KR20160143163A

KR20160143163A - Methods of manufacturing a shoe insole sensor

Info

Publication number: KR20160143163A
Application number: KR1020150079379A
Authority: KR
Inventors: 이진욱; 강치정
Original assignee: 쓰리엘랩스 주식회사
Priority date: 2015-06-04
Filing date: 2015-06-04
Publication date: 2016-12-14
Also published as: KR101783944B1

Abstract

A method of manufacturing a shoe insole sensor of the present invention comprises the following steps of: locating a lower mold including a main body part having grooves, and a concave part corresponding to a shape of a shoe insole sensor having protruding parts formed on the grooves; locating a jig mold including holes formed on areas corresponding to the protruding parts on an upper portion of the lower mold; locating a conductive plate on an upper portion of the jig mold; locating an upper mold including punching pillars formed on the areas corresponding to the protruding parts on an upper portion of the conductive plate; adhering the upper mold and the lower mold by having the jig mold interposed therebetween such that the punching pillars penetrate the holes and push punching pieces of the conductive plate into the concave part; spacing the upper mold and the jig mold from the lower mold when the punching pieces of the conductive plate are pushed into the concave part; and forming the main body part by using a non-conductive material in the lower mold.

Description

METHODS OF MANUFACTURING A SHOE INSOLE SENSOR

The present invention relates to a shoe insole sensor. More particularly, the present invention relates to a shoe insole sensor manufacturing method for manufacturing a shoe insole sensor capable of detecting a pressure in a manner in contact with a shoe insoles substrate.

The present invention has been accomplished as part of the 2014 Global Expertise Development Project (ICT Promising Task) of the Information and Communication Technology Promotion Center of the Korea Information & Telecommunication Industry Promotion Agency. Silver Life Care System Development "on the achievements of technology development of R & D tasks.

A person's pose includes a lot of data related to the person's health. Accordingly, when walking data capable of analyzing a person's walking posture is obtained, a personalized service related to health can be provided to the person. Recently, efforts have been made to extract walking data by combining a pressure sensing device with a shoe insole in order to analyze a person's walking posture. In particular, since the pressure sensing device composed of the shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant and the shoe insoles substrate contacting with the shoe insole can operate at low power and can be manufactured at low cost and small size, So that the walking data can be efficiently provided. Accordingly, there is a need for a method for quickly manufacturing a shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant at low cost and without defects in order to mass-produce the pressure sensing device.

It is an object of the present invention to provide a method of manufacturing a shoe insole sensor capable of rapidly manufacturing a shoe insole sensor including a body portion of a non-conductive material having a plurality of grooves and conductive protrusions formed in the grooves, . It should be understood, however, that the present invention is not limited to the above-described embodiments, and may be variously modified without departing from the spirit and scope of the present invention.

In order to accomplish one object of the present invention, a method for manufacturing a shoe insole sensor according to embodiments of the present invention includes a body portion having a plurality of grooves and a concave portion corresponding to a shape of a shoe insole sensor having protrusions formed in the grooves Placing a lower mold including a plurality of protrusions on the lower mold, positioning a jig mold including holes formed in regions corresponding to the protrusions on an upper portion of the lower mold, placing an upper mold on the conductive plate, the upper mold including punching columns formed in the regions corresponding to the protrusions, the punching columns passing through the holes, The jig metal mold is interposed between the upper mold and the lower mold so as to push the punching pieces of the conductive plate into the concave portion, A step of bringing the upper mold and the jig die away from the lower mold if the punching pieces of the conductive plate are pushed into the recess, and a step of separating the upper mold and the jig metal from the lower mold by using non- To form a part.

According to one embodiment, the step of forming the body portion may include injecting a non-conductive liquid material into the lower mold and curing the non-conductive liquid material in the lower mold.

According to one embodiment, the step of forming the body includes placing the non-conductive solid material in the lower mold and pressing the non-conductive solid material in the lower mold using a press mold .

According to one embodiment, the non-conductive material may be a non-conductive silicone rubber.

According to one embodiment, the conductive plate may be a plate made of conductive silicone rubber.

According to one embodiment, the conductive plate may be a plate made of metal.

According to an embodiment, the holes of the jig die may be circle holes.

According to one embodiment, the punching columns of the upper mold may have a cylinder shape.

According to one embodiment, the holes of the jig die may be polygonal holes.

According to one embodiment, the punching columns of the upper mold may have a polyprism shape.

According to one embodiment, the holes of the jig die may all have the same area.

According to an embodiment, at least two or more holes among the holes of the jig die may have different areas.

According to one embodiment, the protrusions of the shoe insole sensor may all have the same height.

According to an embodiment, at least two protrusions among the protrusions of the shoe insole sensor may have different heights.

In order to accomplish one object of the present invention, an apparatus for manufacturing a shoe insole sensor according to embodiments of the present invention includes a body portion having a plurality of grooves and a concave portion corresponding to a shape of a shoe insole sensor having protrusions formed in the grooves And a plurality of holes formed in regions corresponding to the protrusions, the jig mold being located at an upper portion of the lower mold, and a plurality of holes located in the upper portion of the jig die and corresponding to the protrusions And the upper mold including punching columns formed in the regions to be formed. At this time, when the conductive plate enters between the jig die and the upper die, the lower die and the upper die can be closely contacted with each other with the jig die interposed therebetween.

A method of manufacturing a shoe insole sensor according to embodiments of the present invention includes a lower mold including a concave portion corresponding to a shape of a shoe insole sensor, a jig mold including holes formed in regions corresponding to protrusions of a shoe insole sensor, A shoe insole sensor including a body portion of a non-conductive material having grooves by using an upper metal mold including punching columns formed in regions corresponding to protrusions of the insole sensor and conductive protrusions formed on the grooves, Can be manufactured quickly without defects. Particularly, in the shoe insole sensor manufacturing method, the upper mold and the lower mold are brought into close contact with each other with the jig die interposed therebetween, so that the punching columns of the upper die penetrate the holes of the jig die to push the punching pieces of the conductive plate into the concave portion of the lower die Since the body of the shoe insole sensor is formed by using the non-conductive material in the lower mold, compared with the conventional manufacturing method of manufacturing the shoe insole sensor by bonding the protruding portions of the conductive material to the body portion of the non-conductive material, Suitable. However, the effects of the present invention are not limited to the above-described effects, and may be variously extended without departing from the spirit and scope of the present invention.

1 is a sectional view showing an apparatus for manufacturing a shoe insole sensor according to an embodiment of the present invention.
FIG. 2A is a cross-sectional view showing an example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing apparatus of FIG. 1; FIG.
FIG. 2B is a plan view showing an example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing apparatus of FIG. 1; FIG.
FIG. 3A is a plan view showing a lower mold provided in the shoe insole sensor manufacturing apparatus of FIG. 1. FIG.
FIG. 3B is a plan view showing a jig die provided in the shoe insole sensor manufacturing apparatus of FIG. 1. FIG.
3C is a plan view showing an upper mold provided in the shoe insole sensor manufacturing apparatus of FIG.
FIG. 4 is a plan view showing a conductive plate placed on an upper part of a jig die provided in the shoe insole sensor manufacturing apparatus of FIG. 1; FIG.
5 is a flowchart showing a method of manufacturing a shoe insole sensor according to embodiments of the present invention.
6A to 6E are sectional views for explaining the shoe insole sensor manufacturing method of Fig.
7 is a plan view showing an example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing method of Fig.
8 is a plan view showing another example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing method of Fig.
9 is a plan view showing still another example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing method of Fig.
10 is a plan view showing still another example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing method of Fig.

For the embodiments of the invention disclosed herein, specific structural and functional descriptions are set forth for the purpose of describing an embodiment of the invention only, and it is to be understood that the embodiments of the invention may be practiced in various forms, The present invention should not be construed as limited to the embodiments described in Figs.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprise", "having", and the like are intended to specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, , Steps, operations, components, parts, or combinations thereof, as a matter of principle.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be construed as meaning consistent with meaning in the context of the relevant art and are not to be construed as ideal or overly formal in meaning unless expressly defined in the present application .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings and redundant explanations for the same constituent elements are omitted.

FIG. 1 is a sectional view showing an apparatus for manufacturing a shoe insole sensor according to an embodiment of the present invention. FIGS. 2A and 2B are views showing an example of a shoe insole sensor manufactured by the apparatus for manufacturing a shoe insole sensor of FIG. FIGS. 3A to 3C are plan views showing a lower mold, a jig die and an upper die provided in the apparatus for manufacturing a shoe insole sensor of FIG. 1. FIG. 4 is a cross- 1 is a plan view showing a conductive plate.

Referring to FIGS. 1 to 4, the shoe insole sensor manufacturing apparatus 100 may include a lower mold 120, a jig die 140, and an upper mold 160. When the conductive plate 180 is inserted between the jig die 140 and the upper die 160 (that is, when the conductive plate 180 is inserted between the jig die 140 and the upper die 160) 160), the lower mold 120 and the upper mold 160 can be brought into close contact with each other with the jig die 140 interposed therebetween.

The shoe insole sensor manufacturing apparatus 100 can manufacture a shoe insole sensor including a body portion of a non-conductive material having a plurality of grooves and conductive protrusions formed in the plurality of grooves. Accordingly, the shoe insole sensor manufacturing apparatus 100 can also be used to manufacture the shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant. For example, as shown in FIGS. 2A and 2B, the shoe insole sensor 10 may include a body portion 11, first projections 12, and second projections 14. 2A is a plan view of the shoe insole sensor 10 viewed from above and FIG. 2B is a sectional view of the shoe insole sensor 10 taken along line A-A '. The body portion 11 may be formed of a non-conductive material. In this case, the non-conductive material may be non-conductive silicone rubber, but is not limited thereto. The body 110 may include a plurality of grooves 16 at positions corresponding to vertices of an n-type (where n is an even number). Also, according to the embodiment, the body part 11 may further include extra grooves 17 and 18 for adjusting the sensing sensitivity. The first projections 12 and the second projections 14 may be formed of a conductive material. At this time, the conductive material may be conductive silicone rubber or metal, but is not limited thereto. The first protrusions 13 may be formed in the odd-numbered grooves 16 of the grooves 16 of the body part 11. [ The second protrusions 14 may be formed in the even-numbered grooves 16 among the grooves 16 of the body part 11. [ In this case, the odd-numbered and the even-numbered can be changed depending on how the reference is set. This is because the first protrusions 12 and the second protrusions 14 alternate clockwise or counterclockwise, (Not shown). 2A and 2B, the first protrusion 12 and the second protrusion 14 are shown to have different heights, but the first protrusion 12 and the second protrusion 14 may have the same height have. The shoe insole sensor 10 is placed on a shoe insoles substrate (not shown). Therefore, when the shoe insole sensor 10 is pressed on the shoe insole substrate when the pressure is applied from the upper part, the pressure sensing device composed of the shoe insole sensor 10 and the shoe insole substrate, 12 and the second protrusions 14 are in contact with a plurality of switches of the shoe insoles substrate. However, this is an illustrative example, and the shoe insole sensor manufactured by the shoe insole sensor manufacturing apparatus 100 is not limited to the shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant.

Specifically, the lower mold 120 may include a concave portion 122 corresponding to the shape of a shoe insole sensor having protrusions formed in a plurality of grooves and a body portion having a plurality of grooves. 3A is a plan view showing a lower mold 120 provided in the shoe insole sensor manufacturing apparatus 100. FIG. That is, as shown in FIG. 3A, the concave portion 122 of the lower mold 120 may include a first concave region BCR and a second concave region PCR of the shoe insole sensor. That is, the second concave regions PCR are regions corresponding to protrusions of the shoe insole sensor. The jig die 140 may be located on the upper portion of the lower mold 120 and may include holes 144 formed in regions corresponding to the protrusions of the shoe insole sensor. FIG. 3B is a plan view showing a jig die 140 provided in the shoe insole sensor manufacturing apparatus 100. FIG. 3B, since the holes 144 of the jig die 140 are formed in the regions corresponding to the protrusions of the shoe insole sensor, the holes 144 and the holes 144 of the lower mold 120 The second concave regions PCR of the concave portions 122 may overlap. The upper mold 160 may be located on the upper side of the jig die 140 and may include punching posts 164 formed in regions corresponding to the protrusions of the shoe insole sensor. 3C is a plan view showing an upper mold provided in the shoe insole sensor manufacturing apparatus of FIG. 3C, since the punching pillars 164 are formed in the regions corresponding to the protrusions of the shoe insole sensor in the upper mold 160, the punching pillars 144 and the lower mold 120 The second concave regions PCR of the concave portions 122 of the first and second concave portions 122 may overlap. As described above, the second concave regions PCR of the concave portion 122 of the lower mold 120, the holes 144 of the jig die 140, and the punching posts 164 of the upper mold 160 are overlapped When the lower mold 120 and the upper mold 160 are brought into close contact with each other with the jig die 140 interposed therebetween after the conductive plate 180 enters between the jig die 140 and the upper die 160, The punching columns 164 of the mold 160 penetrate the holes 144 of the jig die 140 to reach the second concave regions PCR of the concave portion 122 of the lower mold 120. [

As shown in FIG. 4, the conductive plate 180 entering between the jig die 140 and the upper mold 160 may be a flat plate. In one embodiment, the conductive plate 180 may be a plate made of conductive silicone rubber. In another embodiment, the conductive plate 180 may be a plate made of metal. When the lower mold 120 and the upper mold 160 are in close contact with each other with the jig die 140 interposed therebetween in the state where the conductive plate 180 is positioned between the jig die 140 and the upper die 160, The punching columns 164 of the mold 160 penetrate the holes 144 of the jig die 140 while pressurizing the conductive plate 180 so that the second concave region PCR of the concave portion 122 of the lower mold 120 ). As a result, punching pieces of the conductive plate 180 can be created by the punching posts 164 of the upper mold 160 and the holes 144 of the jig die 140, and the punching of the conductive plate 180 The pieces can be pushed into the second concave regions PCR of the concave portion 122 of the lower mold 120 by the punching posts 164 of the upper mold 160. [ For this, the rim of the punching column 160 of the upper mold 160 can be sharpened. As described above, the second concave regions PCR of the concave portion 122 of the lower mold 120, the holes 144 of the jig die 140, and the punching posts 164 of the upper mold 160 And the punching columns 164 of the upper mold 160 penetrate through the holes 144 of the jig die 140 to form punching pieces of the conductive plate 180. As a result, The shapes of the holes 144 of the jig die 140 and the shape of the punching posts 164 of the upper mold 160 according to the shape of the second concave regions PCR of the shoe insole sensor 122 The shape can be determined. The holes 144 of the jig die 140 may be circular holes and the punching posts 164 of the upper die 160 may also be formed in a circular cylinder shape, Shape. The holes 144 of the jig die 140 may be polygonal holes and the punching posts 164 of the upper mold 160 may also be formed of polygonal holes, It may have a multi-prism shape. The holes 144 of the jig die 140 may have the same area and the holes 144 of the punching column 164 of the upper mold 160 may have the same area, ) May have the same area. In another embodiment, at least two or more of the holes 144 of the jig die 140 may have different areas, and at least two of the upper dies 160 may have different areas when manufacturing a shoe insole sensor in which at least two protrusions have different areas. The two or more punching posts 164 may also have different areas.

When the lower mold 120 and the upper mold 160 are in close contact with each other with the jig die 140 interposed therebetween, the punching columns 164 of the upper mold 160 penetrate the holes 144 of the jig die 140 And reaches the second concave regions PCR of the concave portion 122 of the lower mold 120. [ The shoe insole sensor manufacturing apparatus 100 may be configured such that the upper mold 160 and the lower mold 120 are brought into close contact with each other with the jig die 140 interposed therebetween. (I.e., lower the upper mold 160). The shoe insole sensor manufacturing apparatus 100 may be configured such that the lower mold 120 and the upper mold 160 are brought into close contact with each other with the jig die 140 interposed therebetween. (I.e., raise the lower mold 120). The shoe insole sensor manufacturing apparatus 100 may include a lower mold 120 and an upper mold 160 so that the lower mold 120 and the upper mold 160 are in close contact with each other with the jig die 140 interposed therebetween, (That is, lower the upper mold 160 and raise the lower mold 120). The punching pillars 164 of the upper mold 160 press the conductive plate 180 and penetrate the holes 144 of the jig die 140 to press the second concave portion 122 of the concave portion 122 of the lower mold 120 The punching posts 164 of the upper mold 160 are punched into the second recessed area PCR of the recess 122 of the lower mold 120 by punching the punching pieces of the conductive plate 180, . When the punching pieces of the conductive plate 180 are pushed into the second concave region PCR of the concave portion 122 of the lower mold 120, the shoe insole sensor manufacturing apparatus 100 forms the upper mold 160 And the jig die 140 can be spaced apart from the lower mold 120. Thereafter, the body of the shoe insole sensor may be formed using the non-conductive material in the lower mold 120. In one embodiment, the body portion of the shoe insole sensor may be formed by curing the non-conductive liquid material in the lower mold 120 after the non-conductive liquid material is injected into the lower mold 120. [ In this case, the non-conductive liquid material corresponding to the body portion of the shoe insole sensor can be strongly adhered to the punching pieces of the conductive plate 180 while being cured. In another embodiment, the body portion of the shoe insole sensor may be formed by pressing a non-conductive solid material into the lower mold 120 by a press mold once the non-conductive solid material is placed on the lower mold 120. [ In this case, the non-conductive solid material corresponding to the body portion of the shoe insole sensor can be strongly adhered to the punching pieces of the conductive plate 180 while being pressed by the press mold. In this way, the shoe insole sensor manufacturing apparatus 100 can quickly manufacture a shoe insole sensor including a non-conductive body portion having a plurality of grooves and conductive protrusions formed in a plurality of grooves at low cost and without defects .

FIG. 5 is a flowchart illustrating a method of manufacturing a shoe insole sensor according to an exemplary embodiment of the present invention, and FIGS. 6A to 6E are cross-sectional views illustrating a shoe insole sensor manufacturing method of FIG.

Referring to FIGS. 1, 5, and 6A to 6E, the shoe insole sensor manufacturing method of FIG. 5 includes a body portion 240 of a non-conductive material having a plurality of grooves and a protruding portion 220 of a conductive material The lower mold 120 including the concave portion 122 corresponding to the shape 124 of the shoe insole sensor 200 having the protruding portions 220 of the shoe insole sensor 200 is positioned S110, The jig die 140 including the holes 144 formed in the regions corresponding to the jig die 140 is positioned at the upper portion of the lower mold 120 and the conductive plate 180 is positioned at the upper portion of the jig die 140 The upper mold 160 including the punching pillars 164 formed in the regions corresponding to the protrusions 220 of the shoe insole sensor 200 is positioned S140 on the conductive plate 180 . At this time, the conductive plate 180 may be a flat plate. 5, the punching columns 164 of the upper mold 160 penetrate the holes 144 of the jig die 140 to punch the punching pieces 184 of the conductive plate 180 into the lower mold 160. [ The upper mold 160 and the lower mold 120 can be closely contacted (S150) with the jig die 140 interposed therebetween so as to be pushed into the concave portion 122 of the lower mold 120. 5, when the punching pieces 184 of the conductive plate 180 are pushed into the concave portion 122 of the lower mold 120, the upper mold 160 and the jig die 140 The body portion 240 of the shoe insole sensor 200 can be formed using the non-conductive material 194 in the lower mold 120 (S170) after separating the lower mold 120 from the lower mold 120 .

5 includes a body portion 240 and a lower mold (not shown) including a concave portion 122 corresponding to the shape 124 of the shoe insole sensor 200 having the protrusions 220. In this case, (S110). 6A, the concave portion 122 of the lower mold 120 may include a first concave region BCR and a second concave region PCR of the shoe insole sensor 200. As shown in FIG. That is, the second concave regions PCR may be regions corresponding to the protrusions 220 of the shoe insole sensor 200. The method of manufacturing the shoe insole sensor of FIG. 5 further includes the steps of forming a jig die 140 including holes 144 formed in regions corresponding to protrusions 220 of the shoe insole sensor 200, The conductive plate 180 is positioned at the upper portion of the jig metal mold 140 and the punching column 164 formed in the regions corresponding to the protrusions 220 of the shoe insole sensor 200 (S140) to the upper portion of the conductive plate 180. The upper mold 160 may be positioned above the conductive plate 180 as shown in FIG. In this case, the holes 144 of the jig die 140 are formed in regions corresponding to the protrusions 220 of the shoe insole sensor 200, and the punching posts 164 of the upper metal mold 160 are inserted into the shoe insole The second concave regions PCR of the concave portion 122 of the lower mold 120 and the holes of the jig die 140 are formed in the regions corresponding to the protrusions 220 of the sensor 200. [ 144 and the punching posts 164 of the upper mold 160 can overlap. Therefore, when the lower mold 120 and the upper mold 160 come into close contact with each other with the jig die 140 interposed therebetween, the punching columns 164 of the upper mold 160 push the conductive plate 180, Through the holes 144 of the lower mold 120 to reach the second concave regions PCR of the concave portion 122 of the lower mold 120. [ 5, the punching columns 164 of the upper mold 160 penetrate the holes 144 of the jig die 140 to punch the punching pieces 184 of the conductive plate 180 into the lower mold 160. [ The upper mold 160 and the lower mold 120 can be closely contacted (S150) with the jig die 140 interposed therebetween so as to be pushed into the concave portion 122 of the lower mold 120. 6B, punching pieces 184 of the conductive plate 180 are created by the punching posts 164 of the upper mold 160 and the holes 144 of the jig die 140 And the punching pieces 184 of the conductive plate 180 are connected to the second concave regions PCR of the concave portion 122 of the lower mold 120 by the punching posts 164 of the upper mold 160 Can be pushed in.

The second concave regions PCR of the concave portion 122 of the lower mold 120, the holes 144 of the jig die 140 and the punching columns 164 of the upper mold 160 overlap each other, Since the punching pillars 164 of the upper mold 160 pass through the holes 144 of the jig die 140 to form the punching pieces 184 of the conductive plate 180, The shape of the holes 144 of the jig die 140 and the shape of the holes 142 of the upper mold 160 according to the shape of the second concave regions PCR of the shoe insole sensor 200 (i.e., the shape of the protrusions 220 of the shoe insole sensor 200) The shape of the punching posts 164 can be determined. Meanwhile, the conductive plate 180 may be a plate made of conductive silicone rubber or a plate made of metal, but the conductive plate 180 is not limited thereto. The holes 144 of the jig die 140 may be circular holes and the holes 144 of the jig die 140 may be circular holes and the punching posts 140 of the upper mold 160 may be circular, (164) may also have a cylindrical shape. The holes 144 of the jig die 140 may be polygonal holes and the upper mold 160 may be punched out The pillars 164 may also have a prismatic shape. The holes 144 of the jig die 140 may have the same area and the upper mold 160 may have the same area as the upper mold 160. In one embodiment, when the shoe insole sensor 200 is manufactured with all the protrusions 220 having the same area, The punching posts 164 may have the same area. In another embodiment, when at least two protrusions 220 produce a shoe insole sensor 200 having a different area, at least two of the holes 144 of the jig die 140 may have different areas, At least two punching posts 164 of the mold 160 may have different areas. Further, in one embodiment, as shown in FIG. 6E, at least two protrusions 220 among the protrusions 220 of the shoe insole sensor 200 may have different heights. In this case, at least two punching posts 164 among the punching posts 164 of the upper mold 160 may have different heights. In another embodiment, the protrusions 220 of the shoe insole sensor 200 may all have the same height. In this case, the punching posts 164 of the upper mold 160 may all have the same height.

5, when the punching pieces 184 of the conductive plate 180 are pushed into the concave portion 122 of the lower mold 120, the upper mold 160 and the jig die 140 The body portion 240 of the shoe insole sensor 200 is separated from the lower mold 120 by using the non-conductive material 194 in the lower mold 120 as shown in FIG. 6C, (S170). Meanwhile, the non-conductive material 194 may be a non-conductive silicone rubber, but the non-conductive material 194 is not limited thereto. The method of manufacturing the shoe insole sensor of Figure 5 may be used to form the body portion 240 of the shoe insole sensor 200 using the non-conductive material 194 in the lower mold 120, The non-conductive liquid material 194 may be cured in the lower mold 120 after the non-conductive liquid material 194 is injected into the lower mold 120. According to the embodiment, the shoe insole sensor manufacturing method of FIG. 5 may apply a predetermined temperature condition or the like for curing the non-conductive liquid material 194 to the lower mold 120. 5 may be used to form the body portion 240 of the shoe insole sensor 200 using the non-conductive material 194 in the lower mold 120. In this case, The non-conductive solid material 194 may be pressed onto the lower mold 120 using a press mold (not shown) after the non-conductive solid material 194 is placed on the non-conductive solid material 194. 5, the non-conductive solid material 194 may be pressed onto the lower mold 120 and a predetermined temperature condition or the like may be applied to the lower mold 120. FIG. 6 (d), the molding corresponding to the shoe insole sensor 200 can be separated from the lower mold 120. As shown in FIG. That is, the molding corresponding to the shoe insole sensor 200 can be cut or trimmed by the shoe insole sensor 200 after being separated from the lower mold 120. As a result, as shown in FIG. 6E, a shoe insole sensor 200 including a body portion 240 of a non-conductive material having grooves and conductive protrusions 220 formed in the grooves can be manufactured .

5 includes the lower mold 120 including the concave portion 122 corresponding to the shape 124 of the shoe insole sensor 200, the protrusion 220 of the shoe insole sensor 200 And the punching pillar 164 formed in the regions corresponding to the protruding portions 220 of the shoe insole sensor 200 and the jig mold 140 including the holes 144 formed in the regions corresponding to the shoe insole sensor 200 The shoe insole sensor 200 including the body portion 240 of a non-conductive material having grooves using the metal mold 160 and the protrusions 200 of conductive material formed in the grooves can be manufactured at a low cost and quickly without defect . 5, the upper mold 160 and the lower mold 120 are brought into close contact with each other with the jig die 140 interposed therebetween so that the punching posts 164 of the upper die 160 are pressed against the jig die 140 The punching pieces 184 of the conductive plate 180 pass through the holes 144 of the lower mold 120 in the concave portions 122 of the lower mold 120 And the body portion 240 of the shoe insole sensor 200 is formed by using the non-conductive material 194 in the lower mold 120. Thus, the body portion 240 of the non- The present invention is advantageous in mass production compared with the conventional manufacturing method in which the shoe insole sensor is manufactured by bonding protrusions made of conductive material to the shoe insole sensor. Since the method of manufacturing the shoe insole sensor of FIG. 5 uses a so-called punching method, the upper end surface of the conductive protrusions 220 can be made various, and the size of the shoe insole sensor 200 (for example, The hardness of the protruding portion 220 of the conductive material and the hardness of the body portion 240 of the nonconductive material can be freely adjusted in the shoe insole sensor 200. [ In the above description, it is assumed that the shoe insole sensor 200 is a shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant. However, the shoe insole sensor 200 ) Is not limited thereto. For example, the method of manufacturing a shoe insole sensor of Fig. 5 includes a shoe insole sensor of various types described in Figs. 7 to 10 below (i.e., a body portion of a non-conductive material having grooves and a projection portion of a conductive material A shoe insole sensor including a shoe insole sensor).

FIG. 7 is a plan view showing an example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing method of FIG. 5, and FIG. 8 is a plan view showing another example of a shoe insole sensor manufactured by the shoe insole sensor manufacturing method of FIG. FIG. 9 is a plan view showing another example of the shoe insole sensor manufactured by the method of manufacturing the shoe insole sensor of FIG. 5, and FIG. 10 is a plan view showing another example of the shoe insole sensor manufactured by the shoe insole sensor manufacturing method of FIG. Fig.

Referring to Figs. 7 to 10, various shoe insole sensors manufactured by the shoe insole sensor manufacturing method of Fig. 5 are shown.

In one embodiment, as shown in Fig. 7, the shoe insole sensor manufacturing method of Fig. 5 can manufacture the shoe insole sensor disclosed in Korean Patent No. 1,283,434 of the present applicant. In this case, the shoe insole sensor manufacturing apparatus 300 may include a lower mold 320, a jig die 340, and an upper mold 360. The lower mold 320 corresponds to the shape of the shoe insole sensor having the body portion including the grooves at positions corresponding to the vertexes of the n-type (for example, n in Fig. 7) and the protrusions formed in the grooves And may include a concave portion. The jig die 340 may include holes formed in areas corresponding to the protrusions. The upper mold 360 may include punching columns formed in areas corresponding to the protrusions. In FIG. 7, the upper end surface of the protrusion of the shoe insole sensor is shown as a circle, but the upper surface of the protrusion of the shoe insole sensor is not limited thereto. For example, the upper section of the protrusions of the shoe insole sensor may be polygonal, elliptical, or the like. In FIG. 7, the areas of the protrusions of the shoe insole sensor are all the same, but the area of at least two protrusions among the protrusions of the shoe insole sensor may be different. In another embodiment, as shown in Fig. 8, the method of manufacturing a shoe insole sensor of Fig. 5 can produce a shoe insole sensor having two parallel straight line-shaped protrusions. In this case, the shoe insole sensor manufacturing apparatus 400 may include a lower mold 420, a jig die 440, and an upper mold 460. The lower mold 420 may include a concave portion corresponding to the shape of the shoe insole sensor having protrusions formed in the grooves and a body portion including grooves arranged in two straight lines. The jig die 440 may include holes formed in areas corresponding to the protrusions. The upper mold 460 may include punching columns formed in areas corresponding to the protrusions. In FIG. 8, the upper end surface of the protrusion of the shoe insole sensor is shown as a circle, but the upper surface of the protrusion of the shoe insole sensor is not limited thereto. 8, the areas of the protrusions of the shoe insole sensor are all the same, but the area of at least two protrusions among the protrusions of the shoe insole sensor may be different.

In another embodiment, as shown in Fig. 9, the shoe insole sensor manufacturing method of Fig. 5 can manufacture a shoe insole sensor having protrusions arranged in one straight line. In this case, the shoe insole sensor manufacturing apparatus 500 may include a lower mold 520, a jig die 540, and an upper mold 560. The lower mold 520 may include a concave portion corresponding to the shape of the shoe insole sensor having the body portion including the grooves arranged in one straight line and the protrusions formed in the grooves. The jig die 540 may include holes formed in regions corresponding to the protrusions. The upper mold 560 may include punching columns formed in areas corresponding to the protrusions. In FIG. 9, the upper end surface of the protrusion of the shoe insole sensor is polygonal (for example, rectangular in FIG. 9), but the upper end surface of the protrusion of the shoe insole sensor is not limited thereto. For example, the upper cross section of the protrusions of the shoe insole sensor may be circular, oval, or the like. In FIG. 9, the areas of the protrusions of the shoe insole sensor are all the same, but the area of at least two protrusions of the shoe insole sensor may be different. In another embodiment, as shown in Fig. 10, the shoe insole sensor manufacturing method of Fig. 5 can manufacture a shoe insole sensor having protrusions arranged in one straight line. At this time, the areas of the protrusions of the shoe insole sensor may be all different. For example, the area of the protrusions of the shoe insole sensor may increase or decrease at a predetermined rate. In this case, the shoe insole sensor manufacturing apparatus 600 may include a lower mold 620, a jig die 640, and an upper mold 660. The lower mold 620 may include a concave portion corresponding to the shape of the shoe insole sensor having the body portion including the grooves arranged in one straight line and the protrusions formed in the grooves. The jig die 640 may include holes formed in areas corresponding to the protrusions. The upper mold 660 may include punching columns formed in areas corresponding to the protrusions. In FIG. 10, the upper end surface of the protrusion of the shoe insole sensor is shown as polygonal (for example, rectangular in FIG. 10), but the upper end surface of the protrusion of the shoe insole sensor is not limited thereto. 7 to 10, various shoe insole sensors manufactured by the method of manufacturing the shoe insole sensor of Fig. 5 have been described. However, these shoe insole sensors are all examples, It should be understood that the sensor may be variously modified and changed without departing from the spirit and scope of the present invention.

The present invention can be applied to a shoe insole for gait diagnosis. Therefore, the present invention can be applied to a gait diagnostic system that extracts human gait data by mounting a shoe insole for gait diagnosis in a shoe worn by a person, and performs gait diagnosis based on the gait data.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims. It can be understood that it is possible.

100: shoe insole sensor manufacturing apparatus 1 20: lower mold
122: recess 140: jig die
144: hole 160: upper mold
164: punching column 180: conductive plate
184: Punching piece 194: Non-conductive material
200: shoe insole sensor 220: protrusion
240:

Claims

The method comprising: positioning a lower mold including a concave portion corresponding to a shape of a shoe insole sensor having a body portion having a plurality of grooves and protrusions formed in the grooves;
Positioning a jig die on the lower mold including holes formed in regions corresponding to the protrusions;
Placing a conductive plate on top of the jig die;
Positioning an upper mold on the conductive plate including punching columns formed in regions corresponding to the protrusions;
Placing the upper mold and the lower mold in close contact with each other with the jig metal interposed therebetween such that the punching columns penetrate the holes and push the punching pieces of the conductive plate into the recess;
Spacing the upper mold and the jig metal from the lower mold when punching pieces of the conductive plate are pushed into the recess; And
And forming the body portion using a non-conductive material in the lower mold.

The method of claim 1, wherein forming the body portion
Injecting a non-conductive liquid material into the lower mold; And
And curing the non-conductive liquid material in the lower mold.

The method of claim 1, wherein forming the body portion
Placing a non-conductive solid material on the lower mold; And
And pressing the non-conductive solid material onto the lower mold using a press mold.

The method of claim 1, wherein the non-conductive material is a non-conductive silicone rubber.

5. The method of claim 4, wherein the conductive plate is a plate made of conductive silicone rubber.

5. The method of claim 4, wherein the conductive plate is a metal plate.

The method of claim 1, wherein the holes of the jig die are circular holes.

The method as claimed in claim 7, wherein the punching columns of the upper mold have a cylinder shape.

The method of claim 1, wherein the holes of the jig die are polygonal holes.

The method as claimed in claim 9, wherein the punching columns of the upper mold have a polyprism shape.

The method of claim 1, wherein the holes of the jig die all have the same area.

The method as claimed in claim 1, wherein at least two or more holes among the holes of the jig die have different areas.

The method of claim 1, wherein the protrusions of the shoe insole sensor all have the same height.

The shoe insole sensor of claim 1, wherein at least two of the protrusions of the shoe insole sensor have different heights.

A lower mold including a concave portion corresponding to a shape of a shoe insole sensor having a body portion having a plurality of grooves and protrusions formed in the grooves;
A jig mold located at an upper portion of the lower mold and including holes formed in regions corresponding to the protrusions; And
And an upper mold positioned at an upper portion of the jig die and including punching columns formed in regions corresponding to the projections,
Wherein when the conductive plate enters between the jig metal mold and the upper metal mold, the lower metal mold and the upper metal mold are brought into close contact with each other with the jig metal interposed therebetween.