KR20160133329A - Magnetism inspection device for reading magnet assembly of semiconductor sputtering machinery and magnetism inspection system using the same - Google Patents

Magnetism inspection device for reading magnet assembly of semiconductor sputtering machinery and magnetism inspection system using the same Download PDF

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Publication number
KR20160133329A
KR20160133329A KR1020150066305A KR20150066305A KR20160133329A KR 20160133329 A KR20160133329 A KR 20160133329A KR 1020150066305 A KR1020150066305 A KR 1020150066305A KR 20150066305 A KR20150066305 A KR 20150066305A KR 20160133329 A KR20160133329 A KR 20160133329A
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KR
South Korea
Prior art keywords
magnetic force
magnet assembly
inspection
unit
semiconductor sputtering
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KR1020150066305A
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Korean (ko)
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KR101720691B1 (en
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송교형
공준호
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송교형
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A magnetic force testing apparatus using a magnetic force testing apparatus for testing a magnet assembly of a semiconductor sputtering apparatus measures a magnetic force of a magnet assembly by a magnetic force measuring unit provided by a structural support provided inside a test case, A magnetic force testing unit for measuring a magnetic force of the magnet assembly, a central control unit, and a communication unit, so that the magnetic force of the magnet assembly is measured and transmitted to the mobile terminal. According to the magnetic force testing apparatus for magnet inspection of the magnet sputtering equipment and the magnetic force testing system using the same, the magnetic force measurement result is transmitted to the mobile terminal through the network communication without being influenced by the magnetism externally applied. It is advantageous in that convenience of use is increased because confirmation is possible.

Description

TECHNICAL FIELD [0001] The present invention relates to a magnetic force inspecting apparatus for inspecting a magnet assembly of a semiconductor sputtering apparatus, and a magnetic force inspecting system using the same. BACKGROUND ART < RTI ID = 0.0 >

The present invention relates to a magnetic force inspecting apparatus for inspecting magnet assemblies of a semiconductor sputtering apparatus and a magnetic force inspecting system using the same, and more particularly, to a magnetic force inspecting apparatus using a magnet sputtering apparatus, To a magnetic force testing apparatus for magnet inspection of a semiconductor sputtering equipment for measuring a state and a magnetic force testing system using the same.

Recently, as the use of commercial electronic products, communication products, and data transmission related products has increased, demand for electronics and semiconductors is increasing rapidly. Examples of such electronic products may be a television, a computer, a mobile phone, a pager, a portable radio, and a remote control.

As a result, miniaturization and thinning of electronic components are required. In order to achieve miniaturization and reduction in thickness, electronic components such as microelectronic chip interconnection, semiconductor chip components, resistors, capacitors, printed circuit boards, wiring boards, And thinning.

Accordingly, various methods for producing semiconductor wafer chips for producing semiconductors have been put into practical use. Among them, the sputtering process corresponding to the whole process of the semiconductor production process separates electrons and ions by the difference in mass and movement speed of electrons and ion particles using the magnetism of the magnet assembly in the vacuum of the equipment, .

FIG. 1 schematically illustrates a conventional sputtering process.

As shown in the figure, when the magnet assembly 10 installed on the sputtering target is energized and rotated, fine plasma is generated on the surface of the sputtering target, and the plasma is deposited on the surface of the wafer.

It is very important to check whether the magnetic force of the magnet assembly 10 is kept constant since the value of the magnetic force generated by the rotation of the magnet assembly 10 is constant.

In order to check whether the magnetic force of the magnet assembly is constant or not, there is a method of measuring by using a gauss meter. Since a general gauss meter is not dedicated for measuring the magnetic force of the magnet assembly, There is a problem that accurate measurement can not be performed due to reception.

Korean Registered Patent No. 10-0381062 (Registered on April 8, 2003)

SUMMARY OF THE INVENTION It is an object of the present invention to provide an inspection apparatus and an inspection system that can accurately measure and manage the magnetic force of a magnet assembly provided in a semiconductor sputtering apparatus.

According to an aspect of the present invention, there is provided an apparatus for inspecting magnetic force for magnet inspection of a semiconductor sputtering apparatus, comprising: a test case having a hollow formed therein and having a magnet assembly therein; And a magnetic force testing unit disposed above the magnet assembly and measuring a magnetic force of the magnet assembly.

Preferably, the magnetic force inspection unit of the present invention is configured to transmit the measurement result of the magnetic force of the magnet assembly to the outside by network communication.

The magnetic force testing unit of the present invention includes: a magnetic force testing unit for testing a magnetic force of the magnet assembly; And a central control unit for controlling the magnetic force testing unit and the communication unit.

Preferably, the magnetic force inspection unit of the present invention includes a unit case, and a meter bar configured to be movable along a guide slit cut on one surface of the unit case, for sensing magnetic force of the magnet assembly.

The inspection case of the present invention comprises: a case body configured as a hollow cylindrical shape; A support structure that is placed on the case body and configured to receive the magnetic force inspection unit; and a cover that shields the upper surface of the case body.

The support structure of the present invention comprises an upper original plate; A lower disk provided below the upper disk and extending over the case body, and a support leg provided between the upper disk and the lower disk.

A magnetic force inspection system using a magnetic force testing apparatus for magnet inspection of a semiconductor sputtering equipment of the present invention comprises a mobile terminal, a network communication with the mobile terminal, and a magnetic force measurement device for measuring the magnetic force of the magnet assembly, And a magnetism inspection device for magnetometer inspection of the semiconductor sputtering equipment according to any one of the above items.

The mobile terminal of the present invention is preferably configured to check the magnetic force measurement state of the magnet assembly by an application driven by itself and to set a maximum value or a threshold value of the magnetic force of the magnet assembly.

According to the magnetic force inspecting apparatus for inspecting the magnet assembly of the semiconductor sputtering equipment and the magnetic force inspecting system using the same, since the magnet assembly is placed in the inspecting case, it is not affected by the magnetism externally applied, Since the magnetic force data measured by the magnet assembly can be transmitted to the mobile terminal through the network communication and can be confirmed immediately, convenience of use is increased.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a conventional magnet assembly.
2 is a perspective view showing a magnetic force testing apparatus for checking a magnet assembly of a semiconductor sputtering equipment according to the present invention.
3 is an exploded perspective view of Fig.
4 is a perspective view showing a magnetic force testing unit of a magnetic force testing apparatus for magnetometer inspection of a semiconductor sputtering equipment according to the present invention.
Fig. 5 is a schematic view showing the magnetic force inspection unit of Fig. 4; Fig.
6 is a display screen showing a screen of a mobile terminal of a magnetic force testing system using a magnetic force testing apparatus for magnet inspection of a semiconductor sputtering equipment.
7 is a display screen showing a magnetic force test result displayed on a mobile terminal of a magnetic force testing system using a magnetic force testing apparatus for magnet inspection of a semiconductor sputtering equipment.

The description of the present invention is merely an example for structural or functional explanation, and the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas. Also, the purpose or effect of the present invention should not be construed as limiting the scope of the present invention, since it does not mean that a specific embodiment should include all or only such effect.

Meanwhile, the meaning of the terms described in the present application should be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected to the other element, but there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" to another element, it should be understood that there are no other elements in between. On the other hand, other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

It is to be understood that the singular " include " or "have" are to be construed as including the stated feature, number, step, operation, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In each step, the identification code (e.g., a, b, c, etc.) is used for convenience of explanation, the identification code does not describe the order of each step, Unless otherwise stated, it may occur differently from the stated order. That is, each step may occur in the same order as described, may be performed substantially concurrently, or may be performed in reverse order.

The present invention can be embodied as computer-readable code on a computer-readable recording medium, and the computer-readable recording medium includes any type of recording device that stores data that can be read by a computer system . Examples of the computer-readable recording medium include a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like, and also implemented in the form of a carrier wave (for example, transmission over the Internet) . In addition, the computer-readable recording medium may be distributed over network-connected computer systems so that computer readable codes can be stored and executed in a distributed manner.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used predefined terms should be interpreted to be consistent with the meanings in the context of the related art and can not be interpreted as having ideal or overly formal meaning unless explicitly defined in the present application.

2 to 5 show a magnetic force testing apparatus for magnet inspection of a semiconductor sputtering equipment according to the present invention and a magnetic force testing system using the same.

A magnetic force testing apparatus for a magnet assembly inspection of a semiconductor sputtering apparatus according to the present invention includes: a test case 100 in which a magnetic force testing unit 200 and a magnet assembly 50 are installed; And a magnetic force testing unit 200 installed inside the test case 100 to measure the magnetic force of the magnet assembly 50.

As shown in FIGS. 2 and 3, the test case 100 is an outer structure in which a magnetic force testing unit 200 and a magnet assembly 50 to be inspected are installed, And includes a cylindrical case body 110.

Preferably, the case body 110 is made of a transparent material, and the material constituting the case body 110 is made of a material that does not allow magnetism to pass therethrough, It is preferable that the magnet 200 is not influenced by external magnetism.

In the case body 110, a support structure 120 for mounting the magnetic force testing unit 200 is provided. The supporting structure 120 includes an upper circular plate 121 and a lower circular plate 122 and the upper circular plate 121 and the lower circular plate 122 are supported by a plurality of supporting legs 123.

The support structure 120 may be configured to be hooked by an engagement member (not shown) provided on the inner circumferential surface of the case body 110, so that the support structure 120 may be hooked to the middle portion of the case body 110.

A circular through hole 124 is formed in the upper and lower circular plates 121 and 122. The probe bar 212 of the magnetic force testing unit 200 to be described below is exposed downward through the through hole 124.

The magnet assembly 50 to be inspected is located at the bottom of the test case by the support structure 120 and the magnetic force testing unit 200 mounted on the upper surface of the lower disk 122 is positioned above do. The probe bar 212 of the magnetic force inspecting unit 200 extends downward through the through hole 124 of the lower disk 122 and its tip is located above the magnet assembly 50.

A cover 130 is provided on an upper surface of the case body 110 to shield the opened upper surface of the case body 110. The support structure 120 and the magnetic force testing unit 200 can be installed in the case body 110 by opening the cover 130.

FIG. 4 shows a magnetic force inspection unit 200 installed inside the inspection case 100. As shown in FIG. As shown in the figure, the magnetic force testing unit 200 includes a unit case 210, and a guide slit 211 is formed on one surface of the unit case 210 in an arc shape.

The probe bar 212 electrically connected to the magnetic force testing unit 240 inside the unit case 210 is exposed to the outside through the guide slit 211. The meter bar (212) is for measuring the magnetic force of the magnet assembly (50), and is movable along the guide slit (211) in a predetermined direction.

The internal configuration of the magnetic force inspection unit 200 is schematically shown in Fig. As shown in the figure, the magnetic force testing unit 200 includes a power unit 220; An operation unit 230; A magnetic force testing unit 240; A central control unit 250, and a communication unit 260.

The magnetic force testing unit 240 may be a Hall effect sensor and measures the magnetic force of the magnet assembly 50 measured by the meter bar 212.

The magnetic force testing unit 240 may be configured to measure both the DC magnetic flux density and the AC magnetic flux density, and the magnetic force measurement range may be in the range of 0 to 30000G.

The central control unit 250 may transmit the result of the measurement by the magnetic force testing unit 240 through the communication unit 260 or may transmit the result of the measurement by the magnetic force testing unit 240, It controls the components.

The communication unit 250 performs network communication with the mobile terminal 300 through various wireless communications such as wireless communication, WiFi, Bluetooth, High Speed Downlink Packet Access (HSDPA), or a Universal Subscriber Identity Module (USIM) .

The mobile terminal 300 linked to the communication unit 250 may correspond to a computing device such as a PC, a smart phone, a PDA (personal digital assistant), and a tablet PC having a central processing unit, a memory unit, and an input / output unit.

The magnetic force measurement result measured by the magnetic force testing unit 200 is transmitted to the mobile terminal 300 and the magnetic force measurement result may be displayed by an application separately installed in the mobile terminal 300. [

6 and 7 show a state in which the magnetic force measurement result transmitted to the mobile terminal 300 is displayed.

The transmission interval of data transmitted from the magnetic force testing unit 200 to the mobile terminal 300 can be set and the maximum measurement value of the magnetic force measured by the magnetic force testing unit 200 can be selected .

Also, it may be configured to set a warning level and a critical level corresponding to warning values. The result of the magnetic force test thus measured is shown in Fig.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the present invention as defined by the following claims It can be understood that

100: Test case 110: Case body
120: support structure 130: cover
200: magnetic force testing unit 210: unit case
220: power supply unit 230:
240: magnetic force testing unit 250: central control unit
260:

Claims (8)

A test case in which a hollow is formed inside and a magnet assembly is positioned;
And a magnetic force testing unit provided in the test case and positioned above the magnet assembly to measure a magnetic force of the magnet assembly
Magnetic Force Inspection System for Inspection of Magnet Assembly of Semiconductor Sputtering Equipment.
The method according to claim 1,
The magnetic force inspection unit
And to transmit the measurement result of the magnetic force of the magnet assembly to the outside by network communication
Magnetic Force Inspection System for Inspection of Magnet Assembly of Semiconductor Sputtering Equipment.
3. The method of claim 2,
The magnetic force inspection unit
A magnetic force testing unit for testing a magnetic force of the magnet assembly;
A communication unit for transmitting a result measured by the magnetic force testing unit to the outside;
And a central control unit for controlling the magnetic force testing unit and the communication unit
Magnetic Force Inspection System for Inspection of Magnet Assembly of Semiconductor Sputtering Equipment.
The method of claim 3,
The magnetic force inspection unit
A unit case,
And a meter bar configured to be movable along a guide slit formed on one surface of the unit case and sensing the magnetic force of the magnet assembly
Magnetic Force Inspection System for Inspection of Magnet Assembly of Semiconductor Sputtering Equipment.
The method according to claim 1,
The inspection case
A case body made of a hollow cylindrical shape;
A support structure that is mounted on the case body and configured to mount the magnetic force inspection unit;
And a cover for shielding an upper surface of the case body
Magnetic Force Inspection System for Inspection of Magnet Assembly of Semiconductor Sputtering Equipment.
6. The method of claim 5,
The support structure
Upper plate;
A lower circular plate provided below the upper circular plate and extending over the case body;
And a support leg provided between the upper original plate and the lower original plate
Magnetic Force Inspection System for Inspection of Magnet Assembly of Semiconductor Sputtering Equipment.
A mobile terminal,
The magnetic sputtering apparatus according to any one of claims 1 to 6, for measuring the magnetic force of the magnet assembly by performing network communication with the mobile terminal,
Magnetic Force Inspection System using Magnetic Force Test Apparatus for Magnet Assembly Inspection of Semiconductor Sputtering Equipment.
8. The method of claim 7,
The mobile terminal
The magnet assembly is configured to check a magnetic force measurement state of the magnet assembly by an application driven by itself and to set a maximum value or a threshold value of the magnetic force of the magnet assembly
Magnetic Force Inspection System using Magnetic Force Test Apparatus for Magnet Assembly Inspection of Semiconductor Sputtering Equipment.
KR1020150066305A 2015-05-12 2015-05-12 Magnetism inspection device for reading magnet assembly of semiconductor sputtering machinery and magnetism inspection system using the same KR101720691B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011515Y2 (en) * 1979-09-20 1985-04-16 株式会社精工舎 Pointer display device
JPH09292450A (en) * 1996-04-26 1997-11-11 Sony Corp Magnetic-field measuring system
KR100381062B1 (en) 1999-12-10 2003-04-26 샤프 가부시키가이샤 Sheet resistance meter and method of manufacturing electronic components
JP2007271465A (en) * 2006-03-31 2007-10-18 Tokyo Institute Of Technology Magnetic field distribution measuring instrument
KR20110075635A (en) * 2009-12-28 2011-07-06 콘티넨탈오토모티브코포레이션코리아 (주) Gauss measurement apparutus of magnet

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011515B2 (en) * 2013-11-07 2016-10-19 トヨタ自動車株式会社 Control device for hybrid vehicle

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011515Y2 (en) * 1979-09-20 1985-04-16 株式会社精工舎 Pointer display device
JPH09292450A (en) * 1996-04-26 1997-11-11 Sony Corp Magnetic-field measuring system
KR100381062B1 (en) 1999-12-10 2003-04-26 샤프 가부시키가이샤 Sheet resistance meter and method of manufacturing electronic components
JP2007271465A (en) * 2006-03-31 2007-10-18 Tokyo Institute Of Technology Magnetic field distribution measuring instrument
KR20110075635A (en) * 2009-12-28 2011-07-06 콘티넨탈오토모티브코포레이션코리아 (주) Gauss measurement apparutus of magnet

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