KR20160127212A - MEMS microphone and manufacturing method thereof - Google Patents
MEMS microphone and manufacturing method thereof Download PDFInfo
- Publication number
- KR20160127212A KR20160127212A KR1020150057324A KR20150057324A KR20160127212A KR 20160127212 A KR20160127212 A KR 20160127212A KR 1020150057324 A KR1020150057324 A KR 1020150057324A KR 20150057324 A KR20150057324 A KR 20150057324A KR 20160127212 A KR20160127212 A KR 20160127212A
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- Prior art keywords
- membrane
- back plate
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- space
- forming
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
The present invention discloses a MEMS microphone package. A MEMS microphone according to the present invention comprises: a substrate: a first back plate and a second back plate formed on an upper surface of a substrate and horizontally spaced apart from each other; An insulating layer protruding along the periphery of the substrate to surround the outer edges of the first back plate and the second back plate; A partition wall formed at a spaced distance between the first back plate and the second back plate and dividing the inside of the insulation layer into a first space and a second space; And a membrane that covers the first space and the second space and is supported by the insulating layer and the partition.
According to the present invention, by implementing a plurality of pairs of membranes and a back plate in a single MEMS microphone, it is possible to obtain highly sensitive and highly reliable signals regardless of the direction of sound or the band of the sound. Further, by improving the vibration width of the membrane as compared with the prior art, high sensitivity can be realized.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a MEMS microphone, and more particularly, to a MEMS microphone capable of effectively operating even when a sound transmission path or a sound band is varied, and having improved sensitivity.
Microphones are devices that convert acoustic signals into electrical signals, and there are a wide variety of types depending on materials and operating principles. Generally, it can be classified into a carbon microphone, a crystal microphone, and a magnetic microphone depending on the material, and it can be classified into a dynamic microphone using an induced electromotive force by a magnetic field and a condenser microphone using a capacitance change due to vibration of the membrane have.
Among them, micro condenser microphones such as ECM (Electret Condenser Microphone) and MEMS (Micro Electro Mechanical System) microphone are mainly used for portable or small electronic devices such as a computer, a mobile communication terminal, an MP3 sound recorder, a cassette recorder, a camcorder and a headset.
MEMS microphones are ultra-precision micromachined micro parts such as membranes, back plates, etc. on silicon substrates by applying semiconductor manufacturing technology. Since MEMS microphones do not use electret materials that are vulnerable to heat, they are mounted on main substrates such as mobile phones in high temperature reflow processes. And there is an advantage that the variation of the sensitivity of each product is not large. For this reason, the demand for MEMS microphones has been greatly increased in recent years compared to the ECM using the iletrette.
1 is a schematic cross-sectional view illustrating a conventional
The MEMS microphone 30 is formed on the upper surface of the
The
The
However, the
First, since one membrane is used, there is a disadvantage that sensitivity to sound transmitted from the opposite side of the membrane is low.
Second, since the size and thickness of the membrane are fixed, it is very difficult to realize a high sensitivity for all the frequency ranges, and therefore, there is a limit to lower sensitivity for a specific frequency range.
Third, since the edge portion of the membrane is fixed to the substrate, there is a limit to increase the vibration width of the membrane, which limits the sensitivity.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a high-sensitivity MEMS microphone which is independent of sound direction. The object of the present invention is to provide a MEMS microphone capable of obtaining high sensitivity for sounds of various ranges.
It is also an object of the present invention to provide a MEMS microphone which improves the sensitivity by increasing the vibration width of the membrane and simplifies the manufacturing process.
It is also an object of the present invention to improve the sensitivity of a MEMS microphone by improving the shape of a conventional membrane or back plate.
In order to achieve the above object, one aspect of the present invention provides a liquid crystal display comprising: a substrate: a first back plate and a second back plate formed on an upper surface of a substrate and horizontally spaced from each other; An insulating layer protruding along the periphery of the substrate to surround the outer edges of the first back plate and the second back plate; A partition wall formed at a spaced distance between the first back plate and the second back plate and dividing the inside of the insulation layer into a first space and a second space; And a membrane that covers the first space and the second space and is supported by an insulating layer and a partition wall.
In a MEMS microphone according to an aspect of the present invention, the membrane includes a first membrane positioned on an upper portion of a first back plate and a second membrane positioned on an upper portion of a second back plate, The second membrane may be electrically insulated.
Also, in the MEMS microphone according to one aspect of the present invention, the first space and the second space are formed to have different sizes, and the first membrane and the second membrane may have different sizes.
According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a first back plate and a second back plate horizontally spaced apart on a substrate; An insulating layer is formed on the upper surface of the substrate so as to surround the periphery of the first back plate and the second back plate while a partition wall is formed in the gap between the first back plate and the second back plate, Forming a first space and a second space on top of the two hundred plates, respectively; Filling the sacrificial layer in the first space and the second space, respectively; Forming a membrane supported on the sacrificial layer by a partition wall and an insulating layer, and forming a sound hole in the membrane; And removing the sacrificial layer filled in the first space and the second space.
In the manufacturing method, the step of forming a sound hole in the membrane may include forming a membrane on the first membrane located on the first back plate and on the second membrane, and electrically insulating the first membrane from the first membrane, To form a second membrane.
According to another aspect of the present invention, there is provided a substrate comprising: a substrate having a back chamber vertically penetrating therethrough; a first membrane covering the back chamber and having a peripheral portion disposed on an upper surface of the substrate and having a tone hole; A back plate spaced apart from the upper portion of the first membrane with a first air gap therebetween; And a second membrane disposed on an upper portion of the back plate with a second air gap interposed therebetween and having a sound hole formed thereon.
In the MEMS microphone according to still another aspect of the present invention, the heights of the first air gap and the second air gap may be different from each other.
Yet another aspect of the present invention is a method for manufacturing a semiconductor device, comprising: forming a first membrane on an upper surface of a substrate and forming a tone hole in the first membrane; Forming an insulating layer around the first membrane and forming a first sacrificial layer in a space surrounded by the insulating layer; Forming a back plate on an upper surface of the first sacrificial layer; Forming an insulating layer around the back plate and forming a second sacrificial layer in a space surrounded by the insulating layer; Forming a second membrane on the top surface of the second sacrificial layer and forming a tone hole in the second membrane; Forming a back chamber to expose a first membrane at a bottom surface of the substrate; And removing the first sacrificial layer and the second sacrificial layer.
According to another aspect of the present invention, there is provided a semiconductor device comprising: a substrate having a horizontal surface and a stepped surface including a vertical surface on one side; A back plate formed on a vertical surface of the step portion; The lower end of which is fixed to the horizontal plane of the step and the upper end is free, and which is arranged side by side with the back plate.
According to another aspect of the present invention, there is provided a semiconductor device, comprising: a substrate in which a vertical through hole is formed, in which a step portion including a horizontal plane and a vertical plane is formed inside the through hole; A back plate formed on a vertical surface of the step portion; The lower end of which is fixed to the horizontal plane of the step and the upper end of which is a free end, and a membrane formed side by side with the back plate.
At this time, a plurality of the step portions are formed in the periphery of the through holes, the back plate is formed in each of the vertical surfaces of the step portions, and the membrane may be formed in each horizontal surface of each step portion.
In addition, a plurality of through-holes may be formed, and one or more stepped portions may be formed for each of the through holes, and the back plate and the membrane may be formed at each of the stepped portions.
A stopper for limiting the amplitude of the membrane may be formed on the vertical surface of the stepped portion. A stopper for limiting the amplitude of the membrane may be formed on the inner wall of the through hole located on the opposite side of the back plate with respect to the membrane.
According to the present invention, by implementing a plurality of pairs of membranes and a back plate in a single MEMS microphone, it is possible to obtain highly sensitive and highly reliable signals regardless of the direction of sound or the band of the sound.
Further, by improving the vibration width of the membrane as compared with the prior art, high sensitivity can be realized.
1 is a cross-sectional view showing a schematic configuration of a conventional MEMS microphone
2 is a view illustrating a membrane and a back plate used in a conventional MEMS microphone;
3 is a cross-sectional view of a MEMS microphone according to a first embodiment of the present invention
FIG. 4 is a flow chart showing a manufacturing method of a MEMS microphone according to the first embodiment of the present invention.
5 is a cross-sectional view of a MEMS microphone according to a second embodiment of the present invention
6A and 6B are flowcharts showing a method of manufacturing a MEMS microphone according to a second embodiment of the present invention.
7 is a perspective view of a MEMS microphone according to a third embodiment of the present invention.
8 is a plan view and a side view of a MEMS microphone according to a third embodiment of the present invention
9 is a view showing various modified examples of a membrane used in a MEMS microphone according to a third embodiment of the present invention.
10 is a view showing a modification of the MEMS microphone according to the third embodiment of the present invention
11 is a view showing another modification of the MEMS microphone according to the third embodiment of the present invention.
12 to 15 are views showing still another modification of the MEMS microphone according to the third embodiment of the present invention
16 is a view showing a state where a stopper is formed on a MEMS microphone according to a third embodiment of the present invention
FIGS. 17A-B show various combinations and cross-sectional structures of a membrane and a backplate formed in a MEMS microphone
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the scope of the present invention should not be construed as limiting the scope of the present invention because many of the drawings are exaggerated in size to illustrate the actual MEMS microphones.
First Embodiment
3, the MEMS
A
A
The
The first and
The first and
Although not shown in the drawing, an electrical circuit pattern connected to the first and
Meanwhile, it is preferable that the first and
Since the
Particularly, when the sizes of the
Further, according to the first embodiment of the present invention, since there is no need to form the
In the meantime, the first embodiment of the present invention shows a MEMS microphone including two membrane / backplate pairs, however, if necessary, three or more membrane / backplate pairs may be formed.
Hereinafter, a method of manufacturing the
First, a first insulating
Then, an
A photosensitive mask (not shown) of a pattern corresponding to the
The second
The deposition thickness of the second insulating
Then, a
After the
Next, a
After the tone holes 165 are formed in the
Second Embodiment
5, the
More specifically, a
A second insulating
A third insulating
The first and
As in the first embodiment, the
According to the second embodiment of the present invention, since the
Particularly, since the
Also, since the sound generated from the same sound source reaches the first and
Even if the widths of the
Hereinafter, a method of manufacturing the
First, a
Next, a second insulating
A space surrounded by the second insulating
Then, a
A second
Next, a
A part of the first insulating
The first and second
Third Embodiment
The third embodiment of the present invention relates to a MEMS microphone of a new structure that can be manufactured in a simpler manner than the first and second embodiments.
7, a
That is, in the
On the other hand, the
As described above, the
A process of forming a
As another example, a step of forming a
As another example, a process of forming two trenches on the
In the
However, in order to improve the flexibility of the
9 (d) to 9 (f), the shape of the
The
10, a vertical through
When an external sound pressure is applied to the
11, a
More specifically, the
When an external sound pressure is applied to the
In this case, if the first and
On the other hand, in the
For example, as shown in the
13, the
As shown in the
As shown in Fig. 15, three or more through-
At this time, the
In the
In order to prevent this, a
Fourth Embodiment
2, the sound holes 35 and 38 are formed in the
However, recently, as MEMS microphones have become smaller in size, it is often difficult to realize high sensitivity because the external sound pressure can not be quickly solved with a conventional membrane or a back plate.
The fourth embodiment of the present invention has been proposed to solve such a problem, and relates to a new shape membrane and a back plate that can solve the sound pressure applied to an air gap in a MEMS microphone more quickly.
In one embodiment, the
17B is a cross-sectional view of the
As can be seen from FIG. 17B, according to the present embodiment, since a considerable space is formed between both sides of the
Also, according to the present embodiment, since the portion where the
18A shows a case where both of the
In this case, since a considerable space is formed between both sides of the
19A, the
19B shows a cross section of the
19B, since a considerable space is formed between both sides of the back platets 130a and 130b and the
20A, the
20B is a cross-sectional view of the
20B, according to the present embodiment, the sound pressure of the air gap can be easily eliminated through the through
21A, the
The
FIG. 21B shows a cross-section of the
As can be seen from FIG. 21B, since the total area of the through-holes formed in the
The fourth embodiment of the present invention has been described with reference to the case where the membrane is located on the upper side of the back plate. However, this is only an example, so that the present invention can be applied to a case where the membrane is located below the back plate.
Further, in the fourth embodiment of the present invention, it is assumed that the basic shape of the membrane or the back plate is circular, but the present invention can also be applied to a case where the basic shape of the membrane or the back plate is rectangular.
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And it is obvious that the scope of the present invention falls within the scope of the present invention if the technical idea of the present invention is included.
100, 200: MEMS microphone 110: substrate
112:
114;
121: first insulating
123: third insulating layer 125: barrier rib
130: back
134: through hole 135: etching groove
150:
160:
165: sound hole 167: elastic connection part
168: slit 170: sacrificial layer
171, 172: first and second sacrificial layers 180: back chamber
190: Through hole
Claims (16)
A first back plate and a second back plate formed on an upper surface of the substrate and horizontally spaced apart from each other;
An insulating layer protruding along the periphery of the substrate to surround the outer edges of the first back plate and the second back plate;
A partition wall formed at a spaced distance between the first back plate and the second back plate and dividing the inside of the insulation layer into a first space and a second space;
A membrane covering the first space and the second space, the membrane being supported by the insulating layer and the partition wall
A MEMS microphone
Wherein the membrane comprises a first membrane located on top of the first backplate and a second membrane located on top of the second backplate,
Wherein the first membrane and the second membrane are electrically insulated from each other.
Wherein the first space and the second space are formed to have different sizes, and the first membrane and the second membrane have different sizes.
An insulating layer is formed on the upper surface of the substrate so as to surround the periphery of the first back plate and the second back plate while a partition wall is formed in the gap between the first back plate and the second back plate, Forming a first space and a second space on top of the two hundred plates, respectively;
Filling the sacrificial layer in the first space and the second space, respectively;
Forming a membrane supported on the sacrificial layer by a partition wall and an insulating layer, and forming a sound hole in the membrane;
Removing the sacrificial layer filled in the first space and the second space
≪ / RTI >
The step of forming a sound hole in the membrane may include forming a first membrane on the first back plate and a second membrane disposed on the second back plate and electrically insulated from the first membrane, The method of manufacturing a MEMS microphone according to claim 1,
A first membrane covering the back chamber and having a peripheral portion disposed on an upper surface of the substrate and having a tone hole formed therein;
A back plate spaced apart from the upper portion of the first membrane with a first air gap therebetween;
A second membrane disposed on the upper portion of the back plate with a second air gap interposed therebetween,
A MEMS microphone
And the height of the first air gap and the second air gap are different from each other.
Forming an insulating layer around the first membrane and forming a first sacrificial layer in a space surrounded by the insulating layer;
Forming a back plate on an upper surface of the first sacrificial layer;
Forming an insulating layer around the back plate and forming a second sacrificial layer in a space surrounded by the insulating layer;
Forming a second membrane on the top surface of the second sacrificial layer and forming a tone hole in the second membrane;
Forming a back chamber to expose a first membrane at a bottom surface of the substrate;
Removing the first sacrificial layer and the second sacrificial layer
≪ / RTI >
A back plate formed on a vertical surface of the step portion;
The lower end is fixed to the horizontal plane of the step portion and the upper end is free end, and a membrane arranged side by side with the back plate
A MEMS microphone
A back plate formed on a vertical surface of the step portion;
The lower end is fixed to the horizontal plane of the step portion and the upper end is free end, and the membrane formed side by side with the back plate
A MEMS microphone
A plurality of step portions are formed in the periphery of the through holes,
Wherein the back plate is formed on each vertical surface of each step portion, and the membrane is formed on each horizontal surface of each step portion
The MEMS microphones according to any one of claims 1 to 5, wherein the through holes are formed in a plurality of through holes, each of the through holes is formed in each of the through holes, and the back plate and the membrane are formed in each of the step portions.
And a stopper for limiting the amplitude of the membrane is formed on the vertical surface of the stepped portion.
And a stopper for limiting the amplitude of the membrane is formed on the inner wall of the through hole located on the opposite side of the back plate with respect to the membrane.
The back plate having a width smaller than the width of the membrane and having a rectangular shape in which both ends are fixed to the substrate, a cross shape in which two rectangles are crossed and four ends are fixed to the substrate, A mesh type in which partition walls having a width smaller than that of the through holes are arranged in a lattice form, and wire types in which partition walls having a smaller width than a plurality of slit-shaped through holes are arranged side by side are selected from the group consisting of a central through- microphone
The membrane is a rectangular shape having a width smaller than that of the back plate and connected at both ends to a substrate, or a cross shape in which two rectangular shapes are crossed and four ends are connected to the substrate.
Characterized in that the back plate is a rectangular, circular or square having the same width as the rectangular membrane,
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KR1020150057324A KR20160127212A (en) | 2015-04-23 | 2015-04-23 | MEMS microphone and manufacturing method thereof |
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KR1020150057324A KR20160127212A (en) | 2015-04-23 | 2015-04-23 | MEMS microphone and manufacturing method thereof |
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KR1020160079405A Division KR101698312B1 (en) | 2016-06-24 | 2016-06-24 | MEMS microphone and manufacturing method thereof |
KR1020160079407A Division KR101700571B1 (en) | 2016-06-24 | 2016-06-24 | MEMS microphone |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180064960A (en) | 2017-06-08 | 2018-06-15 | (주)다빛센스 | Voice transmitting device and manufacturing method thereof |
KR20180066577A (en) | 2016-12-09 | 2018-06-19 | (주)다빛센스 | Acoustic sensor and manufacturing method thereof |
WO2018110878A1 (en) * | 2016-12-13 | 2018-06-21 | (주)글로벌센싱테크놀로지 | Microphone having horizontal tensile structure and method for manufacturing microphone |
KR102091854B1 (en) | 2018-11-30 | 2020-03-20 | (주)다빛센스 | Condensor microphone and manufacturing method thereof |
CN112897448A (en) * | 2021-02-25 | 2021-06-04 | 苏州敏芯微电子技术股份有限公司 | MEMS sensor, MEMS structure thereof and manufacturing method of MEMS structure |
KR102350898B1 (en) | 2020-10-19 | 2022-01-14 | (주)다빛센스 | Method for forming mems electrode |
WO2022055206A1 (en) * | 2020-09-08 | 2022-03-17 | 한국생산기술연구원 | Mems microphone backplate having acoustic hole structure for improving acoustic characteristics |
KR20230125678A (en) | 2022-02-21 | 2023-08-29 | (주)다빛센스 | Condenser microphone |
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KR100925558B1 (en) | 2007-10-18 | 2009-11-05 | 주식회사 비에스이 | Mems microphone package |
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2015
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Patent Citations (1)
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KR100925558B1 (en) | 2007-10-18 | 2009-11-05 | 주식회사 비에스이 | Mems microphone package |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180066577A (en) | 2016-12-09 | 2018-06-19 | (주)다빛센스 | Acoustic sensor and manufacturing method thereof |
WO2018110878A1 (en) * | 2016-12-13 | 2018-06-21 | (주)글로벌센싱테크놀로지 | Microphone having horizontal tensile structure and method for manufacturing microphone |
KR20180064960A (en) | 2017-06-08 | 2018-06-15 | (주)다빛센스 | Voice transmitting device and manufacturing method thereof |
KR102091854B1 (en) | 2018-11-30 | 2020-03-20 | (주)다빛센스 | Condensor microphone and manufacturing method thereof |
KR102091849B1 (en) | 2018-11-30 | 2020-03-20 | (주)다빛센스 | Condensor microphone and manufacturing method thereof |
WO2022055206A1 (en) * | 2020-09-08 | 2022-03-17 | 한국생산기술연구원 | Mems microphone backplate having acoustic hole structure for improving acoustic characteristics |
KR102350898B1 (en) | 2020-10-19 | 2022-01-14 | (주)다빛센스 | Method for forming mems electrode |
CN112897448A (en) * | 2021-02-25 | 2021-06-04 | 苏州敏芯微电子技术股份有限公司 | MEMS sensor, MEMS structure thereof and manufacturing method of MEMS structure |
CN112897448B (en) * | 2021-02-25 | 2024-05-03 | 苏州敏芯微电子技术股份有限公司 | MEMS sensor, micro-electromechanical structure thereof and manufacturing method of micro-electromechanical structure |
KR20230125678A (en) | 2022-02-21 | 2023-08-29 | (주)다빛센스 | Condenser microphone |
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