KR20160126386A - Manufacturing method of hyper-lens and manufacturing apparatus for hyper-lens - Google Patents

Manufacturing method of hyper-lens and manufacturing apparatus for hyper-lens Download PDF

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KR20160126386A
KR20160126386A KR1020150057381A KR20150057381A KR20160126386A KR 20160126386 A KR20160126386 A KR 20160126386A KR 1020150057381 A KR1020150057381 A KR 1020150057381A KR 20150057381 A KR20150057381 A KR 20150057381A KR 20160126386 A KR20160126386 A KR 20160126386A
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lens
lens substrate
pattern
master mold
substrate
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KR1020150057381A
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KR101673201B1 (en
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김민경
김인기
윤관호
노준석
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포항공과대학교 산학협력단
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0074Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00778Producing hyperlenses, superlenses or "perfect" lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00865Applying coatings; tinting; colouring
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3435Applying energy to the substrate during sputtering
    • C23C14/3442Applying energy to the substrate during sputtering using an ion beam

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  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
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Abstract

Disclosed are a manufacturing apparatus and a manufacturing method of a hyperlens, capable of manufacturing a hyperlens in a short period of time. The manufacturing method of a hyperlens comprises the following steps of: providing a master mold formed with a protrusion pattern including at least one protrusion structure for a lens substrate; imprinting a dent pattern corresponding to the protrusion pattern on one surface of the lens substrate by pressurizing the master mold from the lens substrate; releasing the master mold from the lens substrate; and forming a lens layer inside the dent pattern.

Description

TECHNICAL FIELD [0001] The present invention relates to a method and a device for manufacturing a hyper-lens,

The present invention relates to a method and an apparatus for manufacturing a hyper lens, and more particularly to a manufacturing method and apparatus capable of mass-producing a hyper lens in a short time.

In order to recognize the shape of an object, it is necessary to make an image of the object by using light (electromagnetic wave) scattered from the object. Generally, the light scattered by an object has an Evanescent wave and a Propagating wave component whose characteristics are opposite to each other. The disappearing wave has information about the fine space change rather than the wavelength, but it can not make an image since it mostly disappears at a distance of several tens of nanometers or less on the surface of the material after the generation. Generally, images are created by traveling waves. The sharp attenuation of this decaying wave results in a diffraction limit that limits the resolving power of the optical system.

In an optical system for observing objects of small size, the resolving power is a measure of how clearly and clearly the image obtained through the optical system is. For example, the resolution d of an optical system means that when two objects are separated by a distance d or more, the object can be distinguished as being separated using the optical system.

According to general optical theory, it is known that, in an optical system that forms an image of an object using traveling waves, the resolution can not be reduced by more than half of the wavelength of light used for observing an object, regardless of the use of any optical instrument. Therefore, when a general optical microscope that forms an image of an object by irradiating an object with visible light is used, the resolution is limited to 200 nm or less, which is about half the wavelength of purple light, which is the shortest wavelength of visible light. For smaller viruses, macromolecules, or biomaterials, an electron microscope should be used that uses an electron beam with a much shorter wavelength than visible light.

However, the electron microscope is more complicated to use than the optical microscope, it is difficult to observe the object in real time, and the price is much higher than that of the optical microscope. Furthermore, when the object to be observed is an organism, the organism can be killed by the electron beam, and since the specimen to be observed must be made into a solid so as to withstand the vacuum condition of the electron microscope, the organism and the biomaterial can be observed It is impossible to do.

On the other hand, as an improvement measure to overcome the limit of resolution, a technique has been developed in which an extinction wave to be rapidly attenuated is amplified or an extinction wave is converted into a traveling wave to form an image of an object. For example, a hyper-lens can enlarge an image while converting evanescent waves into propagating waves by using an anisotropic meta material in the form of a cylinder. Since the traveling wave has a small amount of attenuation, it is possible to make a distant image which is enlarged far from the rear of the hyper lens, so that an image of an object smaller than the resolution of the visible light ray can be seen. In this case, since the disappearing wave from the object must be incident on the hyper lens before disappearing, the entire surface of the object and the hyper lens must be within several tens of nanometers. With such a hyper lens, it is possible to observe an object having a size smaller than the resolution of visible light without using an electron beam.

FIG. 1 is a cross-sectional view showing a conventional process for manufacturing such a hyper lens. Referring to FIG. 1, a conventional hyper lens is formed by (i) forming a hard mask 2 on a substrate 1, (ii) forming an opening 3 in a hard mask 2, (iii) Etching the substrate 1 through the opening 3 formed in the substrate 1 and (iv) removing the hard mask 2 to form a multi-layer structure 4 of the hyper lens on the substrate 1.

Here, the step (ii) for forming the opening 3 in the hard mask 2 for etching the substrate 1 is performed by a focused ion beam milling process, which forms the opening 3 It is a process to remove the relevant part by intensively injecting ion particles to the desired part. In the focused ion beam milling process, it takes a few seconds to make one opening 3, and the speed is slow. In addition, since it is a series process in which the openings 3 are formed one by one, it takes a long time to form the plurality of openings 3, and the focused ion beam milling apparatus for carrying out the above process is very expensive. As a result, there has been a problem that the hyper lens can not be manufactured quickly and economically due to the step (ii).

Patent Document 1: Japanese Patent Application Laid-Open No. 10-2011-0060404 (published on June 8, 2011)

Embodiments of the present invention are intended to provide a method and an apparatus for manufacturing a hyper-lens of a parallel process type which is economical and can simultaneously manufacture a large number of hyper lenses.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing a master mold on a lens substrate on which a projection pattern including at least one projecting structure is formed; Imprinting a depression pattern corresponding to the protrusion pattern on one surface of the lens substrate by pressing the master mold onto the lens substrate; Releasing the master mold from the lens substrate; And forming a lens layer in the depression pattern.

In this aspect, the protrusion pattern may include a plurality of the protruding structures, and the plurality of protruding structures may be arranged in a lattice pattern at regular intervals from each other.

In addition, the depression pattern may include at least one depression depressed inwardly into each of the protruding structures, and the depression may be formed in a hemisphere shape.

In addition, the protruding structure may be formed in a curved surface whose side is convex outward and in a conical shape having a circular bottom surface.

In addition, the protruding structure may be formed such that the angle between the side surface and the bottom surface is 45 degrees, and the diameter of the bottom surface is twice the height.

Further, the lens substrate may be made of quartz, and the master mold may be made of sapphire.

The step of imprinting the recess pattern may include pressing the master mold onto the lens substrate at a pressure of 0.5 MPa to 0.7 MPa and heating the lens substrate to a temperature of 1000 ° C or more and 1400 ° C or less . ≪ / RTI >

The step of forming the lens layer may include forming a plurality of dielectric layers and a plurality of metal layers alternately on the one surface of the lens substrate.

In addition, the step of alternately forming the plurality of dielectric layers and the plurality of metal layers may include an electron beam evaporation of titanium oxide and an electron beam evaporation of silver (Ag).

In addition, the step of alternately forming the plurality of dielectric layers and the plurality of metal layers may include sputtering silicon (Si) and electron-beam evaporating silver (Ag).

The method may further include forming the plurality of hyper lenses by cutting the lens substrate between the depressed patterns.

Further, the method further comprises the step of preparing the master mold prior to the step of providing the master mold, wherein the step of preparing the master mold comprises: coating a resist on the mold substrate; Irradiating the resist with an electron beam to form an opening pattern; Forming a mask layer of metal in the opening pattern; Removing the resist; Forming the protrusion pattern on the mold substrate by etching the mold substrate using the mask layer as an etching mask; And removing the mask layer.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing a master mold on which a protrusion pattern including at least one protruding structure is formed, on a lens substrate having a metal mask layer formed on one surface thereof; Pressing the master mold onto the lens substrate to imprint the mask layer with at least one opening corresponding to the projection pattern; Releasing the master mold from the mask layer; Forming a recessed pattern on the lens substrate by etching the lens substrate using the mask layer having the opening formed therein as an etching mask; And forming a lens layer in the depression pattern.

In this aspect, the mask layer is made of at least one selected from the group consisting of chromium, aluminum, silver, gold, platinum, titanium, tantalum, nickel, zinc, copper and cobalt, have.

In addition, the etching is a dry etching, and one or more hemisphere-shaped depressions may be formed in the lens substrate.

According to another aspect of the present invention, there is provided a mold assembly comprising: a mold joining portion for joining a master mold having a projection pattern including at least one projecting structure to a lens substrate; A pressing unit which presses the bonded body of the master mold and the lens substrate such that a recessed pattern corresponding to the protrusion pattern is imprinted on one surface of the lens substrate; A mold release portion for releasing the master mold from the lens substrate; And a lens layer forming unit for forming a lens layer inside the depression pattern.

In this aspect, the lens substrate may be made of quartz, and the master mold may be made of sapphire.

The heating unit heats the lens substrate to a temperature of 1000 ° C or more and 1,400 ° C or less and the pressing unit presses the bonded body at a pressure of 0.5 MPa or more and 0.7 MPa or less .

Effects of the method and apparatus for manufacturing a hyper lens according to the present invention will be described as follows.

According to the embodiments of the present invention, by using the imprinting process, a depressed pattern having a plurality of depressed portions can be formed on the lens substrate in a short time. By forming the lens layer in such a depressed pattern, a large number of hyper lenses can be manufactured, and the manufacturing process of the hyper lens can be simplified and quickened, resulting in improved productivity and yield.

Further, since the master mold used in the imprinting process can be recycled, it becomes possible to manufacture a large number of hyper lenses at a lower cost.

1 is a cross-sectional view illustrating a conventional hyper lens manufacturing process.
2 is a cross-sectional view illustrating a manufacturing process of a hyper lens according to an embodiment of the present invention.
3 is a cross-sectional view showing one embodiment of the manufacturing process of the master mold of FIG.
4 is an SEM image of one embodiment of the master mold produced in Fig.
5 is a cross-sectional view illustrating a manufacturing process of a hyper lens according to another embodiment of the present invention.
6 is a block diagram schematically showing an apparatus for manufacturing a hyper lens according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, in the drawings, the thicknesses of layers and films or regions are exaggerated for clarity of description, and if it is stated that any film or layer is "formed" on another film or layer, May be directly on top of the other film or layer, and a third other film or layer may be interposed therebetween

2 is a cross-sectional view illustrating a manufacturing process of a hyper lens according to an embodiment of the present invention.

Referring to FIG. 2, a method of manufacturing a hyper lens according to an exemplary embodiment includes (a) providing a master mold, (b) imprinting, (c) demolding, (d) A layer forming step and (e) a processing step.

In the step (a), the master mold 200 may be provided on one side of the lens substrate 100.

The lens substrate 100 is a substrate for supporting a lens layer 300 forming a meta-material of a hyper lens. The lens substrate 100 may be made of quartz, glass or the like having excellent optical properties, Can be used. In particular, by using the quartz lens substrate 100 having little impurities, it is possible to easily form a depression pattern by the imprinting process described later. The lens substrate 100 is formed to be transparent so that light passing through the lens layer 300 of meta-material can be emitted to the outside without attenuation. Here, transparent means that the light transmittance is 70% or more, preferably 80% or more, more preferably 90% or more.

The master mold 200 is a template for forming a depression pattern for forming a hyper lens on the lens substrate 100. A protrusion pattern including a plurality of protruding structures may be formed on one surface of the master mold 200. The master mold 200 may be used as a mold for forming a depressed pattern on the lens substrate 100 . The master mold 200 may be formed of a material having higher strength and durability than the lens substrate 100 so that the projection pattern of the surface of the master mold 200 can be transferred to the lens substrate 100. For example, when the lens substrate 100 is made of quartz, the master mold 200 may be made of sapphire.

The plurality of protruding structures 210 formed on the master mold 200 may be spaced apart from each other by a predetermined distance. In this case, a plurality of protruding structures 210 are formed in the master mold 200 in a predetermined area. Each protruding structure 210 may have a shape capable of forming a hemisphere or semi-cylindrical depression pattern when imprinted on the lens substrate 100.

A method of manufacturing the master mold 200 will be described later.

In the step (b), a recess pattern may be formed on the lens substrate 100 by imprinting using the master mold 200 as a mold. The protrusion pattern of the master mold 200 may be transferred.

Specifically, the master mold 200 can be bonded to the lens substrate 100 with the protrusion pattern of the master mold 200 facing one surface of the lens substrate 100. As the master mold 200 is pressed onto the lens substrate 100, the protrusion pattern is inserted into the lens substrate 100 and a recessed pattern having a shape corresponding to the protrusion pattern is formed on the one surface of the lens substrate 100 . At this time, the lens substrate 100 can be heated at the same time as or before the master mold 200 is pressed onto the lens substrate 100.

For example, the master mold 200 made of sapphire is pressed against the lens substrate 100 made of quartz at a pressure of 0.5 to 0.7 MPa, and the lens substrate 100 is heated at a temperature of 1000 to 1400 占 폚 Lt; / RTI > Preferably, the lens substrate 100 and the master mold 200 are pressed at 0.6 MPa, and the lens substrate 100 is imprinted while heating at 1200 ° C.

When the pressure for pressing the lens substrate 100 and the master mold 200 is less than 0.5 MPa or the temperature of the lens substrate 100 is less than 1000 ° C., a recessed pattern is hardly formed on the quartz lens substrate 100 . On the other hand, when the pressure for pressing the lens substrate 100 and the master mold 200 is greater than 0.7 MPa or the temperature of the lens substrate 100 is greater than 1200 ° C, the master mold 200 made of sapphire also loses its rigidity, It may not be able to exert its function as a Or the shape of the depressed pattern imprinted on the lens substrate 100 is likely to be crushed.

The master mold 200 is provided on one side of the lens substrate 100 after the lens substrate 100 is heated using an oven or a lamp and the master mold 200 200). However, the present invention is not limited to the above-described processes, and the lens substrate 100 and the master mold 200 may be squeezed in a state where both the lens substrate 100 and the master mold 200 are housed in a heating chamber such as an oven . Alternatively, it is also possible that the master mold 200 is pressed onto the lens substrate 100 while the heating means such as a lamp is heating the lens substrate 100 to a high temperature.

The depressed pattern formed on the lens substrate 100 may have a plurality of depressions 110 spaced apart from each other at a predetermined interval. Each of the depressions 110 can be used as a base structure for forming one hyper lens. That is, a plurality of hyper lenses may be formed through the depression pattern including the plurality of depressions 110.

Each depression 110 may have a hemispherical or semicylindrical shape. In the case where the depression 110 is formed in a hemispherical shape, a hemispherical hyper lens can be manufactured. The hemispherical hyper lens as described above can be used to two-dimensionally magnify an image of an observation target, and is useful for observing a two-dimensional image. The hemispherical depressions 110 are arranged in a lattice pattern with a predetermined interval therebetween to form the depression pattern.

In the step (c), the master mold 200 used as a mold can be released from the lens substrate 100. As the master mold 200 is released from the lens substrate 100, the lens substrate 100 having the recessed pattern formed on one surface thereof can be left.

In the step (d), the lens layer 300 may be formed on the one surface of the lens substrate 100.

The lens layer 300 is a part forming a metamaterial of the hyper lens, and may have a structure including a plurality of laminated layers. To this end, a plurality of layers may be sequentially stacked on the one surface of the lens layer 300. When each layer is formed on the lens layer 300, a depression pattern is formed on the one surface, and a part of each layer is formed in close contact with the inner surface of the depressions 110. As the plurality of layers are sequentially laminated, the plurality of layers may be laminated in a curved shape along the inner surface thereof in the depressions 110. The lens layer 300 needs to have an annular cross section to change the annihilation wave to a traveling wave and enlarge the image. The plurality of layers are laminated in the depression 110 of the depression pattern, The lens layer 300 formed on each depression 110 can be used as the lens layer 300 of one independent hyper lens.

According to one example, the lens layer 300 can be formed by alternately laminating a plurality of dielectric layers 310 and a plurality of metal layers 320. The dielectric layer 310 and the metal layer 320 may be formed through a sputtering process, an electron-beam deposition process, or a thermal deposition process, respectively. Alternatively, the dielectric layer 310 and the metal layer 320 may be formed by electrolytic plating, And the like.

According to one example, the dielectric layer 310 may be titanium oxide (Ti 3 O 5 ) and the metal layer 320 may be silver (Ag). The dielectric layer 310 and the metal layer 320 may each have a thickness of 30 nm and the same number of the dielectric layers 310 and the metal layer 320 may be alternately stacked. For example, nine dielectric layers 310 and nine metal layers 320 may be alternately stacked to form the lens layer 300. The lens layer 300 having such a structure can form an anisotropic meta material for visible light having a wavelength of 400 to 500 nm.

As another example, the dielectric layer 310 may be silicon (Si) and the metal layer 320 may be silver (Ag). In this case, the dielectric layer 310 of silicon may be amorphous silicon formed through sputtering. The dielectric layer 310 and the metal layer 320 may each have a thickness of 15 nm, and nine or more layers may be alternately stacked to form the lens layer 300. The lens layer 300 according to the present embodiment can function as a hyper lens for visible light having a wavelength in the range of 500 to 650 nm.

By forming the lens layer 300 in this step, a plurality of hyper lenses can be obtained at one time. As described above, the lens layer 300 of one hyper lens can be formed through one depression 110, and a plurality of hyper lenses can be manufactured simultaneously through the depression pattern formed on the lens substrate 100 It is because. That is, by simply imprinting a recessed pattern on one surface of the lens substrate 100 and laminating a plurality of layers on the one surface on which the recessed pattern is formed through the step (b), the depression 110 The number of lens layers 300 can be manufactured at a time.

In the step (e), a plurality of hyper lenses may be formed by cutting the lens substrate 100 between two depressions 110 adjacent to each other.

When the lens layers 300 are manufactured as many as the number of the depressions 110 included in the depression pattern, the lens substrate 100 is cut so that the required number of the lens layers 300 can be separated, ) Can be produced. Thereby, a large amount of the hyper lens 10 can be manufactured in a short time.

FIG. 4 is a cross-sectional view illustrating one embodiment of the manufacturing process of the master mold of FIG. 3, and FIG. 5 is an SEM image of the master mold manufactured in FIG.

According to one embodiment, the master mold used for manufacturing the above-described hyper lens may be manufactured through the process shown in Fig. Referring to FIG. 4, the master mold may be formed by the steps of (a-1) resist coating, (a-2) forming an opening pattern in a resist, -5) etching the mold substrate and (a-6) removing the mask layer.

In the step (a-1), the resist 410 may be coated on the mold substrate 220.

The material of the mold substrate 220 may be quartz, glass, sapphire, silicon, or the like. According to an example, the mold substrate 220 may be made of sapphire, because sapphire has no impurities and is easy to form a nanostructure of a desired shape through dry etching. In addition, the mold substrate 220 is preferably made of a material having higher strength and durability than the lens substrate 100 so as to function as a template for imprinting, which transfers a pattern of a nanoscale to the lens substrate 100 When the lens substrate 100 is made of quartz, the mold substrate 220 made of sapphire can exhibit higher strength and durability than the lens substrate 100.

The resist 410 may be made of a material capable of forming a pattern in response to an ultraviolet ray, an electron beam, an ion beam, X-ray or the like. As an example, an intaglio electron beam resist 410 in which a portion irradiated with an electron beam is removed may be used, but the present invention is not limited thereto. It is also possible to use the electron beam resist 410 in a positive-angle fashion, or to use a photoresist 410. The resist 410 may be coated on the mold substrate 220 using a knife coater or the like.

In the step (a-2), the opening pattern 411 may be formed on the resist 410. [

When the electron beam resist 410 is coated as in the above-described example, the opening pattern 411 can be formed by removing the resist 410 at a desired portion through an electron-beam lithography process. The electron beam lithography process is relatively simple in the construction of the system for this purpose, and it is easy to implement a large-area electron beam emitter, so that the aperture pattern 411 can be quickly patterned at a time. As another example, when the photoresist 410 is coated, a pattern may be formed by exposing the mask with a mask having a desired pattern formed thereon, and then performing a development process. The upper surface of the mold substrate 220 can be exposed at the portion where the opening pattern 411 is formed.

According to one example, the opening pattern 411 may be a pattern in which a plurality of circular openings each having a diameter of about 0.1 mu m are arranged in a lattice pattern at intervals of about 3 mu m apart from each other. Here, the fact that the structure of the circular shape is spaced by a certain distance means that the distance between the centers of the two circular shapes adjacent to each other is equal to the distance.

In the step (a-3), the mask layer 420 may be formed in the opening pattern 411 of the resist 410 through a process such as deposition. In the step (a-4) Only the mask layer 420 can be removed. Here, the mask layer 420 may be formed of a metal.

The mask layer 420 of the pattern corresponding to the opening pattern 411 is formed on the mold substrate 220 by filling the material of the mask layer 420 into the opening pattern 411 and removing the remaining resist 410 . Specifically, the mask layer 420 may be formed by depositing a metal material on the exposed portion of the mold substrate 220 in the opening pattern 411 through an electron beam deposition process, and may be formed by sputtering, It may be formed through other methods such as electroplating through electroless plating through reduction of the ionic derivative, and electroless plating. The remaining resist 410 may be removed by physical or other chemical methods such as etching.

The mask layer 420 with the resist 410 removed and left on the mold substrate 220 can be used as a mask for a subsequent etching process. When the opening pattern 411 is formed as in the above-described example, the mask layer 420 also corresponds to a circular disk shape with a diameter of about 0.1 占 퐉, which forms a pattern of a lattice- . This pattern of the mask layer 420 allows subsequent etching of the mold substrate 220 in a regular pattern.

The metal of the mask layer 420 may be selected from the group consisting of chromium, aluminum, silver, gold, platinum, titanium, tantalum, nickel, zinc, copper and cobalt. Among them, it may be preferable to use chromium in consideration of hardness, melting point, and surface energy.

In the step (a-5), the mold substrate 220 may be etched using the mask layer 420 as an etching mask to form a protrusion pattern on the mold substrate 220.

The etching may be dry etching. When the mold substrate 220 is etched by dry etching, a nanostructure having an aspect ratio of at least a certain level can be formed, and a nanostructure having a desired shape can be formed more easily. A mixed gas containing at least one of boron chloride (BCl 3 ), chlorine (Cl 2 ), and nitrogen (N 2 ) may be used as the dry etching material when the basic shape of the mold substrate 220 is sapphire. However, the step (a-5) is not limited to the dry etching, and the wet etching may be performed if necessary.

The protrusion patterns formed on the mold substrate 220 by the etching process in this step may include a plurality of protrusion structures 210 spaced apart from each other by a predetermined distance and arranged in a lattice pattern. As shown in FIG. 4, the protruding structure 210 may have a hemispherical shape or a horn-shaped shape with the uppermost portion of the mask layer 420 on which the circular disk is formed. Here, the mold substrate 220 may be etched so that the side surface of the protruding structure 210 has a curved surface as shown in FIG. 4, but the present invention is not limited thereto. It is also possible for the side surface of the protruding structure 210 to be a flat inclined surface. Also, the protruding structure 210 may have an aspect ratio of 2: 1, and the angle between the side surface and the bottom surface of the protruding structure 210 may be 45 degrees to 90 degrees.

In the step (a-6), the mask layer 420 used as the etching mask may be removed.

The mask layer 420 may be removed by a physical removal method such as dry etching. When the material of the mask layer 420 is chrome, a mixed gas containing at least one of chlorine (Cl 2 ) and boron chloride (BCl 3 ) may be used as the dry etching material. However, the step (a-6) is not limited to dry etching, and wet etching may be performed if necessary.

The mask layer 420 is removed by etching so that only the mold substrate 220 on which the protrusion patterns are formed remains. The mold substrate 220 on which the projection patterns are formed can be used as a mold for forming a depressed pattern on the lens substrate 100 in the process of manufacturing a hyper lens.

According to one embodiment, the protruding structure 210 of the protruding pattern has an angle of about 45 degrees between the side surface and the bottom surface, a diameter of the bottom surface is about twice the height, and the side surface is an outwardly convex curved surface It can have a conical shape formed. In this case, the protruding structure 210 is not perfectly hemispherical, but has an intermediate shape, which is not a perfect conical shape. This is to form a depression pattern of a hemispherical shape when the projection pattern is imprinted on the lens substrate 100 to form a depression pattern. In the imprinting process, when the depression pattern is formed on the lens substrate 100 by the protrusion pattern of the master mold 200, the depression pattern is generally formed so as to be pressed more in the height direction than the protrusion structure 210 of the protrusion pattern to be. Accordingly, if a hemispherical depression pattern is desired, it is preferable that the protrusion structure 210 of the protrusion pattern of the master mold 200 is formed in a hemispherical shape and a conic shape that are not perfectly hemispherical.

According to one example, the hemispheric or horned protruding structure of the protrusion pattern formed on the mold substrate may have a bottom surface diameter of about 2.5 占 퐉, a height of about 1.25 占 퐉, and an angle between the side surface and the bottom surface of about 45 占 퐉. A plurality of protruding structures may be disposed so that the distance between centers of the bottom surfaces of two protruding structures adjacent to each other is about 3 占 퐉 to form the protruding pattern, and this embodiment is shown in the SEM image of Fig.

According to the above-described embodiment, a depression pattern having a large number of depressions 110 can be formed on the lens substrate 100 through a single imprinting process. Each depression 110 is a basic structure for forming one hyper lens, so that a large number of hyper lenses can be manufactured in a short time by laminating the dielectric layer 310 and the metal layer 320 on the depression pattern. By forming the lens layer 300 immediately after patterning the depressed pattern in parallel on the lens substrate 100 using imprinting as described above, it becomes possible to manufacture the hyper lens through a smaller number of processes. As a result, the productivity, yield and economical efficiency in manufacturing the hyper lens can be remarkably improved. For example, when the method of this embodiment is used, the whole process takes about 5 minutes, and about 6.25 million hyper lenses can be manufactured at one time. This productivity is significantly improved over the conventional manufacturing method, which takes about 4 hours or more to manufacture about 10,000 lenses with time-consuming and non-economic ion beam milling processes.

Further, in manufacturing a large number of hyper lenses, adjustment of the size, shape, and number of desired hyper lenses can be facilitated. The lens layer 300 of the hyper lens is formed in accordance with the size, shape, and number of depressions 110 of the depressed pattern, and a master mold 200 capable of forming depressed patterns of desired size, shape, And the size, shape, and number of the hyper lens can be easily changed by using it in the manufacture of a hyper lens. Since the master mold 200 can be reused, the manufacturing cost can also be reduced.

FIG. 6 is a flowchart illustrating a method of manufacturing a hyper lens according to another embodiment of the present invention, and FIG. 7 is a cross-sectional view illustrating a manufacturing process of a hyper lens according to the manufacturing method of FIG.

Referring to FIGS. 6 and 7, the manufacturing method of the hyper lens according to the present embodiment may further include (c-1) etching the lens substrate and (c-2) removing the metal layer. The steps (c-1) and (c-2) may be performed after the (d) lens layer formation step after the (c) In this case, in the step (b) described above, the recess pattern by the master mold can be formed on the mask layer formed on one surface of the lens substrate, and the protrusion pattern of the master mold does not have the depression pattern on the mask layer other than the lens substrate itself Printing can be done.

More specifically, in this embodiment, the master mold 200a may be provided on one side of the lens substrate 100 in the above-described step (a). At this time, a mask layer 500 may be provided on one surface of the lens substrate 100 Can be formed. The mask layer 500 may be made of a metal. For example, the mask layer 500 may be formed of chromium, aluminum, silver, gold, platinum, titanium, tantalum, nickel, zinc, copper or cobalt. The mask layer 500 can be formed by depositing the metal material on one surface of the lens substrate 100 through electron beam evaporation, sputtering, thermal evaporation, or the like. In this step, the lens substrate 100 may be disposed such that the mask layer 500 faces the master mold 200a.

In the imprinting step (b), one or more openings 510 may be formed in the mask layer 500 by imprinting using the master mold 200a as a mold. At this time, the opening 510 may pass through the mask layer 500 in the thickness direction. The material constituting the master mold 200a can be appropriately changed to facilitate imprinting in the metal mask layer 500. [ The shapes and sizes of the protruding structures 210 of the protrusion patterns formed in the master mold 200a may be appropriately set so as to form the openings 510 in the mask 500. [

Specifically, a master mold 200a made of sapphire is pressed to a mask layer 500 made of chrome at a pressure of 0.3 to 0.5 MPa, and the mask layer 500 can be heated to a temperature of 600 to 1000 ° C . Preferably, the mask layer 500 and the master mold 200a are pressed at 0.4 MPa, and the mask layer 500 can be imprinted while heating to 800 ° C.

The pressure of 0.3 MPa for pressing the mask layer 500 and the master mold 200a and the temperature of 600 占 폚 of the mask layer 500 at this time are set such that the mask layer 500 made of chrome is pressed against the master mold 200a made of sapphire It is the minimum condition that can sink. On the other hand, when the pressure for pressing the mask layer 500 and the master mold 200a is greater than 0.5 MPa or the temperature of the mask layer 500 is greater than 1000 degrees Celsius, Is difficult to be formed corresponding to the protruding structure 210. When the imprinting step is completed, the master mold 200a may be separated from the mask layer 500 through the (c) shaping step. When the master mold 200a is detached, the mask layer 500 having openings 510 formed on one surface of the lens substrate 100 may remain. The one surface of the lens substrate 100 can be exposed by each of the openings 510.

In step (c-1), the lens substrate 100 may be etched using the mask layer 500 having the openings 510 as an etch mask. Here, the etching may be wet etching (chemical etching) or BOE (Buffered Oxide Etchant) may be used as the wet etching material when the lens substrate 100 is quartz. However, since the step (c-1) is a wet etching, the spirit of the present invention is not limited thereto. The etching material can be brought into contact with the lens substrate 100 through the respective openings 510 and the lens substrate 100 is etched under the respective openings 510 so that the recessed patterns including the plurality of depressions 110 And may be formed on the substrate 100. At this time, the lens substrate 100 may be etched so that the depressions 110 are hemispherical or semicylindrical.

In the step (c-2), the mask layer 500 used as an etch mask may be removed through an etching process. The mask layer 500 may be removed by dry etching, for example, using a mixed gas comprising at least one of chlorine (Cl 2 ) and boron chloride (BCl 3 ) as an etchant. However, this step is not limited to dry etching, and the mask layer 500 may be removed by wet etching if necessary. The mask layer 500 is removed by etching so that only the lens substrate 100 on which the plurality of depressions 110 are formed remains. The depressions 110 may be a basic structure for forming the lens layer 300 of the hyper lens.

In the step (d) of forming the lens layer 300, the lens layer 300 is formed on the one surface of the lens substrate 100, thereby forming the laminated structure of the lens layer 300 in the depressions 110 formed as described above. In the step (e), the lens substrate 100 may be cut to form a plurality of hyper lenses 10. The details of steps (d) and (e) above are intended to be illustrative of the foregoing.

According to the present embodiment, an imprinting process is performed using the master mold 200a, and an etching mask is formed through the imprinting process instead of forming the depression 110 directly on the lens substrate 100. [ Then, depressions 110 are formed by etching the lens substrate 100 using the etching mask. In this case, the protrusion pattern of the master mold 200a is for forming the opening 510 in the etching mask, and therefore, it does not need to be made elaborately. The specific shape and size of the hyper lens layer 300 are ultimately determined through the etching process. The size and shape of the depression 110 can be changed by adjusting the etching process after the opening 510 is formed with the same master mold 200a. When the size or shape of the hyper lens is changed, It is not necessary to newly fabricate the first electrode 200a. Therefore, it is possible to manufacture a large amount of hyper lens in a short time through the imprinting process, and to manufacture the hyper lens more economically.

8 is a block diagram schematically showing an apparatus for manufacturing a hyper lens according to an embodiment of the present invention.

8, the hyper lens manufacturing apparatus 60 includes a transfer section 61, a mold joining section 62, a pressing section 63, a mold release section 64, a lens layer forming section 65, 66).

The transfer unit 61 can transfer at least one of the master mold and the lens substrate. The protrusion pattern of the master mold can be disposed so as to face the one surface of the lens substrate. If necessary, the transfer unit 61 may be omitted.

The mold joint 62 can bond the master mold onto the lens substrate. At this time, the protrusion pattern of the master mold can be brought into contact with the lens substrate.

The pressing portion 63 can press the joined body of the master mold and the lens substrate with the master mold bonded on the lens substrate. If necessary, the pressing portion 63 can press the bonding body under a temperature condition of a predetermined temperature or higher, or press the bonding body in a state where the lens substrate or the master mold is heated to a predetermined temperature or higher. In this case, the apparatus for producing a hyper lens 60 may further include a heating unit.

By the pressing of the pressing portion 63, the projection pattern of the master mold is transferred to the lens substrate, and a depressed pattern can be formed on the lens substrate. The depressed pattern may include a plurality of depressed portions. In other words, it is possible to perform parallel patterning in which a plurality of depressions are formed on the lens substrate by a single process without repeating the process by the mold joining portion 62 and the pressing portion 63.

The mold releasing portion 64 can separate the master mold from the lens substrate after the pressing of the pressing portion 63 is completed. As the mold releasing portion 64 releases the master mold, only the lens substrate having a plurality of depressed portions on one surface thereof remains.

The lens layer forming section 65 can form a lens layer of a hyper lens by laminating a plurality of layers in a plurality of depressions formed in the lens substrate. For example, the lens layer forming portion 65 may sequentially deposit the plurality of layers on the one surface of the lens substrate. The plurality of layers may be deposited on the inner surface of the depression at the portion where the depression is formed and the plurality of layers may be formed inside the depression.

Specifically, the lens layer forming portion 65 may include a dielectric layer forming portion and a metal layer forming portion. In this case, the lens layer forming section 65 can form a lens layer by alternately laminating a plurality of dielectric layers and a plurality of metal layers. The dielectric layer forming portion can deposit a dielectric material such as metal oxide or silicon on the lens substrate, and the metal layer forming portion can deposit a metal such as silver on the lens substrate.

The processing section 66 can cut a lens substrate between two depressions adjacent to each other to make a plurality of hyper lenses. That is, a large number of depressions are formed on one lens substrate by the mold joining portion 62 and the pressing portion 63, and a lens layer is formed on each of the depressed portions by the lens layer forming portion 65, A plurality of lens layers are formed, and the processing portion 66 can cut such a lens substrate to separate the required number of lens layers. As the machining portion 66 cuts the lens substrate, a plurality of hyper lenses having a structure in which one lens layer is supported by the substrate layer can be produced.

The transferring part 61, the mold joining part 62, the pressing part 63, the mold releasing part 64, the lens layer forming part 65 and the machining part 66 can perform a flat plate process. However, the spirit of the present invention is not limited to this, and it is also possible that at least some of the processes are performed in a roll-to-roll manner, if necessary.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Should be interpreted as having. Skilled artisans may implement a pattern of features that are not described in a combinatorial and / or permutational manner with the disclosed embodiments, but this is not to depart from the scope of the present invention. It will be apparent to those skilled in the art that various changes and modifications may be readily made without departing from the spirit and scope of the invention as defined by the appended claims.

10: Hyper lens 100: Lens substrate
110: depression 200, 200a: master mold
210: protruding structure 220: mold substrate
300: Lens layer 310: Dielectric layer
320: metal layer 410: resist
411: opening pattern 420, 500: mask layer
510: opening

Claims (18)

Providing a master mold on a lens substrate on which a projection pattern including at least one projecting structure is formed;
Imprinting a depression pattern corresponding to the protrusion pattern on one surface of the lens substrate by pressing the master mold onto the lens substrate;
Releasing the master mold from the lens substrate; And
And forming a lens layer inside the depression pattern.
The method according to claim 1,
Wherein the protruding pattern includes a plurality of protruding structures,
Wherein the plurality of protruding structures are arranged in a lattice pattern at a predetermined interval from each other.
3. The method according to claim 1 or 2,
Wherein the depression pattern comprises one or more depressions depressed inwardly into each of the protruding structures,
Wherein the depressions are formed in a hemisphere shape.
The method of claim 3,
Wherein the protruding structure is formed in a conical shape having a circular bottom surface, the side surface being formed as an outward convex surface.
5. The method of claim 4,
Wherein the protruding structure has an angle of 45 degrees between the side surface and the bottom surface, and the diameter of the bottom surface is twice the height.
The method according to claim 1,
Wherein the lens substrate is made of quartz,
Wherein the master mold is made of sapphire.
The method according to claim 6,
The step of imprinting the depression pattern comprises:
Pressing the master mold onto the lens substrate at a pressure of 0.5 MPa or more and 0.7 MPa or less,
And heating the lens substrate to 1000 ° C or higher and 1400 ° C or lower.
The method according to claim 1,
Wherein forming the lens layer comprises:
And alternately forming a plurality of dielectric layers and a plurality of metal layers on the one surface of the lens substrate.
9. The method of claim 8,
Wherein the step of forming the plurality of dielectric layers and the plurality of metal layers alternately includes:
Electron-beam deposition of titanium oxide,
And electron-beam evaporating silver (Ag).
9. The method of claim 8,
Wherein the step of forming the plurality of dielectric layers and the plurality of metal layers alternately includes:
A step of sputtering silicon (Si)
And electron-beam evaporating silver (Ag).
The method according to claim 1,
And cutting the lens substrate between the recessed patterns to make a plurality of hyper lenses.
The method according to claim 1,
Further comprising the step of manufacturing the master mold prior to providing the master mold,
Wherein the step of preparing the master mold comprises:
Coating a resist on the mold substrate;
Irradiating the resist with an electron beam to form an opening pattern;
Forming a mask layer of metal in the opening pattern;
Removing the resist;
Forming the protrusion pattern on the mold substrate by etching the mold substrate using the mask layer as an etching mask; And
And removing the mask layer.
Providing a master mold on which a protrusion pattern including at least one protruding structure is formed, on a lens substrate having a metal mask layer formed on one surface thereof;
Pressing the master mold onto the lens substrate to imprint the mask layer with at least one opening corresponding to the projection pattern;
Releasing the master mold from the mask layer;
Forming a recessed pattern on the lens substrate by etching the lens substrate using the mask layer having the opening formed therein as an etching mask; And
And forming a lens layer inside the depression pattern.
14. The method of claim 13,
Wherein the mask layer is made of at least one selected from the group consisting of chromium, aluminum, silver, gold, platinum, titanium, tantalum, nickel, zinc, copper and cobalt,
Wherein the master mold is made of sapphire.
14. The method of claim 13,
Wherein the etching is dry etching and at least one hemisphere-type depression is formed in the lens substrate.
A mold joining part for joining a master mold having a projection pattern including at least one projecting structure to a lens substrate;
A pressing unit which presses the bonded body of the master mold and the lens substrate such that a recessed pattern corresponding to the protrusion pattern is imprinted on one surface of the lens substrate;
A mold release portion for releasing the master mold from the lens substrate; And
And a lens layer forming unit for forming a lens layer inside the depression pattern.
17. The method of claim 16,
Wherein the lens substrate is made of quartz,
Wherein the master mold is made of sapphire.
18. The method of claim 17,
Further comprising a heating unit for heating the lens substrate,
Wherein the heating unit heats the lens substrate to a temperature of 1000 ° C or more and 1400 ° C or less and the pressing unit presses the joined body at a pressure of 0.5 MPa or more and 0.7 MPa or less.
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