KR20160123502A - Handler for testing semiconductor devices and operating method therof - Google Patents

Abstract

The present invention relates to a handler for testing a semiconductor device and an operating method thereof. The present invention photographs a grip state of a picker of a picking module or a semiconductor device gripped by the picker while operating a handler, and compares a photographed image and a previously stored image to determine whether a teaching point is defective or the semiconductor device is defectively gripped by the picking module. According to the present invention, since the teaching point is continuously adjusted while operating the handler, reliability for semiconductor moving work is improved. Since a situation where an operation is stopped by a teaching point defect does not occur, a rate of operation of the handler can be increased to increase a handling capacity. Whether the semiconductor device is defectively gripped can be checked to quickly handle a defective grip.

Description

TECHNICAL FIELD [0001] The present invention relates to a handler for testing a semiconductor device,

The present invention relates to a handler for electrically connecting a semiconductor device to a tester and classifying the semiconductor device according to a test result.

A handler for semiconductor device testing (hereinafter referred to as a "handler") is a device for classifying semiconductor devices according to a test result after electrically connecting semiconductor devices manufactured through a predetermined manufacturing process to a tester.

Handlers for supporting semiconductor device testing are disclosed in various patent documents such as Korean Patent Laid-Open Nos. 10-2002-0053406 and 10-2012-0027248.

The handler includes a plurality of moving devices for moving the semiconductor device to electrically connect the semiconductor device to the tester.

The moving devices grip semiconductor elements in a certain region of the front end on the movement path of the semiconductor elements, move them to another region in the rear end, and then release the holding of the semiconductor elements. Hereinafter, the holding position of the semiconductor element by the moving device and the releasing position of releasing the holding of the semiconductor element are called a teaching point. In order for the movement of the semiconductor devices by these moving devices to be properly performed, the moving devices must accurately grasp the semiconductor elements at the teaching points of a predetermined area (hereinafter, referred to as " front end teaching area "), It is necessary to release the gripping of the semiconductor element at the correct teaching points of the constant area (hereinafter referred to as the " rear end teaching area ").

Therefore, when the production assembly of the handler or the standard conversion of the semiconductor device to be tested exists, the teaching points of the mobile devices are accurately set.

However, due to the design tolerance of the handler and the operation shock caused by the operation, the arrangement position of the mechanical structure is shaken, which causes the actual teaching points of the mobile devices to deviate from the previously set teaching points. In this case, since the release of the semiconductor device by the moving devices can not be precisely performed, the semiconductor device is not properly moved. For example, if the picker of the mobile device needs to grasp the center of the semiconductor device exactly or at least near the center of the semiconductor device, if the picker can not grasp the semiconductor device at its center, When the semiconductor element can not be placed at a proper position (such as when it is placed outside the proper position, when the semiconductor element is laid over the proper position, or when the semiconductor element is twisted) at the releasing position, there occurs. In this case, the semiconductor element may be lost or broken when the next operation in the handler proceeds. To prevent this, the handler must be stopped and the teaching points must be reset, which reduces the handling capacity of the handler by reducing the handling capacity.

In addition, the semiconductor element held by the picker may be distorted due to an operation impact of the moving apparatus or a defective position of the semiconductor element before gripping, for example. In such a case, the same problem may occur.

A first object of the present invention is to provide a technique capable of adjusting a teaching point of moving devices in which a teaching point is disturbed during the operation of a handler.

A second object of the present invention is to provide a technique for confirming whether or not the semiconductor device moved by the mobile device is poor gripping.

In order to achieve the above object, according to a first aspect of the present invention, there is provided a handler for testing a semiconductor device, comprising: a plurality of moving devices for moving a semiconductor element in a teaching area at a front end to a teaching area at a rear end on a moving path of the semiconductor element; A connecting device for electrically connecting the semiconductor elements to the tester at a test position on the movement path; At least one sensing device for sensing whether the semiconductor device is poorly taught by at least one of the plurality of mobile devices; And a control device for controlling the plurality of mobile devices, the connection device, and the at least one sensing device; Wherein the at least one moving device comprises: a picking module capable of grasping or releasing the at least one semiconductor element and moving according to a predetermined movement pattern; And a mobile device for moving the picking module according to the determined movement pattern. Wherein the at least one sensing device is located at a specific location and includes a camera for photographing a bottom surface of the picking module above the specific location, And compares the stored images to determine whether the picking module is defective or not.

The specific position is a position directly under the position where the picking module temporarily stops moving along the predetermined movement pattern.

According to a first aspect of the present invention, there is provided a method of operating a handler for testing a semiconductor device, comprising: operating a moving device having a picking module for holding or releasing a semiconductor element, Moving the semiconductor device to a teaching range of a rear end of the teaching area of the front end while moving the semiconductor device according to the teaching result; A photographing step of photographing the bottom surface of the picking module when the picking module is at an arbitrary position while moving the semiconductor device in the device moving step; And a determination step of determining whether the semiconductor device is defective by the picking module by comparing the image obtained through the imaging step with a previously stored image. .

An adjusting step of adjusting a teaching point of a semiconductor element by the picking module if it is determined that teaching is failed in the determining step; .

Wherein when the picking module has a plurality of pickers capable of grasping or releasing holding of semiconductor elements, the determining step may determine an image of a semiconductor element held by either one of the plurality of pickers and the reference picker, And comparing it with the pre-stored image.

The photographing step may be performed after temporarily stopping the picking module moving on the predetermined movement pattern at an arbitrary position on the predetermined movement pattern.

According to a second aspect of the present invention, there is provided a handler for testing a semiconductor device, comprising: a plurality of moving devices for moving a semiconductor element in a front end teaching area on a moving path of a semiconductor element to a rear teaching area; A connecting device for electrically connecting the semiconductor elements to the tester at a test position on the movement path; At least one sensing device for sensing whether the semiconductor device is poorly gripped by at least one of the plurality of mobile devices; And a control device for controlling the plurality of mobile devices, the connection device, and the at least one sensing device; Wherein the at least one moving device comprises: a picking module capable of grasping or releasing the at least one semiconductor element and moving according to a predetermined movement pattern; And a mobile device for moving the picking module according to the determined movement pattern. Wherein the at least one sensing device includes a camera disposed at a specific location and capturing a bottom surface of the picking module above the specific location while holding the semiconductor device, And determines whether or not the picking module is grasped by comparing the image captured by the picking module with the previously stored image.

The specific position is a position directly under the position where the picking module temporarily stops moving along the predetermined movement pattern.

According to a second aspect of the present invention, there is provided a method of operating a handler for testing a semiconductor device, comprising: operating a mobile device having a picking module for holding or releasing a semiconductor element, An element holding step of holding a semiconductor element in a region; A photographing step of photographing a bottom surface of the picking module when the picking module holding the semiconductor device is in an arbitrary position while moving the semiconductor device in the device holding step; And a determining step of comparing the image obtained through the photographing step with a pre-stored image to determine whether the semiconductor device is poorly gripped by the picking module. .

A jam generating step of generating a jam if it is judged in the judging step that gripping is poor; .

The photographing step may be performed after temporarily stopping the picking module moving on the predetermined movement pattern at an arbitrary position on the predetermined movement pattern.

The present invention has the following effects.

First, since the teaching point is continuously adjusted during the operation of the handler, the reliability of the semiconductor device moving operation is improved.

Secondly, since the situation of the shutdown due to the teaching point failure does not occur, the operating rate of the handler can be increased and the processing capacity can be increased.

Third, it is possible to confirm the holding failure of the semiconductor element due to the operation impact of the moving apparatus before the holding operation is released, so that the moving defect of the semiconductor element can be quickly prevented before the holding operation is released.

1 is a conceptual plan view of a handler for testing a semiconductor device according to an embodiment of the present invention.
2 is a conceptual block diagram of mobile devices applied to the handler of FIG.
Figs. 3 and 4 are reference diagrams for explaining features of the present invention. Fig.
5 is a flowchart of a method of operating a handler for testing semiconductor devices according to a first embodiment of the present invention.
Fig. 6 is a reference diagram necessary for explaining the flow chart of Fig. 5; Fig.
7 is a flowchart of a method of operating a handler for testing semiconductor devices according to a second embodiment of the present invention.
8 is a reference diagram necessary for explaining the flow chart of Fig.
9 is a supplementary diagram for supplementing a method of operating a handler for testing a semiconductor device according to the flowchart of FIG.

Hereinafter, preferred embodiments of the present invention will be described. For the sake of simplicity of explanation, it is preferable to omit or compress known or duplicated descriptions as much as possible.

<Description of basic configuration of handler>

1 is a conceptual plan view of a handler 100 (hereinafter, referred to as a 'handler') for testing a semiconductor device according to an embodiment of the present invention.

1, the handler 100 according to an exemplary embodiment of the present invention includes a test tray 110, a first moving device 121, a first sensing device 122, a soak chamber 130, A chamber 140, a connection device 150, a DESOAK chamber 160, a second moving device 171, a second sensing device 172, an sorting table 180, A second sensing device 191, a third sensing device 192, and a control device (CA).

The test tray 110 is provided with a plurality of inserts to which a semiconductor element can be mounted, which is somewhat flowable, and circulates along a closed path C defined by a plurality of transfer devices (not shown).

The first moving device 121 moves the semiconductor device to be tested, which is loaded in the customer tray CT ₁ , to the test tray 110 in the loading position (LP).

The first sensing device 122 senses whether the first moving device 121 has failed to teach the semiconductor device.

The soak chamber 130 is provided to preheat or precool the semiconductor devices loaded on the test tray 110 transferred from the loading position LP according to test environment conditions prior to testing . That is, the semiconductor device loaded in the test tray 110 is accommodated in the soak chamber 130 and then transferred to the temperature required for the test while being transferred.

The test chamber 140 receives the test tray 110 that has been preheated / pre-cooled in the soak chamber 130 and then transferred to the test position TP, . &Lt; / RTI &gt;

The connecting device 150 pushes the semiconductor device loaded in the test tray 110 at the test position TP in the test chamber 140 toward the tester TESTER coupled to the test chamber 140, Is provided for electrically connecting to a tester (TESTER).

The desolator chamber 160 is moved by the second moving device 171 or the third moving device 191 to move the heated or cooled semiconductor device loaded on the test tray 110 transferred from the test chamber 140 (As close to room temperature as possible).

The second moving device 171 classifies the semiconductor devices loaded on the test tray 110 in the unloading position (UP: UNLOADING POSITION) from the desock chamber 160 according to the test grade and moves to the sorting table 180 .

The second sensing device 172 senses whether or not the second moving device 171 is teaching the semiconductor device.

The semiconductor device from the test tray 110 is loaded on the sorting table 180 by the second moving device 171.

The third moving device 191 moves the semiconductor devices loaded on the sorting table 180 to the empty customer tray CT ₂ .

The third sensing device 192 senses whether the first moving device 191 has failed to teach the semiconductor device.

The control device CA includes a first mobile device 121, a first sensing device 122, a connecting device 140, a second mobile device 171, a second sensing device 172, (191) and the third sensing device (192). In particular, the control device CA is configured to control the first mobile device 121, the second mobile device 120, and the second mobile device 120 by information sensed by the first sensing device 122, the second sensing device 172, (171) and the third moving device (191) adjust the teaching points for holding or releasing the semiconductor element.

Next, characteristic parts of the present invention will be described in the handler 100 having the above basic configuration.

2, the mobile devices MA, 121, 171 and 191 are provided with a picking module PM, a first horizontal mover HM ₁ , a second horizontal mover HM ₂ and an elevator UD, as shown in the schematic illustration of FIG. .

The picking module PM has pickers P capable of gripping or releasing the semiconductor element. Here, the pickers P can release the gripping of the semiconductor element by holding the semiconductor element by vacuum or releasing the vacuum. The number of pickers P may be one or more, and the number of pickers P may be arbitrarily set according to the specification of the handler 100.

The first horizontal movement device HM ₁ moves the picking module PM in the first direction on the horizontal plane.

Second horizontal mover (HM ₂₎ moves the picking module (PM) in a second direction (generally orthogonal to the first direction) on the horizontal plane.

Therefore, the picking module PM moves the semiconductor device while moving according to the movement pattern determined by the first horizontal movement device HM ₁ and the second horizontal movement device HM ₂ .

For the sake of reference, either the first horizontal moving device HM ₁ or the second horizontal moving device HM ₂ may be omitted.

The elevator UD elevates and lowers the picking module PM so that the picker P can grip or release the semiconductor device.

In addition, the sensing devices SA 122, 172 and 192 include a camera CR at a downward specific position of the picking module PM moving according to a predetermined movement pattern. Then, the bottom surface of the picking module PM in a state in which the semiconductor element is held or not held by the camera CR is photographed. The camera CR is provided at a zero point position where the picking module PM temporarily stops to adjust the teaching point or to check whether the semiconductor element is poorly grasped or not, Is preferably located on the movement pattern of FIG. That is, it is preferable that the zero point position is located directly below an arbitrary position on the movement pattern of the picking module PM.

On the other hand, the control device CA compares the image photographed by the camera CR with the pre-stored image to determine whether the picking module PM is defective or not.

3 is an example of teaching points (T ₁ , T ₂ ) of the picker P for holding the semiconductor element D. 3, the teaching points T ₁ and T ₂ are preferably the center points O ₁ and O ₂ of the semiconductor elements D placed in the teaching area TA.

FIG. 4 shows an example of teaching areas TA ₁ to TA ₅ where teaching points are located in the handler 100 of FIG.

A second teaching area from the handler 100, the semiconductor element (D) is the first mobile device 121 and the customer tray (CT ₁₎ in a first teaching area (TA _1, corresponding to search the loaded position in Fig. 1) by the in (TA ₂₎ is moved to the test tray 110 in, via the soak chamber 130, testing chamber 140, and de-soak chamber 160 with the movement of the test tray 110, a third teaching area (TA ₃ , corresponding to the unloading position in Fig. 1). The semiconductor devices D are moved by the second moving device 171 from the third teaching area TA ₃ to the sorting table 180 in the fourth teaching area TA ₄ and the third moving device 191 Is moved from the sorting table 180 to the customer tray CT ₂ in the fifth teaching area TA ₅ . That is, the moving devices 121, 171, and 191 move from the teaching area TA ₁ / TA ₂ / TA ₃ / TA ₄ at the preceding stage to the teaching area TA ₂ at the rear stage on the movement path M of the semiconductor elements D / TA ₃ / TA ₄ / TA ₅ ). Wherein each teaching area _{(TA 1 / TA 2 / TA} 3 / TA 4 / TA 5) , the customer tray (CT ₁ / CT _2), the test tray 110 as a load element in a semiconductor device (D) can be loaded Or the sorting table 180 is located.

<Explanation of how the handler works - Example of teaching point adjustment>

A method of operating the handler 100 for adjusting the teaching point of the mobile devices MA during the operation of the handler 100 will be described with reference to FIG.

1. Device movement <S501>

The control device (CA) is a mobile device (MA) by operating the picking module (PM) of the front end teaching area _{(TA 1 / TA 2 / TA} 3 / TA 4) Teaching area of the rear end in (TA ₂ / TA ₃ through / TA ₄ / TA ₅ ).

2. Judging whether a certain operation time has elapsed <S502>

As the movement of the semiconductor devices D by the mobile devices MA is continuously performed, the control device CA judges whether a certain operation time has passed. Here, the reference start time of the constant operation time may be the first operation time of the handler 100 or the first operation time after the parts replacement, or may be a teaching point adjustment time point to be described later.

3. Temporary stop of picking module PM <S503>

The control device CA temporarily stops the movement of the picking module PM at a time when the picking module PM moving according to the predetermined movement pattern is located above the camera CR . At this time, the picking module PM does not hold the semiconductor element D. Of course, if the performance of the camera CR is excellent enough to temporarily stop the movement of the picking module PM, this step may be omitted.

4. Shooting <S504>

When the movement of the picking module PM is temporarily stopped, the bottom surface of the picking module PM is photographed by the camera CR.

5. Judging whether the teaching is bad or not <S505>

The control device CA compares the photographed image with the pre-stored normal image in step S504 to determine whether the teaching of the picking module PM is poor or not. The pre-stored normal image may be an image photographed in a state in which the teaching point is adjusted after assembly for production of the handler 100 or replacement of parts due to the specification change of the semiconductor element D to be tested.

For example, FIG. 6 (a) shows a pre-stored normal image I, and FIGS. 6 (b) and 6 (c) Image (I ₁ , I ₂ ). 6 (b) shows that the teaching defects do not occur in spite of the operating shock therebetween, and the exaggerated state (c) of Fig. 6 shows that the defective teaching can be caused by the operating shock have.

When the picking module PM has a plurality of pickers, this step can be made easier by comparing one of the plurality of pickers with the corresponding one on the pre-stored image.

6. Adjust the teaching point <S506>

If it is determined in step S505 that the teaching is not defective, the control device CA continuously activates the handler 100 without adjusting the teaching point.

 However, if it is determined in step S505 that the teaching is defective, the control device CA adjusts and resets the teaching points. For example, the control device CA adjusts the teaching points of the pickers P provided in the picker module PM by moving the picker module PM in the direction of the arrow as shown in FIG. 6D.

And controls the first horizontal mobile unit HM ₁ and the second horizontal mobile unit HM ₂ based on the re-set teaching points.

For reference, the above-described shooting for adjusting the teaching point may be performed every time, and in this case, step S502 may be omitted.

<Explanation of the operation method of the handler - Example of checking whether the grip is poor>

An operation method of the handler 100 for checking whether or not the semiconductor device is gripped while the handler 100 is operating will be described with reference to FIG.

1. Semiconductor device holding <S701>

The control device CA activates the mobile devices MA and grasps the semiconductor elements from the teaching areas TA ₁ / TA ₂ / TA ₃ / TA _{4 of} the preceding stage through the picking module PM.

2. Moving and stopping picking module <S702>

The control device CA temporarily stops the picking module PM after moving the picking module PM upward. Here, if the performance of the camera CR is excellent enough to temporarily stop the movement of the picking module PM, the process of stopping may be omitted.

3. Shooting <S703>

When the movement of the picking module PM is temporarily stopped, the bottom surface of the picking module PM is photographed by the camera CR.

4. Judging whether the grip is poor <S704>

The control device CA compares the photographed image with the pre-stored normal image in step S703 to determine whether the gripping of the picking module PM is poor or not.

For example, FIG. 8 (a) shows a pre-stored normal image I ', and FIG. 8 (b) shows an exaggerated image of the semiconductor element D' And an image (I ₁ ') showing a poor grip state.

6. Jam occurrence <S705>

The control device CA continuously operates the handler 100 to move the semiconductor device to the teaching area TA ₂ / TA ₃ / TA ₄ / TA ₅ in the subsequent stage, if it is determined in step S 704 that the holding device is not a holding failure.

However, if it is determined in step S704 that the gripping is poor, the control device CA generates a jam.

<Supplementary explanation of how the handler works>

1. Threshold setting

The administrator can set a threshold value for the degree of teaching point adjustment in advance.

For example, the center C 'of the pickers P on the photographed image I ₃ is allowed at the center C of the pickers P on the previously stored image I, as in FIG. 9 (a) If there is an error tolerance, it may not be necessary to adjust the teaching point immediately. Therefore, as shown in FIG. 9B, which is exaggerated, the distance between the center C 'of the pickers P and the center C of the pickers P on the previously stored image, It is also possible to set the minimum value (minimum distance or relative coordinate (x, y)) as a threshold value, and to adjust the teaching point only when the minimum value is out of the threshold value. In this case, it is possible to minimize the deterioration of the operating rate due to the frequent adjustment of the teaching point, and the above-mentioned problem of the processing of the semiconductor element held naturally can be solved.

If the threshold is set, step S505 of FIG. 5 may be replaced by determining whether or not the threshold has been exceeded.

2. Problems of semiconductor device processing in case of poor grip

The processing of the semiconductor element currently held by the picker P when it is determined that the gripping is poor may have two examples other than the generation of the jam in accordance with step S705.

First, the currently held semiconductor element can be moved to the teaching area (TA ₂ / TA ₃ / TA ₄ / TA ₅ ) at the rear end. In such a case, even when the holding is poor, it can be considered sufficiently when the semiconductor element can be moved properly within the error range. Of course, if this example is followed, the control unit CA will have to calculate up to the degree of poor gripping.

Second, the current held by the semiconductor element can be implemented so as to stop and then reverting back to the gripping point of the operation of the teaching of the front end area _{(TA 1 / TA 2 / TA} 3 / TA 4). At this time, after the manager appropriately relocates the semiconductor element D to the point of wave, the handler 100 is restarted.

For reference, examples of the above-described teaching adjustment and examples of the grip failure confirmation can be made in one handler 100.

Although the present invention has been fully described by way of example only with reference to the accompanying drawings, it is to be understood that the invention has been shown and described with reference to certain preferred embodiments thereof, It is to be understood that the scope of the invention is to be construed as being limited only by the following claims and their equivalents.

100: Handler for semiconductor device test
MA (121, 171, 191): Mobile device
PM: picking module HM ₁ : first horizontal mobile unit
HM ₂ : second horizontal mobile station
SA (122, 172, 192): sensing device
CR: Camera
150: connecting device
CA: Control device
TA: Teaching area

Claims (9)

A plurality of moving devices for moving a semiconductor element in a teaching area at a front end to a teaching area at a rear end on a movement path of the semiconductor element;
A connecting device for electrically connecting the semiconductor elements to the tester at a test position on the movement path;
At least one sensing device for sensing whether the semiconductor device is poorly taught by at least one of the plurality of mobile devices; And
A control device for controlling the plurality of mobile devices, the connection device and the at least one sensing device; Lt; / RTI &gt;
Wherein the at least one mobile device comprises:
A picking module capable of grasping or releasing holding of at least one semiconductor element and moving according to a predetermined movement pattern; And
A mobile device for moving the picking module according to the predetermined movement pattern; Lt; / RTI &gt;
Wherein the at least one sensing device is located at a specific location and includes a camera for photographing a bottom surface of the picking module above the specific location,
Wherein the control device compares an image photographed by the camera with a previously stored image to determine whether the picking module is defective or not
Handler for testing semiconductor devices. A device moving step of moving a semiconductor device to a teaching area at a rear end of a teaching area while moving the picking module according to a predetermined moving pattern by operating a moving device having a picking module for holding or releasing a semiconductor device;
A photographing step of photographing the bottom surface of the picking module when the picking module is at an arbitrary position while moving the semiconductor device in the device moving step; And
Comparing the image obtained through the photographing step with a pre-stored image to determine whether the semiconductor device is defective in teaching by the picking module; &Lt; RTI ID = 0.0 &gt;
Method of operating a handler for semiconductor device testing. 3. The method of claim 2,
An adjusting step of adjusting a teaching point of a semiconductor element by the picking module if it is determined that teaching is failed in the determining step; &Lt; RTI ID = 0.0 &gt;
Method of operating a handler for semiconductor device testing. 3. The method of claim 2,
When the picking module has a plurality of pickers capable of gripping or releasing the semiconductor element,
Wherein the determining step is performed by comparing an image of one of the plurality of pickers and the semiconductor element held by the reference picker with the pre-stored image
Method of operating a handler for semiconductor device testing. A plurality of moving devices for moving a semiconductor element in a teaching area at a front end to a teaching area at a rear end on a movement path of the semiconductor element;
A connecting device for electrically connecting the semiconductor elements to the tester at a test position on the movement path;
At least one sensing device for sensing whether the semiconductor device is poorly gripped by at least one of the plurality of mobile devices; And
A control device for controlling the plurality of mobile devices, the connection device and the at least one sensing device; Lt; / RTI &gt;
Wherein the at least one mobile device comprises:
A picking module capable of grasping or releasing holding of at least one semiconductor element and moving according to a predetermined movement pattern; And
A mobile device for moving the picking module according to the predetermined movement pattern; Lt; / RTI &gt;
Wherein the at least one sensing device is located at a specific location and includes a camera for photographing a bottom surface of the picking module above the specific location while holding the semiconductor device,
Wherein the control device compares an image photographed by the camera with a pre-stored image to determine whether the gripping of the picking module is poor or not
Handler for testing semiconductor devices. 6. The method according to claim 1 or 5,
Wherein the specific position is a position directly under the position where the picking module that moves along the predetermined movement pattern temporarily stops
Handler for testing semiconductor devices. A device holding step of operating a moving device having a picking module for holding or releasing a semiconductor element to grip a semiconductor element in a teaching area at a front end with the picking module;
A photographing step of photographing a bottom surface of the picking module when the picking module holding the semiconductor device is in an arbitrary position while moving the semiconductor device in the device holding step; And
Comparing the image obtained through the photographing step with a previously stored image to determine whether the semiconductor device is poorly gripped by the picking module; &Lt; RTI ID = 0.0 &gt;
Method of operating a handler for semiconductor device testing. 8. The method of claim 7,
A jam generating step of generating a jam if it is judged in the judging step that gripping is poor; &Lt; RTI ID = 0.0 &gt;
Method of operating a handler for semiconductor device testing. 8. The method according to claim 2 or 7,
Characterized in that the photographing step is performed after temporarily stopping the picking module moving on the predetermined movement pattern at an arbitrary position on the predetermined movement pattern
Method of operating a handler for semiconductor device testing.

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