KR20160122054A - Laser soldering device - Google Patents

Laser soldering device Download PDF

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Publication number
KR20160122054A
KR20160122054A KR1020160013114A KR20160013114A KR20160122054A KR 20160122054 A KR20160122054 A KR 20160122054A KR 1020160013114 A KR1020160013114 A KR 1020160013114A KR 20160013114 A KR20160013114 A KR 20160013114A KR 20160122054 A KR20160122054 A KR 20160122054A
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KR
South Korea
Prior art keywords
laser
laser light
light source
resin
output power
Prior art date
Application number
KR1020160013114A
Other languages
Korean (ko)
Inventor
야수노리 코야마
Original Assignee
리콴-윌 씨오.,엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015219032A external-priority patent/JP6719191B2/en
Application filed by 리콴-윌 씨오.,엘티디 filed Critical 리콴-윌 씨오.,엘티디
Publication of KR20160122054A publication Critical patent/KR20160122054A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention eliminates the need for a visible light source for identifying the laser irradiation point, suppresses the output power to low power, and provides a simpler laser bonding apparatus.
Characterized in that the laser light source is a blue laser diode, the laser light source is a laser light source, and the laser light source has a wavelength of 350 to 550 nm and the output power of the laser light source is lower than a predetermined value. And the wavelength of the light is 430 nm to 460 nm.

Figure P1020160013114

Description

[0001] LASER SOLDERING DEVICE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a laser bonding apparatus for melting a material with laser light to perform bonding.

2. Description of the Related Art Conventionally, a laser soldering apparatus for performing soldering by melting a material with a laser beam, for example, has been proposed. For example, Patent Document 1 proposes a reflow soldering method of coated fine wires by laser. Patent Document 1 discloses the use of a laser of a different wavelength for laser irradiation for the purpose of removing a covering material and laser irradiation for reflow soldering. Specifically, a wavelength of 532 nm is used as a laser for the purpose of removing the covering material, and a wavelength of 1064 nm is used as a laser for reflow soldering.

Japanese Patent Application Laid-Open No. 2001-47222

However, in the conventional laser for the purpose of reflow soldering (including soldering), a wavelength of 800 nm to 1100 nm is used, and since it is not visible light, it is necessary to separately provide a visible light source for confirming the laser irradiation point, There is a problem that the size of the apparatus is increased because the necessary infrared light laser must be used.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a more simple laser bonding apparatus which does not require a visible light source for confirming a laser irradiation point and suppresses output power to a low power .

The laser bonding apparatus according to claim 1 is characterized in that it has a laser light source for emitting laser light, and the output power of the laser light source is lower than a predetermined value with visible light having a wavelength of 350 to 550 nm.

The laser bonding apparatus according to claim 2 is characterized in that the laser light source is a blue laser diode and the wavelength of the laser light is 430 nm to 460 nm.

The laser bonding apparatus according to claim 3 is characterized in that the output power of the laser light source is 5 W or less.

The laser bonding apparatus according to claim 4 is characterized by optimizing the output power of the laser light source and / or the spot diameter at the irradiation point of the laser light according to the degree of adhesion through control of the laser light source.

The laser bonding apparatus described in claim 5 is provided with an infrared thermometer for measuring the temperature of the irradiation point of the laser light and controls the output power of the laser light source and / or the spot diameter at the irradiation point of the laser light, .

The laser bonding apparatus according to claim 6 is characterized by being a laser soldering apparatus for performing soldering by laser light.

The laser bonding apparatus according to claim 7 is characterized in that the object is to melt a resin with laser light and to bond an object through the melted resin.

The laser bonding apparatus according to claim 8 is characterized in that it is intended to dissolve a resin located in front of a light-transmitting material by laser light transmitted through the light-transmitting material and to adhere the light-transmitting material to the resin through the melted resin.

According to the present invention, it is possible to provide a laser light source that emits a laser beam and is capable of emitting visible light with a laser light wavelength of 350 to 550 nm, a low power having a laser light source output of a predetermined value or less, And further suppresses the output power to low power, which is simpler.

1 is a configuration diagram showing an example of the configuration of a laser bonding apparatus according to the present invention.
2 is an explanatory diagram showing an example of use of the laser bonding apparatus.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a configuration diagram showing an example of the configuration of a laser bonding apparatus according to the present invention. 2 is an explanatory diagram showing an example of use of the laser bonding apparatus.

The laser bonding apparatus 1 is a device for melting a material with laser light to perform bonding, and may be, for example, a laser soldering apparatus for performing soldering or an apparatus for melting a resin to perform adhesion. The laser bonding apparatus 1 comprises an apparatus main body 10, an optical system such as a laser diode 30 as a laser light source, a lens 32, an infrared thermometer 40, and the like. The apparatus main body 10 has a microcomputer 12 therein and controls the entire laser bonding apparatus 1 by the microcomputer 12. [ On the other hand, as a method of controlling the entire laser adhesive apparatus 1, there is no need to necessarily use the microcomputer 12, and a method of controlling only by hardware without software, As shown in Fig. The microcomputer 12 can also be connected to a keyboard or other device for inputting various external values through the RS232c connector 12a or the external interface connector 12b.

Next, the apparatus main body 10 will be described in detail. First, the microcomputer 12 is connected to a DA converter 14 which outputs an analog level by a command from the microcomputer 12. [ The DA converter 14 is a current setting (LD current setting) for driving the laser diode 30 to be described later while controlling the output power. The DA converter 14 is connected to the laser diode 30 through the current buffer 16. The laser diode 30 is provided with an AD converter 24 for detecting the laser current so as to detect the laser current of the laser diode 30 and feed back to the control.

The laser diode 30 has visible light with a wavelength of 350 nm to 550 nm as the laser light and a low power whose output power is lower than a predetermined value. For example, when the laser bonding apparatus 1 is used in the laser bonding apparatus, the reflectivity of the metal such as tin or copper, which is the main component of the solder, is about 50%, so that the reflectivity is low, The conversion efficiency is increased and the solder can be efficiently dissolved. On the other hand, more specifically, the laser diode 30 is a blue laser diode, and the wavelength of the laser beam is preferably 430 nm to 460 nm. On the other hand, regardless of whether or not the laser diode 30 to be described later is controlled, it is possible to use the laser diode 30 having an output power of 5 W or less.

The optical system for irradiating laser light to the irradiation point P has lenses 32 and 36. [ On the other hand, the beam splitter 34 is provided in the optical path of the laser beam, and has a structure in which reflected light of 1/100 or less of the transmitted light is sent to the photodiode 42. The photodiode 42 is connected to the AD converter 22 for laser power detection of the apparatus main body 10 and the detected laser power is sent to the microcomputer 12. [

Further, the microcomputer 12 as the control means may consider the laser current and the laser power of the detected laser light, or may calculate various values set in the microcomputer 12 (for example, various materials necessary for adhesion such as solder and resin material, The output power of the laser light source and / or the spot diameter at the irradiation point P of the laser light may be optimized according to the degree of adhesion by controlling the laser light source. Thus, optimum adhesion can be achieved while suppressing the output power of the laser light source.

An infrared thermometer 40 for specifying the temperature of the irradiation point P of the laser beam is provided so that the temperature data detected by the infrared thermometer 40 is supplied to the AD converter 20 to the microcomputer 12 via the network. The microcomputer 12 may optimize the output power of the laser light source and / or the spot diameter at the irradiation point P of the laser light in accordance with the degree of adhesion in consideration of the detected temperature data. Thus, optimum adhesion can be achieved while suppressing the output power of the laser light source.

According to the laser bonding apparatus 1 configured as described above, the visible light having a wavelength of 350 nm to 550 nm is used as the laser light, the output power of the laser light source is low power below a predetermined value, a visible light source for confirming the laser irradiation point is unnecessary , And further suppresses the output power to low power and is simpler. More specifically, by optimizing the height of the heat conversion rate and the spot diameter of the irradiation point P, adhesion with laser power of 1/10 can be achieved as compared with the conventional product using a laser of 30W to 100W. Further, since a low-power laser is used, the heat dissipation mechanism can be simplified, and the power source capacity can be reduced. Therefore, it is possible to reduce the size of the apparatus and can be expected to be applied to places where adhesion is difficult.

On the other hand, the laser bonding apparatus 1 is an example of a laser soldering apparatus. As another example, the laser bonding apparatus 1 may be used as an apparatus for melting a resin with laser light and bonding an object through a melted resin.

Specific examples of the apparatus for melting the resin with the laser light and adhering the object through the melted resin include a method in which the resin located in front of the light-transmitting material is melted by the laser light transmitted through the light-transmitting material, May be used as a device for adhering to a resin. More specifically, as shown in Fig. 2, it is possible to use a lens, which is a light-transmitting material, to adhere to the lens frame 52. Fig. The lens 50 is made of glass or a light transmissive resin and is provided with a laser light output section 38 (optical type from the lens 32 to the lens 36 provided on the outside of the apparatus main body 10 having the configuration of Fig. 1) And transmits the output laser light L. The laser light L transmitted through the lens 50 melts the adhesive portion 52a of the lens frame 52 made of resin melting by the laser light L contacting the lens 50, The lens 50 can be adhered to the lens frame 52. As described above, in the laser bonding apparatus 1 of the present embodiment, adhesion in a narrow area behind the lens 50 is also possible.

On the other hand, the resin on the melting side by the laser light L is preferably a light absorbing resin, and among these, a thermoplastic resin is preferable, and examples thereof include polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyester, methacryl, Polycarbonate, acrylic, and the like. When the absorbability of the laser light L is poor, it is also possible to increase the absorption by adding a pigment to the resin.

INDUSTRIAL APPLICABILITY As described above, according to the present invention, a visible light source for identifying the laser irradiation point is unnecessary, and the output power is suppressed to a low power, and a simpler laser bonding apparatus can be provided.

1 laser bonding device
10 Device body
12 microcomputer
12a RS232c connector
12b External interface connector
14 converter
16 current buffer
20 AD converters
22 AD converter
24 AD converters
30 laser diode
32 lens
34 beam splitter
36 lens
38 laser light output section
40 Infrared thermometer
42 photodiodes
50 lens
52 Lens frame
52a adhesive portion

Claims (8)

A laser bonding apparatus for melting a material by a laser beam to perform bonding,
And a laser light source for emitting the laser light,
The visible light having a wavelength of 350 nm to 550 nm is used as the laser light,
Wherein an output power of the laser light source is a low power equal to or less than a predetermined value. The method according to claim 1,
Wherein the laser light source is a blue laser diode, and the wavelength of the laser light is 430 nm to 460 nm. 3. The method according to claim 1 or 2,
Wherein an output power of the laser light source is 5 W or less. 4. The method according to any one of claims 1 to 3,
Wherein the output power of the laser light source and / or the spot diameter at the irradiation point of the laser light are optimized according to the degree of adhesion through control of the laser light source. 5. The method according to any one of claims 1 to 4,
And an infrared thermometer for measuring the temperature of the irradiation point of the laser light,
Wherein the output power of the laser light source and / or the spot diameter at the irradiation point of the laser light is controlled by the temperature of the irradiation position. 6. The method according to any one of claims 1 to 5,
Wherein said laser welding apparatus is a laser soldering apparatus for performing soldering by laser light. 6. The method according to any one of claims 1 to 5,
Characterized in that the object is to melt the resin by laser light and to bond the object through the melted resin. 6. The method according to any one of claims 1 to 5,
Permeable material to the resin by dissolving the resin positioned in front of the light-transmitting material with laser light transmitted through the light-transmitting material, and bonding the light-transparent material to the resin through the melted resin.
KR1020160013114A 2015-04-13 2016-02-02 Laser soldering device KR20160122054A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2015-081885 2015-04-13
JP2015081885 2015-04-13
JPJP-P-2015-219032 2015-11-09
JP2015219032A JP6719191B2 (en) 2015-04-13 2015-11-09 Laser bonding machine

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106735893B (en) * 2016-11-29 2019-08-13 大族激光科技产业集团股份有限公司 A method of realizing that laser micro welding connects

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001047222A (en) 1999-08-16 2001-02-20 Nippon Avionics Co Ltd Reflow soldering method for coated thin wire by laser beam

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001047222A (en) 1999-08-16 2001-02-20 Nippon Avionics Co Ltd Reflow soldering method for coated thin wire by laser beam

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106735893B (en) * 2016-11-29 2019-08-13 大族激光科技产业集团股份有限公司 A method of realizing that laser micro welding connects

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