KR20160119905A - Substrate Processing Apparatus and Inspection Method of Magnet Assembly - Google Patents

Substrate Processing Apparatus and Inspection Method of Magnet Assembly Download PDF

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KR20160119905A
KR20160119905A KR1020150048345A KR20150048345A KR20160119905A KR 20160119905 A KR20160119905 A KR 20160119905A KR 1020150048345 A KR1020150048345 A KR 1020150048345A KR 20150048345 A KR20150048345 A KR 20150048345A KR 20160119905 A KR20160119905 A KR 20160119905A
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South Korea
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cooling water
magnet assembly
pressure
gas
pipe
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KR1020150048345A
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Korean (ko)
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KR102007867B1 (en
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서문선
김준호
이재승
신동열
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에이피시스템 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
    • H01L21/203—

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to a method for inspecting an assembling state of a magnet assembly connected to a cooling water processor of a substrate processing apparatus. The method for inspecting an assembling state of a magnet assembly comprises the processes of: assembling the magnet assembly; supplying gas to an inner part of the magnet assembly; and monitoring inner pressure of the magnet assembly, thereby easily inspecting abnormality inside the magnet assembly after assembling the magnet assembly.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a magnet assembly assembly,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of checking the assembled state of a magnet assembly and a substrate processing apparatus, and more particularly to a method of checking a state of assemblies of a magnet assembly, .

The formation of a thin film, particularly, a metal layer in a manufacturing process of a semiconductor device can be performed by a physical vapor deposition (PVD) method such as a sputter and a chemical vapor deposition (CVD) .

In the sputtering method, a high heat is generated in the target by the collision of ions on the target surface during the deposition process. Therefore, in the thin film forming step using the sputtering method, a cooling facility for target cooling is required. Such a cooling facility is an indispensable facility for the stable operation of the sputter evaporator. Generally, a cooling facility uses cooling water, which is called cooling water, as a refrigerant to circulate in a magnet assembly at the rear side of the target to cool the target.

If the target is used for a long time, the target may be abraded by ions. Therefore, when the deposition process is carried out according to the sputtering method, the used target must be replaced with a new target. At this time, the cooling water supplied to the magnet assembly may leak to the outside due to a problem that the new target and the magnet assembly are poorly coupled or the O-ring on the coupling surface is damaged. Accordingly, the cooling water may flow into the chamber or the bottom of the clean room to contaminate or damage the equipment.

Conventionally, after replacing the target, cooling water is supplied to the magnet assembly to visually confirm whether or not the cooling water flows out. However, in the case of visually confirming whether or not the cooling water is leaked, the operator may have a detection error, and there is a limit to accurately determine whether or not the cooling water is leaked. Also, if leakage of cooling water is confirmed, there is a risk of safety accidents and equipment damage due to leaked cooling water.

When the leakage of cooling water is confirmed, the cooling water in the magnet assembly is discharged to the outside, and the chamber or the clean room in which the cooling water is introduced is cleaned, and then the magnet assembly is repaired or replaced. Therefore, the process of resolving the leakage of the cooling water after confirming the leakage of the cooling water is complicated and the working time may become very long. Thus, the efficiency of the work may be lowered.

KR 2001-0096337 A

The present invention provides a magnet assembly assembly state checking method and a substrate processing apparatus which can easily check whether a magnet assembly is assembled in good or bad state.

The present invention provides a magnet assembly assembly state checking method and a substrate processing apparatus capable of improving the efficiency of operation.

The present invention relates to a method for checking the assembled state of a magnet assembly connected to a cooling water processor of a substrate processing apparatus, comprising the steps of assembling the magnet assembly, supplying gas into the magnet assembly, and monitoring the pressure inside the magnet assembly .

The process of supplying gas into the magnet assembly includes:

And maintaining the pressure inside the magnet assembly equal to or greater than the cooling water supply pressure of the cooling water processor.

The method comprising the steps of: maintaining a pressure inside the magnet assembly equal to or greater than a cooling water supply pressure of the cooling water processor; and monitoring a pressure inside the magnet assembly,

The supply path of the cooling water supplied to the magnet assembly is switched and connected to the recovery path of the cooling water connected to the discharge path of the gas supplied into the magnet assembly.

In the process of supplying gas into the magnet assembly,

The gas supply pressure is equal to or greater than the cooling water supply pressure of the cooling water processor.

The process of monitoring the pressure inside the magnet assembly includes:

Measuring the pressure inside the magnet assembly while bypassing the cooling water of the cooling water processor; and determining whether the internal pressure of the magnet assembly is abnormal.

Wherein the step of determining whether the pressure inside the magnet assembly is abnormal includes the steps of:

Comparing the measured pressure value with a predetermined set value, and generating an abnormal signal if the measured pressure value is less than the set value.

The set value is 85 to 95% of the pressure value of the cooling water.

Comparing the measured pressure value with the set value,

And reassembling the magnet assembly if the measured pressure value is less than the preset value.

After the magnet assembly is reassembled,

A process of supplying gas into the magnet assembly, and a process of monitoring the pressure inside the magnet assembly are repeated.

A magnet assembly for generating magnetic force is disposed on one side of the target. The magnet assembly includes a chamber having an inner space, a substrate support for supporting the substrate in the inner space, a target disposed opposite to the substrate support, A cooling water pipe forming a path through which the cooling water moves, one end connected to the magnet assembly and the other end connected to the cooling water processor, and a cooling water pipe communicating with the cooling water pipe to supply gas into the magnet assembly And a pressure gauge installed in the magnet assembly or the cooling water pipe to monitor the pressure inside the magnet assembly to check the assembly state of the magnet assembly.

Wherein the cooling water pipe includes a cooling water supply pipe forming a movement path of the cooling water supplied from the cooling water processor to the magnet assembly and a cooling water recovery pipe forming a movement path of the cooling water recovered from the magnet assembly to the cooling water processor,

Further comprising a path diverter connected to the cooling water supply pipe so as to bypass a movement path of the cooling water supplied to the magnet assembly, and a cooling water drain pipe having one end connected to the path diverter and the other end connected to the cooling water recovery pipe,

The path diverter bypasses the cooling water and monitors the pressure inside the magnet assembly.

The gas is circulated through the magnet assembly, is discharged through the cooling water recovery pipe,

The gas supplier supplies gas at a pressure equal to or greater than the cooling water supply pressure of the cooling water processor.

Further comprising a cooling water check valve disposed between the connection portion of the cooling water recovery pipe and the cooling water pipe and between the magnet assembly,

The pressure gauge is disposed in a cooling water movement path between the gas feeder and the cooling water check valve.

The cooling water processor further includes a gas exhaust unit connected to the cooling water recovery pipe to discharge gas supplied to the magnet assembly to the outside.

Further comprising a controller connected to the pressure gauge to determine whether the pressure inside the magnet assembly is abnormal,

The controller includes a transceiver for transmitting and receiving signals to and from the pressure gauge, a determination unit for comparing a pressure value transmitted to the transceiver unit with a predetermined set value, and a control unit connected to the determination unit, And a notification unit for generating an abnormal signal.

According to the embodiments of the present invention, it is possible to confirm whether or not the assembled state of the magnet assembly is defective before supplying the cooling water. Therefore, it is possible to prevent a safety accident caused by leakage of cooling water, contamination and damage of equipment.

In addition, since cooling water is not supplied to the inside of the magnet assembly, cooling water in the magnet assembly may not be discharged, or a chamber or a clean room may be not cleaned. Thus, the work can be simplified, the work time can be shortened, and the efficiency of the work can be improved.

In addition, since it is confirmed whether or not the assembled state of the magnet assembly is defective by using the numerical data, accurate and thorough diagnosis can be made. Then, it is possible to automatically check whether the magnet assembly is assembled or not by using the measuring device, and the efficiency of the work can be improved.

1 is a structural view showing a substrate processing apparatus according to an embodiment of the present invention;
2 is a view showing a connection relationship between a magnet assembly and a cooling water processor according to an embodiment of the present invention;
3 is a view showing a movement path of cooling water and gas according to an embodiment of the present invention.
4 is a flowchart illustrating a method of checking the assembly state of a magnet assembly according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. To illustrate the invention in detail, the drawings may be exaggerated and the same reference numbers refer to the same elements in the figures.

FIG. 1 is a structural view illustrating a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a view showing a connection relationship between a magnet assembly and a cooling water processor according to an embodiment of the present invention. FIG. 4 is a flowchart showing a method of checking the assembly state of a magnet assembly according to an embodiment of the present invention. Referring to FIG.

Referring to FIGS. 1 and 2, a substrate processing apparatus according to an embodiment of the present invention includes a chamber 100 having an internal space, a substrate support 200 for supporting a substrate S in the internal space, A magnet assembly 500 disposed at one side of the target 400 to generate a magnetic force and a cooling water processor 500 for supplying or recovering cooling water to the magnet assembly 500. [ A cooling water pipe 720 and 730 having one end connected to the magnet assembly 500 and the other end connected to the cooling water processor 710; A gas supplier 740 communicating with the cooling water pipes 720 and 730 to supply the magnet assembly 500 with the magnet assembly 500 and monitoring the pressure inside the magnet assembly 500 to check the assembled state of the magnet assembly 500, And a pressure gauge 800 installed in the assembly 500 or the cooling water pipes 720 and 730. In addition, the substrate processing apparatus may include a vacuum generator 300, a driver 600, a path switcher 750, a cooling water pipe 770, and a controller 900.

The chamber 100 includes a main body having an open top, and a plate 410, which will be described later, is installed on the top of the main body to be openable and closable. When the plate 410 is coupled to the upper portion of the main body to close the main body, an internal space in which the sputtering process is performed on the substrate S such as a deposition process is formed in the chamber 100. A through hole is formed in the bottom surface of the chamber 100 to receive a shaft 220 of the substrate support 200, which will be described later. On the side wall of the chamber 100, a gate valve (not shown) is formed for carrying the substrate S into the chamber 100 or taking it out.

The vacuum generator 300 is connected to the chamber 100 to form an internal space of the chamber 100 in a vacuum atmosphere. The vacuum generator 300 includes an exhaust pipe 320 forming a path for gas flow and a vacuum pump 310 disposed outside the chamber 100 and sucking gas in the space inside the chamber 100. An exhaust port for exhausting gas existing in the inner space is formed at a predetermined position of the chamber 100, and the exhaust port is connected to the vacuum pump 310 through an exhaust pipe 320.

The substrate support 200 serves to support the substrate S within the chamber 100. The substrate support 200 includes a support 210 and a shaft 220. The support portion 210 is formed in a disk shape in the horizontal direction inside the chamber 100 and the shaft 220 is connected to the bottom surface of the support portion 210 in a vertical direction. The shaft 220 is connected to a power unit (not shown) such as a motor outside the through hole to lift the support unit 210. At this time, the gap between the shaft 220 and the through hole is sealed by using the bellows 230 or the like to prevent the vacuum in the chamber 100 from being released in the process of depositing the thin film. A heater (not shown) or a channel for cooling water may be provided on the lower side or the inside of the support part 210 to heat or cool the substrate S to a predetermined process temperature.

The target assembly includes a target 400 and a plate 410 for attaching and supporting the rear surface of the target 400. The target assembly deposits the film through thin film deposition by sputtering on a substrate S that rests on the support 210. The target 400 is made of a metal film to be laminated on the substrate S and may be formed in a circular shape or in various shapes. The plate 410 is a plate to which the target 400 is attached and the front surface of the target 400 is directed to the substrate S and the rear surface of the target 400 is attached to the plate 410. When the target 400 is to be replaced, it can be removed from the plate 410 and replaced.

The thin film deposition by the sputtering method is a technique in which a substrate for forming a thin film in a reaction chamber is prepared and a gas molecule or atom in a plasma state is shot on a target such as a metal such as a material of a thin film to be formed, And is deposited on the wafer to form a thin film. That is, when sputtering is performed by applying a high voltage to a target material in an inert gas atmosphere of 10 -2 or 10 -3 Tr (torr), the ionized inert gas collides with the target, and the target material, which receives the momentum, A kind of physical vapor deposition technique that is released and adheres to the substrate.

A direct current (DC) bias voltage is applied to the plate 410 and applied to the target 400 and a ground voltage is applied to the substrate support 210 and the chamber 100 wall. Therefore, the plate 410 to which the DC voltage is applied and the wall of the chamber 100 to be grounded are insulated, and thus the insulator 110 is provided between the plate 410 and the wall of the chamber 100.

The magnet assembly 500 serves to generate a magnetic force. The magnet assembly 500 includes a case 510 having an inner space and a magnet unit 520 accommodated in the case 510. [ At this time, the case 510 can open / close the upper portion of the chamber 100 by driving a hinge (not shown) provided at one side.

In the case 510, a cooling space for circulating cooling water surrounding the outside of the magnet unit 520 is formed. That is, a cooling space is formed inside the case 510 by the upper surface, the side wall, and the plate 410 of the case 510. The lower portion of the case 510 is sealed by the plate 410 to which the target 400 is attached. For example, the case 510 and the plate 410 are coupled with several bolts, and an O-ring (not shown) may be inserted between the joints to prevent leakage of the cooling water. When separating the plate 410 from the case 510 for replacement of the target 400, the plate 410 can be separated from the case 510 by releasing the bolt connection.

In addition, two cooling water circulation passages are formed in the case 510, and an inlet end through which the cooling water flows into the upper surface and a discharge end through which the cooling water is discharged are provided. However, the structure of the case 510 is not limited to this, and may vary.

The magnet unit 520 is composed of a magnetron and a magnet exposed in a cooling space of the case 510. The magnet unit 520 is disposed behind the target 400 and spaced apart from the plate 410. The magnet unit 520 can generate a magnetic field to further enhance the plasma density near the surface of the target 400. [

The driver 600 includes a motor 610 for providing rotational force and a rotation axis 650 connected to the motor 610. The rotating shaft 650 is connected to the magnet unit 520 so that the magnet unit 520 can be rotated by a rotational force provided by the motor 610. For example, the motor 610 and the rotation axis 650 may be on a straight line or may not be on a straight line. When the motor 610 and the rotating shaft 650 are not located on a straight line, the pulley 620, the belt 630, and the housing 640 may be provided to transmit the rotational force of the motor 610 to the rotating shaft 650 have. That is, when the rotational force of the motor 610 is transmitted to the belt 630 using the pulley 620, the housing 640 wound around the belt 630 may be rotated to rotate the rotational shaft 650. However, the method of rotating the magnet unit 520 is not limited to this and may vary.

The cooling water processor 710 functions to supply and recover the cooling water to the inner space of the case 510. And supplies the cooled cooling water to the case 510 and functions to cool the cooling water recovered in the case 510. Accordingly, the cooling water processor 710 has a supply end for supplying the cooling water to the case 510 and a rotation means for recovering the cooling water from the case 510.

The cooling water pipes 720 and 730 include a cooling water supply pipe 720 that forms a path for the cooling water to be supplied to the magnet assembly 500 from the cooling water processor 710, And a cooling water recovery pipe 730 that forms a movement path of the cooling water recovered by the cooling water recovery pipe 730.

The cooling water supply pipe 720 has one end connected to the inlet end of the case 510 and the other end connected to the supply end of the cooling water processor 710 to transfer the cooling water supplied from the cooling water processor 710 to the case 510 . The cooling water supply pipe 720 includes a first supply pipe 722 connecting the first valve hole 721 of the switching valve 752 and a second valve hole 752 of the switching valve 752 and the case 510, And a second supply pipe 721 connecting the inlet ends of the first and second supply pipes 711 and 712. Therefore, the inlet end of the case 510 and the supply end of the cooling water processor 710 are connected to the first and second supply pipes 721 and are selectively turned on / off by the path switcher 750.

The cooling water return pipe 730 is connected to the discharge end of the case 510 and the rotating means of the cooling water processor 710 to transfer the cooling water heated and cooled in the case 510 to the cooling water processor 710. The cooling water return pipe 730 includes a first return pipe 732 for connecting the magnet assembly 500 and a cooling water pipe 770 to be described later and a second return pipe 732 for connecting the cooling water pipe 770 and the cooling water processor 710, And a return pipe 733. However, various cooling liquids other than the cooling water can be used.

The gas supplier 740 communicates with the cooling water supply pipe 720 to selectively supply the gas to the case 510 of the magnet assembly 500. The gas supply unit 740 includes a gas supply pipe 743, a flow rate control unit 741, and a gas inflow check valve 742. The gas supply pipe 743 is connected to the second supply pipe 721 between the inlet end of the case 510 and the second valve hole 752 of the switching valve 752. Therefore, when the gas is supplied to the gas inlet pipe 743, the gas is supplied into the case 510 through the second supply pipe 721. [ At this time, the second valve hole 752 of the switching valve 752 is shut off so that gas does not flow to the path switcher 750. Air can be used as a gas. However, the present invention is not limited thereto, and various inert gases such as argon gas may be used.

The flow rate control unit 741 controls the inflow amount of the gas supplied to the gas supply pipe 743. [ The gas inflow check valve 742 serves to prevent gas from flowing back to the flow rate control unit 741 from the gas supply pipe 743. In addition, when the cooling water moves to the cooling water supply pipe 720, the gas inflow check valve 742 prevents the cooling water from flowing back to the flow rate control unit 741.

Thus, when the gas supplier 740 supplies gas into the magnet assembly 500, the gas is supplied into the case 510 through the second supply pipe 721, and then flows through the cooling water return pipe 730 to the cooling water processor 710). At this time, the cooling water processor 710 may further include a gas discharge unit (not shown) for discharging the gas supplied to the magnet assembly 500 to the outside. The gas supplied from the gas supplier 740 is supplied to the case 510 through the cooling water supply pipe 720 and then the gas recovered in the case 510 is supplied to the cooling water processor 710 through the cooling water return pipe 730, .

The path switcher 750 may switch the supply path of the cooling water supplied to the case 510 of the magnet assembly 500 to the recovery path of the cooling water. In other words, the path changer 750 can bypass the path of the cooling water supplied to the magnet assembly 500. Thus, the path switching unit 750 switches the discharge path of the cooling water according to the operation.

3 (a), the cooling water supplied from the cooling water processor 710 is normally supplied to the case 510 through the cooling water supply pipe 720, and when the cooling water is supplied to the case 510, The cooling water recovered in the case 510 is normally recovered to the cooling water processor 710 through the cooling water recovery pipe 730. 3 (b), when the cooling water supply to the case 510 is stopped, the cooling water supply pipe 720 is connected to the cooling water return pipe 730 to convert the cooling water. At this time, gas is supplied to the case 510 through the gas supplier 740, and the cooling water remaining in the case 510 is pushed out to the cooling water return pipe 730 and discharged to the cooling water processor 710. The path changer 750 also bypasses the cooling water when monitoring the pressure inside the magnet assembly 500 through the pressure gauge 800. [

One end of the cooling water pipe 770 is connected to the path changer 750 and the other end is connected to the cooling water return pipe 730. More precisely, one end of the cooling water pipe 770 is connected to the third valve hole 753 of the path changer 750. The cooling water pipe 770 forms a path of the cooling water bypassed by the path changer 750. The cooling water supplied from the cooling water supply pipe 720 is changed in path by the path switching device 750 and is supplied to the cooling water pipe 770 through the cooling water pipe 770. In this case, And moves to the recovery pipe 730.

The path changer 750 may be a 3-way valve having three valve holes. That is, the path changer 750 includes a first valve hole 721 connected to the first supply pipe 722 contacting the supply end of the cooling water processor 710, a second supply pipe 721 contacting the inlet end of the case 510 And a third valve hole 753 connected to the cooling water pipe 770. The second valve hole 752 is connected to the cooling water pipe 770, Accordingly, the switching valve 752 can selectively change the movement path of the cooling water according to the operation.

For example, when the cooling water is supplied to the case 510, a first valve passage connecting the supply end of the cooling water processor 710 and the inlet end of the case 510 is formed. The first supply pipe 722 connected to the first valve hole 721 and the second supply pipe 721 connected to the second valve hole 752 are passed through each other in the path switcher 750. A second valve passage directly connecting the feed end of the cooling water processor 710 and the rotating means of the cooling water processor 710 is formed. A first supply pipe 722 connected to the first valve hole 721 and a cooling water pipe 770 connected to the third valve hole 753 are passed through the path switcher 750.

At this time, the gas supplier 740 supplies gas at a pressure equal to or greater than the cooling water supply pressure of the cooling water processor 710. Accordingly, the gas supplied into the magnet assembly 500 prevents the cooling water, which flows to the cooling water return pipe 730 through the cooling water pipe 770, from flowing back to the magnet assembly 500 side. Further, the gas makes the internal pressure of the magnet assembly 500 equal to or higher than the supply pressure of the cooling water. Thus, when the cooling water is bypassed, the pressure inside the magnet assembly 500 becomes equal to or similar to the cooling water supply pressure of the cooling water processor 710.

That is, since the pressure of the gas supplied from the gas supplier 740 is electrically coupled to the cooling water check valve 760, the gas is supplied at a pressure equal to or higher than the cooling water supply pressure of the cooling water processor 710 in the gas supplier 740, The pressure inside the assembly 500 can be easily adjusted to be equal to or similar to the cooling water supply pressure of the cooling water processor 710. Further, since the pressure inside the magnet assembly 500 becomes equal to or similar to the supply pressure of the cooling water, the pressure inside the magnet assembly 500 becomes equal to or similar to the pressure when the actual cooling water is supplied. In general, the leakage in the confined space depends on the pressure. Therefore, it is possible to confirm whether leakage has occurred in the actual pressure condition because it is confirmed whether leakage occurs in the magnet assembly 500 under the pressure supply condition of the actual cooling water.

On the other hand, the pressure at which the gas supply unit 740 supplies the gas should be not more than twice the pressure at which the cooling water is supplied. If the pressure of the gas supplied by the gas supplier 740 is too high, the gas may circulate inside the magnet assembly 500 and damage the inside of the magnet assembly 500. Therefore, the gas must be supplied at a pressure at which the magnet assembly 500 is not damaged.

The cooling water check valve 760 is provided in the cooling water return pipe 730 and serves to move the cooling water or gas in the cooling water return pipe 730 only from the magnet assembly 500 to the cooling water processor 710 side. The cooling water check valve 760 is installed between the connection point of the cooling water pipe 770 and the cooling water return pipe and the discharge end of the case 510 of the magnet assembly 500. That is, the cooling water check valve 760 is installed in the first return pipe 732. Therefore, the cooling water check valve can prevent the cooling water, which moves directly from the supply end of the cooling water processor 710 to the rotating means of the cooling water processor 710, to flow back to the case 510 side.

In addition, the cooling water check valve 760 can keep the pressure in the magnet assembly 500 or the first return pipe 732 constant. That is, when the cooling water in the cooling water processor 710 is bypassed, a pressure equal to or similar to the cooling water supply pressure is formed at the connection portion between the cooling water pipe 770 and the cooling water return pipe 730. Accordingly, when the gas is supplied into the magnet assembly 500 and the pressure rises above the cooling water supply pressure, some of the gas moves through the cooling water check valve 760 to the cooling water processor 710 side. At this time, because of the pressure formed on the side of the cooling water processor 710 (the rear end of the check valve), the cooling water check valve 760 is operated only when the excess pressure inside the magnet assembly 500 is lowered to become the same or similar to the cooling water supply pressure Allow movement. Accordingly, the pressure inside the magnet assembly 500 becomes equal to or similar to the cooling water supply pressure.

For example, when the cooling water supply pressure of the cooling water processor 710 is P1 and the gas supply pressure of the gas supplier 740 is P2 (> P1), a pressure of P1 is formed at the rear end of the cooling water check valve 760, A pressure of P1 may be formed at the front end. Then, since the pressure at the front end of the cooling water check valve 760 is larger than the rear end, the gas is passed through the cooling water check valve 760 until it becomes the same or similar to the cooling water supply pressure. That is, when the pressures at the front end and the rear end of the cooling water check valve 760 become equal or similar, the gas can not move to the rear end of the cooling water check valve 760 through the cooling water check valve 760, so that the two pressure values become equal or similar.

Accordingly, when the two pressure values are the same or similar, the front end of the cooling water check valve 760, that is, the inside of the magnet assembly 500, is sealed. Accordingly, when a leak occurs in the magnet assembly 500, the gas is discharged to the outside through the leaking portion, so that the pressure inside the magnet assembly 500 decreases to less than the cooling water supply pressure. That is, it is possible to check whether a leak occurs in the inside of the magnet assembly 500 by checking the pressure change inside the sealed magnet assembly 500.

The pressure inside the magnet assembly 500 should not decrease due to factors other than leakage in order to check whether leakage has occurred. Therefore, the pressure at the rear end of the cooling water check valve 760 must be kept constant at all times. If the pressure at the rear end of the cooling water check valve 760 decreases, the pressure inside the magnet assembly 500 decreases by the pressure change at the downstream end. That is, the gas inside the magnet assembly 500 passes through the cooling water check valve 760 until the pressure at the front end and the rear end of the cooling water check valve 760 becomes equal or similar. Therefore, it is necessary to keep the pressure of the rear end of the cooling water check valve 760 constant by bypassing the cooling water in order to detect the leak by measuring the pressure inside the magnet assembly 500 with the pressure measuring instrument 800.

On the other hand, when a general valve is used instead of the cooling water check valve 760, there is a limit in making the pressure inside the magnet assembly 500 equal to or similar to the cooling water supply pressure. Further, a time difference occurs when the normal valve is turned on / off, and the cooling water may flow back to the magnet assembly 500. Therefore, the cooling water check valve 760 can be provided to control the pressure inside the magnet assembly 500 to be equal to or similar to the cooling water supply pressure. Further, the supply pressure value of the cooling water is a reference which can be compared with the pressure value inside the case 510 measured by the pressure measuring instrument 800. [

The pressure gauge 800 is provided in the cooling water pipes 720 and 730 or the magnet assembly 500 to measure the pressure inside the magnet assembly 500, that is, inside the case 510. The pressure gauge 800 is disposed in the cooling water travel path between the gas feeder 740 and the cooling water check valve 760. For example, the pressure gauge 800 may be installed in the coolant return pipe 730 and may be disposed between the magnet assembly 500 and the coolant check valve 760. When the pressure inside the case 510 is measured, the cooling water supply pipe 720 is connected to the cooling water return pipe 730 to bypass the cooling water. However, the position of the pressure gauge 800 is not limited thereto, but may be provided between the magnet assembly 500 or between the magnet assembly 500 and the gas supply part 740. Further, when the pressure gauge 800 is provided at each of the positions, it is possible to accurately detect the portion where the cooling water leaks.

Then, gas is supplied to the case 510 through the gas supplier 740. At this time, the gas supply pressure is equal to or greater than the cooling water supply pressure. Therefore, a part of the gas is circulated through the case 510, then flows through the cooling water check valve 760 to the cooling water processor 710, and the case (not shown) 510) becomes equal to, or the same or similar to, the supply pressure of the cooling water. Then, the pressure inside the case 510 is measured through the pressure gauge 800 after stopping the gas supply.

If there is a leaked portion in the case 510, the gas in the case 510 flows out to the above portion so that the pressure inside the case 510 becomes lower than the supply pressure of the cooling water. On the contrary, if there is no leak, the pressure in the case 510 is not reduced because the gas in the case 510 is not leaked to the outside. Therefore, the leaked portion of the cooling water can be confirmed by the pressure change in the case 510. At this time, it is necessary to keep the pressure of the rear end of the cooling water check valve 760 constant by bypassing the cooling water in order to detect the leak by measuring the pressure inside the magnet assembly 500 with the pressure measuring instrument 800.

The controller 900 is connected to the pressure gauge 800 and determines whether the internal pressure of the magnet assembly 500 is abnormal. The controller 900 includes a transceiver 910 connected to the pressure gauge 800 and a determiner 920 for comparing a pressure value transmitted to the transceiver 910 with a predetermined set value, 920) for generating an abnormal signal when the measured pressure value is less than the set value.

The transceiver unit 910 transmits and receives signals to and from the pressure measuring instrument 800. That is, the transmitting / receiving unit 910 can receive the pressure value inside the case 510 from the pressure measuring instrument 800. [

The determination unit 920 is connected to the transmission / reception unit 910 and compares the pressure value transmitted to the transmission / reception unit 910 with a predetermined set value. That is, the determination unit 920 compares the pressure value measured by the pressure measurement unit 800 with the set value to determine whether the pressure inside the case 510 is good or bad. For example, the determination unit 920 may compare whether the measured pressure value is less than or equal to the set value. That is, if a problem such as a poor coupling state between the target 400 and the magnet assembly 500 or damage to the O-ring on the coupling surface occurs, the gas supplied to the case 510 flows out through the damaged portion do. Therefore, when the pressure inside the case 510 is measured after stopping the supply of gas into the case 510, the pressure of the inside of the case 510 is lower than when the gas is supplied, so that the defective state of the magnet assembly 500 can be easily confirmed .

The set value is 85 ~ 95% of the pressure value of cooling water. That is, when gas is supplied to the case 510 while recovering the cooling water, the pressure inside the case 510 becomes equal to or similar to the supply pressure of the cooling water. Therefore, when the magnet assembly 500 is in a good condition, even if the gas supply is stopped, the pressure inside the case 510 is not reduced, and the pressure value measured by the pressure gauge 800 may be equal to or similar to the cooling water supply pressure .

On the contrary, when the inside of the magnet assembly 500 is defective, the gas flows out to the damaged portion of the magnet assembly, and the pressure inside the case 510 decreases, so that it becomes smaller than the cooling water supply pressure. At this time, the gas can circulate in the case 510 and the pressure can be reduced by a small amount due to the load. Therefore, if the pressure value measured in consideration of the error range is reduced to 5-15% or less of the cooling water supply pressure, it is possible to make a defect judgment for the magnet assembly 500. However, the setting value is not limited to this and may be various.

The notification unit 930 is connected to the determination unit 920 and notifies the operator of the status of the magnet assembly 500 when the determination unit 920 determines the status of the magnet assembly 500 in an audible or visual manner. For example, a monitor, a siren, or the like may be used as the notification unit 930. However, the form of the notification unit 930 is not limited to this, and an abnormal signal can be notified to the operator by various methods.

Thus, it is possible to confirm whether the magnet assembly 500 is defective or not before supplying the cooling water, thereby preventing a safety accident caused by leakage of the cooling water, contamination and damage of the equipment.

In addition, since cooling water is not supplied to the inside of the magnet assembly 500, the operation of discharging the cooling water in the magnet assembly 500 and the cleaning of the chamber 100, the clean room, etc., I can not. Thus, the work can be simplified, the work time can be shortened, and the efficiency of the work can be improved.

In addition, since it is confirmed whether or not the assembled state of the magnet assembly is defective by using the numerical data, accurate and thorough diagnosis can be made. In addition, by using the pressure gauge 800 and the controller 900, it is possible to automatically check whether the magnet assembly is assembled or not, thereby improving the efficiency of the work.

Hereinafter, a method of checking the assembled state of the magnet assembly according to the embodiment of the present invention will be described in detail.

Referring to FIG. 4, a method of assembling a magnet assembly connected to a cooling water processor of a substrate processing apparatus according to an embodiment of the present invention includes the steps of assembling the magnet assembly (S100) (S200), and monitoring a pressure inside the magnet assembly (S300). At this time, assembling the magnet assembly may be a task of separating the used target from the magnet assembly and mounting a new target.

If the target is to be replaced, the process of stopping the supply of cooling water to the magnet assembly 500 before the target is mounted on the magnet assembly 500, and the process of discharging the cooling water inside the magnet assembly 500 to the outside .

Since heat is generated inside the magnet assembly 500 by the target 400 in the sputtering process of depositing the film on the substrate S using the target 400 and the magnet assembly 500, ). The cooling water supplied from the cooling water processor 710 is supplied to the case 510 of the magnet assembly 500 through the first supply pipe 722, the first valve passage of the path changer 750, the second supply pipe 721, do. The magnet assembly 500 is cooled and the circulated cooling water is recovered to the cooler processor 710 through the coolant recovery pipe 730.

On the other hand, in order to replace the target with a new target, the target attached to the plate 410 must be removed and replaced. To do this, first, the plate 410 coupled to the magnet assembly 500 is separated from the magnet module. Since the cooling water is exposed when the cooling water in the magnet assembly 500 is removed without removing it, the operation of completely discharging the cooling water must be preceded.

The cooling water supplied from the cooling water processor flows through the first supply pipe 722, the second valve passage of the path changer 750, the cooling water pipe 770, and a cooling water return pipe 730 to the cooling water processor 710. Therefore, the cooling water does not flow into the magnet assembly 500. The remaining cooling water remaining in the magnet assembly 500 is pushed into the cooling water recovery pipe 730 by flowing gas into the magnet assembly 500 and discharged to the cooling water processor 710.

Thereafter, the gas supplier 740 is controlled to stop the gas supply to the magnet assembly 500. Then, after separating the plate from the magnet module housing, mount the plate with the new target. Therefore, even if the plate 410 is separated from the magnet assembly 500, the cooling water does not flow out to the outside because no cooling water exists in the magnet assembly.

At this time, the cooling water supplied to the magnet assembly 500 may leak to the outside due to a problem that the new target and the magnet assembly 500 are poorly coupled or the O-ring of the coupling surface is damaged. Therefore, after replacing and mounting the target, it is necessary to confirm whether the assembly of the magnet assembly 500 is good or bad.

In order to confirm this, the supply path of the cooling water supplied to the magnet assembly 500 at any time of before, during, and after the mounting of the target 400 to the magnet assembly 500 And is connected to the recovery path of the cooling water to maintain the state of bypassing the cooling water.

 After the target 400 is mounted on the magnet assembly 500, the gas supplier 740 is controlled to supply gas into the magnet assembly 500. The gas is circulated in the magnet assembly 500 and then discharged to the cooling water processor 710 through the cooling water recovery path. At this time, the supply pressure of the gas may be equal to or greater than the cooling water supply pressure of the cooling water processor 710.

The supply path of the cooling water supplied to the magnet assembly 500 is switched and connected to the recovery path of the cooling water connected to the discharge path of the gas supplied into the magnet assembly 500. The inner pressure of the magnet assembly 500 rises as the gas is supplied, and a part of the gas is discharged through the cooling water return pipe 730.

On the other hand, the cooling water return pipe 730 is provided with a cooling water check valve 760 to maintain a constant pressure in the magnet assembly 500 or the first return pipe 732. That is, when the cooling water in the cooling water processor 710 is bypassed, a pressure equal to or similar to the cooling water supply pressure is formed at the connection portion between the cooling water pipe 770 and the cooling water return pipe 730. Therefore, when the gas is supplied into the magnet assembly 500 and the pressure rises, a part of the gas moves to the cooling water processor 710 side by opening the cooling water check valve 760. At this time, the cooling water check valve 760 opens the path of the gas only until the pressure inside the magnet assembly 500 drops and becomes equal to or similar to the cooling water supply pressure due to the pressure formed on the cooling water processor 710 side. Accordingly, the pressure inside the magnet assembly 500 becomes equal to or similar to the cooling water supply pressure.

That is, the pressure inside the magnet assembly 500 is equal to or greater than the supply pressure of the cooling water, and is kept smaller than the supply pressure of the gas. For example, the inner pressure of the magnet assembly 500 can be maintained at the same or similar 1 bar as the cooling water supply pressure. Accordingly, the supply pressure of the cooling water becomes a value comparable to the pressure inside the magnet assembly 500 measured by the pressure measuring instrument 800.

That is, when the cooling water supply pressure of the cooling water processor 710 is 1 bar and the gas supply pressure of the gas supplier 740 is 1.5 bar, a pressure of 1 bar is formed at the rear end of the cooling water check valve 760, A pressure of 1.5 bar can be formed. Then, since the pressure at the front end of the cooling water check valve 760 is larger than the rear end, the gas is passed through the cooling water check valve 760 until it becomes the same or similar to the cooling water supply pressure. That is, when the pressures at the front end and the rear end of the cooling water check valve 760 become equal or similar, the gas can not move to the rear end of the cooling water check valve 760 through the cooling water check valve 760, so that the two pressure values become equal or similar.

Accordingly, when the two pressure values are the same or similar, the rear end of the cooling water check valve 760, that is, the inside of the magnet assembly 500, is sealed. Accordingly, when a leak occurs in the magnet assembly 500, the gas is discharged to the outside through the leaking portion, so that the pressure inside the magnet assembly 500 decreases to less than the cooling water supply pressure. That is, it is possible to check whether a leak occurs in the inside of the magnet assembly 500 by checking the pressure change inside the sealed magnet assembly 500.

The pressure of the gas supplied from the gas supplier 740 and the cooling water check valve 760 are supplied at a pressure equal to or higher than the cooling water supply pressure of the cooling water processor 710 in the gas supplier 740, 500 can be easily adjusted to the same or similar to the cooling water supply pressure of the cooling water processor 710. Further, since the pressure inside the magnet assembly 500 becomes equal to or similar to the supply pressure of the cooling water, the pressure inside the magnet assembly 500 becomes equal to or similar to the pressure when the actual cooling water is supplied. In general, the leakage in the confined space depends on the pressure. Therefore, it is possible to confirm whether leakage has occurred in the actual pressure condition because it is confirmed whether leakage occurs in the magnet assembly 500 under the pressure supply condition of the actual cooling water.

The pressure inside the magnet assembly 500 should not decrease due to factors other than leakage in order to check whether leakage has occurred. Therefore, the pressure at the rear end of the cooling water check valve 760 must be kept constant at all times. If the pressure at the rear end of the cooling water check valve 760 decreases, the pressure inside the magnet assembly 500 decreases by the pressure change at the downstream end. That is, the gas inside the magnet assembly 500 passes through the cooling water check valve 760 until the pressure at the front end and the rear end of the cooling water check valve 760 becomes equal or similar. Therefore, it is necessary to keep the pressure of the rear end of the cooling water check valve 760 constant by bypassing the cooling water in order to detect the leak by measuring the pressure inside the magnet assembly 500 with the pressure measuring instrument 800.

Then, after stopping the gas supply into the magnet assembly 500, the pressure inside the magnet assembly 500 is monitored through the pressure gauge 800. That is, the pressure inside the magnet assembly 500 is measured while bypassing the cooling water of the cooling water processor 710. Then, the control unit 900 determines whether the internal pressure of the magnet assembly 500 is abnormal.

The controller 900 compares the pressure value measured by the pressure meter 800 with a predetermined set value, and generates an abnormal signal when the measured pressure value is less than the set value. For example, when the assembled state of the magnet assembly 500 is defective, the gas supplied to the inside of the magnet assembly 500 may be leaked to the damaged part. Therefore, if the pressure value measured by the magnet assembly 500 is lower than the cooling water supply pressure, it can be confirmed that the assembled state of the magnet assembly 500 is defective.

At this time, the set value may be a value of 85 to 95% of the pressure value of the cooling water. For example, if the cooling water supply pressure is 1 bar, the set point can be set between 0.85 and 0.95 bar. That is, when the gas circulates inside the magnet assembly 500, the pressure inside the magnet assembly 500 may decrease due to the load. Therefore, it is possible to determine the set value from 0.85 to 0.95 bar with an error of 0.05 to 0.15 bar. If the measured pressure value is measured to be less than the set value, the controller 900 determines that the magnet assembly 500 is in a bad state and can send an abnormal signal to the operator in an audible or visual manner.

On the other hand, if the measured pressure value is less than the set value after the measured pressure value is compared with the set value, a defect occurs in the magnet assembly 500. Thus, the operator reassembles the magnet assembly 500 when the controller 900 generates an abnormal signal. For example, the magnet assembly 500 can be repaired or replaced and assembled. After the magnet assembly 500 is reassembled, the operation of supplying gas into the magnet assembly 500 and monitoring the pressure inside the magnet assembly 500 can be repeated. Therefore, it is confirmed whether or not the assembled state of the magnet assembly 500 is abnormal after reassembling.

Thus, it is possible to confirm whether the magnet assembly 500 is defective or not before supplying the cooling water, thereby preventing a safety accident caused by leakage of the cooling water, contamination and damage of the equipment.

In addition, since cooling water is not supplied to the inside of the magnet assembly 500, the operation of discharging the cooling water in the magnet assembly 500 and the cleaning of the chamber 100, the clean room, etc., I can not. Thus, the work can be simplified, the work time can be shortened, and the efficiency of the work can be improved.

In addition, since it is confirmed whether or not the assembled state of the magnet assembly is defective by using the numerical data, accurate and thorough diagnosis can be made. In addition, by using the pressure gauge 800 and the controller 900, it is possible to automatically check whether the magnet assembly is assembled or not, thereby improving the efficiency of the work.

Although the present invention has been described in detail with reference to the specific embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be defined by the appended claims, as well as the appended claims.

100: chamber 200: substrate support
300: vacuum generator 400: target
500: Magnet assembly 600: Actuator
710: Cooling water processor 720: Cooling water supply pipe
730: Cooling water return pipe 740: Gas feeder
750: Path switcher 760: Cooling water check valve
800: Pressure gauge 900: Controller

Claims (15)

A method for checking the assembled state of a magnet assembly connected to a cooling water processor of a substrate processing apparatus,
Assembling the magnet assembly;
Supplying a gas into the magnet assembly; And
And monitoring a pressure inside the magnet assembly. The method according to claim 1,
The process of supplying gas into the magnet assembly includes:
And maintaining a pressure inside the magnet assembly equal to or greater than a cooling water supply pressure of the cooling water processor. The method of claim 2,
The method comprising the steps of: maintaining a pressure inside the magnet assembly equal to or greater than a cooling water supply pressure of the cooling water processor; and monitoring a pressure inside the magnet assembly,
And the supply path of the cooling water supplied to the magnet assembly is switched and connected to the recovery path of the cooling water connected to the discharge path of the gas supplied into the magnet assembly. The method according to claim 1,
In the process of supplying gas into the magnet assembly,
Wherein the supply pressure of the gas is greater than or equal to the cooling water supply pressure of the cooling water processor. The method according to claim 1,
The process of monitoring the pressure inside the magnet assembly includes:
Measuring the pressure inside the magnet assembly while bypassing the cooling water of the cooling water processor; and determining whether the pressure inside the magnet assembly is abnormal. The method of claim 5,
Wherein the step of determining whether the pressure inside the magnet assembly is abnormal includes the steps of:
Comparing the measured pressure value with a predetermined set value; and generating an abnormal signal if the measured pressure value is less than the set value. The method of claim 6,
Wherein the set value is 85 to 95% of a pressure value of the cooling water. The method of claim 6,
Comparing the measured pressure value with the set value,
And reassembling the magnet assembly when the measured pressure value is less than the set value. The method of claim 8,
After the magnet assembly is reassembled,
A process of supplying gas into the magnet assembly, and a process of monitoring pressure inside the magnet assembly. A chamber having an internal space;
A substrate support for supporting the substrate within the internal space;
A target disposed opposite the substrate support;
A magnet assembly disposed on one side of the target and generating a magnetic force;
A cooling water processor for supplying or recovering cooling water to the magnet assembly;
A cooling water pipe forming a path through which the cooling water moves, one end connected to the magnet assembly and the other end connected to the cooling water processor;
A gas supplier communicating with the cooling water pipe to supply gas into the magnet assembly; And
And a pressure gauge installed in the magnet assembly or the cooling water pipe to monitor the pressure inside the magnet assembly to check the assembled state of the magnet assembly. The method of claim 10,
Wherein the cooling water pipe includes a cooling water supply pipe forming a movement path of the cooling water supplied from the cooling water processor to the magnet assembly and a cooling water recovery pipe forming a movement path of the cooling water recovered from the magnet assembly to the cooling water processor,
Further comprising a path diverter connected to the cooling water supply pipe so as to bypass a movement path of the cooling water supplied to the magnet assembly, and a cooling water drain pipe having one end connected to the path diverter and the other end connected to the cooling water recovery pipe,
Wherein the path diverter bypasses the cooling water and monitors the pressure inside the magnet assembly. The method of claim 11,
The gas is circulated through the magnet assembly, is discharged through the cooling water recovery pipe,
Wherein the gas supply unit supplies gas at a pressure equal to or higher than the cooling water supply pressure of the cooling water processor. The method of claim 11,
Further comprising a cooling water check valve disposed between the connection portion of the cooling water recovery pipe and the cooling water pipe and between the magnet assembly,
Wherein the pressure gauge is disposed in a cooling water movement path between the gas feeder and the cooling water check valve. The method of claim 11,
Wherein the cooling water processor further comprises a gas discharge unit connected to the cooling water recovery pipe to discharge gas supplied to the magnet assembly to the outside. The method of claim 10,
Further comprising a controller connected to the pressure gauge to determine whether the pressure inside the magnet assembly is abnormal,
The controller includes a transceiver for transmitting and receiving signals to and from the pressure gauge, a determination unit for comparing a pressure value transmitted to the transceiver unit with a predetermined set value, and a control unit connected to the determination unit, And an abnormality signal generating unit for generating an abnormal signal.
KR1020150048345A 2015-04-06 2015-04-06 Substrate Processing Apparatus and Inspection Method of Magnet Assembly KR102007867B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109778127A (en) * 2017-11-13 2019-05-21 佳能特机株式会社 Sputtering equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010096337A (en) 2000-04-18 2001-11-07 윤종용 Sputtering equipment including enhanced cooling system over edge section of target
KR20070011162A (en) * 2005-07-19 2007-01-24 어플라이드 머티어리얼스, 인코포레이티드 Evacuable magnetron chamber
KR20070060158A (en) * 2004-10-26 2007-06-12 어플라이드 머티어리얼스, 인코포레이티드 Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers
KR101358805B1 (en) * 2012-08-22 2014-02-07 에이피시스템 주식회사 Apparatus for draining coolant and method for operating the same and apparatus for processing substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010096337A (en) 2000-04-18 2001-11-07 윤종용 Sputtering equipment including enhanced cooling system over edge section of target
KR20070060158A (en) * 2004-10-26 2007-06-12 어플라이드 머티어리얼스, 인코포레이티드 Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers
KR20070011162A (en) * 2005-07-19 2007-01-24 어플라이드 머티어리얼스, 인코포레이티드 Evacuable magnetron chamber
KR101358805B1 (en) * 2012-08-22 2014-02-07 에이피시스템 주식회사 Apparatus for draining coolant and method for operating the same and apparatus for processing substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109778127A (en) * 2017-11-13 2019-05-21 佳能特机株式会社 Sputtering equipment
CN109778127B (en) * 2017-11-13 2022-10-21 佳能特机株式会社 Sputtering device

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