KR102007867B1 - Substrate Processing Apparatus and Inspection Method of Magnet Assembly - Google Patents

Substrate Processing Apparatus and Inspection Method of Magnet Assembly Download PDF

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KR102007867B1
KR102007867B1 KR1020150048345A KR20150048345A KR102007867B1 KR 102007867 B1 KR102007867 B1 KR 102007867B1 KR 1020150048345 A KR1020150048345 A KR 1020150048345A KR 20150048345 A KR20150048345 A KR 20150048345A KR 102007867 B1 KR102007867 B1 KR 102007867B1
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South Korea
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magnet assembly
coolant
cooling water
pressure
gas
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KR1020150048345A
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Korean (ko)
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KR20160119905A (en
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서문선
김준호
이재승
신동열
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에이피시스템 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
    • H01L21/203—

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention is a method of checking the assembly state of the magnet assembly connected to the coolant processor of the substrate processing apparatus, the process of assembling the magnet assembly, supplying gas into the magnet assembly, and monitoring the pressure inside the magnet assembly Including, the magnet assembly after assembly can be easily checked for abnormalities in the magnet assembly.

Description

Substrate Processing Apparatus and Inspection Method of Magnet Assembly

The present invention relates to a method for checking a magnet assembly assembly state and a substrate processing apparatus, and more particularly, a method for checking a magnet assembly assembly state and a substrate processing apparatus that can easily check an abnormality inside a magnet assembly after assembling the magnet assembly. It is about.

Formation of a thin film in the manufacturing process of a semiconductor device, in particular, the formation of a metal layer is a physical vapor deposition (PVD) method, such as sputter (PVD) method and chemical vapor deposition (hereinafter, CVD) To form.

In the sputtering method, high heat is generated in the target by the collision of ions on the target surface during the deposition process. Therefore, in the thin film formation process using the sputtering method, a cooling facility for target cooling is required. Such cooling facilities are indispensable in configuration for the stable operation of the sputter deposition machine. In general, a cooling facility uses a cooling water called cooling water as a refrigerant, and circulates in the magnet assembly at the rear of the target to cool the target.

If the target is used for a long time, the target may be worn by the ions. Therefore, when the deposition process is performed according to the sputtering method, the used target must be replaced with a new target. At this time, the coolant supplied to the magnet assembly may leak to the outside due to a problem such as a poor coupling state between the new target and the magnet assembly or an O-ring of the coupling surface being damaged. Thus, coolant may enter the chamber or the floor of the clean room to contaminate or damage the equipment.

Conventionally, after replacing the target, the cooling water was supplied to the magnet assembly to check whether the cooling water was leaked. However, when visually checking whether the coolant leaks, the operator may have a detection error, and there is a limit in accurately determining whether the coolant leaks. In addition, if the coolant leak is confirmed, there is a risk of safety accident and equipment damage due to the leaked coolant.

Then, when the coolant leak is confirmed, the coolant inside the magnet assembly is discharged to the outside, and after cleaning the chamber or the clean room in which the coolant is introduced, repair or replace the magnet assembly. Therefore, the process of checking the leakage of the cooling water and solving it may be complicated and the working time may be very long. Thus, the efficiency of the work can be lowered.

KR 2001-0096337 A

The present invention provides a method for checking a magnet assembly assembled state and a substrate treating apparatus which can easily check whether the assembled state of the magnet assembly is good or bad.

The present invention provides a method for checking a magnet assembly assembly state and a substrate processing apparatus capable of improving work efficiency.

The present invention is a method of checking the assembly state of the magnet assembly connected to the coolant processor of the substrate processing apparatus, the process of assembling the magnet assembly, supplying gas into the magnet assembly, and monitoring the pressure inside the magnet assembly It includes.

Supplying a gas into the magnet assembly,

Maintaining the pressure inside the magnet assembly to be equal to or greater than the cooling water supply pressure of the cooling water processor.

Maintaining the pressure inside the magnet assembly is greater than or equal to the cooling water supply pressure of the cooling water processor, and the process of monitoring the pressure inside the magnet assembly,

The supply path of the cooling water supplied to the magnet assembly is performed in a state in which the cooling path is connected to the recovery path of the cooling water connected to the discharge path of the gas supplied into the magnet assembly.

In the process of supplying gas into the magnet assembly,

The supply pressure of the gas is greater than or equal to the cooling water supply pressure of the cooling water processor.

The process of monitoring the pressure inside the magnet assembly,

And measuring the pressure inside the magnet assembly while bypassing the cooling water of the coolant processor, and determining whether the pressure inside the magnet assembly is abnormal.

The process of determining whether the pressure inside the magnet assembly is abnormal,

And comparing the measured pressure value with a preset set value, and generating an abnormal signal when the measured pressure value is less than the set value.

The set value is 85 to 95% of the pressure value to which the cooling water is supplied.

After comparing the measured pressure value and the set value,

And reassembling the magnet assembly when the measured pressure value is less than or equal to the set value.

After reassembling the magnet assembly,

The process of supplying gas into the magnet assembly and the process of monitoring the pressure inside the magnet assembly are repeated.

The present invention provides a chamber having an internal space, a substrate support for supporting a substrate in the internal space, a target disposed to face the substrate support, a magnet assembly disposed on one side of the target and generating a magnetic force, and a cooling water in the magnet assembly. Cooling water processor for supplying or recovering the cooling water, the cooling water pipe forming a path for moving the cooling water and the other end is connected to the coolant processor, the other end is connected to the cooling water processor, communicating with the cooling water pipe to supply gas into the magnet assembly And a pressure gauge installed in the magnet assembly or the cooling water pipe to monitor the pressure inside the magnet assembly to check the assembly state of the magnet assembly.

The cooling water pipe may include a cooling water supply pipe forming a moving path of the cooling water supplied from the cooling water processor to the magnet assembly, and a cooling water recovery pipe forming a moving path of the cooling water recovered from the magnet assembly to the cooling water processor.

And a coolant bypass pipe connected to the coolant supply pipe to bypass the movement path of the coolant supplied to the magnet assembly, and a coolant bypass pipe connected to the coolant return pipe at one end thereof and connected to the coolant return pipe at the other end thereof.

The diverter monitors the pressure inside the magnet assembly while bypassing the coolant.

The gas is discharged through the cooling water recovery pipe after circulating inside the magnet assembly,

The gas supplier supplies gas at a pressure greater than or equal to the cooling water supply pressure of the cooling water processor.

And a coolant check valve disposed between the connection portion of the coolant return pipe and the coolant bypass tube and the magnet assembly.

The pressure gauge is disposed in a coolant movement path between the gas supply and the coolant check valve.

The cooling water processor further includes a gas discharge unit connected to the cooling water recovery pipe to discharge the gas supplied to the magnet assembly to the outside.

It is connected to the pressure meter further comprises a controller for determining whether or not the pressure inside the magnet assembly,

The controller may include a transceiver configured to exchange a signal with the pressure gauge, a determiner configured to compare the pressure value transmitted to the transceiver to a preset set value, and be connected to the determiner so that the measured pressure value is less than the set value. It includes a notification unit for generating an abnormal signal.

According to embodiments of the present invention, it is possible to check whether the assembly of the magnet assembly is defective before supplying the cooling water. Thus, it is possible to prevent a safety accident or contamination and damage of the equipment due to cooling water leakage.

In addition, since the cooling water is not supplied into the magnet assembly, the cooling water in the magnet assembly may not be discharged or the chamber or the clean room into which the cooling water is introduced may not be performed. Thus, the work can be simplified and the working time can be shortened to improve the work efficiency.

In addition, since the assembling state of the magnet assembly is checked by using the numerical data, accurate and thorough diagnosis is possible than when visually checking. And, it is possible to automatically determine whether the assembly of the magnet assembly using a measuring instrument can improve the efficiency of the work.

1 is a structural diagram showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a view illustrating a connection relationship between a magnet assembly and a coolant processor according to an exemplary embodiment of the present invention.
3 is a view showing the movement path of the coolant and the gas according to an embodiment of the present invention.
4 is a flowchart illustrating a method of checking a state of assembly of a magnet assembly according to an exemplary embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. BRIEF DESCRIPTION OF THE DRAWINGS The drawings may be exaggerated in order to illustrate the invention in detail, in which like reference numerals refer to like elements.

1 is a structural diagram showing a substrate processing apparatus according to an embodiment of the present invention, Figure 2 is a view showing a connection relationship between the magnet assembly and the coolant processor according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention 4 is a view illustrating a movement path of cooling water and gas, and FIG. 4 is a flowchart illustrating a method of checking a state of assembly of a magnet assembly according to an exemplary embodiment of the present invention.

1 and 2, a substrate processing apparatus according to an embodiment of the present invention includes a chamber 100 having an internal space, a substrate support 200 supporting the substrate S in the internal space, and the substrate. A target 400 disposed to face the support 200, a magnet assembly 500 disposed at one side of the target 400 and generating magnetic force, and a coolant processor for supplying or recovering cooling water to the magnet assembly 500 ( 710, the coolant pipes 720 and 730 connected to the magnet assembly 500 and the other end connected to the coolant processor 710 to form a path through which the coolant moves, and the gas into the magnet assembly 500. Monitor the pressure inside the magnet assembly 500 to check the assembling state of the gas supplier 740 and the magnet assembly 500 to communicate with the cooling water pipes 720 and 730 to supply, and the magnet The pressure gauge 800 is installed in the assembly 500 or the cooling water pipes 720 and 730. In addition, the substrate processing apparatus may include a vacuum generator 300, a driver 600, a path changer 750, a coolant bypass tube 770, and a controller 900.

The chamber 100 includes a main body with an open top, and a plate 410 to be described later is installed to be opened and closed at the top of the main body. When the plate 410 is coupled to the upper portion of the main body to close the inside of the main body, an inner space in which the sputtering process for the substrate S is performed is formed in the chamber 100. In addition, a through hole in which the shaft 220 of the substrate support 200 to be described later is inserted is formed in the bottom surface of the chamber 100. A gate valve (not shown) is formed on the sidewall of the chamber 100 to bring the substrate S into or into the chamber 100.

The vacuum generator 300 is connected to the chamber 100 to form the internal space of the chamber 100 in a vacuum atmosphere. The vacuum generator 300 includes an exhaust pipe 320 forming a gas movement path, and a vacuum pump 310 disposed outside the chamber 100 and sucking gas in the space inside the chamber 100. At a predetermined position of the chamber 100, an exhaust port for discharging the gas existing in the internal space is formed, and the exhaust port is connected to the vacuum pump 310 through the exhaust pipe 320.

The substrate support 200 serves to support the substrate S inside the chamber 100. The substrate support 200 includes a support 210 and a shaft 220. Support 210 is provided in a horizontal direction in the chamber 100 in the shape of a disc, the shaft 220 is connected to the bottom of the support 210 vertically. The shaft 220 may be connected to a power unit (not shown) such as a motor outside the through hole to elevate the support 210. At this time, by sealing the gap between the shaft 220 and the through hole by using the bellows 230 or the like to prevent the vacuum in the chamber 100 is released during the deposition of the thin film. In addition, a heater (not shown) or a coolant flow path may be provided below or inside the support part 210 to heat or cool the substrate S at a constant process temperature.

The target assembly includes a target 400 and a plate 410 attaching and supporting the rear surface of the target 400. The target assembly deposits a film through thin film deposition by sputtering on the substrate S mounted on the support 210. The target 400 is made of a material of a metal film to be stacked on the substrate S, and may be implemented in a circular shape or various shapes. The plate 410 is a plate to which the target 400 is attached. The front surface of the target 400 faces the substrate S and the rear surface of the target 400 is attached to the plate 410. When the target 400 is to be replaced, the plate 410 may be separated and replaced.

Thin film deposition by the sputtering method is to prepare a substrate for forming a thin film in the reaction chamber in a gaseous state or atoms in the plasma state to the target of a material such as metal, such as the material of the thin film to be formed and fine particles It is a method of forming a thin film by being debris and deposited on a wafer. In other words, sputtering means that when a high voltage is applied to a target material and discharged in an inert gas atmosphere of 10 -2 or 10 -3 Tr (tor), the ionized inert gas collides with the target, and the target material, which has received momentum, is moved into a vacuum. It is a kind of physical vapor deposition technique that is released and sticks to a substrate.

A direct current (DC) bias voltage is supplied to the plate 410 and applied to the target 400, and the ground voltage is applied to the substrate support 210 and the wall of the chamber 100. Therefore, the plate 410 to which the DC voltage is applied and the wall of the chamber 100 to be grounded must be insulated, so that an insulator 110 is provided between the plate 410 and the wall of the chamber 100.

The magnet assembly 500 serves to generate a magnetic force. The magnet assembly 500 includes a case 510 having an inner space and a magnet unit 520 accommodated in the case 510. In this case, the case 510 may open and close the upper portion of the chamber 100 by a hinge (not shown) provided on one side.

In the case 510, a cooling space through which the coolant surrounding the outside of the magnet unit 520 is circulated is formed. That is, the cooling space is formed inside the case 510 by the upper surface of the case 510, the side wall, and the plate 410. The lower part of the case 510 is sealed by the plate 410 to which the target 400 is attached. For example, the case 510 and the plate 410 may be coupled by several bolts, and an O-ring (not shown) may be inserted between the coupling portions to prevent leakage of the coolant. When the plate 410 is separated from the case 510 to replace the target 400, the plate 410 may be separated from the case 510 by releasing bolt coupling.

In addition, two cooling water circulation paths are formed in the case 510, and an inlet end through which the coolant is introduced and an outlet end through which the coolant is discharged are provided. However, the structure of the case 510 is not limited thereto and may vary.

The magnet unit 520 is made of a magnetron and a magnet exposed in the cooling space of the case 510. The magnet unit 520 is disposed behind the target 400 and spaced apart from the plate 410. The magnet unit 520 may generate a magnetic field to further enhance the plasma density near the surface of the target 400.

The driver 600 includes a motor 610 for providing a rotational force and a rotation shaft 650 connected to the motor 610. The rotating shaft 650 may be connected to the magnet unit 520 to rotate the magnet unit 520 with the rotational force provided by the motor 610. For example, the motor 610 and the rotation shaft 650 may or may not be aligned in a straight line. When the motor 610 and the rotation shaft 650 are not aligned, the pulley 620, the belt 630, and the housing 640 may be provided to transmit rotational force of the motor 610 to the rotation shaft 650. have. That is, when the rotational force of the motor 610 is transmitted to the belt 630 using the pulley 620, the housing 640 wound around the belt 630 may rotate to rotate the rotation shaft 650. However, the method of rotating the magnet unit 520 may be variously limited.

The coolant processor 710 performs a function of supplying and recovering coolant to the inner space of the case 510. The cooled cooling water is supplied to the case 510 and performs a function of cooling the cooling water recovered from the case 510. Therefore, the coolant processor 710 includes a supply end for supplying coolant to the case 510 and a recovery end for recovering coolant from the case 510.

Cooling water pipes (720, 730), the cooling water supply pipe 720 to form a movement path of the cooling water supplied to the magnet assembly 500 from the cooling water processor 710, and the cooling water processor (710) in the magnet assembly 500 Cooling water recovery pipe 730 that forms the movement path of the cooling water recovered by the.

The coolant supply pipe 720 has one end connected to the inlet end of the case 510 and the other end connected to the supply end of the coolant processor 710 to deliver the coolant supplied from the coolant processor 710 to the case 510. Do it. The coolant supply pipe 720 may include a first supply pipe 722 connecting the first valve hole 721 of the switching valve 752 to be described later, and a second valve hole 752 and the case 510 of the switching valve 752. It includes a second supply pipe 721 connecting the inlet of the. Therefore, the inlet end of the case 510 and the supply end of the coolant processor 710 are connected to the first and second supply pipes 721 and selectively connected on / off by the path changer 750.

The cooling water recovery pipe 730 is connected to the discharge end of the case 510 and the recovery end of the cooling water processor 710, and serves to transfer the cooling water heated by cooling circulation in the case 510 to the cooling water processor 710. The coolant recovery pipe 730 is a first recovery pipe 732 connecting the magnet assembly 500 and the coolant bypass pipe 770 to be described later, and a second connecting the coolant bypass pipe 770 and the coolant processor 710. Recovery tube 733 is included. However, various coolants may be used in addition to the coolant.

The gas supplier 740 communicates with the cooling water supply pipe 720 to selectively supply gas to the case 510 of the magnet assembly 500. The gas supplier 740 includes a gas supply pipe 743, a flow control unit 741, and a gas inflow check valve 742. The gas supply pipe 743 is connected to the second supply pipe 721 between the inlet end of the case 510 and the second valve hole 752 of the switching valve 752. Therefore, when gas is supplied to the gas inlet pipe 743, the gas is supplied into the case 510 through the second supply pipe 721. At this time, the second valve hole 752 of the switching valve 752 is blocked so that gas does not flow to the path switcher 750. Air can be used as the gas. However, the present invention is not limited thereto, and various inert gases such as argon gas may be used.

The flow rate control unit 741 controls the flow rate of the gas supplied to the gas supply pipe 743. The gas inflow check valve 742 serves to block the gas from flowing back from the gas supply pipe 743 to the flow rate control unit 741. In addition, when the coolant moves to the coolant supply pipe 720, the gas inflow check valve 742 prevents the coolant from flowing back into the flow rate control unit 741.

Therefore, when the gas supplier 740 supplies gas into the magnet assembly 500, the gas is supplied into the case 510 through the second supply pipe 721, and then through the coolant recovery pipe 730, the coolant processor ( 710). At this time, the cooling water processor 710 may further include a gas discharge unit (not shown) for discharging the gas supplied to the magnet assembly 500 to the outside. Accordingly, after the gas supplied from the gas supplier 740 is supplied to the case 510 through the cooling water supply pipe 720, the gas recovered from the case 510 is supplied to the cooling water processor 710 through the cooling water recovery tube 730. To be discharged.

The path changer 750 may convert and connect the supply path of the coolant supplied to the case 510 of the magnet assembly 500 to the recovery path of the coolant. That is, the path changer 750 may bypass the movement path of the coolant supplied to the magnet assembly 500. Thus, the path changer 750 switches the discharge path of the coolant according to the operation.

For example, when the cooling water is supplied to the case 510, as shown in FIG. 3A, the cooling water supplied from the cooling water processor 710 is normally supplied to the case 510 through the cooling water supply pipe 720. The coolant recovered from the case 510 is normally recovered to the coolant processor 710 through the coolant recovery tube 730. However, when the cooling water supply to the case 510 is stopped, as shown in FIG. 3B, the cooling water supply pipe 720 is switched to the cooling water recovery pipe 730 to return the cooling water. At this time, the gas is supplied to the case 510 through the gas supplier 740, and the coolant remaining in the case 510 is pushed to the coolant recovery pipe 730 to be discharged to the coolant processor 710. In addition, the diverter 750 bypasses the coolant even when monitoring the pressure inside the magnet assembly 500 through the pressure meter 800.

One end of the cooling water bypass pipe 770 is connected to the path changer 750, and the other end thereof is connected to the cooling water recovery pipe 730. To be precise, one end of the coolant bypass pipe 770 is connected to the third valve hole 753 of the path changer 750. The cooling water bypass pipe 770 forms a movement path of the cooling water in which the movement path is bypassed by the path changer 750. Therefore, when the cooling water movement path is bypassed to stop the supply of the cooling water to the case 510, the cooling water supplied from the cooling water supply pipe 720 is switched in the path changer 750, and the cooling water is switched through the cooling water bypass pipe 770. It moves to the recovery pipe 730.

The diverter 750 may be a three-way valve having three valve holes. That is, the path changer 750 includes a first valve hole 721 connected to the first supply pipe 722 in contact with the supply end of the cooling water processor 710, and a second supply pipe 721 in contact with the inlet end of the case 510. ) And a third valve hole 753 connected to the coolant bypass pipe 770. Therefore, the switching valve 752 can selectively change the movement path of the cooling water according to the work.

For example, when cooling water is supplied to the case 510, a first valve passage connecting the supply end of the cooling water processor 710 and the inflow end of the case 510 is formed. To this end, the first supply pipe 722 connected to the first valve hole 721 and the second supply pipe 721 connected to the second valve hole 752 pass through each other in the path changer 750. When bypassing the movement path of the cooling water, a second valve passage is formed to directly connect the supply end of the cooling water processor 710 and the recovery end of the cooling water processor 710. To this end, the first supply pipe 722 connected to the first valve hole 721 and the cooling water bypass pipe 770 connected to the third valve hole 753 pass through each other in the path changer 750.

In this case, the gas supplier 740 supplies gas at a pressure greater than or equal to the cooling water supply pressure of the cooling water processor 710. Accordingly, the gas supplied into the magnet assembly 500 prevents the coolant flowing to the coolant recovery pipe 730 through the coolant bypass pipe 770 to flow back to the magnet assembly 500. In addition, the gas causes the internal pressure of the magnet assembly 500 to be greater than or equal to the supply pressure of the cooling water. Accordingly, when bypassing the coolant, the pressure inside the magnet assembly 500 is equal to or similar to the coolant supply pressure of the coolant processor 710.

That is, the magnet is supplied at a pressure greater than or equal to the cooling water supply pressure of the cooling water processor 710 in the gas supply 740 by the organic coupling of the pressure of the gas supplied from the gas supply 740 and the cooling water check valve 760. The pressure inside the assembly 500 may be easily adjusted to be the same as or similar to the cooling water supply pressure of the cooling water processor 710. In addition, since the pressure inside the magnet assembly 500 is the same as or similar to the supply pressure of the cooling water, the pressure inside the magnet assembly 500 becomes the same or similar to the pressure when the actual cooling water is supplied. In general, the leak in a confined space depends on the pressure. Therefore, since the leakage occurs in the magnet assembly 500 under the actual supply pressure of the cooling water, it is possible to more accurately check whether the leakage occurs under the actual pressure condition.

On the other hand, the pressure supplied by the gas supplier 740 gas should be less than twice the pressure supplied with the cooling water. If the pressure of the gas supplied by the gas supplier 740 is too high, the gas may damage the inside of the magnet assembly 500 while circulating inside the magnet assembly 500. Therefore, the gas must be supplied at a pressure in which the magnet assembly 500 is not damaged.

The coolant check valve 760 is provided in the coolant recovery pipe 730 to move the coolant or gas in the coolant recovery pipe 730 only from the magnet assembly 500 to the coolant processor 710. In detail, the coolant check valve 760 is installed between the connection point of the coolant bypass pipe 770 and the coolant return pipe and the discharge end of the case 510 of the magnet assembly 500. That is, the coolant check valve 760 is installed in the first recovery pipe 732. Thus, the coolant check valve may prevent the coolant moving directly from the supply end of the coolant processor 710 to the recovery end of the coolant processor 710 to flow backward to the case 510.

In addition, the coolant check valve 760 may maintain a constant pressure in the magnet assembly 500 or the first recovery pipe 732. That is, when the cooling water of the cooling water processor 710 bypasses, a pressure equal to or similar to the cooling water supply pressure is formed at the connection portion between the cooling water bypass pipe 770 and the cooling water recovery pipe 730. Therefore, when the gas is supplied into the magnet assembly 500 and the pressure rises above the cooling water supply pressure, some of the gas moves to the cooling water processor 710 through the cooling water check valve 760. At this time, the coolant check valve 760 is the pressure formed on the coolant processor 710 side (rear end of the check valve), the pressure of the gas until the excess pressure inside the magnet assembly 500 is lowered to be equal to or similar to the coolant supply pressure. Allow movement Thus, the pressure inside the magnet assembly 500 is equal to or similar to the cooling water supply pressure.

For example, when the cooling water supply pressure of the cooling water processor 710 is P1 and the gas supply pressure of the gas supply 740 is P2 (> P1), a pressure of P1 is formed at the rear end of the cooling water check valve 760, A pressure of P1 can be formed at the front end. Then, since the pressure at the front end of the coolant check valve 760 is greater than the rear end, the gas moves through the coolant check valve 760 until it is equal to or similar to the coolant supply pressure. That is, when the pressures of the front and rear ends of the coolant check valve 760 are the same or similar, the gas may not move to the rear end of the coolant check valve 760 through the coolant check valve 760, and thus the two pressure values may be the same or similar.

Therefore, when the two pressure values are the same or similar, the front end of the coolant check valve 760, that is, the inside of the magnet assembly 500 is sealed. Thus, when a leak occurs in the magnet assembly 500, since the gas is discharged to the outside through the leaked portion, the pressure in the magnet assembly 500 decreases below the cooling water supply pressure. That is, by checking the pressure change in the sealed magnet assembly 500, it is possible to check whether the leak occurs in the magnet assembly 500.

In order to confirm the occurrence of the leak by the above method, the pressure inside the magnet assembly 500 should not be reduced due to factors other than the leak. Therefore, the pressure behind the coolant check valve 760 must be kept constant at all times. If the pressure at the rear end of the coolant check valve 760 is reduced, the pressure inside the magnet assembly 500 is also reduced by the pressure change at the rear end. That is, the gas inside the magnet assembly 500 passes through the coolant check valve 760 until the pressures of the front and rear ends of the coolant check valve 760 become equal or similar. Therefore, in order to find the leak by measuring the pressure inside the magnet assembly 500 with the pressure gauge 800, it is necessary to bypass the cooling water and maintain the pressure at the rear end of the cooling water check valve 760 constant.

On the other hand, when using a general valve instead of the coolant check valve 760, there is a limit in making the pressure inside the magnet assembly 500 equal or similar to the coolant supply pressure. In addition, a time difference may occur when the general valve is turned on and off, thereby causing a problem that the cooling water flows back to the magnet assembly 500. Therefore, the coolant check valve 760 may be provided to control the pressure inside the magnet assembly 500 to be equal to or similar to the coolant supply pressure. In addition, the supply pressure value of the cooling water becomes a reference that can be compared with the pressure value inside the case 510 measured by the pressure meter 800.

The pressure gauge 800 is provided in the cooling water pipes 720 and 730 or the magnet assembly 500 to measure the pressure inside the magnet assembly 500, that is, the case 510. The pressure gauge 800 is disposed in the coolant movement path between the gas supply 740 and the coolant check valve 760. For example, the pressure gauge 800 may be installed in the coolant return pipe 730 and may be disposed between the magnet assembly 500 and the coolant check valve 760. When the pressure inside the case 510 is measured, the cooling water supply pipe 720 is switched to the cooling water recovery pipe 730 to bypass the cooling water. However, the position of the pressure meter 800 is not limited thereto, and may be provided between the magnet assembly 500 or the magnet assembly 500 and the gas supply part 740. In addition, when the pressure measuring device 800 is provided at each of the positions, it is possible to accurately find a portion where the coolant leaks.

Then, gas is supplied to the case 510 through the gas supplier 740. At this time, the supply pressure of the gas is equal to or greater than the supply pressure of the cooling water. Therefore, since some of the gas discharge path and the cooling water recovery path overlap each other, some of the gas circulates through the case 510 and then passes through the coolant check valve 760 to the coolant processor 710 and the case ( The pressure inside 510 is equal to, or the same as, or similar to the supply pressure of the coolant. Then, after the gas supply is stopped, the pressure inside the case 510 is measured through the pressure meter 800.

If the leak occurs in the case 510, the gas in the case 510 flows out to the part, and the pressure in the case 510 is lower than the supply pressure of the cooling water. On the contrary, if there is no leak, since the gas in the case 510 does not flow out, the pressure in the case 510 is not reduced. Therefore, the leaked portion of the coolant may be checked by the pressure change in the case 510. At this time, in order to find the leak by measuring the pressure inside the magnet assembly 500 with the pressure measuring device 800, it is necessary to bypass the cooling water to maintain a constant pressure at the rear end of the cooling water check valve 760.

The controller 900 is connected to the pressure meter 800 to determine whether the pressure inside the magnet assembly 500 is abnormal. The controller 900 may include a transceiver 910 connected to the pressure measurer 800, a determination unit 920 for comparing the pressure value transmitted to the transceiver 910 with a preset setting value, and the determination unit ( And a notification unit 930 connected to the 920 to generate an abnormal signal when the measured pressure value is less than or equal to the set value.

The transceiver 910 plays a role of exchanging a signal with the pressure gauge 800. That is, the transceiver 910 may receive a pressure value inside the case 510 from the pressure meter 800.

The determiner 920 is connected to the transceiver 910 and compares the pressure value transmitted to the transceiver 910 with a preset set value. That is, the determination unit 920 determines whether the pressure inside the case 510 is good or bad by comparing the pressure value measured by the pressure measuring device 800 with a set value. For example, the determination unit 920 may compare whether the measured pressure value is less than or equal to the set value. That is, when a problem such as a poor coupling state between the target 400 and the magnet assembly 500 or damage to the coupling surface O-ring, the gas supplied to the case 510 flows out through the damaged part. do. Therefore, if the pressure inside the case 510 is measured after stopping the gas supply into the case 510, the pressure decreases as compared with when the gas is supplied, so that the defective state of the magnet assembly 500 can be easily confirmed. .

The set value is 85 ~ 95% of the pressure value of cooling water supply. That is, when gas is supplied to the case 510 while recovering the cooling water, the pressure inside the case 510 and the supply pressure of the cooling water become equal to or similar to each other. Therefore, when the state of the magnet assembly 500 is good, even if the gas supply is stopped, the pressure inside the case 510 does not decrease, so that the pressure value measured by the pressure gauge 800 may be the same as or similar to the cooling water supply pressure. .

On the contrary, when the state inside the magnet assembly 500 is in a bad state, the gas flows out to the broken portion of the magnet assembly, and thus the pressure inside the case 510 is reduced, which is smaller than the cooling water supply pressure. At this time, while the gas circulates inside the case 510, a small amount of pressure may be reduced due to the load. Therefore, when the measured pressure value in consideration of the error range is reduced to 5 to 15% or less in the cooling water supply pressure may be a bad judgment for the magnet assembly 500. However, the setting value is not limited thereto and may vary.

The notification unit 930 is connected to the determination unit 920, and when the determination unit 920 makes a bad decision about the state of the magnet assembly 500, the notification unit 930 notifies the worker in an audio or visual manner. For example, the monitor 930 may be used as the notification unit 930. However, the shape of the notification unit 930 is not limited thereto, and may notify the operator of the abnormal signal in various ways.

In this way, it is possible to check whether the assembly of the magnet assembly 500 is defective before supplying the coolant, thereby preventing a safety accident or contamination and damage of the equipment due to the coolant leak.

In addition, since the cooling water is not supplied into the magnet assembly 500, when the defect occurs, the cooling water is discharged from the magnet assembly 500 or the chamber 100 or the clean room into which the cooling water is introduced is performed. You can't. Thus, the work can be simplified and the working time can be shortened to improve the work efficiency.

In addition, since the assembling state of the magnet assembly is checked by using the numerical data, accurate and thorough diagnosis is possible than when visually checking. And, using the pressure measuring device 800 and the controller 900 can automatically determine whether the assembly of the magnet assembly is defective can be improved the efficiency of the work.

Hereinafter, a method for checking a magnet assembly assembly state according to an embodiment of the present invention will be described in detail.

Referring to FIG. 4, a method of checking a magnet assembly assembly state according to an embodiment of the present invention is a method of assembling a magnet assembly connected to a coolant processor of a substrate processing apparatus, and assembling the magnet assembly (S100), inside the magnet assembly. Supplying a furnace gas (S200), and monitoring the pressure inside the magnet assembly (S300). In this case, assembling the magnet assembly may be a task of separating the used target from the magnet assembly and mounting a new target.

In the case of replacing the target, before mounting the target to the magnet assembly 500, the step of stopping the cooling water supply to the magnet assembly 500, and the process of discharging the coolant inside the magnet assembly 500 to the outside Can be.

In the sputtering process of depositing a film on the substrate S by using the target 400 and the magnet assembly 500, since the heat is generated inside the magnet assembly 500 by the target 400, the coolant is supplied to the magnet assembly 500. ). Therefore, the coolant supplied from the coolant processor 710 is supplied to the case 510 of the magnet assembly 500 via the first supply pipe 722, the first valve passage of the path changer 750, and the second supply pipe 721. do. The magnet assembly 500 is cooled and the circulated coolant is recovered to the cooler processor 710 through the coolant return pipe 730.

Meanwhile, in order to replace the target with a new target, the target attached to the plate 410 must be separated and replaced. To this end, first, the plate 410 coupled to the magnet assembly 500 is separated from the magnet module. Since the cooling water is exposed when the cooling water in the magnet assembly 500 is removed without being removed, the operation of completely discharging the cooling water must be preceded.

In the case of discharging the coolant, when the path changer 750 is switched to the second valve passage, the coolant supplied from the coolant processor includes the first supply pipe 722, the second valve passage of the path switcher 750, and the coolant bypass pipe ( 770 and the coolant recovery pipe 730 are returned to the coolant processor 710. Therefore, the coolant does not flow into the magnet assembly 500. In addition, gas is introduced into the magnet assembly 500 to push the remaining coolant remaining in the magnet assembly 500 to the coolant recovery pipe 730 to discharge the coolant to the coolant processor 710.

Thereafter, the gas supplier 740 is controlled to stop the gas supply to the magnet assembly 500. After that, the plate is detached from the magnet module housing, and then the plate on which the new target is mounted is mounted. Therefore, since no coolant exists in the magnet assembly, even if the plate 410 is separated from the magnet assembly 500, the coolant does not flow out.

At this time, the coolant supplied to the magnet assembly 500 may leak to the outside due to a problem such as a poor coupling state between the new target and the magnet assembly 500 or damage to the coupling surface O-ring. Therefore, after replacing and mounting the target, it is necessary to check whether the assembly of the magnet assembly 500 is good or bad.

In order to check this, first, the supply path of the coolant supplied to the magnet assembly 500 at any time before, during, or after mounting the target 400 to the magnet assembly 500 is determined. By connecting to the recovery path of the cooling water to maintain the state of bypassing the cooling water.

 After mounting the target 400 to the magnet assembly 500, the gas supply 740 is controlled to supply gas into the magnet assembly 500. The gas is circulated through the magnet assembly 500 and then discharged to the coolant processor 710 through the recovery path of the coolant. At this time, the supply pressure of the gas may be greater than or equal to the cooling water supply pressure of the cooling water processor 710.

The supply path of the cooling water supplied to the magnet assembly 500 is connected to the recovery path of the cooling water connected to the discharge path of the gas supplied into the magnet assembly 500. The internal pressure of the magnet assembly 500 rises as gas is supplied, and some of the gas is discharged through the coolant recovery pipe 730.

On the other hand, the coolant recovery pipe 730 is provided with a coolant check valve 760 may maintain a constant pressure in the magnet assembly 500 or the first recovery pipe 732. That is, when the cooling water of the cooling water processor 710 bypasses, a pressure equal to or similar to the cooling water supply pressure is formed at the connection portion between the cooling water bypass pipe 770 and the cooling water recovery pipe 730. Therefore, when the pressure is increased by supplying gas into the magnet assembly 500, a part of the gas opens the coolant check valve 760 to move toward the coolant processor 710. At this time, the coolant check valve 760 opens the path of the gas only until the pressure inside the magnet assembly 500 is lowered to be equal to or similar to the coolant supply pressure due to the pressure formed on the coolant processor 710. Thus, the pressure inside the magnet assembly 500 is equal to or similar to the cooling water supply pressure.

That is, the pressure inside the magnet assembly 500 is greater than or equal to the supply pressure of the cooling water and is kept smaller than the supply pressure of the gas. For example, the internal pressure of the magnet assembly 500 may maintain 1 bar equal or similar to the cooling water supply pressure. Thus, the supply pressure of the cooling water becomes a value comparable with the pressure inside the magnet assembly 500 measured by the pressure gauge 800.

That is, when the cooling water supply pressure of the cooling water processor 710 is 1 bar (bar) and the gas supply pressure of the gas supply 740 is 1.5 bar, a pressure of 1 bar is formed at the rear end of the cooling water check valve 760, A pressure of 1.5 bar can be formed. Then, since the pressure at the front end of the coolant check valve 760 is greater than the rear end, the gas moves through the coolant check valve 760 until it is equal to or similar to the coolant supply pressure. That is, when the pressures of the front and rear ends of the coolant check valve 760 are the same or similar, the gas may not move to the rear end of the coolant check valve 760 through the coolant check valve 760, and thus the two pressure values may be the same or similar.

Therefore, when the two pressure values are the same or similar, the rear end of the coolant check valve 760, that is, the inside of the magnet assembly 500 is sealed. Thus, when a leak occurs in the magnet assembly 500, since the gas is discharged to the outside through the leaked portion, the pressure in the magnet assembly 500 decreases below the cooling water supply pressure. That is, by checking the pressure change in the sealed magnet assembly 500, it is possible to check whether the leak occurs in the magnet assembly 500.

Due to the organic pressure of the gas supplied from the gas supply 740 and the coolant check valve 760, the gas supply 740 supplies the pressure greater than or equal to the cooling water supply pressure of the cooling water processor 710. The pressure inside 500 may be easily adjusted to be the same as or similar to the cooling water supply pressure of the cooling water processor 710. In addition, since the pressure inside the magnet assembly 500 is the same as or similar to the supply pressure of the cooling water, the pressure inside the magnet assembly 500 becomes the same or similar to the pressure when the actual cooling water is supplied. In general, the leak in a confined space depends on the pressure. Therefore, since the leakage occurs in the magnet assembly 500 under the actual supply pressure of the cooling water, it is possible to more accurately check whether the leakage occurs under the actual pressure condition.

In order to confirm the occurrence of the leak by the above method, the pressure inside the magnet assembly 500 should not be reduced due to factors other than the leak. Therefore, the pressure behind the coolant check valve 760 must be kept constant at all times. If the pressure at the rear end of the coolant check valve 760 is reduced, the pressure inside the magnet assembly 500 is also reduced by the pressure change at the rear end. That is, the gas inside the magnet assembly 500 passes through the coolant check valve 760 until the pressures of the front and rear ends of the coolant check valve 760 become equal or similar. Therefore, in order to find the leak by measuring the pressure inside the magnet assembly 500 with the pressure gauge 800, it is necessary to bypass the cooling water and maintain the pressure at the rear end of the cooling water check valve 760 constant.

Then, after the gas supply is stopped into the magnet assembly 500, the pressure inside the magnet assembly 500 is monitored through the pressure meter 800. That is, while bypassing the coolant of the coolant processor 710, the pressure inside the magnet assembly 500 is measured. Then, the controller 900 performs a task of determining whether the pressure inside the magnet assembly 500 is abnormal.

The controller 900 compares the pressure value measured by the pressure measuring instrument 800 with a preset set value, and generates an abnormal signal when the measured pressure value is less than or equal to the set value. For example, when a defect occurs in the assembled state of the magnet assembly 500, the gas supplied into the magnet assembly 500 may leak as a broken portion. Therefore, when the pressure value measured by the magnet assembly 500 is lower than the cooling water supply pressure, it can be confirmed that a defect occurs in the assembled state of the magnet assembly 500.

At this time, the set value may be a value of 85 to 95% of the pressure value supplied to the cooling water. For example, if the cooling water supply pressure is 1 bar, the set value may be set between 0.85 ~ 0.95 bar. That is, when gas circulates inside the magnet assembly 500, the pressure inside the magnet assembly 500 may decrease due to the load. Therefore, the set value can be determined as 0.85-0.95 bar with an error of 0.05-0.15 bar. And, if the measured pressure value is measured below the set value, the controller 900 may determine that the state of the magnet assembly 500 is bad and may send an abnormal signal to the operator in an audio or visual manner.

On the other hand, after comparing the measured pressure value and the set value, if the measured pressure value is less than the set value is a failure in the magnet assembly 500. Thus, the operator reassembles the magnet assembly 500 when the controller 900 generates an abnormal signal. For example, the magnet assembly 500 may be assembled after repair or replacement. After reassembling the magnet assembly 500, the operation of supplying gas into the magnet assembly 500 and monitoring the pressure inside the magnet assembly 500 may be repeated. Therefore, after reassembly, the assembly state of the magnet assembly 500 is checked for abnormality.

In this way, it is possible to check whether the assembly of the magnet assembly 500 is defective before supplying the coolant, thereby preventing a safety accident or contamination and damage of the equipment due to the coolant leak.

In addition, since the cooling water is not supplied into the magnet assembly 500, when the defect occurs, the cooling water is discharged from the magnet assembly 500 or the chamber 100 or the clean room into which the cooling water is introduced is performed. You can't. Thus, the work can be simplified and the working time can be shortened to improve the work efficiency.

In addition, since the assembling state of the magnet assembly is checked by using the numerical data, accurate and thorough diagnosis is possible than when visually checking. And, using the pressure measuring device 800 and the controller 900 can automatically determine whether the assembly of the magnet assembly is defective can be improved the efficiency of the work.

As described above, in the detailed description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined not only by the claims described below, but also by equivalents thereof.

100: chamber 200: substrate support
300: vacuum former 400: target
500: magnet assembly 600: driver
710: coolant processor 720: coolant supply pipe
730: coolant recovery pipe 740: gas supply
750: path changer 760: coolant check valve
800: pressure gauge 900: controller

Claims (15)

Method for checking the assembly of the magnet assembly connected to the coolant processor of the substrate processing apparatus,
Assembling the magnet assembly;
Supplying gas into the magnet assembly; And
And monitoring the pressure inside the magnet assembly. The method according to claim 1,
Supplying a gas into the magnet assembly,
And maintaining the pressure inside the magnet assembly equal to or greater than the cooling water supply pressure of the cooling water processor. The method according to claim 2,
Maintaining the pressure inside the magnet assembly is greater than or equal to the cooling water supply pressure of the cooling water processor, and the process of monitoring the pressure inside the magnet assembly,
And a switching path of the coolant supplied to the magnet assembly to a return path of the coolant connected to a discharge path of the gas supplied into the magnet assembly. The method according to claim 1,
In the process of supplying gas into the magnet assembly,
And a supply pressure of the gas is greater than or equal to the cooling water supply pressure of the cooling water processor. The method according to claim 1,
The process of monitoring the pressure inside the magnet assembly,
Measuring the pressure inside the magnet assembly while bypassing the coolant in the coolant processor, and determining whether the pressure inside the magnet assembly is abnormal. The method according to claim 5,
The process of determining whether the pressure inside the magnet assembly is abnormal,
And comparing the measured pressure value with a preset set value, and generating an abnormal signal when the measured pressure value is less than the set value. The method according to claim 6,
The set value is a method of checking the assembly state of the magnet assembly is 85 to 95% of the pressure value supplied to the cooling water. The method according to claim 6,
After comparing the measured pressure value and the set value,
And reassembling the magnet assembly if the measured pressure value is less than or equal to the set value. The method according to claim 8,
After reassembling the magnet assembly,
And a process of supplying gas into the magnet assembly and monitoring the pressure inside the magnet assembly. A chamber having an inner space;
A substrate support for supporting a substrate in the internal space;
A target disposed to face the substrate support;
A magnet assembly disposed on one side of the target and generating a magnetic force;
A coolant processor for supplying or recovering coolant to the magnet assembly;
A coolant pipe forming a path through which the coolant moves and having one end connected to the magnet assembly and the other end connected to the coolant processor;
A gas supplier in communication with the cooling water pipe to supply gas into the magnet assembly; And
And a pressure gauge which monitors the pressure inside the magnet assembly to check the assembly state of the magnet assembly and is installed on the magnet assembly or the cooling water pipe. The method according to claim 10,
The cooling water pipe may include a cooling water supply pipe forming a moving path of the cooling water supplied from the cooling water processor to the magnet assembly, and a cooling water recovery pipe forming a moving path of the cooling water recovered from the magnet assembly to the cooling water processor.
And a coolant bypass pipe connected to the coolant supply pipe to bypass the movement path of the coolant supplied to the magnet assembly, and a coolant bypass pipe connected to the coolant return pipe at one end thereof and connected to the coolant return pipe at the other end thereof.
And the path diverter monitors the pressure inside the magnet assembly while bypassing the coolant. The method according to claim 11,
The gas is discharged through the cooling water recovery pipe after circulating inside the magnet assembly,
The gas supplier is a substrate processing apparatus for supplying a gas at a pressure greater than or equal to the cooling water supply pressure of the cooling water processor. The method according to claim 11,
And a coolant check valve disposed between the connection portion of the coolant return pipe and the coolant bypass tube and the magnet assembly.
And the pressure gauge is disposed in a coolant movement path between the gas supply and the coolant check valve. The method according to claim 11,
The cooling water processor further comprises a gas discharge unit connected to the cooling water recovery pipe to discharge the gas supplied to the magnet assembly to the outside. The method according to claim 10,
It is connected to the pressure meter further comprises a controller for determining whether or not the pressure inside the magnet assembly,
The controller may include a transceiver configured to exchange a signal with the pressure gauge, a determiner configured to compare the pressure value transmitted to the transceiver to a preset set value, and be connected to the determiner so that the measured pressure value is less than the set value. Substrate processing apparatus including a notification unit for generating a back signal.
KR1020150048345A 2015-04-06 2015-04-06 Substrate Processing Apparatus and Inspection Method of Magnet Assembly KR102007867B1 (en)

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