KR20160118807A - Flexible package - Google Patents

Flexible package Download PDF

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Publication number
KR20160118807A
KR20160118807A KR1020150047558A KR20150047558A KR20160118807A KR 20160118807 A KR20160118807 A KR 20160118807A KR 1020150047558 A KR1020150047558 A KR 1020150047558A KR 20150047558 A KR20150047558 A KR 20150047558A KR 20160118807 A KR20160118807 A KR 20160118807A
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KR
South Korea
Prior art keywords
flexible substrate
arranging
holes
guide
wiring
Prior art date
Application number
KR1020150047558A
Other languages
Korean (ko)
Inventor
정정태
Original Assignee
에스케이하이닉스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스케이하이닉스 주식회사 filed Critical 에스케이하이닉스 주식회사
Priority to KR1020150047558A priority Critical patent/KR20160118807A/en
Priority to CN201521053630.1U priority patent/CN205752138U/en
Publication of KR20160118807A publication Critical patent/KR20160118807A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms

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  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Provided is a flexible package. The flexible package includes: a flexible substrate including a folding unit making connection such that a second device arrangement unit is located in the upper side of a first device arrangement unit, and providing a first through hole adjacently located in the first device arrangement unit and a second through hole adjacently located in the second device arrangement unit and overlapping the first through hole: and a guide pole inserted so as to continuously penetrate the first and second through holes and inducing the first or second arrangement unit to slide so as to vary a separation distance between the first and second arrangement units.

Description

[0001] The present invention relates to a flexible package,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to package technology, and more particularly to a flexible package for mounting a plurality of electronic devices.

Electronic products such as mobile devices are becoming smaller and smaller, and demand for high-capacity data processing is increasing. As the weight and size of electronic products are reduced, packages of semiconductor devices required for these products are required to have thinner and smaller size products. In addition, with increasing interest in mobility and wearable electronics, there is a growing demand for flexible features that can bend into electronic products. Flexible characteristics are also required for electronic components such as a semiconductor package constituting an electronic product.

This application proposes a flexible package for mounting a plurality of electronic elements.

According to an aspect of the present invention, there is provided a semiconductor device, including a folding portion for connecting a second element placement portion to an upper side of a first element placement portion, wherein a first through hole located near the first element placement portion, A flexible substrate provided adjacent to the element arrangement portion and providing a second through hole positioned to overlap the first through hole; And guide pawls inserted to pierce the first and second through holes to guide the first or second element placement portion to vary the spacing between the first and second element placement portions, and a guide pole.

According to another aspect of the present application, there is provided a semiconductor device, comprising: a folding portion for connecting a second element placement portion to an upper side of a first element placement portion, the first through hole located near the first element placement portion, A flexible substrate provided adjacent to the two-element disposing portion and providing a second through-hole positioned to overlap the first through-hole; A first element embedded in the first element arrangement; And guide pawls inserted to pierce the first and second through holes to guide the first or second element placement portion to vary the spacing between the first and second element placement portions, and a guide pole.

According to another aspect of the present application, there is provided a semiconductor device, comprising: a folding portion for connecting a second element placement portion to an upper side of a first element placement portion, the first through hole located near the first element placement portion, A flexible substrate provided adjacent to the two-element disposing portion and providing a second through-hole positioned to overlap the first through-hole; A first element mounted on a surface of the first element arrangement; And guide pawls inserted to pierce the first and second through holes to guide the first or second element placement portion to vary the spacing between the first and second element placement portions, and a guide pole.

According to the embodiments of the present application, a flexible package for mounting a plurality of electronic elements is proposed.

FIGS. 1 to 4 are views for explaining a flexible package according to an example.
5 and 6 are diagrams for illustrating a flexible package according to another example.

The terms used in describing the example of the present application are selected in consideration of the functions in the illustrated embodiments, and the meaning of the terms may be changed according to the intentions or customs of the user, the operator in the technical field, and so on. The meaning of the term used is in accordance with the defined definition when specifically defined in this specification and can be interpreted in a sense generally recognized by those skilled in the art without specific definition. In the description of the examples of the present application, descriptions such as " first "and" second "are for distinguishing members, and are not used to limit members or to denote specific orders.

The flexible package may include electronic elements such as a semiconductor chip, and the semiconductor chip may include a form in which a semiconductor substrate on which electronic circuits are integrated is cut into die form. The semiconductor chip may be a memory chip integrated with a memory integrated circuit such as DRAM, SRAM, FLASH, MRAM, ReRAM, FeRAM or PcRAM, or a logic chip integrated with a logic circuit on a semiconductor substrate . The flexible package can be applied to an information communication device such as a portable terminal, a bio or a health care related electronic device, or a wearable electronic device.

1 and 2 show a flexible package according to an example.

1, the flexible package 10 may include a flexible substrate 200 on which the elements 100 are disposed and a guide pole 300. The flexible substrate 200 can be introduced into a flexible member which can be bent, bent or folded. The flexible substrate 200 may include wiring portions 210, 230, and 250 for electrical connection.

The first wiring portion 210 may be provided on the first surface 221, which may be any one surface of the flexible substrate 200, including trace patterns constituting the wiring circuit. The first wiring part 210 may include various shapes of trace patterns that are separated or extended from each other. For example, the first wiring portion 210 may be provided, including the trace patterns 211 and extending portions 213 interconnecting the trace patterns 211.

The second wiring portion 250 may be provided on the second surface 223 located in a direction opposite to the first surface 221 of the flexible substrate 200. The second wiring portion 250 may be provided in a pattern providing a first contact portion as a member for electrical connection with other external members, for example, a board 400. The first contact may have a landing pad shape for electrical connection. The second wiring portion 250 may be disposed on a portion of the flexible substrate 200 facing the board 400, for example, a portion of the second surface 223 corresponding to the first element placement portion 201A.

The first element placement unit 201A may be positioned so as to overlap on the board 400. [ The third wiring part 450 providing the second contacts corresponding to the first contact part of the second wiring part 250 disposed on the second surface 223 of the first element placement part 201A is electrically connected to the board 400 ). ≪ / RTI > The third wiring portion 450 may have circuit wiring patterns that provide the second contacts. The connection portion 470 may be further provided between the second contact portion and the first contact portions and electrically coupled to each other. The connection coupling part 470 may be introduced into a conductive adhesive member in the form of a bump or a solder ball.

The first and second wiring portions 210 and 230 located on the first and second surfaces 221 and 223 and the second internal connection portion 230 electrically connecting the second wiring portion 250 are electrically connected to the flexible substrate 200). The second internal connection part 230 may be provided as a connection wiring part connecting the first and second wiring parts 210 and 250 to each other and may include a second via via shape substantially passing through the flexible substrate 200 As shown in Fig.

The flexible substrate 200 may be provided such that a folding portion 203 for bending and folding is disposed between the regions of the element placement portion 201 and the element placement portion 201 and the folding portion 203 are repeatedly arranged . For example, the flexible substrate 200 may be provided in such a manner that the first element arranging section 201A and the second element arranging section 201B are arranged successively and the folding section 203 is disposed therebetween. The flexible substrate 200 may be provided such that the third element arranging portion 201C is arranged in succession to the second element arranging portion 201B and the folding portion 203 is disposed therebetween. A plurality of folding units 203 and device arranging units 201 may be further provided in succession to the third device arranging unit 201C.

A region between the element placement unit 201 and the folding unit 203 or between the edge placement region 201 of the flexible substrate 200 and the element placement unit 201 May be set as a guiding portion 205 area. The guide portion 205 may have through holes 290 through which the guide poles 300 are inserted. The through holes 290 may pass through the flexible substrate 200 and pass through the guide poles 300 through the flexible substrate 200.

The device arrangement region 201 can be set as an area in which the devices 100 are disposed and the device 100 is embedded in the flexible substrate 200 in the device arrangement region 201 to form an embedded package, Shape can be implemented. The embedded device 100 may be an active device including a memory chip or a logic chip. The embedded device 100 may be an optical device such as an image sensor or a light emitting device. The embedded element 100 may be a passive element such as a capacitor element, a resistive element, an inductor, an antenna, or a Micro-Electro-Mechanical System device.

The element 100 embedded in the flexible substrate 200 is formed by the first internal connection part 110 which substantially constitutes the flexible substrate 200 and substantially encloses the dielectric layer part which impregnates and covers the element 100 therein, And may be electrically connected to a portion of the third contact portion provided as a part of the portion 210. [ The first internal connection part 110 may be introduced into a bump-shaped or first via-shaped connecting member. One or a plurality of elements 100 may be arranged side by side or a plurality of elements may be stacked in the element arrangement section 201. In some cases, the elements 100 may not be disposed in some element placement portions 201. [

The folding unit 203 may be bent and folded so that the second element placement unit 201A is positioned above the first element placement unit 201A. At this time, the second element arranging unit 201B may be placed in contact with or spaced apart from the first element arranging unit 201A. A separate adhesive layer for fastening them to each other is omitted between the second element arranging portion 201B and the first element arranging portion 201A which is positioned so as to overlap with the second element arranging portion 201B so that the position of the second element arranging portion 201B is Can be varied with respect to the position of the one-element arrangement section 201A. The spacing between the second element arranging portion 201B and the first element arranging portion 201A can be changed in the external environment 201B because the second element arranging portion 201B can be changed without being fixed to the first element arranging portion 201A, As shown in FIG.

Referring to FIG. 2 together with FIG. 1, the spacing between the second element arranging portion 201B and the first element arranging portion 201A may be shortened or increased by a force applied by an external environment. The guide pawl 300 can be inserted to penetrate the through holes 290 so that the movement of the second element arranging unit 201B in the upward and downward directions is guided along a constant orbit. The guide pawl 300 is arranged on the first through hole 290A in the vicinity of the first through hole 290A and the folded second element placement portion 201B located near the first element placement portion 201A, Hole 290B which can be inserted into the through hole 290B. Accordingly, the second element placement portion 201B is allowed to move up and down along the fixed guide pawl 300. The movement of the second element arranging portion 201B in the horizontal direction perpendicular to the guide pawl 300 is restricted by the guide pawl 300 so that the second element arranging portion 201B is moved by the first element arranging portion 201A, The folded state in which it is positioned so as to be superimposed on the folded state can be maintained. A plurality of guide pawls 300 may be disposed on both sides of the element arranging unit 201.

The first end 310 of one of the guide pawls 300 is provided with a bar bar that restricts the folding of the folded portion such as the third element placement portion 201C or the second element placement portion 201B, 330 may be provided. The limiting bar 330 may be provided in a rivet shape at the first end 310 of the guide pole 310 having a pin shape. The second end 340, which is the other end of the guide pawl 300, may be fixed to the board 400, which may be a module board or a main board. The board 400 may have a fixing groove 434 into which the second end portion 340 of the guide pawl 300 is to be inserted and a second end portion 340 inserted in the fixing groove 434 is fixed A fixture 434, such as a material, may be provided.

The second element placement portion 201B or the third element placement portion 201C of the flexible substrate 200 can slide along the guide pawl 300 and can be moved up and down.

3 shows the guide pawl 300 inserted into the through hole 290 of the flexible substrate 200. Fig.

Referring to FIG. 3, the flexible substrate 200 provides through holes 290 passing through the body, and the guide poles 300 can be inserted through the through holes 290. The portion of the first wiring portion 210 located around the through hole 290, for example, the trace pattern 211A may be disposed so as not to be in electrical contact with the guide pawl 300. The extended portions 213A of the first wiring portion 210 are disposed so as to pass through the through holes 290 so that they are arranged to interconnect the trace patterns 211A located on both sides of the through hole 290 . The spacing portion 209 between the extended portion 213A and the trace pattern 211A is set as a dielectric layer region constituting the flexible substrate 200 so that the guide pawl 300 and the first wiring portion 210 are electrically connected Can be prevented. Accordingly, the guide pawl 300 may be formed of a conductive material or a metal material as well as an insulating material.

4 shows a shape in which the flexible substrate 200 is unfolded.

4, in the flexible substrate 200, a folding section 203 is arranged in a continuous manner in the first element arranging section 201A, and a second element arranging section 201B and the like are successively arranged in the folding section 203 Lt; / RTI > The first element arranging portion 201A of the flexible substrate 200 is mounted and fastened on the board 400 by using the connection fastening portion 470 or the like and the folding portion 203 is bent, The second element arranging unit 201B is positioned so as to overlap on the first element arranging unit 201A and the third element arranging unit 201C is positioned so as to overlap on the second element arranging unit 201B, . Thereafter, the flexible package (10 of FIG. 1) can be assembled by inserting and fixing a guide pole (300 in FIG. 1) so as to pass through the through holes 290.

5 and 6 show a flexible package according to another example.

5, the flexible package 50 may include a flexible substrate 2200 and guide pawls 2300 on which the elements 2100 are disposed on the first surface 2221. The flexible substrate 2200 may have wiring portions 2210, 2230, and 2250 for electrical connection.

The first wiring portion 2210 may be provided on the first surface 2221 of the flexible substrate 2200, including the trace patterns constituting the wiring circuit. The first wiring portion 2210 may include various shapes of trace patterns that are separated or extended from each other. For example, the first wiring portion 2210 may be provided including the trace patterns 2211 and extending portions 2213 interconnecting them.

The second wiring portion 2250 may be provided on the second surface 2223 of the flexible substrate 2200. The second wiring portion 2250 may be provided in a pattern for providing a first contact portion as a member for electrical connection with other external members, for example, the board 2400. The first contact may have a landing pad shape for electrical connection. The second wiring portion 2250 may be disposed on a portion of the flexible substrate 2200 facing the board 2400, for example, a portion of the second surface 2223 corresponding to the first element placement portion 2201A.

The first element arranging unit 2201A may be placed on the board 2400 so as to overlap. The third wiring portion 2450 providing the second contacts corresponding to the first contact portion of the second wiring portion 2250 disposed on the second surface 2223 of the first element placement portion 2201A is electrically connected to the board 2400 ). ≪ / RTI > The third wiring portion 2450 may have circuit wiring patterns that provide the second contacts. And a connection coupling part 2470 which is introduced between the second contact part and the first contact parts and electrically connected to each other. The connection coupling portion 2470 can be introduced into a conductive adhesive member in the form of a bump or a solder ball.

A first internal wiring portion 2230 electrically connecting the first wiring portion 2210 and the second wiring portion 2250 located on different first and second surfaces 2221 and 2223 is electrically connected to the flexible substrate 2200). The second internal connection part 2230 may be provided as a connection wiring part for interconnecting the first and second wiring parts 2210 and 2250 and may have a second via via shape substantially passing through the flexible substrate 2200 As shown in Fig.

The flexible substrate 2200 may be provided such that a folding portion 2203 which is folded and folded between the regions of the element placement portion 2201 is disposed and the element placement portion 2201 and the folding portion 2203 are repeatedly arranged. For example, the flexible substrate 2200 may be provided in such a manner that the first element arranging portion 2201A and the second element arranging portion 2201B are arranged successively and the folding portion 2203 is disposed therebetween. The flexible substrate 2200 may be provided such that the third element arranging portion 2201C is arranged in succession to the second element arranging portion 2201B and the folding portion 2203 is arranged therebetween. A plurality of folding units 2203 and device arranging units 2201 may be further provided in succession to the third device arranging unit 2201C.

The area between the element placement unit 2201 and the folding unit 2203 or between the edge end region 2207 of the flexible substrate 2200 and the element placement unit 2201 May be set as the guide section 2205 area. The guide part 2205 may have through holes 2290 through which the guide pawls 2300 are inserted. The through holes 2290 may be provided so as to substantially penetrate the flexible substrate 2200 and penetrate the guide poles 2300 through the inside thereof.

The element placement area 2201 may be set as an area in which the elements 2100 are arranged and the element 2100 may be mounted or stacked on the flexible board 2200 area of the element placement area 2201 . The device 2100 may be an active device including a memory chip or a logic chip. The element 2100 may be an optical element such as an image sensor or a light emitting element. The device 2100 may be a passive device such as a capacitor device, a resistive device, an inductor, an antenna, or a Micro-Electro-Mechanical System device.

The element 2100 stacked and mounted on the flexible substrate 2200 is fastened to a portion of the third contact portion provided as a part of the first wiring portion 2210 disposed on the first surface 2221 of the flexible substrate 2200 And may be electrically connected to the first wiring portion 2210 by an external connection portion 2110. The external connection portion 2110 may include an interconnection member such as a bump shape or a bonding wire in some cases. One or a plurality of the elements 2100 may be arranged side by side or may be mounted on the first surface 2221 of the flexible substrate 2200 in a stacked manner. The element 2100 disposed on the second element placement portion 2201B may be mounted at a position opposite to the element 2100 disposed on the first element placement portion 2201A. In some cases, the elements 2100 may not be disposed on some element placement portions 2201. [

The folding unit 2203 may be bent and folded so that the second element arranging unit 2201A is positioned above the first element arranging unit 2201A. At this time, the second element arranging unit 2201B may be placed in contact with the first element arranging unit 2201A or spaced apart from the first element arranging unit 2201A.

Referring to FIG. 6 together with FIG. 5, a distance between the second element arranging portion 2201B and the first element arranging portion 2201A may be shortened or increased by a force applied by an external environment. The guide pawls 2300 can be inserted so as to penetrate the through holes 2290 so that the movement of the second element arranging unit 2201B in the upward and downward directions is guided along a constant orbit. The guide pawl 2300 is arranged adjacent to the first through hole 2290A and the folded second element placement portion 2201B located near the first element placement portion 2201A and aligned on the first through hole 2290A Hole 2290B which can be inserted through the through-hole 2290B. Accordingly, the second element arranging portion 2201B is allowed to move upwardly and downwardly along the fixed guide pawls 2300. The movement of the second element arranging portion 2201B in the horizontal direction perpendicular to the guide pawl 2300 is restricted by the guide pawl 2300 so that the second element arranging portion 2201B is moved by the first element arranging portion 2201A, The folded state in which it is positioned so as to be superimposed on the folded state can be maintained. A plurality of guide pawls 2300 may be disposed on both sides of the element arranging unit 2201.

The first end 310 of the guide pawl 2300 may be provided with a limiting bar 2330 which restricts the folding of the folded portion such as the third element arranging portion 2201C or the second element arranging portion 2201B . The second end 2340, which is the other end of the guide pawl 2300, may be fixed to a board 2400, which may be a module board or a main board. The board 2400 may have a fixing groove 2434 into which the second end portion 2340 of the guide pawl 2300 may be inserted and may be fixed to the fixing groove 2434 by an adhesive A fixture 2434, such as a material, may be provided.

Although the embodiments of the present application as described above illustrate and describe the drawings, it is intended to illustrate what is being suggested in the present application and is not intended to limit what is presented in the present application in a detailed form. Various other modifications will be possible as long as the technical ideas presented in this application are reflected.

100: element,
200: flexible substrate,
300: Guide Paul.

Claims (21)

And a folding part for connecting the second element arranging part to the upper side of the first element arranging part, wherein the first through hole is located near the first element arranging part, A flexible substrate provided with a second through hole positioned to overlap with the first through hole; And
A guide pole inserted into the first and second through holes so as to extend through the first and second through holes and guiding the first or second element placement section to be slid so as to vary the spacing between the first and second element placement sections guide poles. The method according to claim 1,
The guide poles
Wherein a plurality of the first and second element arranging portions are arranged on both sides of the first element arranging portion. The method according to claim 1,
The guide poles
And a limiting bar at one end for blocking and restricting the deviation of the second device arranging portion. The method of claim 3,
Further comprising a board for providing a fixing portion to which the other end opposite to the one end of the guide pole is inserted and fixed. The method according to claim 1,
The flexible substrate
And a first wiring portion extending beyond the first and second element arranging portions and the folding portion. 6. The method of claim 5,
The first wiring portion
And the first and second through holes are extended to bypass the first and second through holes so as not to be in contact with the guide pawl. 6. The method of claim 5,
The flexible substrate
A second wiring portion for providing a first contact portion located on another surface opposite to one surface of the first element arrangement portion where the first wiring portion is located; And
And an internal connection portion penetrating the flexible substrate to connect the second wiring portion and the first wiring portion. 8. The method of claim 7,
A board for providing a second contact corresponding to the first contact; And
And a connection fastening part for connecting and interconnecting between the first and second contact parts. And a folding part for connecting the second element arranging part to the upper side of the first element arranging part, wherein the first through hole is located near the first element arranging part, A flexible substrate provided with a second through hole positioned to overlap with the first through hole;
A first element embedded in the first element arrangement; And
A guide pole inserted into the first and second through holes so as to extend through the first and second through holes and guiding the first or second element placement section to be slid so as to vary the spacing between the first and second element placement sections guide poles. 10. The method of claim 9,
The guide poles
And a limiting bar at one end for blocking and restricting the deviation of the second device arranging portion. 11. The method of claim 10,
Further comprising a board for providing a fixing portion to which the other end opposite to the one end of the guide pole is inserted and fixed. 10. The method of claim 9,
The flexible substrate
A first wiring part extending through the first and second device arranging parts and the folding part; And
And a first internal connection portion connecting the first element to the first wiring portion. 13. The method of claim 12,
The first wiring portion
And the first and second through holes are extended to bypass the first and second through holes so as not to be in contact with the guide pawl. 13. The method of claim 12,
The flexible substrate
A second wiring portion for providing a first contact portion located on another surface opposite to one surface of the first element arrangement portion where the first wiring portion is located; And
And a second internal connection portion penetrating the flexible substrate to connect the second wiring portion and the first wiring portion. 15. The method of claim 14,
A board for providing a second contact corresponding to the first contact; And
And a connection fastening part for connecting and interconnecting between the first and second contact parts. 10. The method of claim 9,
The first element
A flexible package that is an active element including a memory chip or a logic chip. 10. The method of claim 9,
The first element
A flexible package that is a passive element that includes a capacitor element, a resistor element, an inductor, an antenna, or a Micro-Electro-Mechanical System device. 10. The method of claim 9,
And a second element embedded in the second element arrangement portion. And a folding part for connecting the second element arranging part to the upper side of the first element arranging part, wherein the first through hole is located near the first element arranging part, A flexible substrate provided with a second through hole positioned to overlap with the first through hole;
A first element mounted on a surface of the first element arrangement; And
A guide pole inserted into the first and second through holes so as to extend through the first and second through holes and guiding the first or second element placement section to be slid so as to vary the spacing between the first and second element placement sections guide poles. 20. The method of claim 19,
The flexible substrate
A first wiring part extending through the first and second device arranging parts and the folding part; And
And an external connection portion connecting the first element to the first wiring portion. 20. The method of claim 19,
And a second element mounted on the surface of the second element arrangement portion so as to face the first element.
KR1020150047558A 2015-04-03 2015-04-03 Flexible package KR20160118807A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150047558A KR20160118807A (en) 2015-04-03 2015-04-03 Flexible package
CN201521053630.1U CN205752138U (en) 2015-04-03 2015-12-16 flexible package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150047558A KR20160118807A (en) 2015-04-03 2015-04-03 Flexible package

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KR20160118807A true KR20160118807A (en) 2016-10-12

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KR1020150047558A KR20160118807A (en) 2015-04-03 2015-04-03 Flexible package

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