KR20160091146A - light-emitting diode package having double lens and method for fabricating the same - Google Patents

Abstract

The present invention relates to an ultraviolet light-emitting diode package having a double-lens structure. The light-emitting diode package comprises: a base; an ultraviolet light-emitting diode chip installed on the base; a first lens for covering the ultraviolet light-emitting diode chip; and a second lens for covering the first lens. The shore hardness of the second lens is higher than the shore hardness of the first lens, a lower surface of the second lens comes into contact with the base, and the second lens includes a dicing surface located on a side thereof. Therefore, burr can be prevented from being generated on the dicing surface located on the side of the second lens, crack can be prevented from being generated on the first lens by heat when the light-emitting diode package is operated for a long time, and thus the reliability and the light-emitting efficiency for the light-emitting diode package can be improved.

Description

 BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an ultraviolet light emitting diode package having a double lens structure,

The present invention relates to an ultraviolet light emitting diode package, and more particularly, to a highly reliable ultraviolet light emitting diode package including a double lens structure.

Light emitting diodes (LEDs) are solid state devices that convert electrical energy into light and generally comprise an active layer of one or more semiconductor materials interposed between semiconductor layers doped with opposite conductivity type impurities. When a bias is applied across these doping layers, electrons and holes are injected into the active layer and recombined to generate light. Particularly, ultraviolet light emitting diodes have a band gap of an ultraviolet light emitting region and can be used as UV curing, sterilization, white light source, medical field, and equipment accessories, and the use range thereof is increasing.

In general, a package type in which a light emitting diode chip is mounted on a substrate or a lead frame, and an upper portion of the light emitting diode chip is covered with a lens or the like is used. In the process of manufacturing the light emitting diode package, the lens and the substrate are diced using a dicing blade to individualize the light emitting diode package.

When the hardness of the lens is low, a burr is generated on the side of the light emitting diode package in the dicing step, so that the contaminants such as moisture can easily penetrate and the reliability of the package is deteriorated. In order to solve this problem, methods of increasing the hardness of the lens have been used. However, when a package using a lens having a high hardness is used for a long period of time, a crack occurs around the lens portion around the light emitting diode chip due to heat generated by light emission. Cracks generated in such a lens portion cause a specific deterioration of the light emitting diode package, thereby lowering the reliability of the light emitting diode package. In particular, in the case of using an ultraviolet light-emitting diode chip, the material of the lens is limited to be selected in order to prevent deformation of the lens due to ultraviolet rays. Among them, it is difficult to obtain a material which has a high hardness and can prevent a crack due to heat.

Therefore, there is a need for an ultraviolet light emitting diode package having a structure capable of preventing burrs during the dicing process and preventing cracks due to heat when the LED package is driven for a long period of time.

Disclosure of Invention Technical Problem [8] The present invention provides a UV light emitting diode package having improved reliability and light emitting efficiency by preventing cracking of the lens due to heat during long-term driving of the LED package.

A further object of the present invention is to provide a method of manufacturing an ultraviolet light-emitting diode package which manufactures a light-emitting diode package with improved reliability by preventing burrs on the dicing surface of a lens during a dicing step.

A light emitting diode package according to an embodiment of the present invention includes a base, an ultraviolet light emitting diode chip mounted on the base, a first lens covering the ultraviolet light emitting diode chip, and a second lens covering the first lens, Wherein a shore hardness of the second lens is higher than a shore hardness of the first lens, a lower surface of the second lens is in contact with the base, and the second lens has a dicing surface located on a side thereof. As a result, burrs can be prevented from being generated on the dicing surface located on the side surface of the second lens, and cracks can be prevented from being generated in the first lens due to heat during long-term driving of the LED package, The reliability and luminous efficiency of the diode package can be improved.

The Shore hardness of the second lens may be A80 or more or D30 or more. When the second lens satisfies the Shore hardness range, burrs may not occur on the dicing surface of the second lens during the dicing step.

The Shore hardness of the first lens may be A65 or less. When the first lens satisfies the Shore hardness range, it is possible to effectively prevent a crack from occurring in the first lens due to heat during long-term driving of the LED package.

The first lens may be at least one selected from the group consisting of a silicone molding material, an epoxy molding material, and a fluorine molding material.

The second lens includes a protruding portion projecting laterally, and the protruding portion may abut against the upper surface of the base. Accordingly, since the interface between the second lens and the base can be extended, the path through which contaminants such as moisture penetrate into the light emitting diode chip and the first lens can be increased, so that the reliability of the light emitting diode package can be improved .

The light emitting diode chip may emit light of 250 to 280 nm or 360 to 370 nm.

According to another aspect of the present invention, there is provided a method of fabricating a light emitting diode package, including: mounting a plurality of ultraviolet light emitting diode chips on a base; forming a plurality of first lenses covering the ultraviolet light emitting diode chips; Forming a plurality of second lenses that cover the lens, and dicing the base and the second lens to separate them. On the other hand, the Shore hardness of the second lens is higher than the Shore hardness of the first lens. As a result, burrs can be prevented from being generated in the second lens during the dicing process, so that the reliability of the light emitting diode package can be improved.

In the method of manufacturing the light emitting diode package, the Shore hardness of the second lens may be A80 or more or D30 or more. When the second lens satisfies the Shore hardness range, burrs may not occur on the dicing surface of the second lens during the dicing step.

In the method of manufacturing the light emitting diode package, the Shore hardness of the first lens may be A65 or less. When the first lens satisfies the Shore hardness range, it is possible to effectively prevent a crack from occurring in the first lens due to heat during long-term driving of the LED package.

The forming of the second lens may include forming a part of the second lens on the base between the ultraviolet light-emitting diode chips. In addition, dicing the base and the second lens to form a plurality of light emitting diode packages may include dicing the base and the second lens between the ultraviolet light emitting diode chips. Accordingly, since the interface between the second lens and the base can be extended, the path through which contaminants such as moisture penetrate into the light emitting diode chip and the first lens can be increased, so that the reliability of the light emitting diode package can be improved .

According to the embodiment of the present invention, burrs can be prevented from occurring on the dicing surface of the side surface of the second lens, and cracks can be prevented from occurring in the first lens by heat during long-term driving of the light emitting diode package Therefore, the reliability and luminous efficiency of the light emitting diode package can be increased.

1 is a perspective view illustrating a light emitting diode package according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a light emitting diode package according to an embodiment of the present invention.
3 is a cross-sectional view illustrating a light emitting diode package according to another embodiment of the present invention.
4 is a cross-sectional view illustrating a light emitting diode package according to another embodiment of the present invention.
5 to 8 are cross-sectional views illustrating a method of manufacturing a light emitting diode package according to another embodiment of the present invention.
9A and 9B are an exploded perspective view and a sectional view for explaining an example in which a light emitting diode package according to an embodiment of the present invention is applied to a display device.
10 (a) and 10 (b) are an exploded perspective view and a cross-sectional view, respectively, for explaining an example in which a light emitting diode package according to an embodiment of the present invention is applied to a display device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can sufficiently convey the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of components may be exaggerated for convenience. It is also to be understood that when an element is referred to as being "above" or "above" another element, But also includes the case where there are other components in between. Like reference numerals designate like elements throughout the specification.

1 and 2 are a perspective view and a cross-sectional view illustrating a light emitting diode package according to an embodiment of the present invention, respectively.

Referring to FIGS. 1 and 2, a light emitting diode package according to an embodiment of the present invention includes a base 100, an ultraviolet light emitting diode chip 110, a first lens 120, and a second lens 130.

The base 100 may include a PCB (Printed Circuit Board) or a lead frame. However, the present invention is not limited thereto. The base 100 may include a wiring that can be electrically connected to the UV LED chip 110. The base 100 applied to the light emitting diode package supports the ultraviolet light emitting diode chip 110, the first lens 120, and the second lens 130, and the ultraviolet light emitting diode chip 110, And supplies power to the external device.

The ultraviolet light-emitting diode chip 110 may include a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer may include a III-V compound semiconductor, for example, a nitride semiconductor such as (Al, Ga, In) N, have. The first conductivity type semiconductor layer may include an n-type impurity (for example, Si), and the second conductivity type semiconductor layer may include a p-type impurity (for example, Mg). It may also be the opposite. The active layer may comprise a multiple quantum well structure (MQW). When a forward bias is applied to the light emitting diode, electrons and holes are combined with each other in the active layer 112 to emit light. In order to emit ultraviolet rays, a nitride-based semiconductor having a bandgap that emits ultraviolet rays by adding Al to a specific composition may be used as the active layer. Depending on the composition of the active layer, the first conductive- The composition of the ternary elements of the ternary system may be varied. The wavelength of the light emitted from the ultraviolet light emitting diode chip 110 may be 360 to 370 nm, or alternatively may be a lower wavelength region, for example, 250 to 280 nm. The first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer may be grown on a growth substrate such as sapphire using techniques such as metalorganic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE). The manufactured ultraviolet light-emitting diode chip 110 may be mounted on the base 100. The ultraviolet light emitting diode chip 110 and the base 100 may be electrically connected through a wire W or a separate electrode on the ultraviolet light emitting diode chip 110. However,

The first lens 120 may cover the ultraviolet light-emitting diode chip. Specifically, the first lens 120 may be disposed on the upper surface and the side surface of the ultraviolet light emitting diode chip 110. Therefore, the light emitted from the upper surface and the side surface of the ultraviolet light emitting diode chip 110 passes through the first lens 120. The first lens 120 may have a semi-spherical convex lens shape, but is not limited thereto. The first lens 120 may have a concave lens shape or a flat top surface.

The shore hardness of the first lens 120 may be A65 or less. Shore hardness is a hardness value measured by a Shore hardness meter. Shore hardness is determined by measuring the raised height of a falling object that has a small diamond fixed at its end when dropped at a constant height. The higher the number of shore hardness, the higher the hardness, but even if the numbers are the same, the hardness is different if the letters in front are different. The alphabet indicates the type of indentor used for hardness measurement. When the shore hardness of the first lens 120 is equal to or less than A65, absorption of stress due to heat generated in the light emitting diode chip 110 is easy. Therefore, it is possible to prevent cracks from being generated in the first lens 120 due to heat when the light emitting diode package is driven for a long period of time. The first lens 120 may include at least one selected from the group consisting of a silicon molding material, an epoxy molding material, and a fluorine molding material. When a silicone molding material is used, it is preferable to use methyl silicone to prevent discoloration due to ultraviolet rays, but the present invention is not limited thereto.

The second lens 130 may cover the first lens 120. Specifically, a part or all of the exit surface of the first lens 120 can be contacted. Therefore, the light emitted from the exit surface of the first lens 120 can pass through the second lens 130. [ The second lens 130 may have the same shape as the first lens 120, but it is not limited thereto and may have a shape different from that of the first lens 120.

The lower surface of the second lens 130 can be in contact with the upper surface of the base 100. Accordingly, the first lens 120 is entirely covered by the second lens 130, so that the first lens 120 is not exposed to the outside of the LED package. Further, the second lens 130 may include a dicing surface D positioned on the side surface thereof. Since the present embodiment is formed by dicing and individualizing the plurality of second lenses 130, the side surface of the second lens 130 may include the dicing surface D.

The Shore hardness of the second lens 130 may be higher than the Shore hardness of the first lens 120. [ Thereby, when the second lens 130 is diced, the dicing surface D can be cut smoothly, so that no burr may occur on the dicing surface D of the second lens 130. [ Particularly, the lower surface of the second lens 130 according to the present embodiment can be in contact with the upper surface of the base 100. At this time, if burrs are formed on the dicing surface D of the second lens 130, the first lens 120 and the ultraviolet light-emitting diode chip 110 covered by the second lens 130 may be externally affected You may be damaged. According to the present embodiment, the burr-free second lens 130, which is generated on the dicing surface D, covers the first lens 120 to prevent the first lens 120 from contaminants such as moisture, And the ultraviolet light-emitting diode chip 110 can be more effectively protected. Accordingly, the reliability and light emitting efficiency of the light emitting diode package can be improved.

In addition, absorption of stress due to heat generated in the LED chip 110 can be facilitated by the first lens 120 having a Shore hardness lower than that of the second lens 130, It is possible to prevent cracks from being generated in the first lens 120 due to heat.

Specifically, the Shore hardness of the second lens 130 may be A80 or more or D30 or more. Occurrence of burrs on the dicing surface D of the second lens 130 in the above range can be effectively prevented. Various materials satisfying the hardness range may be used as the material of the second lens 130. For example, at least one selected from the group consisting of a silicon molding material, an epoxy molding material, and a fluorine-based molding material. When a silicone molding material is used, it is preferable to use methyl silicone to prevent discoloration due to ultraviolet rays, but the present invention is not limited thereto.

The second lens 130 includes a protruding portion P protruding laterally and the protruding portion P can abut against the upper surface of the base 100 in parallel. 1, a portion of the second lens 130 is in contact with the exit surface of the first lens 120 along the shape of the first lens 120, Protrudes from a part of the lens 130 and is in contact with the upper surface of the base 100 in parallel. As a result, the interface between the second lens 130 and the base 100 can be expanded, so that a path through which contaminants such as moisture penetrate the ultraviolet LED chip 110 and the first lens 120 can be increased , The reliability of the light emitting diode package can be further improved.

3 and 4 are cross-sectional views illustrating a light emitting diode package according to another embodiment of the present invention.

The light emitting diode package of Fig. 3 is similar to the light emitting diode package of Fig. 1, but differs in that it has no protrusions. In the case of the above structure, the size of the light emitting diode chip 110 and the first lens 120 surrounding it are the same, and the overall size of the light emitting diode package can be reduced, so that the manufacturing cost can be reduced.

The light emitting diode package of FIG. 4 is similar to the light emitting diode package of FIG. 1, but differs in the following respects. The base 100 has a cavity (not shown) including side walls surrounding the light emitting diode chip 110, and the light emitting diode chip 110 is disposed in the cavity. The first lens 120 is disposed within the cavity and the second lens 130 is disposed on the base 100 and the first lens 120. In this case, the light emitting diode chip 110 can be protected from external impacts and contaminants by the base 100 as well as the first lens 120 and the second lens 130.

5 to 8 are cross-sectional views illustrating a method of fabricating a light emitting diode package according to another embodiment of the present invention.

Referring to FIG. 5, a plurality of ultraviolet light-emitting diode chips 110 may be mounted on the upper surface of the base 100. The ultraviolet light emitting diode chip 110 and the base 100 may be electrically connected through a wire or a separate electrode on the ultraviolet light emitting diode chip 110, but the present invention is not limited thereto. The ultraviolet light-emitting diode chips 110 may be mounted spaced apart by at least one package region.

Referring to FIG. 6, a plurality of first lenses 120 covering the ultraviolet light emitting diode chips 110 may be formed. The plurality of first lenses 120 may be formed to cover at least one ultraviolet LED chip 110. 6 illustrates that the first lens 120 is formed through the dot method, but the present invention is not limited thereto and may be formed by transfer molding. As described above, the Shore hardness of the first lens 120 may be A65 or less.

Referring to FIG. 7, a plurality of second lenses 130 covering a plurality of first lenses 120 may be formed. The plurality of second lenses 130 may be formed along the shape of the first lens 120 on the exit surface of the first lens 120. However, It may be another shape. The plurality of second lenses 130 may be formed through a compression molding. In this case, as shown in FIG. 7, the second lens 130 can be formed using the mold H including the cavity having the shape of the second lens 130. However, the second lens forming method is not limited to the compression molding, and for example, transfer molding, injection molding, and the like are also possible. A part of the second lens 130 may be formed on the base 100 of the A light-emitting diode chips 110. Since the second lens 130 is integrally formed with the plurality of first lenses 120, the second lens 130 is also formed in a portion connecting the second lenses 130, May be formed. As described above, the Shore hardness of the second lens may be higher than the Shore hardness of the first lens. Specifically, the second lens 130 may be A80 or more or D30 or more.

Referring to FIG. 8, a plurality of light emitting diode packages may be formed by dicing the base 100 and the second lens 130. The dicing may be performed using a dicing blade (B), but not limited thereto, using a laser. The dicing position may be the base 100 and the second lens 130 of the ultraviolet light emitting diode chips 110 (A). The second lens 130 and the base 100 may be separately formed by a separate process while the second lens 130 is diced and the base 100 is individually formed. The second lens 130 of the individualized plurality of light emitting diode packages may include a protrusion P projecting from the side surface and contacting the upper surface of the base 100. Since the second lens 130 has a relatively high hardness as compared with the first lens 120, burrs on the dicing surface of the second lens 130 during dicing can be prevented. Accordingly, it is possible to effectively prevent contaminants such as moisture from penetrating into the light emitting diode package through the burr, thereby improving reliability and light emitting efficiency of the light emitting diode package.

The light emitting diode package described with reference to FIGS. 1 and 2 can be formed by the manufacturing method of the light emitting diode package described with reference to FIGS.

9A and 9B are an exploded perspective view and a sectional view for explaining an example in which a light emitting diode package according to an embodiment of the present invention is applied to a display device. The cross-sectional view of FIG. 9 (b) schematically shows a cross-section of a portion corresponding to line I-I 'of FIG. 9 (a).

The display device of this embodiment includes a display panel 2110, a backlight unit BLU1 for providing light to the display panel 2110 and a panel guide 2100 for supporting the lower edge of the display panel 2110. [

The display panel 2110 is not particularly limited and may be, for example, a liquid crystal display panel including a liquid crystal layer. The liquid crystal display panel may include a thin film transistor substrate, a color filter substrate, and a liquid crystal layer sandwiched between the two substrates so as to maintain a uniform cell gap to face each other. The edge of the display panel 2110 may further include gate drive PCBs 2112 and 2113 for supplying driving signals to the gate lines. Here, the gate driving PCBs 2112 and 2113 are not formed on a separate PCB, but may be formed on a thin film transistor substrate. The gate driving PCBs 2112 and 2113 are electrically connected to the liquid crystal display panel 2110 by, for example, COF (Chip on film).

The backlight unit (BLU1) includes a light source module including at least one substrate (2150) and a plurality of light emitting diode packages (2160). Further, the backlight unit BLU1 may further include a bottom cover 2180, a reflection sheet 2170, a diffusion plate 2131, and optical sheets 2130. [

The bottom cover 2180 may open upward to accommodate the substrate 2150, the light emitting diode package 2160, the reflective sheet 2170, the diffusion plate 2131, and the optical sheets 2130. In addition, the bottom cover 2180 can be engaged with the panel guide 2100. The substrate 2150 may be disposed under the reflective sheet 2170 and surrounded by the reflective sheet 2170. However, the present invention is not limited thereto, and it may be placed on the reflective sheet 2170 when the reflective material is coated on the surface. In addition, a plurality of substrates 2150 may be arranged so that a plurality of substrates 2150 are arranged side by side, but it is not limited thereto and may be formed as a single substrate 2150.

The light emitting diode package 2160 may include at least one of the light emitting diode packages according to the embodiments of the present invention described above. The light emitting diode packages 2160 may be regularly arranged in a predetermined pattern on the substrate 2150. Further, a separate lens 2210 is further disposed on each light emitting element 2160, so that the uniformity of light emitted from the plurality of light emitting elements 2160 can be improved.

The diffusion plate 2131 and the optical sheets 2130 are placed on the light emitting diode package 2160. The light emitted from the light emitting diode package 2160 may be supplied to the display panel 2110 in the form of a surface light source through the diffusion plate 2131 and the optical sheets 2130.

As described above, the light emitting diode package according to the embodiments of the present invention can be applied to the direct-type display device as in the present embodiment.

10 (a) and 10 (b) are an exploded perspective view and a cross-sectional view, respectively, for explaining an example in which a light emitting diode package according to an embodiment of the present invention is applied to a display device. The cross-sectional view of FIG. 10 (b) schematically shows a cross-section of a portion corresponding to the line II-II 'of FIG. 10 (a).

The display device having the backlight unit according to the present embodiment includes a display panel 3210 on which an image is displayed, and a backlight unit BLU2 disposed on the back surface of the display panel 3210 to emit light. The display device further includes a frame 240 supporting the display panel 3210 and storing the backlight unit BLU2 and covers 3240 and 3280 surrounding the display panel 3210. [

The display panel 3210 is not particularly limited and may be, for example, a liquid crystal display panel including a liquid crystal layer. The liquid crystal display panel may include a thin film transistor substrate, a color filter substrate, and a liquid crystal layer sandwiched between the two substrates so as to maintain a uniform cell gap to face each other. At the edge of the display panel 3210, a gate driving PCB for supplying a driving signal to the gate line may be further disposed. Here, the gate driving PCB may not be formed on a separate PCB, but may be formed on the thin film transistor substrate. The gate driving PCB is electrically connected to the liquid crystal display panel 3210 by, for example, COF (Chip on film). The display panel 3210 is fixed by the covers 3240 and 3280 located at the upper and lower portions thereof and the cover 3280 located at the lower portion can be engaged with the backlight unit BLU2.

The backlight unit BLU2 for providing light to the display panel 3210 includes a lower cover 3270 partially opened on the upper surface thereof, a light source module disposed on one side of the inner side of the lower cover 3270, And a light guide plate 3250 for converting the light into the plane light. The backlight unit BLU2 of the present embodiment is disposed on the light guide plate 3250 and includes optical sheets 3230 for diffusing and condensing light, a light guide plate 3250 disposed below the light guide plate 3250, And a reflective sheet 3260 that reflects the light toward the display panel 3210. [

The light source module includes a substrate 3220 and a plurality of light emitting diode packages 3110 spaced apart from each other on a surface of the substrate 3220. The substrate 3220 is not limited as long as it supports the light emitting diode package 3110 and is electrically connected to the light emitting diode package 3110, for example, it may be a printed circuit board. The light emitting diode package 3110 may include at least one light emitting diode package according to the embodiments of the present invention described above. The light emitted from the light source module is incident on the light guide plate 3250 and is supplied to the display panel 3210 through the optical sheets 3230. The point light source emitted from the light emitting diode packages 3110 through the light guide plate 3250 and the optical sheets 3230 can be transformed into a surface light source.

As described above, the light emitting diode package according to the embodiments of the present invention can be applied to an edge type display device like this embodiment.

In addition, the light emitting diode package according to the embodiment of the present invention emitting ultraviolet rays may be applied to the sterilizing apparatus. Ultraviolet light photoactivates DNA of pathogenic microorganisms and kills microorganisms. Such a sterilization apparatus may be used alone or as a part of products such as an air purifier, a refrigerator, and a water purifier. Further, in the case of air cleaners and refrigerators, a deodorizing effect can be obtained by using a photocatalyst that reacts with ultraviolet rays to perform a deodorizing action together with the sterilizing device.

In addition, the light emitting diode package according to the embodiment of the present invention emitting ultraviolet rays can be applied to a medical device. Specifically, the antibody can be detected using the change in sensitivity emitted from the light emitting diode package according to the antigen-antibody reaction, and the light emitted from the light emitting diode package according to the embodiment of the present invention, which emits ultraviolet rays even in the skin condition measurement, A diode package may be used.

In addition, the light emitting diode package according to the embodiment of the present invention emitting ultraviolet rays can also be used for criminal investigation. Specifically, by using a fluorescent dye having excitation light in the ultraviolet region together, it is possible to discriminate between counterfeit and fingerprint.

Claims (10)

Base;
An ultraviolet light emitting diode chip mounted on the base;
A first lens that covers the ultraviolet light emitting diode chip; And
And a second lens that covers the first lens,
The shore hardness of the second lens is higher than the shore hardness of the first lens,
The bottom surface of the second lens is in contact with the base, and the second lens is in a side surface thereof. The method according to claim 1,
And the second lens has a Shore hardness of A80 or more or D30 or more. The method of claim 2,
And the shore hardness of the first lens is not more than A65. The method of claim 3,
Wherein the first lens comprises at least one selected from the group consisting of a silicone molding material, an epoxy molding material, and a fluorine molding material. The method according to claim 1,
Wherein the second lens includes a protruding portion projecting laterally,
And the protrusion is in contact with the upper surface of the base in parallel. The method according to claim 1,
Wherein the light emitting diode chip emits light of 250 to 280 nm or 360 to 370 nm. A plurality of ultraviolet light emitting diode chips are mounted on a base,
Forming a plurality of first lenses covering the ultraviolet light-emitting diode chips,
A plurality of second lenses covering the plurality of first lenses are formed,
And dicing and customizing the base and the second lens,
Wherein a shore hardness of the second lens is higher than a shore hardness of the first lens. The method of claim 7,
Wherein the second lens has a Shore hardness of A80 or more or D30 or more. The method of claim 7,
Wherein the shore hardness of the first lens is not more than A65. The method of claim 7,
Forming the second lens includes forming a part of the second lens on the base between the ultraviolet light emitting diode chips,
And dicing the base and the second lens to form a plurality of light emitting diode packages comprises dicing the base and the second lens between the ultraviolet light emitting diode chips.

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