KR20160091064A - Aluminum micro-control method using chemical polishing - Google Patents
Aluminum micro-control method using chemical polishingInfo
- Publication number
- KR20160091064A KR20160091064A KR1020150011251A KR20150011251A KR20160091064A KR 20160091064 A KR20160091064 A KR 20160091064A KR 1020150011251 A KR1020150011251 A KR 1020150011251A KR 20150011251 A KR20150011251 A KR 20150011251A KR 20160091064 A KR20160091064 A KR 20160091064A
- Authority
- KR
- South Korea
- Prior art keywords
- chemical polishing
- aluminum
- aluminum substrate
- substrate
- degreasing
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F17/00—Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
- C23F3/03—Light metals with acidic solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
Abstract
Description
The present invention relates to a method for controlling fine shape of aluminum using chemical polishing. More specifically, it is possible to obtain a surface having improved reflexibility in a chemical polishing process due to a fine process control when an oxide film is formed by a chemical polishing process, and it is possible to obtain a surface having a smoothness of about 10 Å, And a method of controlling micro-shapes of aluminum using chemical polishing that controls damages which are detrimental to thin film deposition and a coloring process by metal oxide while forming a light-based oxide film.
Aluminum is a metal element belonging to group 13 of the periodic table and belonging to three cycles. The elemental symbol is Al, the atomic weight is 26.981 g / mol, the melting point is 660.32 ° C, the boiling point is 2519 ° C, and the density is 2.7 g / cm 3.
Aluminum is one of the main constituent elements of the earth's crust, which is a silvery-white, lightweight, loose metal. It is widely used as raw materials and materials because of its light and durable properties.
Generally, aluminum and its alloys are easily oxidized in the atmosphere, and when the substrate is subjected to a heat treatment process, various oils and oxide scales are firmly adhered to the surface of the substrate. Therefore, it is necessary to remove various oil and oxidizing scale on the product surface after processing of aluminum product.
Conventionally, various oils and oxidized scales on the surface of aluminum are removed by a process in the order of the steps of degreasing, etching, neutralization, and chemical polishing. Aluminum is a metal material widely used in various industrial fields, Dyeing, coloring, or hard thin film deposition process.
Particularly, anodizing, dyeing, coloring, or hard film deposition require different process characteristics to control the fine development of the aluminum surface during chemical polishing.
Such aluminum can control the gloss or the reflectance by a chemical polishing process using a combination of phosphoric acid-nitric acid-ultrapure water. However, the types and shapes of the oxides formed on the surface are various, and fine cracks .
Unlike the anodizing and dyeing processes, in the case of depositing the transition metal, its nitride and its carbide in the form of a thin film, the fine shape control of aluminum must be different, The aluminum oxide coating on the surface should be easily removed, and a chemical polishing technique in which microcracks and precipitation of the second phase are strictly controlled should be required on the surface.
On the other hand, there is a continuing demand for a sensitive quality material having a metallic color that is beautiful due to the advancement of the household appliance or electronic appliance industry.
Conventional aluminum materials have formed the appearance of a product by hard thin film deposition or dyeing which can realize various colors on the surface, but the commerciality is relatively lower because it implements a limited color implementation and a resin-based color tone rather than a metallic color tone.
Particularly, in the case of anodizing which proceeds in conjunction with chemical polishing, a boehmite phase forms a major porosity fibrous oxide film, and coloring is developed by resin dyeing in the space between the pores.
In addition, although the degree of porosity was controlled by controlling the electrolytic solution and each process condition, it showed a wide range of industrial utilization, but the aesthetic degree of freedom was relatively decreased because it could not escape the resin coating color basically, and it was pointed out as a main cause of the deterioration of the merchantability.
In addition, in recent years, with the tendency to become thinner in portable electronic devices, aluminum coloring is also demanded for aluminum material by high value added. For this purpose, coloring by metal oxide on the surface of aluminum and metal coloring by hard film deposition technique However, after the chemical polishing and the anodizing process, it is limited to paint or dyeing by chlorine, so that it is difficult to realize various metal colors.
In addition, the coloration by the metal oxide and the hard thin film deposition layer form a thin layer of a few micrometers or less. Aluminum and its alloy which are the materials of such a fine thin film layer can be formed by controlling the fine shape formed after chemical polishing, It is necessary to provide a chemical abrasive composition which is inexpensive in disposal treatment and has an improved surface reflectance. Korean Patent No. 0213470 exists as a related art.
SUMMARY OF THE INVENTION The object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to solve the above-mentioned problems by providing a polishing method and a polishing method capable of obtaining a surface having an improved reflexibility in a chemical polishing process by controlling a minute process when forming an oxide film by a chemical polishing process And to provide a method of controlling a fine shape of an aluminum alloy.
It is also an object of the present invention to provide a method for controlling a harmful defect caused by a thin film deposition and a coloring process by a metal oxide while forming a bayerite oxide film having a smoothness of about 10 Å and a relatively easy control of an oxide film on the surface of an aluminum alloy And to provide a method of controlling the fine shape of an aluminum alloy using chemical polishing.
According to another aspect of the present invention, there is provided a method of controlling micro-shapes of aluminum using chemical polishing, comprising the steps of: preparing a substrate for inspecting the purity and surface of the aluminum substrate; A chemical polishing step of performing chemical polishing for surface polishing of the aluminum base material, removal and smoothing of the surface of the aluminum base material based on the temperature, performing the chemical polishing to prevent stains on the surface of the aluminum base material subjected to chemical polishing A hot-air drying step of hot-air drying the aluminum base material in an electric furnace, a step of inspecting whether the chemical polishing is normally completed on the surface of the dried aluminum base material and a step of inspecting the surface of the aluminum base material If the fine shape is judged to be good Packaging and protective taping, and protective taping steps.
In this case, the chemical polishing step may include: a jig working step of performing a jig working to form an oxide film on the surface of the aluminum base material; a step of masking the surface of the aluminum base material and immersing the surface of the aluminum base material in an electrolytic solution, A degreasing step of performing a degreasing process by any one of alkali degreasing, degreasing, solvent degreasing, and sulfuric acid degreasing in order to remove various kinds of dirt formed on the surface of the aluminum substrate; A first washing step of immersing the aluminum base material in an immersion bath containing the mixed solution and performing primary washing on the basis of a shock pressure fluctuation by irradiating ultrasonic waves to the mixture solution; A primary precipitation process step for performing primary precipitation, The chemical polishing process step of performing the chemical polishing process, and may include a second washing step and performing a second washing of the aluminum substrate.
At this time, after the masking process step, a buff polishing process step of polishing the surface of the aluminum substrate may be further carried out.
At this time, the degreasing step is performed in the range of 170 seconds to 200 seconds by the degreasing method using sulfuric acid, and the degreasing temperature may be in the range of 70 ° C to 90 ° C.
In this case, the primary washing step may be performed by immersing the hot water in the temperature range of 60 ° C. to 80 ° C. in the range of 0.001 to 20 wt% and then immersing it in the range of 170 to 190 seconds.
At this time, the primary deposition step may be carried out at a temperature of 170 ° C to 180 ° C, and the aluminum substrate may be immersed in a deposition tank to which 5-20 wt% of dilute acid is added, but may be immersed for 170-180 seconds or less.
In this case, the chemical polishing step is carried out by immersing in a dipping bath at 120 ° C to 180 ° C for 10 seconds to 18 minutes while the dipping bath is composed of 30 to 80 wt% of phosphoric acid (H3PO4), 17 to 40 wt% of sulfuric acid (H2SO4) (C3H5 (OH) 3) 0.041 to 2 wt.% (Based on the total weight of the composition) of a mixture composed of 1.5 to 15 wt% of nitric acid (HNO3), 0.009 to 4.5 wt% of copper nitrate (CuNO3) and 0.05 to 4.5 wt% % And a smoothing agent composed of 1.9 to 4 wt% of sodium sulfate (Na2SO4).
At this time, the secondary washing step can be immersed for 180 seconds in a washing deposit bath containing 0.001 to 20 wt% of dilute acid, maintaining the temperature of 180 ° C.
At this time, the dilute acid may include a mixed material of 10 to 40 ppm of F, 10 ppm of SiO 3, and 50 ppm of SO 4.
At this time, after the second washing step, the aluminum substrate is immersed in the immersion tank in which the temperature is maintained at 170 ° C. to 180 ° C. and 5 to 20 wt% of dilute acid is applied, and the second immersion is performed in 170 to 180 seconds The secondary deposition process step can be further advanced.
At this time, after the secondary deposition process step, a tertiary cleaning process step for carrying out a tertiary cleaning, which is the same method as the secondary cleaning process step, may be further performed.
At this time, if it is judged that the fine shape of the surface of the aluminum substrate is defective due to the abnormal completion of the chemical polishing in the step of inspecting the process after the step of inspecting the process, The reproduction inspection step may be performed.
According to the present invention, it is possible to obtain a surface having an improved specific reflectance to be achieved in a chemical polishing process by a fine process control when an oxide film is formed by a chemical polishing process.
Further, according to the present invention, it is possible to control a harmful defect caused by a thin film deposition and a coloring process by a metal oxide while forming a bayerite oxide film which is smooth and relatively easy to control an oxide film, There is a possible effect.
Further, according to the present invention, after the chemical polishing of aluminum, it is possible to perform a coloring process by hard thin film layer deposition (PVD deposition) or a metal oxide, so that various metal colors can be realized.
1 and 2 are chemical polishing process diagrams of aluminum according to an embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected to or connected to the other component, It should be understood that an element may be "connected,""coupled," or "connected."
1 and 2 are chemical polishing process diagrams of aluminum according to an embodiment of the present invention.
As shown in these drawings, the chemical polishing process of an aluminum substrate according to an embodiment of the present invention includes the step of putting a substrate containing aluminum to prevent fine cracks from being formed by controlling the fine development of the surface, Purity and a step of preparing a substrate for controlling the surface of the substrate and controlling the degree of occurrence of microcracks and the appropriate temperature to be maintained during chemical polishing according to the generated cracks and the concentration control, etc. (S110)
When preparation of the substrate is completed, chemical polishing is carried out such that the surface gloss of the substrate, foreign substances on the surface thereof, and smoothing are controlled while keeping the temperature and the concentration according to the set value, that is, the degree of cracks generated on the surface of the substrate. (S120)
The chemical polishing step fixes the substrate to a jig to determine the surface position of the substrate to be chemically polished, and a jig work is performed to form an oxide film on the surface of the substrate (S202)
Thereafter, a masking step of masking the surface of the base material and immersing it in an electrolytic solution in the state of being masked and anodizing the anodic oxide film is carried out. (S204)
That is, in the masking process, when the aluminum substrate is placed on the anode and electrolyzed in a state of being impregnated in the electrolytic bath containing the electrolyte solution, the surface of the aluminum is oxidized by oxygen generated from the anode of the aluminum to form an oxide film of aluminum oxide.
This is because, by forming an oxide film, corrosion resistance is imparted to aluminum, which is a base material, and strength is improved to provide a chemically stable active surface.
In addition, a buff polishing process for polishing the surface of the substrate on which the oxide film is formed is selectively performed. (S206)
In the buff polishing process, the abrasive is attached to the jig where the substrate is placed, and then the surface of the substrate is processed by a cutting action and a friction action of the abrasive by rotating at 1800-3000 m / min. To accelerate mirror-surface gloss.
When the masking process or the optional buffing process is completed, the alkaline degreasing process, the solvent degreasing process, the solvent degreasing process, and the sulfuric acid degreasing process (yellow process) are performed to remove various dirt formed on the surface of the aluminum substrate A degreasing process using an acid scrubbing process (S208)
Here, the degreasing process according to the present invention is performed by the degreasing method using sulfuric acid in combination for a time of 170 seconds to 200 seconds, and the degreasing temperature is preferably between 70 ° C and 90 ° C, but is not limited thereto.
Thereafter, when the degreasing process is completed, 0.001 to 20 wt% of dilute acid is added to hot water at 60 to 80 DEG C, and then the substrate is immersed for 170 to 190 seconds. Thus, the aluminum substrate having been subjected to the degreasing process is mixed with a mixture of coma and dilute acid Is immersed in the immersion tank, and ultrasonic waves are applied to the mixed solution, thereby performing a primary cleaning process in which the liquid is shocked and fluctuated. (S210)
Thereafter, the primary deposition process is performed in which the aluminum substrate is nitric acid-immersed (S212)
The primary deposition process is a process carried out before chemical polishing. The aluminum substrate is immersed in a deposition tank in which 5 to 20 wt% of dilute acid is adhered while maintaining a temperature of 170 to 180 DEG C, and is immersed for 170 to 180 seconds or less . This primary deposition process is a process for preventing surface micro cracks and preventing aging of high concentration chemical polishing liquid when excessive polishing is caused by a high concentration chemical polishing liquid.
After the primary deposition is completed, the chemical polishing process of the aluminum base material is performed (S214)
The chemical polishing process is carried out by using a mixture of 30 to 80 wt% of phosphoric acid (H3PO4), 17 to 40 wt% of sulfuric acid (H2SO4) and 1.5 to 15 wt% of nitric acid (HNO3), 0.009 to 4.5 wt% of copper nitrate (CuNO3) ) In an amount of 0.05 to 4.5 wt%, as a stabilizer, 0.041 to 2 wt% of glycerol (C3H5 (OH) 3) and 1.9 to 4 wt% of sodium sulfate (Na2SO4) as a smoothing agent, Followed by stirring for a minute while being immersed.
When the chemical polishing is completed, a secondary cleaning process for cleaning the aluminum substrate is performed (S216)
The secondary washing step is carried out for 180 seconds in a cleaning dipping bath containing 0.001 to 20 wt% of diluted sulfuric acid at 180 DEG C or lower for 180 seconds. The dilute acid is removed by the removal of the phosphoric acid (H3PO4) and the compound remaining in the chemical polishing step of step S214 In addition to control of surface micro crack generation, a trace amount of chemicals is mixed to suppress floating in the rinsing mixture, and the trace amount of chemicals is F10 ~ 40ppm, SiO3 10ppm, SO4 50ppm.
Thereafter, the aluminum substrate is immersed in the immersion tank in which 5-20 wt% of dilute acid is adhered while maintaining the temperature at 170 ° C to 180 ° C, and the immersion process is carried out for 170-180 seconds or less (S218).
When the second deposition is completed, the third cleaning process is performed in the same manner as the second cleaning process (S220)
Here, the secondary deposition and the tertiary cleaning may be selectively performed depending on the kind of the substrate.
Thereafter, when the above-described chemical polishing process is completed, a drying step of drying the aluminum substrate finished with the chemical polishing is performed (S130)
The drying step is carried out immediately after the completion of the second washing or the third washing depending on the kind of the base material, and is a step of preventing hot spots on the surface of the base material by hot air drying in an electric furnace.
A step of performing a process inspection to confirm whether chemical polishing is properly performed on the surface of the aluminum substrate is performed (S140)
At this time, if the micro-shape of the surface of the aluminum substrate finished with the chemical polishing is in a good state, the aluminum base material is packed and protection taping work is performed to prevent the aluminum substrate from being damaged by an external impact (S150)
When the step S150 is completed, the warehousing work for the sale proceeds (S160). However, if it is determined in step S140 that the fine surface shape of the aluminum substrate is in a bad state, (S170). ≪ RTI ID = 0.0 >
Then, if the regenerated aluminum substrate is in a regenerable state, the substrate containing aluminum to prevent formation of fine cracks is worn, and if the condition of the aluminum substrate after the regeneration test is not good, .
The method for controlling the micro-shape of aluminum using the chemical polishing of the present invention, which is performed through the above processes, obtains a surface having improved reflexibility in the chemical polishing process by a fine process control when forming an oxide film by chemical polishing And it is possible to control harmful defects arising from the thin film deposition and the coloring process by the metal oxide while forming a bayerite oxide film which is smooth and relatively easy to control the oxide film with a thickness of about 10 angstroms on the surface of the aluminum substrate, (PVD deposition) after the chemical polishing of the substrate, or a coloring process using a metal oxide, thereby enabling various metal-based colors to be realized.
While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them.
It is also to be understood that the terms such as " comprises, "" comprising," or "having ", as used herein, mean that a component can be implanted unless specifically stated to the contrary. And all terms including technical and scientific terms are to be construed in a manner generally known to one of ordinary skill in the art to which this invention belongs, It has the same meaning as understood.
The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.
Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.
Claims (12)
A chemical polishing step of performing chemical polishing for removing the surface of the aluminum base material and removing foreign substances on the surface based on the concentration and the temperature corresponding to the crack generated in the aluminum base material;
A hot air drying step of subjecting the aluminum substrate subjected to the chemical polishing to hot air drying in an electric furnace in order to prevent unevenness on the surface of the aluminum substrate subjected to the chemical polishing;
A process inspection step of judging whether chemical polishing is normally completed on the surface of the dried aluminum substrate; And
Characterized by comprising packaging and protective taping steps of packaging and protecting the aluminum base material when it is judged that the fine shape of the aluminum base material surface is satisfactory as the chemical polishing is normally completed in the process inspection step Of the fine shape control method.
The chemical polishing step may comprise:
A jig working step of performing a jig work for forming an oxide film on the surface of the aluminum base material;
A masking process step of masking the surface of the aluminum substrate and then performing anodizing treatment by immersing the surface of the aluminum substrate in an electrolytic solution;
A degreasing step of performing a degreasing process by any one of alkali degreasing, exhaust degreasing, solvent degreasing, and sulfuric acid degreasing to remove various dirt formed on the surface of the aluminum substrate;
A first washing step of immersing the aluminum base material in a dipping bath containing a mixed solution of hot water and dilute acid, and performing primary washing based on shock pressure fluctuation by irradiating ultrasound to the mixed solution;
A primary precipitation process step of performing primary precipitation by nitric acid deposition of the aluminum substrate;
A chemical polishing process step of performing the chemical polishing process of the aluminum base material; And
And a second washing step of performing a second washing of the aluminum base material.
After the masking process step,
Further comprising a buff polishing step of polishing the surface of the aluminum base material.
The degreasing process may include:
And the degreasing temperature is in the range of 70 ° C to 90 ° C according to the degreasing method for sulfuric acid combined use.
Wherein the primary cleaning process step comprises:
Characterized in that the cleaning is carried out by immersing in a range of from 170 to 190 seconds after administering dilute acid in a range of 0.001 to 20 wt% to warm water in a temperature range of 60 to 80 DEG C, and washing the fine shape of aluminum by chemical polishing.
Wherein the primary deposition step comprises:
Characterized in that the aluminum substrate is immersed in a dipping bath containing 5 to 20 wt% of dilute acid while maintaining a temperature of 170 to 180 DEG C, and the aluminum substrate is immersed for 170 to 180 seconds or less. .
Wherein the chemical polishing step comprises:
Agitating the mixture in a dipping bath at 120 ° C to 180 ° C for 10 seconds to 18 minutes,
In the immersion tank,
30 to 80 wt% of phosphoric acid (H3PO4), 17 to 40 wt% of sulfuric acid (H2SO4) and 1.5 to 15 wt% of nitric acid (HNO3)
0.009 to 4.5 wt% of copper nitrate (CuNO3), 0.05 to 4.5 wt% of nickel sulfate (NiSO4);
A safety agent consisting of 0.041 to 2 wt% of glycerol (C3H5 (OH) 3); And
And a smoothing agent composed of 1.9 to 4 wt% of sodium sulfate (Na2SO4).
The secondary cleaning process step may comprise:
Wherein the substrate is immersed in a cleaning deposition bath containing 0.001 to 20 wt% of dilute acid for 180 seconds while maintaining a temperature of 180 DEG C for 180 seconds.
The narrow-
F 10 to 40 ppm, SiO 3 10 ppm, and SO 4 50 ppm.
After the secondary washing process step,
Characterized by further carrying out a second deposition step of maintaining the temperature of 170 ° C to 180 ° C and depositing the aluminum substrate in a deposition tank to which 5-20 wt% of dilute acid has been added, wherein the second deposition is carried out for 170-180 seconds A method of fine shape control of aluminum using chemical polishing.
After the secondary deposition step,
And a third washing step of performing a third washing, which is the same method as the second washing step, is further performed.
After the process inspection step,
If it is determined that the fine shape of the surface of the aluminum substrate is defective as the chemical polishing is abnormally completed in the process inspection step,
And a regeneration inspection step for performing regeneration inspection for confirming whether or not the aluminum substrate is regenerated is carried out.
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| KR1020150011251A KR20160091064A (en) | 2015-01-23 | 2015-01-23 | Aluminum micro-control method using chemical polishing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108411305A (en) * | 2018-05-23 | 2018-08-17 | 深圳市赛邦新材料有限公司 | A kind of the aluminium alloy polishing additive, aluminium alloy polishing fluid and the polishing process that prevent current mark from generating |
| KR101979615B1 (en) * | 2018-12-12 | 2019-05-17 | 장도섭 | Chemical Polishing Agent Composition and Polishing Methods of Aluminium using Thereof |
| CN112707565A (en) * | 2020-12-16 | 2021-04-27 | 中新联科环境科技(安徽)有限公司 | Cationic method treatment mode of chemical polishing aging liquid |
| WO2021112547A1 (en) * | 2019-12-03 | 2021-06-10 | Samsung Electronics Co., Ltd. | Surface pattern forming method for aluminium product |
-
2015
- 2015-01-23 KR KR1020150011251A patent/KR20160091064A/en not_active Application Discontinuation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108411305A (en) * | 2018-05-23 | 2018-08-17 | 深圳市赛邦新材料有限公司 | A kind of the aluminium alloy polishing additive, aluminium alloy polishing fluid and the polishing process that prevent current mark from generating |
| KR101979615B1 (en) * | 2018-12-12 | 2019-05-17 | 장도섭 | Chemical Polishing Agent Composition and Polishing Methods of Aluminium using Thereof |
| WO2021112547A1 (en) * | 2019-12-03 | 2021-06-10 | Samsung Electronics Co., Ltd. | Surface pattern forming method for aluminium product |
| US11913122B2 (en) | 2019-12-03 | 2024-02-27 | Samsung Electronics Co., Ltd. | Surface pattern forming method for aluminium product |
| CN112707565A (en) * | 2020-12-16 | 2021-04-27 | 中新联科环境科技(安徽)有限公司 | Cationic method treatment mode of chemical polishing aging liquid |
| CN112707565B (en) * | 2020-12-16 | 2024-02-27 | 中新联科环境科技(安徽)有限公司 | Cation method treatment mode for chemical polishing aging liquid |
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