KR20160082655A - Silane gas supply - Google Patents

Silane gas supply Download PDF

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Publication number
KR20160082655A
KR20160082655A KR1020140193711A KR20140193711A KR20160082655A KR 20160082655 A KR20160082655 A KR 20160082655A KR 1020140193711 A KR1020140193711 A KR 1020140193711A KR 20140193711 A KR20140193711 A KR 20140193711A KR 20160082655 A KR20160082655 A KR 20160082655A
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KR
South Korea
Prior art keywords
silane gas
gas
supply
purge
box
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KR1020140193711A
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Korean (ko)
Inventor
채옥희
김성준
이영태
곽재규
Original Assignee
주식회사 케이씨텍
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Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020140193711A priority Critical patent/KR20160082655A/en
Publication of KR20160082655A publication Critical patent/KR20160082655A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)

Abstract

The present invention relates to a silane gas supply device, comprising: a first supply part connected to a trailer and supplied with silane gas, for venting silane gas in the pipeline when the trailer is replaced and connected; and a silane gas And a first box for processing the silane gas vented by the first supply unit, wherein the first supply unit is configured to supply the silane gas to the silane gas supply unit A flow rate control vent line for controlling the flow rate of the gas to prevent the silane gas at the overflow rate from being vented to the box, and a purge gas control unit for controlling the purge gas and the residual silane gas supplied by the purge gas control unit, And a purge vent line. In the present invention, when the silane gas is vented, the flow rate of the silane gas flowing into the first box is limited, and when the purge gas is purged, the flow rate of the vent gas is not limited so that the explosion by the flow rate of the silane gas And the safety and reliability can be improved.

Figure P1020140193711

Description

[0001] Silane gas supply [0002]

The present invention relates to a silane gas supply device, and more particularly, to a silane gas supply device capable of safely treating residual silane gas when a trailer for supplying silane gas is replaced.

Generally, silane gas is used in a film formation process of silicon in a semiconductor process. Silane gas is a flammable gas that spontaneously ignites in the air and is a dangerous gas that can damage the eyes, skin, and respiratory system of the human body.

In order to supply such gas, a trailer is directly connected to the piping of the gas supply device, and the silane gas is taken out directly from the trailer and supplied to the semiconductor processing apparatus.

In order to replace the trailer after performing the supply of the silane gas, all of the silane gas remaining in the piping of the gas supply device is vented, and then a new silane gas trailer is bound and used.

At this time, the vented silane gas is burned in a burn box or burned in a scrubber.

No. 10-0847915 (registered on July 16, 2008, an exhaust gas stream treatment method for oxidizing the exhaust gas at the time of manufacturing semiconductors) is described in detail for the technique of treating the gas by using the burner box.

Examples of the gas to be treated include a halogen compound, carbon dioxide, NF 3 , nitrogen oxide, and sulfur oxide. However, the treatment using the burning box is described and can be referred to.

In the prior art searched by the inventors of the present invention, there has been no description clearly related to the supply and vent treatment of silane gas. Here, the configuration of a silane gas supply device installed in a domestic semiconductor manufacturing facility, Described as an example of technology.

1 is a configuration diagram of a conventional silane gas supplying apparatus.

1, a conventional silane gas supply device includes a first supply part connected to a trailer 1 and supplied with silane gas and discharging a silane gas remaining in a pipe by purge gas when the trailer 1 is replaced A second supply unit 3 for supplying silane gas to the processing apparatus through the first supply unit 2 and a second box 4 for processing the silane gas vented in the first supply unit 2, ).

Hereinafter, the configuration, operation, and problems of the conventional silane gas supplying apparatus constructed as above will be described in detail.

First, the first supply part 2 may be installed outside the factory, the second supply part 3 may be installed indoors, and even if the first supply part 2 is installed indoors, due to the danger of silane gas, (2) and the second supply unit (3).

The first supply part 2 serves to supply the silane gas drawn from the trailer 1 to the second supply part 3 when the valves V4 and V5 are opened while the trailer 1 is connected to the piping, The second supply unit 3 serves to supply the silane gas supplied from the first supply unit 2 to the semiconductor processing apparatus in a state where the valves V6, V7, V8 are opened.

When the silane gas of the trailer 1 is exhausted and the trailer 1 needs to be replaced in the process of supplying the silane gas of the trailer 1 to the semiconductor processing apparatus, To discharge the silane gas remaining in the first box 4 to the outside.

This venting process includes a primary vent closing the valves V4 and V5 and discharging only the silane gas in a state in which the piping connected to the second supply unit 3 is closed and the vent gas being supplied to supply the vent gas and the residual silane gas And a secondary vent (purge) to be discharged.

The valve V1 and the bleed valve V2 are opened and the vent gas discharges the silane gas in the second supply portion 2 to the venturi portion VC side.

The venturi part (VC) is provided to allow the silane gas to be discharged more easily. The valve V3 is opened to allow the nitrogen gas supplied from the outside to pass through the venturi part (VC) So that the silane gas in the pipe of the one supply part 2 can be discharged more easily.

At this time, the bleed valve V2 can not control the flow rate, and when the amount of silane gas present in the pipe of the first supply part 2 is large, silane gas at an excessive flow rate is supplied to the box 4 . Therefore, there is a problem that the silane gas may cause an explosion in the burning box 4.

After the silane gas in the first supply unit 2 is firstly vented, nitrogen as a purge gas is supplied through the purge control unit 5 to pressurize the silane gas remaining in the pipe of the first supply unit 2 .

As described above, the conventional silane gas supplying apparatus has a problem in that when the silane gas remaining in the piping is discharged to the box when replacing the silane trailer, the silane gas of the excessive flow rate flows into the box and explosion may occur.

If a valve capable of controlling the flow rate is added for this purpose, it takes a long time to vent the purge gas thereafter, so that the process is interrupted for a long period of time and the productivity is lowered.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a silane gas supply device capable of limiting the amount of silane gas introduced into a box and preventing a delay of purge time when purge is performed .

According to an aspect of the present invention, there is provided a fuel cell system including a first supply unit for supplying a silane gas to a trailer and venting silane gas in a pipe when the trailer is replaced and connected to the first supply unit, A second supply unit for supplying a gas to a process unit and a burn box for treating a silane gas vented at the first supply unit, A flow rate control vent line for controlling the flow rate of the silane gas to prevent the silane gas at the overflow rate from being vented to the box, and a purge gas and residual silane gas supplied by the purge gas control unit, And a purge vent line for venting.

In the silane gas supplying apparatus of the present invention, when the silane gas is vented, the flow rate of the silane gas flowing into the box is limited, and when the purge gas is supplied, the flow rate of the silane gas flowing into the box It is possible to prevent the explosion by the flow rate from occurring and to improve safety and reliability.

In addition, when purging is performed, since there is no restriction on the flow rate of the purge gas, there is an effect that the delay of the purging time can be prevented.

1 is a configuration diagram of a conventional silane gas supplying apparatus.
2 is a configuration diagram of a silane gas supplying apparatus according to a preferred embodiment of the present invention.

Hereinafter, the silane gas supplying apparatus of the present invention will be described in detail with reference to the accompanying drawings.

2 is a configuration diagram of a silane gas supplying apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 2, a silane gas supplying apparatus according to a preferred embodiment of the present invention is connected to a trailer 10 to receive silane gas. When the trailer 10 is replaced, a silane gas A second supply part 30 for supplying a silane gas to the process equipment through the first supply part 20 and a silane gas ventilated in the first supply part 20; (40) which processes the input signal

The first supply unit 20 is connected to a flow control vent line 21 for venting the silane gas remaining in the pipe to the first box 40 while purge gas is supplied to the first box 40, And a purge vent line 22 for venting the gas.

Hereinafter, the construction and operation of the silane gas supplying apparatus according to the preferred embodiment of the present invention will be described in detail.

The valves V4 and V5 of the first supply section 20 are opened and the second supply section 30 is opened to supply the silane gas to the processing apparatus in a state where the trailer 10 is connected to the first supply section 20. [ The valves V6, V7 and V8 of the trailer 10 are opened and the silane gas of the trailer 10 is supplied to the processing apparatus through the first supply part 20 and the second supply part 30. [

When the silane gas of the trailer 10 is exhausted and the trailer 10 needs to be replaced in the process of supplying the silane gas of the trailer 10 to the semiconductor processing apparatus, And discharges the silane gas remaining in the first box 40 to the outside in order to prevent the silane gas remaining in the second box 40 from flowing out.

In this venting process, the valve (V4, V5) is closed and only the silane gas is discharged in a state where the pipe connected to the second supply part (30) is closed.

The valves V1 and V2 included in the flow control vent line 21 are opened to discharge the silane gas present in the piping of the first supply part 20 to the venturi part VC.

A regulator REG is provided between the valves V1 and V2 to prevent excessive flow when the silane gas is vented to the burner box 40 via the venturi VC. It is possible to prevent the silane gas at the excessive flow rate from flowing into the box and causing the explosion to occur.

At this time, the valve V9 of the purge vent line 22 is closed so that the silane gas can be vented only through the flow control vent line 21.

As described above, even after the silane gas is vented, residual silane gas may be present in the pipe of the first supply part 20. Nitrogen gas as the purge gas is supplied through the purge control part 23 to purge the silane gas remaining in the pipe Vents.

The valves V1 and V2 of the flow control vent line 21 are closed and the valve V9 of the purge vent line 22 is opened so that the purge gas and the residual silane gas are not limited to the flow rate The box 40 can be vented.

Therefore, the execution time of the purge can be prevented from being delayed by the limitation of the flow rate of the vent.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention will be.

10: trailer 20: first supply part
21: Flow control vent line 22: Purge vent line
23: purge control unit 30: second supply unit
40: Number box

Claims (3)

A first supply part for supplying a silane gas to the trailer through the first supply part and a second supply part for supplying silane gas of the trailer to the processing device through the first supply part when the trailer is connected and the silane gas is supplied, And a box for treating the silane gas vented at the first supply unit,
Wherein the first supply unit includes:
A flow control vent line for controlling the flow rate of the silane gas vented to the first box to prevent the silane gas at the overflow rate from being vented to the first box; And
And a purge vent line for venting the purge gas and the residual silane gas supplied by the purge gas control unit to the first box without limiting the flow rate.
The method according to claim 1,
Wherein the flow control vent line comprises:
And a regulator.
3. The method of claim 2,
The regulator includes:
Wherein the silane gas supply device is located between the pair of valves.
KR1020140193711A 2014-12-30 2014-12-30 Silane gas supply KR20160082655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140193711A KR20160082655A (en) 2014-12-30 2014-12-30 Silane gas supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140193711A KR20160082655A (en) 2014-12-30 2014-12-30 Silane gas supply

Publications (1)

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KR20160082655A true KR20160082655A (en) 2016-07-08

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