KR20160073445A - Plating method for Wastewater reduction - Google Patents

Plating method for Wastewater reduction Download PDF

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KR20160073445A
KR20160073445A KR1020140181001A KR20140181001A KR20160073445A KR 20160073445 A KR20160073445 A KR 20160073445A KR 1020140181001 A KR1020140181001 A KR 1020140181001A KR 20140181001 A KR20140181001 A KR 20140181001A KR 20160073445 A KR20160073445 A KR 20160073445A
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washing
plating
wastewater
pickling
washing step
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KR1020140181001A
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Korean (ko)
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김영수
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(주)진합
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/50—Controlling or regulating the coating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention, in a normal plating method comprising: a degreasing step (S20); a washing step (A); a pickling step (S30); a washing step (B); an electrolytic degreasing step (S40); a washing step (C); a plating step (S50); a washing step (D); a chromate step (S60); a washing step (E); and a top coating step (S70), relates to a wastewater reducing type plating method characterized by replacing processes from the pickling step (S30) to the washing step (C) with a shot process (S100). The wastewater reducing type plating method according to this adopts the shot process providing the same effects with effects of the pickling and electrolytic degreasing steps of a plating process and the effect of the washing step after the picking and electrolytic degreasing steps for the plating process, thus the washing and electrolytic degreasing steps and the washing step after the pickling and electrolytic degreasing steps can be omitted. Accordingly, the wastewater reducing type plating method is capable of reducing water used for the amount of water necessary for the washing step, thereby reducing wastewater. In addition, an effect of reducing expenses for treating the wastewater is expectable.

Description

폐수저감형 도금 방법{Plating method for Wastewater reduction}[0001] Plating method for Wastewater reduction [

본 발명은 도금 공정에서 산세, 전해탈지 그리고 산세, 전해탈지 후 이어지는 수세공정을 생략하고, 이들 공정의 효과를 동일하게 얻을 수 있는 쇼트를 도금 공정에 적용함으로써 용수절감, 폐수처리비용 절감, 폐수발생량 절감 등의 효과를 기대할 수 있는 폐수저감형 도금 방법에 관한 것이다.
The present invention eliminates water washing steps after pickling, electrolytic degreasing, pickling and electrolytic degreasing in the plating process, and reduces the water consumption, wastewater treatment cost, and waste water generation amount by applying a shot to the plating process, And a method of reducing the amount of wastewater.

도금공정은 소재에 구리나 니켈, 크롬 등의 재료로 피막을 입히는 공정으로서, 탈지, 산세, 전해탈지, 도금, 후처리 등의 공정과 각각의 공정 직후의 수세공정이 연속적으로 이루어진다.The plating process is a process in which a material is coated with a material such as copper, nickel, or chromium, and processes such as degreasing, pickling, electrolytic degreasing, plating, post-treatment, and washing processes immediately after each process are continuously performed.

여기서, 수세공정은 연속으로 이루어지는 공정에서 전단계의 성분이 피도금체에 묻어 다음 공정으로 이동되어 불순물이 발생되는 문제, 다음 공정의 원액을 오염시켜 원액을 자주 교체하여야 하는 문제 등을 해소하고 도금의 불량 발생을 방지하기 위한 것이다.Here, the water washing step is a process in which the components of the previous stage are buried in the plated body in the continuous process and the impurities are generated by moving to the next step, the problem that the raw liquid is frequently replaced by contamination of the raw liquid in the next step, This is to prevent occurrence of defects.

이전 단계의 성분이 다음 단계의 원액에 섞이는 것을 최소화하기 위하여 각 공정마다 수세 공정을 두는 것은 한편으로 폐수발생량이 증가라는 문제가 동반되기 때문에 폐수발생량의 감소를 위하여 각각 단계별 공정이 진행될때 마다 피도금체에 묻어 있는 이전 단계의 성분을 제거하기 위한 각종 수단들이 고안되고 있는데 이와 같은 시도의 한계는 이전단계의 성분이 다음 단계의 원액에 섞이는 것을 얼마나 줄이느냐의 문제와 폐수발생량의 감소의 목적으로 한 것이다.In order to minimize the mixing of the components of the previous step with the stock solution of the next step, it is accompanied with the problem that the amount of generated wastewater is increased in the process of putting the water washing process in each process. Therefore, In order to reduce the amount of waste water to be mixed with the next step, the limit of the attempt is to reduce the amount of the waste water. will be.

나사류의 도금공정은 도 1에 도시된 바와 같이 소재투입(S10), 탈지(S20), 산세(S30), 전해탈지(S40), 도금(S50), 크로메이트(S60), 탑코팅(S70)의 공정을 포함한다.As shown in FIG. 1, the process of plating a screw includes the steps of charging a material (S10), degreasing (S20), pickling (S30), electrolytic degreasing (S40), plating (S50), chromate (S60) Process.

그리고 탈지(S20) ~ 탑코팅(S70)의 공정들 간에는 수세 과정(A,B,C,D,E)이 이루어진다. 도금 공정들 간에는 수세조가 있어 세척을 하여 주며 계속 수세하다보면 수세시 용해된 금속물질이나 산이온 등이 축적되므로 일정량의 물을 보충시켜 주고 보충된 물만큼 폐수로 나가 금속물질이나 산잉온 등이 축적되는 것을 방지하며 이 과정에서 일정량의 폐수가 지속적으로 발생한다.(A, B, C, D, and E) are performed between the processes of degreasing (S20) to top coating (S70). Among the plating processes, there is a water tank, which is cleaned. When washing is continued, dissolved metal materials and acid ions are accumulated during washing. Therefore, a certain amount of water is replenished, In this process, a certain amount of wastewater is continuously generated.

종래 도금 시설에서의 수세조에서 발생되는 폐수는 폐수처리장을 설치하여 폐수처리장에서 처리한 후 하천으로 방류하는 방식이다. 그러나 이러한 방식은 폐수의 경우 폐수처리시설에서 오염물질을 제거하더라도 제거되지 않은 오염물질의 지속적인 방류로 수질오염을 야기하고 있다. 이외에도 수질오염과 함께 폐수로 방류된 만큼 용수를 공급해 줘야 하는 문제점이 있다.
The wastewater generated in the water treatment tank in the conventional plating facility is disposed in the wastewater treatment plant and discharged to the river after the wastewater treatment plant is installed. However, this method causes water pollution due to the continuous discharge of contaminants that have not been removed even if the pollutants are removed from the wastewater treatment facility. In addition, there is a problem that the water should be supplied as much as it is discharged to the waste water together with the water pollution.

등록특허공보 제10-1434417호(공고일자: 2014년08월26일)Patent Registration No. 10-1434417 (Publication Date: Aug. 26, 2014)

본 발명의 목적은 도금 공정의 용수의 절감, 폐수처리비용의 절감, 폐수발생량의 절감 등의 효과를 기대할 수 있는 폐수저감형 도금 방법을 제공하려는데 있다.It is an object of the present invention to provide a wastewater reduction type plating method which can expect the effects of reduction of water in the plating process, reduction of waste water treatment cost, and reduction of the amount of generated wastewater.

본 발명의 목적은 이상에서 언급한 목적으로 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.
The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

상기와 같은 본 발명의 목적은 탈지(S20) - 수세(A) - 산세(S30) - 수세(B) - 전해탈지(S40) - 수세(C) - 도금(S50) - 수세(D) - 크로메이트(S60) - 수세(E) - 탑코팅(S70)을 포함하는 도금 방법에 있어서, 상기 산세(S30) 내지 수세(C)에 이르기까지의 공정을 쇼트 공정(S100)으로 대체하는 것을 특징으로 하는 폐수저감형 도금 방법에 의해 달성된다.
The object of the present invention is to provide a method for manufacturing a waterproofing sheet for a waterproofing sheet, which comprises degreasing (S20) - washing (A) - pickling (S30) - washing (B) - electrolytic degreasing (S40) - washing (C) (S60), a water washing (E), and a top coating (S70), wherein the step from the pickling (S30) to the water washing (C) is replaced by a shot step (S100) And is achieved by a waste water reduction type plating method.

본 발명에 의해 제공되는 폐수저감형 도금 방법에 의하면, 도금 공정의 산세, 전해탈지 그리고 산세, 전해탈지 후 이어지는 수세공정의 효과와 대등한 효과를 보이는 쇼트 공정을 도금 공정에 적용하고 있어, 상기 산세, 전해탈지 그리고 산세, 전해탈지 후 이어지는 수세공정을 생략할 수 있어 상기 수세공정에 사용되는 용수의 양 만큼 용수를 절감할 수 있고, 이로 인해 폐수발생량이 절감되며, 더불어 폐수처리비용이 절감되는 효과를 기대할 수 있다.
According to the wastewater reducing plating method provided by the present invention, the shot process showing the effect equivalent to the effect of the pickling process, the electrolytic degreasing process, the pickling process, and the subsequent water washing process after the electrolytic degreasing process is applied to the plating process, , Electrolytic degreasing, pickling and electrolytic degreasing can be omitted, water can be saved by the amount of water used in the water washing process, thereby reducing the amount of waste water generated and reducing the waste water treatment cost Can be expected.

도 1은 종래 도금 방법의 순서를 개략적으로 나타낸 도면,
도 2는 본 발명에 따른 폐수저감형 도금방법의 순서를 개략적으로 나타낸 도면.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view schematically showing a sequence of a conventional plating method,
2 is a view schematically showing a procedure of a waste water reduction type plating method according to the present invention.

도금시설에서는 도금과정에서 폐수를 발생시킨다. 이러한 폐수는 폐수처리장에서 오염물질을 제거한 후 외부로 배출되고 있지만 제거장치에서 제거되지 않은 잔여물질이 남아 있어 이것이 지속적으로 외부로 배출됨으로써 수질오염을 야기시켜 왔다.Plating facilities generate wastewater during the plating process. Such wastewater is discharged to the outside after removing the pollutants from the wastewater treatment plant, but there are residual substances that have not been removed from the removal device, and this is continuously discharged to the outside, thereby causing water pollution.

이에 본 발명은 폐수 발생량 자체를 저감시키기 위한 것으로, 쇼트 후 도금 공정을 도입함으로써 폐수량을 줄이고, 폐수 발생량의 축소로 인한 폐수처리비용 절감의 효과를 기대할 수 있다.Therefore, the present invention is intended to reduce the amount of generated wastewater. By introducing a post-shot plating process, it is possible to reduce the amount of wastewater and reduce the cost of wastewater treatment due to the reduction of the amount of wastewater generated.

본 발명의 폐수절감형 도금방법은 탈지 후 공정인 산세 및 산세후 수세수 2단, 전해탈지 및 전해탈지 후 수세수 2단의 공정을 생략함으로써 폐수 일 발생량의40%(이는 폐사기준 40ton/일에 상당함) 폐수절감의 효과를 기대할 수 있는 친환경 대응 프로세스(Process)이다.The waste water saving type plating method of the present invention is a method of reducing the amount of wastewater generated by 40% of the amount of wastewater (40 tons per day) by eliminating the second step of washing water after electrolysis degreasing and electrolytic degreasing, ) Is an environmentally friendly response process that can be expected to reduce the effluent.

본 발명의 개요는 도 1에 도시된 도금 공정 중에서 산세 및 전해탈지 공정을 생략한 도금 공정이다.The outline of the present invention is a plating process in which the pickling and electrolytic degreasing processes are omitted in the plating process shown in Fig.

즉, 본 발명에 따른 폐수저감형 도금 방법은 탈지(S20) - 수세(A) - 산세(S30) - 수세(B) - 전해탈지(S40) - 수세(C) - 도금(S50) - 수세(D) - 크로메이트(S60) - 수세(E) - 탑코팅(S70)을 포함하는 도금 방법에 있어서, 상기 산세(S30) 내지 수세(C)에 이르기까지의 공정을 쇼트 공정(S100)으로 대체하는 것을 특징으로 한다.That is, the waste water reduction type plating method according to the present invention is characterized in that the degreasing (S20), the water washing (A), the pickling (S30), the water washing (B), the electrolytic degreasing (S40), the water washing (C) D) -chromate (S60) -washing (E) -top coating (S70), the steps up to the pickling (S30) to the water washing (C) .

구체적으로, 소재 투입(S10) 후 소재를 탈지하는 단계(S20)와; 상기 탈지된 소재를 수세한 후 쇼트 공정을 수행하는 단계(S100)와; 쇼트 공정이 완료된 소재를 도금하는 단계(S50)와; 도금이 완료된 소재를 수세한 후 크로메이트 공정을 수행하는 단계(S60)와; 크로메이트 공정이 수행된 소재를 수세한 후 탑코팅을 수행하는 단계(S70);를 포함하는 것이다.
Specifically, a step (S20) of degreasing the workpiece after the workpiece is inserted (S10); A step (S100) of performing a shot process after washing the degreased material with water; A step (S50) of plating the material having completed the shot process; Performing a chromate process after washing the plated material (S60); (S70) of performing a top coating after washing the material subjected to the chromate process.

이하, 본 발명의 양호한 실시예를 도시한 첨부 도면들을 참조하여 상세히 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

도금공정이란 금속 또는 비금속 물질의 표면상태를 개선하기 위해 다른 금속의 얇은층을 피복하는 과정으로 크게 탈지과정 - 활성화과정(산세, 전해탈지) - 도금과정- 후처리과정(크로메이트, 탑코팅)으로 나누어진다. 본 발명에서는 탈지(S20) - 수세(A) - 산세(S30) - 수세(B) - 전해탈지(S40) - 수세(C) - 도금(S50) - 수세(D) - 크로메이트(S60) - 수세(E) - 탑코팅(S70)을 포함하는 도금 방법에 있어서, 상기 산세(S30) 내지 수세(C)에 이르기까지의 공정을 쇼트 공정(S100)으로 대체한다.Plating process is a process of covering thin layer of other metal in order to improve the surface condition of metal or nonmetallic material. It is largely divided into degreasing process - activation process (pickling, electrolytic degreasing) - plating process - post treatment process (chromate, top coating) Divided. In the present invention, degreasing (S20), water washing (A), pickling (S30), water washing (B), electrolytic degreasing (S40), water washing (C), plating (S50), water washing (D) (E) -top coating (S70), the steps from the pickling (S30) to the water washing (C) are replaced by the shot process (S100).

구체적으로, 본 발명에 따른 폐수저감형 도금 방법은 소재(예컨대, 자동차의 조립 공정에 사용되는 볼트 및 스크류) 투입(S10) 후 소재를 탈지하는 단계(S20)와; 상기 탈지된 소재를 수세한 후 쇼트 공정을 수행하는 단계(S100)와; 쇼트 공정이 완료된 소재를 도금하는 단계(S50)와; 도금이 완료된 소재를 수세한 후 크로메이트 공정을 수행하는 단계(S60)와; 크로메이트 공정이 수행된 소재를 수세한 후 탑코팅을 수행하는 단계(S70);를 포함한다.Specifically, the method for reducing wastewater according to the present invention includes the steps of: (S20) degreasing a workpiece after putting a material (for example, a bolt and a screw used in a car assembling process) (S10); A step (S100) of performing a shot process after washing the degreased material with water; A step (S50) of plating the material having completed the shot process; Performing a chromate process after washing the plated material (S60); (S70) of performing a top coating after washing the material subjected to the chromate process.

탈지(S20)는 도금공정에 있어서 매우 중요한 부분으로 금속표면에 부착되어 있는 산화물, 수산화물, 금속염 및 유지류 등의 오염물을 제거를 목적으로 하며, 오염물의 종류에 따라 알칼리계, 유기용매계 및 에멀션계 탈지로 분류 된다.The degreasing step (S20) is a very important part in the plating process. It is intended to remove contaminants such as oxides, hydroxides, metal salts and oils adhering to the surface of the metal. Alkali, It is classified as degreasing.

금속표면의 탈지과정은 단지 탈지효과를 얻기 위한 것이 아니라 비누화작용, 유화작용, 침투작용, 분산작용 및 기계적 박리작용을 수행한다.The degreasing process of the metal surface is not only for obtaining a degreasing effect but also for saponifying, emulsifying, penetrating, dispersing and mechanical peeling.

탈지과정이 불충분할 경우 도금층의 밀착불량, 광택불량, 도금면의 흠, 부풀음 등의 발생, 도금의 취화(brittle) 및 부식 등이 발생된다.If the degreasing process is insufficient, poor adhesion of the plating layer, poor gloss, occurrence of scratches and swelling of the plated surface, brittleness and corrosion of the plating occur.

쇼트(S100)는 쇼트 피이닝 공법으로서 쇼트라고 불리는 작은 금속입자를 고속으로 제품표면에 투사하여 작은 쇼트입자가 표면을 해머링(hammering)하는 공법이다. The shot (S100) is a shot peening method in which small metal particles called shot are projected onto a product surface at a high speed, and small shot particles hammering the surface.

본 발명에서는 이러한 쇼트 피이닝 공법으로 소재의 표면의 녹제거 등을 할 수 있기 때문에 종래의 산세(S30) - 수세(B) - 전해탈지(S40) - 수세(C)의 과정을 대신한다.In the present invention, since such a shot peening method can remove the rust on the surface of the material, it replaces the conventional pickling (S30) - washing (B) - electrolytic degreasing (S40) - washing (C).

쇼트 피이닝에 대해 좀 더 살펴보면, 쇼트 피이닝이란 작은 구형의 금속입자를 상당한 고속으로 금속표면에 충돌시켜 얻은 냉간 단조공법이라 정의 할 수 있다. 좀더 구체적으로 설명하면 쇼트의 입자는 E=1/2mV²의 운동에너지를 갖고, 작은 햄머(hammer)역활로 금속표면을 강타하여 순간적으로 국부적인 발열을 일으키고 표면에 박히며 국부적인 승복점을 기과하게하여 영구변형을 주고 쇼트는 반발하여 표면에서 이탈하게 된다. 이때 곰보의 깊이는 표면에서 많게는 0.1 - 0.8mm에 달하게 되며, 표면적을 증대시켜 도금 밀착성을 향상시키는데 도움을 준다.A closer look at shot peening can be defined as a cold forging technique in which a small spherical metal particle collides against a metal surface at a very high speed. More specifically, the particles of the shot have a kinetic energy of E = 1 / 2mV ², hammer the metal surface with a small hammer, instantaneously generate a localized fever, stick to the surface, And the shot is repelled and deviated from the surface. At this time, the depth of the pores reaches 0.1 - 0.8 mm at the surface, which increases the surface area and improves the adhesion of the plating.

한편, 도 2의 도금(S50) - 수세(D) - 크로메이트(S60) - 수세(E) - 탑코팅(S70)의 과정은 종래의 도금 공정에서의 과정과 동일하여 상세한 설명은 생략한다.
Meanwhile, the process of plating (S50) -washing (D) -chromate (S60) -washing (E) -top coating (S70) of FIG. 2 is the same as that in the conventional plating process, and a detailed description thereof will be omitted.

이상 본 발명이 양호한 실시예와 관련하여 설명되었으나, 본 발명의 기술 분야에 속하는 자들은 본 발명의 본질적인 특성에서 벗어나지 않는 범위 내에 다양한 변경 및 수정을 용이하게 실시할 수 있을 것이다. 그러므로 개시된 실시예는 한정적인 관점이 아니라 설명적인 관점에서 고려되어야 하고, 본 발명의 진정한 범위는 전술한 설명이 아니라 특허청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will readily occur to those skilled in the art without departing from the spirit and scope of the invention. Therefore, it should be understood that the disclosed embodiments are to be considered in an illustrative rather than a restrictive sense, and that the true scope of the invention is indicated by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof, .

Claims (2)

탈지(S20) - 수세(A) - 산세(S30) - 수세(B) - 전해탈지(S40) - 수세(C) - 도금(S50) - 수세(D) - 크로메이트(S60) - 수세(E) - 탑코팅(S70)을 포함하는 도금 방법에 있어서,
상기 산세(S30) 내지 수세(C)에 이르기까지의 공정을 쇼트 공정(S100)으로 대체하는 것을 특징으로 하는 폐수저감형 도금 방법.
(S) - Washing (C) - Plating (S50) - Washing (D) - Chromate (S60) - Washing (E) - Washing (S20) - Washing (A) - Pickling (S30) - a plating process comprising a top coating (S70)
And the step from the pickling (S30) to the water washing (C) is replaced by a shot process (S100).
도금 방법에 있어서,
소재 투입(S10) 후 소재를 탈지하는 단계(S20)와;
상기 탈지된 소재를 수세한 후 쇼트 공정을 수행하는 단계(S100)와;
쇼트 공정이 완료된 소재를 도금하는 단계(S50)와;
도금이 완료된 소재를 수세한 후 크로메이트 공정을 수행하는 단계(S60)와;
크로메이트 공정이 수행된 소재를 수세한 후 탑코팅을 수행하는 단계(S70);
를 포함하는 폐수저감형 도금 방법.
In the plating method,
(S20) of degreasing the workpiece after the workpiece is inserted (S10);
A step (S100) of performing a shot process after washing the degreased material with water;
A step (S50) of plating the material having completed the shot process;
Performing a chromate process after washing the plated material (S60);
A step (S70) of performing a top coating after washing the material subjected to the chromate process;
Wherein the plating solution is applied to the plating solution.
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Publication number Priority date Publication date Assignee Title
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101434417B1 (en) 2014-04-25 2014-08-26 주식회사 엘에이치이노베이션 Treatment method of wastewater from gilding process for reuse

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