KR20160069836A - Flexible organic light emitting display device - Google Patents

Abstract

A flexible organic light emitting display device according to an embodiment of the present invention comprises: a lower substrate which includes a display area, a line area surrounding the display area, and a dummy area surrounding the line area, and has flexibility; a touch line disposed on the display area and the line area, on the lower substrate, and transmitting a touch sensing signal; an upper insulating layer disposed on the lower substrate to surround the touch line, wherein the upper insulating layer is disposed on the display area, the line area and the dummy area; an upper buffer layer disposed on the upper insulating layer, wherein the upper buffer layer is disposed on the display area, the line area and the dummy area; and an upper substrate disposed on the upper buffer layer and having flexibility. In the dummy area, a hole pattern is disposed on at least one of the upper insulating layer and the upper buffer layer. The flexible organic light emitting display device according to an embodiment of the present invention can minimize a crack in the upper insulating layer and the upper buffer layer made of a material having low ductility.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flexible organic light-

The present invention relates to a flexible organic light emitting diode (OLED) display, and more particularly, to a flexible organic light emitting diode (OLED) display device capable of minimizing the occurrence of cracks in an upper insulating layer and an upper buffer layer, And an organic light emitting display device.

The organic light emitting diode (OLED) is a self-emissive type display device, and unlike a liquid crystal display (LCD), a separate light source is not required, so that it can be manufactured in a light and thin shape. Further, the organic light emitting display device is not only advantageous from the viewpoint of power consumption by low voltage driving, but also excellent in color implementation, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next generation display.

In a general organic light emitting display, a touch screen is implemented by attaching a touch screen panel on an upper substrate. In such an organic light emitting diode display, since the touch screen panel is separately manufactured and attached to the outer surface of the organic light emitting diode display device, the entire thickness of the OLED display device is increased and the visibility of the image is lowered due to the increased thickness have.

In recent years, an in-cell type touch screen integrated type organic light emitting display device in which a touch screen panel is integrated with an organic light emitting display has been developed to solve the above problems.

1 is a schematic cross-sectional view of a conventional in-cell type touch screen integrated type organic light emitting display.

1, a conventional OLED display 100 includes a lower substrate 110, a lower buffer layer 111, a gate insulating layer 112, an interlayer insulating layer 113, a thin film transistor 120, The organic light emitting device 134, the protective layer 138, the adhesive layer 139, the touch electrode 140, the upper planarization layer 142, the touch wiring 144, the upper insulating layer 125, the bank layer 126, Layer 150, an upper buffer layer 160, an upper substrate 180, and a polarizer 190.

The organic light emitting display 100 of FIG. 1 may include a finger of a user, a touch electrode 140, an upper insulating layer 150, an upper buffer layer 160, and the like, for example, when a user's finger contacts the polarizer 180. [ The upper substrate 180 and the polarizer 190. The capacitance of the capacitors is detected by the capacitance of the capacitors, Or not.

However, as the organic light emitting display device is attempted to be embodied as a flexible display device capable of image display even if bent like paper, an upper insulating layer 150 for insulating the touch wiring 144, Cracks are generated in the upper buffer layer 160 to prevent penetration of moisture or impurities through the barrier ribs. Because the upper insulating layer 150 and the upper buffer layer 160 are generally made of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), due to the low ductility of the inorganic material, This is because cracks are easily generated in the insulating layer 150 and the upper buffer layer 160.

According to various experimental results, it has been reported that cracks occur at high probability near the edges of the upper insulating layer 150 and the upper buffer layer 160 due to repetitive bending operations. Cracks generated in the vicinity of the edges of the upper insulating layer 150 and the upper buffer layer 160 are propagated to the touch electrode 140 or the touch wiring 144 to make touch recognition impossible.

[Related Technical Literature]

1. A light emitting display and a method of manufacturing the same (Korean Patent Application No. 10-2007-0090457)

The inventors of the present invention have studied a technique capable of minimizing the problem described above, that is, the problem of cracks occurring near the edges of the upper insulating layer and the upper buffer layer composed of the inorganic layer. As a result, when a hole pattern is formed in the vicinity of the edges of the upper insulating layer and the upper buffer layer, it is possible to suppress the occurrence of cracks in the upper insulating layer and the upper buffer layer as well as to prevent propagation of cracks inevitably generated in the upper insulating layer and the upper buffer layer I can see that I can block.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a flexible organic light emitting display capable of reducing the possibility of cracking at the edges of the upper insulating layer and the upper buffer layer.

Another object of the present invention is to provide a flexible organic light emitting display capable of minimizing the propagation of cracks generated at the edges of the upper insulating layer and the upper buffer layer to adjacent components.

Another object of the present invention is to provide a flexible organic light emitting display having excellent lifetime characteristics and bending reliability.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a flexible OLED display including a display region, a wiring region surrounding the display region, and a dummy region surrounding the wiring region, And a touch wiring for transferring a touch sensing preference and disposed on the lower substrate and arranged in a display area, a wiring area and a dummy area so as to surround the touch wiring and the touch wiring, An upper insulating layer disposed on the upper insulating layer, an upper buffer layer disposed on the display region, a wiring region, and a dummy region on the upper insulating layer, and an upper substrate having flexibility and disposed on the upper buffer layer, And the upper buffer layer. In the flexible organic light emitting display according to an exemplary embodiment of the present invention, cracks may be less generated in the upper insulating layer and the upper buffer layer, which are made of a material with low ductility.

According to another aspect of the present invention, the minimum width of the dummy area may be 120 to 200 占 퐉.

According to another aspect of the present invention, the upper insulating layer may include at least one of aluminum oxide (AlOx), aluminum oxynitride (AlOxNy), titanium oxide (TiOx), silicon oxide (SiOx), zinc oxide (ZnOx), and zirconium oxide (ZrOx) And silicon nitride (SiNx).

According to another aspect of the present invention, the thickness of the upper insulating layer may be 3000 to 7000 A.

According to another aspect of the present invention, the upper buffer layer may be composed of silicon nitride (SiNx), silicon oxide (SiOx), or a combination thereof.

According to another aspect of the present invention, the thickness of the upper buffer layer may be 2000 to 6000 A.

According to another aspect of the present invention, a lower substrate further includes a bending region extending in one direction, the bending region overlapping with a portion of the display region, a portion of the wiring region, and a portion of the dummy region, Can be disposed in the overlapping area.

According to another aspect of the present invention, the hole pattern may include a concave pattern and a convex pattern disposed at the edge of the lower substrate.

According to another aspect of the present invention, each of the concave pattern and the convex pattern may be disposed in succession to both the upper insulating layer and the upper buffer layer.

According to another aspect of the present invention, the height of the convex pattern may be 30 to 100 mu m.

According to another aspect of the present invention, the flexible organic light emitting display may be front bendable.

According to another aspect of the present invention, the hole pattern may comprise an elongated pattern disposed within the dummy region.

According to another aspect of the present invention, the elongated pattern may extend in one direction.

According to another aspect of the present invention, the elongated pattern may be disposed in both the upper insulating layer and the upper buffer layer.

According to another feature of the invention, the minimum width of the elongated pattern can be 30 to 100 [mu] m.

According to another aspect of the present invention, the elongated pattern may be disposed in pluralities between one side of the wiring region of the lower substrate and one side of the edge of the lower substrate.

According to another aspect of the present invention, the elongated pattern can be extended to surround the display area.

The details of other embodiments are included in the detailed description and drawings.

The present invention has the effect of minimizing the occurrence of cracks at the edges of the upper insulating layer and the upper buffer layer due to repetitive bending.

The present invention has an effect of preventing cracks inevitably generated at the edges of the upper insulating layer and the upper buffer layer from propagating to the touch electrode or the touch wiring.

The present invention has an effect of providing a flexible organic light emitting display device which can be used for a long time with high reliability.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a schematic cross-sectional view of a conventional in-cell type touch screen integrated type organic light emitting display.
FIG. 2 is a schematic plan view illustrating regions of a lower substrate of a flexible organic light emitting display according to an exemplary embodiment of the present invention. Referring to FIG.
3 is a schematic cross-sectional view illustrating a flexible organic light emitting display according to an embodiment of the present invention in accordance with III-III of FIG.
4 is a plan view showing a hole pattern of an upper buffer layer of a flexible organic light emitting display according to an embodiment of the present invention.
5 is a perspective view illustrating hole patterns of an upper insulating layer and an upper buffer layer of a flexible organic light emitting display according to an embodiment of the present invention.
6 is a schematic plan view illustrating regions and a hole pattern of a lower substrate of a flexible organic light emitting display according to another embodiment of the present invention.
FIG. 7 is a schematic cross-sectional view illustrating a flexible organic light emitting display according to another embodiment of the present invention, taken along line VII-VII of FIG.
8 is a view for explaining an effect of a flexible organic light emitting display according to another embodiment of the present invention.
9 is a schematic plan view for explaining regions and a hole pattern of a lower substrate of a flexible organic light emitting display according to another embodiment of the present invention.
10 is a schematic plan view illustrating regions and hole patterns of a lower substrate of a flexible organic light emitting display according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic plan view illustrating regions, a touch wiring, and an upper pad of a lower substrate of a flexible organic light emitting display according to an exemplary embodiment of the present invention. Referring to FIG. 3 is a schematic cross-sectional view illustrating a flexible organic light emitting display according to an embodiment of the present invention in accordance with III-III of FIG.

2 and 3, the flexible organic light emitting display 200 includes a lower substrate 210, a lower buffer layer 211, a thin film transistor 220, a lower planarization layer 225, an organic light emitting diode 234, The top layer 242, the touch wiring 244, the top pad 246, the top insulating layer 250, the top buffer layer 260, the top layer 252, A substrate 280 and a polarizer 290.

The lower substrate 210 serves to support and protect various components of the flexible organic light emitting display 200. The lower substrate 210 has flexibility to enable bending, and may be formed of, for example, a polyimide-based material.

Referring to FIG. 2, the lower substrate 210 includes a display area DA, a wiring area WA, a dummy area MA, and a pad area TA. The display area DA refers to an area where an image is displayed in the flexible organic light emitting display device 200. The wiring area WA and the dummy area MA are regions where the image is not displayed and the wiring area WA is a region where the touch wiring 244 is disposed and the dummy area MA is wiring area WA and lower Quot; refers to the area between the edges of the substrate 210. As shown in Fig. 2, the wiring area WA is arranged to surround the display area DA, and the dummy area MA is arranged to surround the wiring area WA. The pad region TA is a region in which the pad portion of the flexible organic light emitting diode display device 200 is disposed. In the pad region TA, an integrated circuit may be formed, or a flexible printed circuit board may be connected.

The minimum width of the dummy area MA may be 120 to 200 mu m, but is not limited thereto.

Referring to FIG. 2, the lower substrate 210 further includes a bending area BA. The bending area BA is an area in which only components having flexibility are disposed and configured to enable repeated bending. As shown in Fig. 2, the bending area BA extends in one direction and overlaps with a part of the display area DA, a part of the wiring area WA, and a part of the dummy area MA. In order to clearly understand the bending area BA, the boundary of the bending area BA is shown by a solid line in Fig. 2 and the following drawings.

A lower buffer layer 211 is disposed on the lower substrate 210. The lower buffer layer 211 prevents penetration of moisture or impurities through the lower substrate 210 and flattens the upper surface of the lower substrate 210. The lower buffer layer 211 may be composed of silicon nitride (SiNx), but is not limited thereto.

A thin film transistor 220 is disposed on the lower buffer layer 211. 3, the thin film transistor 220 is disposed in the display region DA and includes an active layer 221, a gate electrode 222, a source electrode 223, and a drain electrode 224. [ Specifically, an active layer 221 is formed on the lower buffer layer 211, a gate insulating layer 212 is formed on the active layer 221 to insulate the active layer 221 from the gate electrode 222 A gate electrode 222 is formed on the gate insulating layer 212 so as to overlap with the active layer 221 and an interlayer insulating layer 213 is formed on the gate electrode 222 and the gate insulating layer 212, A source electrode 223 and a drain electrode 224 are formed on the interlayer insulating layer 213. The source electrode 223 and the drain electrode 224 are electrically connected to the active layer 221. For convenience of description, only the thin film transistors among the various thin film transistors that can be included in the flexible organic light emitting display 200 are shown in this specification. In this specification, the thin film transistor 220 is described as a coplanar structure, but a thin film transistor having an inverted staggered structure may also be used.

A lower planarization layer 225 is disposed on the thin film transistor 220. The lower planarization layer 225 planarizes the upper portion of the thin film transistor 220. The lower planarization layer 225 includes a contact hole for electrically connecting the thin film transistor 220 and the anode 231 of the organic light emitting diode 234.

The organic light emitting device 234 is disposed on the lower planarization layer 225. [ The organic light emitting device 234 is disposed in the display area DA and includes an anode 231 electrically connected to the thin film transistor 220, an organic light emitting layer 232 disposed on the anode 231, And a cathode 233 disposed on the cathode 233. The anode 231 may be composed of a transparent conductive material having a high work function and a reflective plate. In FIG. 3, the anode 231 is represented as a single layer for convenience of illustration. The organic light emitting layer 232 may be one of a red organic light emitting layer, a green organic light emitting layer, a blue organic light emitting layer, and a white organic light emitting layer as an organic layer for emitting light of a specific color. The organic light emitting layer 232 may be formed over the entire lower substrate 210. In this case, the organic light emitting layer 232 may be a white organic light emitting layer. Although the thickness of the organic light emitting diode 234 is shown in FIG. 3 in detail, the thickness of the organic light emitting diode 234 is considerably thinner than the thickness of the adhesive layer.

A bank layer 226 is disposed on the lower planarization layer 225 and the anode 231. [ The bank layer 226 defines a sub pixel region in a manner that distinguishes adjacent sub pixel regions in the display region DA. Further, the bank layer 226 may define a pixel region composed of a plurality of sub-pixel regions.

A protective layer 238 is disposed on the display region DA, the wiring region WA and the dummy region MA on the organic light emitting element 234. [ The protective layer 238 is disposed over the entire lower substrate 210 between the lower substrate 210 and the upper substrate 280 to cover the organic light emitting element 234. [ 3, the passivation layer 238 is disposed on the first encapsulant layer 235, the foreign material compensation layer 236 disposed on the first encapsulant layer 235, and the foreign material compensation layer 236 And a second encapsulation layer (237). The first sealing layer 235 and the second sealing layer 237 serve to protect the organic light emitting diode 234 from moisture or oxygen from the outside of the flexible organic light emitting display device 200. The first sealing layer 235 and the second sealing layer 237 may be made of the same material, and may be made of a material having excellent barrier properties and transparency such as, for example, silicon nitride (SiNx). The foreign material compensating layer 236 may serve to flatten the stepped portion of the first encapsulating layer 235 and to compensate foreign objects. The foreign material compensation layer 236 may be composed of an acrylic resin or an epoxy resin

An adhesive layer 239 is disposed on the protective layer 238. The adhesive layer 239 intervenes between the lower substrate 210 and the upper substrate 280 to adhere the lower substrate 210 and the upper substrate 280 to each other. The adhesive layer 239 may seal the organic light emitting device 234 disposed on the lower substrate 210 to protect the organic light emitting device 234 from moisture or oxygen penetration from the outside. As the adhesive layer 239, various materials can be used. For example, adhesive materials such as OCA (Optical Clear Adhesive) and OCR (Optical Clear Resin) can be used. 3, the adhesive layer 239 is disposed in both the display area DA, the wiring area WA, and the dummy area MA. The adhesive layer 239 fills a space between the upper insulating layer 250 and the lower substrate 210 in the wiring region WA and the dummy region MA.

A touch electrode 240 is disposed on the adhesive layer 239. 3, the touch electrode 240 is disposed in the display area DA of the lower substrate 210 to sense a touch from the outside. The touch electrode 240 may operate in a manner that senses a capacitance change as a touch is applied from the outside, for example. The touch electrode 240 may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide, tin oxide And a transparent conductive material such as tin oxide (ITO).

An upper planarization layer 242 is disposed on the adhesive layer 239. The upper planarization layer 242 is composed of an organic material and serves to planarize the lower portion of the upper insulation layer 250. 3, the upper planarization layer 242 is disposed to surround the touch electrode 240 in the display area DA and the wiring area WA. The upper planarization layer 242 may be formed of a material such as polyacrylates resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, And may be composed of at least one organic material selected from the group consisting of unsaturated polyesters resins, poly-phenylenethers resins, poly-phenylenesulfides resins, and benzocyclobutenes But not limited to, various materials.

A touch wiring 244 is disposed on the upper planarization layer 242. 3, the touch wiring 244 is disposed in the display area DA and the wiring area WA, and the touch wiring 244 disposed in the display area DA is disposed on the upper insulating layer 250 And may be connected to the touch electrode 240 through the formed contact hole. The touch wiring 244 is electrically connected to the touch electrode 240 to drive the touch electrode 240 or to transmit a touch sensing signal. The touch wiring 244 may be formed of a metal such as aluminum (Al), aluminum (Al) alloy, copper (Cu), copper (Cu) alloy, molybdenum (Mo) Lt; / RTI >

As shown in Fig. 2, the touch wiring 244 is connected to the upper pad 246 disposed in the wiring area WA. The touch wiring 244 may be electrically connected to circuits disposed in the pad area TA through the upper pad 246. [

An upper insulating layer 250 is disposed on the upper planarization layer 242 to surround the touch wiring 244. 3, the upper insulating layer 250 is disposed on both the display area DA, the wiring area WA, and the dummy area MA of the lower substrate 210 to electrically connect the touch wiring 244 to the outside As shown in FIG. The upper insulating layer 250 may be formed of a transparent insulating material such as AlOx, AlOxNy, TiOx, SiOx, ZnOx, ZrOx, ) And silicon nitride (SiNx), and may be composed of silicon nitride (SiNx). The upper insulating layer 250 may have a thickness of 3000 to 7000 angstroms so as to sufficiently insulate the touch wiring 244 while ensuring flexibility.

An upper buffer layer 260 is disposed on the upper insulating layer 250. 3, the upper buffer layer 260 is disposed on both the display area DA, the wiring area WA, and the dummy area MA of the lower substrate 210, Or inhibiting impurities from permeating. 3, the upper buffer layer 260 is formed of a single layer, but the upper buffer layer 260 is formed of silicon oxide (SiOx) to minimize the penetration of moisture or impurities through the upper substrate 280 And two unit buffer layers composed of silicon nitride (SiNx) and two unit buffer layers composed of alternately stacked unit buffers. Here, each of the plurality of unit buffer layers may have a thickness of 500 to 1500 ANGSTROM. Under the criterion that the upper buffer layer includes four unit buffer layers, the upper buffer layer 260 may have a thickness of 2000 to 6000 ANGSTROM.

3, a hole pattern 270 may be formed in the upper insulating layer 250 and the upper buffer layer 260 in the dummy region MA. The hole pattern 270 serves to disperse the stress applied to the upper insulating layer 250 and the upper buffer layer 260 when the upper insulating layer 250 and the upper buffer layer 260 are bent.

4 and 5 are views for explaining a hole pattern formed in the upper buffer layer and the upper insulating layer of the flexible organic light emitting display according to an embodiment of the present invention. 4 is a plan view showing a hole pattern of an upper buffer layer of a flexible organic light emitting display according to an embodiment of the present invention. 5 is a perspective view illustrating hole patterns of an upper insulating layer and an upper buffer layer of a flexible organic light emitting display according to an embodiment of the present invention.

4 and 5, the upper insulating layer 250 and the upper buffer layer 260 include a plurality of convex patterns 272 disposed at the edges of the lower substrate 210, Pattern 274. As shown in Fig. 4, the convex pattern 272 refers to a relatively protruding portion, and the concave pattern 274 refers to a portion that is not relatively protruded.

Each of the convex pattern 272 and the concave pattern 274 is disposed adjacent to both the upper insulating layer 250 and the upper buffer layer 260. In other words, each of the convex pattern 272 and the concave pattern 274 is continuously disposed over the upper insulating layer 250 and the upper buffer layer 260.

The convex pattern 272 and the concave pattern 274 as the hole pattern 270 serve to reduce the stress due to bending and therefore need not be disposed in a region other than the bending region BA. When the concave pattern 274 extends beyond the dummy area MA to the wiring area WA, damage is caused to the touch wiring 244 arranged in the wiring area WA by the concave pattern 274 . 4 and 5, the convex pattern 272 and the concave pattern 274 are disposed only in the area where the dummy area MA and the bending area BA are overlapped with each other.

The minimum width of the dummy area MA is limited to 120 to 200 mu m so that the height L1 of the convex pattern 272 disposed in the dummy area MA is also 120 mu m or less, for example, 30 to 100 mu m Can be limited.

The force required to bend a particular component is proportional to the bending length of that particular component. 4 and 5, when the convex pattern 272 and the concave pattern 274 are formed in the upper insulating layer 250 and the upper buffer layer 260, It can be seen that the user can bend the bending area BA with a significantly higher probability of less bending since the bending length between the concave patterns 274 is reduced.

An upper substrate 280 is disposed on the upper buffer layer 260. The upper substrate 280 is disposed opposite to the lower substrate 210 to support various components of the flexible organic light emitting display 200. The top substrate 280 is comprised of a material that can meet both high transparency and excellent flexibility. For example, the upper substrate 280 may be composed of a transparent polyimide having high transparency and excellent flexibility. The upper substrate 280 is configured to overlap the display area DA, the wiring area WA, and the dummy area MA of the lower substrate.

A polarizer 290 is disposed on the upper substrate 280. The polarizer 290 may be disposed on the upper surface of the upper substrate 280 as a component for minimizing reflection of external light by the reflective material of the flexible organic light emitting display device 200. However, the polarizing plate 290 may not be included in the flexible organic light emitting display 200. In this case, other components for reducing external light reflection may be included in the flexible organic light emitting display 200, The components of the organic light emitting diode display 200 may be partially changed.

An upper insulating layer for insulating the touch wiring and an upper buffer layer for preventing moisture or impurities from penetrating through the upper substrate are generally made of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx). However, since inorganic materials generally have low ductility, cracks can easily occur in the upper insulating layer and the upper buffer layer due to repetitive bending operations. When the cracks generated in the upper insulating layer and the upper buffer layer propagate to the touch wiring, the reliability of the flexible organic light emitting display device can be significantly lowered, thereby suppressing the occurrence of cracks in the upper insulating layer and the upper buffer layer due to repetitive bending A new technology that can do this is required.

The upper insulating layer 250 and the upper insulating layer 250 are formed on the upper insulating layer 250 and the upper insulating layer 250 in the flexible organic light emitting display device 200 according to an embodiment of the present invention, And the upper insulating layer 250 and the upper buffer layer 260 can be bent by the hole pattern 270 formed in the upper buffer layer 260 with less force, (250) and the upper buffer layer (260). Therefore, occurrence of cracks in the upper insulating layer 250 and the upper buffer layer 260 due to repetitive bending operations can be reduced, and it becomes possible to secure excellent bending reliability.

2 and 3, the hole pattern 270 is formed in both the upper insulating layer 250 and the upper buffer layer 260. However, only one of the upper insulating layer 250 and the upper buffer layer 260 A pattern 270 may be formed.

6 is a schematic plan view illustrating regions and a hole pattern of a lower substrate of a flexible organic light emitting display according to another embodiment of the present invention. FIG. 7 is a schematic cross-sectional view illustrating a flexible organic light emitting display according to another embodiment of the present invention, taken along line VII-VII of FIG. In FIG. 6 and the following drawings, the hole pattern is shown by a thick solid line for convenience of illustration.

The flexible organic light emitting diode display 600 of FIG. 6 is different from the flexible organic light emitting display 200 of FIG. 2 in that the bending area is not particularly limited, the hole pattern is arranged inside the dummy area MA And the remaining components are substantially the same, so that redundant description is omitted.

6 and 7, the lower substrate 610 of the flexible organic light emitting display 600 according to another embodiment of the present invention includes a display area DA, a wiring area WA, a dummy area MA, Pad area TA, and does not include a separate defined bending area BA. In other words, the flexible OLED display 600 of FIG. 6 is configured to be capable of front bending.

6 and 7, in the flexible organic light emitting diode display 600 according to another embodiment of the present invention, a hole pattern (not shown) is formed in the upper insulating layer 650 and the upper buffer layer 660 in the dummy region MA, An elongated elongated pattern 676 is disposed. As shown in Fig. 6, the elongated pattern 676 extends long in one direction, and is arranged symmetrically with the display area DA and the wiring area WA therebetween.

7, the elongated pattern 676 is disposed adjacent to both the upper insulating layer 650 and the upper buffer layer 660. [ In other words, the elongated pattern 676 is continuously disposed over the upper insulating layer 650 and the upper buffer layer 660. [

Since the minimum width of the dummy area MA is limited to 120 to 200 mu m, the minimum width of the elongated pattern 676 disposed in the dummy area MA is also 120 mu m or less, for example, 30 to 100 mu m Can be limited.

8 is a view for explaining an effect of a flexible organic light emitting display according to another embodiment of the present invention.

8, when the elongated pattern 676 is formed in the upper insulating layer 650 and the upper buffer layer 660 in the dummy region MA, the upper insulating layer 650 and the upper buffer layer 660 The upper insulating layer 650 disposed inside the dummy area MA by the elongate pattern 676 can be bent even when bent at the same curvature radius R1 as compared with the case where the elongated pattern 676 is not formed in the dummy area MA. The separated upper insulating layer 652 and the upper buffer layer 662 in the dummy region MA are bent to a very large radius of curvature R2 because the upper buffer layer 660 and the upper buffer layer 660 are separated. Therefore, even if repetitive bending operations are performed, less stress is applied to the edges of the upper insulating layer 650 and the upper buffer layer 660 in the dummy region MA, and cracks are generated with less probability.

In addition, since the upper insulating layer and the upper buffer layer are arranged in one continuous layer instead of being separated from each other on the entire surface of the lower substrate in the conventional organic light emitting diode display, The cracks generated in the upper and lower buffer layers are easily propagated to the touch wiring along the upper insulating layer and the upper buffer layer.

However, in the flexible organic light emitting diode display 600 according to another embodiment of the present invention, since the upper insulating layer 650 and the upper buffer layer 660 are disposed separately from each other in the dummy region MA, Even if a crack is inevitably generated at the edges of the layer 650 and the upper buffer layer 660, the propagation path is initially blocked, and the generated crack can not be easily propagated to the touch wiring 642. [ Accordingly, the flexible organic light emitting diode display 600 according to another embodiment of the present invention can further secure excellent lifetime characteristics and bending reliability.

In the flexible organic light emitting diode display 600 according to another embodiment of the present invention, even when bending is performed, less stress is applied to the edges of the upper insulating layer 650 and the upper buffer layer 660, But may also be advantageously applied to edge bending techniques that bend the edge of the lower substrate 610 in order to do so.

9 is a schematic plan view for explaining regions and a hole pattern of a lower substrate of a flexible organic light emitting display according to another embodiment of the present invention.

The flexible organic light emitting display 900 of FIG. 9 is different from the flexible organic light emitting display 600 of FIG. 6 in that a thin elongated pattern (not shown) is formed between one side of the wiring region WA and one side of the edge of the lower substrate 610 976 are arranged in plural, and the remaining components are substantially the same, and therefore duplicate descriptions are omitted.

Referring to FIG. 9, in a flexible organic light emitting display 900 according to another embodiment of the present invention, a thin elongated pattern 976 as a hole pattern is disposed inside the dummy area MA. The elongated patterns 976 are arranged in plural between one side of the wiring region WA and one side of the edge of the lower substrate 610. As shown in Fig. 9, the elongated pattern extends in one direction and is arranged symmetrically with the display region DA and the wiring region WA therebetween.

Since the minimum width of the dummy area MA is limited to 120 to 200 mu m, the minimum width of the elongated pattern 976 arranged in plural in the dummy area MA is 60 mu m or less, for example, 15 to 40 mu m Lt; / RTI > The interval between the elongated patterns 976 may be 10 to 30 占 퐉, but is not limited thereto.

In the flexible organic light emitting display 900 according to another embodiment of the present invention, the plurality of elongated patterns 976 cause less stress on the upper insulating layer and the upper buffer layer due to repetitive bending operations The probability of occurrence of cracks at the edges of the upper insulating layer and the upper buffer layer is greatly reduced. Also, cracks generated in the upper insulating layer and the upper buffer layer outside the dummy area MA are not easily propagated to the touch electrode or the touch wiring. Accordingly, the flexible organic light emitting display 900 according to another embodiment of the present invention has excellent lifetime characteristics and bending reliability. And may be widely used in edge bending techniques for bending the edge of the lower substrate 610 to minimize the bezel area.

10 is a schematic plan view illustrating regions and a hole pattern of a lower substrate of a flexible organic light emitting display according to another embodiment of the present invention.

The flexible organic light emitting display device 1000 of FIG. 10 differs from the flexible organic light emitting display device 600 of FIG. 6 only in the configuration in which the elongated pattern 1078 extends so as to surround the display area DA, Are omitted because they are substantially the same.

Referring to FIG. 10, in the flexible organic light emitting diode display 1000 according to another embodiment of the present invention, a thin elongated pattern 1078 as a hole pattern is disposed inside the dummy area MA. The elongated pattern 1078 extends not to extend in one direction but to surround the display area DA. Specifically, the elongated pattern has a " C " shape and extends so as to surround all the remaining portions except the one side of the wiring region WA adjacent to the pad region TA. Although not shown in FIG. 10, a plurality of elongate patterns 1078 extending to surround the display area DA may be disposed in the dummy area MA.

In the flexible organic light emitting diode display 1000 according to another embodiment of the present invention, less cracks are generated in the edges of the upper insulating layer and the upper buffer layer in all regions except for the pad region TA, It can not be easily propagated to the touch electrode or the touch wiring.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: organic light emitting display
110, 210, and 610:
111, 211: Lower buffer layer
112, 212: gate insulating layer
113, 213: an interlayer insulating layer
120, 220: thin film transistors
125, 225: Lower planarization layer
126, 226: bank layer
134, 234: Organic light emitting device
138, 238: protective layer
139, 239: adhesive layer
140, 240: touch electrode
142, 242: upper planarization layer
144, 244: touch wiring
150, 250, 650: upper insulating layer
160, 260, 660: upper buffer layer
180, 280: upper substrate
190, 290: polarizer
200, 600, 900, 1000: Flexible organic light emitting display
221: active layer
222: gate electrode
223: source electrode
224: drain electrode
231: anode
232: organic light emitting layer
233: Cathode
235: first sealing layer
236: foreign matter compensation layer
237: second sealing layer
246: upper pad
270: Hall pattern
272: convex pattern
274: concave pattern
676, 976, and 1078:
DA: Display area
WA: wiring area
MA: dummy area
TA: pad area
BA: Bending area

Claims (17)

A lower substrate including a display region, a wiring region surrounding the display region, and a dummy region surrounding the wiring region, the lower substrate having flexibility;
A touch wiring disposed on the lower substrate, the touch wiring being disposed in the display region and the wiring region for transmitting a touch sensing preference;
An upper insulating layer disposed on the lower substrate so as to surround the touch wiring and disposed in the display region, the wiring region, and the dummy region;
An upper buffer layer disposed on the display region, the wiring region, and the dummy region on the upper insulating layer; And
And an upper substrate disposed on the upper buffer layer and having flexibility,
And a hole pattern is disposed in at least one of the upper insulating layer and the upper buffer layer in the dummy region. The method according to claim 1,
And the minimum width of the dummy region is 120 to 200 占 퐉. The method according to claim 1,
Wherein the upper insulating layer is formed of a material selected from the group consisting of AlOx, AlOxNy, TiOx, SiOx, ZnOx, ZrOx, Wherein the organic light emitting display device comprises: The method according to claim 1,
Wherein the upper insulating layer has a thickness of 3000 to 7000 ANGSTROM. The method according to claim 1,
Wherein the upper buffer layer comprises silicon nitride (SiNx), silicon oxide (SiOx), or a combination thereof. The method according to claim 1,
Wherein the thickness of the upper buffer layer is 2000 to 6000 ANGSTROM. The method according to claim 1,
Wherein the lower substrate further includes a bending region extending in one direction and overlapping with a portion of the display region, a portion of the wiring region, and a portion of the dummy region,
Wherein the hole pattern is disposed in a region where the bending region and the dummy region overlap each other. 8. The method of claim 7,
Wherein the hole pattern includes a concave pattern and a convex pattern disposed at an edge of the lower substrate. 9. The method of claim 8,
Wherein each of the concave pattern and the convex pattern is disposed to be connected to both the upper insulating layer and the upper buffer layer. 9. The method of claim 8,
Wherein the height of the convex pattern is 30 to 100 占 퐉. The method according to claim 1,
Wherein the flexible organic light emitting display device is front-bendable. 12. The method of claim 11,
Wherein the hole pattern comprises an elongated pattern disposed within the dummy region. ≪ RTI ID = 0.0 > 31. < / RTI > 13. The method of claim 12,
Wherein the elongated pattern extends in one direction. 13. The method of claim 12,
And wherein the elongated pattern is disposed adjacent to both the upper insulating layer and the upper buffer layer. 13. The method of claim 12,
Wherein the minimum width of the elongated pattern is 30 to 100 占 퐉. 13. The method of claim 12,
Wherein the elongated pattern is disposed in a plurality of positions between one side of the wiring region of the lower substrate and one side of the edge of the lower substrate. 13. The method of claim 12,
And the elongated pattern extends to surround the display region.

Images