KR20160061730A - fabrication methods of metal structures using conducting polymers - Google Patents

fabrication methods of metal structures using conducting polymers Download PDF

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KR20160061730A
KR20160061730A KR1020140164493A KR20140164493A KR20160061730A KR 20160061730 A KR20160061730 A KR 20160061730A KR 1020140164493 A KR1020140164493 A KR 1020140164493A KR 20140164493 A KR20140164493 A KR 20140164493A KR 20160061730 A KR20160061730 A KR 20160061730A
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conductive polymer
polymer substrate
metal
metal layer
conductive
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KR1020140164493A
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Korean (ko)
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고종수
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부산대학교 산학협력단
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Publication of KR20160061730A publication Critical patent/KR20160061730A/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to a metal structure using a conductive polymer and a method of manufacturing the same, and more particularly, to a method for manufacturing a conductive polymer substrate, which comprises forming a conductive polymer substrate, electroplating the conductive polymer substrate as a cathode, A method of fabricating a metal structure using a conductive polymer that forms a metal structure composed of only a metal layer by separating the conductive polymer substrate from a metal layer after forming a metal layer on a surface thereof. The present invention also provides a method of forming a conductive polymer substrate, comprising the steps of forming a metal layer on the surface of the conductive polymer substrate by electroplating with the conductive polymer substrate as a cathode and a metal as an anode in a plating bath, The conductive polymer substrate is formed on the outer surface of the roll and the metal layer is formed while the roll is rotated in the plating bath to continuously form the metal structure The method for manufacturing a metal structure is also a technical point. Accordingly, after forming a metal layer by electroplating on the surface of the conductive polymer using a conductive polymer having conductivity, and then separating the conductive polymer, a metal structure composed of only the metal layer is formed and used as a final metal product, It can be utilized as a mold for molding or an electrode for electric discharge machining.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a metal structure using a conductive polymer,

The present invention relates to a metal structure using a conductive polymer and a method of manufacturing the same, and more particularly, to a method of manufacturing a metal structure using a conductive polymer having conductivity by forming a metal layer on a surface of a conductive polymer by electroplating, To a metal structure using a conductive polymer to form a metal structure composed of only a metal layer and a method of manufacturing the same.

In general, polymeric materials are inexpensive, lightweight, excellent in strength and workability, chemically stable and excellent in corrosion resistance, compared with metal materials, and have been widely used as substitute materials for metals in recent years. In particular, when a metal film is attached to the surface of a polymer material, the function of the metal is added, and therefore, the use of the polymer material is remarkably widened. Hardness, strength, electrical conductivity, and lightweight, processability, productivity, and the like, and is very promising as a substitute material for metalwork such as brass. In particular, when a metal layer is formed on the surface of a polymer material, it can be used for various purposes such as an electromagnetic wave shielding film.

However, there are few examples in which a product is manufactured by electroplating a metal on the surface of a polymer material and then separating the plated layer. This is because it is difficult to plate the metal layer on the surface of the polymer material because it is an insulator.

A technique for forming a metal layer on the surface of such a polymer material is disclosed in Korean Patent Application Publication No. 10-2002-0071437 (published on September 12, 2002), entitled "Method for plating a metal film on the surface of a polymer material and electromagnetic wave shielding Method "has been introduced.

In the above prior art, the surface of a polymer material is modified by plasma treatment or the like, and a metal layer is formed by a method such as electroless plating and used for shielding the electric wave.

Another conventional technique is a method of forming a substrate using a conductive polymer material in a polymer material. In Korean Patent Application Publication No. 10-2005-0110276 (published on Nov. 23, 2005), "conductivity A flexible substrate using a polymer and a manufacturing method thereof ". The prior art discloses a method of forming a conductive polymer layer by coating a conductive polymer on one side or both sides of a polyimide base film to form a conductive polymer layer and forming at least one metal layer including copper on the outside of the conductive polymer layer by an electrochemical method And a method of manufacturing a flexible substrate.

As another conventional technique, Korean Patent Application Publication No. 10-2013-0030494 (published on Mar. 27, 2013), "a plating pattern and a manufacturing method thereof", a manufacturing method thereof are introduced. The prior art includes a base substrate; A conductive polymer formed on the base substrate and patterned to selectively deactivate the deactivating agent; And a plating layer formed on a portion of the conductive polymer other than the inactivated portion.

In the case of the above-mentioned prior art, in the case of a non-conductive polymer material, after a surface modification or the like is performed, a metal layer is formed and used on the surface thereof. In the case of a conductive polymer, a conductive polymer is deposited on the surface of a base substrate, There is no example in which a metal plating layer is formed by directly electroplating the surface of the conductive polymer using a conductive polymer and then the conductive polymer is removed to leave only the metal plating layer to form the metal structure.

(Patent Document 1) Korean Patent Application Publication No. 10-2002-0071437 (Publication date: September 12, 2002) (Document 2) Korean Patent Application Publication No. 10-2005-0110276 (Published Date November 23, 2005) (Document 3) Korean Patent Application Publication No. 10-2013-0030494 (Published on March 27, 2013)

DISCLOSURE Technical Problem Accordingly, the present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a conductive polymer having conductivity, And to provide a metal structure using a conductive polymer for forming a formed metal structure and a method of manufacturing the same.

In order to accomplish the above object, the present invention provides a method for manufacturing a conductive polymer substrate, comprising: forming a conductive polymer substrate; forming a metal layer on the surface of the conductive polymer substrate by electroplating with the conductive polymer substrate as a cathode and metal as an anode in a plating bath And separating the conductive polymer substrate from the metal layer, thereby forming a metal structure composed of only the metal layer. The present invention also provides a method for manufacturing a metal structure using the conductive polymer.

It is preferable that the conductive polymer substrate is one of poly-3,4-ethylenedioxythiophene, polyaniline, polyacetylene, polypyrrole, polythiophene, polyphenylene vinylene, and polyphenylene sulfide.

The conductive polymer substrate is preferably formed by mixing conductive particles with a non-conductive polymer.

The conductive polymer substrate is preferably formed in a plate or columnar shape.

It is preferable that the plate-shaped conductive polymer substrate has a porous metal auxiliary material embedded in the conductive polymer substrate or a conductive layer formed on the other side of the conductive polymer.

The columnar conductive polymer substrate preferably has metal wires or metal rods formed along the axial direction.

It is preferable that the conductive polymer substrate has a nonconductive structure formed on one surface of the substrate to be electroplated.

It is preferable that the conductive polymer substrate has unevenness formed on one side thereof.

It is preferable that the plate-like conductive polymer substrate is formed in a curved shape.

It is preferable that the conductive polymer substrate exposes the conductive particles mixed with the nonconductive polymer by etching one surface of the conductive polymer substrate.

The conductive particles exposed to the outside are preferably transferred to the surface of the metal layer.

In the present invention, a conductive polymer substrate is formed, a metal layer is formed on the surface of the conductive polymer substrate by electroplating with the conductive polymer substrate as a cathode and a metal as an anode in a plating bath, The conductive polymer substrate is formed on the outer surface of the roll and the metal layer is formed while the roll is rotated in the plating bath to continuously form the metal structure, The method for manufacturing a metal structure using the same is also a technical point.

The conductive polymer substrate preferably has a nonconductive structure on its surface to be electroplated.

Preferably, the metal structure has a mesh-like metal structure.

Preferably, the metal structure is formed with a micro-sized mesh structure.

It is preferable to pass through a nanostructure forming step of forming a nanostructure on the surface of the metal structure.

And the surface modification step of modifying the surface of the metal structure after the nanostructure forming step.

Accordingly, after forming a metal layer by electroplating on the surface of the conductive polymer using a conductive polymer having conductivity, and then separating the conductive polymer, a metal structure composed of only the metal layer is formed and used as a final metal product, It can be utilized as a mold for molding or an electrode for electric discharge machining.

According to the present invention, a metal layer is formed on the surface of a conductive polymer by electroplating using a conductive polymer having conductivity, and then a conductive polymer is separated to easily form a metal structure composed of only a metal layer, There is an effect that it can be utilized as a metal product, a mold for molding another product, an electrode for electric discharge machining, or the like.

1 is a schematic view of forming a metal structure using a conductive polymer according to a first embodiment of the present invention,
2 is a schematic view of a conductive polymer substrate having a conductive layer formed on the other side of a conductive polymer substrate according to a second embodiment of the present invention,
3 is a schematic view of a conductive polymer substrate in which a porous metal auxiliary material is formed inside a conductive polymer substrate according to a second embodiment of the present invention,
FIG. 4 is a schematic view of forming a metal structure using a conductive polymer in which a non-conductive structure according to a third embodiment of the present invention is formed,
5 is a schematic view of forming a mesh-like metal structure using a conductive polymer having a nonconductor structure according to a third embodiment of the present invention,
6 is a schematic view of forming a tubular metal structure using the conductive polymer according to the fourth embodiment of the present invention,
7 is a schematic view of a conductive polymer substrate in which a metal wire or a metal rod is formed on the central axis of the conductive polymer substrate according to the fourth embodiment of the present invention,
FIG. 8 is a schematic view of a conductive polymer substrate having concave and convex portions formed on an outer surface of a conductive polymer substrate according to a fourth embodiment of the present invention,
9 is a schematic view of forming a porous tubular metal structure using a conductive polymer having a nonconductive structure according to a fifth embodiment of the present invention,
10 is a schematic view of forming a metal structure using a bent conductive polymer substrate according to a sixth embodiment of the present invention,
11 is a schematic view of forming a metal structure using a conductive polymer substrate containing conductive particles inside a conductive polymer according to a seventh embodiment of the present invention,
12 is a schematic view of forming a continuous metal structure using a roll-shaped conductive polymer according to an eighth embodiment of the present invention,
13 is a schematic view of a device for forming a continuous metal mesh structure by forming a nonconductive structure on the outer surface of a rolled conductive polymer according to a ninth embodiment of the present invention,
14 is a scanning electron micrograph of a conductive polymer substrate according to a ninth embodiment of the present invention,
FIG. 15 is a scanning electron microscope (SEM) image of a micro-metal mesh, which is a metal structure according to a ninth embodiment of the present invention,
16 is a SEM photograph showing a nanostructure forming photograph of the surface of a nickel mesh according to the ninth embodiment of the present invention,
17 is a graph showing the super-water-repellent characteristics of the nano-micro-metal mesh modified with the super water-repellent surface according to the ninth embodiment of the present invention,
FIG. 18 is a graph showing the super-affinity characteristic of the nano-micro-metal mesh modified with the super-lipophilic surface according to the ninth embodiment of the present invention,
FIG. 19 is a graph showing the characteristics of super oil-refining of a nano-micro-metal mesh modified with a super oil-releasing surface according to a ninth embodiment of the present invention,
FIG. 20 is a diagram illustrating super-hydrophilic characteristics of a nano-micro-metal mesh modified with a superhydrophilic surface according to a ninth embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic view of forming a metal structure using a conductive polymer according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a conductive polymer substrate according to a second embodiment of the present invention, FIG. 3 is a schematic view of a conductive polymer substrate in which a porous metal auxiliary material is formed in a conductive polymer substrate according to a second embodiment of the present invention. FIG. 4 is a schematic view of a conductive polymer substrate according to a third embodiment of the present invention. FIG. 5 is a schematic view illustrating formation of a mesh-like metal structure using a conductive polymer having a nonconductor structure according to a third embodiment of the present invention. FIG. 5 is a schematic view of a metal structure using a conductive polymer, 6 is a schematic view of forming a tubular metal structure using the conductive polymer according to the fourth embodiment of the present invention, FIG. 8 is a schematic view of a conductive polymer substrate in which a metal wire or a metal rod is formed on the central axis of a conductive polymer substrate according to a fourth embodiment of the present invention. FIG. 8 is a schematic view of a conductive polymer substrate according to a fourth embodiment of the present invention, 9 is a schematic view of forming a porous tubular metal structure using a conductive polymer in which a nonconductor structure according to a fifth embodiment of the present invention is formed, and FIG. 10 is a schematic view of a conductive polymer substrate according to a sixth embodiment of the present invention 11 is a schematic view of a conductive polymer substrate including conductive particles in a conductive polymer according to a seventh embodiment of the present invention to form a metal structure Fig. 12 is a schematic view showing a state in which the roll-shaped conductive polymer according to the eighth embodiment of the present invention is used FIG. 13 is a schematic view of a device for forming a continuous metal mesh structure by forming a nonconductive structure on the outer surface of the roll-shaped conductive polymer according to the ninth embodiment of the present invention, FIG. 14 is a scanning electron micrograph of a conductive polymer substrate according to a ninth embodiment of the present invention, and FIG. 15 is a scanning electron micrograph of a metal mesh according to a ninth embodiment of the present invention. And FIG. 16 is a SEM photograph showing a nanostructure formed on a surface of a nickel mesh according to the ninth embodiment of the present invention. FIG. 17 is a cross- FIG. 18 is a graph showing the superfluidity characteristics of the micro-metal mesh according to the ninth embodiment of the present invention. FIG. FIG. 19 is a diagram showing the characteristics of super-oil-refining of a nano-micro metal mesh modified with a super oil-releasing surface according to a ninth embodiment of the present invention, and FIG. 20 is a cross- Hydrophobic characteristics of the surface modified nano-micro metal mesh.

As shown in the drawings, the metal structure using the conductive polymer according to the present invention can be produced by processing a conductive polymer substrate into a specific shape, using a conductive polymer substrate as a cathode, using a metal to be plated as an anode, The metal layer is formed on the outer surface of the conductive polymer substrate.

Since the conductive polymer is electrically conductive to the material itself, there is no need for an additional metal coating for electrical connection. Therefore, electroplating can be performed by connecting electrodes directly to the conductive polymer substrate. After the electroplating is completed, the conductive polymer is removed from the metal layer, which is a plating material, or removed by a method such as etching, thereby forming a metal structure having a reverse phase of the surface shape of the initial conductive polymer substrate.

In order to more easily separate the conductive polymer substrate from the metal layer, if the temperature difference is increased or decreased by the temperature during the separation, the interface between the conductive polymer and the metal layer can be easily separated due to the different thermal expansion coefficient between the polymer and the metal. Further, separation of the polymer and the metal layer can be facilitated by applying vibration energy such as ultrasonic waves, or by injecting high-pressure air or water to the interface between the polymer and the metal layer.

Here, the conductive polymer may be prepared by using various kinds of conductive polymers such as poly-3,4-ethylenedioxythiophene, polyaniline, polyacetylene, polypyrrole, polythiophene, polyphenylene vinylene and polyphenylene sulfide doped with a suitable impurity. And various conductive particles such as conductive carbides such as carbon nanotubes (CNTs) and graphenes or metal powders may be dispersed in the nonconductor polymer.

The nonconductive polymer is made of acrylic, polymethyl methacrylate (PMMA), polyethylene, PTFE, Teflon, polycarbonate, polyvinylidene fluoride (PVDF), or cyclic olefin copolymer (COC). Such as silicone-based elastic rubbers containing various carbon materials or various carbon-based or polydimethyl siloxane (PDMS) polymers, such as nylon, polyester, polyvinyl, Kapton and photoresist, Materials can also be used.

When the conductive polymer substrate is processed, lathe processing such as turning, milling, and drilling, and groove processing using a dicing device can be performed. Laser processing and water jet processing are possible, and lithography processing is possible , Wet etching using plasma or wet etching using chemical solution is also possible. Conventional conventional processing methods such as injection molding, casting, embossing, extrusion, drawing and the like can also be used.

On the other hand, the plated metal structure itself may be a final product, and may be utilized as a mold for molding other products or as an electrode for EDM.

Electroplating uses a general electroplating. When a conductive polymer substrate of the present invention is used as a negative electrode in a plating bath filled with an electrolyte and a metal to be plated on the conductive substrate is used as an anode, a constant voltage is applied to the positive electrode, A metal layer of a predetermined thickness is formed on the outer surface of the substrate. Here, since the electroplating is a well-known technique, a further detailed description will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

≪ Embodiment 1 >

1, a planar conductive polymer substrate 100 having concavities and convexities is formed and electroplated thereon to form a metal layer 110 on the surface of the conductive polymer substrate having the concave and convex portions formed thereon The conductive polymer substrate 100 is removed to form a plate-shaped metal structure 120, which is a pure metal layer 110. At this time, the metal layer 110 has a planar metal structure 120 having irregularities corresponding to opposite phases of the irregularities formed on the conductive polymer substrate 100. Although the planar conductive polymer substrate 100 has been described as having concave and convex portions, the metal structure 120 can be formed using the planar conductive polymer substrate 100 having no concavities and convexities. That is, the conductive polymer substrate 100 having a plate shape and various shapes can be used to form the metal structure 120 having various shapes corresponding thereto.

≪ Embodiment 2 >

The second embodiment of the present invention is to improve the electrical conductivity of the conductive polymer substrate 100. As shown in FIG. 2, the conductive polymer substrate 100 may be formed by depositing or depositing a metal on the other side of the conductive polymer substrate 100 The conductive layer 200 is formed. This is because when the negative (-) electrode is connected to the conductive layer 200 at the time of plating, the electric conductivity is increased and the plating can be accelerated.

3, if a porous metal auxiliary material 220 in the form of a mesh or a sponge is embedded in the conductive polymer substrate 100, and the negative electrode is connected to the porous metal auxiliary material 220, the electrical conductivity may be increased, And the plating can be made uniform over the entire surface. Of course, in the second embodiment of the present invention, after the plating, the conductive polymer substrate 100 is separated to form a plate-like metal having irregularities corresponding to opposite phases of the irregularities formed on the conductive polymer substrate 100 Structure 120 is obtained.

≪ Third Embodiment >

A third embodiment of the present invention is a method of forming a nonconductive structure 300 on a planar conductive polymer substrate 100, electroplating the same, removing the conductive polymer substrate 100, 120 or a porous metal structure in the form of a mesh is formed.

As shown in FIG. 4, first, a plurality of nonconductive structures 300 are formed on the upper surface of the conductive polymer substrate 100 in the form of a plate. Then, electroplating is performed in the same manner as in the first embodiment. When the electroplating is performed for a predetermined time, a metal layer 110 is formed between the non-conductor structure 300 and the upper surface of the non-conductor structure 300. When the metal layer 110 is formed, the conductive polymer substrate 100 on which the non-conductive structure 300 is formed is separated to form a plate-like metal structure 120 having a high cross-section.

As shown in FIG. 5, the metal structure 120 having a mesh-like structure is formed by first forming a plurality of non-conductive structures 300 on the upper surface of the conductive polymer substrate 100. Then, electroplating is performed in the same manner as in the first embodiment. When the electroplating is performed for a predetermined time or less, the height of the plated metal layer 110 becomes lower than the height of the nonconductive structure 300. A metal layer 110 is formed only inside the nonconductor structure 300 and a non-electroplated metal layer 110 is formed on the nonconductor structure 300 and the conductive polymer substrate 100 To form a mesh-like plate-shaped porous metal structure 120.

<Fourth Embodiment>

A fourth embodiment of the present invention relates to a structure for forming a tubular metal structure. As shown in FIG. 6, a columnar conductive polymer substrate 100 is formed and electroplated using the conductive polymer substrate 100 to form a conductive metal layer on the surface of the conductive polymer substrate. After the metal layer 110 is formed, the conductive polymer substrate 100 is removed to form a tubular metal structure 120 that is a pure metal layer 110.

As shown in FIG. 7, when a columnar conductive polymer substrate having a metal wire 400 embedded along the axial direction is used and a negative electrode is connected to the metal wire 400, the electrical conductivity can be greatly increased, It is possible to uniformize the plating on the entire surface of the conductive polymer substrate 100. After the plating, the conductive polymer substrate 100 is separated to form a tubular metal structure 120.

8, electroplating is performed using a conductive polymer substrate having concave and convex portions formed on the surface of the columnar conductive polymer substrate 100 to form a metal layer 110 on the surface, and the conductive polymer substrate 100 When the metal layer 110 is removed, a cylindrical metal structure 120 having irregularities corresponding to opposite phases of the irregularities formed on the conductive polymer substrate 100 is formed on the inner peripheral surface of the metal layer 110. The shape of the tube is not limited to the above-described columnar shape, and may be formed in a shape such as a triangle, a rectangle, a hexagon, an ellipse, a star, or the like depending on the shape of the conductive polymer substrate.

<Fifth Embodiment>

A fifth embodiment of the present invention relates to a structure for forming a tubular metal structure having a porous structure. As shown in FIG. 9, a plurality of non-conductive structures 300 are formed on the outer surface of a columnar conductive polymer substrate 110 . Then, electroplating is performed in the same manner as in the first embodiment. When the electroplating is performed for a predetermined time or less, the metal layer 110 is formed only in the non-conductor structure, and the non-electroplated metal layer 110 is formed in the non-conductor structure 300. In this state, the conductive polymer substrate 100 on which the nonconductor structure 300 is formed is removed, thereby forming a square tubular metal structure 120 having meshed pores on its surface.

<Sixth Embodiment>

The sixth embodiment of the present invention forms a metal structure having a bent shape. The conductive polymer substrate 100 can be processed in any shape, and the material itself is flexible, so that it can be bent into a desired shape.

Therefore, as shown in FIG. 10, after forming a plate-shaped and curved conductive polymer substrate 100 having irregularities, electroplating the conductive polymer substrate 100 to form a metal layer 110 on the surface of the conductive polymer substrate 100 having the irregularities, The substrate 100 is removed to form a plate-like metal structure 120 that is a pure metal layer 110. The metal layer 110 has a plate-shaped bent metal structure 120 having irregularities corresponding to opposite phases of the irregularities formed on the conductive polymer substrate.

<Seventh Embodiment>

A seventh embodiment of the present invention relates to the case of forming a metal structure using a conductive polymer substrate containing conductive particles such as carbon nanotubes (CNT).

11, the surface of the conductive polymer substrate containing the conductive particles 600 is first etched very thinly, thereby exposing the conductive particles 600 to the surface. The conductive particles 600 are bonded to the metal layer 110 by electroplating the conductive polymer substrate 100 and forming the metal layer 110 in a state where the conductive particles 600 are exposed. When the conductive polymer substrate 100 is removed in this state, the metal structure 120 having the conductive particles 600 fixed on the surface of the plated metal layer 110 is formed. In this way, the conductive particles can be firmly fixed to the metal surface.

The surface etching of the conductive polymer substrate may be performed by dry etching using a plasma or a laser using a gas such as oxygen or helium, or wet etching using a chemical solution.

&Lt; Eighth Embodiment >

An eighth embodiment of the present invention relates to a structure for continuously forming a metal structure.

As shown in FIG. 12, when the conductive polymer substrate 100 is formed on the outer surface of the roll 500 in a cylindrical shape, or when the cylindrical conductive polymer substrate is used as a direct roll, do. On the outer surface of the cylindrical conductive substrate, irregularities are formed if necessary.

In this state, the conductive polymer substrate 100 is used as a cathode, a certain voltage is applied to the anode using a metal to be plated on the conductive substrate as an anode, and the conductive polymer substrate is rotated in the plating bath 700 The metal layer 110 is formed on the outer surface of the conductive polymer substrate 100 by electroplating and the conductive polymer substrate 100 is rotated and separated from the electrolyte solution of the plating bath 700, 110 are separated from the conductive polymer substrate 100, and a plate-like metal structure 120 is continuously formed.

&Lt; Example 9 &

A ninth embodiment of the present invention relates to a structure for continuously forming a mesh-shaped metal structure.

FIG. 13 is a schematic view of a device for forming a continuous metal mesh structure, which comprises a micro-metal mesh forming step of forming a metal structure using electroplating, a step of forming a metal mesh on the surface of the metal mesh, A nanostructure forming step of forming a structure, and a surface modification step of modifying the surface of the metal mesh through the nanostructure forming step.

In order to form the micrometal mesh, a conductive polymer substrate is required. The conductive polymer substrate 100 is formed on the outer surface of the roll 500 in a cylindrical shape to form the conductive polymer substrate 100, The polymer substrate is used as a direct roll.

14 is a scanning electron micrograph of a conductive polymer substrate according to a ninth embodiment of the present invention. In the conductive polymer substrate, a conductive region 101 in which electrically conductive carbon nanotubes are mixed with silicon, The non-conductive region 300 is formed. The conductive region 101 is a portion to be electroplated by electroplating described later, and the non-conductive region becomes a portion which is not electroplated by electroplating described later. The electroplating referred to in the present invention mainly refers to electroforming, and the same is applied hereinafter.

The micrometallic mesh formation step is performed using the conductive polymer substrate 100 formed in a roll shape as described above. In this case, the conductive polymer substrate 100 is used as a cathode in the plating bath, and the anode A metal layer 110 is formed on the outer surface of the conductive polymer substrate 100 by electroplating. The metal layer 110 is formed on the outer surface of the conductive polymer substrate 100 by electroplating The conductive polymer substrate 100 is rotated and separated from the electrolytic solution of the plating bath 700 so that the metal layer 110 is separated from the conductive polymer substrate 100 to form a micro metal mesh (121) is formed. In the present invention, nickel is used as the metal to be plated, and a scanning electron microscope photograph of the micro-metal mesh 121, which is a metal structure formed using nickel, is shown in FIG. According to FIG. 15, it can be seen that a mesh having a micro size is formed.

The micro-metal mesh 121 is subjected to a cleaning and drying process and then a nanostructure forming step. The micrometallic mesh formed through the micrometallic mesh forming step is formed by passing through a first water tank 710 filled with a nanostructure forming solution to form a nano-micro metal mesh 122 Is formed.

FIG. 16 is a SEM photograph showing a nanostructure-forming photograph of the surface of a nickel mesh according to the present invention, showing that a nano-sized nanostructure is formed on the surface of a micro-metal mesh.

The nano-micro-metal mesh 122 is subjected to a surface modification step of modifying the surface of the nano-micro-metal mesh 122 after cleaning and drying. The surface of the nano-micro metal mesh 122 is modified by passing through the second water tank 720 filled with the surface modification solution. Here, the surface of the nano-micro metal mesh 122 can be modified into a surface having various properties such as lipophilic, oil-repellent, hydrophilic, and water-repellent depending on the properties of the surface modification solution. In addition, functional materials such as a chemical substance, a biomaterial, and a self-assembled monolayer (SAM) that catalyze a catalyst in the surface modification process can be applied to the surface of the metal mesh to impart functionality to the surface of the mesh.

FIG. 17 is a graph showing super-water-repellent characteristics of a nano-micro-metal mesh modified with a super water-repellent surface according to a ninth embodiment of the present invention, wherein water is in contact with a nano- FIG. 18 is a graph showing the super-affinity characteristic of the nano-micrometallic metal mesh modified with the supra -channel surface according to the ninth embodiment of the present invention, and shows the super-affinity phenomenon in which the oil contacts the nano- In which the water contacts the surface of the nano-micro metal mesh to show the super oil-releasing characteristic of the nano-micro metal mesh modified with the super oil-releasing surface according to the ninth embodiment of the present invention, Shows a superhydrophilic characteristic of a nano-micro metal mesh modified with a superhydrophilic surface according to a ninth embodiment of the present invention, in which the oil contacts the nano- You can see the burning.

It can be seen that the surface of the nano-micro metal mesh can be surface-modified for various purposes depending on the surface modification solution.

The nano-micro-metal mesh having undergone the surface modification step is again cleaned and dried, and then is wound on the winding roll 800 to form a final metal structure. This series of processes proceeds continuously.

As described above, the conductive polymer having conductivity is used to form a metal layer on the surface of the conductive polymer by electroplating, and then the conductive polymer is separated to easily form a metal structure composed of only the metal layer, A mold for molding other products, an electrode for electric discharge machining, etc., and the above-described embodiments do not limit the scope of the present invention to the extent of explaining the scope of application of the present invention.

100: conductive polymer substrate 101: conductive region
110: metal layer 120: metal structure
121: Micro metal mesh 122: Nano-micro metal mesh
200: conductive layer 220: porous metal auxiliary
300: nonconductor structure 400: metal wire
500: Roll 600: Conductive particles
700: Plating tank 710: First tank
720: The second tank 800:

Claims (18)

Forming a conductive polymer substrate, forming a metal layer on the surface of the conductive polymer substrate by electroplating with the conductive polymer substrate as a cathode and a metal as an anode in a plating bath, and then separating the conductive polymer substrate from the metal layer And forming a metal structure composed of only the metal layer. The conductive polymer substrate according to claim 1, wherein the conductive polymer substrate is one of poly-3,4-ethylenedioxythiophene, polyaniline, polyacetylene, polypyrrole, polythiophene, polyphenylene vinylene, polyphenylene sulfide METHOD FOR MANUFACTURING METAL STRUCTURES USING CONDUCTIVE POLYMER. The method of claim 1, wherein the conductive polymer substrate is formed by mixing conductive particles with a nonconductive polymer. The method of claim 1, wherein the conductive polymer substrate is formed in a plate or column shape. [6] The method of claim 4, wherein the plate-like conductive polymer substrate has a porous metal auxiliary material embedded in the conductive polymer substrate or a conductive layer formed on the other side of the conductive polymer. 5. The method of claim 4, wherein the columnar conductive polymer substrate is formed with a metal wire or a metal rod along the axial direction. The method of claim 1, wherein the conductive polymer substrate has a nonconductor structure formed on one side surface of the substrate to be electroplated. The method of claim 1, wherein the conductive polymer substrate has unevenness formed on one side thereof. The method of claim 4, wherein the plate-like conductive polymer substrate is formed in a curved shape. [4] The method of claim 3, wherein the conductive polymer substrate is formed by etching one side surface of the conductive polymer substrate to expose conductive particles mixed with the nonconductive polymer to the outside. 11. The method of claim 10, wherein the conductive particles exposed to the outside are transferred to the surface of the metal layer. A conductive polymer substrate is formed, a metal layer is formed on the surface of the conductive polymer substrate by electroplating with the conductive polymer substrate as a cathode and the metal as an anode in a plating bath, and then the conductive polymer substrate is separated from the metal layer A metal structure composed of only a metal layer is formed,
Wherein the conductive polymer substrate is formed on an outer surface of the roll, and the roll is rotated in a plating bath to form a metal layer, thereby continuously forming a metal structure. 13. The method of claim 12, wherein the conductive polymer substrate has a nonconductive structure formed on the surface thereof to be electroplated. 14. The method of claim 13, wherein the metal structure has a mesh-like metal structure. 15. The method of claim 14, wherein the metal structure comprises a micro-sized mesh structure. 16. The method of claim 15, wherein the step of forming a nanostructure is formed on the surface of the metal structure. 17. The method of claim 16, wherein the nanostructure forming step is followed by a surface modification step of modifying the surface of the metal structure. 18. A metal structure using a conductive polymer, which is formed by the method of any one of claims 1 to 17.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020071437A (en) 2001-03-06 2002-09-12 유승균 Plating method of metal film on the surface of polymer
KR20050110276A (en) 2004-05-18 2005-11-23 엘에스전선 주식회사 Flexible copper clad laminate using coducting polymer and the method for producing the same
KR20130030494A (en) 2011-09-19 2013-03-27 삼성전기주식회사 Plating pattern and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020071437A (en) 2001-03-06 2002-09-12 유승균 Plating method of metal film on the surface of polymer
KR20050110276A (en) 2004-05-18 2005-11-23 엘에스전선 주식회사 Flexible copper clad laminate using coducting polymer and the method for producing the same
KR20130030494A (en) 2011-09-19 2013-03-27 삼성전기주식회사 Plating pattern and method of manufacturing the same

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