KR20160052327A - Sensor package - Google Patents

Sensor package Download PDF

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Publication number
KR20160052327A
KR20160052327A KR1020150146590A KR20150146590A KR20160052327A KR 20160052327 A KR20160052327 A KR 20160052327A KR 1020150146590 A KR1020150146590 A KR 1020150146590A KR 20150146590 A KR20150146590 A KR 20150146590A KR 20160052327 A KR20160052327 A KR 20160052327A
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KR
South Korea
Prior art keywords
substrate
case
bumps
sensor package
pad
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Application number
KR1020150146590A
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Korean (ko)
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KR101782221B1 (en
Inventor
히사유키 야자와
히로유키 아사히나
히사노부 오카와
마나부 우스이
마사히코 이시조네
아츠시 돈도코로
Original Assignee
알프스 덴키 가부시키가이샤
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Publication of KR20160052327A publication Critical patent/KR20160052327A/en
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Publication of KR101782221B1 publication Critical patent/KR101782221B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)

Abstract

[PROBLEMS] To provide a sensor package capable of miniaturization and low-emission while ensuring detection performance.
[MEANS FOR SOLVING PROBLEMS] An IC substrate is provided with a pressure detecting portion, an IC substrate to which the detection result by the pressure detecting portion is inputted, and a case having a housing space for accommodating the pressure detecting portion therein. So as to cover the opening portion. The IC substrate and the case are electrically connected by a plurality of bumps arranged at intervals. The pressure detecting portion is electrically connected to the IC substrate through the conduction path formed in the case, and the gap between the plurality of bumps forms a gap do.

Description

Sensor package {SENSOR PACKAGE}

The present invention relates to a sensor package that can be miniaturized and reduced in height.

Patent Document 1 discloses a sensor package in which an IC chip is disposed in a bottom portion of a housing, and an acceleration sensor is disposed on the IC chip with a bump and a conductive resin interposed therebetween. In addition, the upper portion of the housing is airtightly covered by the cover body. With this configuration, there is no need to arrange the IC chip and the acceleration sensor in parallel on the same substrate, and it is not necessary to use a gold wire for connecting the IC chip and the acceleration sensor, so that miniaturization can be achieved.

Japanese Patent Application Laid-Open No. 2008-026183

2. Description of the Related Art In recent years, there has been a demand for further downsizing and downsizing of a sensor in accordance with the demand for miniaturization and thinning of a product on which a sensor is mounted. However, in the conventional sensor configuration in which the IC chip and the sensor chip are arranged on the same substrate, there is a problem that miniaturization of each constituent member becomes necessary.

In the pressure sensor, when the housing is closed by the lid body as in the acceleration sensor described in Patent Document 1, since outside air is not introduced into the space in which the pressure sensor is housed, it is difficult to accurately detect the pressure.

Therefore, it is an object of the present invention to provide a sensor package that can be miniaturized and reduced in weight while ensuring detection performance.

In order to solve the above problems, a sensor package according to the present invention is a sensor package comprising: a detecting unit that performs a detecting operation in contact with an outside air; an IC substrate to which a detection result by the detecting unit is inputted; And,

The IC substrate is arranged so as to cover the opening portion in a state having an introduction gap for introducing outside air between the IC substrate and the opening portion of the accommodating space.

As a result, the detection performance can be ensured, the detection unit housed in the accommodation space is not easily damaged from the outside, and the sensor package can be reduced in weight and size.

The detecting unit is a pressure detecting unit. Alternatively, in place of or in addition to the pressure detecting section, the temperature detecting section and the humidity detecting section may be disposed in the receiving space. Even in this case, since it is protected from damage from the outside and outside air is introduced, accurate detection can be performed.

In the sensor package of the present invention, the IC substrate and the case are electrically connected by a plurality of bumps arranged at intervals, and the pressure detecting portion is electrically connected to the IC substrate through the conduction path formed in the case, It is preferable that the introduction gaps are formed between the plurality of bumps.

Thereby, outside air can be surely introduced, and a special structure for forming the gap is not required.

In the sensor package of the present invention, it is preferable that the detecting portion is electrically connected to the pad portion formed in the case by wire bonding, and the pad portion is disposed inside the plurality of bumps.

As a result, the area for carrying out the wire bonding can be widened without increasing the outer shape of the case.

In the sensor package of the present invention, it is preferable that a plurality of pad portions are formed, and the arrangement direction of the plurality of pad portions and the arrangement direction of the plurality of bumps are mutually orthogonal.

This makes it possible to obtain a wider area for carrying out the wire bonding.

In the sensor package of the present invention, it is preferable that the case has a protective wall portion surrounding the side surface of the IC substrate with a gap therebetween.

Thereby, it is possible to protect the IC substrate from damage from the outside, and to accurately measure the sensor package in that ambient air is introduced from the gap.

In the sensor package of the present invention, the height of the protective wall portion is preferably larger than the thickness of the IC substrate.

This makes it possible to more reliably protect the IC substrate.

According to the present invention, it is possible to provide a sensor package capable of achieving miniaturization and reduction in weight while ensuring detection performance in contact with the outside air.

1 is a perspective view showing a configuration of a sensor package according to the first embodiment.
2 is a perspective view showing a state in which the IC substrate is removed from the sensor package of Fig.
Fig. 3 is a plan view showing the structure shown in Fig. 2 in a simplified manner.
4 is a bottom view showing the IC substrate in the first embodiment in a simplified manner.
FIG. 5 is a simplified cross-sectional view taken along line VV 'of FIG. 1; FIG.
6 is a perspective view showing a configuration of a sensor package according to the second embodiment.
7 is a perspective view showing a state in which the IC substrate is removed from the sensor package of Fig.
8 is a simplified cross-sectional view taken along the line VIII-VIII 'in FIG.
Fig. 9 is a cross-sectional view showing a configuration of a sensor package according to a modification of the second embodiment, showing cross sections corresponding to lines VIII-VIII 'in Fig. 6;

Hereinafter, a sensor package according to an embodiment of the present invention will be described in detail with reference to the drawings.

≪ First Embodiment >

1 is a perspective view showing a configuration of a sensor package 10 according to a first embodiment. 2 is a perspective view showing a state in which the IC substrate 40 is removed from the sensor package 10. Fig. 3 is a plan view showing the structure shown in Fig. 2 in a simplified manner. 4 is a bottom view showing the IC substrate 40 in a simplified form. Fig. 5 is a simplified cross-sectional view taken along the line V-V 'in Fig. Hereinafter, the Z1 direction shown in each drawing is referred to as an upward direction and the Z2 direction is described as a downward direction. The X1-X2 direction and the Y1-Y2 direction shown in the respective drawings are orthogonal to each other and perpendicular to the Z1-Z2 direction. The XY plane is a plane orthogonal to the Z1-Z2 direction.

5, the sensor package 10 is provided with a pressure detecting portion 20 serving as a detecting portion which performs a detecting operation in contact with the outside air, a case 30, and an IC substrate 40. [

The pressure detecting unit 20 is, for example, a diaphragm gauge that detects a pressure applied to the diaphragm using a change in capacitance or a strain gauge. 5, the pressure detecting portion 20 is accommodated in the accommodating space 30s of the case 30 and the bottom surface 22 is connected to the bottom surface 36 of the accommodating space 30s of the case 30, And is fixed by the die-bonding resin. 3, the pressure detecting section 20 includes four first pad portions 23 made of a conductive material (for example, gold) at four corners of a quadrangular upper surface 21 in a plan view And the detection result is output from the first pad portion 23. [

The case 30 is made of a non-conductive material (for example, ceramics), and as shown in Figs. 3 and 5, extends from a position surrounding the four sides of the bottom surface 36 in the center of the XY plane, And has a three-tiered structure composed of a lower end, an intermediate portion, and an upper portion formed so as to spread outwardly in a stepwise manner. Thereby, a housing space 30s for housing the pressure detecting portion 20 is formed in the case 30. (The pad forming surface) of the case 30 located on the outer side of the bottom surface 36 in the XY plane is provided with four pieces of conductive material (for example, gold) on the four corners of the XY plane Two pad portions 35 are formed. The four second pad portions 35 are disposed in the vicinity of the first pad portion 23 in the XY plane so as to correspond to the four first pad portions 23, respectively.

The number of the first pad portion 23 and the number of the second pad portion 35 may not be four, but two. In this case, it is preferable to form them at two corresponding positions along the Y1-Y2 direction.

In the case 30, on the bump forming surface 31, which is the uppermost surface (top surface) located on the outer side of the intermediate surface 34 in the XY plane, six first bumps 33 are formed. The first bumps 33 are formed so as to protrude by a predetermined amount in the Z1 direction by, for example, gold plating, and are arranged at regular intervals in the X1-X2 directions.

Here, the arrangement direction (X1-X2 direction) of the first bump 33 is orthogonal to the arrangement direction (Y1-Y2 direction) of the first pad portion 23 and the second pad portion 35. [ In other words, in the case 30, the first bumps 33 are arranged along two sides at both ends in the Y1-Y2 direction, while the second pad portions 35 are arranged at both ends in the X1- Are arranged along two sides. With this arrangement, a region for wire bonding from the first pad portion 23 to the second pad portion 35 can be widened.

Output pads 37 made of a conductive material (e.g., gold) are formed on the XY plane of the bottom surface 32 of the case 30, respectively.

The IC substrate 40 has an arithmetic unit for generating digital output data based on the detection result by the pressure detection unit 20. [ The arithmetic unit is an integrated circuit and is disposed on the lower surface 42 side. The calculation unit corrects the detection result by the pressure detection unit 20 based on the detection result by the temperature sensor formed on the IC substrate 40. [ On the lower surface 42 of the IC substrate 40, six second bumps 43 are formed at both end portions in the Y1-Y2 direction. The second bumps 43 are formed by, for example, gold plating and are formed so as to protrude a predetermined amount in the Z2 direction. The second bumps 43 are formed so as to correspond to the plurality of first bumps 33 formed in the case 30, And are disposed at regular intervals in the direction.

The IC substrate 40 is disposed on the case 30 such that the upper surface 41 is in the Z1 direction upper side so as to cover the opening 30a in the accommodation space 30s of the case 30. [ At this time, twelve first bumps 33 and twelve second bumps 43 formed at positions corresponding to each other arrange the IC substrate 40 via gold balls, and are fixed to each other by ultrasonic melting. The first bump 33 and the second bump 43 protrude toward the IC substrate 40 or the case 30 so that the clearance between the first bump 33 and the second bump 43 10c) (Fig. 5) are formed, and outside air is introduced into the accommodating space 30s of the case 30 from the gap 10c. Therefore, by arranging the IC substrate 40, it is possible to protect the pressure detecting portion 20 disposed in the accommodating space 30s and to make the pressure in the accommodating space 30s equal to that of the outside air, Measurement can be carried out.

Here, one of the first bump 33 and the second bump 43 may be a planar metal surface that does not protrude in the Z1-Z2 direction, for example, an aluminum surface.

As shown in Fig. 3, the four first pad portions 23 of the pressure detecting portion 20 and the four second pad portions 35 of the case 30 are connected by wire bonding wires 51 The pad portions are electrically connected to each other. For example, the first pad portion 23 and the second pad portion 35 disposed on the upper right of the XY plane are connected to each other. The four second pad portions 35 are electrically connected to the first bumps 33 at the corresponding positions by four first conductive paths 52 formed in the case 30 as shown in Fig. Respectively. The output from the first pad portion 23 of the pressure detecting portion 20 is transmitted to the case 30 (see FIG. 3) because the second bumps 43 at the positions corresponding to the first bumps 33 are connected to each other, To the IC substrate 40 via the first conduction path 52 of the first conduction path 52.

A second conduction path 53 independent of the first conduction path 52 is formed in the case 30 at a position corresponding to each first bump 33. [ The second conduction path 53 is electrically connected to the first bump 33 at one end and electrically connected to the output pad 37 at the other end. As a result, the processing result of the IC substrate 40 is output to the output pad 37, and the processing result of the IC substrate 40 can be extracted by connecting the external device to the output pad 37. [

The first conduction path 52 and the second conduction path 53 are formed by forming a through hole in the case 30 and filling the through hole with a conductive material such as tungsten or molybdenum.

According to the above-described embodiment, the following effects can be obtained in the constitution as described above.

 (1) Since the IC substrate 40 is arranged so as to cover the opening 30a of the accommodating space 30s of the case 30, the pressure detecting portion 20 accommodated in the accommodating space 30s is provided with It will not be damaged well. In addition, since the IC substrate 40 is disposed outside the accommodation space 30s, the sensor package 10 can be lowered in volume and the IC substrate 40 is not disposed in the accommodation space 30s , The size of the accommodation space 30s in the XY plane can be suppressed, and the size of the sensor package 10 in the X1-X2 direction and the Y1-Y2 direction can be reduced.

 (2) Since the IC substrate 40 is disposed with the gap 10c for introducing outside air between the IC substrate 40 and the opening 30a of the accommodating space 30s of the case 30, It is possible to accurately measure the atmospheric pressure at the point where the gas is disposed.

 (3) The IC substrate 40 and the case 30 are electrically connected by a plurality of bumps 33 and 43 arranged at intervals, and by the interval between the bumps 33 and 43, 10c can be reliably introduced, so that accurate pressure measurement can be performed and a special structure for forming the clearance 10c is not required.

 (4) Since the second pad portion 35 of the case 30 is disposed inside the plurality of bumps 33 and 43, the distance between the first pad portion 23 and the second pad portion 35 The area for carrying out wire bonding can be widened.

 (5) Since the arrangement direction (Y1-Y2 direction) of the pad portions 23 and 35 and the arrangement direction (X1-X2 direction) of the bumps 33 and 43 are orthogonal to each other, The area for wire bonding to the second pad portion 35 can be widened.

≪ Second Embodiment >

Next, a second embodiment of the present invention will be described. 6 is a perspective view showing a configuration of the sensor package 110 according to the second embodiment. 7 is a perspective view showing a state in which the IC substrate 40 is removed from the sensor package 110 of Fig. Fig. 8 is a simplified cross-sectional view taken along the line VIII-VIII 'in Fig. 6. Fig.

The sensor package 110 according to the second embodiment is different from the first embodiment in that the case 130 has a protective wall portion 138 surrounding the side surface 44 of the IC substrate 40. [ The other structures are the same as in the first embodiment, and the same reference numerals are used for the same members.

The protective wall portion 138 is formed so as to extend in the Z1 direction on the outside of the bump forming surface 131 in the XY plane and is disposed so as to surround the four side surfaces 44 of the rectangular IC substrate 40 in a plan view do. A gap 110d capable of introducing outside air is formed between the protection wall portion 138 and the side surface 44 of the IC substrate 40. [ The upper surface 138a of the protective wall portion 138 and the upper surface 41 of the IC substrate 40 are positioned in the Z1 direction.

Here, the gap 110c, the opening 130a, the accommodation space 130s, the bump forming surface 131, the bottom surface 132 of the accommodation space 130s, the first bump 133, The second pad portion 135, the bottom surface 136, the output pad 137, the first conduction path 152 and the second conduction path 153 in the first embodiment are the same as the first embodiment The bottom surface 32 of the accommodating space 30s, the first bump 33, the intermediate surface 34, and the bottom surface 32c of the accommodating space 30s, the opening 30a, the accommodating space 30s, the bump forming surface 31, The second pad portion 35, the bottom surface 36, the output pad 37, the first conduction path 52, and the second conduction path 53, detailed description thereof will be omitted.

According to the above configuration, since the case 130 has the protection wall portion 138 surrounding the side surface 44 of the IC substrate 40, it is possible to protect the IC substrate 40 from external damage have.

Since the gap 110d is formed between the side surface 44 of the IC substrate 40 and the protective wall portion 138, the distance from the gap 110d to the accommodation space 130s via the gap 110c It is possible to accurately measure the air pressure at the point where the sensor package 10 is installed.

Other operations, effects and modifications are similar to those of the first embodiment.

≪ Modification of Second Embodiment >

9 is a cross-sectional view showing a configuration of a sensor package 210 according to a modified example of the second embodiment, and shows a cross section corresponding to line VIII-VIII 'in FIG.

In the sensor package 210 according to the present modification example, the case 230 has a protective wall portion 239 surrounding the side surface 44 of the IC substrate 40, and the Z1- The height in the Z2 direction is larger than the thickness of the IC substrate 40, which is different from the first embodiment. The other structures are the same as in the first embodiment, and the same reference numerals are used for the same members.

The protection wall portion 239 is formed so as to extend in the Z1 direction on the outside of the bump forming surface 231 in the XY plane and is arranged so as to surround the four side surfaces 44 of the rectangular IC substrate 40 in a plan view do. A gap 210d capable of introducing outside air is formed between the protective wall portion 239 and the side surface 44 of the IC substrate 40. [ 9, the position of the upper surface 239a of the protective wall portion 239 in the Z1-Z2 direction is higher than the position of the upper surface 41 of the IC substrate 40 in the Z1 direction by H .

Here, the gap 210c, the opening 230a, the accommodating space 230s, the bump forming surface 231, the bottom surface 232 of the accommodating space 230s, the first bump 233, The second pad portion 235, the bottom surface 236, the output pad 237, the first conduction path 252 and the second conduction path 253 are the same as those in the first embodiment The gap 10c, the opening 30a, the accommodation space 30s, the bump forming surface 31, the bottom surface 32 of the accommodation space 30s, the first bump 33, the intermediate surface 34, The pad portion 35, the bottom surface 36, the output pad 37, the first conduction path 52, and the second conduction path 53, respectively, and thus the detailed description thereof will be omitted.

With such a configuration, since the height of the protection wall portion 239 is made larger than the thickness of the IC substrate 40, the protection of the IC substrate 40 can be more surely achieved.

Other operations and effects are the same as those of the second embodiment.

While the present invention has been described with reference to the above embodiments, the present invention is not limited to the above-described embodiments, but can be modified or changed within the scope of improvements or the spirit of the present invention.

As described above, the sensor package according to the present invention is further suitable for realizing miniaturization and low-emission.

10, 110, 210: sensor package
10c, 110c, 210c: clearance
20: Pressure detecting section
23: first pad portion
30, 130, 230: Case
30a, 130a, 230a:
30s, 130s, 230s: accommodation space
33, 133, 233: First bump
35, 135, and 235:
40: IC substrate
43: second bump
51: wire
52, 152, 252: first conduction path
53, 153, 253: a second conduction path
110d, 210d: Clearance
138:

Claims (6)

An IC substrate to which a detection result of the detection unit is inputted and a case having a housing space for housing the detection unit therein,
Wherein the IC substrate is disposed so as to cover the opening portion with an introduction gap for introducing outside air between the IC substrate and the opening portion of the accommodating space. The method according to claim 1,
Wherein the IC substrate and the case are electrically connected by a plurality of bumps arranged at intervals and the detecting unit is electrically connected to the IC substrate through a conduction path formed in the case,
And the introduction gaps are formed between the plurality of bumps. 3. The method of claim 2,
The detecting unit is electrically connected to the pad unit formed in the case by wire bonding,
Wherein the pad portion is disposed inside the plurality of bumps. The method of claim 3,
A plurality of pad portions are formed,
Wherein the arrangement direction of the plurality of pad portions and the arrangement direction of the plurality of bumps are orthogonal to each other. 5. The method according to any one of claims 1 to 4,
Wherein the case has a protection wall portion surrounding the side surface of the IC substrate with a gap therebetween. 6. The method of claim 5,
Wherein a height of the protection wall portion is greater than a thickness of the IC substrate.
KR1020150146590A 2014-10-29 2015-10-21 Sensor package KR101782221B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-220733 2014-10-29
JP2014220733A JP6273189B2 (en) 2014-10-29 2014-10-29 Sensor package

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KR101782221B1 KR101782221B1 (en) 2017-09-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019059543A3 (en) * 2017-09-25 2019-05-09 삼성전자 주식회사 Fingerprint recognition package and method for manufacturing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228811B (en) 2004-05-28 2005-03-01 Taiwan Electronic Packaging Co Package for integrated circuit chip
JP4835058B2 (en) * 2005-07-26 2011-12-14 パナソニック電工株式会社 Sensor package
JP2008051658A (en) * 2006-08-24 2008-03-06 Mitsumi Electric Co Ltd Ic-integrated acceleration sensor and its manufacturing method
JP5990933B2 (en) * 2012-02-29 2016-09-14 オムロン株式会社 Manufacturing method of pressure sensor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019059543A3 (en) * 2017-09-25 2019-05-09 삼성전자 주식회사 Fingerprint recognition package and method for manufacturing same
US11688750B2 (en) 2017-09-25 2023-06-27 Samsung Electronics Co., Ltd. Modular fingerprint recognition package having reduced size

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KR101782221B1 (en) 2017-09-26
JP2016090236A (en) 2016-05-23
JP6273189B2 (en) 2018-01-31

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