KR20160050335A - Organic light emitting display device - Google Patents

Abstract

An organic light emitting display device according to an embodiment of the present invention includes a lower substrate, an organic light emitting device located on the lower substrate, a first inorganic sealing layer which covers the organic light emitting device, a first organic layer which covers the first inorganic sealing layer, and a second inorganic sealing layer which covers the first organic layer. The first organic layer includes an inorganic plate-shaped mixture. The first inorganic sealing layer touches the second inorganic sealing layer in an edge region. So, the first organic layer is sealed. A water vapor transmission rate (WVTR) can be lowered.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light-

The present invention relates to an organic light emitting display, and more particularly, to an organic light emitting display having at least one organic layer compensating for foreign matter, including a mixture capable of delaying moisture penetration.

As the era of informationization becomes full-scale, the field of display devices for visually displaying electrical information signals is rapidly developing. Accordingly, studies are being continued to develop performance such as thinning, lightening, and low power consumption for various types of flat panel display devices. Typical examples of such flat panel display devices include a liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED) An electro-wetting display device (EWD), and an organic light emitting display device (OLED).

The organic light emitting display device is a self-emission type display device, unlike a liquid crystal display device, a separate light source is not required, and thus it can be manufactured in a light and thin shape. Further, the organic light emitting display device is not only advantageous from the viewpoint of power consumption by low voltage driving, but also excellent in color implementation, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next generation display.

In the case of a top emission type organic light emitting display, transparent or semitransparent electrodes are used for the cathode to emit light emitted from the organic light emitting layer. In order to secure the reliability of the organic light emitting diode display, an encapsulating portion is formed on the organic light emitting diode including the organic light emitting layer to protect the organic light emitting layer or the like from moisture, physical impact, or foreign matter that may occur during the manufacturing process. In the top emission type organic light emitting display, the encapsulation portion is a glass encapsulation portion, or a sealing portion of a thin film encapsulation structure in which an inorganic encapsulation layer and an organic layer are alternately stacked to increase the moisture permeability to delay moisture penetration.

An encapsulation of a thin film encapsulation structure in which an inorganic encapsulation layer and an organic material layer are alternately stacked has been widely studied because of its advantage of being able to realize a flexible organic light emitting display device with a thin thickness. However, since the sealing portion is formed after the formation of the organic light emitting layer is completed, a process limitation occurs. For example, since the organic light emitting layer is vulnerable to heat, the sealing portion may not be formed by a process requiring high temperature.

The inorganic encapsulation layer is excellent in water moisture permeation delay performance, but may crack and seam due to foreign objects and steps.

The organic material layer has an advantage of flattening a stepped portion by a bank, a spacer, etc., and compensating for foreign matter to reduce the occurrence of cracks and seams in the inorganic encapsulation layer. However, the moisture permeability is poor.

The poor water vapor transmission delay performance means that the water vapor transmission rate (WVTR) is high, and when the moisture permeation rate is increased, the water permeation becomes easy.

[Related Technical Literature]

1. Organic light emitting display panel and its manufacturing method (Korean Patent Application No. 10-2012-0131157)

The inventors of the present invention paid attention to the fact that the water vapor transmission and moisture retardation performance of the organic material layer of the sealing portion of the conventional organic light emitting display device is poor. Particularly, when cracks and shims are generated in the inorganic encapsulation layer, the organic material layer becomes a passage for transferring moisture, thereby recognizing the problem that the life of the encapsulation part is shortened. Accordingly, the inventors of the present invention have invented an organic light emitting display device having a novel structure capable of enhancing water permeation delay performance while maintaining a foreign material compensation ability of an organic material layer by including a mixture capable of delaying moisture penetration in an organic material layer.

Accordingly, it is an object of the present invention to provide an organic light emitting diode display having improved water permeation delay performance by mixing at least one organic material layer with at least one organic material layer having improved moisture permeability and moisture retention performance.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an organic light emitting display including a lower substrate, an organic light emitting device formed on the lower substrate, a first inorganic encapsulation layer configured to cover the organic light emitting device, And a second inorganic encapsulation layer configured to cover the first organic material layer, wherein the first organic material layer includes a inorganic plate-like mixture, and the first inorganic encapsulation layer and the second inorganic encapsulation layer are formed on the outer periphery And the first organic material layer is sealed.

According to another aspect of the present invention, the inorganic plate-like mixture is a plate-like clay pieces having a width of 40 to 1000 nanometers and a thickness of several nanometers or less.

According to another aspect of the present invention, the aspect ratio of the plate-like clay pieces is 50-500.

In accordance with another feature of the invention, one of the plate-shaped viscosity pieces are muscovite _{(K (OHF 2) 2 Al} 3 Si 3 O 10) or biotite _{(K (Mg, Fe) 3} AlSi 3 O 10 (OH) 2) .

According to still another aspect of the present invention, the inorganic plate-like mixture is characterized in that it is electrified and aligned so as to be oriented in the first organic layer.

According to another aspect of the present invention, the inorganic plate-like mixture is characterized in that it is hydrophilically or hydrophobically treated and aligned so as to be oriented in the first organic layer.

According to another feature of the present invention, the first organic material layer is a polymer resin and the first organic material layer in which the inorganic plate-like material mixture is mixed is formed by a screen printing method, a slit coating method, an ink-jet printing method ) Method, an electric spray coating method, or a chemical vapor deposition method.

According to another aspect of the present invention, an OLED display is a flexible display device.

According to another aspect of the present invention, the first inorganic encapsulation layer covers the pixel region and the bezel region, and the first organic layer is formed to cover a portion of the bezel region from the pixel region and the pixel region.

According to another aspect of the present invention, there is provided an organic light emitting display including a lower substrate, an organic light emitting device formed on the lower substrate, a first inorganic encapsulation layer configured to cover the organic light emitting device, A first organic material layer configured to cover the sealing layer, a second organic material layer disposed on the first organic material layer, and a second inorganic sealing layer configured to cover the second organic material layer, wherein the second organic material layer includes a inorganic plate- The inorganic encapsulation layer and the second inorganic encapsulation layer are arranged so that the first organic layer and the second organic layer are sealed by contacting each other in the outer region.

According to another aspect of the present invention, the first organic layer is configured to planarize the bank and the spacer.

According to another aspect of the present invention, there is provided an OLED display including a lower substrate, an organic light emitting diode formed on the lower substrate, a first inorganic encapsulation layer configured to cover the OLED, A second inorganic encapsulation layer configured to cover the first organic layer, a second organic layer configured to cover the second inorganic encapsulation layer, and a third inorganic encapsulation layer configured to cover the second organic layer, Wherein at least one of the first organic layer and the second organic layer comprises a inorganic plate-like mixture, the first inorganic encapsulating layer and the second inorganic encapsulating layer are configured to be in contact with each other in an outer region to seal the first organic layer, And the sealing layer and the third inorganic sealing layer are in contact with each other in the outer region to seal the second organic layer.

According to another aspect of the present invention, both the first organic layer and the second organic layer include a inorganic plate-like mixture.

According to still another aspect of the present invention, only the second organic layer is characterized by including a inorganic plate-like mixture.

According to another aspect of the present invention, the first organic material layer is formed of silicon oxycarbide.

The details of other embodiments are included in the detailed description and drawings.

According to the present invention, the moisture permeation-retarding performance of the sealing portion can be improved by constructing at least one organic layer having improved moisture permeability and moisture-permeability.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a schematic plan view of an OLED display according to an embodiment of the present invention
2 is a cross-sectional view taken along the line II-II 'of the organic light emitting diode display of FIG. 1
3 is a schematic cross-sectional view illustrating a transparent encapsulation part of an organic light emitting display according to an embodiment of the present invention.
4 is a schematic cross-sectional view of an OLED display according to another embodiment of the present invention.
5 is a schematic cross-sectional view of an OLED display according to another embodiment of the present invention.
6 is a schematic cross-sectional view of an OLED display according to another embodiment of the present invention.
7 is a schematic cross-sectional view of an OLED display according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a schematic plan view of an OLED display according to an embodiment of the present invention.

Referring to FIG. 1, the pixel region A / A of the present invention refers to a region where a plurality of pixels 111 are arranged. The pad region (P / A) of the present invention means an area where a plurality of pads are arranged. The bezel area B / A of the present invention means an area surrounding the pixel area A / A.

A plurality of pixels 111 and a plurality of data lines 114 for transmitting data signals generated by the data driver 115 to the plurality of pixels 111 are formed in the pixel region A / And a plurality of gate lines 112 for transferring gate signals generated by the gate driver 113 to the plurality of pixels 111 are arranged.

A gate driver 113 configured to transmit a gate signal to a plurality of gate lines 112 and a gate driver 113 configured to transmit a gate signal to the cathodes of the plurality of pixels 111 in the bezel region B / A of the organic light emitting diode display 100, The common voltage line 116 is arranged. Some of the components arranged in the bezel area B / A may be extended to the pad area P / A.

A data driver 115 configured to transfer a video signal to the plurality of data lines 114 and a plurality of data lines 114 connected to the data driver 115 are formed in the pad area P / . A plurality of pads are arranged in the pad region (P / A).

Anisotropic Conductive Film (ACF) is applied to the pad region P / A. Components such as the data driver 115, flexible printed circuit (FPC), or cable are attached to the pad by an anisotropic conductive film.

The transparent encapsulant 130 according to an embodiment of the present invention is configured to cover the bezel area B / A and the pixel area A / A. The transparent encapsulant 130 is configured not to cover a plurality of pads formed in the pad region P / A. Specifically, when the transparent encapsulant 130 covers the pad area P / A, the transparent encapsulant 130 is not only excellent in moisture permeability and delaying ability but also excellent in electrical insulation, / A may be insulated.

A plurality of pixels 111 are arranged on the lower substrate 101. The plurality of pixels 111 include sub-pixels emitting light of at least red, green, and blue (RGB). The plurality of pixels 111 may further include a sub-pixel that emits white light. Each sub-pixel may further include a color filter. Each of the plurality of pixels 111 is configured to be driven by a plurality of gate lines 112 formed to cross each other and a plurality of thin film transistors connected to the plurality of data lines 114.

The data driver 115 generates a gate start pulse for driving the gate driver 113 and a plurality of clock signals. The data driver 115 converts an externally input digital video signal into an analog video signal using a gamma voltage generated by a gamma voltage generator (not shown). The converted video signal is transmitted to a plurality of pixels 111 through a plurality of data lines 114. The data driver 115 may be attached to a plurality of pads formed on the lower substrate 101.

The gate driver 113 includes a plurality of shift registers, and each shift register is connected to each gate line 112. The gate driver 113 receives a gate start pulse (GSP) and a plurality of clock signals from the data driver 115 and shifts the gate start pulse sequentially in the shift register of the gate driver 113 A plurality of pixels 111 connected to the respective gate lines 112 are activated.

A common voltage line 116 is disposed in the bezel region B / A to supply a common voltage to the cathode. The cathode of the top emission type organic light emitting diode display 100 is formed as a thin film for transparency. Therefore, the cathode has a high electrical resistance value. Therefore, a voltage drop phenomenon may occur and the quality of the display image may be degraded. In order to alleviate this problem, the common voltage line 116 is arranged so as to surround the pixel region A / A. However, the present invention is not limited thereto, and the common voltage line 116 may be formed on at least one side of the pixel region A / A. When the organic light emitting display 100 is enlarged, it is also possible to further arrange the auxiliary electrode.

2 is a cross-sectional view taken along a line II-II 'of the organic light emitting diode display of FIG.

2, an OLED display 100 according to an exemplary embodiment of the present invention includes a lower substrate 101, a thin film transistor 220 disposed on a lower substrate 101, and a thin film transistor 220 A gate driver 113 formed in the bezel region B / A and a common voltage Vss provided in the bezel region B / A to supply the common voltage Vss to the cathode 243, A connection line 260 connecting the cathode 243 and the common voltage line 116 and a transparent encapsulant 130 protecting the pixel area A / A from moisture.

The lower substrate 101 may be formed of a flexible film made of a plastic material, for example, a polyimide series material.

A back-plate may be further provided on the lower surface of the lower substrate 101 to support the OLED 100 so that the OLED display 100 is not easily bent.

A multi-buffer layer formed of silicon nitride (SiN _x ) and silicon oxide (SiO _x ) is added between the lower substrate 101 and the thin film transistor 220 to delay the penetration of moisture and / or oxygen through the lower substrate 101 It is also possible to do.

The thin film transistor 220 includes an active layer 221, a gate electrode 222, a source electrode 223 and a drain electrode 224. The active layer 221 is covered with a gate insulating film 225. The gate electrode 222 is formed of the same material as the gate line 112 and overlaps at least a portion of the active layer 221 on the gate insulating film 225.

The gate electrode 222 is covered with an interlayer insulating film 226 formed on the entire surface of the gate insulating film 225. The interlayer insulating film 226 may be formed in a multi-layer structure formed of silicon nitride and silicon oxide.

The source electrode 223 and the drain electrode 224 are formed of the same material as the data line 114 and spaced apart from each other on the interlayer insulating film 226. The source electrode 223 is connected to one end of the active layer 221 and is connected to the active layer 221 through a first contact hole 229a penetrating the gate insulating film 225 and the interlayer insulating film 226. [ The drain electrode 224 overlaps at least the other end of the active layer 221 and is connected to the active layer 221 through the first contact hole 229a penetrating the gate insulating film 225 and the interlayer insulating film 226 do. Though the thin film transistor 220 is described as a coplanar structure, a thin film transistor having an inverted staggered structure may also be used

A thin film transistor insulating film 227 is disposed on the thin film transistor 220. However, the present invention is not limited to this, and it is also possible that the thin film transistor insulating film 227 is not disposed. The thin film transistor insulating film 227 can further block moisture penetrating into the thin film transistor 220.

The planarizing layer 228 is disposed on the thin film transistor insulating film 227. The second contact hole 229b penetrates the planarization layer 228 and the thin film transistor insulating film 227. The planarization layer 228 may be formed of a photoacid having a low dielectric constant. The thickness of the planarization layer 228 is preferably 2 탆 to 3.5 탆. The planarization layer 228 reduces the parasitic capacitance generated between the anode 241 and the thin film transistor 220, the gate line 112 and the data line 115, and the anode 241 ).

A layer having a lens shape for improving light extraction efficiency may be added to the planarization layer 228 in the region where the anode 241 is disposed.

The organic light emitting diode 240 includes an anode 241 and a cathode 243 facing each other and an organic light emitting layer 242 interposed therebetween. The light emitting region of the organic light emitting layer 242 may be defined by the bank 244. [

The organic light emitting diode 240 may be configured to emit light of any of red, green, and blue (RGB), or may be configured to emit white light. When the organic light emitting diode 240 emits white light, a color filter may be added.

The anode 241 is disposed on the planarization layer 228 to correspond to the light emitting region of each pixel 111 and is connected to the drain of the thin film transistor 220 through the second contact hole 229b penetrating the planarization layer 228. [ Electrode 224 is connected. The anode 241 is made of a metallic material having a high work function. The anode 241 may be composed of a reflective material or may include a reflector below the anode 241 so that the anode 241 has a reflective characteristic. And a video signal for displaying a video signal is applied to the anode 241 through a drain electrode 224. [

The banks 244 are disposed on the planarization layer 228 in the non-emission regions between the pixels 111 and have a tapered shape. The bank 244 is configured to overlap at least a portion of the rim of the anode 241. [ The height of the bank 244 is preferably 1 m to 2 m.

Spacer 245 is disposed on bank 244. The spacer 245 may be the same material as the bank 244. For example, the bank 244 and the spacers 245 may be formed of polyimide. The spacer 245 can protect the organic light emitting diode 240 from being damaged by a fine metal mask (FMM) used when patterning the organic light emitting layer 242. It is preferable that the height of the spacer 245 is set to 1.5 탆 to 2.5 탆. According to such a configuration, the damage of the organic light emitting diode 240 can be reduced in a fine metal mask process. However, the present invention is not limited thereto, and the spacer 245 may not be formed.

An organic light emitting layer 242 is formed on the anode 241. The cathode 243 is disposed so as to face the anode 241 with the organic light emitting layer 242 therebetween. The organic light emitting layer 242 may be formed of a phosphorescent or fluorescent material, and may further include an electron transporting layer, a hole transporting layer, a charge generating layer, and the like.

The cathode 243 is formed of a very thin work function metallic material or a transparent conductive oxide (Transparent Conductive Oxide: TCO). When the cathode 243 is formed of a metallic material, the cathode 243 is formed to a thickness of 1500 ANGSTROM or less, preferably 400 ANGSTROM or less. When the cathode 243 is formed to such a thickness, the cathode 243 becomes a substantially semitransparent layer and becomes a substantially transparent layer. The common voltage Vss is applied to the cathode 243.

The gate driver 113 is formed of a plurality of thin film transistors. The plurality of thin film transistors constituting the gate driver 113 are formed in the same process as the thin film transistor 220 of the pixel region A / A. Therefore, a duplicate description of the thin film transistor constituting the gate driver 113 is omitted.

The common voltage line 116 is composed of a single layer or a multi-layer using the same material as the gate line 112 and / or the data line 114.

The common voltage line 116 supplies a common voltage Vss to the cathode 243. A thin film transistor insulating layer 227 may be disposed on the common voltage line 116. The common voltage line 116 is disposed outside the gate driver 113.

The connection portion 260 may be disposed on the planarization layer 228 and overlapped with the gate driver 113. The connection portion 260 connects the common voltage line 116 and the cathode 243. The connection portion 260 may be made of the same material as the anode 241. [

The connection portion 260 is connected to the common voltage line 116 along the inclined surface of the one end of the planarization layer 228. If an insulating layer is present between the connection part 260 and the common voltage line 116, the connection part 260 is connected to the common voltage line 116 through the contact hole.

The cathode 243 is disposed on the bank 244 and / or the spacer 245 and extends to a portion of the bezel area B / A. The cathode 243 is connected to the connection portion 260 in the bezel region B / A region where the bank 244 is not formed.

In summary, the gate electrode 222 of the thin film transistor 220 receives the driving signal generated by the gate driver 113 through the gate line 112. Then, the conductivity of the active layer 221 is varied by a signal applied to the gate electrode 222. Then, a video signal applied to the source electrode 223 through the active layer 221 is applied to the anode 241. The common voltage Vss is applied to the cathode 243, and the organic light emitting layer 242 emits light to display an image.

Sectional structures of the thin film transistor 220 and the organic light emitting diode 240 disposed on the ideal bezel region B / A and the pixel region A / A have been described.

The transparent encapsulant 130 of the OLED display 100 according to an embodiment of the present invention includes a first inorganic encapsulating layer 131, a first organic layer 132, and a second inorganic encapsulating layer 133 .

Aluminum oxide (Al ₂ O ₃ ), silicon nitride (SiN _x ), silicon oxide (SiO _y ), or the like may be used for the first inorganic encapsulating layer 131 and the second inorganic encapsulating layer 133. The first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 may be formed of the same material or different materials. For example, aluminum oxide may be used for the first inorganic sealing layer 131, and silicon nitride may be used for the second inorganic sealing layer 133.

The first inorganic sealing layer 131 and the second inorganic sealing layer 133 may be formed by atomic layer deposition or chemical vapor deposition. The first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 may be formed by the same deposition method or may be formed by different deposition methods. For example, the first inorganic sealing layer 131 may be formed by atomic layer deposition and the second inorganic sealing layer 133 may be formed by a chemical vapor deposition method.

When the first inorganic encapsulating layer 131 and / or the second inorganic encapsulating layer 133 are formed by atomic layer deposition, the thickness is preferably 200 ANGSTROM to 1500 ANGSTROM. In particular, although the thickness of the first inorganic encapsulation layer 131 formed by the atomic layer deposition method is thin, the density of the thin film is higher than that of the inorganic encapsulation layer formed by chemical vapor deposition. Therefore, excellent water permeation delay performance can be achieved even with a thin thickness. And because of its thin thickness, it is advantageous to realize a thin design and a flexible display device. And excellent visible light transmittance can be achieved, which is advantageous for organic light emitting display devices of the top emission type.

When the first inorganic encapsulating layer 131 and / or the second inorganic encapsulating layer 133 are formed by the chemical vapor deposition method, the thickness is preferably set to 5000 ANGSTROM to 15000 ANGSTROM. In particular, the chemical vapor deposition method is advantageous for mass production because the deposition time is relatively faster and thicker than the atomic layer deposition method.

The first organic layer 132 according to an embodiment of the present invention is disposed between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133. The first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 are configured to seal the first organic layer 132 by contacting with each other in the outer region. Accordingly, the first organic material layer 132 is directly exposed to the atmosphere, so that a direct moisture permeation path is not generated. The outer region is an edge of the bezel region B / A and a region of the bezel region B / A and the pad region P / A as a part of the bezel region B / A surrounding the pixel region A / A).

The first organic layer 132 according to an embodiment of the present invention includes a inorganic plate-like mixture 132a. The first organic material layer 132 may be a polymer resin. For example, acrylic or epoxy based resins are used. Such a polymer resin is flowable and has a planarizing property, so that the stepped portion by the bank 244 or the spacer 245 can be flattened.

The inorganic plate-like mixture (132a) is a plate-like inorganic material having transparency and excellent water permeation delay performance. The inorganic plate-like mixture (132a) is an inorganic material and is superior in water vapor transmission and moisture retardation performance to the organic material layer. Therefore, when water penetrates into the first organic material layer 132, the moisture permeation path of moisture to the organic light emitting device 240 becomes longer by the inorganic plate-like material mixture 132a as shown in FIG. Therefore, it is possible to improve moisture permeation delay performance.

The inorganic plate-like mixture 132a may be, for example, plate-shaped clay pieces having a width of 40 to 1000 nanometers (nm) in size and a thickness of several nanometers or less. Specifically, the plate-like clay may be a thin plate-like clay pieces having an average aspect ratio of 50 to 500 per clay piece. These clay pieces are densely stacked in a multi-layered structure, so that the water infiltration path can be extended. For example, inorganic plate-shaped mixture (132a) may be used in the muscovite _{(K (OHF 2) 2 Al} 3 Si 3 O 10), biotite _{(K (Mg, Fe) 3} AlSi 3 O 10 (OH) 2). In particular, such clay products are advantageous in that they can be mass-produced at a low cost because the production cost is relatively low and the material is easily secured.

The inorganic plate-like mixture (132a) may be mixed with the first organic layer (132). But may be mixed with the second organic layer 432 to be described later, or may be mixed with at least one organic layer when there are a plurality of organic layers. In addition, the inorganic plate-like mixture 132a may be electrified and aligned so as to be oriented in the organic layer. Or the inorganic plate-like mixture 132a may be treated to be hydrophilic or hydrophobic and aligned so as to be oriented in the organic layer. In particular, when the inorganic plate-like mixture 132a has a directionality in the organic material layer, the inorganic plate-like mixture 132a is densely arranged, and the effect of prolonging the moisture permeation path is further improved.

The organic layer in which the inorganic plate-like mixture 132a is mixed may be formed by a screen printing method, a slit coating method, an ink-jet printing method, or an electric spray coating method. have.

The first organic material layer 132 is formed to a thickness of 3 탆 to 20 탆. Preferably 5 占 퐉 to 10 占 퐉. When the first organic material layer 132 is 3 탆 or less, an uncoated region such as a pin hole may occur during the screen printing process. When the first organic material layer 132 is 10 탆 or more, The first inorganic encapsulating layer 131 or the second inorganic encapsulating layer 133 may be cracked.

That is, a suitable process can be selected according to the thickness of the desired organic material layer. For example, when the first organic material layer 132 is formed to a thickness of 20 탆, a screen printing method or a slit coating method may be suitable for the process characteristics. In particular, as the thickness of the organic material layer becomes thicker, the number of layers in which the inorganic plate-like mixture 132a is laminated increases, so that the moisture permeation path becomes longer. Therefore, the water vapor transmission and moisture retardation performance of the first organic material layer 132 is improved.

For example, when the first organic material layer 132 is formed to a thickness of 10 μm or less, an ink jet printing method, an electrospray coating method, or a chemical vapor deposition method may be suitable. Particularly, as the thickness of the organic material layer becomes thinner, the flexural characteristics of the flexible display device are improved.

3 is a schematic cross-sectional view illustrating a transparent encapsulation part of an organic light emitting display according to an embodiment of the present invention.

3 is a cross-sectional view of a lower substrate 101, an organic light emitting diode 240, and a transparent encapsulant 130 of an OLED display 100 according to an embodiment of the present invention, Only the other components are omitted.

The transparent encapsulant 130 according to an embodiment of the present invention includes a first inorganic encapsulation layer 131, a first organic material layer 132, and a second inorganic encapsulation layer 133.

The first inorganic sealing layer 131 covers the pixel area A / A and the bezel area B / A. However, the present invention is not limited to this, and it is also possible that it is not formed in a part of the bezel area B / A.

The first organic material layer 132 is formed to cover a part of the bezel area B / A from the pixel area A / A and the pixel area A / A.

The second inorganic encapsulation layer 133 is configured to seal the first organic material layer 132 in contact with the first inorganic encapsulation layer 131 in the bezel region B / A while covering the first organic material layer 132. Therefore, the first organic material layer 132 is directly exposed to the atmosphere, and the direct moisture permeation path is blocked. The first organic layer 132 has an effect of improving the water vapor transmission and moisture retardation performance by the inorganic plate-like mixture 132a.

4 is a schematic cross-sectional view illustrating a transparent encapsulation unit of an organic light emitting display according to another embodiment of the present invention.

The transparent encapsulant 430 of the OLED display 400 according to another embodiment of the present invention is a modified embodiment of the transparent encapsulant 130 of the OLED display 100 according to an embodiment of the present invention .

The transparent encapsulant 430 of the OLED display 400 according to another embodiment of the present invention further includes a second organic layer 432 and a third inorganic encapsulation layer 437. [

The second organic layer 432 includes a inorganic plate-like mixture 132a. The second organic layer 432 is disposed on the second inorganic sealing layer 133 and covers a part of the bezel region B / A from the pixel region A / A and the pixel region A / A .

The second organic layer 432 may be formed to have the same area as the first organic layer 132, but may be formed to have a larger area than the first organic layer 132. When the second organic layer 432 is further extended from the end of the first organic layer 132 to the bezel area B / A, the end of the second organic layer 432 is gently formed to form the third inorganic encapsulation layer 437 And the occurrence of cracks is reduced.

The third inorganic encapsulation layer 437 is configured to seal the second organic layer 432 in contact with the second inorganic encapsulation layer 133 in the bezel region B / A while covering the second organic layer 432. Therefore, the second organic layer 432 is directly exposed to the atmosphere, and the direct moisture permeation path is blocked.

In particular, since the second organic layer 432 is located on the planarized second inorganic sealing layer 133, the inorganic plate-like mixture 132a can be densely aligned.

The third inorganic encapsulation layer 437 may be formed by selecting one of materials usable for the first inorganic encapsulation layer 131 or the second inorganic encapsulation layer 133. The third inorganic encapsulation layer 437 may be formed by selecting one of the methods of forming the first inorganic encapsulation layer 131 or the second inorganic encapsulation layer 133.

Except for the foregoing, the OLED display 400 according to another embodiment of the present invention is the same as the OLED display 100 according to an exemplary embodiment of the present invention, .

5 is a schematic cross-sectional view illustrating a transparent encapsulation portion of an organic light emitting display according to another embodiment of the present invention.

The transparent encapsulant 530 of the organic light emitting diode display 500 according to another embodiment of the present invention is a modification of the transparent encapsulant 430 of the organic light emitting diode display 400 according to another embodiment of the present invention to be.

The first organic layer 132 of the transparent encapsulant 530 according to another embodiment of the present invention does not include the inorganic plate-like mixture 132a. And the second organic layer 432 includes a inorganic plate-like mixture 132a. That is, only at least one organic layer is configured to include the inorganic plate-like mixture 132a.

The thickness of the first organic layer 132 of the transparent encapsulant 530 according to another embodiment of the present invention is less than 10 mu m. According to this configuration, the second inorganic encapsulation layer 133 can be planarized while the thickness of the first organic layer 132 is made thin, and the inorganic plate-like mixture 132a contained in the second organic layer 432 is densely There is an effect that can be formed.

For example, if the thickness of the first organic layer 132 of the transparent encapsulant 530 is 5 占 퐉 and the thickness of the second organic layer 432 is 15 占 퐉, the inorganic plate-like mixture 132a ) Can be stacked more densely while having directionality.

In particular, since the second organic material layer 432 is formed to be denser and thicker with relatively directivity on the planarized surface, the first organic material layer 132 including the inorganic plate-like mixture 132a and the inorganic plate-like material mixture 132a are included Substantially equal moisture impermeability retardation performance can be achieved as compared with the case where the thickness of the second organic material layer 432 is 10 mu m.

In particular, the transparent encapsulant 530 according to another embodiment of the present invention preferably uses an inkjet printing method or an electrospray coating method when forming the first organic material layer 132, It is preferable to use a printing method and a slit coating method. That is, it is desirable to determine the process mode according to the designed thickness.

Except for the foregoing, the OLED display 500 according to another embodiment of the present invention is the same as the OLED display 400 according to another embodiment of the present invention, .

6 is a schematic cross-sectional view illustrating a transparent encapsulation unit of an OLED display according to another embodiment of the present invention.

The transparent encapsulant 630 of the organic light emitting diode display 600 according to another embodiment of the present invention may be modified in accordance with a modification of the transparent encapsulant 530 of the organic light emitting diode display 500 according to another embodiment of the present invention. Yes.

The transparent encapsulant 630 according to another embodiment of the present invention has silicon oxycarbide (SiOC) 632 disposed between the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133. [ That is, the first organic material layer 132 of the transparent encapsulant 530 is formed of silicon oxy-carbon 632.

The carbon content of silicon oxycarbon (632) is 1% to 50% or less. As the carbon content increases, the flowability of the silicon oxy-carbon 632 improves, foreign matter can be easily compensated, and a planarizing effect is obtained. It is preferable that the thickness of the silicon oxy-carbon 632 is formed to 1.5 占 퐉 to 3 占 퐉.

According to such a configuration, the transparent encapsulant 630 of another embodiment of the present invention has an effect of achieving a thinner thickness than the transparent encapsulant 530. [

In particular, the transparent encapsulant 630 according to another embodiment of the present invention preferably uses a chemical vapor deposition method when forming the silicon oxycarbon 632, and controls the carbon content to be 1% to 50%.

Except for the foregoing, the OLED display 600 according to another embodiment of the present invention is the same as the OLED display 500 according to another embodiment of the present invention, .

7 is a schematic cross-sectional view illustrating a transparent encapsulation portion of an OLED display according to another embodiment of the present invention.

The transparent encapsulant 730 of the organic light emitting diode display 700 according to another embodiment of the present invention is a modification of the transparent encapsulant 130 of the organic light emitting diode display 100 according to an embodiment of the present invention to be.

The first organic material layer 132 and the second organic material layer 7132 are disposed between the first inorganic encapsulating layer 131 and the second inorganic encapsulating layer 133 of the transparent encapsulant 730. The first organic material layer 132 does not include the inorganic plate-like mixture 132a. The second organic layer 732 includes a inorganic plate-like mixture 132a. The first organic material layer 132 is disposed below the second organic material layer 732.

According to such a configuration, the first organic material layer 132 has the effect of flattening the stepped portion by the bank 244 or the spacer 245. When the second organic material layer 732 is disposed on the first organic material layer 732, the inorganic plate-like material mixture 132a is further densely packed to improve the moisture permeation delay performance. In addition, the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 are in contact with each other in the outer region so that the first organic layer 132 and the second organic layer 732 are sealed at the same time.

Except for the foregoing, the organic light emitting diode display 700 according to another embodiment of the present invention is the same as the organic light emitting diode display 100 according to an embodiment of the present invention, so that duplicate descriptions are omitted

According to some embodiments of the present invention, a touch panel may be disposed on the transparent encapsulant. According to some embodiments of the present invention, a barrier film may be disposed on the transparent encapsulant. According to some embodiments of the present invention, a color filler may be disposed on the transparent encapsulant. According to some embodiments of the present invention, a polarizer may be disposed on the transparent encapsulant. According to some embodiments of the present invention, at least one of graphene, carbon nano tube, SiOx plate-like powder and AlOx plate-like powder may be mixed with at least one organic material layer.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 400, 500, 600, 700: organic light emitting display
101: Lower substrate
A / A: pixel area
B / A: Bezel area
P / A: Pad area
113: Gate driver
116: common voltage line
130, 430, 530, 630, 730:
131: first inorganic encapsulating layer
132: first organic layer
132a: inorganic plate-like mixture
133: Second inorganic encapsulating layer
732: Second organic layer
437: third inorganic encapsulating layer
632: Silicon Oxy Carbon
220: thin film transistor
221: active layer
222: gate electrode
223: source electrode
224: drain electrode
225: gate insulating film
226: Interlayer insulating film
227: Thin film transistor insulating film
228: Planarizing layer
229a: first contact hole
229b: second contact hole
240: organic light emitting element
241: anode
242: organic light emitting layer
243: cathode
244: Bank
245: Spacer
260: Connection

Claims (15)

A lower substrate;
An organic light emitting diode (OLED) disposed on the lower substrate;
A first inorganic encapsulation layer configured to cover the organic light emitting element;
A first organic layer configured to cover the first inorganic encapsulation layer,
And a second inorganic encapsulation layer configured to cover the first organic material layer,
Wherein the first organic layer comprises a inorganic plate-like mixture,
Wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer are in contact with each other in an outer region to seal the first organic layer. The method according to claim 1,
Wherein the inorganic plate-like mixture is plate-like clay pieces having a width of 40 to 1000 nanometers and a thickness of 1 nanometer or less. 3. The method of claim 2,
Wherein the ratio of the average (width / length) of the plate-like clay pieces to the number of the plate-shaped clay pieces is 50 to 500. The method of claim 3,
The plate-shaped viscosity pieces are muscovite _{(K (OHF 2) 2 Al} 3 Si 3 O 10) or biotite _{(K (Mg, Fe) 3} AlSi 3 O 10 (OH) 2), show the OLED, characterized in that one of the Device. 3. The method of claim 2,
Wherein the inorganic plate-like mixture is electrified and aligned so as to be oriented in the first organic layer. 3. The method of claim 2,
Wherein the inorganic plate-like mixture is treated to be hydrophilic or hydrophobic and aligned so as to be oriented in the first organic layer. 3. The method of claim 2,
The first organic material layer is a polymer resin and the first organic material layer in which the inorganic plate-like material mixture is mixed is formed by a screen printing method, a slit coating method, an ink-jet printing method, wherein the organic light emitting display device is one of an electric spray coating method and a chemical vapor deposition method. The method according to claim 1,
Wherein the organic light emitting display device is a flexible display device. The method according to claim 1,
Wherein the first inorganic encapsulation layer covers a pixel region and a bezel region, and the first organic layer covers a portion of the bezel region from the pixel region and the pixel region. A lower substrate;
An organic light emitting diode (OLED) disposed on the lower substrate;
A first inorganic encapsulation layer configured to cover the organic light emitting element;
A first organic layer configured to cover the first inorganic encapsulation layer;
A second organic material layer disposed on the first organic material layer,
And a second inorganic encapsulation layer configured to cover the second organic material layer,
Wherein the second organic layer comprises a inorganic plate-like mixture,
Wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer are in contact with each other in an outer region so that the first organic layer and the second organic layer are sealed. 12. The method of claim 11,
Wherein the first organic layer is configured to planarize the bank and the spacer. A lower substrate;
An organic light emitting diode (OLED) disposed on the lower substrate;
A first inorganic encapsulation layer configured to cover the organic light emitting element;
A first organic layer configured to cover the first inorganic encapsulation layer;
A second inorganic encapsulation layer configured to cover the first organic material layer;
A second organic layer configured to cover the second inorganic encapsulation layer and
And a third inorganic encapsulation layer configured to cover the second organic layer,
Wherein at least one of the first organic layer and the second organic layer includes a inorganic plate-
Wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer are configured to be in contact with each other in an outer region to seal the first organic layer, 2 < / RTI > organic layer is sealed. 13. The method of claim 12,
Wherein both the first organic layer and the second organic layer include the inorganic plate-like mixture. 13. The method of claim 12,
Wherein only the second organic layer includes the inorganic plate-like mixture. 13. The method of claim 12,
Wherein the first organic material layer is made of silicon oxycarbon.

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