KR20160049720A - Both-sides mounting module, PCB mounted Both-sides mounting module and method for manufacturing Both-sides mounting module - Google Patents

Both-sides mounting module, PCB mounted Both-sides mounting module and method for manufacturing Both-sides mounting module Download PDF

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Publication number
KR20160049720A
KR20160049720A KR1020140147255A KR20140147255A KR20160049720A KR 20160049720 A KR20160049720 A KR 20160049720A KR 1020140147255 A KR1020140147255 A KR 1020140147255A KR 20140147255 A KR20140147255 A KR 20140147255A KR 20160049720 A KR20160049720 A KR 20160049720A
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KR
South Korea
Prior art keywords
substrate
mounting module
solder balls
electrode
double
Prior art date
Application number
KR1020140147255A
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Korean (ko)
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KR101983176B1 (en
Inventor
정승필
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삼성전기주식회사
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Priority to KR1020140147255A priority Critical patent/KR101983176B1/en
Publication of KR20160049720A publication Critical patent/KR20160049720A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

An embodiment of the present invention relates to a double-sided mounting module, a printed circuit board in which the double-sided mounting module is mounted, and a method for manufacturing the double-sided mounting module. The double-sided mounting module comprises: a substrate in which an electrode for mounting is formed wherein a plurality of electronic devices are mounted on both sides of the substrate; a plurality of solder balls arranged on one surface of the substrate; and a plurality of electrode pads arranged to be close to an edge of the surface of the substrate where the plurality of solder balls are arranged wherein coupling force of the electrode pads is stronger than coupling force of the solder balls. Therefore, the double-sided mounting module can drastically enhance coupling force by small sacrifices of an area and a pin number.

Description

[0001] The present invention relates to a double-sided mounting module, a printed circuit board on which a double-sided mounting module is mounted, and a method for manufacturing the double-

The present invention relates to a two-sided mounting module, a printed circuit board on which a two-sided mounting module is mounted, and a method for manufacturing a two-sided mounting module.

Recently, as the functions of smart phones have been diversified and the number of components mounted inside the phone has increased, miniaturization and weight reduction of parts have been continuously demanded. For example, Wi-Fi modules are being applied with a two-sided mounting technique for miniaturization.

In addition, the number of pins connected to the outside is increasing with the support of various functions of the smartphone. Therefore, instead of the conventional LGA (Line Grid Array), a BGA (Ball Grid Array) type substrate is used.

However, the pins can not be placed on the bottom of the module due to the two-sided mounting, and the area of the pad is reduced due to the BGA. As a result, there is a problem that bonding force between the module and the printed circuit board (PCB) on which the module is mounted is weakened. The weakened bonding force has a problem that cracking of the solder ball is caused when the PCB is bent or twisted due to assembly, screwing or dropping of the set.

In order to solve the above problems, one embodiment of the present invention provides a double-sided mounting module having enhanced bonding force, a printed circuit board having mounted thereon a double-sided mounting module, and a method of manufacturing a double-

A double-sided mounting module according to an embodiment of the present invention includes: a substrate on which an electrode for mounting is formed, on which a plurality of electronic elements are mounted; A plurality of solder balls disposed on one side of the substrate; And a plurality of electrode pads disposed on the substrate, the plurality of electrode pads being closer to the edges of the surface on which the plurality of solder balls are disposed, . ≪ / RTI >

For enhancing the bonding strength of the electrode pads, the shape, area, etc. of the electrode pads may be different from those of the solder balls.

For stable bonding of the electrode pads, the electrode pads may be connected to a ground (GND) or a power supply electrode of the substrate.

In addition, the double-sided mounting module may be mounted on a printed circuit board (PCB) or the like.

An embodiment of the present invention can enhance the bonding force at the sacrifice of a small number of pins while the electronic elements are mounted in a wide range in a limited area of the substrate.

1 to 3 are views showing a double-sided mounting module according to an embodiment of the present invention.
4 is a view illustrating a printed circuit board on which a double-sided mounting module according to an exemplary embodiment of the present invention is mounted.
5 is a flowchart illustrating a method of manufacturing a two-sided mounting module according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order that those skilled in the art can easily carry out the present invention.

1 to 3 are views showing a double-sided mounting module according to an embodiment of the present invention.

1 to 3, a double-sided mounting module 1 according to an embodiment of the present invention may include a substrate 100, an electronic device 110, a solder ball 120, and an electrode pad 130 have.

In the substrate 100, an electrode for mounting may be formed.

The electronic device 110 may be mounted on both sides of the substrate 100. [ By mounting the electronic device 110 on both sides of the substrate 100, the space of the substrate 100 can be efficiently utilized.

The solder ball 120 may be disposed on one side of the substrate 100. Here, the solder ball may provide a bonding force for coupling with a PCB or the like. The solder ball 120 may be connected to an electrode formed on the substrate to serve as a pin or an external connection terminal of the module.

For example, a plurality of solder balls 120 may be arranged side by side on the edge of one side of the substrate 100. Since the electronic device 110 and the solder ball 120 are all disposed on one surface of the substrate 100, the mounting area of the electronic device 110 can be increased as the number of the solder balls is reduced. Accordingly, the number of solder balls can be limited by the number of pins required at the minimum in the substrate. A limited number of solder balls 120 are arranged side by side on the edge, so that the bonding force of the two-sided mounting module 1 can be efficiently improved.

Meanwhile, the interval between the plurality of solder balls 120 may be equal to or greater than a predetermined interval. When the size of the solder ball is increased, the interval between the plurality of solder balls can be narrowed. If the interval of the solder balls is narrower than the predetermined interval, a short may occur between the solder balls. Accordingly, when the size of the solder ball is increased, the number of solder balls is reduced, so that a short circuit between the solder balls can be prevented.

The electrode pads 130 may be arranged close to the edges of the surface on which the plurality of solder balls 120 are arranged on the substrate 100. Here, the proximity to the edge means that the distance from the edge is shorter on average as compared with the electronic devices 110. [

In addition, since the edge of the surface includes the vertex of the surface, the electrode pad 130 may be disposed close to the vertex of the surface on which the plurality of solder balls 120 are arranged on the substrate 100. Here, the electrode pad 130 may be arranged closer to the vertex of the electronic device 110 and the solder ball.

In addition, the electrode pad 130 may have a stronger bonding force than the solder ball.

For example, when the substrate 100 is polygonal, the corner portions of the substrate 100 may be susceptible to impacts such as warping, warping, and dropping. Therefore, the electrode pad 130 having stronger coupling force than the solder ball 120 is disposed at a position close to the edge of the substrate 100, so that the substrate 100 can be further strengthened against the impact.

Hereinafter, the bonding force enhancing means of the electrode pad 130 will be described.

Referring to FIG. 1, the electrode pad 130 may be connected to four electrodes of the substrate 100 to have a square shape. That is, since the area of the electrode pad 130 is wider than the area of the solder ball 120, the bonding force of the electrode pad 130 can be enhanced.

Referring to FIG. 2, the electrode pad 130 may be connected to three electrodes of the substrate so as to be in the 'a' shape. The area of the electrode pad 130 may be larger than the area of the solder ball 120 and may be narrower than the area of the electrode pad of FIG. For example, the electrode pad of FIG. 1 may be replaced with an 'a' type electrode pad and a solder ball 120. The 'a' shaped electrode pad may be disposed close to the edge line of the substrate 100, and one solder ball 120 may be disposed in an empty space. Accordingly, the electrode pad 130 can enhance the bonding force by sacrificing a small number of solder balls.

Referring to FIG. 3, the electrode pad 130 may have an area and shape similar to the solder ball 120. For example, the bonding strength of the electrode pad 130 can be enhanced not only by the shape but also by the bonding force of the material, the disposition method, and the like. Therefore, the electrode pad 130 disposed at the edge of the substrate 100 is not limited to a particular shape, and the area of the electrode pad 130 is not necessarily wider than the area of the solder ball 120.

Meanwhile, the electrode pad 130 may be connected to a ground (GND) of the substrate 100 or a power supply electrode. Through this, a short circuit between the electrodes can be prevented.

4 is a view illustrating a printed circuit board on which a double-sided mounting module according to an exemplary embodiment of the present invention is mounted.

Referring to FIG. 4, the double-sided mounting module 1 may be mounted on the printed circuit board 200. Generally, since the printed circuit board 200 is thin and wide, it is likely to be momentarily bent due to vibration due to an impact such as twisting, warping, or falling.

However, the double-sided mounting module 1 mounted on the printed circuit board 200 is much smaller than the printed circuit board 200. Therefore, the impact received by the double-sided mounting module 1 may be much larger or smaller than the average impact that the printed circuit board 200 receives.

Because of such a difference in impact, cracks may occur in the corner portions of the two-sided mounting module 1. [ Also, the greater the area of the double-sided mounting module 1, the higher the probability that cracks will occur in the corner portions.

Therefore, the double-sided mounting module 1 can be stably coupled to the printed circuit board 200 by disposing the electrode pad 130 having strong bonding force at the corner of the double-sided mounting module 1. [

Hereinafter, a method of manufacturing a double-sided mounting module according to an embodiment of the present invention will be described. The same or equivalent contents to those described above with respect to the above-described two-sided mounting module with reference to Figs. 1 to 3 will not be described redundantly.

5 is a flowchart illustrating a method of manufacturing a two-sided mounting module according to an embodiment of the present invention.

5, a two-sided mounting module according to an embodiment of the present invention includes a step of mounting a plurality of electronic elements on both sides of a substrate on which a mounting electrode is formed (S10), a plurality of solder balls (S30) of arranging a plurality of electrode pads each having a stronger bonding force than the solder balls in the vicinity of the edge of the surface on which the plurality of solder balls are arranged in the substrate, respectively.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Anyone can make various variations.

1: double-sided mounting module 100: substrate
110: electronic device 120: solder ball
130: electrode pad 200: printed circuit board

Claims (7)

A substrate on which an electrode for mounting is formed and on which a plurality of electronic elements are mounted;
A plurality of solder balls disposed on one side of the substrate; And
A plurality of electrode pads arranged on the substrate in proximity to the edges of the surface on which the plurality of solder balls are arranged and having a stronger bonding force than the solder balls; Lt; / RTI >
The method according to claim 1,
Each of the plurality of solder balls is connected to one electrode of the substrate,
Wherein the plurality of electrode pads are connected to four electrodes of the substrate to form a square shape.
The method according to claim 1,
Each of the plurality of solder balls is connected to one electrode of the substrate,
Wherein the plurality of electrode pads are connected to the three electrodes of the substrate to form a 'A' shape.
The method according to claim 1,
Wherein the plurality of electrode pads are respectively connected to a ground (GND) or a power supply electrode of the substrate.
The method according to claim 1,
Wherein the plurality of electrode pads are disposed close to the vertexes of the surface on which the plurality of solder balls are arranged in the substrate, respectively, and closer to the vertexes than the electronic element and the solder ball.
Printed circuit board; And
A two-sided mounting module mounted on the printed circuit board; / RTI >
The double-sided mounting module includes:
A substrate on which an electrode for mounting is formed and on which a plurality of electronic elements are mounted;
A plurality of solder balls disposed on one side of the substrate and bonded to the printed circuit board; And
A plurality of electrode pads arranged on the substrate in proximity to the edges of the surfaces on which the plurality of solder balls are arranged and bonded to the printed circuit board and having a stronger bonding force than the solder balls; And a printed circuit board mounted on the printed circuit board.
Mounting a plurality of electronic elements on both sides of a substrate on which a mounting electrode is formed;
Disposing a plurality of solder balls on one side of the substrate; And
Disposing a plurality of electrode pads, each having a stronger bonding force than a solder ball, near the edge of the surface on which the plurality of solder balls are arranged; Lt; RTI ID = 0.0 > 1, < / RTI >
KR1020140147255A 2014-10-28 2014-10-28 Both-sides mounting module, PCB mounted Both-sides mounting module and method for manufacturing Both-sides mounting module KR101983176B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140147255A KR101983176B1 (en) 2014-10-28 2014-10-28 Both-sides mounting module, PCB mounted Both-sides mounting module and method for manufacturing Both-sides mounting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140147255A KR101983176B1 (en) 2014-10-28 2014-10-28 Both-sides mounting module, PCB mounted Both-sides mounting module and method for manufacturing Both-sides mounting module

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KR20160049720A true KR20160049720A (en) 2016-05-10
KR101983176B1 KR101983176B1 (en) 2019-05-28

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179175A (en) * 2001-12-10 2003-06-27 Kyocera Corp Wiring board
JP2003338585A (en) * 2002-05-22 2003-11-28 Kyocera Corp Wiring board
KR20130056570A (en) * 2011-11-22 2013-05-30 삼성전기주식회사 Semiconductor package and manufacturing method threrof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179175A (en) * 2001-12-10 2003-06-27 Kyocera Corp Wiring board
JP2003338585A (en) * 2002-05-22 2003-11-28 Kyocera Corp Wiring board
KR20130056570A (en) * 2011-11-22 2013-05-30 삼성전기주식회사 Semiconductor package and manufacturing method threrof

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