KR20160028817A - Organic light emitting diode display apparatus and method for manufacturing the same - Google Patents

Abstract

According to an embodiment of the present invention, an organic light emitting display apparatus integrated with a touch screen is provided. The apparatus comprises: a lower substrate; a plurality of lower substrate connection pads arranged on the lower substrate; an upper substrate facing the lower substrate; a plurality of upper connection pads arranged on the upper substrate to correspond to the lower connection pads; and a side wall arranged between the lower substrate connection pads or the upper connection pads. According to an embodiment of the organic light emitting display apparatus, a conductive ball is not placed between upper pads or lower pads through the side wall. As such, a short circuit is minimized between the upper pads or the lower pads to reduce a malfunction rate of the organic light emitting display apparatus integrated with the touch screen.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch screen integrated type organic light emitting display device and a touch screen integrated type organic light emitting display device,

The present invention relates to a touch screen integrated type organic light emitting diode (OLED) display device and a touch screen integrated type OLED display device, and more particularly, Type OLED display device.

The organic light emitting display device is a self-emission type display device, unlike a liquid crystal display device, a separate light source is not required, and thus it can be manufactured in a light and thin shape. Further, the organic light emitting display device is not only advantageous from the viewpoint of power consumption by low voltage driving, but also excellent in color implementation, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next generation display.

In a general organic light emitting display, a touch screen is implemented by attaching a touch screen panel on an upper substrate. In such an organic light emitting diode display, since the touch screen panel is separately manufactured and attached to the outer surface of the organic light emitting diode display device, the entire thickness of the OLED display device is increased and the visibility of the image is lowered due to the increased thickness have.

In recent years, an in-cell type touch screen integrated type organic light emitting display device in which a touch screen panel is integrated with an organic light emitting display has been developed to solve the above problems.

In the conventional method of fabricating a touch screen integrated type organic light emitting display, a connection conductive film including conductive balls such as ACF (Anisotropic Conductive Film) is attached to the lower connection pad of the lower substrate or the upper connection pad of the upper substrate. Further, an adhesive material such as a face seal is applied to the lower substrate, or an adhesive film is adhered thereto. Next, after the connection conductive film is attached to the upper connection pad or the lower connection pad, the upper substrate and the lower substrate are bonded together.

However, the conductive balls included in the ACF do not have a constant arrangement or spacing but are arranged irregularly. Therefore, the density of the conductive balls can be controlled, but the distance between the conductive balls is difficult to control. Accordingly, when the conductive balls are broken due to heat and / or pressure applied to the upper substrate and the lower substrate during the adhesion process, the conductive balls are agglomerated to form not only the upper connection pads and the lower connection pads, Can be electrically connected to each other. Or a short circuit in which the wirings around the connection pads are connected may occur.

It is important that the size of the conductive ball is large enough to connect the upper connection pad and the lower connection pad in conducting the upper connection pad and the lower connection pad. Meanwhile, the size of the conductive ball used is determined by the size of the lower connection pad and the upper connection pad, and the distance between the connection pads. However, if the distance between the lower connection pads and the upper connection pads is small, the connection pads and the upper connection pads may be short-circuited by the conductive balls when the plurality of conductive balls are continuously broken, There is a problem that the size of the conductive ball can not be increased as long as the distance between the upper connection pads is kept small.

[Related Technical Literature]

1. Anisotropic conductive film, manufacturing method of display panel using same, and flat panel display module including the display panel (Korean Patent Application No. 2011-0044813)

DISCLOSURE Technical Problem The inventors of the present invention have invented a new structure of a touch screen integrated type organic light emitting display and a method of manufacturing the same to solve the problems caused by using the conventional method of manufacturing a touch screen integrated type organic light emitting display as described above.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a touch screen integrated type organic light emitting display device having improved reliability by using a large size conductive ball for easy conduction while minimizing a space between upper connection pads and lower connection pads, And a method for manufacturing the same.

Another object of the present invention is to provide a touch screen integrated type organic light emitting display and a method of manufacturing the same, in which the shortage between the lower connection pads or the upper connection pads is minimized while using a large size conductive ball, .

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a touch screen integrated type organic light emitting diode display. The touch screen integrated type organic light emitting diode display includes a plurality of lower connection pads arranged on a lower substrate and a lower substrate, and a plurality of upper connection parts arranged on the upper substrate so as to correspond to an upper substrate and a lower connection pad, Pad. The touch screen integrated type organic light emitting display includes a plurality of lower connection pads or barrier ribs disposed between the plurality of upper connection pads. According to the touch screen integrated type organic light emitting diode display according to the embodiment of the present invention, the conductive balls are not located between the upper pads or between the lower pads by the partition walls. Therefore, a short circuit between the lower pads or between the lower pads is minimized, thereby reducing the defect rate of the touch screen integrated type organic light emitting display device.

According to another aspect of the present invention, the touch screen integrated type organic light emitting display further includes a connection conductive film electrically connecting the lower connection pad and the upper connection pad.

According to another aspect of the present invention, the connecting conductive film is in contact with the partition wall.

According to another aspect of the present invention, the barrier rib is formed of a plurality of layers, and a layer in contact with the connecting conductive film among the plurality of layers is formed so as to surround the remaining layers.

According to still another aspect of the present invention, the connecting conductive film is formed of an ACF (Anisotropic Conductive Film) including a conductive ball.

According to another aspect of the present invention, there is provided a touch screen integrated type organic light emitting diode display, further comprising an adhesive layer interposed between the upper substrate and the lower substrate, wherein the connection conductive film includes conductive balls and is made of the same material as the adhesive layer do.

According to still another aspect of the present invention, the height of the partition is at least one third of the diameter of the conductive ball.

According to another aspect of the present invention, the width of the partition wall is less than 1/4 of the diameter of the conductive ball.

According to another aspect of the present invention, the length of the barrier rib is equal to or greater than the length of the lower connection pad or the upper connection pad.

According to another aspect of the present invention, a touch screen integrated type organic light emitting diode display further includes a thin film transistor disposed on a lower substrate, a lower planarization layer for flatting the upper portion of the thin film transistor, a bank layer and a spacer disposed on the lower planarization layer, The barrier ribs are barrier ribs disposed between the plurality of lower connection pads, and the barrier ribs are made of the same material as at least one of the lower planarization layer, the bank layer, and the spacers.

According to another aspect of the present invention, a touch screen integrated organic light emitting display further includes a color filter disposed on the upper substrate, a black matrix disposed on the color filter, and a top planarization layer disposed on the black matrix and the color filter And the barrier ribs are barrier ribs disposed between the plurality of upper connection pads, and the barrier ribs are made of the same material as at least one of the color filter, the black matrix, and the upper planarization layer.

According to another aspect of the present invention, the barrier rib is disposed so as to surround each of the plurality of lower connection pads or each of the plurality of upper connection pads.

According to another aspect of the present invention, the touch screen integrated type organic light emitting diode display further includes a touch sensing electrode disposed on the upper substrate, and the touch sensing electrode is electrically connected to the plurality of upper connection pads.

According to still another aspect of the present invention, the barrier rib is disposed between the plurality of lower connection pads and between the plurality of upper connection pads.

According to another aspect of the present invention, the space between the plurality of lower connection pads or the plurality of upper connection pads is larger than the width of the partition.

According to an aspect of the present invention, there is provided a method of manufacturing a touch screen integrated type organic light emitting display, In the method of fabricating a touch screen integrated type organic light emitting display, a plurality of lower connection pads are formed on a lower substrate, and a plurality of upper connection pads are formed on an upper substrate. Next, a partition wall is formed between the plurality of upper connection pads or the plurality of lower connection pads. The conductive balls are disposed between the plurality of lower connection pads and the plurality of upper connection pads by applying an organic material including conductive balls on the plurality of upper connection pads or the plurality of lower connection pads or by disposing the ACF including the conductive balls . Next, the upper substrate and the lower substrate are bonded together. According to the method for fabricating a touch screen integrated type organic light emitting display device according to an embodiment of the present invention, since the conductive balls are not disposed between the lower connection pads or between the upper connection pads by the barrier ribs, The occurrence of short-circuit defects due to continuous breakage of the conductive balls is reduced.

According to another aspect of the present invention, the step of forming the barrier ribs may include forming the barrier ribs to surround the plurality of upper connection pads or the plurality of lower connection pads.

According to another aspect of the present invention, the step of forming the partition is performed by laminating a plurality of layers, and the step of disposing the conductive balls between the plurality of lower connection pads and the plurality of upper connection pads is performed by disposing the ACF And the step of bonding the upper substrate and the lower substrate includes pressing the upper substrate or the lower substrate such that a layer in contact with the ACF among the plurality of layers surrounds the remaining layer.

According to still another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: applying an organic material to a lower substrate before a step of bonding an upper substrate and a lower substrate, wherein conductive balls are arranged between a plurality of lower connection pads and a plurality of upper connection pads Is characterized in that the step is carried out by applying an organic matter containing conductive balls.

The details of other embodiments are included in the detailed description and drawings.

Since the conductive balls are not disposed between the lower connection pads or between the upper connection pads by the partition walls, a larger conductive ball can be used while maintaining a narrow space between the lower connection pads or between the upper connection pads have.

A larger conductive ball facilitates conduction between the upper connection pad and the lower connection pad. Accordingly, the present invention provides a touch screen integrated type organic light emitting display device with improved reliability and a method of manufacturing the same.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a schematic plan view for explaining a lower substrate of a touch screen integrated type organic light emitting diode display according to an embodiment of the present invention.
2 is a schematic plan view illustrating an upper substrate of a touch screen integrated type OLED display according to an exemplary embodiment of the present invention.
3 is a schematic plan view illustrating a touch screen integrated type organic light emitting display according to an exemplary embodiment of the present invention.
4 is a schematic cross-sectional view illustrating an integrated touch screen type organic light emitting display according to an embodiment of the present invention, taken along the line IV-IV 'of FIG.
5 is a schematic cross-sectional view for explaining a touch screen integrated type organic light emitting display according to another embodiment of the present invention.
6 is a schematic plan view illustrating an upper substrate of a touch screen integrated touch screen integrated type organic light emitting display according to another embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a touch screen integrated type organic light emitting display according to an exemplary embodiment of the present invention.
8A to 8F are cross-sectional views illustrating a method of manufacturing a touch screen integrated type organic light emitting display according to an exemplary embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

It is to be understood that an element or layer is referred to as being "on" another element or layer, including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

1 is a schematic plan view for explaining a lower substrate of a touch screen integrated type organic light emitting diode display according to an embodiment of the present invention. 1, only the lower substrate 110, the lower connection pad 150, the driving IC 191, and the FPCB connection pad 192 among various components of the touch screen integrated type organic light emitting display device 100 are shown.

Referring to FIG. 1, the lower substrate 110 supports various components of the touch screen integrated type organic light emitting diode display 100, and is formed of an insulating material. The lower substrate 110 may be made of a material having flexibility, and may be made of plastic such as polyimide (PI) or the like. As the lower substrate 110 is formed of a material having flexibility, a back plate for supporting the lower substrate 110 may be used.

The lower substrate 110 has a display area DA, a non-display area NA, and an exposed area EA. The display area DA refers to an area where an image is displayed in the touch-screen integrated type organic light emitting diode display 100, in which a thin film transistor, an organic light emitting diode, and the like are disposed. The non-display area NA is an area where the image is not displayed in the touch-screen integrated type organic light emitting diode display 100, and is a region in which the wiring or the circuit is disposed, though not shown in FIG. Referring to Fig. 1, the non-display area NA surrounds the display area DA. The exposed region EA is a region extending from one side of the non-display area NA and is a region where the upper substrate 115 and the lower substrate 110 are not covered by the upper substrate and are exposed to the outside it means. An FPCB connection pad 192 and a driving IC 191 for connecting to the FPCB are disposed in the exposed area EA and various wirings may be formed although not shown in FIG.

And the lower connection pad 150 is disposed in the non-display area NA of the lower substrate 110. [ The lower connection pad 150 is a pad for transmitting a sensing signal from the touch sensing unit disposed on the upper substrate 115 to the FPCB and is disposed adjacent to the exposed area EA in the non-display area NA. That is, the lower connection pad 150 is disposed between the display area DA and the exposed area EA of the non-display area NA. Although not shown in FIG. 1, the lower connection pad 150 may be connected to the FPCB connection pad 192 through a separate wiring. The lower connection pad 150 may be formed of the same material as one of various conductive materials constituting the thin film transistor and the organic light emitting device arranged in the display area DA. Although the lower connection pad 150 is illustrated as being disposed on the left and right sides of the lower substrate 110 for convenience of description in FIG. 1, the position of the lower connection pad 150 is not limited to that of the lower connection pad 150 And the like are not limited to the embodiment shown in Fig.

A barrier rib 160 is disposed on the lower substrate 110. Specifically, the barrier ribs 160 are formed between the lower connection pads 150. In FIG. 1, the barrier ribs 160 are formed to prevent the lower connection pads 150 from being short-circuited by conductive balls for electrically connecting the lower connection pads 150 and the upper connection pads 170. That is, when the connection conductive film including the conductive ball is attached to the lower connection pad 150, the conductive ball is not disposed between the lower connection pads 150, but is adjacent to the lower connection pad 150 So that the conductive balls can be guided. Since the conductive balls are not located between the lower connection pads 150, the occurrence of a short circuit between the lower connection pads 150 can be greatly reduced.

2 is a schematic plan view illustrating an upper substrate of a touch screen integrated type OLED display according to an exemplary embodiment of the present invention. 2, only the upper substrate 115, the upper connection pad 170, and the wiring 175 among various components of the touch screen integrated type OLED display 100 are shown.

The upper substrate 115 is disposed opposite to the lower substrate 110 to support various components of the touch screen integrated type OLED display 100. The upper substrate 115 may be made of a material having flexibility or may be made of the same material as the lower substrate 110. The upper substrate 115 is disposed so as to face the remaining region except for the exposed region EA of the lower substrate 110. [ That is, the upper substrate 115 includes a region corresponding to the display region DA of the lower substrate 110 and a region corresponding to the non-display region NA of the lower substrate 110, The size may be the same as the size of the region except the exposed region EA in the lower substrate 110. 2, a portion corresponding to the outer edge of the exposed region EA of the lower substrate 110 is shown by a dotted line on the upper side of the upper substrate 115 and a display region DA and a non- NA) is indicated by a dotted line inside the upper substrate 115. [0064]

A touch sensing unit is formed inside the dotted line of the upper substrate 115. The touch sensing unit is formed in a region corresponding to the display area DA of the lower substrate 110. The touch sensing unit may include a touch sensing electrode for recognizing a touch from a user.

An upper connection pad 170 is formed on the upper substrate 115. The upper connection pad 170 is formed at a position corresponding to the lower connection pad 150. That is, when the upper substrate 115 and the lower substrate 110 are bonded together, the upper connection pad 170 is formed to overlap with the lower connection pad 150. The upper connection pad 170 is electrically connected to the touch sensing electrode of the touch sensing unit via the wiring 175.

3 is a schematic plan view illustrating a touch screen integrated type organic light emitting display according to an exemplary embodiment of the present invention. 4 is a schematic cross-sectional view illustrating an integrated touch screen type organic light emitting display according to an embodiment of the present invention, taken along the line IV-IV 'of FIG. FIG. 3 is a schematic plan view of a state in which the lower substrate 110 shown in FIG. 1 and the upper substrate 115 shown in FIG. 2 are joined together. In FIG. 3, the components formed under the upper substrate 115 are shown by dotted lines.

Referring to FIGS. 3 and 4, a multi-buffer layer 115 is formed on a lower substrate 110. A thin film transistor 130 is formed on the multi-buffer layer 115. Specifically, on the multi-buffer layer 115, a thin film transistor having a coplanar structure including an active layer 131, a gate electrode 132, a source electrode 133, and a drain electrode 134 is formed. The active layer 131 and the gate electrode 132 are insulated by the gate insulating layer 123 and the interlayer interlevel layer 124 insulates the gate electrode 132 and the source electrode 133 and the drain electrode 134 . However, the thin film transistor 130 is not limited thereto, and a thin film transistor having various structures can be used.

A planarization layer 141 is formed on the thin film transistor 130. The planarization layer 141 is a layer for planarizing the upper portion of the thin film transistor 130. The planarization layer 141 has a contact hole exposing at least a part of the drain electrode 134 or the source electrode 133 of the thin film transistor 130. An organic light emitting element 135 including an anode 136, an organic light emitting layer 137, and a cathode 138 is formed on the planarization layer 141. The anode 136 is connected to the source electrode 133 or the drain electrode 134 of the thin film transistor 130 through the contact hole of the planarization layer 141. A bank layer 142 is disposed on the side surface of the anode 136.

The organic light emitting layer 137 is made of an organic light emitting material for emitting light. The organic light emitting layer 137 may be one of a red organic light emitting material, a green organic light emitting material, and a blue organic light emitting material. However, the present invention is not limited thereto, and it may be made of a plurality of layers of organic light emitting materials for emitting various colors. On the bank layer 142, a spacer 143 for supporting a mask for forming an organic light emitting material may be formed. The organic light emitting layer 137 may include a plurality of organic light emitting materials for emitting white light. In this case, the spacer 143 may not be formed. On the organic light emitting layer 137, a cathode 138 is formed. The cathode 138 is formed of a very thin work function metal material or a transparent conductive oxide.

Although not shown in FIG. 4, an adhesive layer for attaching the upper substrate 115 and the lower substrate 110 may be interposed between the upper substrate 115 and the lower substrate 110. The adhesive layer is composed of an adhesive for bonding the upper substrate 115 and the lower substrate 110, and adheres the upper substrate 115 and the lower substrate 110 to each other. The adhesive layer may be formed by sealing the organic light emitting element 135 of the display portion formed on the lower substrate 110 and protecting the organic light emitting element 135 from penetration of moisture or oxygen from the outside of the touch screen integrated type organic light emitting diode display 100 . ≪ / RTI > As the adhesive layer, various materials can be used. For example, adhesive materials such as OCA (Optical Clear Adhesive), OCR (Optical Clear Resin), PSA (Pressure Sensitive Adhesive) and the like can be used.

A plurality of color filters 144 and 145 are disposed in the display area DA of the upper substrate 115 and a black matrix 146 is disposed under the color filters 144 and 145. A touch sensing electrode 148 is formed under the black matrix 146 and an upper planarization layer 147 is disposed under the touch sensing electrode 148.

In the non-display area NA, the wiring 175 is disposed below the upper substrate 115. An upper connection pad 170 is disposed on the side of the wiring 175 below the upper substrate 115. A lower connection pad 150 is disposed on the lower substrate 110 to correspond to the upper connection pad 170.

A connection conductive film 185 is formed between the lower connection pad 150 and the upper connection pad 170. The connection conductive film 185 may be an ACF (Anisotropic Conductive Film) including the conductive balls 180. The conductive ball 180 electrically connects the lower connection pad 150 and the upper connection pad 170.

Referring to FIGS. 3 and 4, the barrier ribs 160 are disposed between the lower connection pads 150. The barrier ribs 160 contact the connection conductive film 185. The barrier ribs 160 are formed of an insulating material. The barrier ribs 160 may be formed of the same material as at least one of various insulating layers formed on the touch screen integrated type organic light emitting diode display device 100. For example, the barrier ribs 160 may be formed of the same material as at least one of the planarization layer 141, the bank layer 142, and the spacers 143.

4 is formed of a plurality of layers made of the same material as the planarization layer 141 and the bank layer 142. [ The uppermost layer made of the same material as the bank layer 142 among the plurality of layers is in contact with the connection conductive film 185 and the layer 162 in contact with the connection conductive film 185 is formed of the same material as the underlying planarization layer 141 As shown in FIG.

3, the length L2 of the partition 160 is equal to or greater than the length L1 of the lower connection pad 150 or the upper connection pad 170. [ If the length L2 of the barrier rib 160 is smaller than the length L2 of the lower connection pad 150 or the upper connection pad 170, The ball 180 is positioned, and the lower connection pads 150 can be short-circuited.

4, the interval W2 between the plurality of lower connection pads 150 is greater than the width W1 of the barrier ribs 160. As shown in FIG. The insulating barrier 160 does not cover the lower connection pad 150 when the distance W2 between the lower connection pads 150 is greater than the width W1 of the barrier rib 160. [ When the barrier rib 160 covers the lower connection pad 150, conduction between the lower connection pad 150 and the upper connection pad 170 by the conductive ball 180 may not be established.

Since the partition 160 is formed between the lower connection pads 150, the lower connection pads 150 and the upper connection pads 170 are formed in the touch screen integrated type organic light emitting diode display 100 according to an embodiment of the present invention. The conductive balls 180 are not positioned between the lower connection pads 150 by the partition 160 when the conductive balls 180 are connected. A conductive ball 180 having a size sufficient to connect the upper connection pad 170 and the lower connection pad 150 without shorting the lower connection pads 150 can be used. In addition, while the conductive balls 180 of this size are used, the interval between the lower connection pads 150 can be kept narrow.

3 and 4, the touch screen integrated type organic light emitting diode display 100 is described as employing a connection conductive film 185 such as an ACF including a conductive ball 180. However, And the pad 150 and the upper connection pad 170 are electrically connected to each other.

For example, in the touch screen integrated type organic light emitting diode display 100 according to another embodiment of the present invention, a connection conductive film 185 is formed of the same material as the adhesive layer interposed between the upper substrate 115 and the lower substrate 110 . The connection conductive film 185 formed of the same material as the adhesive layer is formed by applying an organic material on which the conductive balls 180 are dispersed to the lower connection pad 150. The organic material may be applied by a dispensing method, a screen printing method using a mesh mask, or the like. When the touch screen integrated type OLED display 100 is bended, the force transmitted to the display area DA and the force transmitted to the display area DA by the upper connection pads 185 of the non-display area NDA, The force transmitted to the lower connecting pad 170 and the lower connecting pad 150 becomes equal. Accordingly, the peeling phenomenon and cracks that may occur when the touch screen integrated type organic light emitting display device 100 is bent can be minimized.

5 is a schematic cross-sectional view for explaining a touch screen integrated type organic light emitting display according to another embodiment of the present invention. 5 is different from the touch screen integrated type OLED display 100 shown in FIG. 4 in that the barrier ribs 160 are formed on the upper substrate 115, not on the lower substrate 110, ), The other components are substantially the same, so redundant explanations are omitted.

Referring to FIG. 5, the barrier ribs 160 are disposed under the upper substrate 115. The barrier rib 160 includes a plurality of color filters 144 and 145 disposed on the upper substrate 115, a black matrix 146 and a black matrix 146 disposed on the color filters 144 and 145 and a color filter 144 The upper planarization layer 147 may be formed of the same material as at least one of the upper planarization layers 147 disposed on the upper planarization layer 147, 5, the barrier ribs 160 are formed of a plurality of layers made of the same material as the color filters 144 and 145, the black matrix 146, and the upper planarization layer 147. A layer made of the same material as the upper planarization layer 147 among the plurality of layers is in contact with the connection conductive film 185 and the layer 267 in contact with the connection conductive film 185 is in contact with the rest of the plurality of layers 264, 266, respectively.

3 to 5, the barrier ribs 160 of the touch screen integrated type organic light emitting display device 100 are disposed between the lower connection pads 150 or between the upper connection pads 170. However, without being limited thereto, the barrier ribs 160 may be disposed both between the lower connection pads 150 and between the upper connection pads 170. When the barrier ribs 160 are disposed between the lower connection pads 150 and the upper connection pads 170, the frequency at which the conductive balls 180 short-circuit between the pads can be further reduced.

6 is a schematic plan view illustrating an upper substrate of a touch screen integrated touch screen integrated type organic light emitting display according to another embodiment of the present invention. The upper substrate 115 of the touch screen integrated type organic light emitting diode display 100 shown in FIG. 6 is different from the upper substrate 115 of the touch screen integrated type organic light emitting display 100 shown in FIG. Except that it is arranged so as to surround each of the upper connection pads 170, the other components are substantially the same, and redundant description will be omitted. Referring to FIG. 6, the barrier ribs 160 are disposed to surround each of the plurality of upper connection pads 170. When the conductive balls 180 are in contact with the upper connection pads 170, the conductive balls 180 are not formed in the upper connection pads 170 The possibility of leaving the part is reduced. In addition, it is possible to minimize the shorting of the upper connection pad 170 by foreign matters that may occur during scribing of the upper main substrate.

7 is a flowchart illustrating a method of manufacturing a touch screen integrated type organic light emitting display according to an exemplary embodiment of the present invention. 8A to 8F are cross-sectional views illustrating a method of manufacturing a touch screen integrated type organic light emitting display according to an exemplary embodiment of the present invention. 8A to 8F are process cross-sectional views for manufacturing the touch screen integrated type organic light emitting diode display 100 of FIG. 4, so duplicate descriptions are omitted.

First, a plurality of lower connection pads 150 are formed on the lower substrate 110 (S710). The plurality of lower connection pads 150 may be formed of the same material as the gate electrode 132, the source electrode 133, or the drain electrode 134 of the thin film transistor 130 formed on the lower substrate 110. Referring to FIG. 8A, a plurality of lower connection pads 150 made of the same material as the source electrode 133 or the drain electrode 134 are patterned and formed.

Next, a plurality of upper connection pads 170 are formed on the upper substrate 115 (S720). The plurality of upper connection pads 170 may be formed of the same material as the wiring 175 formed on the upper substrate 115. Referring to FIG. 8B, a plurality of upper connection pads 170 made of the same material as the wiring 175 are patterned.

Next, the barrier ribs 160 are formed between the plurality of lower connection pads 150 (S730). The formation of the barrier ribs 160 is performed by laminating a plurality of layers and the barrier ribs 160 are formed of the same material as at least one of the planarization layer 141, the bank layer 142 and the spacers 143 as described above . Referring to FIG. 8C, the barrier ribs 160 are formed of the same material as the planarization layer 141 and the bank layer 142. 8C, the thickness of the barrier ribs 160 is equal to the sum of the thicknesses of the planarization layer 141 and the bank layers 142. [

Next, the conductive balls 180 are disposed on the plurality of lower connection pads 150 by arranging the connection conductive film 185 including the conductive balls 180 on the plurality of the lower connection pads 150 (S740 ). Referring to FIG. 8D, a connection conductive film 185 including conductive balls 180 is disposed on the lower pad. A protective film 192 is attached on the connection conductive film 185. The conductive balls 180 are disposed at irregular positions in the connection conductive film 185. Here, the height h1 of the barrier ribs 160 is at least 1/3 of the diameter h2 of the conductive balls 180. When the height h1 of the barrier rib 160 is at least 1/3 of the diameter h2 of the conductive ball 180, the conductive ball 180 is moved to the side of the barrier rib 160, As shown in FIG. When the height h1 of the barrier rib 160 is less than 1/3 of the diameter h2 of the conductive ball 180, it is difficult to prevent the conductive balls 180 from continuing to short-circuit the lower connection pad 150.

The width of the barrier ribs 160 is 1/4 or less of the diameter h2 of the conductive balls 180. When the width of the barrier rib 160 is 1/4 or less of the diameter h2 of the conductive ball 180, the conductive ball 180 is not located above the barrier rib 160, And is arranged to be disposed on the connection pad 150. When the width of the partition wall 160 exceeds 1/4 of the diameter h2 of the conductive balls 180, the conductive balls 180 can be placed on the partition walls 160, and the conductive balls 180 can be continuously So that the lower connection pads 150 can be short-circuited.

A connection conductive film 185 is then attached to the lower substrate 110 such that the conductive balls 180 are in contact with the lower connection pad 150. The protective film 192 is removed from the connection conductive film 185 attached to the lower substrate 110. [ Some of the conductive balls 180 disposed at irregular positions within the connection conductive film 185 are moved along the side surfaces of the barrier ribs 160 to be disposed on the lower connection electrodes. In addition, the connection conductive film 185 is attached to the lower substrate 110, and the connection conductive film 185 presses the barrier ribs 160. At this time, the layer 162 in contact with the connection conductive film 185 of the plurality of barrier ribs 160 is deformed by the pressure as shown in FIG. 8E, and is formed so as to surround the remaining one of the plurality of layers 161 . Next, the upper substrate 115 and the lower substrate 110 are bonded together. The conductive balls 180 are not disposed between the lower connection pads 150 by the barrier ribs 160 so that the upper substrate 115 is electrically connected to the lower connection pads 150. In the method of manufacturing the touch screen integrated type organic light emitting display device according to an embodiment of the present invention, The occurrence of a short circuit failure due to continuous breakage of the upper conductive balls 180 when the upper substrate 110 and the lower substrate 110 are attached together is reduced.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 200, 300: touch screen integrated type organic light emitting display
110: Lower substrate
115: upper substrate
122: multi-buffer layer
123: gate insulating layer
124: interlayer insulating layer
130: thin film transistor
131: active layer
132: gate electrode
133: source electrode
134: drain electrode
135: Organic light emitting device
136: anode
137: organic light emitting layer
138: cathode
141: planarization layer
142: bank layer
143: Spacer
144, 145: Color filter
146: Black Matrix
147: upper planarization layer
148: Touch sensing electrode
150: Lower connection pad
160, 260, 360:
161, 264, 265, 266: the remaining layer
162, 267: a layer in contact with the connection conductive layer
170: upper connection pad
175: Wiring
180: conductive ball
185, 190: Conductive membrane
192: Shield
191: Driving IC
192: FPCB connection pad

Claims (19)

A lower substrate;
A plurality of lower connection pads disposed on the lower substrate;
An upper substrate facing the lower substrate;
A plurality of upper connection pads disposed on the upper substrate corresponding to the lower connection pads; And
And the barrier ribs are disposed between the plurality of lower connection pads or between the plurality of upper connection pads. The method according to claim 1,
Further comprising a connection conductive film electrically connecting the lower connection pad and the upper connection pad. 3. The method of claim 2,
And the connection conductive film is in contact with the barrier rib. The method of claim 3,
Wherein the partition wall is formed of a plurality of layers,
And a layer in contact with the connection conductive film among the plurality of layers is formed so as to surround the remaining layers of the plurality of layered layers. 3. The method of claim 2,
Wherein the connection conductive film is made of an ACF (Anisotropic Conductive Film) including a conductive ball. 3. The method of claim 2,
Further comprising an adhesive layer interposed between the upper substrate and the lower substrate,
Wherein the connection conductive film includes conductive balls and is made of the same material as the adhesive layer. The method according to claim 5 or 6,
Wherein the height of the barrier ribs is at least 1/3 of the diameter of the conductive balls. The method according to claim 5 or 6,
Wherein the width of the barrier rib is 1/4 or less of the diameter of the conductive ball. The method according to claim 5 or 6,
Wherein the length of the barrier rib is equal to or greater than the length of the lower connection pad or the upper connection pad. The method according to claim 1,
A thin film transistor disposed on the lower substrate;
A lower planarization layer for planarizing the upper portion of the thin film transistor;
Further comprising a bank layer and a spacer disposed on the lower planarization layer,
Wherein the partition is a partition disposed between the plurality of lower connection pads,
Wherein the barrier is formed of the same material as at least one of the lower planarization layer, the bank layer, and the spacer. The method according to claim 1,
A color filter disposed on the upper substrate;
A black matrix disposed on the color filter; And
Further comprising an upper planarization layer disposed on the black matrix and the color filter,
Wherein the partition is a partition disposed between the plurality of upper connection pads,
Wherein the barrier is made of the same material as at least one of the color filter, the black matrix and the upper planarizing layer. The method according to claim 1,
Wherein the barrier ribs are disposed to surround each of the plurality of lower connection pads or each of the plurality of upper connection pads. The method according to claim 1,
And a touch sensing electrode disposed on the upper substrate,
Wherein the touch sensing electrode is electrically connected to the plurality of upper connection pads. The method according to claim 1,
Wherein the barrier ribs are disposed between the plurality of lower connection pads and between the plurality of upper connection pads. The method according to claim 1,
Wherein the spacing between the plurality of lower connection pads or between the plurality of upper connection pads is greater than the width of the barrier ribs. Forming a plurality of lower connection pads on the lower substrate;
Forming a plurality of upper connection pads on the upper substrate;
Forming a barrier between the plurality of upper connection pads or the plurality of lower connection pads;
By applying an organic material including conductive balls on the plurality of upper connection pads or the plurality of lower connection pads or by disposing a connection conductive film including conductive balls, the conductive balls are electrically connected to the plurality of lower connection pads or the plurality of upper connection pads Placing on a connection pad; And
And bonding the upper substrate and the lower substrate to each other. ≪ RTI ID = 0.0 > 11. < / RTI > 17. The method of claim 16,
Wherein the step of forming the barrier ribs comprises forming the barrier ribs to surround the plurality of upper connection pads or the plurality of lower connection pads. 17. The method of claim 16,
The step of forming the barrier ribs is performed by laminating a plurality of layers,
Wherein the step of disposing the conductive balls between the plurality of lower connection pads and the plurality of upper connection pads is performed by disposing the connection conductive film,
Wherein the step of attaching the upper substrate and the lower substrate comprises pressing the upper substrate or the lower substrate such that a layer in contact with the connection conductive film among the plurality of layers surrounds the remaining layer. Screen integrated type organic light emitting display device. 17. The method of claim 16,
Further comprising the step of applying the organic material to the lower substrate before the step of bonding the upper substrate and the lower substrate,
Wherein the step of disposing the conductive balls between the plurality of lower connection pads and the plurality of upper connection pads is performed by applying the organic material including the conductive balls. .

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