KR20160026147A - Conductive laminate - Google Patents

Abstract

The present invention relates to a conductive laminate. According to the present specification, the conductive laminate directly attaches a conductive thin film to glass or ITO to improve convenience in a process and provides superior adhesive force, durability, and retention force to glass, ITO, or a hard coating surface. The conductive laminate comprises: a base layer; a conductive layer formed on one surface of the base layer; and an adhesive layer formed on the other surface of the base layer.

Description

Conductive laminate {CONDUCTIVE LAMINATE}

The present application relates to a conductive laminate and an electronic device including the same.

BACKGROUND ART [0002] A touch panel or a touch screen is variously applied to various information processing terminals such as a mobile communication terminal or an ATM, or a display device such as a TV and a monitor. In addition, as the application to small portable electronic devices increases, there is an increasing tendency for a smaller and lighter touch panel or screen.

In constructing the touch panel or the screen, for example, a conductive laminate as disclosed in Patent Document 1 or 2 is used.

Such a conductive laminate may include a pressure-sensitive adhesive layer. The conductive laminate including the pressure-sensitive adhesive layer can directly adhere a conductive thin film such as a thin film of indium tin oxide (ITO) to glass or ITO, which can facilitate the process. However, the above-mentioned conductive laminate is required to have excellent adhesive force and holding power for various adhesives such as glass, ITO or hard coated surface.

Patent Document 1: Korean Patent Publication No. 2002-0036837 Patent Document 2: Korean Patent Publication No. 2001-0042939

The present application is directed to a conductive laminate capable of realizing excellent adhesion, durability and holding power to a glass, ITO or hard coated surface as well as being able to attach the conductive thin film directly to glass or ITO, to provide.

The present application relates to a conductive laminate. 1 is a cross-sectional view illustrating a structure of a conductive laminate according to the present application. 1, the conductive laminate according to the present application comprises a base layer 30; And a conductive layer 40 formed on one surface of the base layer 30. The adhesive layer 20 is formed on a surface of the base layer 30 on which the conductive layer 40 is not formed .

Exemplary conductive laminates include a substrate layer; A conductive layer formed on one surface of the substrate layer; And a pressure-sensitive adhesive layer formed on the other surface of the base layer and satisfying the general formula (1).

[Formula 1]

-4% ≤ 100 × (C _f - C _i ) / C _i ≤ 50%

In the general formula (1), C _i is a pressure-sensitive adhesive layer before the heat shock test (a test in which the conductive laminate is held at -40 占 폚 for 1 hour and then held at 80 占 폚 for 1 hour, (Peel rate: 0.3 m / min, peel angle: 180 deg.) With respect to the glass or indium tin oxide layer having a glass transition temperature Tg of 1,000 g / in or more. C _f is a room temperature peeling force (peel rate: 0.3 m / min, peeling angle: 180 DEG) for the glass or indium tin oxide layer of the pressure sensitive adhesive layer after the thermal shock test. That is, in the pressure-sensitive adhesive layer according to the present application, the adhesive force is hardly lowered before and after the thermal shock test, and the adhesive force is raised in a certain range. In the above general formula (1), when C _i is measured at room temperature peeling force against glass, C _f may be a room temperature peeling force against glass after the thermal shock test. When C _i in the general formula (1) is measured by the room temperature peeling force against the indium tin oxide layer, C _f may be a room temperature peeling force against the indium tin oxide layer after the thermal shock test. In the present specification, the room temperature is 15 to 35 ?, 20 to 30? Or about 25 ?. In the following description, the adhesive force or the peeling force measured in this specification can be measured by the method shown in the embodiment, and unless otherwise specified, the width of the measurement sample is set to 1 inch by ASTM D3330, And then measured at a peeling speed of 0.3 m / min and a peeling angle of 180 °. 100 x (C _f - C _i ) / C _i in the above general formula (1) can mean the rate of change of the adhesive force of the pressure-sensitive adhesive layer according to the thermal shock test, and the rate of change is, for example, -4% to 50% 50%, 10% to 50%, 15% to 50%, or 20% to 50%. In the conductive laminate in which the conductive layer and the pressure-sensitive adhesive layer are integrated, the adhesive force of the pressure-sensitive adhesive layer needs to be kept excellent, and thus the adhesive force of the pressure-sensitive adhesive layer can be controlled to a specific range as shown in the general formula (1). In the present specification, the term adhesive force can be used in the same meaning as the peeling force.

In one example, the pressure-sensitive adhesive layer may further satisfy the following general formula (2).

[Formula 2]

-10%? 100 x (A _f - A _i ) / A _i ? 50%

In the general formula (2), A _i represents a room temperature peeling force (peel rate: 0.3 m) against the glass or indium tin oxide layer of the pressure-sensitive adhesive layer before the low temperature holding test (test for holding the conductive laminate at -40 캜 for 120 hours) / min, peeling angle: as 180 °), 1,000 g / a in one value, a _f is a temperature peel strength (peeling rate on glass or indium tin oxide layer of the pressure-sensitive adhesive layer after the test maintaining the low temperature: 0.3 m / min , Peeling angle: 180 [deg.]). In the above general formula (2), when A _i is measured at room temperature peeling force against glass, A _f may be a room temperature peeling force against glass after the low temperature holding test. When A _i is measured by the room temperature peeling force against the indium tin oxide layer in the general formula (2), A _f may be a room temperature peeling force against the indium tin oxide layer after the low temperature holding test. In the formula (2), 100 x (A _f - A _i ) / A _i may mean a rate of change of the adhesive force of the pressure sensitive adhesive layer according to the low temperature maintenance test, and the rate of change may be, for example, from -10% to 50% To 45%.

In one example, the pressure-sensitive adhesive layer is a conductive laminate satisfying the following general formula 3:

[Formula 3]

-10% &_lt; / ₌ 100 x (B _f - B _i ) / B _i 80%

In the general formula (3), B _i represents the room temperature peeling force (peel rate: 0.3 m / min) against the glass or indium tin oxide layer of the pressure-sensitive adhesive layer before the high temperature maintenance test (test for holding the conductive laminate at 80 DEG C for 120 hours) (peel rate: 0.3 m / min, peel angle: 180 deg.), and B _f is a value at room temperature peeling force (peel rate: 0.3 m / min) against the glass or indium tin oxide layer of the pressure- Peeling angle: 180 [deg.]). In the above general formula (3), when B _i is measured at room temperature peeling force against glass, B _f can be a room temperature peeling force against glass after the high temperature maintenance test. When B _i is measured by the room temperature peeling force against the indium tin oxide layer in the general formula 3, B _f can be a room temperature peeling force against the indium tin oxide layer after the high temperature maintenance test. In the above formula (3), 100 x (B _f - B _i ) / B _i may mean the rate of change of the adhesive force of the pressure sensitive adhesive layer according to the high temperature maintenance test, and the rate of change may be, for example, To 80%, 0% to 80%, 10% to 80%, 20% to 80%, 25% to 80% or 30% to 80%. The pressure-sensitive adhesive layer according to the present application hardly deteriorates the adhesive force even in a harsh environment outside, and the adhesive force can be increased within a certain range.

In the specific examples of the present application, the material constituting the pressure-sensitive adhesive layer is not particularly limited as long as the above-mentioned peeling force is satisfied, but in order to satisfy the peeling force of the general formula 1, 2 or 3, 30 to 95 parts by weight of acrylate and 25 to 50 parts by weight of the compound of the following formula (1) as polymerized units.

[Chemical Formula 1]

In Formula 1, R may be hydrogen or an alkyl group having 1 to 4 carbon atoms, 1 to 3 carbon atoms, or 1 to 2 carbon atoms. In Formula 1, P may be an aliphatic saturated hydrocarbon cyclic monovalent residue having 3 to 30 carbon atoms. In Formula 1, P is preferably a monovalent residue derived from an aliphatic saturated hydrocarbon ring compound having 3 to 25 carbon atoms, 6 to 20 carbon atoms, or 8 to 15 carbon atoms. Examples of the compound of formula (I) include isobornyl (meth) acrylate, cyclohexyl (meth) acrylate, norbornanyl (meth) acrylate, norbornenyl (Meth) acrylate, dicyclopentadienyl (meth) acrylate, ethynylcyclohexane (meth) acrylate, ethynylcyclohexene (meth) acrylate or ethynyldecahydronaphthalene But is not limited thereto. The compound of the formula (1) may be contained in an amount of 20 to 50 parts by weight, 25 to 50 parts by weight, 30 to 50 parts by weight, or 30 to 45 parts by weight. The adhesive force, durability and adhesive property of the pressure-sensitive adhesive layer can be excellently realized within such a range. In the present invention, the unit " parts by weight " means the weight ratio. By adjusting the weight ratio between the monomers as described above, it is possible to effectively maintain the physical properties such as the adhesive strength, durability and peel strength of the pressure-sensitive adhesive layer.

In one example of the present application, the polymer may comprise 30 to 95 parts by weight, 35 to 90 parts by weight or 40 to 90 parts by weight of alkyl (meth) acrylate as polymerized units, as described above. The alkyl (meth) acrylate may be a straight chain or branched alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms in consideration of physical properties such as cohesion, glass transition temperature and tackiness. Examples of such alkyl (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, Acrylate, lauryl (meth) acrylate, and tetradecyl (meth) acrylate. One or more of these may be contained in a polymerized form in the resin.

In addition, the polymer may further comprise, as polymerized units, a compound comprising at least one reactive functional group. That is, when a compound containing a reactive functional group is contained as polymerized units, the compound may provide a reactive functional group capable of reacting with the polyfunctional crosslinking agent in the polymer. Examples of such a compound containing a reactive functional group include a hydroxy group-containing compound or a carboxyl group-containing compound. In the production of polymers, various copolymerizable monomers capable of providing such reactive functional groups to acrylic polymers are known. In the present invention, such monomers may be used without limitation. Examples of the compound having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl Hydroxypropyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethyleneglycol (meth) acrylate or 2-hydroxypropyleneglycol (Meth) acryloyloxybutyric acid, acrylic acid dimer, itaconic acid, itaconic acid, and the like may be used alone or in combination of two or more selected from the group consisting of (meth) acrylic acid, 2- , Maleic acid, maleic anhydride, and the like can be used, but the present invention is not limited thereto. On the other hand, the compound containing a reactive functional group is, for example, 1 to 30 parts by weight, 3 to 30 parts by weight, 5 to 30 parts by weight, 8 to 30 parts by weight, 10 to 30 parts by weight 13 to 30 parts by weight, By weight or 15 to 30 parts by weight. The polymer according to the present invention can effectively achieve desired physical properties such as adhesion, durability and peeling force of the pressure-sensitive adhesive layer by controlling the content of the compound containing a reactive functional group as a polymerized unit to be high.

In addition, in the embodiments of the present application, the polymer may further comprise 1 to 50 parts by weight of a compound represented by the following general formula (2) or (3) as a polymerized unit.

(2)

(3)

In Formula 2, R < _{1 >} And R ₂ are each independently hydrogen or an alkyl group, an alkoxy group, an alkenyl group, an alkynyl group or an aryl group having 1 to 20 carbon atoms, or R ₁ And R ₂ are connected together to form a cyclic structure having 2 to 20, 2 to 18, 2 to 16, 3 to 15, 3 to 14, 4 to 13, 4 to 12, 5 to 11 or 5 to 10 ring- And the ring constituent atom is carbon, nitrogen or oxygen, and the ring structure may contain one or more double bonds. Examples of the compound of Formula 2 include 4-acryloylmorpholine, N-hydroxyethylacrylamide, acrylamide, N, N-diethylacrylamide, N, N-dimethylmethacrylamide, N-diphenylmethacrylamide, N- (n-dodecyl) methacrylamide, and the like.

Further, in the above formula 3, R ₃ And R ₄ are linked together to form a cyclic structure having 2 to 20, 2 to 18, 2 to 16, 3 to 15, 3 to 14, 4 to 13, 4 to 12, 5 to 11 or 5 to 10 ring- And the ring constituent atom may be carbon, nitrogen or oxygen, the ring structure may contain one or more double bonds, carbon in the ring constituting atom may be carbon forming a carbonyl group, Q is carbon or nitrogen atom . Examples of the compound of Formula 3 include 2-isopropenyl-2-oxazoline, 1-vinyl-2-pyrrolidone, N-vinylcaprolactam, But is not limited thereto.

The compound of Formula 2 or 3 may be used in an amount of 1 to 15 parts by weight, 2 to 14 parts by weight, 3 to 13 parts by weight, 4 to 12 parts by weight, 5 to 11 parts by weight, Parts by weight to 10 parts by weight. The compound of the general formula (2) or (3) can excellently realize the adhesive force, durability and adhesive property of the pressure-sensitive adhesive layer within the above range.

The alkyl group, alkoxy group, alkenyl group, alkynyl group or aryl group may be substituted with at least one hydroxy group.

The term "alkyl group" as used herein means an alkyl group having 1 to 30 carbon atoms, 1 to 25 carbon atoms, 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms ≪ / RTI > The alkyl group may have a linear, branched or cyclic structure and may optionally be substituted with one or more substituents.

The term "alkoxy group" as used herein may mean an alkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms, unless otherwise specified. The alkoxy group may be linear, branched or cyclic. In addition, the alkoxy group may be optionally substituted with one or more substituents.

Unless otherwise specified, the term "alkenyl group" as used herein may mean an alkenyl group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms have. The alkenyl group may be linear, branched or cyclic. In addition, the alkenyl group may be optionally substituted with one or more substituents.

Unless otherwise specified, the term "alkynyl group" as used herein may mean an alkenyl group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms have. The alkenyl group may be linear, branched or cyclic. In addition, the alkynyl group may be optionally substituted with one or more substituents.

As used herein, the term " aryl group " means a monovalent residue derived from a compound or derivative thereof, including a structure containing benzene or a structure in which two or more benzenes are condensed or bonded, unless otherwise specified have. The aryl group may be, for example, an aryl group having 6 to 22 carbon atoms, preferably 6 to 16 carbon atoms, and more preferably 6 to 13 carbon atoms, and examples thereof include a phenyl group, a phenylethyl group, a phenylpropyl group, , A tolyl group, a xylyl group or a naphthyl group.

Meanwhile, in the present application, the polymer comprises 30 to 95 parts by weight of an alkyl (meth) acrylate having a straight chain or branched alkyl group, 25 to 50 parts by weight of the compound of the formula (1) and 1 to 30 parts by weight of a compound containing a reactive functional group, As shown in FIG. In another embodiment, the polymer comprises from 30 to 95 parts by weight of an alkyl (meth) acrylate having a straight or branched chain alkyl group, from 25 to 50 parts by weight of a compound of formula (1) and from 1 to 15 parts by weight of a compound of formula Can be included. In another embodiment, the polymer comprises from 30 to 95 parts by weight of an alkyl (meth) acrylate having a straight chain or branched chain alkyl, from 25 to 50 parts by weight of a compound of formula (I), from 1 to 15 parts by weight of a compound of formula 1 to 30 parts by weight of a compound containing a reactive functional group may be contained as a polymerization unit.

Such polymers in the present application may be prepared by conventional polymerization methods in this field, such as solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization Emulsion polymerization, and the like, preferably by a solution polymerization method. In the above, the polymer may exist in a crosslinked state in the pressure-sensitive adhesive layer.

In the present application, the polymer may be crosslinked by a multifunctional crosslinking agent. Such a crosslinking agent improves the cohesion of the resin cured product (pressure-sensitive adhesive) through the reaction with the polar functional group contained in the acrylic polymer, imparts a crosslinking structure, and controls the adhesive property.

In one example, the polymer in the pressure-sensitive adhesive layer may be crosslinked by at least one polyfunctional crosslinking agent selected from the group consisting of an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent and a metal chelate crosslinking agent, In consideration of the kind, one or more kinds of crosslinking agents can be appropriately selected.

Examples of the isocyanate crosslinking agent include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, tetramethylxylene diisocyanate, and naphthalene diisocyanate, Addition reaction product of an isocyanate compound and a polyol may be used. As the polyol, trimethylolpropane or the like may be used. Examples of the epoxy crosslinking agent include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylol propane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine or glycerin diglycidyl Ether and the like can be used. As the aziridine crosslinking agent, N, N'-toluene-2,4-bis (1-aziridine carboxamide), N, N'-diphenylmethane- , 4'-bis (1-aziridine carboxamide), triethylene melamine, bisisopropanoyl-1- (2-methylaziridine) or tri-1-aziridinylphosphine oxide But is not limited thereto. Examples of the metal chelate crosslinking agent include compounds in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium and / or vanadium is coordinated to acetylacetone or ethyl acetate or the like. But is not limited to. The multifunctional crosslinking agent may be contained in an amount of 0.01 to 10 parts by weight, 0.1 to 9 parts by weight, or 0.2 to 8 parts by weight based on 100 parts by weight of the polymer.

In one example, the polymer has a weight average molecular weight of 500,000 or more, 550,000 or more, 600,000 or more, 650,000 or more, 700,000 or more, 80,000 or more, 900,000 or more, 1,000,000 or more, Or more. The upper limit of the weight average molecular weight is not particularly limited, but may be 2,000,000 or less. In this range, the durability and the adhesive property of the pressure-sensitive adhesive layer can be effectively controlled.

In the pressure-sensitive adhesive layer of the present application, in addition to the above-mentioned components, a silane coupling agent; Tackifiers; Epoxy resin; Ultraviolet stabilizer; Antioxidants; Coloring agent; Reinforcing agents; Filler; Defoamer; A surfactant, a plasticizer, and the like may be further included.

The type of the base layer included in the conductive laminate is not particularly limited, and for example, a glass base material or a plastic base material can be used. As the plastic substrate, a polyester film, a polyamide film, a polyvinyl chloride film, a polystyrene film, a polyolefin film, or the like can be used, and usually a polyester film such as polyethylene terephthalate (PET) A carbonate film, and the like can be used, but the present invention is not limited thereto.

In the present application, the thickness of the base layer is not particularly limited and may be suitably set as long as it can function as a conductive laminate. For example, the thickness of the substrate layer may be in the range of about 1 탆 to 500 탆, about 3 탆 to 300 탆, about 5 탆 to 250 탆, or about 10 탆 to 200 탆.

The base layer is not particularly limited, but may be subjected to appropriate bonding treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching treatment.

A conductive layer may be formed on one surface of the base layer of the conductive laminate of the present application.

The method of forming the conductive layer is not particularly limited, and may be formed by a conventional thin film forming method combining a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, And can usually be formed by a vacuum evaporation method or a sputtering method.

Examples of the material constituting the conductive layer include metal such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin or two or more alloys of the above metals, indium oxide, tin oxide, Metal oxides such as titanium oxide, cadmium oxide, or a mixture of two or more of them may be used, and the conductive layer may be a crystalline layer or an amorphous layer. In the present application, indium tin oxide (ITO) may be used among the materials constituting the conductive layer, but the present invention is not limited thereto.

The thickness of the conductive layer may be adjusted to about 10 nm to 300 nm, about 10 nm to 200 nm, or about 10 nm to 100 nm in consideration of the possibility of forming a continuous coating, conductivity, transparency, and the like.

The conductive layer of the present application may be formed on one surface of the base layer via an anchor layer or a dielectric layer, if necessary. The anchor layer or the dielectric layer improves the adhesion between the conductive layer and the base layer, and improves scratch resistance or flex resistance. The anchor layer or the dielectric layer may be formed of an inorganic material such as SiO ₂ , MgF ₂ or Al ₂ O ₃ ; A sputtering method, an ion plating method, or a coating method using an organic material such as an acrylic resin, a urethane resin, a melamine resin, an alkyd resin or a siloxane-based polymer, or a mixture of two or more of them. The anchor layer or the dielectric layer is usually formed to a thickness of about 100 nm or less, specifically 15 nm to 100 nm or 20 nm to 60 nm.

The present application also relates to a method for manufacturing the above-described conductive laminated body. In one example, the production method relates to a method for producing a conductive laminate, which comprises forming a conductive layer on one side of a base layer and forming a pressure-sensitive adhesive layer on the other side of the base layer.

The present application is also directed to electronic devices. An exemplary electronic device may be a touch panel. The touch panel may include the conductive laminate as an electrode plate for a touch panel, for example.

The touch panel may have a known structure including an electrostatic capacity type or a resistance film type as long as the touch panel includes the conductive laminated body. The conductive laminate can be used for forming various devices such as a touch panel or a liquid crystal display.

The conductive laminate according to the present application can easily attach the conductive thin film to the glass or ITO, thereby not only facilitating the process but also realizing excellent adhesion, durability and holding power to the glass, ITO or hard coated surface have.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a conductive laminate according to one example of the present application. Fig.

Hereinafter, the present application will be described in more detail by way of examples according to the present application and comparative examples not complying with the present application, but the scope of the present application is not limited by the following embodiments.

The physical properties in the following examples and comparative examples were evaluated in the following manner.

1. Molecular weight measurement

The weight average molecular weight (Mw) was measured using GPC under the following conditions, and the measurement results were converted using standard polystyrene of Agilent system for the calibration curve.

<Measurement Conditions>

Measuring instrument: Agilent GPC (Agilent 1200 series, U.S.)

Column: Two PL Mixed B connections

Column temperature: 40 ° C

Eluent: THF (Tetrahydrofuran)

Flow rate: 1.0 mL / min

Concentration: ~ 1 mg / mL (100 μL injection)

2. Adhesion measurement

<Measurement Conditions>

Measuring equipment: Texture Analyzer. XT. Plus (Stable Micro Systems)

Measuring angle and speed: 180 °, 0.3m / min

Piece width: 2.5 cm (~ 1 inch)

Soda lime glass, indium tin oxide layer (ITO)

The conductive laminate was prepared and cut to a width of 2.5 cm after heat treatment by sintering of the conductive layer and pattern formation process (150 ° C, 1 hour), and the pressure-sensitive adhesive layer of the conductive laminate was laminated on the soda lime glass or indium tin oxide layer The laminate was measured for adhesion according to ASTM D3330. The indium tin oxide layer is laminated with the conductive laminate after the heat treatment for sintering and pattern formation (150 DEG C, 1 hour).

Manufacturing example  1. Preparation of adhesive polymer (A1)

Butyl acrylate (BA), isobornyl acrylate (IBOA) and 2-hydroxyethyl acrylate (2-HEA) were added to a 1 L reactor equipped with a cooling device so that nitrogen gas was refluxed and temperature- : 30: 15 (BA: IBOA: 2-HEA). Subsequently, ethyl acetate (EAc) was added as a solvent, nitrogen gas was purged for 60 minutes to remove oxygen, and then azobisisobutyronitrile (AIBN ) Was added to initiate the reaction. Thereafter, the reaction product which had been reacted for about 5 hours was diluted with ethyl acetate (EAc) to prepare a sticky polymer (A1).

Manufacturing example  2 to Manufacturing example  4. Preparation of sticky polymers (A2 to A4)

(A2 to A4) were prepared in the same manner as in Production Example 1, except that the types and / or ratios of raw materials and additives used in the polymerization of the adhesive polymer were controlled as shown in Table 1 below.

Raw material Weight average molecular weight (Mw) BA EHA IBOA HEA HEAA VP MMA polymer A1 55 30 15 148 A2 50 30 15 5 74 A3 50 30 15 5 68 A4 50 10 40 25 A5 65 20 15 127 Content Unit: g
BA: n-butyl acrylate
IBOA: isobornyl acrylate
HEA: 2-hydroxyethyl acrylate
VP: 1-vinyl-2-pyrrolidone
EHA: 2-ethylhexyl acrylate
MMA: methyl (meth) acrylate
HEAA: N-hydroxyethyl acrylamide

Example  One

Preparation of pressure-sensitive adhesive composition

0.25 parts by weight of xylene diisocyanate (Takenate D110N, Mitsui Chemicals, Inc.) as a crosslinking agent was uniformly mixed with 100 parts by weight of the adhesive polymer (A1) prepared in Preparation Example 1 to prepare a pressure-sensitive adhesive composition.

Conductivity Of the laminate  Produce

On one surface of the PET film, the pressure-sensitive adhesive composition was releasably treated with silicone, and the pressure-sensitive adhesive composition thus prepared was coated thereon to a thickness of about 50 mu m and dried to form a pressure-sensitive adhesive layer. Thereafter, the pressure-sensitive adhesive layer was transferred to the opposite surface of a PET film (thickness: about 25 mu m) having an ITO layer formed on one surface thereof in a usual manner, and the PET film thus treated was peeled off to produce a conductive laminate.

Example  2

A conductive laminate was produced in the same manner as in Example 1, except that A2 was used instead of A1 as the adhesive polymer.

Example  3

A conductive laminate was prepared in the same manner as in Example 1, except that A3 was used instead of A1 as the adhesive polymer.

Comparative Example  One

A conductive laminate was prepared in the same manner as in Example 1, except that A4 was used instead of A1 as the adhesive polymer.

Comparative Example  2

A conductive laminate was prepared in the same manner as in Example 1, except that A5 was used instead of A1 as the adhesive polymer.

Condition Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 ITO cotton adhesion (g / in) Room temperature / 24 hours 1097 1138 1122 520 650 -40 ° C / 120 hours 1048 1204 1021 480 430 80 占 폚 / 120 hours 1566 1877 2011 670 734 Thermal shock / 100 cycle 1542 1678 1567 580 700 Glass surface
Adhesion (g / in) Room temperature / 24 hours 1143 1301 1200 620 722 -40 ° C / 120 hours 1036 1205 1543 530 490 80 占 폚 / 120 hours 1468 1986 2013 720 834 Thermal shock / 100 cycle 1346 1567 1678 590 780

Table 2 shows the adhesive force (peeling force) of the pressure-sensitive adhesive layer of the conductive laminate according to Examples and Comparative Examples.

Adhesive force change rate (%) Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 ITO 100 x (C _f - C _i ) / C _i 40.57 47.45 39.66 11.54 7.69 100 x (A _f - A _i ) / A _i -4.47 5.80 -9.00 -7.69 -33.85 100 x (B _f - B _i ) / B _i 42.75 64.94 79.23 28.85 12.92 Glass 100 x (C _f - C _i ) / C _i 17.76 20.45 39.83 -4.84 8.03 100 x (A _f - A _i ) / A _i -9.36 -7.38 28.58 -14.52 -32.13 100 x (B _f - B _i ) / B _i 28.43 52.65 67.5 16.13 15.51

Table 3 shows the rate of change of the adhesive force (peeling force) according to the general formulas 1 to 3 of the pressure-sensitive adhesive layer of the conductive laminate according to Examples and Comparative Examples. Table 3 shows the rate of change in the adhesive force of the pressure-sensitive adhesive layer to the ITO surface and the rate of change in the adhesive force to the glass surface of the pressure-sensitive adhesive layer, respectively.

20: pressure-sensitive adhesive layer
30: substrate layer
40: conductive layer

Claims (16)

A base layer; A conductive layer formed on one surface of the substrate layer; And a pressure-sensitive adhesive layer formed on the other surface of the base layer and satisfying the general formula (1):
[Formula 1]
-4% ≤ 100 × (C _f - C _i ) / C _i ≤ 50%
In the general formula (1), C _i is a pressure-sensitive adhesive layer before the heat shock test (a test in which the conductive laminate is held at -40 占 폚 for 1 hour and then held at 80 占 폚 for 1 hour, (Peel rate: 0.3 m / min, peeling angle: 180 DEG) with respect to the glass or indium tin oxide layer of the glass or indium tin oxide layer, and C _f is the glass or the glass of the pressure- (Peel rate: 0.3 m / min, peel angle: 180 DEG) with respect to the indium tin oxide layer. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer further satisfies the following general formula (2)
[Formula 2]
-10%? 100 x (A _f - A _i ) / A _i ? 50%
In the general formula (2), A _i represents a room temperature peeling force (peel rate: 0.3 m) against the glass or indium tin oxide layer of the pressure-sensitive adhesive layer before the low temperature holding test (test for holding the conductive laminate at -40 캜 for 120 hours) / min, peeling angle: as 180 °), 1,000 g / a in one value, a _f is a temperature peel strength (peeling rate on glass or indium tin oxide layer of the pressure-sensitive adhesive layer after the test maintaining the low temperature: 0.3 m / min , Peeling angle: 180 [deg.]). The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer further satisfies the following general formula (3)
[Formula 3]
-10% &_lt; / ₌ 100 x (B _f - B _i ) / B _i 80%
In the general formula (3), B _i represents the room temperature peeling force (peel rate: 0.3 m / min) against the glass or indium tin oxide layer of the pressure-sensitive adhesive layer before the high temperature maintenance test (test for holding the conductive laminate at 80 DEG C for 120 hours) (peel rate: 0.3 m / min, peel angle: 180 deg.), and B _f is a value at room temperature peeling force (peel rate: 0.3 m / min) against the glass or indium tin oxide layer of the pressure- Peeling angle: 180 [deg.]). The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive layer comprises a polymer comprising an alkyl (meth) acrylate and a compound of the following formula (1)
[Chemical Formula 1]

In Formula (1), R is hydrogen or an alkyl group having 1 to 4 carbon atoms, and P is an aliphatic saturated hydrocarbon cyclic monovalent residue having 3 to 30 carbon atoms. The conductive laminate according to claim 4, wherein the polymer comprises 30 to 95 parts by weight of alkyl (meth) acrylate and 25 to 50 parts by weight of the compound of formula (1) as polymerized units. 5. The conductive laminate of claim 4, wherein the polymer further comprises, as polymerized units, a compound comprising at least one reactive functional group. The conductive laminate according to claim 6, wherein the compound containing a reactive functional group comprises a hydroxy group-containing compound or a carboxyl group-containing compound. The conductive laminate according to claim 6, wherein the polymer comprises 30 to 95 parts by weight of alkyl (meth) acrylate, 25 to 50 parts by weight of the compound of the formula (I) and 1 to 30 parts by weight of the compound containing the reactive functional group. 5. The conductive laminate according to claim 4, wherein the polymer further comprises a compound represented by the following formula (2) or (3)
(2)

(3)

In the general formulas (2) and (3), R is hydrogen or an alkyl group having 1 to 4 carbon atoms,
R ₁ And R ₂ are each independently hydrogen or an alkyl group, an alkoxy group, an alkenyl group, an alkynyl group or an aryl group having 1 to 20 carbon atoms, or R ₁ And R &lt; ₂ &gt; are taken together to form a ring structure having 2 to 20 ring atoms and the ring constituent atoms are carbon, nitrogen or oxygen, the ring structure may contain one or more double bonds,
R ₃ And R &lt; ₄ &gt; are taken together to form a ring structure having 2 to 20 ring atoms and the ring constituting atoms are carbon, nitrogen or oxygen, the ring structure may contain one or more double bonds, Carbon may be carbon forming a carbonyl group, Q is carbon or nitrogen,
The alkyl group, alkoxy group, alkenyl group, alkynyl group or aryl group may be substituted with at least one hydroxy group. The polymer according to claim 9, wherein the polymer comprises 30 to 95 parts by weight of alkyl (meth) acrylate, 25 to 50 parts by weight of the compound of the formula (1) and 1 to 15 parts by weight of the compound of the formula . The conductive laminate according to claim 4, wherein the polymer is present in a crosslinked state in the pressure-sensitive adhesive layer. 5. The conductive laminate according to claim 4, wherein the polymer in the pressure-sensitive adhesive layer is crosslinked by at least one polyfunctional crosslinking agent selected from the group consisting of an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent and a metal chelate crosslinking agent. The conductive laminate according to claim 12, wherein the polyfunctional crosslinking agent is contained in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the polymer. 5. The conductive laminate according to claim 4, wherein the polymer has a weight average molecular weight of 500,000 or more. The method for producing a conductive laminate according to Claim 1, which comprises forming a conductive layer on one side of a base layer and forming a pressure-sensitive adhesive layer on the other side of the base layer. An electronic device comprising the conductive laminate of claim 1.

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