KR20160026019A - A manufacturing method of Al-Sn alloy - Google Patents

Abstract

The present invention relates to a manufacturing method of an Al-Sn alloy comprising: a step of preparing molten metal of an Al-Sn alloy containing Al-Sn alloy elements; and a step of injecting an electron pulse to the prepared molten metal of the Al-Sn alloy using an electron pulse generator, wherein the treatment intensity of the electron pulse is greater than or equal to 1.0 kJ. The microstructure of the Al-Sn alloy to which a pulse is injected has finer Sn particles than an alloy where a pulse is not injected and is formed in a comparatively uniform structure having low segregation.

Description

Technical Field [0001] The present invention relates to a manufacturing method of an Al-Sn alloy,

The present invention relates to a method for producing an aluminum-tin alloy, and more particularly, to a method for producing an aluminum-tin alloy capable of finely and uniformly dispersing Sn in Al.

Al-Sn alloys are excellent in lubricating properties and corrosion resistance, and are particularly suitable for metal bearing alloys because of their excellent thermal conductivity.

Alloy material requirements for metal bearings require good fatigue strength, lubricity, abrasion resistance, corrosion resistance, thermal conductivity, appropriate thermal expansion and low material cost at operating temperatures and loads.

Until now, alloys used for bearing alloys have been mainly used as lead and Sn alloys, Cu alloys, Al alloys and sintered bronze alloys. However, in recent years, alloys used for shipbuilding have been used to improve lubricity, thermal conductivity and corrosion resistance Aluminum alloy is attracting attention.

Meanwhile, the price of the same bearing alloy varies greatly depending on the manufacturing method. The bearing manufactured by Bimetal is the cheapest and is five times cheaper than the bearing manufactured by the sputtering (thin film) process.

Bimetal bearings are suitable for crank bearing of internal combustion engines and are mainly required to crush white metal, sintered bronze and cast bronze on iron plate and recently aluminum alloy with excellent lubrication characteristics, corrosion resistance and heat dissipation on iron plate have.

That is, the material to be cladded on the iron plate uses white metal such as SnSb8Cu3 and PbSn6Sn6, sintered bronze material such as CuPb30, CuPb22Sn4, CuPb10Sn10, CuPb26Sn2, and bronze casted with CuPb23Sn1, CuPb8Sn4Zn4, CuPb10Sn10 alloy. Recently, AlSn20Cu and AlSn6CuNi Alloys are in the spotlight.

Al20Sn1Cu and Al40Sn1Cu alloys have low Hv hardnesses of 35 and 30, respectively. Al12Sn4Si1Cu bearing alloys with 4% Si and 1% Cu added to the Al-12Sn alloy to increase the hardness to 45 are being developed.

The Al4Si0.5Cu0.5Mg alloy, which contains 14% Si, 0.5% Cu and 0.5% Mg, has been developed as an alloy with a hardness of 70 or higher, excluding Sn elements with low hardness.

In order to improve the fatigue strength of the aluminum alloy material for bearing, Si is added up to 2.5%, and Pb, which is a harmful substance, is added up to 1.7% in order to improve lubrication characteristics.

Aluminum alloys for bearings add Sn elements for lubrication properties and corrosion resistance, add Si, Cu, and Mg elements for strength and wear resistance, and add Ni elements for heat resistance.

Recently, AlSn20Cu and AlSn6CuNi alloys are used as aluminum alloys. These alloys are aluminum materials for engine bearings and have excellent compatibility, conformability, and good filling properties, that is, lubricating properties and fatigue strength.

In addition, aluminum alloy for bearing is cheaper than Cu-based, has no Pb, has good wear resistance, has excellent corrosion resistance, and does not require expensive overlay technology. Recently, Al-Sn alloy is required.

1 is a view showing a state diagram of an Al-Sn alloy.

Referring to FIG. 1, when tin is solved in aluminum, solidification is not achieved, and aluminum and tin differ in their specific gravity and melting point by about three times.

Therefore, in Al-Sn alloys, it is the most important development technology to distribute Sn elements in a network shape along the aluminum grain boundaries without segregation.

For example, when the amount of Sn is increased from 12% to 20%, the amount of Sn particles becomes large and unevenly distributed, thereby causing a problem in wear resistance.

On the other hand, Al-Sn alloy has a high coexistence range of 350 ° C, while the high-temperature coexistence range of the 356 alloy, which is the most used aluminum alloy for casting, is 50 ° C., It is essential.

Therefore, in order to control the shape and distribution of Sn particles, existing advanced companies have tried to distribute Sn particles to some extent uniformly by repeating continuous casting, rolling and heat treatment through strip casting. However, Poor bond strength, and the like. Further, the production cost is increased due to repetitive rolling and heat treatment processes.

The present invention has been made to solve the above-mentioned technical problems, and it is an object of the present invention to provide a method of manufacturing an aluminum-tin alloy in which Sn segregation can be finely uniformly dispersed in Al do.

The problems to be solved by the present invention are not limited to the above-mentioned technical problems, and other technical problems which are not mentioned can be clearly understood by those skilled in the art from the following description.

In order to solve the above-mentioned problems, the present invention provides a steel sheet comprising, by weight, 25 to 40% of Sn, 0.5 to 1.5% of Cu, 0.5 to 1.5% of Si and 0.2% Aluminum-tin alloy.

The present invention also relates to a method for producing aluminum-tin alloy melt, comprising the steps of: preparing an aluminum-tin alloy melt containing an aluminum-tin alloy component; And an electron pulse scanning step of scanning the produced aluminum-tin alloy melt with an electron pulse by an electron pulse generator, wherein the processing intensity of the electron pulse is 1.0 kJ or more. ≪ / RTI >

Further, the present invention provides a process for producing an aluminum-tin alloy, wherein the processing intensity of the electron pulse is 1.0 to 1.25 kJ.

In the present invention, the aluminum-tin alloy preferably contains 25 to 40% of Sn, 0.5 to 1.5% of Cu, 0.5 to 1.5% of Si and 0.2% or less of Mn, Tin alloy. ≪ / RTI >

According to another aspect of the present invention, there is provided a method of manufacturing an aluminum-tin alloy including an external pulse generating electrode and a wave guide for transmitting an electron pulse generated in the external pulse generating electrode to the inside of the molten metal.

Also, the present invention provides a method of manufacturing an aluminum-tin alloy, wherein the frequency of the electron pulse is 1.5 to 3 Hz.

Further, the present invention provides a method for producing an aluminum-tin alloy, wherein the processing time of the electron pulse is 3 to 5 minutes.

According to the present invention as described above, it is possible to finely and uniformly disperse Sn into Al by controlling segregation of Sn which is impossible in the conventional manufacturing process.

Further, in the present invention, the microstructure pulsed with the Al-Sn alloy can be formed into a relatively uniform structure in which the Sn particles are finer and less segregated than the non-pulsed alloy.

1 is a view showing a state diagram of an Al-Sn alloy.
FIG. 2 is a schematic view of an electromagnetic field using apparatus having a general structure, and FIG. 3 is a schematic diagram of an ultrasonic wave generating apparatus having a general structure.
4 is a schematic diagram of an electron pulse generator according to the present invention.
Figs. 5A to 5C are photographs showing the microstructure of the aluminum-tin alloy before electron pulse processing, and Figs. 5D to 5F are photographs showing the microstructure of the aluminum-tin alloy after electron pulse processing.
FIG. 6A is an SEM photograph according to the condition of FIG. 5A, FIG. 6B is an SEM photograph according to the condition of FIG. 5D, and FIG. 6C is an enlarged view according to the condition of FIG.
FIG. 7A is a mapping image of a Sn element according to the condition of FIG. 5A, FIG. 7B is a mapping image of a Si element according to the condition of FIG. 5A, FIG. 7D is a mapping photograph of the Si element according to the condition of FIG. 5D. FIG.
Fig. 8 is a photograph showing the particle size of Sn according to the electron pulse intensity treatment of an aluminum-tin alloy. Fig. 8a shows the case where the electron pulse treatment is not performed, Fig. 8b shows the case with the intensity of 0.625 kJ, Fig. 8D is a photograph showing a case of treating with an intensity of 1.0 kJ, Fig. 8 (e) showing a case of treating with an intensity of 1.25 kJ, and Fig. 8 (f) showing a case of treating with an intensity of 1.7 kJ.
9 is a graph showing particle size of other Sn in the electron pulse intensity treatment of an aluminum-tin alloy.
FIGS. 10A and 10B are photographs showing the microstructure of the aluminum-tin alloy before electron pulse processing, and FIGS. 10C and 10D are photographs showing the microstructure of the aluminum-tin alloy after electron pulse processing.
FIG. 11A is a mapping image of Sn elements according to the conditions of FIG. 10A, FIG. 11B is a mapping image of Si elements according to the conditions of FIG. 10A, FIG. 11C is a mapping image of Sn elements 11D is a mapping photograph of the Si element according to the condition of FIG. 10C. FIG.
Fig. 12 is a photograph showing the particle size of Sn according to the electron pulse intensity treatment of an aluminum-tin alloy. Fig. 12a shows a case where electron pulse processing is not performed, Fig. 12b shows a case of processing with an intensity of 0.625 kJ, Fig. 12D is a photograph showing a case of treating with an intensity of 1.0 kJ, Fig. 12 (e) showing a case of treating with an intensity of 1.25 kJ, and Fig. 12 (f) showing a case of treating with an intensity of 1.7 kJ.
13 is a graph showing particle sizes of other Sn in the electron pulse intensity treatment of an aluminum-tin alloy.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. &Quot; and / or "include each and every combination of one or more of the mentioned items. ≪ RTI ID = 0.0 >

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, a method of manufacturing an aluminum-tin alloy of the present invention will be described with reference to the accompanying drawings.

In the present invention, Al-Sn, Al-Cu, Al-Si and Al-Mn parent alloys are added to and dissolved in pure aluminum in an electric furnace to produce aluminum-tin alloy melts. The aluminum-tin alloy melt contains 25 to 40% of Sn, 0.5 to 1.5% of Cu, 0.5 to 1.5% of Si and 0.2% or less of Mn, and the remaining amount of the aluminum- .

Further, the produced aluminum-tin alloy melt is directly subjected to electron pulse treatment.

In the present invention, the processing intensity of the electron pulse is 1.0 kJ or more, and more preferably 1.0 to 1.25 kJ.

This will be described in more detail as follows.

FIG. 2 is a schematic view of an electromagnetic field using apparatus having a general structure, and FIG. 3 is a schematic diagram of an ultrasonic wave generating apparatus having a general structure.

Referring to FIG. 2, FIG. 2 is a schematic view of a conventional gas control system, an exhaust gas purifier, and an improved processing agent, , EMS (electro magnetic stirring device) studied in Ukraine and the Netherlands.

However, in the case of EMS, since the high frequency induction coil is formed around the molten metal to form a magnetic field, the size of the molten metal must be large, and the apparatus is expensive.

Next, referring to FIG. 3, in order to treat highly complex processes using expensive additives such as existing gas control, microfilizing agent, and modifying agent, it is necessary to carry out the process in Germany, Japan, Russia, Figure 2 is a schematic diagram of an apparatus for ultrasonic being studied;

However, even in the case of such an ultrasonic wave generator, only the molten metal material in the local region which is in contact with the ultrasonic wave is processed and practically not applicable to the production site.

Accordingly, in order to solve the problems of the above-described electromagnetic and ultrasonic wave processing techniques, the present invention provides an electronic pulse generating apparatus as shown in FIG. 4, which is capable of fine-tuning the structure and controlling segregation control, intermetallic compounds and oxides It is a very suitable technology for large-scale melting furnace in the field.

4 is a schematic diagram of an electron pulse generator according to the present invention.

4, an electron pulse generating device 1 according to the present invention is located outside a molten aluminum-tin alloy component, and includes an electron pulse generator 1, Is injected into a molten aluminum-tin alloy, casting defects of the Al-Sn alloy can be made without the addition of a separate treating agent.

That is, as the number of dissolving operations in the production of aluminum-tin alloy increases, the content of impurities such as Fe increases. As the amount of scrap containing Fe increases, the number of coarse Fe inclusions increases, .

Due to such casting defects, it is not possible to use a small amount of scrap cheaply in the field, and a large amount of expensive aluminum virgin is added, resulting in a problem of increased manufacturing cost.

However, in the present invention, casting defects of the Al-Sn alloy can be solved by injecting an electron pulse into the molten aluminum-tin alloy.

The electrode 2 of the electron pulse generator 1 according to the present invention is located outside the molten metal and the waveguide 3 is spaced apart from the electrode so as to more effectively scan the generated electron pulse to the molten metal And the waveguide 3 may include a structure that is inserted into the molten metal so that an electron pulse can be directly injected into the molten metal, wherein the material of the waveguide does not react with the molten aluminum-tin alloy It is preferred that the material is a safe titanium and a low alloy steel.

As can be seen from Table 1, when comparing the conventional ultrasonic generator with the electron pulse generator according to the present invention, it is possible to control the casting defects of the Al-Sn alloy by using the electronic pulse generator according to the present invention. , It is possible to process at a frequency of 1.5 to 3 Hz which is very small in frequency as compared with the conventional ultrasonic generator, and the energy consumption is reduced to 1/30 of that of the ultrasonic generator in terms of energy consumption, so that the energy efficiency is excellent.

Further, in the area to be processed, the ultrasonic wave generating device is limited to the contact part where the ultrasonic waves come into contact with the ultrasonic wave generating device. Therefore, the ultrasonic wave generating device has a problem that it can be applied only to a small test of about several Kg. However, Is a feature of this technology that it can be used in a large-scale furnace in the field.

Also, in terms of the processing time, the electron pulse generator according to the present invention is completed in 3 to 5 minutes, but in the case of the ultrasonic generator, it takes 30 minutes or more.

Item Electronic pulse generator Ultrasonic generator Frequency 1.5 to 3.0HZ 18 ~ 20 KHZ Energy consumption 2kw · hr / ton 60kw · hr / ton Treatment affected area 1m in diameter Contact area only Processing capacity Large size available Kg Small test available only Processing time 3 to 5 minutes More than 30 minutes

In other words, the development of the present technology for melting the aluminum-tin alloy melt has been studied by using ultrasonic technology and electromagnetic technology. However, since the ultrasonic melt processing method is effective only at the portion contacting with the surface, There is a limit, and since the melting process using electromagnetic is required to install the electromagnetic device on the outside of the melting furnace, the production cost is high, so it is limited in application to the field size.

However, the technique of directly applying pulses to the molten aluminum-tin alloy according to the present invention is effective as a powerful electron pulse, and at the same time, the apparatus is inexpensive and is expected to be applied to a large melting furnace scale in an actual field.

On the other hand, in the case of aluminum, the shape of the process Si is very important. If the size of the process Si is large and unevenly exists, partial abrasion occurs unevenly.

As the strengthening elements, there are elements such as Cu, Ni, Cr, Mn and Zn. Most of the elements are solid solution strengthening elements. However, Cu and Si are precipitated in the secondary phase of Al ₂ Cu and Mg ₂ Si due to heat treatment, So that the abrasion resistance can be improved.

Particularly, it was confirmed that the microstructure pulsed with Al-Sn alloy had a relatively uniform structure in which the Sn particles were finer and the segregation was smaller than that of the non-pulsed alloy.

In general, the molten metal by GBF (Gas Bubbling Filteration) which rotates while injecting Ar gas for degassing of the aluminum alloy melt was stirred for 15 minutes and the microstructure of the test piece injected into the slab mold was observed. As a result, the aluminum- , The agitation by GBF does not cause a large impact, so that it is observed that the grain refinement and segregation control of Sn are hardly controlled.

In the present invention, in order to improve the abrasion resistance, 0.5 to 1.5% of Cu is added to the aluminum alloy for bearing, thereby producing an Al ₂ Cu phase to increase strength and hardness. In addition, 0.5 to 1.5% Si was finely and uniformly distributed to improve abrasion resistance, and Mn was added in an amount of 0.2% or less to improve ductility.

Hereinafter, preferred embodiments according to the present invention will be described. However, the present invention is not limited to the following examples.

Figs. 5A to 5C are photographs showing the microstructure of the aluminum-tin alloy before electron pulse processing, and Figs. 5D to 5F are photographs showing the microstructure of the aluminum-tin alloy after electron pulse processing.

At this time, the aluminum-tin alloy contains Sn 25%, Cu 1%, Si 1%, Mn 0.2%, the processing intensity of the electron pulse is 1.25 kJ, the frequency is 2 Hz, do.

Further, an aluminum-tin alloy plate was manufactured by casting an aluminum-tin alloy before and after the electron pulse treatment into a square mold. The thickness of the plate material of Figs. 5A and 5D was 6 mm, and the thickness of the plate material of Figs. 5B and 5E Is 11 mm, and the thickness of the plate members of Figs. 5C and 5F corresponds to 20 mm.

5A to 5F, the microstructures of the Al-25% Sn alloy according to the thicknesses 6, 11, and 20 mm of the test piece (plate) produced by the alloy and the alloy pulsed before the pulse treatment and at 1.25 KJ were analyzed As a result, it was observed that the fine particles before pulsing were coarse in size of Sn particles, while the particles of pulsed Sn particles were finer and had less segregation.

In the case of Al-25% Sn alloy test specimens molded into a mold having a thickness of 6 mm, the microstructure of the non-pulsed microstructures was as large as about 70 mu m, while the segregation was large and unevenly distributed. However, the pulsed test specimens showed a fine uniformity of Sn particles with a grain size of about 40 袖 m, a relatively small number of segregations, and a good texture without bubble defects.

Further, in the case of the Al-25% Sn alloy test piece cast in a mold portion having a thickness of 11 mm, the microstructure of the non-pulsed microstructure was distributed uniformly with a large amount of Sn particles of about 80 mu m, and bubble defects were also observed considerably. However, the pulsed test specimen showed a fine grain with about 48μm of Sn particles, a relatively uniform mesh shape with few segregations, and good texture without bubble defects.

In the case of Al-25% Sn alloy test specimens molded into a mold having a thickness of 20 mm, the microstructures of the non-pulsed microstructures were coarse to about 90 mu m with large distribution of segregation, and bubble defects were considerably observed. However, the pulsed test specimens showed a fine grain size of about 50 μm, a relatively uniform mesh shape with little segregation, and good texture without bubble defects.

In other words, when the pulse treatment is compared with the post-pulse treatment, the Sn particles in the case of pulsed treatment are fine, have a relatively uniform mesh shape with less segregation, and have a good texture without bubble defects.

FIG. 6A is an SEM photograph according to the condition of FIG. 5A, FIG. 6B is an SEM photograph according to the condition of FIG. 5D, and FIG. 6C is an enlarged view according to the condition of FIG.

Referring to FIGS. 6A and 6B, it is observed that the texture before the pulse treatment shows coarse and non-uniform texture, while the pulsed SEM texture shows fine and uniform distribution of Sn.

Further, referring to FIG. 6C, it was confirmed that the large network white was Sn structure and the small gray was Al ₂ Cu phase. That is, it can be confirmed that the present invention can increase the strength and hardness by forming an Al ₂ Cu phase.

FIG. 7A is a mapping image of a Sn element according to the condition of FIG. 5A, FIG. 7B is a mapping image of a Si element according to the condition of FIG. 5A, FIG. 7D is a mapping photograph of the Si element according to the condition of FIG. 5D. FIG.

Referring to Figs. 7A to 7D, when the pulses before and after the pulse treatment are compared, it can be seen that the Sn and Si particles in the case of pulsed treatment are fine and good texture is observed.

Fig. 8 is a photograph showing the particle size of Sn according to the electron pulse intensity treatment of an aluminum-tin alloy. Fig. 8a shows the case where the electron pulse treatment is not performed, Fig. 8b shows the case with the intensity of 0.625 kJ, Fig. 8D is a photograph showing a case of treating with an intensity of 1.0 kJ, Fig. 8 (e) showing a case of treating with an intensity of 1.25 kJ, and Fig. 8 (f) showing a case of treating with an intensity of 1.7 kJ.

9 is a graph showing the particle size of other Sn in the electron pulse intensity treatment of the aluminum-tin alloy, and shows the particle size of Sn in FIG.

At this time, the aluminum-tin alloy contains 25% of Sn, 1% of Cu, 1% of Si and 0.2% of Mn, the frequency is 2 Hz, and the treating time is 4 minutes.

Further, the aluminum-tin alloy before and after the electron pulse treatment was cast into a square mold to produce an aluminum-tin alloy plate, and the thickness of the plate corresponds to 6 mm.

8 and 9, in the Al-25% Sn alloy, the change of the Sn particle size according to the electron pulse processing intensity was examined. As a result, when the electron pulse was not processed, the particle size of Sn was about 75 μm 0.6, 0.85, 1.0, 1.25, and 1.7 kJ, it was observed that the microfibrillation was reduced to 65, 60, 45, 40 and 40 um.

That is, up to 0.625 and 0.85 kJ, the fineness effect is gentle, but from 1.0 kJ, the finer effect appears wisely. From 1.25 kJ to 1.7 kJ, the same finer effect is exhibited.

Therefore, in the present invention, the processing intensity of the electron pulse is preferably 1.0 kJ or more.

Further, if a force larger than 1.7 kJ is applied, there is a high risk that the crucible is broken due to the high-temperature aluminum alloy melting. Therefore, the electron pulse treatment strength is more preferably 1.0 to 1.25 kJ.

FIGS. 10A and 10B are photographs showing the microstructure of the aluminum-tin alloy before electron pulse processing, and FIGS. 10C and 10D are photographs showing the microstructure of the aluminum-tin alloy after electron pulse processing.

At this time, the aluminum-tin alloy contains Sn 40%, Cu 1%, Si 1% and Mn 0.2%, the processing intensity of the electron pulse is 1.25 kJ, the frequency is 2 Hz, do.

In addition, aluminum-tin alloy plates were manufactured by casting aluminum-tin alloy before and after the electron pulse treatment into a square mold. The thickness of the plate material of Figs. 10A and 10C was 6 mm, the thickness of the plate materials of Figs. 10B and 10D Corresponds to 11 mm.

10A to 10D, the microstructures of the Al-40% Sn alloy according to the thickness 6 and 11 mm of the test piece (plate) prepared by the alloy and the mold pulsed before the pulse treatment and before the pulse treatment were analyzed, It was observed that the Sn particles of the pulsed specimens were finer and had a less segregated uniform structure.

In the case of the Al-40% Sn alloy test piece cast in a mold area having a thickness of 6 mm, the microstructure of the non-pulsed microstructure was coarse to about 80 탆, and the segregation was large and unevenly distributed. However, the pulsed test specimens showed a fine uniformity of Sn particles with a grain size of about 40 袖 m, a relatively small number of segregations, and a good texture without bubble defects.

In the case of the Al-40% Sn alloy test specimen cast in a mold area of 11 mm in thickness, the untreated microstructure has a large coarse segregation of Sn particles of about 90 탆, which is unevenly distributed, and bubble defects are considerably observed. However, the pulsed test specimen shows a fine uniformity of Sn particles with a size of about 42 袖 m, a relatively uniform mesh shape with few segregations, and good texture without bubble defects.

In other words, when the pulse treatment is compared with the post-pulse treatment, the Sn particles in the case of pulsed treatment are fine, have a relatively uniform mesh shape with less segregation, and have a good texture without bubble defects.

FIG. 11A is a mapping image of Sn elements according to the conditions of FIG. 10A, FIG. 11B is a mapping image of Si elements according to the conditions of FIG. 10A, FIG. 11C is a mapping image of Sn elements 11D is a mapping photograph of the Si element according to the condition of FIG. 10C. FIG.

Referring to Figs. 11A to 11D, when the pulses were compared before and after the pulse treatment, it can be seen that the Sn and Si particles in the case of pulsed treatment are fine and good texture is observed.

Fig. 12 is a photograph showing the particle size of Sn according to the electron pulse intensity treatment of an aluminum-tin alloy. Fig. 12a shows the case where the electron pulse treatment is not performed, Fig. 12b shows the case where the intensity is 0.625 kJ, Fig. 12D is a photograph showing a case of processing with an intensity of 1.0 kJ, Fig. 12 (e) showing a case of processing with an intensity of 1.25 kJ, and Fig. 12 (f) showing a case of processing with an intensity of 1.7 kJ.

FIG. 13 is a graph showing particle size of other Sn in the electron pulse intensity treatment of the aluminum-tin alloy, and shows the particle size of Sn in FIG.

At this time, the aluminum-tin alloy contains Sn 40%, Cu 1%, Si 1%, Mn 0.2%, the frequency is 2 Hz, and the treatment time corresponds to 4 minutes.

Further, the aluminum-tin alloy before and after the electron pulse treatment was cast into a square mold to produce an aluminum-tin alloy plate, and the thickness of the plate corresponds to 6 mm.

12 and 13, Al-40% Sn alloys were tested for the change of Sn particle size according to the electron pulse treatment intensity. As a result, when the electron pulse was not processed, the particle size of Sn was as large as about 90 μm 0.6, 0.5, 0.8, 1.0, 1.25 and 1.7 kJ, it was observed that the microfibrillation was reduced to 68, 60, 45, 42 and 42 um.

That is, up to 0.625 and 0.8 kJ, the micronization effect is gentle, but from 1.0 kJ, the micronization effect appears wisely, and from 1.25 kJ to 1.7 kJ, the same micronization effect is exhibited.

Therefore, in the present invention, the processing intensity of the electron pulse is preferably 1.0 kJ or more.

Further, if a force larger than 1.7 kJ is applied, there is a high risk that the crucible is broken due to the high-temperature aluminum alloy melting. Therefore, the electron pulse treatment strength is more preferably 1.0 to 1.25 kJ.

According to the present invention, it is possible to finely and uniformly disperse Sn into Al by controlling the segregation of Sn which is impossible in the conventional manufacturing process.

That is, the microstructure pulsed with the Al-Sn alloy can be formed into a relatively uniform structure in which the Sn particles are finer and less segregated than the non-pulsed alloy.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (7)

The aluminum-tin alloy contains 25 to 40% of Sn, 0.5 to 1.5% of Cu, 0.5 to 1.5% of Si, and 0.2% or less of Mn, with the balance being aluminum. Producing an aluminum-tin alloy melt comprising an aluminum-tin alloy component; And
And an electron pulse scanning step of scanning the produced aluminum-tin alloy melt with an electron pulse by an electron pulse generator,
Wherein the processing intensity of the electron pulse is 1.0 kJ or more. 3. The method of claim 2,
Wherein the processing intensity of the electron pulse is 1.0 to 1.25 kJ. 3. The method of claim 2,
The aluminum-
A method for producing an aluminum-tin alloy, which comprises 25 to 40% of Sn, 0.5 to 1.5% of Cu, 0.5 to 1.5% of Si, and 0.2% or less of Mn, with the balance being aluminum. 3. The method of claim 2,
Wherein the pulse generator includes an external pulse generating electrode and a waveguide for transmitting an electron pulse generated in the external pulse generating electrode to the inside of the molten metal. 3. The method of claim 2,
Wherein the frequency of the electron pulse is 1.5 to 3 Hz. 3. The method of claim 2,
Wherein the processing time of the electron pulse is from 3 to 5 minutes.

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