KR20160023443A - Organic protective film composition for optical device - Google Patents

Abstract

The present invention relates to an organic protective film composition for an optical device. More particularly, the organic protective film composition for an optical device comprises: an epoxy resin including water-added bisphenol A, liquid alicyclic epoxy, and solid alicyclic epoxy; a hardening agent; and a silane coupling agent. By comprising the water-added bisphenol A, liquid alicyclic epoxy, and solid alicyclic epoxy as an epoxy resin, the composition has excellent flexibility, impact resistance, transparency, adhesive strength, and stability at room temperature, and can be rapidly cured in comparison to a conventional composition, thereby being capable of being used as an organic protective film material for various optical devices.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic protective film composition for an optical element,

More particularly, the present invention relates to an organic passivation film composition for an optical element, and more particularly, to an organic passivation film composition for an optical element, which is excellent in flexibility and durability by using water-added bisphenol A, an alicyclic liquid epoxy resin and an alicyclic solid epoxy resin as the epoxy resin. To an organic protective film composition for an optical element which is excellent in impact resistance, transparency, adhesiveness, room temperature stability and curing speed.

Organic materials included in optical devices such as OLEDs and LCDs are very vulnerable to oxygen or water vapor in the atmosphere, so that when exposed to oxygen or water vapor, a reduction in output or premature performance may occur. Thus, a method for protecting the devices by using metal and glass to prolong the lifetime of the device has been developed, but the metal generally has a disadvantage in that the transparency is insufficient and the glass has insufficient flexibility.

Accordingly, a transparent barrier film, an encapsulating material composition, or an organic protective film composition having flexibility, which is used for encapsulating other optical elements, including a flexible, thin, light and flexible OLED, has been developed.

Among these organic protective film compositions, the organic electronic device protective film material to which the epoxy resin is applied mainly includes aromatic epoxy, or a copolymer of the above epoxy resin and compatibilizing monomer. However, since the aromatic epoxy resin causes discoloration phenomenon such as yellowing due to ultraviolet rays and deterioration, reliability and brightness can be lowered. In addition, most of the epoxy resin compositions have a large elastic modulus and brittleness of the cured product, so that when the cured product thermally expands, a large stress is applied to the electric / electronic device including the cured product. As a result, there is a problem that the electric / electronic element is warped, cracks are generated in the cured product itself, or gaps are generated between the electric / electronic elements and the cured product.

A typical one-pack type epoxy resin composition requires a high temperature curing condition of about 140 to 170 DEG C when novolak or acid anhydride curing agent is used as a curing agent and about 90 to 130 DEG C when using a modified amine / amide or imidazole curing agent. Therefore, in the case of heat-sensitive electronic parts, there is a limitation in application. Therefore, it is preferable to use a latent curing agent which does not cause a curing reaction at room temperature and causes a curing reaction by light irradiation or heating.

As one typical example of the latent curing agent for a one-component epoxy resin composition, an amine-based curing agent can be mentioned. However, the one-part epoxy resin composition using these amine-based curing agents has a high curing temperature and a long curing time, There is a problem that the storage stability is poor when the fast curability is excellent.

On the other hand, organic electronic devices (OLED, AMOLED, OTFT, etc.), which are the next generation light emitting devices, have advantages such as low power consumption, wide viewing angle and fast response speed. In order to commercialize such organic electronic devices, Should be overcome.

In general, as an inorganic material for a thin film protective film for satisfying a water vapor permeability of 10 ^-6 g / m ² · day required for a light emitting device, an oxide such as SiO ₂ , Al ₂ O ₃ , TiO ₂ , MgO, Li ₃ N, Nitrides. Since oxygen and nitrogen are contained in the atmosphere, the protective layer using the oxidation or nitrides has an advantage that a thin film is easily formed in a general environment and defects of the device due to the protective layer material itself can be minimized. However, in practical process, the gap between the atoms is increased due to the relatively low polarity during the process of forming the protective film, and there is a limit to prevent permeation of oxygen and moisture due to surface defects caused by such large gap.

As a method for solving such a problem, an organic protective film which reduces surface defects of a protective film made of an inorganic material and imparts flatness is applied as a flattening layer. Such an organic protective film has an effective wettability with an inorganic protective film, transparency, Adhesion is required. In addition, when the inorganic protective film is formed in multiple layers, the strength of the organic protective film is required to be such that defects or deformation do not occur in the process.

In order to solve the above problems, it is an object of the present invention to provide an organic protective film composition for an optical element which is excellent in light resistance, transparency, flatness and substrate adhesion.

In order to achieve the above object,

In the organic protective film composition for an optical element,

a) a water-added bisphenol A, an alicyclic liquid epoxy, and an alicyclic solid epoxy;

b) a curing agent; And

c) silane coupling agents;

And an organic protective film composition for an optical element.

The present invention also provides an organic protective film and an optical device including the same, which are produced using the organic protective film composition for an optical element.

INDUSTRIAL APPLICABILITY The organic passivation film composition for an optical element of the present invention is superior in flexibility, impact resistance, transparency, and adhesion property as compared with the conventional composition by containing water-added bisphenol A type epoxy resin, alicyclic liquid epoxy resin and alicyclic solid epoxy resin as an epoxy resin . In addition, discoloration phenomenon such as yellowing caused by ultraviolet rays and deterioration is prevented, reliability is given, and flexibility can be imparted by appropriately applying an epoxy resin having a flexible structure.

In addition, by applying an appropriate amount of the ionic latent curing agent, it is possible to cure at a low curing temperature for a short time and also to have excellent storage stability at room temperature.

In addition, it is possible to effectively impart adhesiveness, flatness and transparency to substrates made of various kinds of materials, inorganic protective film materials, and organic materials that reduce the surface bonding of metal (Au, Ag, Cu, ITO,

Accordingly, the organic passivation film composition of the present invention can be widely used as a protective film material for organic electronic devices, a multilayered structure (organic layer) material for PSV (Perovskite Solar Cell), or a protective film material for metal-based electrodes.

1 and 2 are photographs showing surface roughness of an embodiment of the present invention.

Hereinafter, the present invention will be described in detail.

The resin composition for encapsulating an optical element according to the present invention is a resin composition for optical element encapsulation which is a resin composition comprising a water-added bisphenol A, an alicyclic liquid epoxy resin and an alicyclic epoxy resin as an epoxy resin of the above a) in order to obtain excellent flexibility, impact resistance, transparency, adhesiveness, quick cure and long- And is characterized by containing an alicyclic solid epoxy.

In the present invention, the water-added bisphenol A may be a known water-added bisphenol A, preferably a compound having a structure of the following formula 1:

[Chemical Formula 1]

In this formula,

R ₁ and R ₂ each independently represent an alkyl group having 1 to 5 carbon atoms,

R ₃ are each independently a hydrogen atom or a monovalent hydrocarbon group, a glycidyl group or an acrylic group,

X is independently a divalent hydrocarbon group, a glycidyl group or an acrylic group,

n is an integer of 0 to 10, preferably an integer of 1 to 8;

The compositions of the present invention also include alicyclic liquid epoxies. The alicyclic epoxy may be a known alicyclic epoxy, for example, 3,4-Epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate; (Ciba-Geigy Chemical), ERL-4221 (Union Carbide), UVR-6105 (Synasia Epoxy), CELLOXIDE 2021P (Daicel Chemical), Bis -epoxycyclohexylmethyl) adipate; ERL-4299 (Union Carbide Chemical), 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate; Chissonox 201 (Chisso Company), Vinyl cyclohexene dioxide; ERL-4206 (Union Carbide), 2- [3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy] cyclohexane metadioxane; ERL-4234 (Union Carbide), diglycidyl ester of hexahydrophthalic anhydride ARALDITE CY-184 (Ciba-Geigy Chemical), Vinyl cyclohexene monoxide, 5-ethyl-7-oxabicyclo [4.1.0] heptan- ethyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, (3-methyl-7-oxabicyclo [4.1.0] heptan- -4-carboxylate, 1- (7-oxabicyclo [4.1.0] heptan-4-yl) ethyl-3-methyl-7-oxabicyclo [4.1.0] heptane- Heptane-4-dicarboxylate, (5-methyl-7-oxabicyclo [4.1.0] heptan-4-yl) 3-methyl-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxypropyl] -3-methyl- 2-yl-3-methyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, 2- (7-oxabicyclo [4.1.0] heptan- -4-carboxylate, 2 - [(3-methyl-7-oxabicyclo [4.1.0] heptan-4-yl) methoxy] ethyl-3-methyl-7-oxabicyclo [4.1.0] heptane- 5-methyl-7-oxabicyclo [4.1.0] heptan-4-yl) methyl-7-oxabicyclo [ Methyl-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxyethoxy] ethyl-3-methyl-7-oxabicyclo [4.1.0] heptane -4-carboxylate, [2-ethyl-3- (3-methyl-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxyhexyl] -3-methyl- carboxylate, 2- (3-methyl-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxyethyl-3-methyl-7-oxabicyclo [4.1.0] heptane- 4.1.0] heptan-4-yl) propan-2-yl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, 7-oxabicyclo [4.1.0] heptan- 7-oxabicyclo [4.1.0] heptane-3-carboxylate, [2,2-dimethyl-3- (3-methyl-7-oxabicyclo [4.1.0] heptane- 4-carboxylate, [3-methyl-5- (7-oxabicyclo [4.1.0] heptane-4-carbonyloxy) pentyl] -7-oxabicyclo [4.1.0] heptane- carboxylate, [4- (3-methyl-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxycyclohexyl] -3-methyl-7-oxabicyclo [4.1.0] heptane- (4-carboxylato-7-oxabicyclo [4.1.0] heptan-4-yl) propyl] -7-oxabicyclo [4.1.0] heptane- ate and 3-methyl-4- (3-methyl-7-oxabicyclo [4.1.0] heptan-4-yl) -7-oxabicyclo [4.1.0] heptane-4-carboxylate. It is not. The alicyclic liquid epoxy may be used singly or as a mixture of two kinds.

The composition of the present invention also includes alicyclic solid epoxy. The alicyclic solid epoxy may be a known alicyclic solid epoxy, for example, Dicyclopentadiene dioxide, a mixture of endo and exo isomers; Unox207X (Union Carbide), 1,2-Epoxy-4 (2-oxiranyl) -cyclohexane-2,2-bis (hydroxylmethyl) -1-butanol; EHPE 3150 (Daicel Chemical), EHPE 3180 (Daicel Chemical), CT-315 (Chembridge), 17-Beta-acetoxy-3alpha, 5-cyclo-6beta, 19-epoxy-5alpha-androstane; But are not limited to, AC1LCEVL (ABI Chem), Poly (vinylcyclohexene dioxide), Alicyclic epoxy compound, and a diepoxytrispiro-based compound.

These alicyclic solid epoxy resins may be used alone or in combination of two.

In the present invention, since phenol novolak epoxy resin having an aromatic structure can be excluded, discoloration phenomenon such as yellowing caused by ultraviolet rays and deterioration can be prevented and reliability can be provided.

Preferably, the composition of the present invention may include 20 to 50% by weight of water-added bisphenol A, 20 to 50% by weight of alicyclic liquid epoxy, and 5 to 40% by weight of alicyclic solid epoxy, More preferably 30 to 45% by weight of water-added bisphenol A, 30 to 50% by weight of an alicyclic liquid epoxy, and 15 to 35% by weight of an alicyclic solid epoxy resin. In this case, excellent flexibility, impact resistance, transparency, adhesion, fast curing and long-term stability can be obtained.

The b) curing agent of the present invention is not particularly limited as long as it is capable of polymerizing the epoxy resin by heat, and an appropriate amount of ionic curing agent is applied as a latent curing agent of the epoxy resin composition of the present invention, A material excellent in storage stability at room temperature can be developed even with a short curing time. Examples of the cationic polymerization initiator which can be used in the present invention for initiating polymerization by generating a cationic species by carrying out a heat treatment include a cationic polymerization initiator which is selected from the group consisting of diazonium salts, aryl iodide salts, arylsulfonium salts and allene ion complexes The above compounds can be used. The curing agent is preferably used in an amount of 0.1 to 5% by weight, preferably 0.1 to 2% by weight based on the whole composition.

In the present invention, the c) silane coupling agent acts to improve the adhesiveness of the organic protective film composition of the present invention, and a silane coupling agent or a silicone compound may be used alone or in combination. The silane coupling agent is preferably contained in an amount of 0.5 to 5.0% by weight, preferably 0.5 to 3% by weight based on the total composition. Within the above range, the composition of the present invention can simultaneously satisfy the curability, light transparency, adhesiveness, moisture resistance, and the like.

The composition of the present invention may further comprise d) a leveling agent or e) an antifoaming agent.

The d) leveling agent is not particularly limited as long as it is a leveling agent commonly used in the art, for example, a silicon-based, acrylate-based or fluoro-acrylate-based leveling agent can be used. Preferably, a fluoro-acrylate leveling agent is used. Preferably, the leveling agent may be used in an amount of 0.01 to 2.0% by weight based on the total composition.

The v) antifoaming agent is not particularly limited as long as it is a defoaming agent commonly used in the art and is preferably used in an amount of 0.01 to 2.0% by weight based on the total composition.

The organic protective film composition for an optical element according to the present invention preferably has a light transmittance of 99% or more, a viscosity of 10,000 cps or less, and a glass transition temperature of 100 to 140 ° C at the time of curing.

The organic protective film composition for an optical element according to the present invention can be coated on the surface of an inorganic protective film on a substrate using screen printing, dispensing, slit, applicator or the like, and preferably coated by a screen printing method.

For example, in the case of coating with a screen printing method, the surface of the inorganic protective film to be coated is covered with a mask having an opening of a required pattern, the composition of the present invention is put into a squeegee, By moving the stomach, the composition is filled in the opening of the masking member, and then the mask is separated, whereby the organic protective film material can be formed on the surface of the substrate.

The composition thus formed can be heated at 90 to 110 DEG C for 30 to 50 minutes to form an organic passivation layer.

The present invention also relates to an organic protective layer of an optical element manufactured using the above composition, for example, a protective layer such as an OLED or an AMOLED, a multi-layered PSC (organic layer) or metal (Au, Ag, Cu , ITO, etc.) series electrode, and the like.

The present invention also provides an optical element comprising the organic protective film, wherein the optical element may be an OLED element, an AMOLED or an OTFT element.

INDUSTRIAL APPLICABILITY The organic protective film composition for an optical element of the present invention is superior in flexibility, impact resistance, transparency, and adhesive property as compared with the conventional composition by containing a water-added bisphenol alicyclic epoxy resin and an alicyclic solid epoxy resin as an epoxy resin. In addition, since phenol novolac epoxy resin having an aromatic structure can be excluded, it is possible to prevent discoloration phenomenon such as yellowing caused by ultraviolet ray and deterioration and to provide reliability, and to suitably apply an epoxy resin having a flexible structure, ) Can be given.

In addition, by applying an appropriate amount of the ionic latent curing agent, it is possible to cure at a low curing temperature for a short time and also to have excellent storage stability at room temperature.

In addition, it is possible to effectively impart adhesiveness, flatness and transparency to substrates made of various kinds of materials, inorganic protective film materials, and organic materials that reduce the surface bonding of metal (Au, Ag, Cu, ITO,

Accordingly, the organic passivation film composition of the present invention can be widely used as a protective film material for organic electronic devices, a multilayered structure (organic layer) material for PSV (Perovskite Solar Cell), or a protective film material for metal-based electrodes.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the scope of the present invention is not limited to the following examples.

Examples 1 to 8 and Comparative Examples 1 to 7 : Preparation of thermosetting epoxy resin composition

The thermosetting epoxy resin compositions according to Examples 1 to 8 and Comparative Examples 1 to 7 were each prepared by mixing the components and the contents shown in Table 1 below. Waterborne bisphenol A having the structure of formula (1) was used, and alicyclic liquid epoxy was CELLOXIDE 2021P, ERL 4299, and Chissonox 201. Also, 1,2-epoxy-4-cyclohexane of 2,2-bis (hydroxyl methyl) -1-butanol (EHPE 3150, Daicel Chemical Industries) was used as the alicyclic epoxy resin. In Table 1, the unit is parts by weight.

Composition Epoxy Hardener Silane
Coupling agent Water addition
Bisphenol A phenol
Novolac Alicyclic liquid phase Alicyclic solid phase CEL 2021P ERL 4299 Chissonox 201 EHPE 3150 Example 1 43 - 20 - - 35 0.5 1.5 Example 2 33 - 30 - - 35 0.5 1.5 Example 3 38 - 25 - - 35 0.5 1.5 Example 4 38 - 30 - - 30 0.5 1.5 Example 5 38 - 35 - - 25 0.5 1.5 Example 6 38 - 40 - - 20 0.5 1.5 Example 7 38 - - 40 - 20 0.5 1.5 Example 8 38 - - - 40 20 0.5 1.5 Comparative Example 1 38 - 60 - - - 0.5 1.5 Comparative Example 2 38 50 10 - - - 0.5 1.5 Comparative Example 3 38 - - - - 60 0.5 1.5 Comparative Example 4 38 15 45 - - - 0.5 1.5 Comparative Example 5 38 25 35 - - - 0.5 1.5 Comparative Example 6 20 25 53 - - - 0.5 1.5 Comparative Example 7 38 35 25 - - - 0.5 1.5

Test Example 1

The properties and performance of the thermosetting epoxy resin compositions according to Examples 1 to 8 and Comparative Examples 1 to 7 were evaluated as follows. The results are shown in Table 2 below.

Further, the surface of the inorganic protective film to be coated is covered with a mask having an opening of a desired pattern, the composition of the present invention is introduced into the squeegee, and the squeegee is moved to move the composition over the mask while pressing the composition. Lt; / RTI > Thereafter, the mask was separated to form an organic protective film material on the surface of the substrate, and then heated at 100 DEG C for 30 minutes to thermally cure to form an organic passivation layer. The physical properties and performance of the organic passivation layer were evaluated as follows. The results are shown in Table 2 below.

1) Condition of composition: The thermosetting epoxy resin composition was visually observed to confirm whether it was colorless or transparent.

2) Viscosity of the composition: 0.5 g of the thermosetting epoxy resin composition was quantitatively measured, and when the internal resistance value (torque,%) of the composition became 80 or more at 25 캜 using a Brookfield viscometer HBDV-II +, BROOKFIELD The viscosity was measured.

3) Condition of cured product: The cured organic protective film layer was visually observed to confirm whether it was colorless or transparent.

4) Transmittance and yellowing degree of the cured product: The transmittance of the prepared specimen was measured at a wavelength of 380 to 780 nm using ultraviolet-visible spectroscopy (UV-Vis spectroscopy, Cary 4000, VARIAN) The light transmittance was evaluated. The yellow index was measured according to ASTM D1925 using a spectrophotometer (CM-3700A, KONICA MINOLTA) to determine the degree of yellowing of the cured product.

5) Glass transition temperature of cured product: The temperature of the cured organic protective film layer was measured by a differential scanning calorimeter (DSC) using a thermal analyzer (DSC Q20, TA Instruments) in a nitrogen atmosphere at 10 ° C / min The mid-point glass transition temperature was measured while raising the temperature to 200 ° C.

6) Flexibility: The thermosetting epoxy resin composition was coated on the surface of a polyethylene terephthalate film using a bar applicator, and then cured by heating at 100 ° C for 30 minutes. Flexibility of the cured product thus obtained was measured by three contact bending evaluation. When cracks were formed on the coating surface formed during the bending evaluation, it was judged that there was no flexibility and was marked with X. When it was clear without cracking, it was judged as having flexibility and indicated as O.

7) Long-term stability: The cured organic protective layer was allowed to stand in a Constant Temp. & Humid chamber at 85 ° C and 85% relative humidity for 500 hours, and the yellowness was measured over time.

Composition Evaluation results Composition
condition Viscosity
(cps) Cured goods
condition Transmittance
(%) Yellowness
(D1925) Tg
(° C) flexibility long time
stability Example 1 transparent 9,820 transparent 99.98 0.45 125.1 O 0.54 Example 2 transparent 8,800 transparent 99.99 0.45 125.2 O 0.52 Example 3 transparent 9,230 transparent 99.97 0.46 124.9 O 0.56 Example 4 transparent 7,740 transparent 99.98 0.45 124.3 O 0.55 Example 5 transparent 5,650 transparent 99.98 0.44 123.7 O 0.53 Example 6 transparent 3,270 transparent 99.98 0.45 123.8 O 0.55 Example 7 transparent 3,850 transparent 99.99 0.45 124.2 O 0.52 Example 8 transparent 2,960 transparent 99.97 0.46 128.5 O 0.54 Comparative Example 1 transparent 451 - - - - - - Comparative Example 2 yellow 82,012 - - - - - - Comparative Example 3 transparent 22,288 - - - - - - Comparative Example 4 Pale yellow 1,745 transparent 99.35 0.64 87.37 O - Comparative Example 5 Pale yellow 4,955 transparent 99.42 0.63 105.08 O 1.06 Comparative Example 6 Pale yellow 3,606 transparent 99.37 0.58 107.61 X - Comparative Example 7 yellow 7,865 yellow - - - - -

As shown in Table 2, the results of visual observation of the composition and the cured product in each of Examples 1-8 and the epoxy composition and the cured product obtained on the basis of the transmittance are all colorless and transparent. Also, since the yellow index value of the cured product is also measured at a value of about 0.45, it can be confirmed that the cured product is not colored and transparent. In addition, since the viscosity is suppressed low (10,000 mPa · s or less), it is easy to apply in the screen printing process. Since the solid alicyclic epoxy having a cyclic structure in which all of Examples 1-8 were repeated was applied in a certain amount range, other characteristics including long-term reliability including the thermal properties of the cured product itself were satisfied at a level that did not impair flexibility .

On the other hand, the epoxy composition obtained in Comparative Example 1 was too low in viscosity and could not be applied to a screen printing process. In the case of Comparative Example 2-3, the epoxy composition was in the paste state and the screen printing process was impossible. In Comparative Example 4, since the glass transition temperature (Tg) is lower than the general process temperature (? 100 ° C), the organic protective film material may be damaged during the process, which is not suitable. In the case of Comparative Example 6, the content of water-added bisphenol A epoxy, which is a part imparting flexibility, was so small that cracks were formed during the evaluation of flexibility. On the other hand, the composition obtained in Comparative Example 7 was high in content of phenol novolak epoxy having an aromatic structure and yellowish, and the cured product was also yellow, so that it was not suitable for an organic protective film material requiring colorless and transparent characteristics. In the case of Comparative Example 5, it was confirmed that yellowing occurred in the evaluation of long-term stability, although the optical characteristics of the cured product and the glass transition temperature (Tg) and flexibility associated with the progress of the process were excellent. It can be seen that when epoxy containing an appropriate level of aromatic structure is included, the yellowing can be controlled in the short term, but the yellowing problem can not be completely controlled in the long run.

Examples 9 to 13 : Preparation of thermosetting epoxy resin composition

In order to evaluate the coating properties, the thermosetting epoxy resin compositions according to Examples 9-13 were prepared by mixing the leveling agent and defoamer in the components and contents shown in the following table. The composition was formulated as shown in Table 3 below, and the unit is parts by weight.

Composition Epoxy Hardener Silane
Coupling agent Leveling agent Defoamer Water addition
Bisphenol
A Alicyclic
Liquid phase Alicyclic
elegance Silicon system Acrylate series Fluoro-acrylate series CEL 2021P EHPE 3150 Example 9 38 40 20 0.5 1.5 0.5 - - 0.5 Example 10 38 40 20 0.5 1.5 - 0.5 - 0.5 Example 11 38 40 20 0.5 1.5 - - 0.5 0.5 Example 12 38 40 20 0.5 1.5 - - 1.0 0.5 Example 13 38 40 20 0.5 1.5 - - 0.5 1.0

Test Example 2

The physical properties and performance of the thermosetting epoxy resin compositions according to Examples 9 to 13 were evaluated in the same manner as in Test Example 1, and the results are shown in Table 4 below.

The degree of surface deflection of the obtained cured product is shown by the numerical value of 1 to 5 through visual observation, and it is shown in Table 4 below. At this time, the value is shifted to 1 as the degree of curvature increases and the flatness increases to 5 Surface flexion: 5 > 3 > 1).

Composition Evaluation results Composition
condition Viscosity
(cps) Cured goods
condition Transmittance
(%) Yellowness
(D1925) Tg
(° C) Coating property Example 9 Pale white 2,913 transparent 99.37 0.41 121.6 4 Example 10 Pale white 2,895 transparent 99.42 0.39 121.3 3 Example 11 Pale white 2,925 transparent 99.70 0.47 122.5 One Example 12 Pale white 2,850 transparent 99.25 0.47 123.7 2 Example 13 Pale white 2,869 transparent 99.51 0.46 122.1 3

As shown in Table 4, the epoxy compositions obtained in Examples 9 to 13 were pale white, colorless and transparent after curing, had a viscosity which facilitated screen printing process, and a glass transition temperature (Tg) suitable for general process temperature , And it can be seen that the surface flatness is excellent.

In particular, the composition of Example 10 to which an acrylate-based leveling agent was applied had a good coating property. In the case of the composition of Example 11 in which an acrylate-based leveling agent substituted with a fluoro group was used, The flatness was good and the bending characteristic was evaluated as 1.

FIGS. 1 and 2 are photographs showing surface roughness of Example 11 of the present invention.

Claims (11)

In the organic protective film composition for an optical element,
a) a water-added bisphenol A, an alicyclic liquid epoxy, and an alicyclic solid epoxy;
b) a curing agent; And
c) Silane coupling agent
And an organic protective film composition for an optical element. The method according to claim 1,
a) 20 to 50% by weight of water-added bisphenol A, 20 to 50% by weight of an alicyclic liquid epoxy, and 5 to 40% by weight of an alicyclic solid epoxy epoxy resin as an epoxy resin;
b) 0.1 to 5.0% by weight of a hardener; And
c) 0.5 to 5.0% by weight of silane coupling agent,
And an organic protective film composition for an optical element. The method according to claim 1,
As the epoxy resin,
And 30 to 45% by weight of water-added bisphenol A, 30 to 50% by weight of an alicyclic liquid epoxy, and 15 to 35% by weight of an alicyclic solid epoxy resin. The method according to claim 1,
Wherein the water-added bisphenol A has a structure represented by the following formula (1): < EMI ID =
[Chemical Formula 1]

In this formula,
R ₁ and R ₂ each independently represent an alkyl group having 1 to 5 carbon atoms,
R ₃ are each independently a hydrogen atom or a monovalent hydrocarbon group, a glycidyl group or an acrylic group,
X is independently a divalent hydrocarbon group, a glycidyl group or an acrylic group,
n is an integer of 0 to 10; The method according to claim 1,
Wherein the alicyclic epoxy is selected from the group consisting of 3,4-Epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, Bis (3,4-epoxycyclohexylmethyl) adipate, 3,4- Epoxy-6-methylcyclohexylmethyl- 5-ethyl-7-oxabicyclo [4.1.0] heptan-4-yl) methyl] -1,2,3,4-tetrahydroisoquinoline, 5-ethyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, (3-methyl-7-oxabicyclo [4.1.0] heptan- heptane-4-carboxylate, 3- (7-oxabicyclo [4.1.0] heptan-4-yl) ethyl-3-methyl-7-oxabicyclo [4.1.0] heptane- 4-O- (7-oxabicyclo [4.1.0] heptan-4-ylmethyl) -7-oxabicyclo [4.1.0] heptane-3,4-dicarboxylate, (5-methyl-7-oxabicyclo [4.1.0] heptane 4-yl) methyl-5-methyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, 2- (3- methyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, 2- (7-oxabicyclo [4.1.0] heptan-4- yl) propan- Heptane-4-carboxylate, 2 - [(3-methyl-7-oxabicyclo [4.1.0] heptan-4-yl) methoxy] ethyl-3-methyl-7-oxabicyclo [ methyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, 2- [2- (3- 3-methyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate, [2-ethyl-3- (3-methyl-7-oxabicyclo [ 4.1.0] heptane-4-carbonyl) oxyhexyl] -3-methyl-7-oxabicyclo [4.1.0] heptane- carbonyl) oxyethyl-3-methyl-7-oxabicyclo [4.1.0] heptane-4-carboxylate; 2- (7-oxabicyclo [4.1.0] heptan- Heptane-4-carboxylate, 7-oxabicyclo [4.1.0] heptan-4-ylmethyl4,4-dimethyl-7-oxabicyclo [4.1.0] heptane- 3- (3-methyl-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxypropyl] -3-methyl-7-oxabicyclo [4.1.0] heptane- 7-oxabicyclo [4.1.0] heptane-4-carbonyloxy) pentyl] -7-oxabicyclo [4.1.0] heptane- 4- [2- (4-carboxylato-7-oxabicyclo [4.1.0] heptane-4-carbonyl) oxycyclohexyl] -3-methyl-7-oxabicyclo [4.1.0] heptane- ] heptan-4-yl) propyl] -7-oxabicyclo [4.1.0] heptane-4-carboxylate, 3-methyl- 7-oxabicyclo [4.1.0] heptane-4-carboxylate. The organic protective film composition for an optical element according to claim 1, The method according to claim 1,
Wherein the alicyclic solid epoxy is selected from the group consisting of Dicyclopentadiene dioxide, a mixture of endo and exo isomers, 1,2-Epoxy-4 (2-oxiranyl) -cyclohexaneof2,2- bis (hydroxylmethyl) At least one member selected from the group consisting of 5-cyclo-6beta, 19-epoxy-5alpha-androstane, poly (vinylcyclohexene dioxide), alicyclic epoxy compound and a diepoxytrispiro-based compound. The method according to claim 1,
Wherein the curing agent is at least one selected from the group consisting of a diazonium salt, an aryl iodide salt, an arylsulfonium salt, and an allene ion complexing agent. The method according to claim 1,
The organic protective film composition for an optical element according to claim 1, further comprising a leveling agent. The method according to claim 1,
The organic protective film composition for an optical element according to claim 1, further comprising a defoaming agent. An organic passivation layer produced by using the organic passivation film composition for an optical element according to claim 1. An optical element comprising an organic protective film for an optical element according to claim 10.

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