KR20160018729A - Dark film lamination for a touch sensor - Google Patents

Abstract

Different lamination methods can be used to create a touch sensor on which the exposed side of the metallized film faces the user. The one-laminating method includes laminating the metallized film to the OCA layer such that the edges of the metallized film comprising the termination pads remain unattached to the optically clear adhesive (OCA) layer. The flextails can later be bonded to the termination pads by bending up the unattached edge. An anisotropic conductive film (ACF) can be placed on the termination pads before laminating the metallized films. The flextails can be placed on the OCA layer at locations where the termination pads on the metallization film are positioned when laminated to the OCA layer. Strips of the anisotropic conductive film can be placed on the flextail pads. The flextails may be bonded to the termination pads of the metallized film before the metallization film is laminated.

Description

{DARK FILM LAMINATION FOR A TOUCH SENSOR}

Some film-based, metal conductor touch sensors have a darkening coating on the side (non-film side) of the conductors open to the air. Film-based sensors are often built on glass substrates. The metallized touch metallization film layer is oriented with the metallization layer facing away from the user so that the termination pads are still accessible during lamination.

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify essential features or essential features of the claimed invention, nor is it intended to be used to assist in determining the scope of the claimed invention.

The touch sensor is configured to have a light-sensitive coating on the side of the metallization film facing a user (e.g., a glass touch surface). One or more metallized films may be used in the touch sensor (e.g., low and column films, grid films, etc.). Different lamination methods can be used to construct a touch sensor on which the photosensitive side of the film faces the user. The one-lamination method includes laminating the metallized film to the OCA layer (OCA) so that the edges of the metallized film comprising the termination pads remain unattached to the optically clear adhesive (OCA) layer. The unattached edges of the metallized film are such that flex tails (e.g. having an Anisotropic Conductive Film (ACF)) are interposed between the OCA layer and the metallized film and the termination pads of the metallized film Lt; RTI ID = 0.0 > beneath < / RTI > The individual layers can then be more fully bonded to support ensuring a good bond between the flextails, the anisotropic conductive film, and the termination pads of the metallized film (e. G., Pressure / All). Another method of lamination involves placing an anisotropic conductive film on termination pads prior to lamination of the metallized films. Another method of lamination involves placing flextails on the OCA layer at locations where the termination pads on the metallization film are positioned when laminated to the OCA layer. Strips of the anisotropic conductive film can be placed on the flextail pads. The metallized film is aligned and laminated so that the metallization film termination pads are on top of the anisotropic conductive film / flex tail pads. Another method of lamination involves attaching flex tails to the termination pads of the metallized film before the metallization film is laminated. In this way, the metallized film can be tested prior to lamination to the touch surface (e. G., Electrical continuity).

Figure 1 shows an optical transparent adhesive (OCA) layer laminated to a touch surface.
Figure 2 shows the raw film laminated to the OCA layer.
Figure 3 shows an OCA layer laminated to a low film.
Figure 4 shows a column film laminated to an OCA layer.
FIG. 5 illustrates flex tails aligned and bonded in place on a row film and a column film.
Figure 6 shows an optical transparent adhesive (OCA) layer laminated to a touch surface.
Figure 7 shows a low film laminated to an OCA layer after an anisotropic conductive film (ACF) is disposed on the row film termination pads.
Figure 8 shows an OCA layer laminated to a low film.
Figure 9 shows a column film laminated to an OCA layer after an anisotropic conductive film (ACF) is placed on the column film termination pads.
Figure 10 shows flex tails aligned and bonded in place on a row film and column film using an anisotropic conductive film.
Figure 11 shows an optical transparent adhesive (OCA) layer laminated to a touch surface.
Figure 12 shows flex tails aligned with an anisotropic conductive film (ACF) on pads aligned and bonded onto OCA.
Figure 13 shows a low film laminated to the OCA layer such that the termination pads on one end of the low film are bonded to the top of the anisotropic conductive film on the flex tails.
Figure 14 shows an optical transparent adhesive (OCA) layer laminated to a low film.
Figure 15 shows flex tails aligned with an anisotropic conductive film (ACF) on pads aligned and bonded onto OCA.
Figure 16 shows a column film laminated to an OCA layer such that the termination pads on one end of the column film are bonded to the top of the anisotropic conductive film on the flextails.
Figure 17 shows flex tails attached to a loose roll film using an anisotropic conductive film.
Figure 18 shows a low film laminated to an OCA layer where the flextails are already laminated to a touch surface in place.
Figure 19 shows flex tails attached to a loose column film using an anisotropic conductive film.
Figure 20 shows a column film laminated to an OCA layer where the flextails are already laminated to the low film in place.
Figure 21 shows a process for laminating a dark metallized film with termination pads to a touch surface, with the dark side facing the touch side.
22 illustrates a process for placing an anisotropic conductive film (ACF) on termination pads of a metallized film prior to lamination.
Figure 23 shows the process of placing flex tails before lamination of the metallized film used in the touch sensor.
24 illustrates a process for placing flex tails on a loose metallized film.
Figure 25 provides a discussion of the operating environment in which embodiments of the present invention may be practiced.

According to an embodiment, the touch sensor embodiments described herein use a projected capacitive technology (PCT). Other techniques may be used in accordance with embodiments of the present invention. Although the figures generally show two different layers of the metallized film (e.g., a low film and a column film), fewer / more metallized film layers may be used. Generally, each metallized film layer comprises a conductive material arranged in a pattern (e.g., rows, columns, diamond pattern, grid pattern, ...). According to an embodiment, the low film comprises parallel lines of conductive material arranged in rows, and the column film comprises parallel lines of conductive material arranged in columns. Some film-based, metal conductor touch sensors include a darkening coating on one side of the film (e.g., the side of the openings in the air). Embodiments described herein include the use of film-based sensors (e.g., low film, column film) built on a glass substrate, wherein the sheet of glass is the touch surface with which the user interacts. Using previous lamination methods, the film was laminated with a photosensitive surface facing away from the user so that the termination pads on the film could be kept accessible and attached to the flex tails. As such, the non-photosensitive side of the film has faced the user instead of having the photosensitive side of the film facing the user. Having a photosensitive surface facing the user can help mask what the conductive material can be seen when viewed through the glass. The following embodiments illustrate touch sensors and methods for laminating layers of a touch sensor to have a light-sensitive coating on a side (e.g., a glass touch side) of the film facing the user.

Various embodiments will now be described with reference to the drawings in which like numerals represent like elements.

Figure 1 shows an optical transparent adhesive (OCA) layer laminated to a touch surface.

As shown, the side view 110 shows an optical transparent adhesive (OCA) layer laminated to the touch surface. The touch surface can be made of different materials. According to the embodiment, the touch surface is a glass. Although an OCA layer is shown, other products, such as other types of adhesives, may be used. The OCA layer may be liquid OCA and / or OCA tape. The OCA may be of different thicknesses (e.g., 50 microns to 250 microns, or other thicknesses), depending on the application. The touch surface may be of different thicknesses (depending, for example, on the type of application and / or device). For example, the glass touch surface may range from about 0.5 mm to about 3 mm or more, depending on the application.

The top view 120 shows that the OCA layer is sized smaller than the touch surface. As shown, a boundary 125 is shown that leaves a portion of the touch surface that is not covered by the OCA.

Figure 2 shows the raw film laminated to the OCA layer.

As shown, the side view 210 shows the low film 212 including termination pads 225 disposed on the end of the low film 225 laminated to OCA1. According to an embodiment, the thickness of the low film is between about 75 microns and 250 microns, and the low film can be bent. Different types of metallization films may be used. For example, different patterns of conductive materials may be arranged in one or more metallized film layers. According to an embodiment, the low film comprises a conductive material arranged in parallel rows (e.g., two wires of 6.5 mm pitch) across the low film. The side of the low film where the photoresist coating faces the touch surface and the termination pads 225 are on the side of the metallized film to which the flex tails are bonded (see the drawings and discussion below). As can be seen, the side of the low film, including the photoresist coating, faces a glass (e.g., a user) of the touch surface.

The top view 120 shows that the low film covers the OCA1 layer. As shown, the termination pads 225 are disposed near the left end of the low film. Termination pads may be located at different positions (e.g., near the right end of the low film).

Figure 3 shows an OCA layer laminated to a low film.

As shown, the side view 310 shows a second OCA layer (OCA2) laminated to the low film 212. As shown in FIG.

Top view 320 shows that the second OCA2 layer is sized less than the low film surface. As shown, a boundary 325 is shown leaving a portion of the touch surface that is not covered by the OCA2 layer.

Figure 4 shows a column film laminated to an OCA layer.

As shown, the side view 410 illustrates a column film that is disposed on the end of a column film laminated to OCA2. According to an embodiment, the column film comprises a conductive material arranged in parallel columns below the column film. The photoresist coating is on one side of the column film facing the touch surface and on the side of the metallization film, where the termination pads 425 are bonded to the flextails. As can be seen, the side of the column film comprising the photosensitive coating faces a glass (e.g., a user) of the touch surface.

The side view 415 illustrates a column film comprising termination pads 425 disposed on the end of a column film laminated to OCA2.

The top view 420 shows that the column film covers the OCA2 layer. As shown, the termination pads 425 are disposed near the top end of the column film. The termination pads may be located at other locations (e.g., near the bottom end of the low film).

FIG. 5 illustrates flex tails aligned and bonded in place on a row film and a column film.

As shown, the non-adhesive edges of the films (the low film and the column film) are peeled off and the flextails having an anisotropic conductive film (ACF) on their pads are aligned and bonded in place. Generally, the anisotropic conductive film is an adhesive having metal balls embedded therein, and is conductive in the z-axis rather than the x- or y-axis. According to one embodiment, the anisotropic conductive film is 3M (TM) Electrically Conductive Adhesive Transfer Tape 9703, which is part of a family of anisotropic (Z-axis) conductive tapes and thermosetting films.

Figure 6 shows an optical transparent adhesive (OCA) layer laminated to a touch surface.

As shown, the side view 610 shows a layer of optical transparent adhesive (OCA) laminated to a glass touch surface. The touch surface can be made of different materials.

The top view 620 shows that the OCA layer is sized less than the touch surface. As shown, a boundary 625 is shown that leaves a portion of the touch surface that is not covered by the OCA.

Figure 7 shows a low film laminated to OCA after an anisotropic conductive film (ACF) is placed on the row film termination pads.

As shown, the side view 710 shows the row film comprising termination pads 725 disposed on the end of the low film 725 laminated to OCA1. As can be seen, the side of the low film, including the photoresist coating, faces a glass (e.g., a user) of the touch surface.

Top view 720 shows that the low film covers the OCA layer. As shown, the termination pads 725 are disposed near the left end of the low film. Termination pads may be located at different positions (e.g., near the right end of the low film). Before laminating the low film to OCA1, a strip of anisotropic conductive film 726 is positioned downwardly on the low film termination pads. The low film is laminated to OCA1 so that the termination pads 725 on one end of the film are exposed and not laminated.

Figure 8 shows an OCA layer laminated to a low film.

As shown, a side view 810 shows a second OCA layer (OCA2) laminated to the low film 212. As shown in FIG.

Top view 820 illustrates that the second OCA layer is sized less than the low film surface. As shown, a boundary 325 is shown leaving a portion of the touch surface that is not covered by the OCA.

Figure 9 shows a column film laminated to an OCA layer after an anisotropic conductive film (ACF) is placed on the column film termination pads.

As shown, the side view 910 and side view 920 illustrate the overlap of the low film over the OCA1 layer and the column film over the OCA2 layer. Prior to laminating the column film to OCA2, a strip of anisotropic conductive film 926 is positioned downwardly on the column film termination pads. The column film is laminated to OCA2 so that the termination pads on one end of the column film are exposed and not laminated. As can be seen, the side of the film comprising the photosensitive coating faces a glass (e.g., a user) of the touch surface.

Top view 920 shows that the column film covers the OCA2 layer. As shown, the termination pads 425 are disposed near the top end of the column film. The termination pads may be located at other positions (e.g., near the bottom end of the column film).

Figure 10 shows flex tails aligned and bonded in place on a row film and column film using an anisotropic conductive film.

As shown, the unattached edges of the films (the low film and the column film) are peeled off and the flextails having an anisotropic conductive film (ACF) on their pads are aligned and bonded in place.

Figure 11 shows an optical transparent adhesive (OCA) layer laminated to a touch surface.

As shown, the side view 1100 shows a layer of optical transparent adhesive (OCA) laminated to a glass touch surface. The touch surface can be made of different materials.

The top view 920 shows that the OCA layer is sized slightly smaller than the touch surface. Other sizes may be selected. As shown, the boundaries at the top and bottom of the touch surface are not covered by the OCA1 layer.

Figure 12 shows flex tails aligned with an anisotropic conductive film (ACF) on pads aligned and bonded onto OCA.

The side view 1210 shows the flex tails in which an anisotropic conductive film (ACF) on the pads is aligned and bonded in place on the OCA1 layer.

Top view 1220 illustrates flex tails having strips of anisotropic conductive film on terminated pads aligned and bonded in place on the OCA1 layer.

Figure 13 shows a low film laminated to the OCA layer such that the termination pads on one end of the low film are bonded to the top of the anisotropic conductive film on the flex tails.

The side view 1310 shows the low film laminated over the OCA1 layer such that the termination pads on the low film are bonded onto the top of the anisotropic conductive film on the flex tails. As can be seen, the side of the film comprising the photosensitive coating faces a glass (e.g., a user) of the touch surface.

Top view 1320 shows the low film laminated onto the OCA1 layer such that termination pads 1325 on the low film are bonded onto the top of the anisotropic conductive film on the flex tails.

Figure 14 shows an optical transparent adhesive (OCA) layer laminated to a low film.

As shown, the side view 1410 shows a second OCA layer (OCA2) laminated to the low film 212. As shown in FIG.

The top view 1420 illustrates that the OCA2 layer is sized less than the low film surface but covers the flex tails and termination pads of the low film. As shown, a small boundary is shown leaving a portion of the low film that is not covered by OCA.

Figure 15 shows flex tails aligned with an anisotropic conductive film (ACF) on pads aligned and bonded onto OCA.

The side view 1510 shows the flex tails where the anisotropic conductive film (ACF) on the pads is aligned and bonded in place on the OCA2 layer.

Top view 1520 illustrates flex tails having strips of anisotropic conductive film on terminated pads aligned and bonded in place on the OCA2 layer.

Figure 16 shows a column film laminated to an OCA layer such that the termination pads on one end of the column film are bonded to the top of the anisotropic conductive film on the flextails.

The side view 1610 shows the column film laminated on the OCA2 layer such that the termination pads on the column film are bonded onto the top of the anisotropic conductive film on the flextails. As can be seen, the side of the film comprising the photosensitive coating faces a glass (e.g., a user) of the touch surface.

Top view 1620 shows the low film laminated over the OCA2 layer such that termination pads 1625 on the column film are bonded onto the top of the anisotropic conductive film on the flextails.

Figure 17 shows flex tails attached to a loose roll film using an anisotropic conductive film.

The side view 1710 illustrates the use of an anisotropic conductive film to attach the flextails to the loose low film. As shown, the low film was not yet laminated. Tests such as electrical continuity tests can be performed prior to lamination of the low film.

Top view 1720 shows that flex tails are attached to a loose low film comprising termination pads 1725 using an anisotropic conductive film.

Figure 18 shows the low film laminated to the OCA layer laminated to the touch surface where the flex tails are already in place.

As shown, the side view 1810 illustrates a low film that already includes flextails laminated in place on the OCA1 layer laminated to the glass touch side. Because the flextails are already in place, the entire low film can be laminated to the OCA1 layer.

The top view 1820 shows that the low film 212 covers the OCA layer. As shown, the termination pads 1825 are disposed near the left end of the low film. Termination pads may be located at different positions (e.g., near the right end of the low film).

Figure 19 shows flex tails attached to a loose column film using an anisotropic conductive film.

The side view 1910 shows a loose column film using an anisotropic conductive film. As shown, the column film has not yet been laminated to either. Tests such as electrical continuity tests can be performed prior to lamination of the column film. As can be seen, the side of the film comprising the photosensitive coating faces a glass (e.g., a user) of the touch surface.

Top view 1920 shows that flextails are attached to a loose column film comprising termination pads 1925 using an anisotropic conductive film.

Figure 20 shows a column film laminated to an OCA layer laminated to a low film where flextails are already in place.

As shown, the side view 2010 shows a column film that already includes flextails laminated in place on the OCA2 layer. Because the flextails are already in place, the entire column film can be laminated to the OCA2 layer. As can be seen, the side of the film comprising the photosensitive coating faces a glass (e.g., a user) of the touch surface.

The top view 2020 shows that the column film 212 covers the OCA2 layer. As shown, termination pads 1825 are disposed near the top end of the column film.

Figs. 21-24 illustrate exemplary processes for laminating a dark film facing a touch surface of a touch sensor. Although a particular order is shown, the order of operations may vary according to various embodiments.

Figure 21 shows a process for laminating a dark metallized film with termination pads to a touch surface, with the dark side facing the touch side.

After the start-up operation, the process moves to operation 2110 where the first layer of the optical transparent adhesive (OCA) layer is applied to the touch surface. The touch surface can be made of different materials. According to one embodiment, the touch surface is a glass. The touch surface may be of different thicknesses (depending, for example, on the type of application and / or device). For example, the glass touch surface may range from about 0.5 mm to about 3 mm or more. The OCA layer can cover all or a portion of the touch surface. Although the OCA layer is shown, other products, such as other types of adhesives, may be used. The OCA layer may be liquid OCA and / or OCA tape.

Moving to operation 2120, a low film comprising termination pads is laminated to the OCA. The low film is laminated to the OCA so that the termination pads remain exposed and do not adhere to the OCA (e.g., so that the unbonded termination can be peeled off). The metallized film used in the touch sensor includes a photoreceptive side facing invisibly to the wires disposed in the metallized film. According to one embodiment, both the low film and the column film are used in the touch sensor. According to another embodiment, row and column films may be used. Different pattern layouts of the wires in the row / column film may be used (e.g., parallel lines, diamond patterns, etc.). The photoresist coating of the low film faces the touch surface (e.g., closest to the touch surface).

Continuing to operation 2130, the second layer of OCA is laminated to the low film.

Moving to operation 2140, a column film comprising termination pads is laminated to the second OCA layer. The column film is laminated to the OCA so that the termination pads remain exposed and do not adhere to the OCA (so that the unbonded termination can be peeled off). The metallized film used in the touch sensor includes a photoreceptive side facing invisibly to the wires disposed in the metallized film. The photosensitive coating of the column film faces the touch surface.

Continuing to operation 2150, the flextails are bonded to the termination pads of the row and column films. For example, the side of the low film that is not attached to the OCA layer can be peeled off and the termination pads are bonded to the flextails. For example, an anisotropic conductive film (ACF) may be disposed on the termination pads used for bonding. Other bonding methods can be used. Similarly, the side of the column film that is not attached to the OCA layer can be peeled off and the termination pads are bonded to the flextails.

Then, the process moves to a termination operation.

22 illustrates a process for placing an anisotropic conductive film (ACF) on termination pads of a metallized film prior to lamination.

After the start operation, the process moves to operation 2210 where the first layer of the optical transparent adhesive (OCA) layer is laminated to the touch surface.

Moving to operation 2220, an anisotropic conductive film is placed over the termination pads on the metallized film. According to one embodiment, the strip of anisotropic conductive film covers the low film termination pads on the low film and the strip of anisotropic conductive film covers the column film termination pads on the column film.

Continuing to operation 2230, a low film comprising termination pads and anisotropic conductive film is laminated to the OCA. The low film is laminated to the OCA so that the termination pads and the anisotropic conductive film remain exposed and do not adhere to the OCA (so that the unbonded termination can be peeled off). The metallized film includes a photosensitive side facing the touch surface to assist in rendering the wires in the metallized film invisible.

Continuing to operation 2240, the second layer of OCA is laminated to the low film.

Moving to operation 2250, a column film comprising termination pads and an anisotropic conductive film is laminated to the second OCA layer. The column film is laminated to the OCA so that the termination pads and the anisotropic conductive film remain exposed and do not adhere to the OCA (so that the unbonded termination can be peeled off). The metallized column film includes a photosensitive side facing the touch surface to assist in rendering the wires in the metallized film invisible.

Continuing to operation 2260, the flex tails are bonded to the termination pads of the row and column films. For example, the sides of the low film that are not attached to the OCA layer can be peeled off and the termination pads are bonded to the flextails using the anisotropic conductive film strips already disposed.

Then, the process moves to a termination operation.

Figure 23 shows the process of placing flex tails before lamination of the metallization film used in the touch sensor.

After the start operation, the process moves to operation 2310 where the first layer of the optically clear adhesive (OCA) layer is applied / laminated to the touch surface.

Moving to operation 2320, the flextails with the anisotropic conductive film are bonded to the OCA layer such that the flextails are aligned with the row termination pads.

Continuing to operation 2330, the low film comprising termination pads is laminated to the OCA such that the termination pads of the low film are bonded to the anisotropic conductive film on the flex tails. The metallized film includes a photosensitive side facing the touch surface to assist in rendering the wires in the metallized film invisible.

Moving to act 2340, the second layer of OCA is laminated to the low film.

Continuing to operation 2350, the flextails with the anisotropic conductive film are bonded to the second OCA layer such that the flextails are aligned with the column termination pads.

Moving to operation 2360, the column film comprising the termination pads is laminated to the OCA such that the termination pads of the column film are bonded to the anisotropic conductive film on the flextails. The metallized film includes a photosensitive side facing the touch surface to assist in rendering the wires in the metallized film invisible.

Then, the process moves to a termination operation.

24 illustrates a process for placing flex tails on a loose metallized film.

After the start operation, the process continues to operation 2410 where the flextails with the anisotropic conductive film are bonded to the metallized film such that the flextails are aligned with the termination pads of the metallized film. According to one embodiment, the flextails are bonded to a row film comprising row termination pads, and the flex tails are bonded to a column film comprising column termination pads.

Moving to operation 2420, the metallized film (s) may be tested (e.g., for electrical continuity) before being laminated (e.g., to a touch surface).

Continuing to operation 2430, the first layer of the optically transparent adhesive (OCA) layer is laminated to the touch surface.

Moving to operation 2440, a low film containing already bonded flextails is laminated to the OCA. The low film can be perfectly laminated without leaving the part of the unbonded film since the flextails are already in place. The metallized film includes a photosensitive side facing the touch surface to assist in rendering the wires in the metallized film invisible.

Moving to operation 2450, the second layer of OCA is laminated to the low film.

Continuing to operation 2460, a column film comprising already bonded flextails is laminated to the second OCA layer. The column film can be perfectly laminated without leaving the part of the unbonded film because the flextails are already in place. The metallized film includes a photosensitive side facing the touch surface to assist in rendering the wires in the metallized film invisible.

Then, the process moves to a termination operation.

The embodiments and functions described herein may be implemented or performed with a variety of computing devices, such as displays having touch screens, desktop computer systems, wired and wireless computing systems, mobile computing systems (e.g., mobile phones, netbooks, Including, but not limited to, microprocessor-based or programmable consumer electronics, minicomputers, and mainframe computers), handheld devices, multiprocessor systems, Lt; / RTI > computing systems.

In addition, the embodiments and functions described herein may operate on distributed systems (e.g., a cloud-based computing system), where application functions, memory, data storage and retrieval, Or remotely from each other via a distributed computing network, such as an intranet. Various types of user interfaces and information may be displayed via on-board computing device displays or via remote display units associated with one or more computing devices. For example, various types of user interfaces and information may be displayed and interacted with on a display having a touch sensor 1130 as described herein. The interaction with a plurality of computing systems in which embodiments of the present invention may be practiced may include keystroke input, touch screen input, voice or other audio input, the associated computing device captures user gestures that control the functionality of the computing device And a gesture input equipped with a detecting (e.g., camera) function to interpret.

Figure 25 provides a discussion of the operating environment in which embodiments of the present invention may be practiced. The description is for purposes of illustration and example only and is not intended to limit the broad range of computing device configurations that may be utilized to practice the embodiments of the invention described herein.

25 is a block diagram illustrating the physical components (i.e., hardware) of a computing device 1100 that includes one or more touch sensors upon which embodiments of the invention may be practiced. In the basic configuration, computing device 1100 may include at least one processing unit 1102 and system memory 1104. Depending on the configuration and type of computing device, system memory 1104 may include volatile storage (e.g., random access memory), non-volatile storage (e.g., read only memory), flash memory, But is not limited thereto. The system memory 1104 may include an operating system 1105 and one or more program modules 1106 suitable for driving software applications 1170 such as the display manager 26. [ The display manager 26 is configured to process the touch input received from the touch sensor 1130. The operating system 1105 may be suitable, for example, to control the operation of the computing device 1100. Furthermore, embodiments of the present invention may be implemented in cooperation with a graphics library, other operating systems, or any other application program, and are not limited to any particular application or system. The basic configuration is illustrated in FIG. 25 by the components in dashed line 1108. The computing device 1100 may have additional features or functionality. For example, computing device 1100 may also include additional data storage devices (removable and / or non-removable) such as, for example, magnetic disks, optical disks, or tape. This additional storage is illustrated in Fig. 25 by removable storage device 1109 and non-removable storage device 1150. Fig.

As noted above, a number of program modules and data files may be stored in the system memory 1104. Although executing on the processing unit 1102, it may perform processes including, but not limited to, processing of touch inputs received from program modules 1106 (e.g., display manifests, one or more touch sensors, etc.) Program modules may be used in accordance with embodiments of the present invention.

Embodiments of the present invention may also be practiced with other electronic devices including, but not limited to, electronic circuits including discrete electronic elements, packaged or integrated electronic chips including logic gates, circuits utilizing microprocessors, or on a single chip comprising electronic elements or microprocessors . For example, embodiments of the present invention may be implemented through a system-on-a-chip (SOC) in which each or a plurality of the components illustrated in Fig. 25 may be integrated on a single integrated circuit. Such SOC devices may include one or more processing units, graphics units, communication units, system virtualization units, and various application functions, all of which are integrated on a chip substrate as a single integrated circuit do"). When operating through the SOC, the functions described herein with respect to the display manager 26 may be operated through application specific logic integrated with other components of the computing device 1100 on a single integrated circuit (chip). Embodiments of the present invention may also be practiced using other techniques capable of performing logical operations such as, for example, AND, OR, and NOT, including, but not limited to, mechanical, optical, have. Furthermore, embodiments of the invention may be practiced in a general-purpose computer or in any other circuitry or systems.

The computing device 1100 may also have one or more input device (s) 1112, such as a touch sensor 1130, a keyboard, a mouse, a pen, a sound input device, Although the touch sensor 1130 is shown outside the computing device 1100, the display and / or touch sensor 1130 may be included within the computing device 1100. Output device (s) 1114, such as a display, speakers, printer, etc., may also be included. The above-mentioned devices are examples and others may be used. Computing device 1100 may include one or more communication connections 1116 that allow communication with other computing devices 1118. [ Examples of suitable communication connections 1116 include, but are not limited to, RF transmitters, receivers, and / or transceiver circuits, Universal Serial Bus (USB), parallel and / or serial ports.

The term computer readable media as used herein may include computer storage media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, or program modules. The system memory 1104, the removable storage device 1109, and the removable storage device 1150 are all computer storage media examples (e.g., memory storage). Computer storage media includes, but is not limited to, RAM, ROM, electrically erasable read only memory (EEPROM), flash memory or other memory technology, CD ROM, digital versatile disks (DVD) or other optical storage, magnetic cassettes, Storage, or other magnetic storage devices, or any other product that can be used to store information and which can be accessed by the computing device 1100. Any such computer storage media may be part of the computing device 1100. Computer storage media do not include carrier waves or other propagated or modulated data signals.

Communication media may be embodied by computer-readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media. The term " modulated data signal " may describe a signal having one or more characteristics set or changed in this manner with respect to encoding information in the signal. By way of example, and not limitation, communication media include wired media such as a wired network or direct-wired connection, and wireless media such as acoustic waves, radio frequency (RF), infrared, and other wireless media.

The above specification, examples and data provide a complete description of the manufacture and use of the composition of the present invention. Numerous embodiments of the invention can be made without departing from the spirit and scope of the invention, which is encompassed within the claims appended hereto.

Claims (10)

In the touch sensor,
The touch surface,
A first optically clear adhesive (OCA) layer laminated to the touch surface;
A low film comprising row termination pads on a row termination bonded to flex tails, said low film having a first surface and a second top surface, said first substrate having a darkened surface of said low film facing said touch surface, Laminated to a layer,
A second optically transparent adhesive (OCA) layer laminated to the low film,
A column film comprising column termination pads on a column termination bonded to the column flex tails, wherein the column film is laminated to the second OCA layer. The method according to claim 1,
Wherein the touch surface is a glass, and the photosensitive surface is applied to one side of the low film and one side of the column film. The method according to claim 1,
A portion of the row termination of the row film including the row termination pads is overlapped with the first OCA layer so that the row termination pads are exposed after the row film is laminated to the first OCA layer, Is not bonded to the surface of the substrate. The method according to claim 1,
A portion of the column termination of the column film including the column termination pads is overlapped with the second OCA layer so that the column termination pads are exposed after the column film is laminated to the second OCA layer, Is not bonded to the surface of the substrate. A method of laminating layers of a touch sensor,
Bonding the flextails to termination pads of a metallization film used in the touch sensor, prior to laminating the metallization film;
And laminating the metallized film including the bonded flextails to a touch surface. ≪ RTI ID = 0.0 > 8. < / RTI > 6. The method of claim 5,
The step of bonding the flextails to the termination pads of the metallization film used in the touch sensor prior to laminating the metallization film comprises attaching the termination pads using an anisotropic conductive film (ACF) ≪ / RTI > 6. The method of claim 5,
Bonding the flex tails to the termination pads of the metallization film used in the touch sensor prior to laminating the metallization film comprises bonding the flex tails to the row termination pads of the low metallization film, And bonding the tails to the column termination films of the column metallization film. 6. The method of claim 5,
Wherein the step of laminating the metallized film including the bonded flextails to a touch surface includes laminating the photosensitive side of the metallized film toward the touch surface such that the photosensitive side is invisible to the wires in the metallized film ≪ / RTI > 6. The method of claim 5,
Further comprising the step of testing the metallized film comprising the flextails prior to laminating the metallized film to the touch surface. ≪ Desc / Clms Page number 21 > In the apparatus,
A glass touch surface,
A first optical transparent adhesive (OCA) layer laminated to the touch surface,
A first metallization film comprising termination pads on a first end bonded to the flextails, the first metallization film being disposed on the first OCA layer such that the photosensitive surface of the first metallized film faces the touch surface Laminated < / RTI >
A second optically transparent adhesive (OCA) layer that is laminated to the first metallization film,
A second metallization film comprising termination pads on a second termination bonded to the flextails, the second metallization film being laminated to the second OCA layer.

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