TWM518331U - Device having photosensitive ag paste wire - Google Patents

Device having photosensitive ag paste wire Download PDF

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Publication number
TWM518331U
TWM518331U TW104211482U TW104211482U TWM518331U TW M518331 U TWM518331 U TW M518331U TW 104211482 U TW104211482 U TW 104211482U TW 104211482 U TW104211482 U TW 104211482U TW M518331 U TWM518331 U TW M518331U
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TW
Taiwan
Prior art keywords
silver paste
photosensitive silver
line
substrate
paste line
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TW104211482U
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Chinese (zh)
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許銘案
林文福
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許銘案
林文福
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Application filed by 許銘案, 林文福 filed Critical 許銘案
Priority to TW104211482U priority Critical patent/TWM518331U/en
Publication of TWM518331U publication Critical patent/TWM518331U/en

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  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

具感光銀漿線路之裝置 Device with photosensitive silver paste line

本創作係有關於一種銀漿,特別是關於一種具感光銀漿線路之裝置。 This creation is about a silver paste, especially for a device with a photosensitive silver paste line.

電路板分為軟板與硬板,透明與不透明。其中,硬板當中較為特殊的是玻璃基材,玻璃基材可應用於觸控面板上;軟板當中的PET材質,可運用於許多領域,例如,觸控面板、檢測用試紙等。 The board is divided into a soft board and a hard board, which are transparent and opaque. Among them, the special one among the hard plates is a glass substrate, and the glass substrate can be applied to the touch panel; the PET material in the soft board can be used in many fields, for example, a touch panel, a test strip for testing, and the like.

在觸控面板與檢測試紙領域的應用當中,導電銀漿是其中的重要導線材料,因為其可用較低溫的方式製作於基材上,特別是PET等的塑膠基材。將導電銀漿製作於基材上主要有兩種技術,第一是網印,第二是採用感光銀漿(或稱曝光銀漿)。網印的解析度差,而感光銀漿可達較高的解析度。 Among the applications of touch panels and test strips, conductive silver paste is an important conductive material because it can be fabricated on substrates in a relatively low temperature manner, especially for plastic substrates such as PET. There are two main techniques for making conductive silver paste on a substrate. The first is screen printing, and the second is to use photosensitive silver paste (or silver paste). The resolution of the screen printing is poor, and the photosensitive silver paste can reach a higher resolution.

由於觸控面板窄邊框或無邊框之設計潮流,因感光銀漿的解析度較高,成為觸控面板在邊框的線路形成技術上成為主流。然而,目前感光銀漿的開發多著重在成份的研究,並未針對特定的產品需求來進定應用,例如,檢測試紙的特殊阻抗需求等。因此,如何針對特定產品需求來應用感光銀漿,成為各家廠商的努力方向。 Due to the design trend of the narrow border or the borderless of the touch panel, the resolution of the photosensitive silver paste is high, and the touch panel becomes the mainstream in the line forming technology of the frame. However, at present, the development of photosensitive silver paste focuses on the research of components, and does not target applications for specific product requirements, for example, detecting the special impedance requirements of test strips. Therefore, how to apply sensitive silver paste to specific product requirements has become the direction of efforts of various manufacturers.

習知感光銀漿所應用之裝置,並未針對特殊阻抗需求來進行 調配,本新型針對特殊阻抗需求,定義出感光銀漿的線寬、厚度等,以滿足特定阻抗值的需求。 The device used in the photosensitive silver paste is not designed for special impedance requirements. For the special impedance requirement, the new definition defines the line width and thickness of the photosensitive silver paste to meet the specific impedance value.

本創作提供一種具感光銀漿線路之裝置,包含:一基材與一感光銀漿線路。其中,基材係選自軟性基材或透明基材;感光銀漿線路形成於該基材上。其中,感光銀漿線路以一微影製程製作,感光銀漿線路之線寬與厚度依據阻抗值計算產生,線寬大於10微米。 The present invention provides a device for a photosensitive silver paste line comprising: a substrate and a photosensitive silver paste line. Wherein, the substrate is selected from a soft substrate or a transparent substrate; and a photosensitive silver paste line is formed on the substrate. Among them, the photosensitive silver paste line is fabricated by a lithography process, and the line width and thickness of the photosensitive silver paste line are calculated according to the impedance value, and the line width is greater than 10 micrometers.

為讓本創作之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉數個較佳實施例,並配合所附圖式,作詳細說明如下(實施方式)。 The above and other objects, features, and advantages of the present invention will become more apparent and understood.

10‧‧‧軟性基材 10‧‧‧Soft substrate

20‧‧‧感光銀漿線路 20‧‧‧Photosensitive silver paste line

30‧‧‧玻璃基材 30‧‧‧ glass substrate

41‧‧‧感光銀漿線路 41‧‧‧Photosensitive silver paste line

42‧‧‧連接點 42‧‧‧ Connection point

50‧‧‧觸控面板可視區 50‧‧‧Touch panel viewing area

第1A圖係本新型的第一實施例上視圖。 Fig. 1A is a top view of the first embodiment of the present invention.

第1B圖係本新型的第一實施例剖視圖。 Fig. 1B is a cross-sectional view showing the first embodiment of the present invention.

第2圖係本新型的第二實施例上視圖。 Figure 2 is a top view of a second embodiment of the present invention.

請參閱第1A、1B圖,本新型的第一實施例,其為一試紙結構。在試紙所用的軟性基材10上,運用微影製程製作出感光銀漿線路20,其線寬與厚度依據一阻抗值計算產生,其中,線寬大於10微米。由於銀漿的混和成分當中有銀粒子,因此,線寬會受到侷限。 Please refer to FIGS. 1A and 1B, a first embodiment of the present invention, which is a test paper structure. On the flexible substrate 10 used for the test paper, a photosensitive silver paste line 20 is produced by a lithography process, and the line width and thickness are calculated according to an impedance value, wherein the line width is greater than 10 μm. Since silver particles are mixed in the silver paste, the line width is limited.

在此實施例中,軟性基材10可採用PET材質,其具有透明與可撓的特性。並且,感光銀漿線路20形成於軟性基材10之中央,以構成特定阻抗值之傳導線路。 In this embodiment, the flexible substrate 10 may be made of a PET material having transparent and flexible properties. Further, the photosensitive silver paste line 20 is formed in the center of the flexible substrate 10 to constitute a conductive line of a specific impedance value.

舉例而言,血糖試紙的阻抗值,控制在900-1k歐姆(Ω)時,可讓血糖儀的準確度提高。一般血糖試紙的設計,與血糖儀的連接器(connector)所需求的線寬有相關性。如能準確的製作出,無論是金手指的寬度、間距以及與試紙邊緣的距離等,可降低血糖儀的數值誤判。因此,採用本新型所製作的感光銀漿線路的試紙片,將可達到精度較高的阻抗值、高解析度的線寬、間距等。阻抗值介於100-3,000歐姆,厚度介於5-10微米,線寬介於10-50微米。 For example, the blood glucose test strip's impedance value, controlled at 900-1k ohms (Ω), can improve the accuracy of the blood glucose meter. The design of a typical blood glucose test strip is related to the line width required by the connector of the blood glucose meter. If it can be accurately produced, the width and spacing of the gold finger and the distance from the edge of the test paper can reduce the numerical misjudgment of the blood glucose meter. Therefore, the test piece using the photosensitive silver paste line produced by the present invention can achieve a high precision impedance value, a high resolution line width, a pitch, and the like. The impedance is between 100 and 3,000 ohms, the thickness is between 5 and 10 microns, and the line width is between 10 and 50 microns.

此外,製作完感光銀漿線路20後,可於其上形成一保護層,以使感光銀漿線路受到保護。在許多試紙的製作過程,還會在感光銀漿線路上鋪上碳膜層作為保護層。 In addition, after the photosensitive silver paste line 20 is formed, a protective layer can be formed thereon to protect the photosensitive silver paste line. In the production process of many test papers, a carbon film layer is also laid on the photosensitive silver paste line as a protective layer.

軟性基板還有其他的應用,如觸控面板的軟板,同樣可用本新型製作。 Other applications for flexible substrates, such as soft boards for touch panels, can also be made with this new type.

接著,請參閱第2圖,本新型的第二實施例,其為一觸控面板結構。在此實施例中,運用透明的玻璃基材30,將感光銀漿線路41形成於其上,並同時形成連接點42。感光銀漿線路41與觸控面板可視區50的透明電極相連接,再透過連接點42外接到觸控晶片。由於目前觸控面板對於邊框的窄化要求,線寬必須越作越細,同時,阻抗值也有特定的要求。因此,運用微影製程製作出來的感光銀漿線路,將可有效地滿足此一需求。 Next, referring to FIG. 2, a second embodiment of the present invention is a touch panel structure. In this embodiment, a transparent glass substrate 30 is used to form the photosensitive silver paste line 41 thereon, and at the same time, a connection point 42 is formed. The photosensitive silver paste line 41 is connected to the transparent electrode of the visible area of the touch panel 50, and then externally connected to the touch wafer through the connection point 42. Due to the narrowing requirements of the touch panel for the frame, the line width must be made thinner and thinner, and the impedance value also has specific requirements. Therefore, the photosensitive silver paste circuit produced by the lithography process can effectively meet this demand.

雖然本新型的技術內容已經以較佳實施例揭露如上,然其並非用以限定本新型,任何熟習此技藝者,在不脫離本新型之精神所作些許之更動與潤飾,皆應涵蓋於本新型的範疇內,因此本新型之保護範圍當視後附之申請專利範圍所界定者為準。 Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be encompassed by the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application.

30‧‧‧玻璃基材 30‧‧‧ glass substrate

41‧‧‧感光銀漿線路 41‧‧‧Photosensitive silver paste line

42‧‧‧連接點 42‧‧‧ Connection point

50‧‧‧觸控面板可視區 50‧‧‧Touch panel viewing area

Claims (9)

一種具感光銀漿線路之裝置,包含:一基材,係選自一軟性基材或一透明基材;一感光銀漿線路,形成於該基材上;及其中,該感光銀漿線路以一微影製程製作,該感光銀漿線路之一線寬與一厚度依據一阻抗值計算產生,該線寬大於10微米。 A device having a photosensitive silver paste line, comprising: a substrate selected from a soft substrate or a transparent substrate; a photosensitive silver paste line formed on the substrate; and wherein the photosensitive silver paste line is In a lithography process, a line width and a thickness of the photosensitive silver paste line are calculated according to an impedance value greater than 10 microns. 如請求項1所述之具感光銀漿線路之裝置,其中該軟性基材係選自PET。 The device of claim 1, wherein the flexible substrate is selected from the group consisting of PET. 如請求項1所述之具感光銀漿線路之裝置,其中該透明基材係選自一玻璃基材或PET。 The device of claim 1, wherein the transparent substrate is selected from a glass substrate or PET. 如請求項3所述之具感光銀漿線路之裝置,其中該感光銀漿線路形成於該透明基材之邊框,以構成該阻抗值之傳導線路。 The device of claim 3, wherein the photosensitive silver paste line is formed on a frame of the transparent substrate to form a conductive line of the impedance value. 如請求項3所述之具感光銀漿線路之裝置,其中該感光銀漿線路形成於該軟性基材之中央,以構成該阻抗值之傳導線路。 The device of claim 3, wherein the photosensitive silver paste line is formed in the center of the flexible substrate to form a conductive line of the impedance value. 如請求項1所述之具感光銀漿線路之裝置,其中該阻抗值介於100-3,000歐姆。 A device having a photosensitive silver paste line as claimed in claim 1, wherein the impedance value is between 100 and 3,000 ohms. 如請求項1所述之具感光銀漿線路之裝置,其中該厚度介於5-10微米。 A device having a photosensitive silver paste line as claimed in claim 1, wherein the thickness is between 5 and 10 microns. 如請求項1所述之具感光銀漿線路之裝置,其中該線寬介於10-50微米。 A device having a photosensitive silver paste line as claimed in claim 1, wherein the line width is between 10 and 50 microns. 如請求項1所述之具感光銀漿線路之裝置,更包含:一保護層,形成於該感光銀漿線路上。 The device of claim 1 , further comprising: a protective layer formed on the photosensitive silver paste line.
TW104211482U 2015-07-16 2015-07-16 Device having photosensitive ag paste wire TWM518331U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112449490A (en) * 2019-08-30 2021-03-05 致伸科技股份有限公司 Thin film circuit structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112449490A (en) * 2019-08-30 2021-03-05 致伸科技股份有限公司 Thin film circuit structure
CN112449490B (en) * 2019-08-30 2022-04-01 致伸科技股份有限公司 Thin film circuit structure

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