KR20160018232A - Heating Apparatus of Pipe - Google Patents

Heating Apparatus of Pipe Download PDF

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Publication number
KR20160018232A
KR20160018232A KR1020140102541A KR20140102541A KR20160018232A KR 20160018232 A KR20160018232 A KR 20160018232A KR 1020140102541 A KR1020140102541 A KR 1020140102541A KR 20140102541 A KR20140102541 A KR 20140102541A KR 20160018232 A KR20160018232 A KR 20160018232A
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South Korea
Prior art keywords
pipe
heat
electric wire
heating
lcd
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KR1020140102541A
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Korean (ko)
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최상철
김정섭
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(주)이피엔
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Priority to KR1020140102541A priority Critical patent/KR20160018232A/en
Publication of KR20160018232A publication Critical patent/KR20160018232A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L53/00—Heating of pipes or pipe systems; Cooling of pipes or pipe systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pipe Accessories (AREA)
  • General Induction Heating (AREA)

Abstract

The present invention relates to a heating apparatus for a pipe, which heats a fluid in a pipe for semiconductor, LCD and LED processes. Especially, the heating apparatus comprises an inner coating touching an outer surface of a pipe; an electric wire which is arranged on an upper surface of the inner coating; an outer coating which is arranged on the upper side of the inner coating; an insulator which is arranged between the inner coating and the outer coating. The electric wire comprises an induction coil to heat the pipe by induction heating, so a fluid in the pipe can be more efficiently heated by transmitting heat to the fluid.

Description

반도체 및 LCD, LED 공정의 배관용 히팅장치{Heating Apparatus of Pipe}[0001] Heating Apparatus of Pipe [0002]

본 발명은 배관용 히팅장치에 관한 것으로서, 특히 배관 내부에서 유동하는 유체를 효율적으로 가열하여 에너지 효율을 높일 수 있는 반도체 및 LCD, LED 공정의 배관용 히팅장치에 관한 것이다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating device for piping, and more particularly, to a heating device for piping in a semiconductor, LCD, and LED process, which can efficiently heat a fluid flowing inside a pipe to increase energy efficiency.

일반적으로, 반도체 공정설비, 가스 설비, LCD, LED 공정설비 등과 같이 가스가 이동하는 파이프에는 이 파이프 내부를 유동하는 가스가 액화되는 것을 방지하기 위하여 파이프의 외측면에 히팅장치(일반적으로 히터자켓이라고 명칭됨)을 설치한다.Generally, in order to prevent liquefaction of the gas flowing inside the pipe, such as a semiconductor process facility, a gas facility, an LCD, and an LED process facility, a heating device (usually a heater jacket ).

이렇게 파이프 외측에 설치되는 히터자켓은 열선이 구비되어 파이프를 가열하는데, 종래의 히터자켓은 길이가 긴 열선을 지그재그로 배치하여 배관의 외측면을 가열하는 구조를 취하고 있다.The heater jacket disposed outside the pipe is provided with a heat wire to heat the pipe. The conventional heater jacket has a structure in which hot wires having a long length are disposed in a zigzag manner to heat the outer surface of the pipe.

이러한 구조의 히터자켓은 열선으로 배관을 가열한 후 이 배관이 다시 내부의 유체를 가열하기 때문에 열효율이 좋지 않을 뿐만 아니라 반복적으로 열선에 전원을 공급하여 가열하다보면 열선에 피로가 누적되어 외부 충격에 열선이 쉽게 파손되는 문제점이 있다.
Since the heater jacket of this structure heats the piping by heating the pipeline and then heats the fluid inside again, not only the heat efficiency is not good but also the power is supplied repeatedly to the hot line, There is a problem that the heat ray is easily broken.

출원번호:10-2009-0071904, 등록번호:10-0955861, 발명의 명칭:파이프 가열 장치Application No. 10-2009-0071904, Registration No. 10-0955861, Title of the invention: Pipe heating device

본 발명은 상기한 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 전자기유도에 의한 유도가열현상을 이용하여 배관을 가열함으로써 배관 내부에 유동하는 유체를 효율적으로 가열할 수 있는 반도체 및 LCD, LED 공정의 배관용 히팅장치를 제공하는데 그 목적이 있다.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a semiconductor and LCD capable of efficiently heating a fluid flowing in a pipe by heating a pipe using induction heating phenomenon by electromagnetic induction, And it is an object of the present invention to provide a heating device for piping of a pipe.

상기한 과제를 해결하기 위한 본 발명에 의한 반도체 및 LCD, LED 공정의 배관용 히팅장치는 반도체 및 LCD, LED 공정의 배관 내부 유체를 가열하는 것으로서; 상기 배관 외측면에 접촉되는 내피와; 상기 내피의 상면에 배치되는 전선과; 상기 내피의 상측에 배치되는 외피와; 상기 내피와 외피 사이에 배치되는 단열재;로 구성되되, 상기 전선은 인덕션코일로 이루어져 유도가열에 의해 상기 배관이 발열되도록 한다.
According to an aspect of the present invention, there is provided a heating apparatus for piping in a semiconductor, LCD, or LED process, which heats a fluid in a pipe of a semiconductor, LCD, or LED process; An inner skin contacting the outer surface of the pipe; An electric wire disposed on an upper surface of the endothelium; An outer skin disposed on the upper side of the inner skin; And a heat insulating material disposed between the inner skin and the outer skin, wherein the electric wire is made of an induction coil so that the pipe is heated by induction heating.

상기와 같이 구성되는 본 발명의 반도체 및 LCD, LED 공정의 배관용 히팅장치는 인덕션코일로 이루어진 전선에 수~수십KHz의 교류전원을 인가하면 전자기유도에 의해 유도가열현상이 발생되고 이 유도가열현상에 의해 배관이 발열되므로, 배관 내부의 유체에 열이 잘 전달되도록 하여 더욱 효율적으로 유체를 가열할 수 있는 이점이 있다. 즉 에너지 효율성이 높은 이점이 있다.In the heating apparatus for piping in the semiconductor, LCD, and LED process according to the present invention, when an AC power source of several to several tens of KHz is applied to a wire made of an induction coil, induction heating phenomenon occurs due to electromagnetic induction, The heat is efficiently transmitted to the fluid inside the pipe, so that the fluid can be heated more efficiently. That is, it has a high energy efficiency.

또한, 배관 자체가 발열되기 때문에 전선의 열피로 누적현상에 의한 단선을 방지할 수 있는 이점이 있다.
In addition, since the pipe itself generates heat, there is an advantage that disconnection due to thermal fatigue accumulation phenomenon of the electric wire can be prevented.

도 1은 본 발명에 의한 반도체 및 LCD, LED 공정의 배관용 히팅장치를 설치한 모습을 보인 단면도.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a heating device for piping of a semiconductor, LCD, and LED process according to the present invention.

이하, 본 발명에 의한 반도체 및 LCD, LED 공정의 배관용 히팅장치의 실시 예를 첨부된 도면을 참조하여 상세히 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a heating apparatus for piping of semiconductor, LCD, and LED processes according to the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 의한 반도체 및 LCD, LED 공정의 배관용 히팅장치를 설치한 모습을 보인 단면도이다.
1 is a cross-sectional view illustrating a heating device for piping of a semiconductor, LCD, and LED process according to the present invention.

본 발명에 의한 반도체 및 LCD, LED 공정의 배관용 히팅장치는 반도체 공정 및 LCD, LED 공정 등에 설치된 배관(P)의 내부를 유동하는 유체를 가열하기 위한 것으로서, 내피(10)와, 상기 내피(10)의 상면에 배치되는 전선(20)과, 상기 내피(10)의 상측에 배치되는 외피(30)와, 상기 내피(10)와 외피(30) 사이에 배치되는 단열재(40)로 구성된다.
A heating device for piping in a semiconductor, LCD, and LED process according to the present invention is for heating a fluid flowing in a piping (P) installed in a semiconductor process, LCD, and LED process. The heating device includes an inner film (10) 10 arranged on the upper surface of the inner sheet 10, a sheath 30 disposed on the upper side of the inner sheet 10, and a heat insulating material 40 disposed between the inner sheet 10 and the sheath 30 .

상기 내피(10)는 상기 배관(P)을 둘러싸서 배관(P)의 외측면에 접촉되는 것으로서, 유연성과 내열성이 좋은 섬유나 직물과 같은 것으로 그 재질이 이루어진다.
The inner skin 10 surrounds the pipe P and is in contact with the outer surface of the pipe P. The inner skin 10 is made of a material such as a fiber or a fabric having good flexibility and heat resistance.

상기 전선(20)은 상기 내피(10)의 상면에 배치되는 것으로서 인덕션코일로 이루어져 유도가열에 의해 상기 배관(P)이 발열되도록 한다.The electric wire 20 is disposed on the upper surface of the inner skin 10 and is made of an induction coil so that the pipe P is heated by induction heating.

즉, 본 발명에 의한 반도체 및 LCD, LED 공정의 배관용 히팅장치에 사용되는 전선(20)은 그 자체가 발열하는 것이 아니고, 상기 전선(20)에 수~수십KHz의 교류전원을 인가했을 때 전자기유도에 의해 발생되는 유도가열에 의해 배관(P)을 가열시킨다. 유도가열에 의해 배관(P)이 발열되기 때문에 배관(P) 내부에서 유동하는 유체는 직접적으로 열을 전달받게 되어 그만큼 신속하게 열을 전달받을 수 있는 장점이 있다.That is, the electric wire 20 used in the heating device for piping in the semiconductor, LCD, and LED process according to the present invention does not generate heat itself, and when an AC power of several to several tens of KHz is applied to the electric wire 20 And the pipe P is heated by induction heating generated by electromagnetic induction. Since the pipe P generates heat by induction heating, the fluid flowing inside the pipe P receives the heat directly, and the heat can be received as quickly as it is.

그러나, 종래에는 배관(P)이 가열되는 방식이 아니고 전선, 즉 발열코일이 발열되어 이 열로 배관(P)을 가열함으로써 배관(P) 내부의 유체를 가열하기 때문에 그만큼 열효율도 떨어지고 발열코일에 피로가 쌓여 쉽게 단선되는 문제점이 있었다.However, conventionally, the pipe P is not heated but the electric wire, that is, the heat generating coil is heated, and the pipe P is heated by this heat to heat the fluid in the pipe P. Accordingly, the heat efficiency is lowered, There is a problem in that it is easily broken.

상기와 같이 인적션코일로 이루어지는 전선(20)은 상기 내피(10)의 상면에 밀착되도록 설치된다.
As described above, the electric wire 20 made of the incision coil is installed so as to be in close contact with the upper surface of the inner skin 10. [

상기 외피(30)는 상기 내피(10)의 상면에 고정되는 것으로서, 단열성능이 우수하고 유연성이 좋은 섬유나 직물로 그 재질이 이루어진다.
The outer cover 30 is fixed to the upper surface of the inner cover 10 and is made of a fiber or fabric having excellent heat insulation performance and good flexibility.

상기 단열재(40)는 상기 내피(10)와 외피(30) 사이에 충진되는 것으로서, 상기 전선(20)의 외측면을 둘러싼다. 이 단열재(40)는 배관(P)에서 발산되는 열이 배관(P)의 외부로 발산되는 것을 억제하여 열이 배관(P) 내부의 유체로 집중될 수 있도록 도움을 준다.
The heat insulating material 40 is filled between the inner skin 10 and the outer skin 30 and surrounds the outer surface of the electric wire 20. The heat insulating material 40 prevents the heat emitted from the pipe P from being radiated to the outside of the pipe P to help the heat to be concentrated in the fluid inside the pipe P. [

10: 내피 20: 전선
30: 외피 40: 단열재
P: 배관10: endothelia 20: wires
30: jacket 40: insulation
P: Piping

Claims (2)

반도체 및 LCD, LED 공정의 배관(P) 내부 유체를 가열하는 히팅장치에 관한 것으로서,
상기 배관(P) 외측면에 접촉되는 내피(10)와; 상기 내피(10)의 상면에 배치되는 전선(20)과; 상기 내피(10)의 상측에 배치되는 외피(30)와; 상기 내피(10)와 외피(30) 사이에 배치되는 단열재(40);로 구성되되,
상기 전선(20)은 인덕션코일로 이루어져 유도가열에 의해 상기 배관(P)이 발열되도록 하는 것을 특징으로 하는 반도체 및 LCD, LED 공정의 배관용 히팅장치.
The present invention relates to a heating device for heating a fluid inside a pipe (P) of a semiconductor, an LCD, and an LED process,
An inner skin 10 in contact with the outer surface of the pipe P; An electric wire (20) disposed on an upper surface of the inner skin (10); A skin 30 disposed on the upper side of the inner skin 10; And a heat insulating material (40) disposed between the inner skin (10) and the outer skin (30)
Wherein the electric wire (20) is made of an induction coil so that the pipe (P) is heated by induction heating.
청구항 1에 있어서,
상기 전선(20)은 상기 내피(10)의 상면에 밀착되도록 설치되는 것을 특징으로 하는 반도체 및 LCD, LED 공정의 배관용 히팅장치.The method according to claim 1,
Wherein the electric wire (20) is installed in close contact with the upper surface of the inner skin (10).
KR1020140102541A 2014-08-08 2014-08-08 Heating Apparatus of Pipe KR20160018232A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200037517A (en) * 2018-10-01 2020-04-09 한국해양대학교 산학협력단 Helical Trace Heating Flowline
KR102189289B1 (en) 2019-07-30 2020-12-11 조영준 Toxic gas pipe fixing bracket
KR102190416B1 (en) * 2019-06-19 2020-12-11 (주)티제이텍 Heating jacket assembly for semiconductor manufacturing apparatus
KR20210117735A (en) * 2020-03-20 2021-09-29 (주)벡터에스 Heating pipe using plate heating element
KR20210129802A (en) * 2020-04-21 2021-10-29 주식회사 아이에스케이 A Magnetic Induction Type of an Apparatus for Heating a Conduit
KR20240005644A (en) * 2021-12-29 2024-01-12 주식회사 미성 Pipe freeze protection system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090071904A (en) 2007-12-28 2009-07-02 강형모 Drawer type cd case

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090071904A (en) 2007-12-28 2009-07-02 강형모 Drawer type cd case

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200037517A (en) * 2018-10-01 2020-04-09 한국해양대학교 산학협력단 Helical Trace Heating Flowline
KR102190416B1 (en) * 2019-06-19 2020-12-11 (주)티제이텍 Heating jacket assembly for semiconductor manufacturing apparatus
KR102189289B1 (en) 2019-07-30 2020-12-11 조영준 Toxic gas pipe fixing bracket
KR20210117735A (en) * 2020-03-20 2021-09-29 (주)벡터에스 Heating pipe using plate heating element
KR20210129802A (en) * 2020-04-21 2021-10-29 주식회사 아이에스케이 A Magnetic Induction Type of an Apparatus for Heating a Conduit
KR20240005644A (en) * 2021-12-29 2024-01-12 주식회사 미성 Pipe freeze protection system

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