KR20160016329A - Finger sensor and touch device comprising the same - Google Patents

Abstract

According to one embodiment of the present invention, provided are a fingerprint sensor having an improved electrical characteristic and a touch device including the same. The fingerprint sensor includes: a first substrate; a second substrate on the first substrate; a first electrode and a first chip on the first substrate; and a second electrode and a second chip on the second substrate.

Description

Technical Field [0001] The present invention relates to a finger sensor and a touch device including the finger sensor.

Embodiments relate to a fingerprint sensor and a touch device including the fingerprint sensor.

2. Description of the Related Art [0002] In recent years, a touch device has been applied to a variety of electronic products to input an image displayed on a display device by touching an input device such as a finger or a stylus.

A sensor for recognizing a fingerprint may be applied to such a touch device. In detail, by touching such a fingerprint sensor with a finger, various operations such as on-off of the touch device can be performed.

Such a fingerprint recognition sensor can be manufactured by disposing electrodes and a fingerprint recognition drive chip on a substrate.

In the case of such a fingerprint sensor, the distance between the sensing unit and the chip must be short in order to detect a minute cap change, and as the distance of the chip increases, the touch sensitivity of the fingerprint sensor deteriorates There is a problem.

Accordingly, there is a demand for a fingerprint sensor having a new structure and a touch device including the fingerprint sensor, which can solve the above problems.

Embodiments provide a fingerprint sensor having improved electrical characteristics and a touch device including the fingerprint sensor.

A fingerprint sensor according to an embodiment includes: a first substrate; A second substrate on the first substrate; A first electrode and a first chip on the first substrate; And a second electrode and a second chip on the second substrate.

In the fingerprint sensor according to the embodiment, two circuit boards on which chips are mounted are arranged in one region on two substrates, and a chip connected to each electrode is arranged on the back surface of the substrate by bending a region where the circuit substrate is arranged .

That is, a first circuit board and a second circuit board, each of which mounts a chip on one region of the first board and the second board, are arranged, and the first circuit board and the second circuit board can be bent in the direction of the main board driving chip .

Therefore, the fingerprint recognition driving chip and the main board driving chip or the first and second electrodes and the main board driving chip can be connected by the shortest distance.

In the case of a fingerprint sensor, the distance between the sensing unit and the chip must be short in order to detect a minute cap change, and as the distance between the sensing unit and the chip increases, the touch sensitivity of the fingerprint sensor deteriorates .

Accordingly, since the fingerprint sensor according to the embodiment can reduce the distance between the distance chip and the electrode, that is, the distance between the chip and the sensing units, to a minimum, noise due to the distance difference between the chip and the sensing units can be reduced, The touch characteristics and the reliability of the touch panel can be improved.

1 and 2 are views showing an isolated top view of a fingerprint sensor according to a first embodiment.
FIGS. 3 and 4 are views showing an isolated top view of the fingerprint sensor according to the second embodiment.
FIGS. 5 and 6 are views showing an isolated plan view of the fingerprint sensor according to the third embodiment.
FIG. 7 is a plan view showing the fingerprint sensors of FIGS. 5 and 6 assembled together.
FIG. 8 is a plan view of the folded fingerprint sensor according to the third embodiment, showing a front view of the fingerprint sensor. FIG.
9 is a cross-sectional view taken along the line AA 'in FIG.
10 is a plan view of the folded fingerprint sensor according to the third embodiment, showing the rear surface of the fingerprint sensor.
11 to 14 are views showing an example of a touch device to which a fingerprint sensor or a touch window including the fingerprint sensor according to the embodiment is applied.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

Also, when a part is referred to as being "connected" to another part, it includes not only a case of being "directly connected" but also a case of being "indirectly connected" with another member in between. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 10, a fingerprint sensor according to an embodiment will be described.

1 to 10, a fingerprint sensor 1000 according to an embodiment may include a first substrate 110, a second substrate 120, a first chip C1, and a second chip C2. have.

The first substrate 110 and the second substrate 120 may support the first chip C1 and the second chip C2, respectively.

The first substrate 110 and the second substrate 120 may be rigid or flexible. Preferably, the substrate 100 is flexible and can be bent or bent in various directions.

The first substrate 110 and the second substrate 120 may include plastic. For example, the substrate 100 may include plastic such as polyethylene terephthalate (PET).

Referring to FIGS. 1 and 2, the first substrate 110 of the fingerprint sensor according to the first embodiment may include a first region 1A and a second region 2A. In detail, the first substrate 110 may include the first region 1A and the second region 2A that are connected to each other. That is, the first region 1A and the second region 2A may be integrally formed. In the first region 1A, the first electrode 210 may be disposed. In detail, the first sensing portion 211 and the first wiring portion 212 may be disposed in the first region 1A.

The first sensing unit 211 may extend in one direction on the first region 1A. The first wiring part 212 may be connected to one end of the first sensing part 211.

The first circuit board 310 may be disposed in the second region 2A. In detail, the first circuit board 310 may be disposed on one side of the second region 2A. The first circuit board 310 may be partially disposed on one side of the second area 2A. That is, the area of the first circuit board 310 may be smaller than the area of the second area 2A.

The first circuit board 310 may be adhered and disposed on the second region 2A of the first substrate 110 using an anisotropic conductive adhesive film (ACF) or an anisotropic conductive adhesive (ACA).

The first chip C1 may be adhered on the first circuit board 310. That is, the first chip C1 may be mounted on the first circuit board 310. [ For example, the first chip C1 may be bonded to the first circuit board 310 using an anisotropic conductive adhesive film (ACF) or an anisotropic conductive adhesive (ACA).

A COF film may be further disposed between the first circuit board 310 and the first chip C1. That is, the first chip C1 may be disposed on the COF film.

The first wiring part 212 extends from the first area 1A toward the second area 2A and is mounted on the first circuit board 310 on the second area 2A. 1 chip (C1).

Referring to FIG. 2, the second substrate 120 of the fingerprint sensor according to the first embodiment may include a third region 3A and a fourth region 4A. In detail, the second substrate 120 may include the third region 3A and the fourth region 4A connected to each other. That is, the third region 3A and the fourth region 4A may be integrally formed.

A second electrode 220 may be disposed in the third region 3A. In detail, the second sensing unit 221 and the second wiring unit 222 may be disposed on the third region 120.

The second sensing unit 221 may be disposed on the third region 120 in a direction different from the first direction, that is, in a direction different from a direction in which the first sensing unit 211 extends. The second wiring part 222 may be connected to one end of the second sensing part 221.

The second circuit board 320 may be disposed in the fourth region 4A. In detail, the second circuit board 310 may be disposed on one side of the fourth region 4A. The second circuit board 320 may be partially disposed on one side of the fourth region 4A. That is, the area of the second circuit board 320 may be smaller than the area of the fourth area 4A.

The second circuit board 320 may be adhered and disposed on the third region 2A of the second substrate 120 using an anisotropic conductive adhesive film (ACF) or an anisotropic conductive adhesive (ACA).

The second chip (C2) may be adhered on the second circuit board (320). That is, the second chip C2 may be mounted on the second circuit board 320. [ For example, the second chip C2 may be bonded to the second circuit board 320 using an anisotropic conductive adhesive film (ACF) or an anisotropic conductive adhesive (ACA).

A COF film may further be disposed between the second circuit board 320 and the second chip C2. That is, the second chip C2 may be disposed on the COF film.

The second wiring part 222 is formed on the second area of the third area 3A and extends from the third area 3A toward the fourth area 4A and is mounted on the second circuit board 320 on the fourth area 4A. 2 chip C2.

3 and 4 are views showing a fingerprint sensor according to the second embodiment. In the description of the fingerprint sensor according to the second embodiment, descriptions similar to those of the first embodiment described above will be omitted.

Referring to FIG. 3, the first substrate 110 of the fingerprint sensor according to the second embodiment may include a first area 1A and a second area 2A.

The sizes of the first region 1A and the second region 2A of the first substrate 110 may be different from each other. In detail, the size of the second area 2A may be smaller than the size of the first area 1A. More specifically, the connecting surface connecting the second area 2A with the first area 1A may be smaller than one surface of the first area 1A.

The first circuit board 310 may be disposed in the second region 2A. In addition, the first chip C1 may be mounted on the first circuit board 310. The first circuit board 310 may be disposed on the front surface of the second area 2A, or may be partially disposed on one surface.

Also, referring to FIG. 4, the second substrate 120 may include a third region 3A and a fourth region 4A.

The sizes of the third region 3A and the fourth region 4A of the second substrate 120 may be different from each other. In detail, the size of the fourth region 4A may be smaller than the size of the third region 3A. More specifically, the connecting surface connecting the fourth region 4A with the third region 3A may be smaller than one surface of the third region 3A.

The second circuit board 320 may be disposed in the fourth region 4A. Also, the second chip C2 may be mounted on the second circuit board 320. The second circuit board 320 may be disposed on the front surface of the fourth region 4A, or partially on one side of the fourth region 4A.

5 to 7 are views showing a fingerprint sensor according to a third embodiment. In the description of the fingerprint sensor according to the third embodiment, descriptions similar to those of the first embodiment described above will be omitted.

Referring to FIG. 5, the first substrate 110 of the fingerprint sensor according to the third embodiment may include a first area 1A and a second area 2A.

The sizes of the first region 1A and the second region 2A of the first substrate 110 may be different from each other. In detail, the size of the second area 2A may be smaller than the size of the first area 1A. The length of the connecting surface connecting the second region 2A and the first region 1A may correspond to the length of one surface of the first region 1A or one surface of the second region 2A have.

The first circuit board 310 may be disposed in the second region 2A. In addition, the first chip C1 may be mounted on the first circuit board 310. The first circuit board 310 may be disposed on the front surface of the second area 2A. That is, the area of the joint area between the first circuit board 310 and the second area 2A may correspond to the area size of the first circuit board 310 or the second area 2A.

Also, referring to FIG. 6, the second substrate 120 may include a third region 3A and a fourth region 4A.

The sizes of the third region 3A and the fourth region 4A of the second substrate 120 may be different from each other. In detail, the size of the fourth region 4A may be smaller than the size of the third region 3A. The length of the connecting surface connecting the fourth region 2A and the third region 3A may correspond to one side of the third region 3A or one side of the fourth region 4A have.

The second circuit board 320 may be disposed in the fourth region 4A. Also, the second chip C2 may be mounted on the second circuit board 320. The second circuit board 320 may be disposed on the front surface of the fourth region 4A. That is, the size of the junction area between the second circuit board 320 and the fourth region 4A may correspond to the size of the area of the second circuit board 320 or the fourth region 4A. 7, the first substrate 110 and the second substrate 120 may overlap each other. For example, the first substrate 110 and the second substrate 120 may have a size corresponding to each other, and the first substrate 110 and the second substrate 120, which are disposed on the first substrate 110 and the second substrate 120, 1 sensing unit 211 and the second sensing unit 221 may be overlapped with each other.

The first substrate 110 and the second substrate 120 may be adhered to each other by using an optical transparent adhesive 600 or the like.

After the first substrate 110 and the second substrate 120 are overlapped and adhered to each other, the second region 2A of the first substrate 110 and the second region 120 of the second substrate 120 The fourth region 4A may be bent or bent in the rear direction of the first region or in the rear direction of the third region, respectively. In detail, the second region 2A and the fourth region 4A may be folded in the same direction.

For example, when the second substrate 120 is disposed on the first substrate 110 as shown in FIG. 9, the first substrate 110 includes a first surface on which the first electrode 210 is disposed, A second face opposite to the first face can be defined. The second region 2A and the fourth region 4A may be bent in the direction of the second surface of the first substrate 110.

The second region 2A and the fourth region 4A are bent by 180 degrees in the second surface direction of the first substrate 110 and the second surface of the second substrate 120, 2 substrate 120 on which the second electrode 220 is not disposed.

The first circuit board 310 and the second circuit board 320 disposed in the second area 2A and the fourth area 4A can be disposed in the second surface direction, .

In the fingerprint sensor according to the first and second embodiments, the first substrate and the second substrate are bonded together in the same manner as in the third embodiment, and the second region and the fourth region can be folded in the same direction.

FIG. 8 is a plan view of the folded fingerprint sensor, showing the front face of the fingerprint sensor, and FIG. 9 is a sectional view taken along the line A-A 'of FIG.

8 and 9, the first sensing unit 211 and the second sensing unit 221, which extend in different directions, may be disposed on the front surface of the fingerprint sensor so as to cross each other.

8 and 9 illustrate that the second sensing unit 221 is disposed on the first sensing unit 211. However, the present invention is not limited to this, 1 substrate 110 may be disposed and the first sensing unit 221 may be disposed on the second sensing unit 221.

Fig. 10 is a plan view of the folded fingerprint sensor, showing the back surface of the fingerprint sensor. Fig.

Referring to FIG. 10, on the rear surface of the fingerprint sensor, that is, on the second substrate 120, the first circuit substrate 310 of the second region 2A and the second circuit 120 of the fourth region 4A, The substrate 320 may be disposed. The first chip C1 may be mounted on the first circuit board 310 and the second chip C2 may be mounted on the second circuit board 320. [

The first chip C1 and the second chip C2 may be connected to the third chip C3 on the second surface of the first substrate 110, that is, on the rear surface of the fingerprint sensor.

For example, the first chip C1 and the second chip C2 may be a fingerprint recognition drive chip, and the third chip C3 may be a main board drive chip. That is, the fingerprint recognition drive chip may be connected to an external mainboard drive chip. A first connection part 410 and a second connection part 420 are connected to one end of the first circuit board 310 and the second circuit board 320, And the second chip C2 is connected to the second connection wiring 520 connected to the second connection part 420. The second connection wiring 520 is connected to the second connection part 420 by the first connection wiring 510 connected to the first connection part 410, ) Connected to the third chip (C3).

In the fingerprint sensor according to the embodiment, two circuit boards on which chips are mounted are disposed in one region on two substrates, and a chip region connected to each electrode is bent on the back surface of the substrate by bending a substrate region where the circuit substrate is disposed can do.

That is, a first circuit board and a second circuit board, each of which mounts a chip on one region of the first board and the second board, are arranged, and the first circuit board and the second circuit board can be bent in the direction of the main board driving chip .

Therefore, the fingerprint recognition driving chip and the main board driving chip or the first and second electrodes and the main board driving chip can be connected by the shortest distance.

In the case of a fingerprint sensor, the distance between the sensing unit and the chip must be short in order to detect a minute cap change, and as the distance between the sensing unit and the chip increases, the touch sensitivity of the fingerprint sensor deteriorates .

Accordingly, since the fingerprint sensor according to the embodiment can reduce the distance between the distance chip and the electrode, that is, the distance between the chip and the sensing units, to a minimum, noise due to the distance difference between the chip and the sensing units can be reduced, The touch characteristics and the reliability of the touch panel can be improved.

Hereinafter, an example of a display device to which a touch window including a fingerprint sensor according to the above-described embodiments is applied will be described with reference to FIGS. 11 to 14. FIG.

The fingerprint sensor according to the embodiments can be applied to the locking device. For example, the fingerprint sensor according to the embodiments can be applied to electronic products and the like as a locking device.

In detail, as shown in Fig. 11, the fingerprint sensor according to the embodiments can be applied to the door lock by being coupled to the door lock. Or may be applied to a locking device of a mobile phone in combination with a mobile phone as shown in FIG.

Alternatively, the fingerprint sensor according to the embodiments may be applied to a power supply apparatus. For example, the fingerprint sensor according to the embodiments can be applied to household appliances, vehicles, and the like.

It can be coupled to a home appliance such as an air conditioner as a power supply device in detail, as shown in Fig. Alternatively, as shown in FIG. 14, the present invention can be applied to a vehicle, such as a starting device of a vehicle, and a power supply device such as a car audio.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (12)

A first substrate;
A second substrate on the first substrate;
A first electrode and a first chip on the first substrate; And
And a second electrode on the second substrate and a second chip. The method according to claim 1,
Wherein the first substrate comprises a first region and a second region,
The second substrate includes a third region and a fourth region,
Wherein the first electrode is disposed on the first region,
Wherein the first chip is disposed on the second region,
The second electrode is disposed on the third region,
And the second chip is disposed on the fourth region. 3. The method of claim 2,
A first circuit board is disposed on the second region, the first chip is disposed on the first circuit board,
A second circuit substrate is disposed on the fourth region, and the second chip is disposed on the second facing substrate. The method of claim 3,
Wherein the first substrate includes a first surface on which the first electrode is disposed and a second surface opposite to the first surface,
Wherein the first chip and the second chip are connected to the third chip on the second surface. The method of claim 3,
And the second region and the fourth region are folded in the same direction. 6. The method of claim 5,
And the second region and the fourth region are folded in the second surface direction. The method of claim 3,
Wherein the electrode includes a sensing portion and a wiring portion,
Wherein the sensing unit includes a first sensing unit disposed on the first area and a second sensing unit disposed on the third area,
Wherein the wiring portion includes a first wiring portion disposed on the first excitation plate and a second wiring portion disposed on the second substrate. 8. The method of claim 7,
Wherein the first wiring portion extends from the first region toward the second region, and the second wiring portion extends from the third region to the fourth region. 9. The method of claim 8,
Wherein the first wiring portion is connected to the first sensing portion in the first region, is connected to the first chip in the second region,
Wherein the second wiring portion is connected to the second sensing portion in the third region and is connected to the second chip in the fourth region. 8. The method of claim 7,
Wherein the first sensing unit and the second sensing unit extend in different directions from each other. 5. The method of claim 4,
And the third chip includes a mainboard chip. A touch device comprising a fingerprint sensor according to any one of claims 1 to 11.

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