KR20160014493A - Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche - Google Patents

Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche Download PDF

Info

Publication number
KR20160014493A
KR20160014493A KR1020140096816A KR20140096816A KR20160014493A KR 20160014493 A KR20160014493 A KR 20160014493A KR 1020140096816 A KR1020140096816 A KR 1020140096816A KR 20140096816 A KR20140096816 A KR 20140096816A KR 20160014493 A KR20160014493 A KR 20160014493A
Authority
KR
South Korea
Prior art keywords
adhesive
layer
adhesive layer
substrate
pattern layer
Prior art date
Application number
KR1020140096816A
Other languages
Korean (ko)
Inventor
김사라
이승헌
성지현
이기석
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to KR1020140096816A priority Critical patent/KR20160014493A/en
Publication of KR20160014493A publication Critical patent/KR20160014493A/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F1/00Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed
    • B41F1/16Platen presses, i.e. presses in which printing is effected by at least one essentially-flat pressure-applying member co-operating with a flat type-bed for offset printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F13/00Common details of rotary presses or machines
    • B41F13/08Cylinders
    • B41F13/10Forme cylinders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F3/00Cylinder presses, i.e. presses essentially comprising at least one cylinder co-operating with at least one flat type-bed
    • B41F3/46Details
    • B41F3/51Type-beds; Supports therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a cliche, a printing apparatus including the same, a printing method using the same, and a manufacturing method thereof. The cliche comprises: a substrate; an adhesive layer which is formed on the substrate and maintains durability against delamination to an organic amine-based stripper for 24 hours or more at an ordinary temperature; and a pattern layer which is formed on the adhesive layer and has engraved parts.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cliche, a printing apparatus including the cliche, a printing method using the same, and a manufacturing method of the cliche.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cliche, a printing apparatus including the same, a printing method using the same, and a manufacturing method of the cliche.

In reversed offset printing, a glass cloce has been mainly used in the past. However, in the case of the glass cloak, the work is inconvenient because it is broken well, and once it is broken, there is a problem that the expensive laser exposure process must be newly performed again.

On the other hand, in order to improve the productivity in the inversion offset process, the tact time must be reduced, and a plurality of cloakers are required for this. As the number of cliches increases, the manufacturing process cost increases, and in particular, the glass cliches have a problem that cliche production cost is large and cloning is not easy.

In the conventional reverse offset printing process, a process of cleaning the printing plate is essential. Because of its strong cleaning ability, it has a high cleaning speed and does not cause any damage to the conventional glass printing plate. Therefore, it is cleaned with a stripper (stripping liquid) .

In the reversal offset printing, when a UV-curable resin layer is formed on a glass substrate instead of a glass cliche and the mold imprinted with the pattern on the resin layer is used as it is, in the process of cleaning the stripper with organic amine, There is a problem that the resin layer is easily removed.

In order to improve the adhesion between the resin layer and the glass substrate, a primer-treated substrate may be used. However, the primer giving the adhesion force currently used is peeled off when exposed to a high temperature and long time in a stripper containing an organic amine.

Korean Patent Application Publication No. 20090031337

The present invention provides a cliche, a printing apparatus including the cliche, a printing method using the same, and a manufacturing method of the cliche.

A first embodiment of the present disclosure relates to a semiconductor device comprising: a substrate; An adhesive or adhesive layer provided on the substrate and having an exfoliation durability against an organic amine-based stripper at room temperature for 24 hours or more; And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.

A second embodiment of the present disclosure relates to a semiconductor device comprising: a substrate; An adhesive or adhesive layer provided on the substrate and having a thickness of 1 占 퐉 or more; And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.

A third embodiment of the present disclosure relates to a semiconductor device comprising: a substrate; An adhesive or adhesive layer provided on the substrate and having a gel content of 50% or more; And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.

A further embodiment of the present disclosure provides a method of manufacturing a cliche according to the first through third embodiments.

A further embodiment of the present invention provides a printing apparatus including a cliche according to the first to third embodiments.

A further embodiment of the present disclosure provides a printing method using a cliche according to the first to third embodiments.

A further embodiment of the present disclosure provides a method of making a duplicate cliche using a cliche according to the first through third embodiments.

Since the cliche according to the embodiments of the present disclosure has chemical resistance, even when used in a printing method or a cliche replication method in which the cleaning solution is repeatedly exposed to a specific cleaning liquid such as an organic amine, such as an inversion offset printing method, Lt; / RTI > In addition, the cliche according to the embodiments of the present invention is easier to manufacture than the glass cliche, so that the manufacturing cost is low and the cliche cliche can be easily manufactured. In addition, the cliques according to some embodiments of the present disclosure have dimensional stability and excellent printability. Further, when a cliche according to some embodiments of the present specification is used, it is possible to contribute to the reduction of the process cost and the productivity improvement due to excellent chemical resistance and / or printing property.

1 is a cross-sectional view of a cliche according to one embodiment of the present disclosure;
2 is a cross-sectional view of a cliche according to another embodiment of the present disclosure;
3 is a schematic diagram of a process for manufacturing a cliche according to another embodiment of the present invention.
4 illustrates a configuration of a printing apparatus according to an embodiment of the present invention.
5 and 6 are photographs showing the chemical resistance of the clay produced in Example 1 and Comparative Example 1, respectively.
7 is a photograph of a pattern formed as a result of printing using the clay produced in Example 1. Fig.

Hereinafter, the present invention will be described in detail.

[First Embodiment]

A first embodiment of the present disclosure relates to a semiconductor device comprising: a substrate; An adhesive or adhesive layer provided on the substrate and having an exfoliation durability against an organic amine-based stripper at room temperature for 24 hours or more; And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.

In the first embodiment, the peeling durability means that the adhesive force is maintained at 20% or more of the initial adhesive force after the clay having the adhesive or adhesive layer is immersed in an organic amine-based stripper for 24 hours. At this time, the adhesive force after immersing for 24 hours is a value obtained by immersing the cliché having the adhesive or adhesive layer in an organic amine type stripper for 24 hours, washing with distilled water and drying with an air knife. The adhesive strength can be measured by the peel test method. Specifically, the adhesive force can be measured using a 180 ° peel test method using a Texture Analyzer (TA instrument, TA.XT.PLUS). The normal temperature means a temperature of the natural state as it is not heated or cooled. In the present specification, the temperature is selected from the range of 30 degrees to 23 degrees.

In the first embodiment of the present invention, the adhesive or adhesive layer is characterized in that the peeling durability to an organic amine-based stripper is 24 hours or more. Conventionally, a method of directly coating or transferring a resin layer on a substrate has been used. According to the first embodiment, an adhesive or adhesive layer having the above-described peeling durability is provided between the substrate and the pattern layer.

The sticking or peeling durability of the adhesive layer can be realized by sticking or selecting or thickness of the material of the adhesive layer or the like.

According to one embodiment, the thickness of the adhesive or adhesive layer is at least 1 mu m. Conventionally, in order to increase the adhesive force between the substrate and the resin layer, general vapor deposition type primer treatment has been performed. However, there is a limit to the improvement of the adhesive strength by the surface treatment or the primer treatment, and they can improve the adhesive strength, but they do not have a great effect in improving the peeling durability against the cleaning liquid such as the above-mentioned organic amine. According to the embodiment of the present invention, the above-described peel-off durability can be realized by using an adhesive or adhesive layer having a thickness of a certain level or more.

According to another embodiment, the thickness of the adhesive or adhesive layer is 1 占 퐉 or more and 200 占 퐉 or less.

According to another embodiment, the gel content of the adhesive or adhesive layer is at least 50%. Here, the gel content refers to the content of the insoluble component which is insoluble in the solvent in the adhesive or adhesive layer, and can be a measure of chemical resistance. According to the above-described embodiment, by using the adhesive or adhesive layer having a relatively high gel content, it is possible to realize the above-described peeling durability. According to one example, the solvent for identifying the insoluble component is methanol or hexane.

According to another embodiment, the gel content of the adhesive or adhesive layer is 50% or more and 99.5% or less. When the gel content is 99.5% or less, sticking or sticking or adhesion of the adhesive layer can be retained.

According to another embodiment, the thickness of the adhesive or adhesive layer is 1 占 퐉 or more and the gel content is 50% or more.

According to another embodiment of the present invention, the thickness of the adhesive or adhesive layer is 1 占 퐉 to 200 占 퐉, and the gel content is 50% to 99.5%.

According to another embodiment, the adhesive or adhesive layer is of the thermosetting or ultraviolet curing type.

According to another embodiment, the adhesive or adhesive layer has a storage shear modulus (G ') of about 30,000 to 100,000 Pa. When the pre-stage number of adhesion or the storage layer of the adhesive layer is 100,000 Pa or less, the viscosity of the adhesive or the resin constituting the adhesive layer is not high, and thus the resin has excellent processability. Even when the printing process is repeated, Cracks can be prevented from being generated. In addition, when the adhesive or adhesive layer has a storage shear rate of 30,000 Pa or more, it is possible to prevent the adhesive layer from being easily deformed even when the pressure is increased during printing.

According to another embodiment, the adhesive or adhesive layer is not particularly limited as long as it is a material capable of imparting adhesive performance. For example, the adhesive or adhesive layer comprises an adhesive or adhesive resin or an organic hybrid adhesive or adhesive material. As an example, the adhesive or adhesive layer may comprise a photo-curable material of a photo-curable monomer, an oligomer, a polymer, or an organic hybrid material.

Specifically, the adhesive or adhesive layer may include an acrylate adhesive resin, an epoxy adhesive resin, an urethane adhesive resin, a polyester adhesive resin, a silicone adhesive resin, a thiol-ene curing system, And may include an organic or inorganic hybrid material including Si and the like.

The acrylate adhesive resin may include a photopolymerizable compound such as a polyfunctional (meth) acrylate monomer, a polyfunctional (meth) acrylate oligomer, a monofunctional (meth) acrylate monomer, and a monofunctional (meth) acrylate oligomer have. Light cured cargo means a cured material reacted with a photoinitiator such as a UV initiator.

More specifically, the adhesive or adhesive layer may be formed of a material selected from the group consisting of 2-ethylhexyl acrylate, isobornyl acrylate, hexanediol diacrylate, di-trimethylolpropane tetra-acrylate, 3- glycidoxypropyltrimethoxysilane, Ethyl acrylate, isophorone diisocyanate and the like can be used in combination with alpha, alpha-dimethoxy-alpha-phenylacetophenone (trade name Irgacure 651), 1 -hydroxy-cyclohexyl phenyl ketone, diphenyl (2,4,6-trimethylbenzoyl) And a UV initiator such as phosphine oxide.

As another specific example, the adhesive or adhesive layer includes a resin cured by reacting a polydimethylsiloxane having a vinyl group with a vinyl group and a polydimethylsiloxane having a hydroxysilane group as a silicone-based adhesive or adhesive resin under a platinum-based catalyst, Or at high temperatures.

According to one embodiment, the adhesive strength of the adhesive or adhesive layer to the substrate is 30 N / 100 mm or more as measured by the ASTM D3330 method.

According to one embodiment, the adhesive strength of the adhesive or adhesive layer to the pattern layer is very high and is not measurable in the full strength test as measured by the ASTM D3330 method.

According to one embodiment of the present invention, the pattern layer having the engraved portion includes a resin or an organic hybrid material.

According to one embodiment, the pattern layer having the engraved portion includes a resin or an organic hybrid material including Si.

According to one embodiment, the pattern layer having the engraved portion includes at least one functional group selected from an OH group, an epoxy group, an amide group, a urethane group, and ethylene oxide.

According to one embodiment, the pattern layer having the engraved portion includes a resin containing at least one functional group selected from an OH group, an epoxy group, an amide group, a urethane group and ethylene oxide.

According to one embodiment, the pattern layer having the engraved portion includes a photocured product of a photocurable resin. The composition for forming the pattern layer having the engraved portion may include a photo-curable monomer, an oligomer or a polymer, and a photoinitiator. The composition may further comprise an organic hybrid material or solvent such as a photoreactive release agent, an inorganic material, or a Si-based polymer.

As an example, the pattern layer having the depressed portion may be at least one selected from the group consisting of tetrakis (3-mercaptopropionate) pentaerythritol, diethylene glycol dimethacrylate, bis (3-mercaptopropyl) dimethylsilane, Triacrylate and the like can be mixed with a photo-curable material such as alpha, alpha-dimethoxy-alpha-phenylacetophenone (trade name Irgacure 651), 1 -hydroxy-cyclohexyl phenyl ketone, diphenyl (2,4,6-trimethylbenzoyl) Or by using a UV initiator such as pin oxide.

 As another example, the pattern layer having the engraved portions may be formed by a composition comprising a (meth) acrylate multifunctional monomer, an acrylamide monomer, and a photoinitiator. More specifically, the pattern layer having the engraved portion may be at least one selected from the group consisting of N, N-dimethylacrylamide, 2-hydroxypropyl acrylate, N-vinyl-2-pyrrolidone, 2,4-diisocyanato- (Trade name: Darocur 1173), alpha, alpha-dimethoxy-alpha-phenylacetophenone (trade name Irgacure 651), 1-hydroxy-2-methyl- -Cyclohexyl phenyl ketone, and diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide.

According to one embodiment, the pattern layer having the engraved portion comprises an organic hybrid material containing Si, and the adhesive or adhesive layer comprises a silane-based adhesive. The silane-based adhesive may be formed by a composition comprising polydimethyl / methylvinyl siloxane as a main material and diluted with a solvent such as xylene or toluene. The curing agent includes a Pt catalyst, and the viscosity of the pressure-sensitive adhesive layer material before curing is 5000 to 15000 mP · s.

As another example, the pattern layer having the engraved portion includes a urethane group, and the adhesive or adhesive layer includes an optical transparent adhesive (OCA). The pattern layer having the engraved portion may be a polyfunctional acrylate such as N, N-dimethylacrylamide, 2-hydroxypropyl acrylate or PETA-triacrylate, N-vinyl-2-pyrrolidinone, Isocyanato-1-methylbenzene, photoinitiators, plasticizers, and the like. The adhesion or adhesion layer may be formed of a material selected from the group consisting of 2-ethylhexyl acrylate, isobornyl acrylate, 3-glycidoxypropyltrimethoxysilane, hydroxyethylacrylate, Irgacure 651, isophorone diisocyanate (isophorone diisocyanate).

According to one embodiment, the thickness of the pattern layer is 5 占 퐉 or more and 200 占 퐉 or less. The thickness of the pattern layer has a thickness equal to or greater than a thickness of the mold for forming a depressed portion in the pattern layer and is preferably 200 m or less in order to minimize cracks or curl of the substrate.

According to another embodiment of the present invention, the substrate may have a dimensional change rate of 0.5% or less, preferably 0.1% or less. Due to such physical properties, the substrate is minimally deformed according to the number of times of copying or printing. In order to secure dimensional stability, dimensional changes due to the number of replications must be minimized during the primary or secondary replication to make the clone. Therefore, it is preferable to replicate using a glass substrate or a thick plastic substrate of 1T or more, and it is preferable to produce a replica cliche targeted with one replica.

The thickness of the substrate can be adjusted as required, for example, a thickness of about 1T to 3T, and a thickness that is convenient for a human to handle with less risk of breakage.

According to another embodiment, a substrate made of glass, PET (polyethylene terephthalate), or PC (polycarbonate) may be used as the substrate. Glass has almost no dimensional deformation even when the number of copies or prints is increased, and PCs of 1T or more have almost no dimensional change due to their thickness. In addition, when a thick glass having a thickness of 1T or more is used, it is more advantageous to prevent breakage. A laminated structure of a cliche according to an example using glass as a substrate is illustrated in Fig.

According to another embodiment, the substrate may be a laminated structure including two sheets of glass and a bonding resin provided between the two sheets of glass. The bonding resin is not particularly limited, and for example, EVA (ethylene vinyl acetate) may be used. A laminated structure of a cliche according to an example using a glass / EVA / glass laminated structure as a substrate is illustrated in Fig.

[Second Embodiment]

A second embodiment of the present disclosure relates to a semiconductor device comprising: a substrate; An adhesive or adhesive layer provided on the substrate and having a thickness of 1 占 퐉 or more; And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.

According to the second embodiment of the present invention, since the thickness of the pressure-sensitive adhesive or pressure-sensitive adhesive layer is 1 占 퐉 or more, it can have chemical resistance, and thereby it is used in a clay replica or printing method in which a cleaning liquid such as an organic amine is used several times It is possible to prevent the pattern layer from being removed.

According to another embodiment, the gel content of the adhesive or adhesive layer is at least 50%. According to another embodiment, the gel content of the adhesive or adhesive layer is from 50% to 99.5%.

In addition, the description of the adhesion or the adhesive layer, the pattern layer and the substrate in the above-described first embodiment can also be applied to the second embodiment.

[Third Embodiment]

A third embodiment of the present disclosure relates to a semiconductor device comprising: a substrate; An adhesive or adhesive layer provided on the substrate and having a gel content of 50% or more; And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.

According to the third embodiment of the present invention, since the gel content of the pressure-sensitive adhesive or pressure-sensitive adhesive layer is 50% or more, it is possible to have chemical resistance, whereby a clay replica or printing method It is possible to prevent the pattern layer from being removed.

According to another embodiment, the gel content of the adhesive or adhesive layer is from 50% to 99.5%.

In addition, the description of the adhesion or the adhesive layer, the pattern layer and the substrate in the above-described first embodiment can also be applied to the third embodiment.

[Production method of clay (1)]

As a method of manufacturing a cliche in accordance with the above-described embodiments,

Forming an adhesive or adhesive layer on the substrate; And

Forming a pattern layer having a depressed portion on the adhesive or adhesive layer

The present invention provides a method of producing a cliche comprising the steps of:

The step of forming the adhesive or adhesive layer may include the step of laminating an adhesive or an adhesive film on the substrate.

The step of forming the adhesive or adhesive layer may include a step of coating the adhesive or adhesive composition on the substrate. If necessary, after the coating, a drying or curing step may be further carried out.

The peeling durability, thickness, gel content, material, etc. of the adhesive or adhesive layer are as described above in connection with the first to third embodiments.

Wherein the forming of the pattern layer comprises: applying the composition for pattern layer on the adhesive or adhesive layer; And forming a pattern on the surface of the composition using a mold.

The composition for a pattern layer includes a thermosetting or ultraviolet ray curing resin. And may further contain a polymerization initiator and a solvent as required.

The step of forming the pattern includes curing the composition for a pattern layer. For example, when the composition for a pattern layer includes a resin for ultraviolet curing, a pattern corresponding to the mold can be formed by ultraviolet curing. If necessary, a pressurized or vacuumed atmosphere can be formed during curing.

The step of forming the pattern layer may further include removing the air bubbles inside the composition for a patterned layer applied before the pattern is formed using the mold after the composition for a pattern layer is applied.

The pattern layer may be formed by patterning the mold and removing the mold.

The material, thickness, etc. of the pattern layer are as described above in connection with the first to third embodiments.

 [Production method of clay (2)]

As a method of manufacturing a cliche in accordance with the above-described embodiments,

Forming a pattern layer on the patterned mold;

Forming an adhesive or adhesive layer and a substrate on the pattern layer; And

Removing the patterned mold from the pattern layer

The present invention provides a method of producing a cliche comprising the steps of:

The step of adhering or forming the adhesive layer and the substrate on the pattern layer

Forming an adhesive or adhesive layer on the substrate; And

Attaching the surface of the substrate on which the adhesive layer or adhesive layer is formed on the pattern layer

. ≪ / RTI >

The step of adhering or forming the adhesive layer and the substrate on the pattern layer

Forming an adhesive or adhesive layer on the pattern layer; And

Forming a substrate on the adhesive or adhesive layer

. ≪ / RTI >

The step of forming the adhesive or adhesive layer may include the step of laminating an adhesive or an adhesive film on the substrate or the pattern layer.

The step of forming the adhesive or adhesive layer may include a step of coating the adhesive or adhesive layer composition on the substrate or the pattern layer. If necessary, after the coating, a drying or curing step may be further carried out.

The step of forming a pattern layer on the patterned mold may include: applying a composition for a pattern layer on the patterned mold; And curing the composition for the applied pattern layer.

The composition for a pattern layer includes a thermosetting or ultraviolet ray curing resin. And may further contain a polymerization initiator and a solvent as required. For example, when the composition for a pattern layer includes a resin for ultraviolet curing, a pattern corresponding to the mold can be formed by ultraviolet curing. If necessary, a pressurized or vacuumed atmosphere can be formed during curing. After performing the curing, the mold is removed.

The step of forming the pattern layer may further include removing the air bubbles inside the composition for a patterned layer applied before the pattern is formed using the mold after the composition for a pattern layer is applied.

The description of the adhesive or adhesive layer and the pattern layer is as described above in connection with the first to third embodiments.

[printer]

The present disclosure provides a printing apparatus including a cliche according to the above described embodiments.

According to one embodiment, the printing apparatus comprises a printing roll; A coating portion adapted to coat the printing composition on the printing roll; The printing press according to any one of the preceding claims, further comprising a printed substrate stage for transferring the printing composition coated on the printing roll to a substrate, wherein the cliche contacts the printing substrate coated with the printing roll, Roll.

According to one embodiment, the cliche is located between the printing roll and the substrate stage to contact the surface of the cliche as the printing roll moves.

The printing roll, the coated portion, and the printed substrate stage may have a configuration known in the art. FIG. 4 illustrates a printing apparatus according to an embodiment. 4, a coating composition 10 is used to coat the printing composition 22 onto a printing roll comprising a roll support 20 and a printing blanket 21, which is applied to the pattern layer 31 of the cliche 30, To remove some of the printing composition, and then the printing composition 41 is transferred onto the substrate provided on the print substrate stage 40.

 [Printing method]

The present specification provides a printing method using the cliche.

According to one embodiment,

Coating a printing composition on a printing roll;

The printing roll coated with the printing composition is brought into contact with the cliche described above to remove the printing composition in contact with the cliche from the printing roll; And

And transferring the printing composition remaining on the printing roll to the substrate.

The printing method is an inverse offset printing method, and methods and conditions known in the art can be applied, except that the cliche according to the above-described embodiments is used.

[Production method of clone clone]

The cliche according to the above-described embodiments may be applied to the printing process by itself, but may also be used in the process of manufacturing the cliche cliche.

A manufacturing method of a duplicate cliche according to an embodiment

Forming a thermosetting or ultraviolet curable resin layer on the substrate;

Forming a pattern on the thermosetting or ultraviolet-curable resin layer using a cliche according to the above-described embodiments;

Curing the thermosetting or ultraviolet-curable resin layer to produce a mold; And

And producing a duplicate cliche using the mold.

The step of producing the replica cliche may be carried out by applying the description described in the above-mentioned methods (1) and (2) of manufacturing the cliche, except that the mold is manufactured using the cliche according to the embodiments of the present invention as described above .

According to one embodiment, two or more molds may be used, or two or more molds may be used to produce a cliche having a pattern in two or more areas of the area of the mold. Such a process is called a stitch process, and a process schematic diagram using the process is illustrated in FIG.

Example

Hereinafter, the embodiments described in this specification will be described by way of examples. However, the following examples are intended to illustrate the invention and are not intended to limit the scope of the invention.

[Prepare for Cleansing]

A glass-made mother cliche was prepared. A mother liquor was immersed in a 0.3 wt% solution of perfluorooctyltrichlorosilane in hexane for 2 hours, washed sequentially with hexane and acetone, and blow-dried.

[Primary Mold Manufacture]

The photo-curable perfluoropolyether mold composition was applied to the side having the pattern of the mother cliche. A primed PET substrate (Skyro SH34, SKC) was laminated to the surface to which the composition was applied. The laminated mother lacquer and PET substrate were placed in a vacuum chamber to remove microbubbles present in the mold composition. The composition was then cured by ultraviolet irradiation and the mother clay was removed.

[Manufacture of Cleanse]

Example  One

A mixed pressure-sensitive adhesive sheet of an epoxy-based, urethane-based, and acrylic-based polymer was laminated on a glass substrate. A photocurable urethane acrylate composition (Minutatech, Gyeonggi Province) as a composition for a pattern layer was evenly applied on the adhesive sheet, and the primary mold was coated thereon. After allowing the composition for the pattern layer to uniformly spread between the primary mold and the substrate, the microbubbles were removed by a vacuum defoaming process. Subsequently, the composition for a pattern layer was cured by ultraviolet irradiation, and the primary mold was removed to prepare a cliche having a structure such as a mother clay.

Example  2

The procedure of Example 1 was repeated except that the adhesive sheet was not laminated and a mixed solution of a silicone adhesive resin and a curing agent was uniformly coated using a Meyer bar and then thermally cured.

Comparative Example  One

The procedure of Example 1 was repeated except that the pressure-sensitive adhesive sheet was not formed.

The results of chemical resistance evaluation of the clay produced in Example 1 and Comparative Example 1 are shown in FIG. 5 and FIG. 6, respectively. The prepared clithe were left under organic washing conditions for 24 hours. Specifically, the cleansing process for the organic cleansing is performed by placing the cleanser in a cleansing agent, placing the cleanser in a strip zone for 24 hours, rinsing in a DIW rinse zone, and finally removing water remaining as an air knife . LGS-202 manufactured by LG Chemical Co., Ltd. was used as the detergent, which is an organic cleaning type detachment solution containing an organic amine compound and NMF (N-methylformamide).

The pattern obtained by performing the printing process using the clay prepared in Example 1 is shown in Fig.

Claims (24)

Board;
An adhesive or adhesive layer provided on the substrate and maintained in peeling durability against an organic amine-based stripper at room temperature for 24 hours or more; And
And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.
The clay, according to claim 1, wherein the adhesive or adhesive layer has a thickness of at least 1 탆. The clay according to claim 1, wherein the adhesive or adhesive layer has a gel content of 50% or more. The clay according to claim 1, wherein the adhesive or adhesive layer has a gel content of 50% to 99.5%. Board;
An adhesive or adhesive layer provided on the substrate and having a thickness of 1 占 퐉 or more; And
And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.
7. The closure of claim 5, wherein the adhesive or adhesive layer has a gel content of at least 50%. The clay according to claim 5, wherein the adhesive or adhesive layer has a gel content of 50% to 99.5%. Board;
An adhesive or adhesive layer provided on the substrate and having a gel content of 50% or more; And
And a pattern layer provided on the adhesive or adhesive layer and having a depressed portion.
The clay according to claim 8, wherein the adhesive or adhesive layer has a gel content of 50% to 99.5%. The clay according to any one of claims 1 to 9, wherein the pattern layer having the engraved portion comprises an organic hybrid material. The clay according to any one of claims 1 to 9, wherein the pattern layer having the engraved portion comprises Si. The clay according to any one of claims 1 to 9, wherein the pattern layer having the engraved portion comprises at least one functional group selected from an OH group, an epoxy group, an amide group, a urethane group and ethylene oxide. The clay, as claimed in any one of claims 1 to 9, wherein the pattern layer with the engraved portion comprises an organic hybrid material comprising Si and the adhesive or adhesive layer comprises a silane-based adhesive. The clay, according to any one of claims 1 to 9, wherein the pattern layer having the engraved portion comprises a urethane group, an acrylate group, and the adhesive or adhesive layer comprises an optical transparent adhesive (OCA). The clay according to any one of claims 1 to 9, wherein the adhesive strength of the adhesive or adhesive layer to the substrate is 30 N / 100 mm or more as measured by ASTM D3330 method. The claychee according to any one of claims 1 to 9, wherein the pre-storage of the adhesive or adhesive layer is 30,000 Pa or more and 100,000 Pa or less. The clay according to any one of claims 1 to 9, wherein the rate of dimensional change of the substrate is 0.1% or less. The clay according to any one of claims 1 to 9, wherein the thickness of the pattern layer is 1 占 퐉 or more and 200 占 퐉 or less. The clay according to any one of claims 1 to 9, wherein the thickness of the substrate is 1T or more and 3T or less. Forming an adhesive or adhesive layer on the substrate; And
A method according to any one of claims 1 to 9, comprising the step of forming a pattern layer having a depressed portion on the adhesive or adhesive layer.
Forming a pattern layer on the patterned mold;
Adhering or sticking the adhesive layer and the substrate onto the pattern layer; And
And removing the patterned mold from the pattern layer. ≪ RTI ID = 0.0 > 11. < / RTI >
A printing apparatus comprising a cliche according to any one of claims 1 to 9. 23. The printing apparatus according to claim 22,
Printing roll;
A coating portion adapted to coat the printing composition on the printing roll;
Further comprising a print stage provided so that the printing composition coated on the printing roll is transferred to the substrate,
Wherein the clithe is configured to contact the printing composition coated on the printing roll to remove the contacted printing composition from the printing roll.
A printing method using a cliche according to any one of claims 1 to 9.
KR1020140096816A 2014-07-29 2014-07-29 Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche KR20160014493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140096816A KR20160014493A (en) 2014-07-29 2014-07-29 Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140096816A KR20160014493A (en) 2014-07-29 2014-07-29 Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche

Publications (1)

Publication Number Publication Date
KR20160014493A true KR20160014493A (en) 2016-02-11

Family

ID=55351686

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140096816A KR20160014493A (en) 2014-07-29 2014-07-29 Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche

Country Status (1)

Country Link
KR (1) KR20160014493A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090031337A (en) 2007-09-21 2009-03-25 주식회사 엘지화학 Method for etching glass or metal substrates using negative photoresist and method for fabricating cliche using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090031337A (en) 2007-09-21 2009-03-25 주식회사 엘지화학 Method for etching glass or metal substrates using negative photoresist and method for fabricating cliche using the same

Similar Documents

Publication Publication Date Title
US20170320261A1 (en) Method for Producing Patterned Materials
KR100929381B1 (en) Mold sheet composition and mold sheet manufacturing method using the same
US8475892B2 (en) Transfer film and method of manufacturing same
KR20040088977A (en) Composition for mold used in forming micropattern, and mold prepared therefrom
TW445289B (en) Easily peelable adhesive film
JP5877786B2 (en) Photocurable fluorine-containing resin composition and method for producing resin mold using the same
JPWO2007074778A1 (en) Surface protection film
KR20180132374A (en) Decoration sheet
KR101307134B1 (en) Release film for transcribing pattern, transcription film for patterning and patterning method using the same
KR20020063818A (en) Adhesive tape and process for removing resist
KR20090084340A (en) Photocurable resin composition and method for preparing of mold using the same
KR20160014493A (en) Cliche, printing apparatus comprising the same, pringting method using the same, and method for preparing cliche
TWI382278B (en) Mold film composition for forming pattern and mold film manufactured by using the same
JP6247826B2 (en) Photo-curable resin composition for imprint molding
KR102130323B1 (en) Manufacturing method of pattern film using functional materials and transfer method of pattern film using functional materials
JP2014210362A (en) Blanket for offset printing, and method for producing the blanket
KR101772612B1 (en) Photocurable resin mold composition for imprint lithography
KR101820087B1 (en) Photocurable resin composition
JP2013116577A (en) Transfer sheet for transfer printing, and method for manufacturing the same
US20240053677A1 (en) Apparatus and Method for Structured Replication and Transfer
JP5512153B2 (en) Microstructure manufacturing method
JP5463072B2 (en) Microstructure manufacturing method
JP2008246702A (en) Image forming method
JP6135040B2 (en) Photosensitive resin relief printing plate precursor
JP2004331795A (en) Hard coating layer-laminated film and display device substrate using the same

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination