KR20160013371A - Heatsink and Method for Manufacturing the Heatsink, Lead-frame Assembly for Electronic Component Package Having the Heatsink and Method for Manufacturing the Lead-frame Assembly - Google Patents

Heatsink and Method for Manufacturing the Heatsink, Lead-frame Assembly for Electronic Component Package Having the Heatsink and Method for Manufacturing the Lead-frame Assembly Download PDF

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Publication number
KR20160013371A
KR20160013371A KR1020140094503A KR20140094503A KR20160013371A KR 20160013371 A KR20160013371 A KR 20160013371A KR 1020140094503 A KR1020140094503 A KR 1020140094503A KR 20140094503 A KR20140094503 A KR 20140094503A KR 20160013371 A KR20160013371 A KR 20160013371A
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South Korea
Prior art keywords
via holes
heat sink
conductive metal
thermally conductive
metal
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Application number
KR1020140094503A
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Korean (ko)
Inventor
손호원
도복남
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주식회사 에스에프이
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Priority to KR1020140094503A priority Critical patent/KR20160013371A/en
Publication of KR20160013371A publication Critical patent/KR20160013371A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures

Abstract

The present invention relates to a heat sink and a manufacturing method thereof, and a lead frame assembly for an electronic component package having the heat sink and a manufacturing method thereof. The heat sink has an improved structure which has a heat emitting performance for cooling an electronic component and a low thermal expansion coefficient. According to the present invention, the heat sink comprises: a body formed by sintering metal powder containing frame metal selected from tungsten and molybdenum and copper; a plurality of via holes installed in the middle of the body; and thermally conductive metal impregnated in the plurality of via holes and a gap in the body. The heat sink has a structure which fills the body with thermally conductive metal having a high thermal expansion coefficient wherein the body is based on tungsten and molybdenum so that a damage risk due to thermal expansion is small in a bonding portion and heat generated from an electronic component is quickly and efficiently discharged to the air.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a lead frame assembly for an electronic device package having a heat sink, a method of manufacturing the same and a heat sink, Assembly}

The present invention relates to a heat sink, and more particularly, to a heat sink provided in an electronic device package in which various electronic devices are mounted to dissipate heat of an electronic device, a method of manufacturing the same and a lead for an electronic device package Frame assembly and a method of manufacturing the same.

2. Description of the Related Art In recent years, electronic devices such as semiconductor chips have rapidly become miniaturized, multifunctional, high-performance, and large-capacity, and packaging technology is finally a key technology for determining the electrical performance, reliability, Importance is increasing.

Packaging technology refers to a series of processes that ultimately commercialize individual chips made in a wafer process. Generally, a semiconductor chip has many microelectronic circuits integrated therein, but it can not serve as a semiconductor finished product itself and can be damaged by external physical and chemical impacts.

Accordingly, there is a need for a packaging technique that enables a semiconductor chip to be mounted on a circuit board or the like and electrically connected to the semiconductor chip so that the semiconductor chip can be sealed and packaged so as to protect it from external moisture or impurities to function as a semiconductor. In addition, since the semiconductor chip has a precise circuit, it is vulnerable to external shocks and moisture, and it can effectively dissipate the heat generated during the operation to avoid a malfunction. Packaging also plays a role in protecting semiconductor chips from such external impacts.

Generally, the electronic device package can improve the heat emission performance by using various members such as a lead frame, a circuit film, and a heat sink, realize slenderness and shortening close to the size of an electronic device, increase the number of input / output terminals And it is manufactured in a structure that can contribute to performance improvement in various forms.

Particularly, in recent years, the cooling performance that appropriately cools the heat generated in the electronic device by using the high-capacity and high-voltage electronic device has become one of the main design factors of the electronic device package. Therefore, the importance of a heat sink used in an electronic device package is also increasing.

Generally, the heat sink is made of a metal material such as silver, copper, gold, or aluminum, which is excellent in thermal conductivity. Because silver and copper are economical, corrosive and low mechanical strength, most heat sink materials generally use aluminum, which is lightweight and workable, except in special cases.

Thermal conductivity and thermal expansion coefficient are the main design factors to be considered in designing the heat sink. Conventional metals such as silver, copper, gold, aluminum and the like have excellent thermal conductivity, but the degree of thermal expansion is large in the process of dissipating heat generated in the electronic device, so that there is a problem that a joint portion with other subsidiary materials is easily broken. The damage caused by the thermal expansion of such a heat sink is more marked when using a high-output, high-voltage electronic device.

Patent Document No. 0475336 (2005. 05. 18.) Published Japanese Patent Application No. 1999-0026510 (Apr. 15, 1999) Published Patent Publication No. 2009-0085255 (2009. 08. 07.)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a heat sink having an improved structure that has excellent heat dissipation performance for cooling an electronic device and has a low thermal expansion coefficient, A lead frame assembly and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a heat sink comprising: a body formed by sintering a skeletal metal selected from tungsten and molybdenum and a metal powder containing copper; A plurality of via holes provided in the middle of the body; And a thermally conductive metal impregnated in the plurality of via holes and the voids in the body.

(A1) preparing a metal powder mixture to which a binder is added to a metal powder containing a skeletal metal and copper selected from tungsten and molybdenum; (b1) Forming a green body having a plurality of via holes in the middle and a compressed metal powder mixture; (c1) sintering the green body to form a body having the plurality of via holes in the middle thereof; And (d1) impregnating the thermally conductive metal into the voids inside the body and the plurality of via holes.

According to an aspect of the present invention, there is provided a lead frame assembly for an electronic device package, comprising: a body formed by sintering a skeletal metal selected from tungsten and molybdenum and a metal powder containing copper; A heat sink including a via hole, the plurality of via holes, and a thermally conductive metal impregnated in voids inside the body; An insulating sheet disposed on one surface of the heat sink where the plurality of via holes are disposed; And a lead frame coupled to the insulating sheet so that the electronic device can be mounted.

According to another aspect of the present invention, there is provided a method of manufacturing a lead frame assembly for an electronic device package, the method comprising: (a2) preparing a metal powder mixture containing a skeletal metal selected from tungsten and molybdenum, (B2) forming a green body having a plurality of via holes in the middle and the metal powder mixture being compressed; (c2) sintering the green body to form a body having the plurality of via holes in the middle thereof; (d2) impregnating a thermally conductive metal in the voids and the plurality of via holes in the body to form a heat sink; (e2) bonding an insulating sheet on one surface of the heat sink where the plurality of via holes are disposed; And (f2) bonding the lead frame to the insulating sheet so that the electronic device can be mounted.

The lead frame assembly for an electronic device package according to the present invention has a simple structure in which a lead frame having an electronic device mounted thereon is connected to a heat sink through an insulating sheet or the like, thereby facilitating assembly and durability.

Further, the lead frame assembly for an electronic device package according to the present invention has a structure in which the heat sink provided therein is filled with a thermally conductive metal having a large heat transfer coefficient in a body based on tungsten or molybdenum having a small thermal expansion coefficient, So that the heat generated in the electronic device can be quickly and efficiently radiated into the outside air.

Also, the method of manufacturing a lead frame assembly for an electronic device package according to the present embodiment can effectively manufacture a high-strength and high-efficiency heat sink impregnated with a thermally conductive metal in a body of a tungsten base or a molybdenum base, The package lead frame assembly can be effectively manufactured.

1 is a plan view of a lead frame assembly for an electronic device package according to an embodiment of the present invention.
2 is a block diagram showing a step-by-step process for manufacturing a lead frame assembly for an electronic device package according to an embodiment of the present invention.
FIG. 3 illustrates a process of fabricating a lead frame assembly for an electronic device package according to an embodiment of the present invention.
4 is a block diagram showing a step-by-step process for manufacturing a lead frame assembly for an electronic device package according to another embodiment of the present invention.
5 is a view illustrating a process of manufacturing a lead frame assembly for an electronic device package according to another embodiment of the present invention.

Hereinafter, a heat sink according to the present invention, a method of manufacturing the same, a lead frame assembly for an electronic device package having a heat sink, and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view showing a lead frame assembly for an electronic device package according to an embodiment of the present invention, FIG. 2 is a block diagram showing a step of a method of manufacturing a lead frame assembly for an electronic device package according to an embodiment of the present invention And FIG. 3 illustrates a process of fabricating a lead frame assembly for an electronic device package according to an embodiment of the present invention.

1 to 3, a lead frame assembly 100 for an electronic device package according to an embodiment of the present invention includes a heat sink 110, a kovar sheet 120, an insulating sheet 130, And a lead frame 140. In the lead frame assembly 100 for an electronic device package according to the present embodiment, a variety of electronic devices that generate heat when a transistor, a semiconductor chip, or an LED chip is mounted on the lead frame 140 constitute an electronic device package .

The heat sink 110 includes a body 111 and a heat conductive metal 113. The body 111 is formed by sintering a skeletal metal selected from tungsten (W) and molybdenum (Mo) and a metal powder containing copper (Cu). A plurality of via holes 112 are formed in the middle of the body 111 And the via holes 112 are filled with the thermally conductive metal 113. The thermally conductive metal 113 is also filled in the voids formed in the body 111 when the body 111 is made through the sintering process. The thermally conductive metal 113 can be filled in the plurality of via holes 112 and the voids inside the body 111 through an impregnation process to be described later. As the heat conduction metal 113, a metal having a large heat transfer coefficient such as copper, silver, gold, aluminum, or an alloy containing these metals may be used.

The heat sink 110 has a structure in which a body 111 made of tungsten or molybdenum having a high melting point and a small thermal expansion coefficient is filled with a thermally conductive metal 113 having a large heat transfer coefficient. Therefore, the heat radiation performance is excellent and the overall thermal expansion coefficient is small. Further, even if the temperature rises due to the heat radiation function, the degree of thermal expansion is small, and the risk of breakage at the junction with other subsidiary materials constituting the electronic device package is small.

The kovar sheet 120 is joined to one surface of the heat sink 110 where the plurality of via holes 112 are formed. An opening 121 is provided in the middle of the kovar sheet 120 so that the kovar sheet 120 does not completely cover one side of the heat sink 110. [ The kovar sheet 120 is made of Korvar, an alloy of iron, nickel and cobalt, as is well known. The covar sheet 120 has a low coefficient of thermal expansion and can be interposed between the heat sink 110 and the insulating sheet 130 to serve as a cushioning member for thermal expansion.

The insulation sheet 130 is coupled to the heat sink 110 via the covar sheet 120 by being coupled to the covar sheet 120. An opening 131 is provided in the middle of the insulation sheet 130 like the kovar sheet 120 so that the insulation sheet 130 does not completely cover one surface of the heat sink 110. [ The insulating sheet 130 may be made of various insulating materials such as ceramics or synthetic resin that can be connected between the kovar sheet 120 and the lead frame 140 by insulation.

The lead frame 140 has an opening 141 and is coupled to the insulating sheet 130 so that the electronic device can be mounted. One surface of the lead frame 140 on which the electronic device is mounted may be plated with a conductive metal such as gold or nickel.

The lead frame assembly 100 for an electronic device package according to the present embodiment has a lead frame 140 in which an electronic device is mounted is connected to a heat sink 110 via a covar sheet 120 and an insulating sheet 130 It is simple structure, easy to assemble and excellent durability. Also, heat generated in the electronic device can be dissipated smoothly through the heat sink 110. In particular, the heat sink 110 of the lead frame assembly 100 for an electronic device package according to the present embodiment includes a via hole 112 of a body 111 made of tungsten or molybdenum and a heat conductive metal (113) is filled. Therefore, there is little risk of breakage at the joint due to thermal expansion of the heat sink 110, and heat generated in the electronic device can be dissipated quickly and efficiently into the outside air.

Hereinafter, a method of manufacturing the lead frame assembly 100 for an electronic device package according to the present embodiment will be described with reference to FIGS. 2 and 3. FIG.

As shown in FIGS. 2 and 3, the method of manufacturing a lead frame assembly for an electronic device package according to the present embodiment is roughly divided into a heat sink manufacturing step (S10 to S15) and a joining step for joining subsidiary materials such as a lead frame to a heat sink (S16-S18).

Metal injection molding is used for the heat sink manufacturing process. As is well known, in the metal injection molding process, various metal powder materials are mixed with a binder to prepare a powder mixture, the powder mixture is subjected to an injection molding process to form a desired green body, It is a manufacturing method of making finished metal parts through sintering process. Such a metal injection molding method has an advantage that a product having excellent dimensional accuracy can be mass-produced stably.

In general, the metal injection molding process is largely composed of injection molding, degreasing, and sintering processes. The injection molding process is a process of making a desired part shape using a polymer binder. Process. As the degreasing method, there are various methods such as solvent degreasing, hot degreasing, and catalyst degreasing. The sintering process is a process for improving mechanical properties by heating a powdery product to a high temperature.

The manufacturing process of the heat sink according to the present embodiment will be described in detail as follows. First, a metal powder mixture in which a binder is added to a metal powder containing a skeletal metal and copper selected from tungsten and molybdenum is prepared (step S10, (a1), and (a2).) Copper is sintered to form tungsten or molybdenum The heat sink 110 has a low coefficient of thermal expansion, and the body 111 of the heat sink 110 is made of tungsten or molybdenum having a low thermal expansion coefficient as a base It is necessary to do. For this purpose, the metal powder should have a higher content of tungsten or molybdenum than the copper. The content of copper in the metal powder is preferably 30 wt% to 5 wt%. If the content of copper exceeds 30 wt%, there arises a problem that the formed body 111 is not solidified and copper flows down. On the other hand, when the content of copper is less than 5 wt%, impregnation of copper during sintering is not performed well.

The binder serves to impart fluidity to the powdery body during injection molding and to maintain the metal powder in a rigid shape. As the binder, various known types such as those containing a binder (filler), a lubricant, a plasticizer and a surfactant can be used.

After the metal powder mixture is prepared, the metal powder mixture is heated and kneaded to produce a raw material for injection molding (S11). Using the raw material for injection molding, a green body 115 having a plurality of via holes 112 in the middle and having a compressed metal powder mixture is formed as shown in FIG. 3 (a) (S12 , (b1) and (b2)). The raw material for injection molding is injected into the cylinder of the injection molding machine and is press-fitted into the mold while heating to form the green body 115. In forming the green body 115, the via hole 112 may be formed at the time of injection or may be formed through a separate perforation process. In the former case, the green body 115 can be injection molded so that a plurality of via holes 112 can be formed at the same time without a subsequent process by using a suitable mold. In the latter case, a green body 115 may be formed by injection-molding a molding corresponding to the external shape of the green body 115, and a plurality of via holes 112 may be formed through the upper and lower portions of the molded body.

3 (b), the green body 115 is sintered to form a body 111 having a plurality of via holes 112 in the middle thereof (S13, (c1), and (c2)). step). Various known apparatus and methods can be used for the sintering process, and the green body 115 can be heated at a high temperature to proceed sintering in a solid-phase reaction. The polymer binder is removed through the sintering process and a body 111 in which copper particles are dispersed between particles of a skeletal metal selected from tungsten and molybdenum is formed. A void is formed in a portion where the binder between the metal particles in the body 111 escapes.

Although not shown, a degreasing process may be performed to remove the polymer binder in the green body 115 before the sintering process after the injection molding.

After the sintering process, as shown in FIG. 3 (c), a step of impregnating the thermally conductive metal 113 into the voids inside the body 111 and the plurality of via holes 112 is performed (S14, (d1), (d2)). First, the body 111 and the thermally conductive metal body 116 made of a metal or alloy having a large heat transfer coefficient such as copper, silver, gold, and aluminum are brought into contact with each other and accommodated in the chamber 10 d1-1) step). Then, the body 111 and the thermally conductive metallic body 116 are heated to a temperature not lower than the melting point of the thermally conductive metallic body 116 in a vacuum or reducing atmosphere. At this time, as the thermally conductive metal body 116 melts, the melt penetrates into the voids inside the body 111 and the plurality of via holes 112 to impregnate the thermally conductive metal 113 (step d1-2) . Through the impregnation process, a plurality of via holes 112 of the tenter-based body 111 and a heat sink 110 impregnated with the thermally conductive metal 113 in the pores can be formed.

In the figure, it is shown that two thermally conductive metal bodies 116 are heated on both sides of the thermally conductive metal body 116 and the body 111 in a state in which both surfaces of the body 111 on which the via-holes 112 are formed are brought into contact. However, in addition to the illustrated process method, one thermally conductive metal body 116 and the body 111 can be arranged in various forms in a vacuum or reducing atmosphere, and the impregnation process can be performed.

After the impregnation process, a thermally conductive metal residue 117 may be adhered to the surface of the body 111 of the heat sink 110 as shown in FIG. 3 (d). The thermally conductive metal residue 117 is removed from the surface of the body 111 through the polishing process (S15, (e1)). 3E, after the polishing process, the heat sink 110 having a smooth surface with the heat conductive metal 113 filled in the plurality of via holes 112 exposed on both upper and lower surfaces is completed.

3 (f), the kovar sheet 120 having the opening 121 is fitted to one surface of the heat sink 110 where the via hole 112 is disposed (S16, (g2 )). The kovar sheet 120 may be bonded to the heat sink 110 through various methods such as brazing.

3 (g), an insulating sheet 130 having an opening 131 is bonded to the kovar sheet 120, and the insulating sheet 130 is heat-sealed through the kovar sheet 120. Then, To the sink 110 (steps S17 and (e2)). Various methods such as brazing can be used for joining the insulating sheet 130.

Next, as shown in FIG. 3 (h), the lead frame 140 having the opening 141 is coupled to the insulating sheet 130 so that the electronic device can be mounted, thereby forming the lead frame assembly 100 (Step S18, step (f2)). The lead frame 140 may be bonded to the insulating sheet 130 through various methods such as brazing. Although not shown in the drawings, the plating process may be preceded by plating the surface of the lead frame 140 with metal such as gold or nickel excellent in conductivity before bonding the lead frame 140.

As described above, according to the manufacturing method of a lead frame assembly for an electronic device package according to the present embodiment, the via hole 112 of the body 111 based on tungsten or molybdenum and the heat conductive metal The heat sink 110 having the structure in which the heat sink 113 is filled can be manufactured effectively. It is possible to effectively manufacture the lead frame assembly 100 for an electronic device package that has excellent heat dissipation efficiency and durability.

FIG. 4 is a block diagram illustrating a method of fabricating a lead frame assembly for an electronic device package according to another embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a lead frame assembly for an electronic device package according to another embodiment of the present invention. And the manufacturing process is sequentially shown.

4 and 5, a method of manufacturing a lead frame assembly for an electronic device package according to another embodiment of the present invention is roughly divided into a heat sink manufacturing process (S20 to S25) and a bonding process for connecting subsidiary materials such as a lead frame to a heat sink And steps (S26 to S28).

The heat sink manufacturing process uses a metal injection molding method as described above. First, a metal powder mixture in which a binder is added to a metal powder containing a skeletal metal selected from tungsten and molybdenum and copper is prepared (steps S20, (a1), and (a2)). The steps of preparing such a metal powder mixture are as described above. Then, the metal powder mixture is heated and kneaded to produce a raw material for injection molding (S21).

Next, a green body 215 is formed as shown in FIG. 5A (steps S22, (b1), and (b2)). A plurality of via holes 212 are formed in the middle of the green body 215 and receiving grooves 213 are formed on the upper and lower surfaces of the green body 215 to connect with the plurality of via holes 212. In forming the green body 215, the via hole 212 and the receiving recess 213 may be formed at the time of injection or may be formed through a separate processing step. In the former case, the green body 215 can be injection molded so that a plurality of via holes 212 and a pair of receiving grooves 213 can be formed at the same time by using a proper mold. A plurality of via holes 212 and a pair of receiving grooves 213 are formed through a perforation process and a cutting process to form a green body 215. In this case, (215) can be formed.

Next, as shown in FIG. 5B, the green body 215 is sintered to form a body 211 having a plurality of via holes 212 and a pair of receiving grooves 213 (S23, (c1), (c2), and (f1)). The sintering process is as described above.

Next, as shown in FIG. 5 (c), a step of impregnating the thermally conductive metal 113 into the voids inside the body 211, the plurality of via holes 212, and the pair of receiving grooves 213 is performed (Steps S24, (d1), and (d2)). This impregnation process is as described above. However, if the body 211 and the thermally conductive metallic body 116 are heated to a temperature not lower than the melting point of the thermally conductive metallic body 116 while the chamber 10 is in a vacuum or reduced atmosphere, Holes 211 and a plurality of via holes 212 as well as a pair of receiving grooves 213. [

After the impregnation process, the remaining thermally conductive metal residue 117 adhered to the surface of the body 211 of the heat sink 210 is removed through a polishing process as shown in FIGS. 5 (d) and 5 (e) , (e1)).

Next, the joining step S26 of the kovar sheet 120 as shown in Fig. 5 (f), the joining step S27 of the insulating sheet 130 as shown in Fig. 5 (g) The step of joining the lead frame 140 as shown in Fig. 5 (h) of Fig. 5 is performed in order to complete the lead frame assembly 200 for an electronic device package having the heat sink 210. [ These auxiliary material joining processes are as described above.

The heat sink 210 of the lead frame assembly 200 for an electronic device package according to the present embodiment is smaller in size than the heat sink 110 according to the previous embodiment in that it is accommodated in the receiving recess 213 provided on the upper and lower surfaces of the body 211 Gt; 216 < / RTI > These thermally conductive metal layers 216 are connected to the thermally conductive metal 113 filled in the plurality of via holes 212 to further improve heat radiation efficiency.

In this embodiment, the thermally conductive metal layer 216 may be formed through impregnation of the thermally conductive metal 113, or may be formed through a separate process from the impregnation process. For example, after the thermally conductive metal 113 is impregnated into the voids of the body 211 and the via hole 212 through an impregnation process, a heat conductive metal layer made of the same material as that of the heat conductive metal 113 or a different material It may be inserted into the receiving groove 213 of the body 211.

Although the preferred embodiments of the present invention have been described above, the scope of the present invention is not limited to the embodiments described above.

For example, although the insulation sheet 130 is shown to be coupled to the heat sink 110 (210) via the kovar sheet 120, the kovar sheet may be omitted in some cases.

Further, the insulating sheet, the corbar sheet, and the lead frame may be changed into various other shapes other than the structure in which the opening is formed at the center as shown in the figure.

Further, the heat sink can be changed into various other structures other than the structure in which a plurality of via holes or a pair of receiving grooves are formed in the shape of a rectangular block as shown in the figure.

Although the heat sinks 110 and 210 have been described above as being manufactured by a metal injection molding method and a vacuum or reduced atmosphere impregnation method, a method of forming a body of a heat sink, a method of forming a body of a heat sink, Various other methods can be used.

Holes 112 and 212 are formed before the sintering process in the manufacturing of the heat sinks 110 and 210. However, in some cases, after the sintering process, the via holes or the receiving recesses May be formed.

100, 200: lead frame assembly for electronic device package
110, 210: heat sink 111, 211: body
112, 212: via hole 113: heat conduction metal
115, 215: green body 116: thermally conductive metal body
117: thermally conductive metal residue 120: kovar sheet
130: Insulation sheet 140: Lead frame
213: receiving groove 216: heat conductive metal layer

Claims (16)

A body formed by sintering a metal powder containing a skeletal metal and copper selected from tungsten and molybdenum;
A plurality of via holes provided in the middle of the body; And
And a heat conductive metal impregnated in the plurality of via holes and the voids inside the body. The method according to claim 1,
A receiving groove formed on a surface of the body to be connected to the plurality of via holes; And
And a heat conductive metal layer accommodated in the receiving groove to be connected to the thermally conductive metal impregnated in the plurality of via holes. 3. The method according to claim 1 or 2,
Wherein the thermally conductive metal is copper. (a1) preparing a metal powder mixture to which a binder is added to a metal powder containing a skeletal metal and copper selected from tungsten and molybdenum;
(b1) forming a green body having a plurality of via holes in the middle and the metal powder mixture being compressed;
(c1) sintering the green body to form a body having the plurality of via holes in the middle thereof; And
(d1) impregnating a thermally conductive metal into the voids in the body and the plurality of via-holes. 5. The method of claim 4,
After the step (d1)
(e1) polishing the surface of the body to remove the residue of the thermally conductive metal adhered to the surface of the body. 5. The method of claim 4,
Prior to step (d1)
(f1) forming a receiving groove connected to the plurality of via holes on the surface of the body,
Wherein the receiving groove is impregnated with the thermally conductive metal in the step (d1). 5. The method of claim 4,
Wherein the step (b1) comprises forming the green body by an injection method so that the plurality of via holes are simultaneously formed. 5. The method of claim 4,
Wherein the step (b1) comprises forming an injection body corresponding to the outer shape of the green body by an injection method, and then drilling the plurality of via holes into the injection body to form the green body. 5. The method of claim 4,
The step (d1)
(d1-1) receiving a thermally conductive metal body made of the body and the thermally conductive metal in a chamber,
(d1-2) heating the body and the thermally conductive metal body to a temperature equal to or higher than the melting point of the thermally conductive metal body in a vacuum or reducing atmosphere, and causing the melt, which melts the thermally conductive metal body, And a step of impregnating the via hole into the via hole of the heat sink. 10. The method according to any one of claims 4 to 9,
Wherein the thermally conductive metal is copper. 5. The method of claim 4,
Wherein the content of copper in the metal powder in the step (a1) is 30 wt% to 5 wt%. A body formed by sintering a metal powder containing a skeletal metal and copper selected from tungsten and molybdenum, a plurality of via holes provided in the middle of the body, and a plurality of via holes and a heat conductive metal impregnated in the voids inside the body A heat sink including a heat sink;
An insulating sheet disposed on one surface of the heat sink where the plurality of via holes are disposed; And
And a lead frame coupled to the insulating sheet so that the electronic device can be mounted on the lead frame. 13. The method of claim 12,
And a Kovar sheet interposed between the heat sink and the insulating sheet. 13. The method of claim 12,
Wherein said thermally conductive metal is copper. ≪ RTI ID = 0.0 > 11. < / RTI > (a2) preparing a metal powder mixture to which a binder is added to a metal powder containing a skeletal metal and copper selected from tungsten and molybdenum;
(b2) forming a green body having a plurality of via holes in the middle and the metal powder mixture being compressed;
(c2) sintering the green body to form a body having the plurality of via holes in the middle thereof;
(d2) impregnating a thermally conductive metal in the voids and the plurality of via holes in the body to form a heat sink;
(e2) bonding an insulating sheet on one surface of the heat sink where the plurality of via holes are disposed; And
(f2) bonding the lead frame to the insulating sheet so that the electronic device can be mounted on the lead frame. 16. The method of claim 15,
After step (d2) and before step (e2)
(g2) bonding the Kovar sheet to one surface of the heat sink where the plurality of via holes are disposed,
Wherein the step (e2) joins the insulating sheet to the heat sink via the covar sheet.
KR1020140094503A 2014-07-25 2014-07-25 Heatsink and Method for Manufacturing the Heatsink, Lead-frame Assembly for Electronic Component Package Having the Heatsink and Method for Manufacturing the Lead-frame Assembly KR20160013371A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116230398A (en) * 2022-12-29 2023-06-06 丰宾电子科技股份有限公司 Super radiating aluminium electrolytic capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116230398A (en) * 2022-12-29 2023-06-06 丰宾电子科技股份有限公司 Super radiating aluminium electrolytic capacitor

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