KR20160010253A - Composite electronic component, board having the same mounted thereon and power smoothing unit comprising the same - Google Patents

Abstract

The present invention relates to a composite electronic component including a composite body in which a laminated ceramic capacitor and a tantalum capacitor are coupled. The composite electronic component has a superior reduction effect of an acoustic noise, low equivalent series resistance (ESR)/equivalent series inductance (ESL), an improved DC-bias characteristic, and the small chip thickness. The composite body is disposed on an insulation sheet including a connection conductor unit. The stacked ceramic capacitor includes a plurality of dielectric layers, a ceramic body in which inner electrodes are disposed to face each other with the dielectric layers therebetween, and first and second outer electrodes disposed on an outer circumferential surface of the ceramic body. The tantalum capacitor includes a tantalum powder, and a body unit in which a tantalum wire is disposed on one end thereof. The composite electronic component additionally comprises a molding unit enclosing the composite body, a positive terminal connected to the tantalum wire and the first outer electrode, and a negative terminal connected to the body unit of the tantalum capacitor and the second outer electrode.

Description

TECHNICAL FIELD The present invention relates to a composite electronic component, a mounting substrate thereof, and a power stabilizing unit including the same.

The present invention relates to a composite electronic part having a plurality of passive elements.

A multilayer ceramic capacitor which is one of the multilayer chip electronic components can be used for various electronic products such as a liquid crystal display (LCD) and a plasma display panel (PDP) And is a chip-type capacitor mounted on a circuit board and serving to charge or discharge electricity.

Such a multi-layered ceramic capacitor (MLCC) can be used as a component of various electronic devices because of its small size, high capacity, and easy mounting.

The multilayer ceramic capacitor may have a structure in which a plurality of dielectric layers and internal electrodes of different polarities are alternately stacked between the dielectric layers.

Since the dielectric layer has piezoelectricity and electrostrictive properties, when a direct current or an alternating voltage is applied to the multilayer ceramic capacitor, piezoelectric phenomenon occurs between the internal electrodes and vibration may occur.

These vibrations are transmitted to the printed circuit board through the solder of the multilayer ceramic capacitor, and the entire printed circuit board becomes an acoustic radiation surface, thereby generating a noisy vibration sound.

The vibration sound may correspond to an audible frequency in the range of 20 to 20000 Hz which gives an uncomfortable feeling to a person, and an unpleasant vibration sound is called an acoustic noise.

A product in which the lower cover layer of the multilayer ceramic capacitor is increased in order to reduce the acoustic noise has been studied.

However, there is a need to further study a product having a better effect of reducing acoustic noise.

Japanese Laid-Open Patent Publication No. 1997-326334

The present specification aims to provide a composite electronic part having excellent effect of reducing acoustic noise.

Also, the present specification aims to provide a composite electronic part having a low ESR (Equivalent Series Resistance) / ESL (Equivalent Series Inductance), an improved DC-bias characteristic, and a low chip thickness.

According to an embodiment of the present invention, there is provided a composite including a composite of a multilayer ceramic capacitor and a tantalum capacitor, wherein in a graph of equivalent series resistance (ESR) versus frequency of an input signal to be input, a self resonant frequency (ESR) occurs in at least one of a frequency region before or after a frequency (SRF) of the electronic component.

According to another aspect of the present invention, there is provided an insulating sheet, comprising: an insulating sheet; a connecting conductor disposed on at least one of an upper surface and a lower surface of the insulating sheet; a plurality of dielectric layers disposed on the upper surface of the insulating sheet, A multilayer ceramic capacitor including first and second external electrodes disposed on an outer circumferential surface of the ceramic body, and a tantalum powder disposed on one end side of the ceramic body, And a second terminal electrically connected to the tantalum wire and the first external electrode, and a second terminal electrically connected to the first terminal and the second terminal, the first terminal being connected to the tantalum capacitor, And a second external electrode connected to the main body of the tantalum capacitor and the second external electrode, It provides a composite electronic component including a negative electrode terminal.

According to another embodiment of the present invention, there is provided a multilayer ceramic capacitor including: a multilayer ceramic capacitor including an input terminal supplied with power converted by a power management unit, a ceramic body having a plurality of dielectric layers and internal electrodes disposed to face each other with the dielectric layer interposed therebetween; And a tantalum capacitor including a tantalum powder and a tantalum wire formed on one end of the tantalum capacitor, the power stabilizer for stabilizing the power supply and the ground terminal for bypassing a ripple of the power supply, The power stabilizer provides a composite electronic part that reduces ripples of the supplied power.

According to still another aspect of the present invention, there is provided a composite electronic device including a printed circuit board having an electrode pad on an upper surface thereof, the composite electronic component provided on the printed circuit board, and a solder connecting the electrode pad and the composite electronic component Thereby providing a mounting substrate.

According to still another aspect of the present invention, there is provided a battery charger comprising: a first power stabilizer for stabilizing a battery and a power source supplied from the battery; a power manager for converting power supplied from the first stabilizer through a switching operation; And a second power stabilizer for stabilizing the supplied power source, wherein the first power stabilizer or the second power stabilizer comprises a ceramic body having a plurality of dielectric layers and internal electrodes arranged to face each other with the dielectric layer interposed therebetween And a tantalum capacitor comprising a capacitor and a tantalum powder, and a tantalum wire formed on one end of the tantalum wire, wherein the composite electronic device includes a power stabilization circuit for reducing ripple of the supplied power supply, Provide a unit.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a composite electronic part excellent in reducing acoustic noise.

Further, according to the disclosure of the present specification, it is possible to provide a composite electronic part which can realize a high capacitance and has a low ESR (Equivalent Series Resistance) / ESL (Equivalent Series Inductance), an improved DC-bias characteristic and a low chip thickness .

1 (a) and 1 (b) are graphs showing equivalent series resistance (ESR) and impedance according to a comparative example and a composite electronic component according to an embodiment of the present invention.
Fig. 2 is a perspective view showing the projection of the molding electrode and the terminal electrode of the composite electronic component according to the first embodiment of the present invention. Fig.
Fig. 3 is a side view seen from the direction A in Fig.
4 is an enlarged view of the areas C1 and C2 in Fig.
FIG. 5 is a top plan view showing the interior of the projection in the direction B in FIG. 2; FIG.
6 is a plan view showing an embodiment of the connecting conductor portion.
7 is a plan view showing another embodiment of the connecting conductor portion.
8 is a perspective view schematically showing a composite electronic part according to a second embodiment of the present invention.
9 is a perspective view schematically showing a composite electronic part according to a third embodiment of the present invention.
10 is a graph showing an output voltage versus time according to an embodiment of the present invention and a comparative example.
11 is a graph showing ESR voltage ripple (DELTA V) according to the volume ratio of the multilayer ceramic capacitor and the tantalum capacitor in the composite electronic device according to an embodiment of the present invention.
12 is a view showing a driving power supply system for supplying driving power to a predetermined terminal requiring a driving power source through a battery and a power management unit.
13 is a perspective view showing a state in which the composite electronic component of Fig. 2 is mounted on a printed circuit board.
FIG. 14 is a detailed circuit diagram of a power stabilization unit including a composite electronic device according to an embodiment of the present invention.

The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

In order to clearly illustrate the embodiments of the present invention, when the directions of the hexahedron are defined, L, W, and T shown in the drawings indicate the longitudinal direction, the width direction, and the thickness direction, respectively.

Composite electronic parts

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 (a) and 1 (b) are graphs showing equivalent series resistance (ESR) and impedance according to a comparative example and a composite electronic component according to an embodiment of the present invention.

Referring to FIGS. 1 (a) and 1 (b), a composite electronic device according to an embodiment of the present invention has an equivalent series resistance (ESR) An equivalent series resistance (ESR) and an inflection point of impedance occur in at least one of the frequency regions before and after the self resonant frequency (SRF).

That is, according to the embodiment of the present invention, the impedance of the tantalum capacitor appears in the low frequency region and the impedance of the multilayer ceramic capacitor in the high frequency region in the frequency versus impedance graph.

Therefore, in the graph of equivalent series resistance (ESR) and impedance of the input signal with respect to the frequency of the input signal, an equivalent serial resistance (" SRR ") is applied to at least one of the frequency regions before and after the self resonant frequency ESR) and an inflection point of impedance occur.

The inflection point of the equivalent series resistance (ESR) and the impedance may occur in at least one of the frequency regions before and after the self resonant frequency (SRF), and may occur in both the before and after frequency regions have.

Since the inflection point of the equivalent series resistance (ESR) and the impedance occurs in at least one of the frequency regions before and after the self resonant frequency (SRF), the composite electronic device according to the embodiment of the present invention Can achieve a low ESR (Equivalent Series Resistance).

A composite electronic device according to an embodiment of the present invention includes a composite in which a multilayer ceramic capacitor and a tantalum capacitor are combined.

According to an embodiment of the present invention, the multilayer ceramic capacitor and the tantalum capacitor may be connected in parallel.

According to one embodiment of the present invention, the composite electronic device includes an insulating sheet on which a multilayer ceramic capacitor and a tantalum capacitor are mounted, and a molding portion formed to surround the multilayer ceramic capacitor and the tantalum capacitor.

According to one embodiment of the present invention, the composite electronic part includes a positive electrode terminal and a negative electrode terminal electrically connected to the multilayer ceramic capacitor and / or the tantalum capacitor.

According to one embodiment of the present invention, the composite electronic part is provided with a multilayer ceramic capacitor in an assembled structure of a tantalum capacitor without a lead frame, and a tantalum capacitor and a multilayer ceramic capacitor are connected in parallel.

According to an embodiment of the present invention, an insulating layer can be disposed between the tantalum capacitor and the multilayer ceramic capacitor, and electrical shorting can be prevented by the insulating layer.

Hereinafter, the specific structure of the composite electronic component according to one embodiment of the present invention will be described in more detail.

Fig. 2 is a perspective view showing the projection of the molding electrode and the terminal electrode of the composite electronic component according to the first embodiment of the present invention. Fig.

2, the composite electronic device according to the first embodiment of the present invention includes an insulating sheet 140 and connecting conductor portions 141 and 142 disposed on at least one of the upper surface and the lower surface of the insulating sheet 140 A ceramic body 111 disposed on an upper surface of the insulating sheet 140 and having a plurality of dielectric layers and internal electrodes disposed to face each other with the dielectric layer interposed therebetween; A multilayer ceramic capacitor 110 including first and second external electrodes 131 and 132 and a tantalum wire 121 containing tantalum powder and having a tantalum wire 121 disposed on one end side, And a capacitor 130 to which a capacitor 120 is coupled.

The multilayer ceramic capacitor 110 is not particularly limited, and a commonly used multilayer ceramic capacitor may be used.

For example, the multilayer ceramic capacitor 110 includes a ceramic body 111 in which a plurality of dielectric layers and internal electrodes disposed so as to face each other with the dielectric layer sandwiched therebetween.

The multilayer ceramic capacitor 110 includes first and second external electrodes 131 and 132 disposed on an outer peripheral surface of the ceramic body 111.

The first and second external electrodes 131 and 132 may be formed of a conductive paste containing a conductive metal.

The conductive metal may be, but is not limited to, nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof.

According to an embodiment of the present invention, a nickel / tin (Ni / Sn) plating layer may not be disposed on the first and second external electrodes 131 and 132, unlike a general multilayer ceramic capacitor.

The composite electronic part includes a molding part 150 disposed to surround a composite body 130 including a multilayer ceramic capacitor 110 and a tantalum capacitor 120 disposed on an upper surface of an insulating sheet 140 as described later Therefore, it is not necessary to form a plating layer on the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 110.

Therefore, there is no problem of reliability reduction due to penetration of the plating liquid into the ceramic body 111 of the multilayer ceramic capacitor 110.

The tantalum capacitor 120 includes a body portion 122 and a tantalum wire 121. The tantalum wire 121 is electrically connected to the body portion 122 As shown in Fig.

Although not limited thereto, the body portion 122 of the tantalum capacitor 120 may include an anode, a dielectric layer, a solid electrolyte layer, a carbon layer, and a cathode layer.

The anode body may be formed of a tantalum material and may be formed of a porous sintered body of tantalum powder.

A dielectric layer may be formed on the surface of the anode body. The dielectric layer may be formed by oxidizing the surface of the anode body. For example, the dielectric layer may be formed of a dielectric material composed of tantalum oxide (Ta ₂ O ₅ ), which is an oxide of tantalum forming the anode, and may have a predetermined thickness on the surface of the anode.

A solid electrolyte layer may be formed on the surface of the dielectric layer. The solid electrolyte layer may include a conductive polymer.

When the solid electrolyte layer is formed of a conductive polymer, it may be formed on the surface of the dielectric layer by a chemical polymerization method or an electrolytic polymerization method. The conductive polymer material is not particularly limited as long as it is a conductive polymer material. For example, the conductive polymer material may include polypyrrole, polythiophene, polyaniline, polypyrrole, and the like.

A carbon layer containing carbon may be disposed on the solid electrolyte layer.

The carbon layer may be formed of a carbon paste. A carbon paste in which a conductive carbon material powder such as natural graphite or carbon black is dispersed in water or an organic solvent while being mixed with a binder, a dispersant, and the like is coated on the solid electrolyte layer And can be formed by coating.

A negative electrode layer including a conductive metal may be disposed on the carbon layer to improve electrical connectivity with the negative terminal, and the conductive metal included in the negative electrode layer may be silver (Ag).

Although the tantalum capacitor is not particularly limited, for example, a tantalum capacitor having no inner lead frame structure can be used.

According to one embodiment of the present invention, a structure of a composite electronic device including a composite in which a multilayer ceramic capacitor and a tantalum capacitor are combined is excellent in an effect of reducing acoustic noise, Equivalent Series Resistance (ESR) / Equivalent Series Inductance (ESL), improved DC-bias characteristics and low chip thickness.

The tantalum capacitor can realize a high capacitance, has excellent DC-bias characteristics, and does not generate acoustic noise at the time of mounting on a substrate.

On the other hand, the tantalum capacitor has a problem of high equivalent series resistance (ESR).

On the other hand, the multilayer ceramic capacitor has low equivalent series resistance (ESR) and equivalent series inductance (ESL). However, the DC-bias characteristic is poor compared to a tantalum capacitor, There are difficult disadvantages.

Further, the multilayer ceramic capacitor has a thick chip thickness, and there is a problem that acoustic noise is generated when the multilayer ceramic capacitor is mounted on a substrate.

However, since the composite electronic device according to an embodiment of the present invention includes a composite in which a multilayer ceramic capacitor and a tantalum capacitor are combined, a high equivalent series resistance (ESR), which is a disadvantage of the tantalum capacitor, can be reduced.

In addition, degradation of the DC bias characteristic, which is a disadvantage of the multilayer ceramic capacitor, can be improved, and a thick chip thickness can be realized with a low thickness.

In addition, a multilayer ceramic capacitor in which acoustic noise is generated when a substrate is mounted and a tantalum capacitor in which acoustic noise is not generated at all are combined at a constant volume ratio, so that an effect of reducing acoustic noise is excellent can do.

In addition, since the plating layer is not formed on the external electrode of the multilayer ceramic capacitor in the above-described composite electronic part, there is no problem of reliability lowering due to penetration of the plating liquid.

According to an embodiment of the present invention, the combined volume ratio (tantalum capacitor: multilayer ceramic capacitor) of the tantalum capacitor 120 and the multilayer ceramic capacitor 110 may be 2: 8 to 9: 1.

The Equivalent Series Resistance (ESR) value is adjusted by adjusting the combined volume ratio (tantalum capacitor: multilayer ceramic capacitor) of the tantalum capacitor 120 and the multilayer ceramic capacitor 110 to 2: 8 to 9: It is possible to realize a composite electronic part having a low noise level and an excellent acoustic noise improving effect.

More preferably, the combined volume ratio of the tantalum capacitor and the multilayer ceramic capacitor is 5: 5 to 7: 3.

If the combined volume ratio of the tantalum capacitors is less than 5, a high-capacity electronic component can not be realized. If the combined volume ratio is more than 7, the Equivalent Series Resistance (ESR) and the voltage ripple (? V) .

According to the first embodiment of the present invention, in the composite body 130, the multilayer ceramic capacitor 110 may be coupled to the side surface of the tantalum capacitor 120.

The method of joining the multilayer ceramic capacitor 110 and the tantalum capacitor 120 is not particularly limited and an adhesive may be applied to the side surface of the tantalum capacitor 120 to be coupled.

The multilayer ceramic capacitor 110 and the tantalum capacitor 120 may be connected in parallel.

According to an embodiment of the present invention, the multilayer ceramic capacitor 110 and the tantalum capacitor 120 may be disposed on the insulating sheet 140 as shown in FIG.

The insulating sheet 140 is not particularly limited when it exhibits an insulating property, and may be manufactured using an insulating material such as a ceramic material.

The connection conductors 141 and 142 may be disposed on at least one of the upper surface and the lower surface of the insulating sheet 140.

The shape of the connection conductors 141 and 142 is not particularly limited as long as the connection conductors 141 and 142 can electrically connect the positive and negative terminals and the internal complex on the outside of the mold, as described later.

For example, as shown in FIG. 2, the connection conductors 141 and 142 may be in the form of metal pads, but are not limited thereto.

In addition, the connection conductor portions 141 and 142 may include copper (Cu) as a conductive metal, but are not limited thereto.

The connection conductors 141 and 142 may be connected to the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 110, respectively, as described later.

Also, the first external electrode and the negative terminal may be connected to the second external electrode terminal connecting conductor 141, 142 through the positive terminal.

The main body 122 of the tantalum capacitor 120 and the negative terminal of the tantalum capacitor 120 may be connected to each other through the connection conductor 142. However, the present invention is not limited thereto.

An insulating layer 170 may be disposed between the multilayer ceramic capacitor 110 and the tantalum capacitor 120 to prevent electrical shorting of each element disposed in the composite electronic component by the insulating layer 170. .

The molding part 150 is formed to cover the upper surface of the insulating sheet 140 on which the multilayer ceramic capacitor 110, the tantalum capacitor 120, the multilayer ceramic capacitor, and the tantalum capacitor are disposed.

The molding part 150 may be formed of an epoxy or silica based EMC or the like so that the multilayer ceramic capacitor 110 and the tantalum capacitor 120 are protected from the external environment, but the present invention is not limited thereto.

Due to the molding part 150, the composite electronic device according to an embodiment of the present invention can be realized as a single part in which the multilayer ceramic capacitor 110 and the tantalum capacitor 120 are combined.

According to one embodiment of the present invention, the tantalum wire 121 may be exposed to the first longitudinal side of the molding part 150.

The tantalum capacitor 120 is a tantalum capacitor having no internal lead frame. The tantalum wire 121 can be exposed to the first longitudinal side of the molding part 150, .

Meanwhile, the connection conductors 141 and 142 may be exposed to the first longitudinal side of the molding part 150.

Hereinafter, a structure in which a multilayer ceramic capacitor and a tantalum capacitor included in a composite electronic device according to an embodiment of the present invention are connected to a terminal electrode will be described, but the present invention is not necessarily limited thereto.

Fig. 3 is a side view seen from the direction A in Fig.

4 is an enlarged view of the areas C1 and C2 in Fig.

Referring to FIGS. 3 and 4, the terminal electrode may include a cathode terminal 161 and a cathode terminal 162.

The anode terminal 161 is disposed on first and second longitudinal sides of the molding part 150 and is connected to the tantalum wire 121 and the first external electrode 131, May be connected to the body 121 of the tantalum capacitor 120 and the second external electrode 132. The tantalum capacitor 120 may be connected to the body 121 of the tantalum capacitor 120,

The cathode terminal 161 and the first external electrode 131 may be connected through one of the connection conductors 141 and the cathode terminal 162 and the second external electrode 132 may be connected to each other through the connection conductor The other one of the parts 142 may be connected.

The anode terminal 161 may extend from the first longitudinal side of the molding part 150 to a portion of the lower surface of the insulating sheet 140 and the anode terminal 162 may extend from the first side of the molding part 150 to the molding part 150. [ And the cathode terminal 161 and the anode terminal 162 may be spaced apart from each other at the lower surface of the insulating sheet 140. [ have.

The positive electrode terminal 161 may include a positive side terminal portion As disposed on a side surface of the molding portion 150 and an anion side bottom portion Ab disposed on a bottom surface of the insulating sheet 140, 162 may include a cathode side terminal portion Cs disposed on a side surface of the molding portion 150 and a cathode bottom portion Cb disposed on a lower surface of the insulating sheet 140.

According to one embodiment of the present invention, the cathode terminal 161 includes a lower base layer 161a, side base layers 161b and 161c connected to the lower base layer 161a, And plating layers 161d and 161e disposed so as to surround the base layers 161b and 161c.

The negative electrode terminal 162 includes a lower base layer 162a, side base layers 162b and 162c connected to the lower base layer 162a and lower base layers 162a and 162b and 162c. And a plating layer 162d and 162e arranged to surround the plating layer 162c.

In FIG. 3, the base layers 161a and 162a are illustrated as one layer and the side base layers 161b, 161c, 162b, and 162c are illustrated as two layers. However, the present invention is not limited thereto. .

The cathode terminal 161 and the cathode terminal 162 may be formed by a process of sputtering at least one of Cr, Ti, Cu, Ni, Pd and Au, plating, , But is not limited thereto.

The positive terminal 161 and the negative terminal 162 are formed by first forming the lower terminal portions Ab and Cb and then forming the side terminal portions As and Cs to be connected to the lower terminal portions Ab and Cb Lt; / RTI >

The base layers 161a and 162a may be formed by etching, but the present invention is not limited thereto.

The base layers 161a and 162a are disposed on the lower surface of the insulating sheet 140. When the metal sheet is coated on the lower surface of the insulating sheet 140 and then the anode sheet is anodized, An etching process may be performed to form a pattern.

The base layers 161a and 162a are not particularly limited, but may include, for example, copper (Cu).

As described above, when the base layers 161a and 162a are formed using copper, the anode side terminal portion As formed by a separate process and the negative side electrode portion Cb are excellent in connection, and the electrical conductivity is excellent can do.

The side surface underlying layers 161b, 161c, 162b and 162c may be formed by vapor deposition, for example, by sputtering.

The side surface underlying layers 161b, 161c, 162b, and 162c are not particularly limited, but may be formed of two layers, i.e., an inner layer and an outer layer.

The inner side base layers 161b and 162b of the side base layers 161b, 161c, 162b and 162c may be formed by a sputter method including at least one of Cr and Ti, And can be connected to the first and second connection terminals 161a and 162a.

Outer side base layers 161c and 162c among the side base layers 161b, 161c, 162b and 162c may include Cu and may be formed by sputtering.

FIG. 5 is a top plan view showing the interior of the projection in the direction B in FIG. 2; FIG.

5, the tantalum wire 121 of the tantalum capacitor 120 may be exposed through the first longitudinal side surface of the molding part 150 to be electrically connected to the positive terminal 161, The first external electrode 161 and the first external electrode 131 may be connected through one of the connection conductors 141.

The body portion 122 of the tantalum capacitor may be electrically connected to the negative terminal 162 disposed on the second longitudinal side of the molding portion 150. The negative terminal 162 may be electrically connected to the negative terminal 162, (132) may be connected through another one of the connection conductors (142).

The positive electrode terminal 161 and the negative electrode terminal 162 may function as an input terminal and a ground terminal of a signal, respectively, but are not limited thereto.

6 is a plan view showing an embodiment of the connecting conductor portion.

6, the connection conductor portion 142 includes a lead portion 142a exposed at one end of the insulation sheet 140 and a first extension portion 142b extending in the first direction from the lead portion 142a And a second extension 142c.

The tantalum capacitor 120 may be disposed on the first extended portion 142b and the multilayer ceramic capacitor 110 may be disposed on the second extended portion 142c.

Although not shown, the second extended portion 142c may be formed to be shorter than the first extended portion 142b in order to prevent electrical short-circuiting between the external electrodes of the multilayer ceramic capacitor 110. [

Or the second extended portion 142c may not be formed and the second outer electrode 132 of the multilayer ceramic capacitor 110 may be disposed at the lead portion 142a.

The outer electrode 132 of the first extended portion 142b and the tantalum capacitor 120 and the second extended portion 142c or the lead portion 142a and the multilayer ceramic capacitor 110 are electrically connected to each other through conductive paste As shown in Fig.

The conductive face can secure the electrical connection between the connection conductor portion, the tantalum capacitor, the connection conductor portion, and the multilayer ceramic capacitor, and can adhere (bond) the multilayer ceramic capacitor and the multilayer ceramic capacitor to the insulation sheet.

Also, the conductive paste, the tantalum capacitor, the connecting conductor, and the multilayer ceramic capacitor are firmly adhered to each other by the conductive paste to reduce the adhesion resistance, thereby effectively exhibiting the low ESR characteristics of the multilayer ceramic capacitor.

The second extended portion 142c or the extended portion 142a of the connection conductor portion 142 may be connected to the second external electrode 132 of the external electrode of the multilayer ceramic capacitor 110. [

The lead portion 142a of the connection conductor portion 142 may be connected to the negative terminal 162 formed on the side surface of the molding portion 150 by being led to the second longitudinal side surface of the molding portion 150. [

The tantalum wire 121 of the tantalum capacitor 120 can be drawn out to the side of the molding part 150. The first external electrode 131 of the multilayer ceramic capacitor 110 is electrically connected to the molding part 150 and may be connected to the positive terminal 161 formed on the side of the molding part 150.

According to the present embodiment, the first extended portion 142b and the second extended portion 142c are spaced apart from each other to prevent a short circuit between the tantalum capacitor and the multilayer ceramic capacitor.

7 is a plan view showing another embodiment of the connecting conductor portion.

Referring to FIG. 7, the connection conductors 141 and 142 are exposed at one end of the insulation sheet 140 and include a first connection conductor portion 142d in which the tantalum capacitor 120 is disposed, And a pair of second connection conductor portions 141e and 142e, which are exposed at both ends and are spaced apart from each other and on which the multilayer ceramic capacitor 110 is disposed.

The body portion 122 of the tantalum capacitor 120 is connected to the first connection conductor portion 142d and the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 110 are connected to a pair of And may be connected to the second connection conductor portions 141e and 142e, respectively.

The body portion 122 of the tantalum capacitor 120 and the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 110 may be directly connected to the connecting conductors 141 and 142, Lt; / RTI >

The first connection conductor part 142d and the pair of second connection conductor parts 141e and 142e may be exposed to the side of the molding part 150 and connected to the cathode terminal 161 or the anode terminal 162. [

The body portion 122 of the tantalum capacitor 120 and the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 110 may be connected to the conductive paste exposed on the side surface of the molding portion 150 .

According to this embodiment, since the first connection conductor portion 142d and the pair of second connection conductor portions 141e and 142e are separately formed, it is possible to prevent a short circuit between the tantalum capacitor and the multilayer ceramic capacitor.

According to the above-described embodiment, the tantalum capacitor and the multilayer ceramic capacitor can be independently connected in parallel.

The connection of the tantalum capacitor and the multilayer ceramic capacitor can be connected by a conductive paste after chemically etching the electrode portions.

8 is a perspective view schematically showing a composite electronic part according to a second embodiment of the present invention.

Referring to FIG. 8, in the composite electronic device according to the second embodiment of the present invention, the multilayer ceramic capacitor 210 may be coupled to the upper portion of the tantalum capacitor 220.

That is, a composite body 230 in which a tantalum capacitor 220 and a multilayer ceramic capacitor 210 are coupled to the insulation sheet 240 can be disposed on the insulation sheet 240.

When the multilayer ceramic capacitor 210 is coupled to the upper portion of the tantalum capacitor 220, the effect of reducing the acoustic noise can be improved when the composite electronic component is mounted on the substrate.

Although the tantalum capacitor 220 is not particularly limited, for example, a tantalum capacitor having no inner lead frame may be used.

Alternatively, tantalum oxide (Ta ₂ O ₅ ) is formed on the surface of the tantalum by anodic oxidation, and the tantalum capacitor (220) having the structure in which the conductive polymer layer is disposed on the tantalum oxide ) Can be used.

The multilayer ceramic capacitor 110 and the tantalum capacitor 120 are connected in parallel.

The composite electronic component according to the second embodiment of the present invention includes a molding part 250 arranged to surround the composite body 230.

9 is a perspective view schematically showing a composite electronic part according to a third embodiment of the present invention.

Referring to FIG. 9, in the composite electronic device according to the third embodiment of the present invention, the multilayer ceramic capacitor 310 may be coupled to the lower portion of the tantalum capacitor 320.

That is, the composite body 330 in which the multilayer ceramic capacitor 310 and the tantalum capacitor 320 are combined on the insulation sheet 340 can be disposed.

Since the multilayer ceramic capacitor 310 is coupled to the lower portion of the tantalum capacitor 320, the current loop is further shortened when the composite electronic device is mounted on the substrate, so that the ESL of the composite electronic device can be further reduced.

Although the tantalum capacitor 320 is not particularly limited, for example, a tantalum capacitor having no inner lead frame may be used.

Alternatively, tantalum oxide (Ta ₂ O ₅ ) is formed on the surface of the tantalum by anodic oxidation, and the tantalum capacitor (320) having the structure in which the conductive polymer layer is disposed on the tantalum oxide ) Can be used.

The multilayer ceramic capacitor 310 and the tantalum capacitor 320 are connected in parallel.

The composite electronic device according to the third embodiment of the present invention includes a molding part 350 disposed so as to surround the composite body 330.

10 is a graph showing an output voltage versus time according to an embodiment of the present invention and a comparative example.

Referring to FIG. 10, in the embodiment of the present invention, the voltage ripple is greatly reduced compared with the comparative example in which only the tantalum capacitor is applied, and it is almost similar to the comparative example in which only the multilayer ceramic capacitor is used.

That is, in the comparative example using only the tantalum capacitor, the voltage ripple is 34 mV, whereas in the embodiment of the present invention, the voltage ripple is reduced to 9 mV similar to the comparative example (voltage ripple is 7 mV) using only the multilayer ceramic capacitor .

11 is a graph showing ESR voltage ripple (DELTA V) according to the volume ratio of the multilayer ceramic capacitor and the tantalum capacitor in the composite electronic device according to an embodiment of the present invention.

11, in the embodiment of the present invention, when the combined volume ratio of the tantalum capacitor and the multilayer ceramic capacitor is in the range of 5: 5 to 7: 3, Equivalent Series Resistance (ESR) (Voltage Ripple,? V) value is low, and high-capacity electronic parts can be realized.

According to another embodiment of the present invention, there is provided a multilayer ceramic capacitor including: a multilayer ceramic capacitor including an input terminal supplied with power converted by a power management unit, a ceramic body having a plurality of dielectric layers and internal electrodes disposed to face each other with the dielectric layer interposed therebetween; A power stabilizer for stabilizing the power supply and a ground terminal for bypassing a ripple of the power supply, the power stabilizer including a tantalum capacitor including a tantalum powder and a tantalum wire formed on one end side thereof, The power stabilizer provides a composite electronic part that reduces ripples of the supplied power.

A composite electronic device according to another embodiment of the present invention includes a plurality of inductors connected to a power management IC (PMIC) to stabilize a power supply, and a tantalum capacitor and a multilayer ceramic capacitor which can be used instead of a capacitor, And the like.

According to another embodiment of the present invention, the composite electronic part is formed of a single composite part of the power stabilizing part that stabilizes the power supplied by the power management IC (Power Management IC, PMIC) It is not.

The composite electronic component includes a multilayer ceramic capacitor including an input terminal to which power is converted by the power management unit, a ceramic body having a plurality of dielectric layers and internal electrodes disposed to face each other with the dielectric layer interposed therebetween, And a tantalum capacitor including a tantalum wire formed on one end of the tantalum capacitor, the power stabilizing unit stabilizing the power supply and a ground terminal for bypassing a ripple of the power supply.

12 is a view showing a driving power supply system for supplying driving power to a predetermined terminal requiring a driving power source through a battery and a power management unit.

Referring to FIG. 12, the driving power supply system may include a battery 400, a first power stabilization unit 500, a power management unit 600, and a second power stabilization unit 700.

The battery 400 may supply power to the power management unit 600. Here, the power supplied from the battery 400 to the power management unit 600 is defined as a first power source.

The first power stabilization unit 500 may stabilize the first power V1 and supply the stabilized first power to the power management unit. The first power stabilization unit 500 may include a capacitor C1 formed between a connection terminal of the battery 400 and the power management unit 600 and a ground. The capacitor C1 may reduce the ripple included in the first power supply.

Also, the capacitor C1 can charge the charge. In addition, when the power management unit 600 instantaneously consumes a large current, the capacitor C1 discharges the charged charge to suppress voltage fluctuation of the power management unit 600. [

According to an embodiment of the present invention, a composite electronic component including a composite 130 in which a multilayer ceramic capacitor 110 and a tantalum capacitor 120 are combined may be used in place of the capacitor C1.

The power management unit 600 converts electric power input to the electronic equipment to the electronic equipment, and distributes, charges, and controls the electric power. Therefore, the power management unit 600 may include a DC / DC converter.

Also, the power management unit 600 may be implemented as a power management integrated circuit (PMIC).

The power management unit 600 may convert the first power V1 into a second power V2.

The second power stabilizer 700 may stabilize the second power V2 and may transmit the stabilized second power to the output Vdd. An active element such as an IC that receives driving power from the power management unit 600 may be connected to the output terminal Vdd.

Specifically, the second power stabilization unit 700 may include a capacitor C2 formed between the power management unit 600 and the connection terminal of the output terminal Vdd and the ground.

The second power stabilization unit 700 may reduce the ripple included in the second power source V2.

In addition, the second power stabilization unit 700 can supply power stably to the output terminal Vdd.

A composite electronic component including a composite 130 in which a multilayer ceramic capacitor 110 and a tantalum capacitor 120 are combined may be used in place of the capacitor C2 according to an embodiment of the present invention.

Table 1 below shows capacitance, ESR (Equivalent Series Resistance), and voltage ripple (voltage ripple) of a tantalum capacitor according to the volume ratio of the tantalum capacitor to the volume of the tantalum capacitor (volume of the tantalum capacitor: volume of the multilayer ceramic capacitor) ? V) characteristic determination results.

Sample The volume ratio of the tantalum and multilayer ceramic capacitors
(T: M) capacitance
(μF) ESR
(mΩ) ESL
(pH) Acoustic noise
(dBA) One* 10: 0 45.0 150 471 16.6 2* 9.5: 0.5 44.9 58 415 16.6 3 9: 1 44.7 27 369 16.7 4 8: 2 44.4 22 313 16.7 5 7: 3 44.1 17 281 16.8 6 6: 4 43.8 13 258 16.9 7 5: 5 43.5 11 240 16.9 8 4: 6 43.0 9.2 225 17.3 9 3: 7 42.9 8.3 213 17.5 10 2: 8 42.6 7.3 203 18.1 11 * 1: 9 42.3 6.2 197 26.5 12 * 0: 10 42.0 5.1 207 28.2

*: Comparative Example

Referring to Table 1, Samples 1 and 2 show that the equivalent series resistance (ESR) is increased when the combined volume ratio of the tantalum capacitors exceeds 9 in the composite electronic part.

For capacitors used in the power stage, if the equivalent series resistance (ESR) value exceeds 30 mΩ, the voltage ripple and radiation noise increase, and the power supply efficiency may decrease.

Samples 11 and 12 show that the coupling volume ratio of the tantalum capacitors is less than 2, and the effect of reducing the acoustic noise is not remarkably exhibited.

Samples 3 to 10 illustrate embodiments of the present invention in which the combined volume ratio of the tantalum capacitor and the multilayer ceramic capacitor is in the range of 9: 1 to 2: 8 and the equivalent series resistance (ESR) It is possible to realize a composite electronic part having an excellent effect of improving acoustic noise.

The mounting substrate of the composite electronic component

13 is a perspective view showing a state in which the composite electronic component of Fig. 2 is mounted on a printed circuit board.

13, a mounting board 800 of a composite electronic component according to another embodiment of the present invention includes a printed circuit board 810 having electrode pads 821 and 822 on the top and a printed circuit board 810 And the solder 830 connecting the composite electronic component 100 and the electrode pads 821 and 822 to the composite electronic component 100.

The mounting board 800 of the composite electronic component according to the present embodiment includes a printed circuit board 810 on which the composite electronic component 100 is mounted and two or more electrode pads 821 and 821 formed on the top surface of the printed circuit board 810. [ 822).

The electrode pads 821 and 822 include first and second electrode pads 821 and 822 connected to the cathode terminal 161 and the cathode terminal 162 of the composite electronic part, respectively.

The positive and negative terminals 161 and 162 of the composite electronic component are electrically connected to the printed circuit board 810 by the solder 830 in a state of being in contact with the first and second electrode pads 821 and 822, .

Power stabilization unit

FIG. 14 is a detailed circuit diagram of a power stabilization unit including a composite electronic device according to an embodiment of the present invention.

According to another embodiment of the present invention, a first power stabilizer 500 for stabilizing the power supplied from the battery 400 and the battery 400, and a second power stabilizer 500 for switching the power supplied from the first stabilizer 500 And a second power stabilization unit 700 for stabilizing the power provided from the power management unit 600. The first power stabilization unit 500 or the second power stabilization unit 500 700 includes a tantalum capacitor composed of a capacitor including a ceramic body in which a plurality of dielectric layers and internal electrodes disposed so as to face each other with the dielectric layer interposed therebetween and a tantalum powder and a body in which tantalum wires are formed on one end side Wherein the composite electronic component includes a power stabilization unit including a composite electronic component that reduces ripples of the supplied power supply, The ball.

Referring to FIG. 14, the power stabilization unit includes a battery 400, a first power stabilizer 500 for stabilizing the power supplied from the battery 400, a second power stabilizer 500 for stabilizing the power supplied from the first stabilizer 500, And a second power stabilization unit 700 for stabilizing the power supplied from the power management unit 600. The second power stabilization unit 700 may be a power stabilization unit,

The power management unit 600 includes a transformer having a primary side and a secondary side insulated from each other, a switch unit disposed at a primary side of the transformer for switching power supplied from the first stabilizing unit, PWM IC to control; And a rectifying unit located on a secondary side of the transformer and rectifying the converted power.

That is, the power management unit 600 may convert the power supplied from the first power stabilization unit 500, for example, the first voltage V1 into the second voltage V2 through the switching operation of the switch unit. At this time, the PWM IC of the power management unit 600 can control the switching operation of the switch unit so that the first voltage V1 can be converted into the second voltage V2.

Then, the second voltage V2 may be rectified through the rectifying part, for example, the diode element D1, and then supplied to the second power stabilizing part 700. [

The first power stabilization unit 500 or the second power stabilization unit 700 includes a multilayer ceramic capacitor including a plurality of dielectric layers and a ceramic body having internal electrodes disposed to face each other with the dielectric layer interposed therebetween, And a composite body including a tantalum capacitor-containing composite body including a tantalum powder and a body portion having a tantalum wire disposed on one end side thereof. In addition, the composite electronic part can reduce the ripple of the supplied second voltage V2.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

100: Composite electronic parts
110, 210, 310: Multilayer Ceramic Capacitors
120, 220, 320: Tantalum capacitors 130, 230, 330:
111: ceramic body 121: tantalum wire
122: main body portion of the tantalum capacitor
131, 132: first and second outer electrodes
140, 240, 340: insulating sheet 141, 142:
150, 250, 350: molding part 161, 162: anode and cathode terminal
170: Insulation layer 400: Battery
500: first power stabilizer 600: power manager
700: second power stabilization unit
800: mounting board 810: printed circuit board
821, 822: electrode pad 830: solder

Claims (37)

And a tantalum capacitor. In the graph of the Equivalent Series Resistance (ESR) versus frequency of the input signal, the self resonant frequency (SRF) Wherein an inflexion point of Equivalent Series Resistance (ESR) occurs in at least one of the following frequency regions.
The method according to claim 1,
Wherein the composite is disposed on an upper surface of an insulating sheet including a connecting conductor portion disposed on at least one of an upper surface and a lower surface,
Wherein the multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers and internal electrodes disposed to face each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on an outer peripheral surface of the ceramic body,
Wherein the tantalum capacitor includes a tantalum powder body and a tantalum wire disposed on one end side thereof,
A positive terminal connected to the tantalum wire and the first external electrode, and a second terminal disposed on a second side surface and a bottom surface in the longitudinal direction of the molding part, the molding terminal being disposed on the first side surface and the bottom surface in the longitudinal direction of the molding part, And a cathode terminal connected to the body portion of the tantalum capacitor and the second external electrode.
3. The method of claim 2,
Wherein the tantalum wire is exposed to a longitudinal first side of the molding part.
3. The method of claim 2,
Wherein the connecting conductor portion is exposed to a longitudinal first side of the molding portion.
3. The method of claim 2,
And the connection conductor portion is connected to the first and second external electrodes, respectively.
3. The method of claim 2,
And the cathode terminal and the first external electrode are connected through the connection conductor portion.
3. The method of claim 2,
And the negative terminal and the second external electrode are connected through the connection conductor portion.
3. The method of claim 2,
Wherein the connection conductor portion includes a lead portion exposed in a longitudinal second side of the molding portion and a first extension portion and a second extension portion extending in a first direction at the lead portion.
9. The method of claim 8,
Wherein the second extending portion is shorter than the first extending portion.
3. The method of claim 2,
Wherein the connection conductor portion includes a first connection conductor portion exposed in a longitudinal second side of the molding portion and a second connection conductor portion exposed in a longitudinal first side and a second side surface of the molding portion, respectively.
3. The method of claim 2,
Wherein the connection conductor portion, the tantalum capacitor, the connection conductor portion, and the multilayer ceramic capacitor are connected by a conductive paste.
3. The method of claim 2,
Wherein the cathode terminal and the cathode terminal include a lower base layer, a side base layer connected to the lower base layer, and a plating layer disposed so as to surround the lower base layer and the side base layer.
13. The method of claim 12,
In this case, the underlying layer is formed by etching.
13. The method of claim 12,
Wherein the lateral underlying layer is formed by deposition.
The method according to claim 1,
Wherein the multilayer ceramic capacitor is coupled to at least one of a side surface, an upper surface, and a lower surface of the tantalum capacitor.
The method according to claim 1,
Wherein an insulating layer is disposed on a coupling surface of the multilayer ceramic capacitor and the tantalum capacitor.
The method according to claim 1,
Wherein a combined volume ratio (tantalum capacitor: multilayer ceramic capacitor) of the tantalum capacitor and the multilayer ceramic capacitor is 2: 8 to 9: 1.
Insulating sheet;
A connection conductor disposed on at least one of an upper surface and a lower surface of the insulating sheet;
A ceramic body provided on the upper surface of the insulating sheet and having a plurality of dielectric layers and internal electrodes arranged so as to face each other with the dielectric layer interposed therebetween and first and second external electrodes disposed on the outer peripheral surface of the ceramic body, A ceramic capacitor, and a tantalum capacitor coupled body including a tantalum powder and a body portion having a tantalum wire disposed on one end side thereof;
A molding part arranged to surround the composite; And
A positive terminal connected to the tantalum wire and the first external electrode, and a second terminal disposed on a second side surface and a bottom surface in the longitudinal direction of the molding part, the main body part of the tantalum capacitor, And a negative terminal connected to the second external electrode.
19. The method of claim 18,
Wherein the tantalum wire is exposed to a longitudinal first side of the molding part.
19. The method of claim 18,
Wherein the connecting conductor portion is exposed to a longitudinal first side of the molding portion.
19. The method of claim 18,
And the connection conductor portion is connected to the first and second external electrodes, respectively.
19. The method of claim 18,
And the cathode terminal and the first external electrode are connected through the connection conductor portion.
19. The method of claim 18,
And the negative terminal and the second external electrode are connected through the connection conductor portion.
19. The method of claim 18,
Wherein the connection conductor portion includes a lead portion exposed in a longitudinal second side of the molding portion and a first extension portion and a second extension portion extending in a first direction at the lead portion.
25. The method of claim 24,
Wherein the second extending portion is shorter than the first extending portion.
19. The method of claim 18,
Wherein the connection conductor portion includes a first connection conductor portion exposed in a longitudinal second side of the molding portion and a second connection conductor portion exposed in a longitudinal first side and a second side surface of the molding portion, respectively.
19. The method of claim 18,
Wherein the connection conductor portion, the tantalum capacitor, the connection conductor portion, and the multilayer ceramic capacitor are connected by a conductive paste.
19. The method of claim 18,
Wherein the cathode terminal and the cathode terminal include a lower base layer, a side base layer connected to the lower base layer, and a plating layer disposed so as to surround the lower base layer and the side base layer.
29. The method of claim 28,
In this case, the underlying layer is formed by etching.
29. The method of claim 28,
Wherein the lateral underlying layer is formed by deposition.
19. The method of claim 18,
Wherein the multilayer ceramic capacitor is coupled to at least one of a side surface, an upper surface, and a lower surface of the tantalum capacitor.
19. The method of claim 18,
Wherein an insulating layer is disposed on a coupling surface of the multilayer ceramic capacitor and the tantalum capacitor.
19. The method of claim 18,
Wherein a combined volume ratio (tantalum capacitor: multilayer ceramic capacitor) of the tantalum capacitor and the multilayer ceramic capacitor is 2: 8 to 9: 1.
An input terminal receiving power converted by the power management unit;
A tantalum capacitor including a tantalum capacitor including a tantalum powder and a tantalum wire formed on one side of the tantalum capacitor, the tantalum capacitor including a tantalum capacitor including a plurality of dielectric layers and a ceramic body having internal electrodes disposed to face each other with the dielectric layer interposed therebetween; A power stabilizer for stabilizing the power supply; And
And a ground terminal for bypassing a ripple of the power supply,
Wherein the power stabilizing unit reduces the ripple of the supplied power.
A printed circuit board having an electrode pad thereon;
A composite electronic component according to any one of claims 1 to 18 provided on the printed circuit board; And
And a solder connecting the electrode pad and the composite electronic part.
battery;
A first power stabilizer for stabilizing the power supplied from the battery;
A power manager for converting power supplied from the first stabilizer through a switching operation; And
And a second power stabilization unit for stabilizing the power supplied from the power management unit,
Wherein the first power stabilizer or the second power stabilizer includes a tantalum powder and a capacitor composed of a ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with the dielectric layer interposed therebetween are laminated, And a tantalum capacitor composed of a body formed with the tantalum capacitor, wherein the composite electronic part reduces a ripple of the supplied power supply.
37. The apparatus of claim 36,
A transformer in which a primary side and a secondary side are insulated from each other;
A switch unit located at a primary side of the transformer and switching power supplied from the first stabilizing unit;
A PWM IC for controlling a switching operation of the switch unit; And
A rectifying part located on a secondary side of the transformer and rectifying the converted power;
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