KR20160004819A

KR20160004819A - Optical semiconductor illuminating apparatus

Info

Publication number: KR20160004819A
Application number: KR1020140083871A
Authority: KR
Inventors: 김동희; 김경례; 박현규; 김철주; 양휘석
Original assignee: 주식회사 포스코엘이디
Priority date: 2014-07-04
Filing date: 2014-07-04
Publication date: 2016-01-13

Abstract

The present invention relates to an optical semiconductor illumination apparatus. The optical semiconductor illumination apparatus comprises: a socket base fastened to a socket to enable an electric current to be applied; a converter electrically connected to the socket base; a housing coupled to the socket base and accommodating the converter; a heat dissipation base which is detachably coupled to the housing and arranged to be spaced apart from an end portion of the housing, and includes one or more semiconductor optical devices; and a plurality of heat dissipation pins which are arranged on the upper surface of the heat dissipation base, and are formed to be inclined upward from a central portion of the heat dissipation base and formed to be inclined downward from a predetermined position to the edge of the heat dissipation base. The end face of the housing coupled to the socket base is convex; the central portion of the heat dissipation base is concavely formed; and a space part, to which heat generated from the semiconductor optical devices is discharged, is formed between the end face of the housing and the central portion of the heat dissipation base. Therefore, the optical semiconductor illumination apparatus has an optimal structure for effectively discharging heat generated from a light source part and components to the outside.

Description

[0001] OPTICAL SEMICONDUCTOR ILLUMINATION APPARATUS [0002]

BACKGROUND OF THE INVENTION Field of the Invention [0002] The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus capable of obtaining an optimal structure that can effectively discharge heat generated from a light source unit and components.

An illumination device based on a photo-semiconductor using a light source such as an LED (Light Emitting Diode), an organic light emitting diode, a laser diode, an organic electroluminescent diode or the like includes a housing having a heat sink in a socket base having the same shape as a halogen lamp or an incandescent lamp Structure.

Here, a structure in which optical semiconductors are arrayed as a light source in such a housing, and an optical member for surrounding the optical semiconductor is mounted on the housing is also put on the market.

In this case, the edison base is a socket having the same shape as a halogen lamp or an incandescent lamp. When the socket base is aligned with the socket having a round screw after the tightening operation, It is widely used because it is not needed.

However, among the lighting devices based on optical semiconductors in recent years, high output products for use in factories, auditoriums, and the like include heat dissipation units including a heat sink of a metal material.

In such lighting devices based on optical semiconductors, the components including the circuit part are disposed on the upper part of the heat-radiating part, and the heat generated from the heat-radiating part is directly received, so that the temperature of the inside and the outside of the circuit- , The flow of air is not smooth, and the temperature of the light source part in which the LEDs are arrayed as well as the heat dissipating part also increases.

However, there is a problem that high-power products having an Edison-based structure can not find an optimized design structure capable of positively responding to such heat accumulation.

Patent Application No. 10-2011-0118371 Patent Application No. 10-2013-0012181 Utility Model Application No. 20-2012-0004931

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide an optical semiconductor lighting device capable of obtaining an optimal structure for effectively externally discharging heat generated from a light source part and parts.

According to an aspect of the present invention, there is provided a socket comprising: a socket base coupled to a socket to be energized; A converter electrically connected to the socket base; A housing coupled to the socket base and receiving the converter; And a heat dissipation base detachably coupled to the housing, the heat dissipation base being disposed apart from an end of the housing and including at least one semiconductor optical device; And a plurality of radiating fins radially arranged on an upper surface of the heat dissipation base and formed to be sloped upward from a central portion of the heat dissipation base and inclined downward from a predetermined position to an edge of the heat dissipation base, Wherein the housing has a convex surface, a central portion of the heat dissipation base is concave, and a space is formed between the end surface of the housing and the center portion of the heat dissipation base to discharge heat generated from the semiconductor optical device. A semiconductor lighting device can be provided.

The housing includes a hollow connection portion coupled to the socket base and having a predetermined length and a substrate on which the converter is mounted so that the inside diameter of the connection portion is gradually widened along a direction away from the socket base, And a connection flange portion extending along an edge of the opened accommodating portion and facing the heat dissipating base.

The housing includes a housing cover detachably coupled to the connection flange and forming a guide curved surface protruding in a direction away from the socket base.

The housing may further include a plurality of vent holes each penetrating the coupling flange and the cover flange formed along the edge of the housing cover coupled to the coupling flange.

The heat dissipation base includes a heat dissipation block in which a light emitting module in which at least one or more semiconductor optical elements are arrayed on the bottom surface and a communication hole through which a wiring electrically connected to the light emitting module passes, Wherein some of the radiating fins are radially arranged from an edge of the communication hole.

The radiating fins may include a plurality of first radiating fins radially disposed from a central portion of the radiating base and a plurality of first radiating fins disposed adjacent to one of the plurality of first radiating fins, And a plurality of second radiating fins having a plurality of second radiating fins.

The area of one of the first radiating fins is larger than the area of one of the second radiating fins.

The height of the first radiating fins protruded from the radiating base is higher than the height of the second radiating fins protruding from the radiating base.

The first radiating fin includes a plurality of rectilinear rib portions radially arranged along the edge of the communication hole penetrating the central portion of the heat dissipating base and being inclined upward gradually toward the edge side of the heat dissipating base, A first upwardly curved rib portion extending from each of the end portions so as to rise in a curved shape toward the edge side of the heat dissipation base; and a second upwardly curved rib portion extending from an end of each of the first upwardly curved rib portions, And a first downward curved rib portion formed to be inclined downwardly from the first upward curved rib portion to the first upward curved rib portion. The second radiating fin starts one end between one of the plurality of first upward curved rib portions and the neighboring first upward curved rib portion.

The first upward curved rib portion has a first vertex at an end of the straight rib portion,

A first curve starting portion formed so as to rise toward the edge side of the heat dissipation base in a shape corresponding to a curved portion disposed in a first quadrant or a quadrant of the xy coordinates, And the other end becomes the second apex, and the convex parabola

Wherein the first downward curved rib portion is formed in a shape that rises toward the edge side of the heat dissipation base in a shape corresponding to a curved portion disposed at a third quadrant or quadrant of the xy coordinate, And the second radiating fin is disposed between one of the plurality of first curve starting portions and a neighboring first curve starting portion.

The first downward curved rib portion has one end portion formed from the end portion of the first upwardly curved rib portion and the other end portion being the third apex point,

And a shape corresponding to the curved portion disposed in the second quadrant or the first quadrant of the xy coordinate is formed to be lowered toward the edge side of the heat radiation base.

The second radiating fin is disposed radially on the upper surface of the heat dissipating base with a communication hole passing through the central portion of the heat dissipating base and is formed in a curved shape rising toward the edge side of the heat dissipating base. And a second downwardly curved rib portion extending from the end of the second upwardly curving rib portion toward the edge side of the heat dissipation base, the second downwardly curving rib portion extending from the end of the second upwardly curving rib portion in a curved shape, And the height protruded to the end of the curved rib portion is lower than the height at which the first radiating fin protrudes from the radiating base.

And, the second upward curved rib portion has a fourth apex located at one end thereof, and a convex parabola

A second curved line starting portion formed so as to rise toward the edge side of the heat dissipating base in a shape corresponding to the curved line portion disposed in the first or second quadrant of the xy coordinate and a second curved line starting portion extending from the end of the second curved line starting portion And the other end is the fifth apex, and the convex parabola

And a second bent portion formed so as to rise toward the edge side of the heat dissipation base in a shape corresponding to the curved portion disposed in the third quadrant or quadrant of the xy coordinate.

The second downwardly curved rib portion has one end portion formed from the end portion of the second upwardly curved rib portion and the other end portion being the sixth apex point,

The heat dissipation base may further include an extension rim extending from an end of each of the radiating fins and an outer rim spaced apart from an edge of the heat dissipation base by connecting end portions of the extension pieces, And a vent slot is formed in a space between the extended piece and the outer rim.

The housing further includes a plurality of reinforcing ribs extending radially along the outer circumferential surface of the receiving portion and connected to the connecting flange portion.

The optical semiconductor lighting device may further include a plurality of fastening holes passing through the connection flange at regular intervals along the forming direction of the connection flange and an upper end disposed at a position corresponding to the fastening hole, A plurality of fastening protrusions projecting from the upper surface of the heat dissipating base so as to be spaced apart from each other; and fasteners inserted through the fastening holes to be engaged with the fastening protrusions.

According to the present invention having the above-described configuration, the following effects can be achieved.

First, in order to solve the phenomenon of heat accumulation from the central portion of the light source, the present invention is characterized in that, in order to solve the phenomenon of heat accumulation from the central portion of the light source, heat is radiated upward through a space portion formed between the central portion of the heat dissipation base recessed by a plurality of radially disposed heat dissipating fins, The cooling effect due to the heat conduction and the cooling effect due to the natural convection are increased to solve this problem.

Also, according to the present invention, at least one second radiating fin is separately formed between the first radiating fin and the neighboring first radiating fin among the plurality of radiating fins made up of the first and second radiating fins, thereby further increasing the heat transfer area, .

Particularly, according to the present invention, by making the shape and the size of the first radiating fin and the second radiating fin different from each other, the flow of air can be smoothly guided from the center of the radiating base and the end surface of the housing.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial sectional schematic view showing a heat exhausting structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention;
2 is a perspective view showing the overall appearance of an optical semiconductor lighting device according to an embodiment of the present invention.
3 is an exploded perspective view showing the overall structure of the optical semiconductor lighting apparatus according to the embodiment of the present invention.
4 is a perspective view showing the overall structure of a heat dissipation base, which is a main part of an optical semiconductor lighting device according to an embodiment of the present invention.
FIG. 5 is a partially cutaway perspective view showing a coupling relation between a housing and a heat-dissipating base, which are main parts of an optical semiconductor lighting apparatus according to an embodiment of the present invention.
FIG. 6 is a cross-sectional view of the optical semiconductor lighting apparatus according to an embodiment of the present invention, and FIG. 5 (a) is a sectional view of the optical semiconductor lighting apparatus according to an embodiment of the present invention. Fig. 5 (b) is a view showing a case where an existing lighting device is installed on a reflector, Fig. 5
FIG. 7 is a photograph showing a temperature distribution of a thermal imaging camera photographed by installing an optical semiconductor illumination device according to an embodiment of the present invention on a reflector

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings.

However, the present invention is not limited to the embodiments described below, but may be embodied in various other forms.

The present embodiments are provided so that the disclosure of the present invention is thoroughly disclosed and that those skilled in the art will fully understand the scope of the present invention.

And the present invention is only defined by the scope of the claims.

Thus, in some embodiments, well known components, well known operations, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention.

In addition, throughout the specification, like reference numerals refer to like elements, and the terms (mentioned) used herein are intended to illustrate the embodiments and not to limit the invention.

In this specification, the singular forms include plural forms unless the context clearly dictates otherwise, and the constituents and acts referred to as " comprising (or having) " do not exclude the presence or addition of one or more other constituents and actions .

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs.

Also, commonly used predefined terms are not ideally or excessively interpreted unless they are defined.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially sectional schematic view showing a heat exhausting structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention; FIG.

FIG. 2 is a perspective view showing the overall appearance of the optical semiconductor lighting apparatus according to one embodiment of the present invention, and FIG. 3 is an exploded perspective view showing the overall structure of the optical semiconductor lighting apparatus according to an embodiment of the present invention.

4 is a perspective view illustrating the overall structure of a heat dissipation base, which is a major part of an optical semiconductor lighting apparatus according to an embodiment of the present invention. FIG. 5 is a perspective view illustrating a main part of a photo semiconductor lighting apparatus according to an embodiment of the present invention, Is a partially cutaway perspective view showing a coupling relation of the heat dissipation base.

As shown in the drawings, the present invention includes a housing 300 in which a converter 200 is embedded in a socket base 100, a heat dissipation base 500 is detachably coupled to the housing 300, It can be understood that the plurality of radiating fins 500f are arranged.

The socket base 100 is electrically connected to a socket 600 (refer to FIG. 6 below). The socket base 100 includes a contact terminal 110 which is electrically connected to the socket 600 at an end thereof.

The converter 200 is electrically connected to the socket base 100, thereby relieving the flickering phenomenon inevitably caused by the characteristics of the AC waveform in the lighting apparatus according to the present invention operated by the AC direct drive type, So that it can relieve fatigue.

The housing 300 is coupled with the socket base 100 and is for providing a space in which the converter 200 described above is accommodated.

The heat dissipation base 500 is detachably coupled to the housing 300 and is disposed apart from the end of the housing 300 and includes at least one semiconductor optical device 401 and is provided for countermeasure against heat generation through conduction and convection .

The radiating fins 500f are radially arranged on the upper surface of the heat dissipating base 500 and are formed to be inclined upward from the center of the heat dissipating base 500 and downwardly inclined from a predetermined position to the edge of the heat dissipating base 100. [

The end surface of the housing 300 coupled to the socket base 100 is convex in a direction away from the socket base 100 as shown in FIG. 1, and a central portion of the heat dissipation base 500 formed by the plurality of heat dissipation fins 500f And it is concaved to correspond to the end surface of the housing 300.

At this time, heat generated from the semiconductor optical device 401 is discharged between the end surface of the housing 300 and the central portion of the heat dissipating base 500 in an upward sloping manner from the center of the heat dissipating base 500 (see an arrow indicated by a dotted line in FIG. 1) As shown in Fig.

Accordingly, the heat generated from the semiconductor optical device 401 is discharged upwardly along the space, and the direction in which heat is upwardly inclined is formed by the end surface of the housing 300 and the heat dissipation fins 500f And the space portion formed by the central portion shape.

That is, since the generated heat naturally rises, the shape of the space portion can also serve as a guide passage for heat discharge.

In addition, the arrows indicated by dashed lines in FIG. 1, that is, the direction of heat discharge, are discharged upward from the central portion of the heat-dissipating base 500 along the end surface of the convex housing 300 as described above, May be discharged parallel to the upper surface of the heat dissipating base 500 along the space of the heat dissipating base 500 or may be formed along the side surface of the housing 300 through the end surface of the housing 300 from the center of the heat dissipating base 500 Of course.

It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention.

As described above, according to the present invention, the end face of the housing 300 coupled with the socket base 100 is convex in the direction away from the socket base 100, so that the air heated by the convection can be smoothly discharged to the outside. The central portion of the heat dissipation base 500 is concave corresponding to the end surface of the housing 300 and the end surface of the housing 300 and the central portion of the heat dissipation base 500 are spaced apart from each other.

The housing 300 includes the connecting portion 310, the receiving portion 320, and the connecting flange portion 330.

The connection unit 310 is a hollow member having a predetermined length coupled with the socket base 100 and is a wiring member electrically connected to the converter 200 to be described later. And a light emitting module (400) functioning as a light source unit.

The connecting portion 310 may be connected to the socket base 100 by selecting a different length depending on the size of the reflector 700 (see FIG. 6) provided with the socket 600 You can do it.

The accommodating portion 320 is formed to be gradually widened so as to expand the inner diameter of the connection portion 310 along the direction away from the socket base 100 and has a space in which a board or the like with the converter 200 mounted therein is embedded.

The connection flange portion 330 extends along the edge of the opened accommodating portion 320 and is engaged with the cover flange portion 351 of the separately provided housing cover 350 so as to be fixed to the heat- And is coupled to the heat dissipation base 500.

The housing cover 350 is detachably coupled to the connection flange 330 and forms a guide curved surface 352 which protrudes convexly in a direction away from the socket base 100. The guide cover surface 350 is formed on the upper surface of the heat radiating base 500 The central portion is recessed in a shape corresponding to the guide curved surface 352 so as to facilitate the heat discharge due to the convection as shown in FIG.

The central portion of the heat dissipation base 500 is formed concavely by the heat dissipation fins 500f to be described later.

At this time, the housing 300 includes a plurality of vent holes 360 which penetrate through the connection flange 330 and the cover flange 351 formed along the edge of the housing cover 350 coupled with the connection flange 330 So that heat discharge can be achieved.

The heat dissipation base 500 includes a light emitting module 400 in which at least one semiconductor optical device 401 is arrayed on the bottom surface and a communication hole 503 through which the wiring electrically connected to the light emitting module 400 passes, And a part of the plurality of radiating fins 500f is arranged radially from the edge of the communication hole 503. [0158] As shown in FIG.

The heat dissipation block forms an upper surface on which the plurality of heat dissipation fins 500f are arranged in the heat dissipation base 500 and forms a bottom surface on which the light emitting module 400 is seated as shown in FIGS.

The radiating fin 500f includes a plurality of first radiating fins 501 radially disposed from the central portion of the radiating base 500 and a plurality of first radiating fins 501 disposed between adjacent first radiating fins 501 And a plurality of second radiating fins 502 having different shapes from those of the first radiating fins 501.

The area of one of the first radiating fins 501 disposed on the heat dissipating base 500 is formed larger than the area of one of the second radiating fins 502 to form various airflows and smoothly discharge the heat. have.

The height at which the first radiating fins 501 protrude from the radiating base 500 from the difference in area between the first radiating fins 501 and the second radiating fins 502 is equal to the height at which the second radiating fins 502 protrude from the radiating base 500 &Lt; / RTI >

Hereinafter, the detailed structure of each of the first and second radiating fins 501 will be described with reference to FIG.

The first radiating fin 501 is a structure including a straight rib portion 511, a first upward curved rib portion 521 and a first downward curved rib portion 531 sequentially from the center of the heat dissipating base 500 .

The straight rib portion 511 is a plurality of members arranged radially along the edge of the communication hole 503 penetrating the central portion of the heat dissipating base 500 and being formed to be gradually inclined upward toward the edge side of the heat dissipating base 500 .

The first upward curved rib portion 521 extends from the end of each of the straight rib portions 511 and is formed so as to curve upward toward the edge side of the heat radiation base 500.

The first downward curved ribs 531 extend from the ends of each of the first upward curved ribs 521 and are curved downwardly to the edges of the heat-dissipating base 500.

At this time, the second radiating fin 502 to be described later can be seen from the drawing that one end starts between one of the plurality of first upward curved ribs 521 and the neighboring first upward curved rib 521.

Here, the first upward curved rib portion 521 can be understood as a structure in which the first curved line starting portion 521a and the first curved line portion 521b are formed sequentially from the central portion of the heat radiation base 500 toward the edge side.

The first curve starting portion 521a has a first vertex p1 at the end of the straight rib portion 511 and a convex parabola

And upward toward the edge of the heat dissipating base 500 in a shape corresponding to the curved portion disposed in the first or second quadrant of the xy coordinates.

One end of the first bent portion 521b is formed from the end of the first curved line starting portion 521a and the other end is formed as the second apex p2,

And upward toward the edge side of the heat dissipating base 500 in a shape corresponding to the curved portion disposed in the third quadrant or the fourth quadrant of the xy coordinates.

Accordingly, the first downward curved rib portion 531, which will be described later, is formed from the second vertex p2, and the second radiating fin 502, which will be described later, has the first curved portion 521a adjacent to one of the plurality of first curved start portions 521a, And is located between the curve start portions 521a.

One end of the first downward curved rib 531 is formed from the end of the first upward curved rib 521 and the other end of the first downward curved rib 531 is the third apex p3, Convex parabola down

It can be understood that it is formed so as to fall toward the edge side of the heat radiation base 500 in a shape corresponding to the curved portion disposed in the second quadrant or the first quadrant of the xy coordinates.

On the other hand, the second radiating fin 502 has a structure in which the second upward curved rib portion 522 and the second downward curved rib portion 532 are formed sequentially from the central portion of the heat dissipation base 500 toward the edge side.

The second upward curved rib portion 522 is radially disposed on the upper surface of the heat dissipating base 500 with the communication hole 503 passing through the central portion of the heat dissipating base 500 as a center, In a curved shape.

The second downward curved rib portion 532 extends in a curved shape downwardly from the end of the second upward curved rib portion 522 toward the edge side of the heat radiation base 500.

Here, the height protruding from the heat-dissipating base 500 to the end of the second upward curved rib 522 is lower than the height at which the first radiating fin 501 protrudes from the heat-dissipating base 500.

The second upward curved rib 522 may be a structure in which the second curved portion 522a and the second curved portion 522b are sequentially formed from the central portion of the heat radiation base 500 toward the edge side .

The second curved line starting portion 522a has a fourth apex p4 at one end and a convex parabola

One end of the second bent portion 522b is formed from the end of the second curved line starting portion 522a and the other end is a fifth vertex p5,

One end of the second downward curved rib portion 532 is formed from the end of the second upward curved rib portion 522 and the other end of the second downward curved rib portion 532 is the sixth vertex p6 , Downward convex parabola

It can be seen that it is formed so as to be lowered toward the edge side of the heat radiation base 500 in a shape corresponding to the curved portion disposed in the second quadrant or the first quadrant of the xy coordinates.

The shape of the first and second heat dissipation fins 501 and 502 is determined by the shape of the end face of the housing 300, that is, the shape of the guide curved surface 352, So as to optimize the heat transfer characteristics due to heat conduction and convection.

Accordingly, the first and second heat dissipation fins 501 and 502 formed on the heat dissipation base 500 gradually increase the height from the central portion of the heat dissipation base 500 to the edge side so that the heat can flow smoothly, In the extended portion, the heat radiation effect is reduced in comparison with the weight or the area according to the extended length. Therefore, the height is gradually lowered in order to reduce the waste of unnecessary materials.

That is, the other end portions of the first radiating fin 501 and the second radiating fin 502, that is, the first downward curved rib portion 531 and the second downward curved rib portion 532 are connected to the second apexes p2 ) And the fifth vertex (p5), there is no difference in the heat radiation effect according to the heat conduction, so that the height is lowered gradually so that weight and volume can be reduced to help lighten the weight.

Meanwhile, the ventilation slots 500 may be further formed in the heat-dissipating base 500 so that cooling efficiency can be improved by passage of air introduced or discharged from the outside.

The heat dissipation base 500 may include an extension piece 504 extending from an end of each of the first heat dissipation fins 501 and an end of each of the extension pieces 504, And an outer rim 505 disposed apart from the outer rim 505 may be applied.

Therefore, the vent slot 506 is formed in the space between each extension piece 504 and the outer rim 505. [

In order to further enhance the structural strength of a portion where a heat-insulating base 500, which is a heavy metal, is coupled to the housing 300, which is a synthetic resin material, the housing 300 is radially extended along the outer peripheral surface of the housing portion 320 And a plurality of reinforcing ribs 340 extending to the connection flange portion 330 and connected thereto.

Further, in order to achieve uniform distribution and support of the load and to ensure structural stability, the present invention is characterized in that a plurality of fastening holes (not shown) corresponding to a plurality of fastening holes (not shown) And a plurality of fastening protrusions 540 protruding from the upper surface of the heat dissipating base 500 so that the housing 300 is spaced apart from the heat dissipating base 500. [

Here, a fixture (not shown) such as a bolt is inserted through the fastening hole and coupled with the fastening protrusion 510, thereby fixing the heat dissipating base 500.

As described above, the structure in which the shapes of the first and second radiating fins 501 and 502 of the heat dissipating base 500, which is a major part of the optical semiconductor lighting apparatus according to an embodiment of the present invention, We will look briefly at the following table with reference to the table below.

For reference, in Table 1 and Table 2, Comparative Example 1 is made only of a heat dissipation base, and there is no heat dissipation fin itself.

In Table 1 and Table 2, in Comparative Example 2, a heat radiating fin is formed on the heat radiating base, but the heat radiating fin protrudes in the same height as the first radiating fin 501 of the present invention, Is formed in the same manner as the second radiating fin 502 of the present invention, and is formed in the same manner as a generally rectangular member.

In addition, in Table 2, a housing 300 having the same structure as that of the present invention is provided on the heat dissipation base of Comparative Example 1 and Comparative Example 2 together with the heat dissipation base 500 of the present invention.

Comparative Example 1 Comparative Example 2 Invention The temperature of the heat dissipation base portion (占 폚) 75.1 72.0 69.5

Comparative Example 1 Comparative Example 2 Invention Temperature of heat dissipation base (℃) 81.1 78.0 76.8 Housing temperature on the heat dissipation base (℃) 90.6 88.2 82.2

That is, as shown in Tables 1 and 2, the first and second radiating fins (501 and 502) on the radiating base 500 of the present invention have excellent cooling performance and provide a smooth cooling performance We can see that it is implemented.

6, a case in which the optical semiconductor lighting apparatus according to an embodiment of the present invention is installed in the reflector 700 and a case in which the housing 30 of the existing lighting apparatus is installed in the reflector 700 will be described with reference to FIG. I would like to compare.

That is, since the heat dissipating base 500 spaced from the socket base 100 by the second length L2 is connected by the housing 300, the lighting apparatus according to the present invention is arranged as shown in FIG. 6 (a) It is possible to secure an additional sufficient convection space S1 between the inner surface of the reflector 700 and the outer surface of the housing 300 when the reflector 700 is mounted on the socket 600 equipped with the reflector 700. [

In other words, the above-mentioned convection space S1 is ensured by the fact that the housing 30 of the conventional lighting device 30 as shown in Fig. 6 (b) has a very short third length L3 in comparison with the present invention, S2) is also very small compared to the present invention, so that an additional heat radiation effect according to natural convection can be achieved as compared with the conventional lighting apparatus.

7, a slight exothermic phenomenon occurs in the vicinity of the heat-dissipating base 500, but in the vicinity of the inside of the reflector 700 and the outer circumferential surface of the housing 300 in which a sufficient convection space S1 is ensured, It was confirmed that the thermal rheology phenomenon did not occur.

As described above, it is understood that the present invention is based on a technical idea to provide an optical semiconductor lighting device capable of obtaining an optimal structure for effectively externally discharging heat generated from a light source part and parts.

It will be apparent to those skilled in the art that many other modifications and applications are possible within the scope of the basic technical idea of the present invention.

100 ... socket base
200 ... Converters
300 ... housing
310 ... connection
320 ... accommodating portion
330 ... connection flange
340 ... reinforced rib
350 ... housing cover
351 ... Cover flange
352 ... guide surface
360 ... vent hole
400 ... light emitting module
401 ... semiconductor optical device
500 ... heat-dissipating base
500f ... heat sink fin
501 ... first radiator pin
502 ... second heat radiating fin
503 ... communication hole
504 ... extension
505 ... outer rim
506 ... vent slot
511 ... straight rib portion
521 ... first upward curved rib portion
521a ... first curve start portion
521b ... first bent portion
522 ... second upward curved rib portion
522a ... second curve start portion
522b ... second bent portion
531 ... first downward curved rib portion
532 ... second downward curved rib portion
540 ... fastening protrusion
600 ... socket
700 ... Reflector
800 ... light emitting module
810 ... semiconductor optical device
p1 ... first corner
p2 ... second corner
p3 ... third corner
p4 ... fourth corner
p5 ... fifth corner
p6 ... sixth corner

Claims

A socket base which is fastened to the socket and energized;
A converter electrically connected to the socket base;
A housing coupled to the socket base and receiving the converter; And
A heat dissipation base detachably coupled to the housing and spaced apart from an end of the housing, the heat dissipation base including at least one semiconductor optical device; And
And a plurality of heat dissipating fins radially arranged on the upper surface of the heat dissipation base and formed to be sloped upward from a central portion of the heat dissipation base and inclined downward from a predetermined position to an edge of the heat dissipation base,
Wherein an end surface of the housing coupled to the socket base is convex, a central portion of the heat dissipation base is concave,
Wherein a space is formed between an end surface of the housing and a center portion of the heat dissipation base to discharge heat generated from the semiconductor optical device.

The method according to claim 1,
The housing includes:
A hollow connection portion coupled to the socket base and having a predetermined length,
An accommodating portion having a space for gradually expanding the inside diameter of the connecting portion along a direction away from the socket base, and having a space for accommodating the substrate on which the converter is mounted;
And a connection flange portion extending along an edge of the opened receiving portion and facing the heat radiating base.

The method according to claim 1,
The housing includes:
And a housing cover detachably coupled to a connection flange portion formed along an open other end edge of the housing away from the socket base to form a convexly curved guide curved surface in a direction away from the socket base. Optical semiconductor lighting device.

The method of claim 3,
The housing includes:
Further comprising a plurality of vent holes each penetrating the connection flange portion and the cover flange formed along the housing cover edge coupled with the connection flange portion.

The method according to claim 1,
The heat-
And a heat dissipation block in which a light emitting module in which at least one or more semiconductor optical elements are arrayed is disposed on a bottom surface and a communication hole passing through a wiring electrically connected to the light emitting module is passed through the center,
And a part of the plurality of radiating fins is arranged radially from an edge of the communication hole.

The method according to claim 1,
The heat-
A plurality of first radiating fins radially disposed from a central portion of the radiating base,
And a plurality of second radiating fins disposed between one of the plurality of first radiating fins and the neighboring first radiating fins and having a shape different from that of the first radiating fins.

The method of claim 6,
Wherein the area of one of the first radiating fins is larger than the area of one of the second radiating fins.

The method of claim 6,
Wherein a height at which the first radiating fins protrude from the radiating base is higher than a height at which the second radiating fins protrude from the radiating base.

The method of claim 6,
Wherein the first radiating fin comprises:
A plurality of straight rib portions arranged radially along the edge of the communication hole penetrating the central portion of the heat dissipation base and formed to be gradually inclined upward toward the edge side of the heat dissipation base,
A first upward curved rib portion extending from an end of each of the rectilinear rib portions and rising in a curved shape toward an edge side of the radiating base;
And a first downward curved rib portion extending from an end of each of the first upward curved rib portions to be curved downwardly to an edge of the heat radiating base,
Wherein the second radiating fin starts at one end between one of the plurality of first upward curved rib portions and a neighboring first upward curved rib portion.

The method of claim 9,
Wherein the first upward curved rib portion comprises:
A first corner point is formed at an end of the straight rib portion, and a convex parabola

A first curve starting portion formed so as to rise toward the edge side of the heat dissipation base in a shape corresponding to a curved portion arranged in a first quadrant or a quadrant of the xy coordinate,
One end is formed from the end of the first curve starting portion and the other end is made the second apex,

And a first bent portion formed in a shape corresponding to a curved portion disposed in a third quadrant or quadrant of the xy coordinate and rising toward the edge side of the heat radiation base,
Wherein the first downwardly curved rib portion is formed from the second apex,
Wherein the second radiating fin is disposed between one of the plurality of first curve starting portions and a neighboring first curve starting portion.

The method of claim 9,
The first downward curved rib portion
One end portion is formed from the end portion of the first upwardly curved rib portion and the other end portion is made the third apex point,

Is formed to have a shape corresponding to a curved portion disposed in a second quadrant or a quadrant of the xy coordinates and to be lowered toward the edge side of the heat radiation base.

The method of claim 6,
The second heat-
A plurality of second upward curved rib portions radially disposed on the upper surface of the heat dissipation base with a communication hole passing through the central portion of the heat dissipation base and formed so as to rise in a curved shape toward the edge side of the heat dissipation base,
And a second downwardly curved rib portion extending from the end of the second upward curved rib portion toward the edge side of the heat dissipation base in a curved shape inclined downwardly,
And a height protruding from the heat dissipation base to an end of the second upward curved rib is lower than a height at which the first heat dissipation fin protrudes from the heat dissipation base.

The method of claim 12,
Wherein the second upward curved rib portion comprises:
A fourth apex is disposed at one end, and a convex parabola

A second curve starting portion formed so as to rise toward the edge side of the heat dissipation base in a shape corresponding to a curved portion arranged in a first quadrant or a quadrant of the xy coordinate,
One end portion is formed from the end of the second curve starting portion and the other end is formed as the fifth apex point,

And a second bent portion formed in a shape corresponding to a curved portion disposed in a third quadrant or quadrant of the xy coordinate and rising toward the edge side of the heat radiation base.

The method of claim 12,
The second downward curved rib portion
One end portion is formed from the end portion of the second upwardly curved rib portion and the other end portion is made the sixth apex point,

The method according to claim 1,
The heat-
An extension piece extending from an end of each of the radiating fins,
Further comprising an outer rim that interconnects the ends of each of the extension pieces and is spaced apart from the rim of the heat dissipation base at regular intervals,
And a vent slot is formed in a space between the extended piece and the outer rim.

The method of claim 2,
The housing includes:
Further comprising a plurality of reinforcing ribs extending radially along an outer circumferential surface of the accommodating portion and connected to the connection flange portion.

The method of claim 2,
In the optical semiconductor lighting device,
A plurality of fastening holes passing through the connection flange part at equal intervals along the forming direction,
A plurality of fastening protrusions projecting from an upper surface of the heat dissipation base so that the housing is spaced apart from the heat dissipation base;
And a fastener inserted through the fastening hole and coupled with the fastening protrusion.