KR20150143287A - Rear case for electronic apparatus - Google Patents

Abstract

Disclosed is a rear case for an electronic device which expresses design features of metal texture without interrupting an electromagnetic wave signal. The rear case provided to a rear surface of an electronic device comprises: a transparent substrate which is arranged on the rear surface of the electronic device; and a metal decoration which is made of a metal material and provided to one surface of the transparent substrate. The metal decoration comprises a plurality of thin metal film figures which are electrically and mutually insulated.

Description

REAR CASE FOR ELECTRONIC APPARATUS

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rear case for an electromagnetic device, and more particularly to a rear case for an electromagnetic device capable of expressing design characteristics of a metal texture without disturbing an electromagnetic wave signal.

Typically, a rear case is provided on the back of electronic devices such as smart phones, tablets, notebooks, and monitors.

Plastic material is mainly used as a material of the rear case for an electromagnetic device, but it is difficult to express a high-quality texture due to the characteristics of a plastic material.

On the other hand, the performance of electronic devices is important in recent years, but the external design of electronic devices is as important as that. For example, according to a survey of buyers, the first thing to consider when purchasing a product is 'design'. The result is that the external design of the product greatly influences the purchase of the product.

The rear case can represent the external design of the electronic device together with a basic role of protecting the internal components of the electronic device from external impacts. To this end, in recent years, various studies have been made on the material of the rear case, which can exhibit a unique design effect so as to satisfy the rapidly changing consumer needs.

For example, in recent years, various attempts have been made to form a rear case with a metal material such as aluminum.

On the other hand, when a metal material is used as the material of the rear case, a unique design characteristic of the metal texture can be expressed. However, when the rear case is formed of a metal material, the inherent characteristics of the metal deteriorate electromagnetic wave signals (for example, antenna propagation signals), thereby interfering with communication.

Accordingly, in recent years, a variety of studies have been made on a rear case capable of expressing a unique design characteristic without interfering with an electromagnetic wave signal.

The present invention provides a rear case for an electromagnetic device capable of expressing a design characteristic of a unique texture without interfering with an electromagnetic wave signal.

In particular, the present invention provides a rear case for an electromagnetic device having metal decorations capable of expressing a design characteristic of a metal texture using a metal material and capable of preventing deterioration of an electromagnetic wave signal such as an antenna signal.

In addition, the present invention provides a transparent substrate in which fine bends and flat portions are formed to prevent reflection of light due to metal decoration, and light can be reflected at the outermost edge portion, Provide rear case for machine.

Further, the present invention provides a rear case for an electromagnetic device which can improve the metal decorating effect by forming the metal decoration into a multi-layered metal structure.

In addition, the present invention provides a rear case for an electromagnetic device which can improve the product value, contribute to the upgrading of the product, and enhance the satisfaction of the consumer.

According to a preferred embodiment of the present invention, a rear case provided on a rear surface of an electronic device includes a transparent substrate disposed on a rear surface of the electronic device, Wherein the metal decorations include a plurality of electrically thinned metal foil geometries.

For reference, the rear case in the present invention can be understood as a concept including a case that is disposed on the outermost back surface of the electronic device and is directly exposed to the outside, and a case that can be stacked on the back surface of the electronic device. In addition, the rear case of the present invention may be attached to a case of an electronic device or may be integrated with a case by a double injection method during injection molding of the case, or may be used as a protective film having an adhesive layer on one side.

The metal decoration consists of a plurality of electrically thin metal thin film shapes. For reference, the metal thin film shape can be understood as meaning a shape including at least one of a polygon, a circle, an ellipse, and a hairline.

The size of the metal thin film graphic form can be appropriately changed according to the required conditions and design specifications. Preferably, the metal thin film figure may be formed to a size that does not cause electromagnetic interference, such as an antenna signal.

For example, a plurality of metal thin film figures may be formed to have a size of 10 to 1000 mm, and each metal thin film figure may be spaced apart by a gap of 2 to 100 mm. In some cases, the size and spacing of the metal thin film graphic form may be formed in nanometer units.

A fine bent portion corresponding to the metal decoration may be formed on the transparent substrate so as to prevent reflection of light (reflection mirror effect) caused by metal decoration of the metal material.

For reference, it can be understood that, in the present invention, the fine bend portion corresponding to the metal decoration is formed on the transparent substrate, it is understood that the metal decoration and the fine bend portion in the planar projection are arranged in the overlapping areas.

The fine bends can be formed on one side or the other side of the transparent substrate according to the required conditions and design specifications. In one example, the fine bend portion may be formed on the inner surface (one surface) of the transparent substrate, and the metal decoration may be formed to cover the fine bend portion on one surface of the transparent substrate. In some cases, metal decorations may be formed on the inner surface of the transparent substrate, and fine bends may be formed on the outer surface of the transparent substrate. Alternatively, it is also possible that the fine bend portion is provided so as to cover the metal decoration on one side of the transparent substrate.

Further, a flat portion may be provided between the outermost rim of the transparent substrate and the fine bend portion. Here, the flat portion can be understood as a flat portion where fine bend portions are not formed (raw or untreated).

Further, the rear case for an electronic device may include a printing layer formed on the bottom surface of the metal decoration. In addition to the effect of preventing light leakage, the printed layer enables the new design effect to be expressed through the difference in texture with the metal thin film pattern.

In addition, the transparent substrate according to the present invention may include a metal line formed along the outermost border of the transparent substrate, an oxide thin film layer formed on the transparent substrate, an inorganic thin film layer formed so as to cover the fine bend portion, and a protective coating layer formed to cover the metal decoration .

According to the present invention, by using the metal decorations including a plurality of metal thin film figures, it is possible to prevent electromagnetic wave signal interference while expressing the design characteristics of the metal texture.

Particularly, according to the present invention, by using a plurality of metal thin film figures electrically insulated from each other as metal decorations, it is possible to prevent deterioration of electromagnetic wave signals due to metal characteristics, while exhibiting high-grade design characteristics of metal texture.

Further, according to the present invention, it is possible to prevent the reflection of light (reflection mirror effect) as the metal decoration is formed of a metal material by forming the fine bent portion on the transparent substrate.

In addition, according to the present invention, metal decorations of fine bends and metal materials are formed on different surfaces of a substrate of a transparent substrate, light incident on the transparent substrate can be scattered first through the fine bends, It is possible to minimize the reflection of light by the light source.

According to the present invention, since the fine bend portion serving as a scattering layer for scattering light and the flat portion serving as a mirror surface reflecting light are coexisted on the transparent substrate, It is possible to reflect the light at the outer edge portion and to scatter the light at the inner edge portion, thereby making it possible to express a more exclusive and unique design effect.

In addition, according to the present invention, when the transparent substrate is made of glass or tempered glass, it is possible to provide a rough flat portion between the outermost rim of the glass substrate and the fine bend, It is possible to prevent breakage and cracking of the outermost frame.

In addition, according to the present invention, by forming the print layer so as to cover the metal decoration, a new design effect can be expressed through the difference in texture with the metal thin film figure as well as the light leakage prevention effect.

Further, according to the present invention, the metal decoration effect can be further improved by forming the metal decoration into a multi-layered metal structure.

Further, according to the present invention, it is possible to improve the design characteristics and improve the product value. Therefore, it can contribute to the upgrading of the product and enhance the satisfaction of the consumer.

1 is a view for explaining a rear case for an electromagnetic device according to the present invention.
Fig. 2 is a view for explaining metal decoration as a rear case for an electronic device according to the present invention. Fig.
3 to 5 are views for explaining a method of manufacturing a rear case for an electronic device according to the present invention.
6 is a view for explaining a rear case for an electronic device according to another embodiment of the present invention.
7 to 9 are views for explaining a method of manufacturing a rear case for an electronic device according to another embodiment of the present invention.
10 is a view for explaining a rear case for an electronic device according to another embodiment of the present invention.
11 is a view for explaining a metal line as a rear case for an electromagnetic device according to the present invention.
12 is a view for explaining an oxide thin film layer as a rear case for an electromagnetic device according to the present invention.
13 and 14 are views for explaining an inorganic thin film layer as a rear case for an electronic device according to the present invention.
15 is a view for explaining a protective coating layer as a rear case for an electromagnetic device according to the present invention.
16 and 17 are views for explaining a laminated structure with a glass substrate as a rear case for an electronic device according to the present invention.
Fig. 18 is a rear case for an electronic device according to the present invention, which is a view for explaining a modified example of a fine bend portion. Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments. For reference, the same numbers in this description refer to substantially the same elements, and the contents described in the other drawings under the above-mentioned rules can be explained by quoting, and the contents which are judged to be obvious to the person skilled in the art or repeated can be omitted.

FIG. 1 is a view for explaining a rear case for an electronic device according to the present invention, and FIG. 2 is a view for explaining metal decoration as a rear case for an electronic device according to the present invention. 3 to 5 are views for explaining a method of manufacturing a rear case for an electronic device according to the present invention.

Referring to FIGS. 1 and 2, a rear case 10 for an electronic device according to the present invention includes a transparent substrate 100 and a metal decoration 200.

For reference, the electronic device 20 in the present invention may include a general smart phone, a tablet, a smart watch, a notebook, and a monitor, and the present invention is limited or limited by the type and characteristics of the electronic device. It is not.

The transparent substrate 10 is disposed on the rear surface of the electronic device 20. The metal decoration 200 is formed on one surface of the transparent substrate 10 so as to display the design characteristics of the metal texture.

The metal decorations 200 may be partially or wholly formed on one side of the transparent substrate 10 and may be formed in a condition that does not disturb electromagnetic wave signals (for example, antenna propagation signals) of electronic equipment .

The transparent substrate 100 may be formed of ordinary glass, tempered glass, or sapphire, or may be formed of a general plastic material such as PET (polyethylene terephthalate) or polycarbonate having high light transmittance and high strength, The present invention is not limited or limited by the material and characteristics of the substrate 100. For reference, the transparent substrate may be disposed on the back surface of the electronic apparatus, but in some cases, other substrates may be laminated on the outer surface of the transparent substrate.

The metal decoration (200) is made of a metal material and is formed on one surface of the transparent substrate (100). Here, the one surface of the transparent substrate 100 may be understood to include both the surface of the transparent substrate 100 and the inner surface of the transparent substrate 100. Hereinafter, an example in which the metal decorations 200 are formed on the inner surface of the transparent substrate 100 will be described.

More specifically, at least a portion of the metal decorations 200 may be composed of a plurality of electrically insulated metal thin film figures 203. For reference, the metal thin film figure 203 can be understood to mean at least one of polygonal, circular, elliptical, and hairline shapes.

As described above, in the present invention, by using the metal decoration (200) formed of a plurality of metal thin film figures (203) electrically insulated from each other, the metal decoration (200) 200 are formed of a metal material, it is possible to prevent interference of transmission and reception of a radio wave signal.

Hereinafter, a method for manufacturing a rear case for an electronic device according to the present invention will be described with reference to FIGS. 3 to 5. FIG.

The manufacturing method of the rear case 10 for an electronic device according to the present invention includes the steps of providing a transparent substrate 100 and forming a metal decoration 200 made of a metal on one side of the transparent substrate 100 , And the metal decoration (200) is provided including a plurality of electrically thin metal thin film figures (203).

The metal decoration 200 including the metal thin film figure 203 can be formed in various ways according to the required conditions.

3, a transparent substrate 100 is first provided, a metal thin film layer 201 is formed on a transparent substrate 100, and then the metal thin film layer 201 is partially removed to form a metal thin film shape 203 may be formed.

The metal thin film layer 201 may be formed on the surface of the transparent substrate 100 by a conventional thermal deposition method, an E-beam deposition method, a sputtering method, or the like, The present invention is not limited to or limited by the kind and characteristics of the catalyst. For example, the metal thin film layer 201 may have a single layer structure or a multi-layer structure using at least one of chromium, aluminum, tin, palladium, molybdenum, copper, gold, titanium and indium. The metal thin film layer 201 may have a thickness of 10 to 500 nm.

In some cases, before forming the metal thin film layer, an oxide thin film layer such as alumina (Al 2 O 3), silicon dioxide (SiO 2), titanium dioxide (TiO 2) or the like is previously coated on the surface of the transparent substrate, Can be formed.

Although the metal thin film layer 201 is formed as a single metal layer in the above-described embodiment of the present invention, the metal thin film layer may be provided in a multi-layer structure of different or similar material, May be provided as a multi-layered metal structure.

Thereafter, a mask layer (not shown) is formed on the surface of the metal thin film layer 201 and then the metal thin film layer 201 is partially etched using the mask layer to form a plurality of A metal thin film figure 203 can be formed. For reference, the step of forming the plurality of metal thin film figures 203 may be performed by a conventional photolithography process.

The metal thin film figures 203 may be separated from each other in a plurality corresponding to the mask layer during the etching process, and the metal thin film figures 203 may be electrically isolated as they are separated from each other. With such a structure, each metal thin film figure 203 can be electrically insulated from each other, and an electromagnetic wave signal such as an antenna signal can be prevented from being interfered with by the metal characteristics of the metal thin film figure 203. In addition, the mask layer used for etching the metal thin film pattern can be removed before the print layer is formed, but in some cases it is possible to form the print layer without removing the mask layer.

For reference, in the present invention, an example in which the metal thin film figure 203 is formed in a rectangular shape will be described. In some cases, the metal thin film may be formed in any other polygonal shape such as a triangle, a hexagon, or the like, or may be formed in a shape such as a circle, an ellipse, or an irregular shape, or alternatively, a metal thin film shape may be formed in a shape of a hair line Do.

In the above-described embodiments of the present invention, metal decorations are formed of a plurality of metal thin film shapes insulated from each other. However, in some cases, the metal thin film layer itself may be used as metal decoration without any additional etching processing. It is also possible to do. For example, in the case of a metal thin film layer having a very thin thickness of 1 to several nanometers, since the metal atom is not connected and can be electrically insulated, the very thin metal thin film layer itself can be subjected to metal decoration Can be used.

On the other hand, the size of the metal thin film figure 203 can be appropriately changed according to required conditions and design specifications. For reference, the metal thin film may be formed in any conventional size, but may be formed to any size as long as it does not cause antenna signal crosstalk. For example, the metal thin film figure 203 may be formed to have a size of 10 to 1000 mm, and each metal thin film figure 203 may be spaced apart with a gap of 2 to 100 mm. In some cases, the size and spacing of the metal thin film graphic form may be formed in nanometer units.

5, the rear case 10 for an electronic device according to the present invention may include a printing layer 300 formed so as to cover the metal decoration 200 on the inner surface of the metal decoration 200. The print layer 300 can display a new design effect through the difference in texture between the metal thin film figure 203 and the light shielding effect.

The print layer 300 may be formed by a conventional silk screen printing method or the like, and may be provided to have a thickness of about 5 to 20 mm.

In addition, it is possible to prevent static electricity from accumulating on the metal thin film figure 203 through the print layer 300. For this, the print layer 300 may be formed of an electrically conductive material. Preferably, the print layer 300 may be formed of a high-resistance material having a specific resistance greater than 1 OMEGA cm.

For reference, the print layer 300 may have electrical conductivity by adding at least one of carbon powder, metal powder, and nano-conductive powder to the printing ink. In some cases, the printed layer may be configured to have electrical conductivity in other ways. Alternatively, it is possible to form the print layer using nonconductive colored, black, and color inks.

The printing layer 300 may be printed singly or plural times, and the forming conditions of the printing layer 300 may be appropriately changed according to required conditions and design specifications.

6 is a view for explaining a rear case for an electronic device according to another embodiment of the present invention, and FIGS. 7 to 9 are views for explaining a method of manufacturing a rear case for an electronic device according to another embodiment of the present invention to be. 10 is a view for explaining a rear case for an electronic device according to another embodiment of the present invention. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

6 to 9, a rear case 10 for an electronic device according to another embodiment of the present invention includes a transparent substrate 100 and a metal decoration 200, and the transparent substrate 100 is provided with a metal decoration 200 can be formed.

The fine bend section 102 may be formed to prevent reflection of light (reflection mirror effect) as the metal decoration 200 is formed of a metal material.

In the present invention, the fine bend section 102 corresponding to the metal decoration 200 is formed on the transparent substrate 100 in the region where the metal decoration 200 and the fine bend section 102 are overlapped with each other As shown in FIG.

The fine bend section 102 may be formed on one surface or the other surface of the transparent substrate 100 according to required conditions and design specifications. For example, the fine bend section 102 may be formed on the inner surface (one surface) of the transparent substrate 100, and the metal decoration 200 may be formed on one surface of the transparent substrate 100 so as to cover the fine bend section 102 .

The fine bend section 102 can be formed by processing the surface of the transparent substrate 100 using at least one of a sandblasting process, an etching process, a plasma etching process, a laser process, and a machining process, The present invention is not limited to or limited by the processing method of the processing unit 102. In some cases, the scattering layer may function as a fine bend by forming a polymer resin layer having bending on the surface of the transparent substrate, or a scattering layer including micro beads, without processing the surface of the transparent substrate Do. The scattering layer may be provided by mixing fine beads with an ordinary resin such as an ultraviolet ray hardening resin or ink, and then curing. For reference, the micro-bend section 102 may be formed in a regular or irregular shape, and the micro-bend section of the micro-bend section may have a height of about 0.1 μm to 50 μm.

7, a masking pattern 410 is first formed on a transparent substrate 100 through a printing or photomasking process. Then, a portion where the masking pattern 410 is not formed is sandblasted ), It is possible to form the fine bend section 102 having a random size of 1 to 10 mm in size. On the other hand, when the fine bending portion 102 is formed by laser machining or the like, the fine bending portion 102 can be formed to have a constant interval and size.

In addition, a portion where the fine bend section 102 is formed may have a scattering effect of scattering light, and a hazy effect that may appear to be puffy.

For example, the transparent substrate 100 may be provided corresponding to at least one electronic device, and may be provided after cutting the masking pattern 410 after the micro-bend 102 is formed.

In addition, a flat portion 104 may be provided between the outermost rim of the transparent substrate 100 and the fine bend portion 102. Here, the flat portion 104 can be understood as a flat portion where the fine bend portion 102 is not formed (raw or untreated). In one example, the flat portion 104 may be provided to have a width within approximately 1 mm so as to minimize the reflection of light through the flat portion 104.

When the transparent substrate 100 is formed of glass or tempered glass, if the fine bend section 102 is formed up to the outermost edge of the transparent substrate 100, the outermost edge of the transparent substrate 100, The glass is broken at the portion and cracks may occur. Particularly, the tempered glass has a high strength but is easily broken when an edge portion is cracked. To this end, it is possible to prevent breakage and cracking of the transparent substrate 100 by providing the unevenly-formed flat portion 104 at the edge portion (outermost frame) of the transparent substrate 100 which is relatively weak.

When the masking pattern 410 for forming the fine bending portion 102 is formed, the flat portion 104 is formed with a masking pattern 410 at a portion corresponding to the flat portion 104, 102 and then removing the masking pattern 410.

As described above, according to the present invention, by providing the fine bend section 102 and the flat section 104 together on the transparent substrate 100, reflection of light by the metal decoration 200 made of a metal can be prevented, By allowing the light to be reflected at the outermost edge, a unique design effect can be expressed.

Referring to FIG. 6 again, after forming the fine bend section 102, the metal decoration 200 may be formed to cover the fine bend section 102 and the flat section 104 at the same time.

9, after the metal decoration 200 is formed to cover the fine bend section 102 and the flat section 104 of the transparent substrate 100, the metal decoration 200 is covered with the print layer 300 May be formed.

On the other hand, in the embodiment of the present invention described above, an example is described in which the fine bend portion and the transparent substrate of metal decoration are formed on the same one surface (bottom surface). However, in some cases, the fine bend portion and metal decoration may be formed on opposite surfaces As shown in Fig.

10, a metal decoration 200 may be formed on the inner surface of the transparent substrate 100, and a fine bend portion 102 'may be formed on the outer surface of the transparent substrate 100 corresponding to the metal decoration 200 . Similarly, the print layer 300 may be formed on the inner surface of the metal decoration 200 so as to cover the metal decoration 200.

For example, the fine bend section 102 'may be provided in a hairline structure, a microlens structure, a spin structure, or a random shape by forming a scattering layer having a polymer resin layer or fine beads on the upper surface of the transparent substrate 100 .

In this structure, light incident on the transparent substrate 100 can be scattered first through the fine bend section 102 ', thereby minimizing the reflection of light by the metal decoration 200.

In some cases, metal decorations and fine bends are formed on the same surface (e.g., outer surface) of the transparent substrate. After the metal decorations are first formed on the outer surface of the transparent substrate, the fine bends cover the outer surface of the metal decoration. . In this case, the above-described scattering layer may be used as the fine bend portion.

Although the metal decoration 200 is directly formed on the surface of the transparent substrate 100 in the above-described embodiment of the present invention, the metal decoration may be formed on the back surface of the electronic device Thereafter, the transparent substrate may be bonded to the back surface of the electronic apparatus. Alternatively, it is also possible to form a coating layer of metal or other material so as to cover the metal decoration.

12 is a view for explaining an oxide thin film layer as a rear case for an electromagnetic device according to the present invention, and Fig. 12 is a cross- And FIG. 14 is a view for explaining an inorganic thin film layer as a rear case for an electromagnetic device according to the present invention, and FIG. 15 is a view for explaining a protective coating layer as a rear case for an electromagnetic device according to the present invention. 16 and 17 are views for explaining a laminated structure with a glass substrate as a rear case for an electromagnetic device according to the present invention. Fig. 18 is a rear case for an electromagnetic device according to the present invention. Fig. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

Referring to FIG. 11, the rear case for an electronic device according to the present invention may include a metal line 500 formed along an outermost edge of a transparent substrate 100.

Since the metal line 500 is formed in a region that does not interfere with the signal line, the metal line 500 need not be provided in an insulated structure like the metal thin film figure 203. For example, the metal line 500 may be formed in a region corresponding to the region where the flat portion is formed, and may be formed of the same or similar material as the metal thin film pattern described above.

The metal line 500 allows metallic light to be reflected at the outermost edge of the transparent substrate 100, thereby enabling a more luxurious and unique design effect.

12, the rear case for an electronic device according to the present invention may include an oxide thin film layer 600 formed on a transparent substrate 100, and a metal thin film shape 203 forming a metal decorating may include an oxide thin film layer 600 As shown in Fig.

The oxide thin film layer 600 can display a variety of colors by the refraction effect of light. The oxide thin film layer 600 may be formed by coating a conventional metal oxide such as TiO 2, SiO 2, Al 2 O 3, or the like with a single layer or a laminated structure. The oxide thin film layer 600 may be formed by conventional e-beam evaporation, sputtering, Deposition, PECVD, or the like. For example, the oxide thin film layer may be coated to a thickness of about 10 to 100 nm.

In addition, a print layer 300 (e.g., a black, white, or color print layer) may be formed on the surface of the metal thin film figure 203. In this structure, since the printed color can be transmitted when the thickness of the metal thin film figure 203 is thin, and the transmitted color can be mixed with the multi-coated color of the oxide thin film layer 600 to show the final color, Can be more variously formed.

Referring to FIG. 13, the rear case for an electronic device according to another embodiment of the present invention may include an inorganic thin film layer 700 provided on the transparent substrate 100 corresponding to the micro-bend section 102.

13, the inorganic thin film layer 700 may be provided to have a refractive index different from that of the micro bend section 102, and may be formed on the outer surface of the transparent substrate 100 so as to cover the micro bend section 102. For example, have. That is, the fine bend section 102 and the metal thin film figure 203 can be formed on the inner surface of the transparent substrate 100, and the inorganic thin film layer 700 can be formed on the outer surface of the transparent substrate 100 As shown in FIG.

14, the fine bend section 102 may be formed on the outer surface of the transparent substrate 100, and the inorganic thin film layer 700 may be first formed on the inner surface of the transparent substrate 100, It is also possible to form the metal thin film figure 203 on the surface of the inorganic thin film layer 700 so as to cover the surface of the inorganic thin film layer 700.

As the inorganic thin film layer 700, a transparent thin film such as a metal oxide film, a metal nitride film, or a metal fluoride film may be used. For example, the inorganic thin film layer is composed of SiO2 (1.46), Al2O3 (1.7), TiO2 (2.45), Ta2O5 (2.2), ZrO2 (2.05), HfO2 (2.0), Nb2O5 (2.33), Si3N4 (2.02), MgF2 May be provided by coating a single layer or a laminated structure by a method such as sputtering, E Beam Evaporation, PECVD, or the like.

The inorganic thin film layer 700 having a refractive index different from that of the fine bend section 102 allows light incident on the metallic thin film figure 203 to be incident in a more various form,

Referring to FIG. 15, the rear case for an electronic device according to the present invention may include a protective coating layer 800 formed to cover the surface of the metal decoration on one side of the transparent substrate 100.

For example, the protective coating layer 800 may be formed so as to cover the surface of the metal thin film graphic form to protect the metal thin film graphic object 203 when the metal thin film graphic object 203 is formed to be exposed to the outside. In addition, the protective coating layer 800 may be formed to cover the surface of the metal thin film figure 203, thereby minimizing light reflection of the metal. In some cases, it is also possible to form the protective coating layer and the metal decoration so as to be disposed on the opposite surface of the transparent substrate, respectively.

Referring to FIG. 16, the rear case for an electronic device according to the present invention can be laminated on the back surface of an electronic device, and the metal thin film figure 203, which forms a metal decoration, And may be provided on one surface of the transparent substrate 100.

That is, metal decorations may be formed on the back cover 110, and fine bends 102 may be formed on the transparent substrate 100 stacked on the back cover 110. For reference, in the embodiment of the present invention, fine bends are formed on the transparent substrate and metal decorations are formed on the cover glass. However, in the case of a structure in which the transparent substrate is laminated on the inner surface of the back cover, It is also possible to form a metal decoration and to form a fine bend in the back cover.

The transparent substrate 100 may be adhered to the back cover 110 using a conventional adhesive layer 106 or an adhesive film and the print layer 300 may be formed on the inner surface of the back cover 110. Alternatively, it is also possible to form a metal decoration and fine bend on the transparent substrate, and to form a printed layer on the back cover.

Referring to FIG. 17, according to another embodiment of the present invention, the transparent substrate 100 may be stacked on the inner surface of the back cover 110 of the electronic device. The fine bend section 102 may be provided on the outer surface of the bottom cover 110. An inorganic thin film layer 700 is formed on the inner surface of the transparent substrate 100 stacked on the inner surface of the bottom cover 110 via the adhesive layer 106, The metal thin film figure 203 and the print layer 300 may be sequentially formed.

Referring to FIG. 18, in the rear case for an electronic device according to the present invention, fine bends 102 and 103 may be provided in a plurality of layers. That is, the inner fine bend section 103 can be formed on the inner surface of the transparent substrate 100, and the outer fine bend section 102 can be formed on the outer surface of the transparent substrate 100.

The outer fine bend section 102 and the inner fine bend section 103 may be provided in the same or different shapes. For example, the outer fine bend section 102 may be provided by processing an outer surface of the transparent substrate 100, and the lower fine bend section 103 may form a polymer resin layer or a scattering layer on the inner surface of the transparent substrate 100 . In some cases, both the outer fine bending portion and the inner fine bending portion may be provided in the form of a processed surface of the transparent substrate, or may be provided in a structure using a polymer resin layer or a scattering layer.

In addition, a metal thin film figure 203 and a print layer 300 may be sequentially formed on the inner surface of the inner fine bend section 103. In this structure, even if the metal thin film figure is formed of a metal material having a relatively low adhesion force, the metal thin film figure can be formed on the surface of the inner fine bend, so that the adhesion of the metal film figure can be further improved.

Although the present invention has been described with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that

10: transparent substrate 100: transparent substrate
200: metal decoration 201: metal thin layer
203: metal thin film figure 300: printing layer
500: metal line 600: oxide thin film layer
700: inorganic thin film layer 800: protective coating layer

Claims (16)

In the rear case provided on the rear surface of the electronic apparatus,
A transparent substrate disposed on a rear surface of the electronic device; And
And a metal decoration provided on one surface of the transparent substrate made of a metal material,
Wherein the metal decorations include a plurality of electrically thin metal foil graphics. The method according to claim 1,
Wherein the transparent substrate has a fine bend portion corresponding to the metal decoration. 3. The method of claim 2,
Wherein the fine bend portion is provided on one surface of the transparent substrate and the metal decoration is provided on one surface of the transparent substrate so as to cover the fine bend portion. 3. The method of claim 2,
Wherein the fine bent portion is provided on the other surface of the transparent substrate. 3. The method of claim 2,
Wherein the fine bend portion is provided on one surface of the transparent substrate so as to cover the metal decoration. 3. The method of claim 2,
Wherein a flat portion is provided between an outermost rim of the transparent substrate and the fine bend portion. 3. The method of claim 2,
The micro-
The surface of the transparent substrate is processed by using at least one of a sand blasting process, an etching process, a plasma etching process, a laser process, and a machining process,
Wherein the transparent substrate is provided with a polymer resin layer having a curvature on the surface of the transparent substrate or a scattering layer including a micro bead. The method according to claim 1,
Wherein the plurality of metal thin film figures are formed in the form of at least one of electrically separated polygons, circular, elliptical, and hair lines. The method according to claim 1,
Wherein the plurality of metal thin film figures have a size of 0.1 to 0.5 mm and a thickness of 10 to 500 nm. The method according to claim 1,
Wherein the plurality of metal thin film figures are provided in a single layer or a multilayer structure using at least one of chromium, aluminum, tin, palladium, molybdenum, copper, gold, titanium and indium. The method according to claim 1,
And a printed layer formed on a bottom surface of the metal decoration. The method according to claim 1,
Further comprising a metal line formed along an outermost edge of the transparent substrate. The method according to claim 1,
Further comprising an oxide thin film layer formed on the transparent substrate,
Wherein the metal decoration is formed on the surface of the oxide thin film layer. 3. The method of claim 2,
Wherein the transparent substrate is provided with an inorganic thin film layer corresponding to the fine bend portion. The method according to claim 1,
And a protective coating layer formed on one surface of the transparent substrate to cover the metal decoration. The method according to claim 1,
Wherein the transparent substrate is laminated on the back surface of the electronic device,
Wherein the metal decoration is formed on a back surface of the electronic device and is provided on one surface of the transparent substrate.

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