KR20150134969A - Inverter package for motor and Motor using the same - Google Patents

Abstract

The present invention relates to an inverter package which increases heat emitting efficiency while maximizing a circuit design size. Especially, provided is the inverter package which symmetrically mounts switching elements on upper and lower surfaces of a printed circuit board wherein the switching elements constitute a power switching unit of an inverter, and arranges a conductive cover member and a heat emitting member on an upper surface of each switching element, thereby widening a current pattern width while minimizing a design size of a circuit board in the same PCB size, and increasing a heat emission performance.

Description

[0001] The present invention relates to an inverter package for a motor and a motor including the inverter package.

The present invention relates to an inverter package capable of maximizing a circuit design area and increasing a heat radiation efficiency.

The inverter for driving the motor is constituted by a package including various switching elements, and there is a demand for a technique for dissipating heat generated in a switching element and a pattern designing technique capable of realizing a high output while minimizing the size of the entire package.

Generally, one or a plurality of switching elements are mounted on a printed circuit board constituting the inverter package, and a heat dissipating member coupled with the switching elements is disposed to dissipate heat of the switching elements.

However, in order to combine the switching element and the heat dissipating member, there is a pressure applied from the upper side to the lower side of the printed circuit board, and in the process of joining between the heat dissipating member and the switching element, such a pressure causes the printed circuit board to bend locally .

In order to solve such a problem, a method of fixing a heat dissipating member to a printed circuit board using a fixing member such as a bolt has been proposed. However, this also increases the fastening space of the bolt and the like, It is not an alternative.

In addition, in the case of a motor requiring a high output power, the number of switching elements, circuit patterns, vias, and the like constituting the inverter increases. Inevitably, the size of the package gradually increases.

The embodiments of the present invention have been made to solve the above-mentioned problems. In particular, the embodiments of the present invention are implemented by mounting the switching elements constituting the power source switching unit of the inverter on the upper and lower surfaces of the printed circuit board so as to be mutually symmetrical, The conductive cover member and the heat dissipating member are disposed so that the current pattern width can be increased while minimizing the design area of the circuit board at the same PCB area and an inverter package capable of improving the heat radiation performance can be provided.

According to an embodiment of the present invention, there is provided a printed circuit board including a printed circuit board including circuit patterns on both sides of a substrate, a first switching element mounted to be electrically connected to a circuit pattern on one surface of the printed circuit board, And a second switching element which is electrically connected to a circuit pattern on the other side of the printed circuit board opposite to the one side and which is disposed at a position symmetrical to the first switching element, and a second switching element which is electrically connected to the first switching element and the second switching element And a first conductive cover member and a second conductive cover member both ends of which are in electrical contact with a part of the printed circuit board.

According to the embodiment of the present invention, the arrangement of the switching elements constituting the power supply switching unit of the inverter is mounted on the upper and lower surfaces of the printed circuit board so as to be mutually symmetrical, and the conductive cover member and the heat radiation member are disposed on the upper surfaces of the respective switching elements, It is possible to increase the current pattern width while minimizing the design area of the circuit board at the same PCB area and to provide an inverter package capable of improving the heat radiation performance.

Particularly, according to the embodiment of the present invention, a switching element is simultaneously mounted on the upper and lower surfaces of a printed circuit board and a conductive cover member is disposed on the upper surface of the switching element to increase the mounting efficiency without the structure of additional fixing bolts, It is possible to prevent the PCB from being warped based on the supporting force realized by the switching device mounted on the PCB.

Further, when a motor that forms a part of the heat dissipating member of the inverter package according to the embodiment of the present invention and the housing of the motor is implemented, not only the structure but also the heat radiating efficiency can be maximized.

1 is a schematic cross-sectional view of an inverter package for a motor according to an embodiment of the present invention.
2 illustrates a layout structure on a PCB of (a) a first switching device and (b) a second switching device according to an embodiment of the present invention.
3 is a circuit diagram showing an embodiment in which switching units included in an inverter of a motor are connected in parallel.
4 is an implementation conceptual view of the 'A' portion of FIG.
5 is a schematic cross-sectional view illustrating a structure in which an inverter package according to an embodiment of the present invention is applied to an electric oil pump (EOP).

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

1 is a schematic cross-sectional view of an inverter package for a motor according to an embodiment of the present invention.

Referring to FIG. 1, a motor zero inverter package according to an embodiment of the present invention includes a printed circuit board 100 including circuit patterns 130 on both sides of a substrate, a circuit pattern on one side of the printed circuit board 100, A first switching element 210 electrically connected to the first switching element 210, a first switching element 210 electrically connected to a circuit pattern on the other side of the first switching element 210 in a direction opposite to the first switching element 210, 2 switching element (310), a first conductive cover member (220) in contact with a surface of the first switching element and having both ends electrically connected to a part of the printed circuit board, And a second conductive cover member 320 electrically connected to a part of the printed circuit board.

In particular, the arrangement of the first switching device 210 and the second switching device 220, which are mounted symmetrically with respect to the printed circuit board 100, prevents localized warping of the printed circuit board, The design area of the mounting area and the circuit pattern can be minimized compared with a case where a plurality of switching elements are mounted on one side of the printed circuit board, thereby reducing the size of the overall package.

The printed circuit board 100 may be a variety of commercial printed circuit boards. In order to maximize heat radiation efficiency, however, a copper foil 120 is formed on the insulating layer 110 as shown in FIG. 1 And the metal layer 130 is formed on the copper foil 130.

The first switching device 210 and the second switching device 310 mounted on the printed circuit board 100 are mounted on a circuit pattern formed on a surface of the printed circuit board 100, The arrangement position of the printed circuit board 100 is arranged at a position that is vertically symmetrical with respect to the center line in consideration of a virtual center line in the thickness direction of the printed circuit board 100 so that mutual support force can be realized, And the like. The first switching device 210 and the second switching device 310 may be various diodes, thyristors, transistors, IGBTs, and GTOs. However, in the embodiment of the present invention, A metal oxide semiconductor field effect transistor (MOSFET) is applied.

Particularly, the first conductive cover member 220 and the second conductive cover member 320 are in contact with the surfaces of the first switching device 210 and the second switching device 310, respectively, according to the embodiment of the present invention And the terminal portions 221, 222, 321, and 322 of the first conductive cover member 220 and the second conductive cover member 320 are formed to have a structure connected to a circuit pattern on the surface of the printed circuit board. For example, when the first switching device 210 and the second switching device 310 are applied as MOSFETs according to the present embodiment, the first conductive cover member 220 and the second conductive cover member 220 The end portions 221, 222, 321, and 322 may perform a function corresponding to a drain.

1, the portions of the gates 223 and 323 and the source 224 and the portion of the source 324 in the mounting portion of the first switching device 210 and the second switching device 310, The first switching device 210 and the second switching device 310 may be electrically connected in parallel via the vias 140. The first switching device 210 and the second switching device 310 may be mounted in parallel to each other. In the case where the switching elements are disposed at mutually symmetrical positions and the first switching element 210 and the second switching element 310 are connected in parallel, the gate, drain, and source lines of each switching element are designed to be very short As a result, the space of the entire printed circuit board can be reduced.

The thermally conductive members 230 and 330 are disposed between the first switching device 210 and the second switching device 310 and between the first conductive cover member and the conductive cover members 220 and 320, Heat can be efficiently discharged to the upper part.

The first radiation member 240 and the second radiation member 340 are coupled to the upper portion of the first conductive cover member 220 and the conductive cover member 320, respectively, in the embodiment of the present invention. More specifically, the first conductive member 220 and the second conductive member 320 on the first switching element and the second conductive member 320 on the second switching element, 340). ≪ / RTI >

In this case, an insulating material layer (250, 350) disposed between the first switching element and the second switching element and the first heat radiation member and the second heat radiation member is disposed to prevent electrical shorting, So that it can be done efficiently. As shown in FIG. 1, the arrangement positions of the first and second heat radiation members 240 and 340 are also arranged at the upper portions of the respective switching elements, In the bonding process, pressing force is applied in mutually opposing surface directions with respect to the printed circuit board, so that even force is provided on opposite sides of the PCB, thereby preventing deformation of the PCB.

In the case of the inverter package according to the embodiment of the present invention in which the heat dissipating members are disposed at mutually opposing positions, the metal printed circuit board is used, and the conductive cover member is implemented, the same switching Compared with two devices, the thermal efficiency is about 6 times higher than that of the same printed circuit board.

2 illustrates a layout structure on a PCB of (a) the first switching device 210 and (b) the second switching device 310 according to the embodiment of the present invention. As shown in Fig. 1, since the structure is arranged on the printed circuit board with the symmetrical structure, the size of the circuit pattern can be reduced and the number of vias can be reduced compared with the case where two switching elements are arranged on the same plane. In addition, it is possible to provide a space in the PCB space for implementing the width of the circuit pattern, thereby allowing the design to allow a higher current.

FIG. 3 is a circuit diagram showing an embodiment in which switching parts included in an inverter of a motor are connected in parallel. When a required amount of current is large, a total of six switching elements A V, and W phases of the currents applied to the three groups of transistors.

In the case of implementing the switching elements of FIG. 4 to be mounted on one plane of the printed circuit board, the size of the printed circuit board becomes very large and the problem of heat dissipation must be considered very seriously.

However, in the case of packaging one group, that is, one group (A) connecting four switching elements in parallel as shown in FIG. 4, the layout of the circuit patterns can be absolutely reduced, The gate (G), drain (D), and source (S) lines in the group of devices can be made very short, which can reduce the overall size of the package.

The inverter package according to the embodiment of the present invention described above with reference to FIGS. 1 to 4 can be applied to various motors. 5 is a schematic cross-sectional view illustrating a structure in which an inverter package according to an embodiment of the present invention is applied to an electric oil pump (EOP).

5, only a pair of switching elements are disposed symmetrically with respect to each other with respect to the printed circuit board. However, it is needless to say that a structure in which a plurality of switching elements are packaged as described above with reference to FIGS. 3 and 4 can be applied.

In particular, the inverter package I according to the embodiment of the present invention is implemented in a structure in contact with the motor housing (MTH) of the motor which drives the EOP. That is, the switching elements 210 and 310 are mounted on the opposite sides of the printed circuit board 100 in FIG. 1, and the conductive cover member is mounted on the switching elements 210 and 310. The first switching element 210, The heat dissipating member 240 is mounted on the upper portion of the heat dissipating unit 300 in the same manner as the embodiment described above with reference to FIG. However, instead of mounting the heat releasing member on the upper portion of the second switching device 310, the housing MTH of the motor may be brought into contact with the second conductive cover member on the second switching device 310 in FIG. 1, So that the housing MTH can serve as a heat dissipating member. This makes it possible to further miniaturize the overall size of the inverter package, and to maximize the heat radiation efficiency, so that the inverter package can be combined with the motor.

A stator 400 including a plurality of unit stator cores, an insulator and a coil 410 may be disposed inside the housing MTH of the motor. The stator 400 is rotatably installed at the center of the stator 400, A rotor 500 including a through hole and a magnet module may be disposed. A rotating shaft 510 is disposed in the center of the rotor 500 so as to pass therethrough. The configuration of the stator 400 and the rotor 500 can be generally applied to a structure of a known motor, and a detailed description thereof will be omitted.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

100: printed circuit board
110: Insulation Blue
120: copper foil
130: metal layer
210: first switching element
220: first conductive cover member
230: thermally conductive member
240: first heat-radiating member
250: insulating material layer
310: second switching element
320: second conductive cover member
330: thermally conductive member
340: second heat-
350: insulating material layer
400: stator
500: Rotor

Claims (10)

A printed circuit board including circuit patterns on both sides of the substrate;
A first switching element mounted to be electrically connected to a circuit pattern on one surface of the printed circuit board;
A second switching element that is electrically connected to a circuit pattern on the other side opposite to the one surface and disposed at a position symmetrical to the first switching element; And
A first conductive cover member in contact with a surface of the first switching element and having both ends electrically connected to a part of the printed circuit board and a second conductive cover member electrically connected to a part of the printed circuit board, A second conductive cover member connected to the first conductive cover member;
And an inverter package for a motor.
The method according to claim 1,
Wherein the first switching element and the second switching element comprise:
And electrically connected through a via hole passing through the printed circuit board.
The method of claim 2,
Further comprising a thermally conductive member between the first switching element and the first conductive cover member and between the second switching element and the second conductive cover member.
The method according to any one of claims 1 to 3,
Wherein the first switching device and the second switching device are Metal Oxide Semiconductor Field Effect Transistors (MOSFETs).
The method of claim 4,
A first heat radiation member adjacent to the first conductive cover member on the first switching element;
A second heat radiation member adjacent to the second conductive cover member on the second switching element;
Further comprising: an inverter package for a motor.
The method of claim 5,
And an insulating material layer disposed between the first switching element and the second switching element and the first heat radiation member and the second heat radiation member.
The method of claim 5,
Wherein one of the first heat radiation member and the second heat radiation member is a housing of a motor.
The method of claim 5,
Wherein the first switching element and the second switching element are arranged symmetrically with respect to the printed circuit board,
And at least two switching element groups each having such an arrangement structure.
A first switching element and a second switching element arranged in mutually symmetrical manner on one surface of the printed circuit board and the other surface opposite to the one surface,
A first conductive cover member which contacts the surface of the first switching element and has both ends electrically connected to a part of the printed circuit board and a second switching element which is in contact with the surface of the second switching element and whose both ends are electrically connected The second conductive cover member,
An inverter package including a first conductive cover member on the first switching element and an adjacent heat radiation member via an insulating material layer;
A motor housing contacting the second conductive cover member on the second switching element of the inverter package;
A stator installed in the motor housing and including a plurality of unit stator cores, an insulator, and a coil; And
A rotor rotatably installed at the center of the stator, the rotor including a through hole formed at the center and a magnet module;
/ RTI >
The method of claim 9,
And at least two pairs of switching elements arranged to be mutually symmetrical with respect to the printed circuit board.

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