KR20150124274A - Digitizer and fabricating method of the same - Google Patents

Abstract

A digitizer according to an embodiment comprises: a first electrode disposed on a first substrate; an insulation layer disposed on the first electrode, and including a hole exposing a part of the first electrode; and a second electrode disposed on the insulation layer, and connected to the first electrode through the hole. The first electrode and second electrode respectively include a lower electrode layer and an upper electrode layer. The upper electrode layer is formed for warping an exposed front surface of the lower electrode layer. Moreover, a method for producing a digitizer according to an embodiment comprises the following steps: producing the first electrode on the first substrate; producing the insulation layer including the hole exposing a part of the first electrode on the first electrode; and producing the second electrode connected to the first electrode through the hole on the insulation layer. The steps of producing the first electrode and producing the second electrode include following the steps: producing the lower electrode layer; and producing the upper electrode layer wrapping a front surface of the lower electrode layer on the lower electrode layer through a printing process or a depositing process.

Description

[0001] DIGITIZER AND FABRICATING METHOD OF THE SAME [0002]

Embodiments relate to a digitizer and a method of manufacturing the same.

Recently, a touch panel has been applied to input a specific command by touching an input device such as a finger or a stylus pen to an image displayed on a display device in various electronic products.

Electro magnetic resonance (EMR) is widely used as an input method of a stylus pen. In the EMR system, a loop coil is disposed on a printed circuit board, a voltage is applied to the printed circuit board to control electromagnetic waves to be generated due to power transmitted, and the generated electromagnetic waves are absorbed by the EMR pen. Here, the EMR pen may include a capacitor and a loop, and the absorbed electromagnetic wave can be emitted again at a predetermined frequency.

The electromagnetic waves emitted by the EMR pen can be absorbed again by the loop coil of the printed circuit board, and thus it can be determined which position of the EMR pen is close to the touch screen.

In the case of the EMR method, it can be manufactured by forming an electrode on a printed circuit board. Accordingly, there is an advantage that a substrate of an electrode can be formed on one side or both sides of a printed circuit board due to the characteristics of a printed circuit board. However, since a process of forming a hole on a substrate to connect electrodes formed on both sides is essentially required, There is a problem in that it becomes complicated.

As a result, the manufacturing process is complicated and the process cost is increased. Therefore, a touch panel, i.e., a digitizer, of a new structure capable of solving such a problem is required. In addition, the digitizer requires improvement in electrical characteristics such as resistance.

Embodiments provide a digitizer with improved electrical characteristics and a method of manufacturing the same.

A digitizer according to an embodiment includes: a first electrode disposed on a first substrate; An insulating layer disposed on the first electrode, the insulating layer including a hole exposing a part of the first electrode; And a second electrode disposed on the insulating layer and connected to the first electrode through the hole, wherein the first electrode and the second electrode each include a lower electrode layer and an upper electrode layer, And is formed to surround the exposed front surface of the lower electrode layer.

According to another aspect of the present invention, there is provided a method of manufacturing a digitizer, including: forming a first electrode on a first substrate; Forming an insulating layer on the first electrode, the insulating layer including a hole exposing a portion of the first electrode; And forming a second electrode on the insulating layer, the second electrode being connected to the first electrode through the hole, wherein the forming of the first electrode and the forming of the second electrode include forming a lower electrode layer ; And forming an upper electrode layer surrounding the entire surface of the lower electrode layer on the lower electrode layer by a printing process or a deposition process.

The digitizer according to the embodiment and the manufacturing method thereof can be easily manufactured, and the process efficiency can be improved. That is, the digitizer according to the embodiment can be manufactured by forming a first electrode composed of an upper electrode layer and a lower electrode layer on one surface of a substrate, and connecting the first electrode and the second electrode through the hole.

In addition, since the digitizer according to the embodiment and the manufacturing method thereof use a plastic substrate such as PET, it is possible to realize a large size and reduce the process cost. Further, by forming the holes connecting the first electrode and the second electrode by selectively printing the insulating layer, a separate hole forming step can be omitted. Also, the process of forming the through-holes of the substrate for connecting the electrodes formed on both sides of the substrate can be omitted, and the process efficiency can be improved.

The digitizer and the method of fabricating the same according to the embodiment of the present invention are configured such that the first electrode and the second electrode each include an upper electrode layer and a lower electrode layer, and the upper electrode layer surrounds the exposed front surface of the lower electrode layer. Thus, the upper electrode layer can protect the lower electrode layer, and the upper electrode layer can prevent damage to the lower electrode layer and improve the electrical characteristics of the digitizer. The upper electrode layer of each of the first electrode and the second electrode is formed by a printing process or a deposition process. That is, the forming process is simple and the manufacturing cost can be reduced.

1 is a plan view of a digitizer according to a first embodiment of the present invention.
FIGS. 2 to 6 are sectional views illustrating a method of manufacturing the digitizer according to the first embodiment.
7 is a sectional view of the digitizer according to the second embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of a digitizer according to a first embodiment, and FIGS. 2 to 6 are sectional views illustrating a method of manufacturing a digitizer according to a first embodiment.

1 to 6, the digitizer according to the first embodiment may include a first electrode 210, an insulating layer 410, and a second electrode 310 on one side of a substrate 100.

The substrate 100 may support the first electrode 210, the insulating layer 410, and the second electrode 310. The substrate 100 may comprise glass or plastic. At this time, the substrate 100 may include polyethylene terephthalate (PET).

Referring to FIGS. 2 and 3, a first electrode 210 is formed on the substrate 100. The first electrode 210 may include a lower electrode layer 201 and an upper electrode layer 202. At this time, the upper electrode layer 202 of the first electrode 210 prevents oxidization and damage of the lower electrode layer 201 and improves the electrical characteristics.

The first electrode 210 may be disposed in contact with the substrate 100. At this time, the first electrode 210 may extend in a first direction and may be disposed on the substrate 100.

The lower electrode layer 201 of the first electrode 210 may include a conductive material. The lower electrode layer 201 may include a metal material. For example, the lower electrode layer 201 may include at least one of Au, Ag, Cu, Mo, Ni, and Cr .

The lower electrode layer 201 may be formed by printing a conductive paste on the substrate 100. For example, the lower electrode layer 201 can be formed by printing a silver (Ag) paste by a printing process such as screen printing, inkjet, aeroget, direct printing or gravure offset.

However, the embodiment is not limited to this, and the lower electrode layer 201 may be formed by directly depositing metal on the substrate 100, or patterning the substrate 100 on which the metal is deposited.

The lower electrode layer 201 may have a predetermined thickness. For example, the lower electrode layer 201 may be formed to a thickness of about 9 μm to about 50 μm. If the thickness of the lower electrode layer 201 is less than about 9 占 퐉, the electrical characteristics may deteriorate, and if the thickness exceeds about 50 占 퐉, the thickness of the digitizer may be thickened.

Referring to FIG. 3, an upper electrode layer 202 is formed on the lower electrode layer 201. The upper electrode layer 202 is formed to surround the entire surface of the lower electrode layer 201. That is, when the upper surface and side surfaces of the lower electrode layer 201 are exposed to the outside, the upper electrode layer 202 is formed on the upper surface and side surfaces of the lower electrode layer 201.

The upper electrode layer 202 may include a conductive material. The upper electrode layer 202 may be formed by a printing process or a deposition process. At this time, the lower electrode layer 201 and the upper electrode layer 202 may be formed of the same material. The lower electrode layer 201 and the upper electrode layer 202 may be formed of materials different from each other.

The printing process refers to a process of forming the upper electrode layer 202 by printing conductive ink or conductive paste with screen printing, inkjet, aeroget, direct printing or gravure offset.

The conductive ink is a material in which conductive particles having a diameter of several nanometers to several tens of micrometers are dispersed in a solvent. When a conductive ink is printed on the lower electrode layer 201 and heat is applied at a predetermined temperature, The organic additives are volatilized and the voids between the conductive particles are shrunk and sintered to form conductors electrically and mechanically connected to each other.

The conductive ink may be prepared by redispersing conductive particles of nano-sized or micro-sized electroconductive materials together with capping molecules and additives in a polar or non-polar solvent to form an ink. The conductive particles may be metal nanoparticles. For example, the conductive particles may be any one selected from the group consisting of silver (Ag), copper (Cu), gold (Au), and combinations thereof .

The capping of the metal nanoparticles as ceramic particles or organic molecules prevents oxidation of the metal nanoparticles during firing or in contact with air, prevents agglomeration between particles, and maintains the specific resistance constant. The conductive ink may further contain other additives such as an additional organic solvent, a binder, a dispersing agent, a thickener, and a surfactant, if necessary.

The conductive paste is a material in which conductive particles having a diameter of several nanometers to several tens of micrometers are dispersed in an adhesive resin. The conductive paste is printed on the lower electrode layer 201, The resin is cured and electrical and mechanical contact between the metal particles is fixed so that conductors connected to each other can be formed.

The conductive paste includes conductive particles of an electrically conductive material. For example, the conductive particles may be any one selected from the group consisting of silver (Ag), copper (Cu), gold (Au), and combinations thereof. The shape of the conductive particles is not particularly limited, and for example, plate-like, fiber-like and nano-sized nanoparticles, nanotubes and the like can be used. These conductive particles may be used alone or in combination.

In addition, the conductive paste may further include a binder to improve adhesion with the substrate. In addition, other additives may include pigments such as silver (Ag) powder, a solvent, a dispersing agent, a coupling agent, a viscosity adjusting agent, and the like.

The deposition process refers to a process of depositing a metal oxide layer to form the upper electrode layer 202. At this time, the metal oxide film may be a copper oxide film (CuOx) or a silver oxide film (AgOx).

Particularly, when the upper electrode layer 202 is formed by the metal oxide film, the upper electrode layer 202 is formed to surround the entire surface of the lower electrode layer 201, so that the lower electrode layer 201 has advantages .

The upper electrode layer 202 may be formed to a thickness of about 1 [mu] m to about 10 [mu] m. If the thickness of the upper electrode layer 202 is less than about 1 mu m, the resistance may increase and the electrical characteristics may be deteriorated. If the thickness is more than about 10 mu m, the thickness may be increased, and the process efficiency may be lowered.

Although the upper electrode layer 202 is represented as a single layer in the drawing, the upper electrode layer 202 may be formed of two or more multi-layers. The upper electrode layer 202 may protect the lower electrode layer 201 from oxidation and may prevent damage to the lower electrode layer 201 even if the upper electrode layer 202 is damaged. In addition, as the upper electrode layer 202 is formed, the electrical characteristics of the digitizer can be improved.

Referring to FIG. 4, an insulating layer 410 is formed on a substrate 100 on which the upper electrode layer 202 is formed. The insulating layer 410 may be formed through a printing process. The insulating layer 410 may include an insulating resin such as acryl.

The insulating layer 410 may be disposed on the first electrode 210 and the upper electrode layer 202. The insulating layer 410 may be disposed while surrounding the upper electrode layer 202. The upper electrode layer 202 is disposed to surround the first electrode 210. The insulating layer 410 may be disposed to surround the first electrode 210.

A hole H may be formed in the insulating layer 410. That is, the insulating layer 410 may be formed with a hole H through the insulating layer 410. For example, when the insulating layer 410 is printed, a plurality of holes H may be formed on the insulating layer 410 by performing selective printing except for the hole H.

The upper electrode layer 202 disposed on the substrate 100 may be exposed by the holes H. That is, the holes H may be formed in a region corresponding to the portion where the first electrode 210 and the upper electrode layer 202 are disposed.

The upper electrode layer 202 disposed on the substrate 100 and connected to the first electrode 210 is partially covered with the first insulating layer 410 and partially covered with the hole (H).

Referring to FIGS. 5 and 6, a second electrode 310 including a lower electrode layer 301 and an upper electrode layer 302 is formed on the insulating layer 410. That is, the lower electrode layer 301 of the second electrode 310 is formed on the insulating layer 410 including the hole H. Then, the upper electrode layer 302 of the second electrode 310 is formed on the lower electrode layer 301. At this time, the upper electrode layer 302 of the second electrode 310 prevents oxidization and damage of the lower electrode layer 301 and improves the electrical characteristics.

The lower electrode layer 301 of the second electrode 310 may include a conductive material. The lower electrode layer 301 may include a metal material. For example, the lower electrode layer 201 may include at least one of Au, Ag, Cu, Mo, Ni, and Cr .

The lower electrode layer 301 may be formed by printing a conductive paste on the insulating layer 410. For example, the lower electrode layer 301 can be formed by printing a silver (Ag) paste by a printing process such as screen printing, inkjet, aeroget, direct printing or gravure offset. However, the embodiment is not limited to this, and the metal layer may be formed by directly depositing a metal on the insulating layer 410.

The lower electrode layer 301 may have a predetermined thickness. For example, the lower electrode layer 301 may be formed to a thickness of about 9 μm to about 50 μm. If the thickness of the lower electrode layer 301 is less than about 9 占 퐉, the electrical characteristics may deteriorate, and if the thickness exceeds about 50 占 퐉, the thickness of the digitizer may be thickened.

Referring to FIG. 6, an upper electrode layer 302 is formed on the lower electrode layer 301. The upper electrode layer 302 is formed to surround the entire surface of the exposed lower electrode layer 301. That is, when the upper surface and the side surface of the lower electrode layer 301 are exposed to the outside, the upper electrode layer 302 is formed on the upper surface and the side surface of the lower electrode layer 301.

The upper electrode layer 302 may include a conductive material. The upper electrode layer 302 may be formed by a printing process or a deposition process. At this time, the lower electrode layer 301 and the upper electrode layer 302 may be formed of the same material. The lower electrode layer 301 and the upper electrode layer 302 may be formed of materials different from each other.

The printing process refers to a process of forming the upper electrode layer 302 by printing conductive ink or conductive paste using screen printing, inkjet, aeroget, direct printing or gravure offset. The conductive ink or conductive paste may be the same as the upper electrode layer 202 of the first electrode 210.

The deposition process refers to a process of depositing a metal oxide layer to form the upper electrode layer 202. At this time, the metal oxide film may be a copper oxide film (CuOx) or a silver oxide film (AgOx).

The upper electrode layer 302 may have a thickness of about 1 [mu] m to about 10 [mu] m. If the thickness of the upper electrode layer 302 is less than about 1 占 퐉, the resistance may increase and the electrical characteristics may be deteriorated. If the thickness is more than about 10 占 퐉, the thickness may be increased and the process efficiency may be lowered.

Although the upper electrode layer 302 is represented as a single layer in the drawing, the upper electrode layer 302 may be formed of two or more multi-layers. The upper electrode layer 302 can protect the lower electrode layer 301 from oxidation and can prevent damage to the lower electrode layer 301 even if the upper electrode layer 302 is damaged. In addition, as the upper electrode layer 302 is formed, the electrical characteristics of the digitizer can be improved.

The lower electrode layer 301 of the second electrode 310 may be formed to contact the upper electrode layer 202 of the first electrode 210 through the hole H of the insulating layer 410. Accordingly, the first electrode 210 and the second electrode 310 can be in contact with each other in the hole forming region.

Although the first electrode 210 is arranged in the longitudinal direction and the second electrode 310 is arranged in the horizontal direction on the drawing, the embodiment is not limited to this, The second electrodes 310 may be arranged in various directions intersecting with each other. The first electrode 210 and the second electrode 310 formed to intersect with each other can operate as a sense coil for detecting the position of a driving coil and a pen for forming a magnetic field.

In detail, the first electrode 210 and the second electrode 310 may be connected to each other through the hole H, thereby forming a loop-shaped electrode as a whole. 1, the electrode of the digitizer extends in a first direction in which the first electrode 210 extends, and is electrically connected to the second electrode 310 and the second electrode 310 in the hole H, And extends in the second direction in which the second electrode 310 extends, and contacts the first electrode 210 in the hole H again, May extend in a first direction in which the first electrode 210 extends.

Accordingly, the first electrode 210 and the second electrode 310 may be formed as a loop-shaped electrode that contacts each other at the hole (H). That is, the electrode including the first electrode 210 and the second electrode 310 may be a loop-shaped coil.

Accordingly, when a touch object, e.g., a digitizer pen, of an electromagnetic type is touched on one surface of a display device including a digitizer, a signal generated in a resonance circuit included in the digitizer pen is recognized by the touch sensor, The position can be detected. Electric power is transmitted to the loop coil including the first electrode 210 and the second electrode 310 to generate an electromagnetic wave. The generated electromagnetic wave is absorbed by the digitizer pen, and the electromagnetic wave absorbed by the digitizer pen is re- By emitting at a predetermined frequency, the touch sensor senses the electromagnetic change caused by the approach of the digitizer pen, and the position of the digitizer pen can be grasped.

Although not shown in the drawing, a protective layer (not shown) may be further formed on the second electrode 310 to protect the second electrode 310. The protective layer may be formed of an insulating layer. In addition, the protective layer may be formed through a printing process, and the protective layer may include an insulating resin such as acryl. In addition, one or more functional layers such as a shielding layer or a ground electrode may be further disposed on the other surface of the substrate 100.

Hereinafter, a digitizer according to another embodiment and a method of manufacturing the same will be described with reference to FIG. 7 is a sectional view of the digitizer according to the second embodiment. In the description of the digitizer according to the second embodiment and the method of manufacturing the same, description of parts similar to those of the digitizer according to the embodiment described above will be omitted, and the same reference numerals are given to the same components.

Referring to FIG. 7, the digitizer according to the second embodiment of the present invention may further include a second substrate 200 disposed on the first substrate 100. The first substrate 100 or the second substrate 200 may include glass or plastic. At this time, the first substrate 100 or the second substrate 200 may include polyethylene terephthalate (PET).

An insulating layer 410 including a first electrode 210 and a hole H exposing a part of the first electrode 210 is formed on the first substrate 100. A second electrode 310 is formed on the second substrate 200. The second substrate 200 is disposed on the insulating layer 410 and a connection portion 610 connecting the second electrode 310 and the first electrode 210 is formed.

The connection portion 610 may be formed of a conductive paste. For example, the conductive paste is a silver paste. The connection portion 610 formed of the conductive paste is formed to be in contact with the second electrode 310 and to be in contact with the first electrode 210 through the hole H formed in the insulating layer 410.

The first electrode 210 and the second electrode 310 are composed of the lower electrode layers 201 and 301 and the upper electrode layers 202 and 302, respectively. The upper electrode layers 202 and 302 are formed to surround the entire surface of the exposed lower electrode layers 201 and 301. That is, when the upper and side surfaces of the lower electrode layers 201 and 301 are exposed to the outside, the upper electrode layers 202 and 302 are formed on the upper and side surfaces of the lower electrode layers 201 and 202, respectively.

At this time, the lower electrode layers 201 and 301 and the upper electrode layers 202 and 302 may be formed of the same material. In addition, the lower electrode layers 201 and 301 and the upper electrode layers 202 and 302 may be formed of materials different from each other.

The lower electrode layers 201 and 301 may include a conductive material. The lower electrode layers 201 and 301 may include a metal material. For example, the lower electrode layers 201 and 301 may include at least one of Au, Ag, Cu, Mo, Ni, and Cr .

The lower electrode layers 201 and 301 may be formed by printing a conductive paste on the first substrate 100 or the second substrate 200. However, the embodiment is not limited to this, and a metal may be directly deposited on the first substrate 100 or the second substrate 200, a first substrate 100 or a second substrate 200 on which a metal is deposited, The lower electrode layers 201 and 301 can be formed.

The upper electrode layers 202 and 302 may include a conductive material. The upper electrode layers 202 and 302 may be formed by a printing process or a deposition process.

The printing process refers to a process of forming the upper electrode layers 202 and 302 by printing conductive ink or conductive paste with screen printing, inkjet, aeroget, direct printing or gravure offset. For example, in the printing process, the conductive ink containing conductive particles is printed on the lower electrode layers 201 and 301, and the upper electrode layers 202 and 302 are formed by shrinking and sintering the pores between the conductive particles by applying heat . Alternatively, in the printing process, the conductive paste containing conductive particles and resin may be printed on the lower electrode layers 201 and 301, and the resin may be cured by applying heat to form the upper electrode layers 202 and 302.

The deposition process refers to a process of depositing a metal oxide layer to form the upper electrode layers 202 and 302. At this time, the metal oxide film may be a copper oxide film (CuOx) or a silver oxide film (AgOx).

Although the upper electrode layers 202 and 302 are represented as a single layer in the drawing, the upper electrode layers 202 and 302 may be formed of two or more multi layers. The upper electrode layers 202 and 302 can protect the lower electrode layers 201 and 301 from oxidation and can prevent damage to the lower electrode layers 201 and 301 even if the upper electrode layers 202 and 302 are damaged. In addition, since the upper electrode layers 202 and 302 are formed, the electrical characteristics of the digitizer can be improved.

Conventionally, after a first electrode and a second electrode are formed on both sides of a polyimide substrate by patterning copper plating on both sides on a polyimide substrate having copper plating on both sides, A process for forming a through hole on a polyimide substrate is required.

Thus, conventionally, it has been difficult to implement a digitizer of a large size by manufacturing the digitizer using the FPCB method. A process of forming a through hole to penetrate the substrate to connect the first electrode and the second electrode is required and the process efficiency is lowered. Further, since a substrate such as a polyimide substrate is used, there is a problem that the process cost increases.

Accordingly, in the digitizer according to the present invention, a first electrode and a second electrode are disposed on one surface of a substrate using a substrate such as polyethylene terephthalate (PET). An insulating layer including a hole exposing a part of the first electrode may be disposed between the first electrode and the second electrode so that the first electrode and the second electrode are connected to each other through the hole .

Accordingly, since the digitizer according to the embodiment uses a substrate such as PET, it can realize a large size and reduce the process cost, and by selectively forming the holes by printing the insulating layer, It is possible to omit the step of forming a through-hole to improve the process efficiency. Further, by disposing the first electrode and the second electrode on one surface of the substrate, a functional layer such as a shielding layer and a ground electrode can be further formed on the other surface of the substrate.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (18)

A first electrode disposed on the first substrate;
An insulating layer disposed on the first electrode, the insulating layer including a hole exposing a part of the first electrode; And
And a second electrode disposed on the insulating layer and connected to the first electrode through the hole,
Wherein the first electrode and the second electrode each include a lower electrode layer and an upper electrode layer,
Wherein the upper electrode layer is formed to surround the exposed front surface of the lower electrode layer. The method according to claim 1,
Wherein the upper electrode layer is formed of conductive ink or conductive paste. 3. The method of claim 2,
The conductive ink or conductive paste includes conductive particles,
Wherein the conductive particles are any one selected from the group consisting of silver (Ag), copper (Cu), gold (Au), and combinations thereof. The method according to claim 1,
Wherein the upper electrode layer is formed of a metal oxide film. 5. The method of claim 4,
Wherein the metal oxide film is a copper oxide film or a silver oxide film. The method according to claim 1,
Wherein the lower electrode layer and the upper electrode layer are formed of the same material. The method according to claim 1,
Wherein the lower electrode layer and the upper electrode layer are formed of materials different from each other. The method according to claim 1,
The second electrode is formed on a second substrate disposed on the insulating layer,
And a connection unit connecting the first electrode and the second electrode through the hole. 9. The method of claim 8,
Wherein the connection portion is a silver paste. Forming a first electrode on a first substrate;
Forming an insulating layer on the first electrode, the insulating layer including a hole exposing a portion of the first electrode; And
And forming a second electrode on the insulating layer, the second electrode being connected to the first electrode through the hole,
The forming of the first electrode and the forming of the second electrode may include:
Forming a lower electrode layer; And
And forming an upper electrode layer surrounding the entire surface of the lower electrode layer on the lower electrode layer by a printing process or a deposition process. 11. The method of claim 10,
Wherein the printing process forms an upper electrode layer by printing conductive ink or conductive paste containing conductive particles on the lower electrode layer. 12. The method of claim 11,
Wherein the printing process prints a conductive ink containing conductive particles on the lower electrode layer and applies heat to shrink and sinter the voids between the conductive particles. 12. The method of claim 11,
Wherein the printing step prints a conductive paste containing conductive particles and a resin on the lower electrode layer and applies heat to cure the resin. 12. The method of claim 11,
Wherein the conductive particles are any one selected from the group consisting of silver (Ag), copper (Cu), gold (Au), and combinations thereof. 11. The method of claim 10,
Wherein the deposition process deposits a metal oxide layer to form an upper electrode layer. 16. The method of claim 15,
Wherein the metal oxide film is a copper oxide film or a silver oxide film. 11. The method of claim 10,
Forming a second electrode on the insulating layer, the second electrode being connected to the first electrode through the hole,
Forming a second electrode on a second substrate;
Disposing the second substrate on the insulating layer; And
Connecting the first electrode and the second electrode to each other through a hole formed in the insulating layer, and forming a connection portion formed of a conductive paste. 18. The method of claim 17,
Wherein the conductive paste is a silver paste.

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