KR20150107071A - Display IC having fingerprint sensing function - Google Patents

Abstract

Disclosed is a DDI for fingerprint recognition. The DDI is designed to drive a display device and includes a plurality of connection terminals for connection wires connecting the display device and the DDI; a plurality of capacitive electric conductors disposed adjacent to the connection terminals; and a fingerprint detection signal output unit connected to the capacitive electric conductors. The fingerprint detection signal output unit is designed to output a value related to a capacitance value formed by the capacitive electric conductors.

Description

[0001] Display IC having fingerprint sensing function [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC for driving a display device and an apparatus therefor, and more particularly to an apparatus including a fingerprint recognition sensor.

User devices, which are called smart phones, smart pads, and laptop computers, have recently been disclosed as user devices that receive commands from a user and output the results corresponding to the commands to a display device. In particular, the user equipment may include a touch input sensing device disposed near the display screen of the user equipment and covering the entire area of the display screen, as a user input device for receiving a user's command. Examples of such a user input device include a so-called pressure sensitive type sensing device, an electrostatic type sensing device, and a stylus pen sensing device (hereinafter, simply referred to as a pen sensing device). The above sensing devices are products based on different technologies (hereinafter referred to as touch input technology). Since each of the above technologies has its advantages and disadvantages, an attempt has been made to provide a more convenient user input experience by providing a combination of advantages of each other. The basic operating principle of each of the above technologies is disclosed in various documents.

The touch input sensing device may include a touch panel including a front-end sensing device for sensing a touch input, and a touch IC receiving a signal from the touch panel.

The distal sensor device may be comprised of one or more transparent / opaque electrodes or thin electrodes. The electrode may be provided in a state of being overlapped with a separate display unit (that is, a display unit, a screen display unit, or a screen unit). Or the electrode may be provided in a form of sharing the parts of the display part together.

Conventionally, a so-called touch IC has been provided for a touch input sensing device and a so-called DDI (Display Driver IC) has been separately provided for driving the display portion (hereinafter, DDI refers to a D-IC, a display IC have). However, as described above, since the display portion and the touch input sensing device are arranged at a very short distance, some of the components of the touch IC are integrated in the DDI, or some components of the DDI are integrated in the touch IC, The DDI and the touch IC may be integrated into one single IC.

On the other hand, the number of one or more electrodes constituting the end portion sensor device may be large or small according to a specific design method or application field. In order to know whether the electrodes are touch-input, a touch sensing circuit is required to sense a change in the electrical properties of the electrodes. In this case, when N electrodes are present, N touch sensing circuits may be provided, but only M (M < N) touch sensing circuits may be provided using a multiplexer.

The trend toward miniaturization of portable user devices including the above-described devices is ongoing. In addition, for the sake of security, fingerprint recognition technology is being applied to these small user devices. Most of the front portion of such small-sized user equipment is allocated to the display area. Therefore, it is not easy to separately place the fingerprint sensor in a space other than the display area.

The present invention provides a technology for providing a fingerprint recognition sensor to a user device without allocating a separate space for the fingerprint recognition sensor by incorporating the fingerprint sensor in the DDI.

&Lt; Case where sensing electrodes for fingerprint sensing are formed on the DDI >

In one embodiment of the present invention, the wiring connection terminals 22 existing in the DDI are arranged in the outer portion of the DDI to connect the internal circuits of the DDI and the wirings extending from the input / output panel, The small sensing electrodes 44 for fingerprint sensing are arranged in the region where the sensing electrodes 44 are arranged. The sensing electrodes for fingerprint sensing may be provided to a size enough to recognize the irregularities of the fingerprint. The fingerprint sensing signal output unit for measuring the electrical characteristics of the fingerprint sensing electrodes may be disposed inside the DDI.

The fingerprint sensing signal output unit may be provided separately from the touch sensing signal output unit that measures whether a touch input to the input / output panel is present.

Alternatively, the touch sensing signal output unit may be used as a fingerprint sensing signal output unit. That is, the touch sensing signal output unit and the fingerprint sensing signal output unit may be provided integrally. At this time, in a state in which the authenticated fingerprint recognition is not performed, the user device can maintain the state prior to the wake-up. Before the user equipment wakes up, the touch sensing signal output unit may function as a fingerprint sensing signal output unit for sensing fingerprint. After the user equipment is woken up, the touch sensing signal output unit may be used to detect whether a touch input to the input / output panel is present.

&Lt; DDI including capacitive conductor for fingerprint detection >

A fingerprint recognition DDI provided in accordance with an aspect of the present invention is a DDI adapted to drive a display device. The DDI includes a plurality of connection terminals for connecting connection wirings connecting between the display device and the DDI; A plurality of capacitive conductors disposed adjacent the connection terminals; And a fingerprint sensing signal output unit connected to the plurality of capacitive conductors, wherein the fingerprint sensing signal output unit outputs a value related to a capacitance value formed by the capacitive conductor.

At this time, the function of the fingerprint sensing signal output unit may be activated only when the user equipment including the display device is in a sleep mode (non-wake-up mode).

In this case, the light emitting device may further include a light emitting element disposed near the plurality of capacitive conductors.

At this time, the light emitting device may be configured to emit light only when the user equipment including the display device is in the sleep mode.

At this time, the pitch between the plurality of capacitive conductors can satisfy the critical distance condition for recognizing the irregularities of the fingerprint.

According to the present invention, it is possible to provide a fingerprint recognition technology using a DDI without adding a separate sensor.

1 illustrates a cross-sectional structure of an input / output panel constituting an integrated input / output device in which a touch input sensing device and a display device are combined according to an embodiment of the present invention.
2 illustrates a structure of an integrated input / output device according to an embodiment of the present invention.

1 illustrates a cross-sectional structure of an input / output panel constituting an integrated input / output device in which a touch input sensing device and a display device are combined according to an embodiment of the present invention.

The input / output panel 1050 includes a thin film transistor array substrate 1020, a color filter array substrate 1030, a liquid crystal display panel having a liquid crystal layer 1040 filled between the two substrates 1020 and 1030, (BLU) 1060 formed on the lower side of the display unit 1020. [

The thin film transistor array substrate 1020 includes gate lines and data lines formed to cross each other on the first substrate 1021, thin film transistors formed at intersections of the gate lines and the data lines, A TFT array 1023 including pixel electrodes connected to the thin film transistors, and an alignment film 1025 coated thereon. The gate lines and the data lines are supplied with signals from the driving circuits through respective pad portions, and the thin film transistors can supply pixel voltage signals to the pixel electrodes in response to the scan signals supplied to the gate lines.

The color filter array substrate 1030 includes color filters 1033 formed on a second substrate 1031 in units of a liquid crystal cell, a black matrix 1035 for separating color filters and reflecting external light, A common electrode (Vcom) 1037 for supplying a common reference voltage to the common electrode (Vcom) 1037, and an alignment film 1039 applied thereon. At this time, the common electrode (Vcom) 1037 may be divided into several parts. That is, a plurality of common electrodes may exist.

In one embodiment of the present invention, the plurality of common electrodes may be utilized as a device for touch input sensing. Each common electrode can function as an independent 'touch node'. The touch input sensing apparatus according to an embodiment of the present invention basically calculates data on whether or not a touch input has been made to each touch node and a strength of the touch input when the touch input is performed.

2 illustrates a structure of an integrated input / output device according to an embodiment of the present invention.

The integrated input / output device may include an input / output panel 1050, a timing controller 1101, a data driver 1102, a gate driver 1103, a host computer 1120, and a touch IC. Here, the data driver 1102 and the gate driver 1103 may be functional modules included in the DDI. Also, some or all of the components of the touch IC according to the embodiment may be provided in the DDI.

2, only a first substrate 1021 and a plurality of common electrodes (Vcom) 1037 having gate lines and data lines in the input / output panel 1050 are shown for the sake of convenience.

The input / output panel 1050 may include a color filter array, a thin film transistor array, a liquid crystal layer disposed therebetween, and a spacer for maintaining the cell gap of the liquid crystal layer. The color filter array may include an upper substrate, a color filter formed on one surface of the upper substrate, a black matrix, and a common electrode (Vcom) formed on the color filter and the black matrix. The thin film transistor array includes a lower substrate and a plurality of data lines (DL) 1104 and a plurality of gate lines (GL) 1105, gate lines 1105, A thin film transistor formed in a region where the data line 1104 intersects and a pixel defined by the intersection of the gate line 1105 and the data line 1104. [ A lower polarizer may be disposed on the other surface of the lower substrate.

The backlight unit may be disposed below the input / output panel 1050. The backlight unit may include a plurality of light sources to uniformly irradiate the input / output panel 1050 with light. The backlight unit may be implemented as a direct type backlight unit or an edge type backlight unit. The light source of the backlight unit may include at least one of a hot cathode fluorescent lamp (HCFL), a cold cathode fluorescent lamp (CCFL), an external electro fluorescent lamp (EEFL), and a light emitting diode (LED).

The data driver 1102 can sample and latch the digital video data RGB under the control of the timing controller 1101. [ The data driver 1102 may convert the digital video data RGB to a positive / negative gamma compensation voltage to invert the polarity of the data voltage. The positive / negative polarity data voltages output from the data driver 1102 may be synchronized with gate pulses output from the gate driver 1103. Each of the source driver ICs of the data driver 1102 may be connected to the data lines 1104 of the input / output panel 1050 by a COG (Chip On Glass) process or a TAB (Tape Automated Bonding) process. The source drive IC may be integrated in the timing controller 1101 and implemented as a one-chip IC together with the timing controller 101. [

The gate driving unit 103 sequentially outputs gate pulses (or scan pulses) in the display mode under the control of the timing controller 101, and can shift the swing voltage of the output to the gate high voltage and the gate low voltage. The gate pulse output from the gate driver 1103 may be sequentially supplied to the gate lines 1105 in synchronization with the data voltage output from the data driver 1102. The gate high voltage is higher than the threshold voltage of the thin film transistor T and the gate low voltage may be lower than the threshold voltage of the thin film transistor T. [ The gate drive ICs of the gate driver 1103 are connected to the gate lines 1105 of the lower substrate of the input / output panel 1050 through a TAP process or connected to the gate lines 1105 of the input / And may be formed directly on the lower substrate.

The timing controller 101 uses a timing signal from the host computer 1120 to generate a data timing control signal for controlling the operation timing of the data driver 1102 and the polarity of the data voltage and an operation timing of the gate driver 1103 And generate a gate timing control signal for controlling.

The gate timing control signal may include a gate start pulse (GSP), a gate shift clock (GSC), a gate output enable signal (GOE), and the like. The gate start pulse GSP is applied from the gate driver 1103 to the first gate driver IC which outputs the gate pulse first in every frame period, so as to control the shift start timing of the gate driver IC. The gate shift clock GSC is a clock signal commonly input to the gate drive ICs of the gate driver 1103 to shift the gate start pulse GSP. The gate output enable signal GOE can control the output timing of the gate drive ICs of the gate driver 1103.

The data timing control signal includes a source start pulse (SSP), a source sampling clock (SSC), a polarity control signal (POL), and a source output enable signal (SOE) . &Lt; / RTI &gt; The source start pulse SSP may be applied to the first source drive IC that samples the data first in the data driver 1102 to control the data sampling start timing. The source sampling clock SSC is a clock signal that controls the sampling timing of data in the source drive ICs based on the rising or falling edge. The polarity control signal POL can control the polarity of the data voltage output from the source drive ICs. The source output enable signal SOE can control the output timing of the source drive ICs. The source start pulse SSP and the source sampling clock SSC may be omitted if digital video data RGB is input to the data driver 1102 through the Low Voltage Differential Signaling (LVDS) interface.

The host computer 1120 transmits the digital video data RGB of the input image and the timing signals Vsync, Hsync, DE and MCLK necessary for the display driving through an interface such as an LVDS interface and a TMDS (Transition Minimized Differential Signaling) To the timing controller 1101.

In one embodiment of the present invention, the timing controller 1101, the data driver 1102, and the gate driver 1103 may be included in one DDI (Display Driver IC) 2 (FIG. 3).

Hereinafter, the common electrode 1037 may be referred to as a &quot; VCOM electrode 1037 &quot;. In this case, the common electrodes may be arranged in the form of an M * N matrix. In the example of FIG. 2, M = 6 and N = 6. Hereinafter, common electrodes 1037 intersecting in the pth row and the qth column are denoted as VCOM, pq. For example, the common electrode 1037 intersecting in the second row and the qth column may be denoted as VCOM, 23. In one embodiment of the present invention using VCOM, qp described above, each VCOM, pq can function as an independent touch node (TN, pq).

In one embodiment, the common electrodes 1037 may be used as a part for screen output in the first time period and as a part for confirming whether the touch input is performed in the second time period.

FIG. 2 shows a configuration according to an embodiment of the present invention. In FIG. 2, a common electrode included in a display output device is used as an end portion sensing device of a touch input sensing device. In another embodiment of the present invention, The terminal end sensing device may be provided separately on the other side of the display output device. The scope of the present invention does not depend on whether the terminal sensing device is formed integrally with the display output device.

FIG. 3 shows a specific configuration of a touch input sensing apparatus according to an embodiment of the present invention.

The touch input sensing device measures a plurality of sensing electrodes 100 arranged in a predetermined manner and information about electrical characteristics at each sensing electrode using signals provided from the plurality of sensing electrodes 100 One or more touch sensing signal output units 20 and wires 2037 connecting the sensing electrodes 100 and the touch sensing signal output unit 20. In Fig. 3, one wiring 2037 is connected to one sensing electrode 100 only.

At this time, an area formed by the sensing electrodes 100 may be referred to as a sensing area A2.

And the touch sensing signal output units 20 may be provided in an independent IC 2. [ At this time, the independent IC may be a touch IC processing only a touch input signal, or a DDI (D-IC) processing a display control signal and a touch input signal together. In the latter case, the IC (2) of FIG. 3 may further include other functional units not shown, for example, functional units corresponding to the reference numerals 1101, 1102, 1103, and 1104 of FIG.

A part of the wiring 2037 may be disposed between the sensing area A2 and the IC 2. [ At this time, a physical space may exist between the sensing area A2 and the IC 2, and this space is not intended to be used as a sensing area. Therefore, a certain region between the sensing region A2 and the IC 2 may be referred to as a non-sensing region A1.

In the example of FIG. 3, the sensing electrodes 100 are arranged in a 6 * 6 matrix and consist of six columns C1 to C6 and six rows R1 to R6.

In the example of FIG. 3, six wirings 2037 pass over each sensing electrode 100, but only one wiring 2037 is electrically connected to each sensing electrode 100. The positions where the sensing electrodes 100 and the wiring 2027 are coupled are indicated by triangles, squares, pentagons, and circles.

In the embodiment of FIG. 3, the sensing electrodes 100 may be divided into four groups. The groups A, B, C, and D include sensing electrodes having triangular, square, pentagonal, and circle joint portions, respectively. For example, the group A may include sensing electrodes (TN, 11, TN, 13, TN, 15, TN, 31, TN, 33, TN, 35, TN, 51, TN,

In the embodiment of FIG. 3, a total of nine touch sensing signal output units 20 are provided. Four wires 2037 are connected to each touch sensing signal output unit 20. At this time, one touch sensing signal output unit 20 is connected to one sensing electrode belonging to group A, one sensing electrode belonging to group B, one sensing electrode belonging to group C, and one sensing electrode belonging to group D .

Each of the touch sensing signal output units 20 may be provided with a touch input sensing circuit 10. The touch input sensing circuit 10 is an example of the above-described integrating circuit. In the embodiment of FIG. 3, a total of nine touch sensing signal output units 20 are provided, so that nine touch sensing sensing circuits 10 are provided in total.

FIG. 4A is a view for explaining the operation principle of the touch input sensing apparatus according to the embodiment of FIG. 3, and shows the construction of the touch sensing signal output unit 20 in more detail. 4B shows the function of the MUX (multiplexer) shown in FIG. 4A in more detail.

The touch sensing signal output unit 20 may include a touch input sensing circuit 10 and a MUX M1. The four signals input to the touch sensing signal output unit 20 are supplied from the four wires 2037 connected to the four sensing electrodes 100, TN, 11, TN, 12, TN, 21, . The four signals may be provided at the input of the MUX M1.

In the structure according to FIG. 4B, each MUX can select one or more of the four inputs IN1 to IN4 and connect them to the output OUT. Thus, more than one input can be connected to the output at the same time. For this purpose, a 4-bit input selector (Sel-4bit) may be provided. At this time, the four signals are currents flowing through the four wirings 2037, and the flow of the currents can be superimposed by the switches SW1, SW2, SW3, and SW4 included in the MUX.

The touch input sensing circuit 10 may include an operational amplifier 215 and an integral capacitor Cf connected between the inverting input terminal and the output terminal of the operational amplifier 215. [ At this time, a predetermined voltage signal Vdp may be input to the non-inverting input terminal of the operational amplifier 210. [ For convenience, the input terminal 11 of the touch input sensing circuit 10 can be defined. The input terminal 11 may be the same terminal as the inverting input terminal of the operational amplifier 215. The input terminal 11 can be connected to the output of the MUX.

The voltage signal Vdp may be a signal having periodicity. Furthermore, the DC component may be a periodic signal having zero (zero), that is, an AC periodic signal. Or the voltage signal Vdp may not be a periodic signal, but may be a signal having a component of the frequency fc. Or a DC signal having a predetermined voltage.

The value of the output signal (1) of the touch input sensing circuit 10 may be determined by the magnitude of the current flowing through the input terminal 11 and the magnitude of the integral capacitor Cf. The magnitude of the current flowing through the input terminal 11 can be affected by the magnitude of the capacitance formed between the sensing electrodes TN, 11, TN12, TN, 21, TN, 22 and the finger 17 . Therefore, it is possible to determine whether or not touch input has been made to the sensing electrodes TN, 11, TN12, TN, 21, TN, 22 using the value of the output signal (1). In one embodiment, when a parasitic capacitance (not shown) is connected to the output terminal of the MUX, the magnitude of the current flowing through the input terminal 11 may be affected by the parasitic capacitance.

4A, the process of checking whether the touch input has been performed at the sensing electrodes TN, 11, TN12, TN, 21, TN, 22 may be periodically updated, It can be reset to the on state for a while.

FIG. 5 shows a configuration in which the touch IC 3 and the host computer 1120 are further connected to the touch input sensing apparatus shown in FIG.

Each sensing electrode 100 is electrically separated from each other and can be connected to the IC 2 through a wiring 2037. According to the embodiment, the IC 2 may include the timing controller 1101, the data driver 1102, and the gate driver 1103 shown in Fig. The magnitude of the gap between each sensing electrode 100 shown in FIG. 5 is exaggerated for convenience of explanation.

The IC 2 may include one or more touch sensing signal output units 20. In FIG. 5, the index of the touch sensing signal output unit is represented by 20_k (where k = 1, 2, 3, ... 9), and the indexes of the 36 sensing electrodes are Ak, Bk, Ck, 1, 2, 3, ... 9). At this time, the touch sensing signal output unit 20_k selects one or a plurality of sensing electrodes Ak, Bk, Ck, Dk (where k = 1, 2, 3, ..., or 9) have.

Since a total of four sensing electrodes are connected to each touch sensing signal output unit 20_k, a total of 36 sensing electrodes can be divided into four groups. In FIG. 5, the four groups are group A, group B, group C, and group D, and nine sensing electrodes are included in each group. The group A includes sensing electrodes A1 to A9, the group B includes sensing electrodes B1 to B9, the group C includes sensing electrodes C1 to C9, And sensing electrodes D1 to D9.

The touch sensing signal output unit 20_k outputs whether or not the touch input is performed by one or more of the sensing electrodes connected to the touch sensing signal output unit 20_k. Further, the touch sensing signal output unit 20_k outputs a value related to the input intensity when the touch input is performed. The output values (1 &amp; cir &amp;) of the plurality of touch sensing signal output units 20_k may be provided to the touch IC 3. The touch IC 3 can determine touch coordinates by calculating which part of the plurality of sensing electrodes is touch input based on the output values (1). The host computer 1120 receives the touch coordinates from the touch IC 3 and can execute an application corresponding to the touch coordinates.

Here, the touch IC 3 may be provided integrally with the IC 2 and provided.

6 shows an exemplary configuration of an input / output panel 1050 according to an embodiment of the present invention.

The DDI 2 may be disposed very close to the input / output panel 1050 or may be disposed on a partial area of the input / output panel 1050. 6 shows an example in which the DDI 2 is disposed on a partial area of the input / output panel 1050.

The DDI 2 may have a shape elongated in one direction. And the width of the DDI 2 may be very thin. A part of a plurality of wirings connecting between the various circuit elements of the DDI 2 and the input / output panel 1050 may be arranged on the area A1.

An embodiment of the present invention provides a sensor for enabling a fingerprint recognition when the fingerprint portion of the finger F1 is moved in a predetermined direction D1 in contact with the center of the region occupied by the DDI 2 to the DDI 2 &Lt; / RTI &gt;

7 shows in more detail the coupling structure of the input / output panel 1050 and the DDI 2 shown in FIG.

The DDI 2 can be coupled onto the input / output panel 1050 and the portion occupied by the DDI 2 on the input / output panel 1050 can be represented by the area A3.

The top-layer (2T) portion of the DDI 2 may be coupled to the input / output panel 1050.

DDI (2) This top-layer (2T) portion can be made of a material containing a metal.

The bottom-layer (2B) portion of the DDI (2) may be comprised of a material comprising silicon.

In one embodiment, in particular, the DDI 2 may be disposed on the thin film transistor array substrate 1020 of the input / output panel 1050. At this time, at least a part of the wirings 2037 may also be disposed on the thin film transistor array substrate 1020. However, the present invention is not limited to such a configuration.

&Lt; Example 1 >

FIG. 8 shows a configuration of a fingerprint recognition apparatus according to an embodiment of the present invention.

8A, 8B and 8C show the bottom-layer 2B, the top-layer 2T, and the thin film transistor array substrate 1020 shown in FIG. 7, respectively.

8 (a) and 8 (c) are viewed from the + z direction toward the? Z direction, and Fig. 8 (b) is viewed from the? Z direction toward the + z direction.

Referring to FIG. 8A, fingerprint sensing electrodes 44 for recognizing fingerprints may be disposed in the bottom-layer 2B. The fingerprint sensing electrodes 44 may have an x * y matrix structure, of which x or y may have a value of one. The fingerprint sensing electrodes 44 may be connected to the fingerprint sensing signal output unit 20 'included in the DDI 2. One example of the fingerprint sensing signal output unit 20 'is described in FIGS. 13 and 14, which will be described later.

Referring to FIG. 8B, connection terminals 22 and 221 for connecting the wiring 2037 to the internal circuit of the DDI 2 may be disposed in the top-layer 2T.

Referring to FIG. 8C, a plurality of wirings 2037 may be disposed on the thin film transistor array substrate 1020. Connection terminals 22 and 222 for connecting the wiring 2037 to the DDI 2 may be disposed on the thin film transistor array substrate 1020. The connection terminals 22 and 222 and the wiring 2037 may be electrically connected to each other. The connection terminals 22 and 222 may be disposed inside the region A3.

The connection terminals 22 and 222 and the connection terminals 22 and 221 may be arranged so as to be connected to each other. The wiring 2037 can be connected to the internal circuit of the DDI 2 through the connection terminals 22 and 222 and the connection terminals 22 and 221. [

&Lt; Example 2 >

FIG. 9 shows a configuration of a fingerprint recognition apparatus according to another embodiment of the present invention.

9A, 9B and 9C show the bottom-layer 2B, the top-layer 2T, and the thin film transistor array substrate 1020 shown in FIG. 7, respectively.

9 (a) and 9 (c) are all viewed from the + z direction toward the? Z direction, and FIG. 9 (b) is viewed from the? Z direction toward the + z direction.

Referring to FIG. 9B, fingerprint sensing electrodes 44 for recognizing a fingerprint may be disposed in the top-layer 2T. The fingerprint sensing electrodes 44 may have an x * y matrix structure, of which x or y may have a value of one. The fingerprint sensing electrodes 44 may be connected to the fingerprint sensing signal output unit 20 'included in the DDI 2. One example of the fingerprint sensing signal output unit 20 'is described in FIGS. 13 and 14, which will be described later.

9B, connection terminals 22 and 223 for connecting the wiring 2037 to the internal circuit of the DDI 2 may be disposed in the top-layer 2T.

Referring to FIG. 9C, a plurality of wirings 2037 may be disposed on the thin film transistor array substrate 1020. Connection terminals 22 and 224 for connecting the wiring 2037 to the DDI 2 may be disposed on the thin film transistor array substrate 1020. The connection terminals 22 and 224 and the wiring 2037 may be electrically connected to each other. The connection terminals 22 and 224 may be disposed inside the region A3.

The connection terminals 22 and 223 and the connection terminals 22 and 224 may be arranged so as to be joined to each other. The wiring 2037 can be connected to the internal circuit of the DDI 2 via the connection terminals 22 and 224 and the connection terminals 22 and 223. [

&Lt; Example 3 >

FIG. 10 shows a configuration of a fingerprint recognition apparatus according to another embodiment of the present invention.

10A, 10B and 10C show the bottom-layer 2B, the top-layer 2T, and the thin film transistor array substrate 1020 shown in FIG. 7, respectively.

10 (a) and 10 (c) are viewed from the + z direction toward the? Z direction, and Fig. 9 (b) is viewed from the z direction to the + z direction.

10 (b), connection terminals 22 and 225 for connecting the wiring 2037 to the internal circuit of the DDI 2 may be disposed in the top-layer 2T. Connection terminals 21 and 213 for connecting the connection terminals 21 and 214 disposed on the thin film transistor array substrate 1020 to the internal circuit of the DDI 2 are disposed in the top layer 2T.

Referring to FIG. 10C, fingerprint sensing electrodes 44 for recognizing a fingerprint may be disposed on the TFT array substrate 1020. The fingerprint sensing electrodes 44 may have an x * y matrix structure, of which x or y may have a value of one.

Referring to FIG. 10C, a plurality of wirings 2037 may be disposed on the thin film transistor array substrate 1020. Connection terminals 22 and 226 for connecting the wiring 2037 to the DDI 2 may be disposed on the thin film transistor array substrate 1020. The connection terminals 22 and 226 and the wiring 2037 may be electrically connected to each other.

10 (c), connection terminals 21 and 214 for connecting the fingerprint sensing electrodes 44 to circuits in the DDI 2 may be disposed. The fingerprint sensing electrode 44 and the connection terminals 21 and 214 may be connected to each other by separate wirings.

At this time, the connection terminals 22 and 226, the connection terminals 21 and 214, and the fingerprint sensing electrodes 44 may all be disposed in the area A3.

The fingerprint sensing electrodes 44 may be connected to the fingerprint sensing signal output unit 20 'included in the DDI 2 via the connection terminals 21 and 214 and the connection terminals 21 and 213. One example of the fingerprint sensing signal output unit 20 'is described in FIGS. 13 and 14, which will be described later.

The connection terminals 22 and 225 and the connection terminals 22 and 226 may be arranged so as to be joined to each other. The wiring 2037 can be connected to the internal circuit of the DDI 2 via the connection terminals 22 and 224 and the connection terminals 22 and 223. [

The connection terminals 21 and 213 and the connection terminals 21 and 214 may be arranged so as to be joined to each other.

<Example 4>

11 illustrates a configuration of a fingerprint recognition apparatus according to another embodiment of the present invention.

11A, 11B and 11C show the bottom-layer 2B, the top-layer 2T, and the thin film transistor array substrate 1020 shown in FIG. 7, respectively.

11 (a) and 11 (c) are all viewed from the + z direction toward the? Z direction, and Fig. 9 (b) is viewed from the z direction to the + z direction.

11 (b), connection terminals 22 and 227 for connecting the wiring 2037 to the internal circuit of the DDI 2 may be disposed in the top-layer 2T. Connection terminals 21 and 215 for connecting the connection terminals 21 and 216 disposed in the thin film transistor array substrate 1020 to the internal circuit of the DDI 2 are disposed in the top layer 2T.

Referring to FIG. 11C, fingerprint sensing electrodes 44 for recognizing fingerprints may be disposed on the TFT array substrate 1020. The fingerprint sensing electrodes 44 may have an x * y matrix structure, of which x or y may have a value of one.

11 (c), a plurality of wirings 2037 may be disposed on the thin film transistor array substrate 1020. Connection terminals 22 and 228 for connecting the wiring 2037 to the DDI 2 may be disposed on the thin film transistor array substrate 1020. The connection terminals 22 and 228 and the wiring 2037 may be electrically connected to each other.

10 (c), the connection terminals 21 and 216 for connecting the fingerprint sensing electrodes 44 to circuits inside the DDI 2 may be disposed. The fingerprint sensing electrode 44 and the connection terminals 21 and 216 may be connected to each other by separate wirings.

At this time, the connection terminals 22 and 228 and the connection terminals 21 and 216 may all be disposed inside the area A3.

However, the fingerprint sensing electrodes 44 may be disposed outside the region A3.

The fingerprint sensing electrodes 44 may be connected to the fingerprint sensing signal output unit 20 'included in the DDI 2 via the connection terminals 21 and 216 and the connection terminals 21 and 215. One example of the fingerprint sensing signal output unit 20 'is described in FIGS. 13 and 14, which will be described later.

The connection terminals 22 and 227 and the connection terminals 22 and 228 may be arranged so as to be connected to each other. The wiring 2037 can be connected to the internal circuit of the DDI 2 via the connection terminals 22 and 228 and the connection terminals 22 and 227. [

The connection terminals 21 and 215 and the connection terminals 21 and 216 may be arranged so as to be connected to each other.

&Lt; Example 5 >

FIG. 12 shows a configuration of a fingerprint recognition device according to another embodiment of the present invention.

12A, 12B, and 12C show the bottom-layer 2B, the top-layer 2T, and the thin film transistor array substrate 1020 shown in FIG. 7, respectively.

12 (a) and 12 (c) are all viewed from the + z direction toward the? Z direction, and Fig. 9 (b) is viewed from the z direction toward the + z direction.

Referring to FIG. 12B, connection terminals 22 and 229 for connecting the wires 2037 to the internal circuit of the DDI 2 may be disposed in the top-layer 2T.

Referring to FIG. 12C, fingerprint sensing electrodes 44 for recognizing a fingerprint may be disposed on the TFT array substrate 1020. The fingerprint sensing electrodes 44 may have an x * y matrix structure, of which x or y may have a value of one.

Referring to FIG. 12C, a plurality of wirings 2037 may be disposed on the thin film transistor array substrate 1020. Connection terminals 22 and 230 for connecting the wiring 2037 to the DDI 2 may be disposed on the thin film transistor array substrate 1020. The connection terminals 22 and 230 and the wiring 2037 may be electrically connected to each other. The connection terminals 22 and 230 may be disposed inside the area A3.

At this time, the fingerprint sensing electrode 44 may be formed integrally with a part of the wiring 2037. The fingerprint sensing electrode 44 may be disposed outside the region A3, and may be formed within the non-sensing region A1.

The fingerprint sensing electrodes 44 can be connected to the circuit inside the DDI 2 via the connection terminals 22 and 230 and the connection terminals 22 and 229. [

The fingerprint sensing electrode 44 and the sensing electrode 100 may both be connected to the fingerprint sensing signal output unit 20 'inside the DDI 2 via the wiring 2037. One example of the fingerprint sensing signal output unit 20 'is described in FIGS. 13 and 14, which will be described later.

At this time, a switch unit 3012 may be disposed between the fingerprint sensing electrode 44 and the sensing electrode 100. The wiring 2037 can pass through the terminal T1 and the terminal T2 of the switch portion 3012. The switch portion 3012 connects the wiring 2037 between the terminal T1 and the terminal T2 Can be disconnected or connected as needed.

In one mode, the switch portion 3012 can connect the wirings 2037 between the terminals T1 and T2 to each other. In this case, the circuit inside the DDI 2 can receive the signal from the sensing electrode 100. [

In another mode, the switch portion 3012 can disconnect the wiring 2037 between the terminal T1 and the terminal T2. In this case, the circuit inside the DDI 2 can not receive the signal from the sensing electrode 100. [ However, a circuit inside the DDI 2 can receive a signal from the fingerprint sensing electrode 44.

The connection terminals 22 and 229 and the connection terminals 22 and 230 may be arranged so as to be joined to each other.

FIG. 13 is for explaining an example of a circuit for detecting the electrical characteristics of the fingerprint sensing electrodes 44 provided in accordance with an embodiment of the present invention.

Although the fingerprint sensing electrode 44 is shown as a part of the DDI 2 in FIG. 13, the fingerprint sensing electrode 44 may exist outside the DDI 2, as can be seen in the various embodiments described above.

The circuit 20 'having the same structure as that of the touch sensing signal output unit 20 shown in FIG. 4A may be connected to the fingerprint sensing electrodes 44 to function as the fingerprint sensing signal output unit 20'. In FIG. 13, the 4-bit selection multiplexer MF1 is included in the fingerprint sensing signal output unit 20 '. However, it is also possible to provide a larger number of the touch input sensing circuits 10 without disposing the multiplexer. Bit selection multiplexer MF1 'instead of the 4-bit selection multiplexer MF1' and connect only the two fingerprint sensing electrodes 44 to each 2-bit selection multiplexer MF1 '. It will be readily appreciated that many other variations are possible.

Fig. 14 is for explaining an example of a circuit for detecting the electrical characteristics of the fingerprint sensing electrodes 44 provided according to another embodiment of the present invention.

In the example of FIG. 14, the touch sensing signal output unit 20 shown in FIG. 4A may be used as the fingerprint sensing signal output unit 20 '. That is, for at least some of the fingerprint sensing electrodes 44, one touch sensing signal output unit 20 may replace the function of the fingerprint sensing signal output unit 20 '. To this end, there may be another plurality of multiplexers 400 that receive the sensing electrode 100 and the fingerprint sensing electrode 44 as inputs and select one of them.

It should be noted that the circuit shown in Figs. 13 and 14 is merely an example for facilitating understanding of the present invention, and it is possible to deal with various other embodiments.

The embodiments illustrated in the present specification are intended to facilitate understanding of the present invention and any other kinds of embodiments to which the inventive aspects set forth in the claims of the present invention may be applied may be applied to the present invention. The invention set forth in the claims herein should not be construed as limited by the embodiments disclosed herein.

Claims (10)

A DDI adapted to drive a display device,
A plurality of connection terminals for connecting connection wirings connecting between the display device and the DDI;
A plurality of capacitive conductors disposed adjacent the connection terminals; And
A fingerprint sensing signal output unit connected to the plurality of capacitive conductors;
/ RTI &gt;
Wherein the fingerprint sensing signal output is adapted to output a value associated with a capacitance value formed by the capacitive conductor.
Fingerprint recognition. The method according to claim 1,
Wherein the function of the fingerprint sensing signal output unit is activated only when the user equipment including the display device is in the sleep mode. 3. The method according to claim 1 or 2,
Further comprising a light emitting element disposed near said plurality of capacitive conductors. The method of claim 3,
Wherein the light emitting element is adapted to emit light only when the user equipment including the display device is in the sleep mode. The method according to claim 1,
Wherein a pitch between the plurality of capacitive conductors satisfies a critical distance condition for recognizing the irregularities of the fingerprint. The method according to claim 1,
Wherein the capacitive conductor is disposed on a first side of the plurality of faces forming the package of the fingerprint recognition DDI, the first side contacting the display device. The method according to claim 6,
Wherein the first side comprises a region comprising a metal material. An input / output device including an input / output panel (1050) and a DDI (2) connected on a first layer (1020) of the input / output panel,
The input /
A plurality of capacitive conductors (44) disposed outside of an area (A3) occupied by the DDI in the first layer;
A plurality of first connection terminals 228 for connecting connection wirings 2037 connecting between the input / output panel and the DDI; And
A second connection terminal 216 for connecting the capacitive conductor 44 to an internal circuit of the DDI 2,
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The first connection terminal and the second connection terminal are disposed in the region, the capacitive conductor is disposed outside the region,
The DDI includes a third connection terminal (227) for connecting the first connection terminal to the internal circuit and a fourth connection terminal (215) for connecting the second connection terminal to the internal circuit.
Input / output device. An input / output device including an input / output panel (1050) and a DDI (2) connected on a first layer (1020) of the input / output panel,
The input /
A wiring 2037 for connecting the sensing electrode 100 on the sensing area of the input / output panel to the internal circuit of the DDI;
A plurality of capacitive conductors (44) formed integrally with the wiring in a partial region of the wiring (2037);
A switch unit (3012) disposed between the capacitive conductor (44) and the sensing electrode (100) and capable of breaking the electrical connection between the sensing electrode and the capacitive conductor; And
A first connection terminal 230 for connecting the wiring to the internal circuit of the DDI,
/ RTI &gt;
Wherein the DDI includes a second connection terminal (229) for contacting the first connection terminal,
Input / output device. A fingerprint recognition DDI according to claim 1;
I / O panel; And
And an FPCB for connecting the fingerprint recognition DDI and the input /
/ RTI &gt;
User device.

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