KR20150089750A - Micro electro mechanical systems magnetic field sensor package - Google Patents

Abstract

A micro-electro-mechanical system (MEMS) magnetic field sensor package according to an embodiment comprises: a package body; a magnetic field sensor disposed on the top of the package body and including a sensor structure in which a displacement is generated by magnetic field; and a conductive line formed on the package body, and generating magnetic field for displacing the sensor structure by having current to be measured flow. The conductive line and the sensor structure are formed on the same plane.

Description

[0001] MICRO ELECTRO MECHANICAL SYSTEMS [0002] MAGNETIC FIELD SENSOR PACKAGE [0003]

Embodiments relate to a magnetic sensor package, and more particularly to a MEMS magnetic sensor package.

MEMS (MICRO ELECTRO MECHANICAL SYSTEMS) In the case of a magnetic sensor based on capacitive sensing technology, it is generally composed of a driving electrode capable of moving in response to a magnetic field and a fixed electrode capable of sensing a change in capacitance corresponding thereto.

The principle of the magnetic field sensor is that when the reference current is supplied to the driving electrode in a predetermined direction, the driving electrode moves in the positive or negative direction with respect to the fixed electrode by the Lorentz force according to the magnetic field direction and intensity from the outside.

At this time, the distance between the two electrodes and the overlap area change, and the capacitance changes. And sensing the magnetic field by detecting such a change in capacitance or correspondingly changing signal.

However, since the Lorentz force used to sense the magnetic field is relatively small compared with gravity, it is difficult to obtain a sufficient mechanical displacement amount due to restriction of the sensor structure design such as a spring.

Further, as the distance between the conductor through which the current to be measured flows and the sensor becomes longer, the magnetic field sensitivity becomes smaller and it is not easy to detect an accurate signal.

On the other hand, in recent years, the conductor and the magnetic field sensor are formed as one package, and the conductor and the magnetic field sensor are disposed together in one receiving space, thereby enhancing the strength of the magnetic field.

At this time, in the case of the magnetic field sensor, the displacement amount of the driving electrode varies depending on the direction of the magnetic field entering the sensor structure. Therefore, the sensor structure and the conductor should be arranged properly.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a conductor in which a current to be measured flows in the sensor package according to the prior art, and the arrangement of the sensor structure. Fig.

Referring to FIG. 1, a sensor package according to the related art includes a magnetic sensor 10 including a sensor structure 20, a wire 30 disposed on the magnetic sensor 10, through which a current to be measured flows, .

The conductive line 30 is disposed parallel to the sensor structure 20 at a predetermined distance from the sensor structure 20.

However, according to the sensor package as described above, since the conductor 30 and the sensor structure 20 are arranged in parallel vertically, the direction of the magnetic field entering the sensor structure 20 is horizontal or inclined.

Therefore, since the magnetic field is horizontal or inclined, the force of the Lorentz acts in the vertical direction of the sensor structure 20, and the amount of displacement of the sensor structure 20 is reduced or abnormal driving occurs.

As described above, when the amount of displacement of the sensor structure 20 is reduced or abnormal driving occurs, the output signal of the magnetic sensor decreases at the same current intensity, and the output value of the magnetic sensor becomes unstable .

In the embodiment according to the present invention, a sensor package of a new structure and a manufacturing method thereof are provided.

Further, in an embodiment according to the present invention, a sensor package in which a magnetic field generated from a conductor through which a current to be measured flows is generated in the vertical direction of the sensor structure, and a method of manufacturing the same are provided.

It is to be understood that the technical objectives to be achieved by the embodiments are not limited to the technical matters mentioned above and that other technical subjects not mentioned are apparent to those skilled in the art to which the embodiments proposed from the following description belong, It can be understood.

A MEMS sensor package according to an embodiment includes a package body; A magnetic sensor disposed on the package body and including a sensor structure in which a displacement is generated by a magnetic field; And a conductor formed on the package body and generating a magnetic field for displacement of the sensor structure by flowing a current of the measurement object, wherein the conductor and the sensor structure are formed on the same plane.

Further, the conductor causes a magnetic field generated by the measurement subject current to be generated in the vertical direction of the sensor structure.

In addition, the sensor structure is formed by floating inside the body constituting the magnetic field sensor.

In addition, the package body may include a first groove into which the magnetic sensor is inserted and a second groove into which the conductive line is embedded, and the depths of the first groove and the second groove are different from each other.

The second groove has a shallower depth from the depth of the first groove by the floating height of the sensor structure.

The magnetic sensor is attached to the upper surface of the package body, and the conductor is formed on the protrusion protruding from the upper surface of the package body.

The height of the protrusion corresponds to the floating height of the sensor structure.

The conductor has a linear shape spaced apart from the magnetic sensor by a predetermined distance and extending in a direction parallel to the arrangement direction of the sensor structure formed in the magnetic sensor.

The conductor has a linear shape spaced apart from the magnetic sensor by a predetermined distance and extending in a direction perpendicular to the direction of arrangement of the sensor structure formed in the magnetic sensor.

According to another aspect of the present invention, there is provided a MEMS magnetic sensor package including: a package body; A magnetic sensor disposed on the package body and including a sensor structure in which a displacement is generated by a magnetic field; And a conductor formed on the package body and generating a magnetic field for displacement of the sensor structure by flowing a current of the measurement object, wherein the conductor generates a magnetic field applied in the vertical direction of the sensor structure.

The conductor may be formed so as to surround the first region formed in the package body, and the first region may be formed on the package body such that the conductor is located at a position below the second region, And overlaps at least a part of the second region.

The first region may include a first overlapping region located on the package body and vertically below a third region where the sensor structure is formed and overlapping the entire region of the third region, And overlaps with a portion of the second region.

In addition, the conductor overlaps with the second region located above the first region in the vertical direction, and is not overlapped with the third region.

The conductive line is formed so as to surround the first region, and the first region is located on the package body in the vertical direction above the second region in which the magnetic field sensor is formed, It overlaps with a part.

The first region may include a first overlapping region located on the package body and vertically above a third region where the sensor structure is formed and overlapping the entire region of the third region, And overlaps with a portion of the second region.

Further, the lead wire overlaps with the second region located vertically below the first region, and is not overlapped with the third region.

In addition, the conductor surrounding the periphery of the first region has a shape including at least one bent portion of a triangular shape, a square shape, a circular shape, an elliptical shape, and a polygonal shape.

According to the embodiment of the present invention, the magnetic field is generated in the vertical direction of the sensor structure by optimizing the arrangement of the conductor and the sensor structure through which the current to be measured flows, thereby minimizing the loss of the strength of the magnetic field required to generate Lorentz force .

In addition, according to the embodiment of the present invention, by making the direction of the magnetic field perpendicular to the reference current conductor of the driving electrode, it is possible to reduce the probability that the driving electrode receives the Lorentz force in a direction other than the horizontal direction, You can get the output value.

According to the embodiment of the present invention, by concentrating the Lorentz force in the horizontal direction, it is possible to maximize the amount of displacement of the driving electrode, thereby maximizing the output value and improving the resolution with respect to the same current amount and the same magnetic field intensity have.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a conductor in which a current to be measured flows in the sensor package according to the prior art, and the arrangement of the sensor structure. Fig.
2 is a top view of the MEMS magnetic sensor package according to the first embodiment of the present invention.
3 is a first cross-sectional view of the MEMS magnetic sensor package of FIG. 2 taken along line A-A '.
4 is a second cross-sectional view of the MEMS magnetic sensor package of FIG. 2 taken along line A-A '.
5 is a top view of the magnetic field sensor in the magnetic sensor package of FIG.
FIGS. 6 to 9 are views for explaining the manufacturing method of the magnetic sensor package shown in FIGS. 2 and 3 in the process order.
10 is a top view of a MEMS magnetic sensor package according to a second embodiment of the present invention.
11 is an enlarged top view of the conductor and sensor structure shown in Fig.
12 is a second cross-sectional view of the MEMS magnetic sensor package of FIG. 10 taken along line A-A '.
13 is a top view of a MEMS magnetic sensor package according to a third embodiment of the present invention.
14 is a cross-sectional view of the MEMS magnetic sensor package of FIG. 13 taken along line A-A '.
15 is a cross-sectional view showing a modified example of the MEMS magnetic sensor package of FIG.
16 is a top view of a MEMS magnetic sensor package according to a fourth embodiment of the present invention.
17 is a top view of a MEMS magnetic sensor package according to a fifth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

The present invention provides a MEMS magnetic sensor package with improved sensing capability of the sensor.

Hereinafter, a MEMS magnetic sensor package according to a first embodiment of the present invention will be described with reference to FIGS.

FIG. 2 is a top view of a MEMS magnetic sensor package according to a first embodiment of the present invention, FIG. 3 is a first sectional view taken along line A-A 'of the MEMS magnetic sensor package of FIG. 2, Sectional view of the MEMS magnetic sensor package taken along line A-A ', and FIG. 5 is a top view showing the magnetic sensor in the magnetic sensor package of FIG.

3 is a cross-sectional view of the MEMS magnetic sensor package of FIG. 2 according to an embodiment of the present invention taken along line A-A '. FIG. 4 is a view of another embodiment of the MEMS magnetic sensor package of FIG. A 'in Fig.

2 through 4, the magnetic sensor package 300 according to the embodiment includes the magnetic sensor 100, the package body 210, the lead pad 220, the lead 230, the control element 240, A connection line 250, and a protection layer 260. [

The package body 210 is a supporting substrate, and may be formed of an insulating material. Specifically, the package body 210 may be formed of a multi-layer ceramic (MLC), a glass substrate, a resin substrate, or a high-density silicon substrate.

In the package body 210, a plurality of elements are disposed. That is, a plurality of devices are mounted on the package body 210, and the plurality of devices are electrically connected to each other through the connection line 250.

The plurality of elements may include a magnetic field sensor 100 and a control element 240.

The magnetic field sensor 100 and the control device 240 may be arranged in a row as shown in FIG. 2, but the present invention is not limited thereto.

The magnetic field sensor 100 includes sensor components for sensing a magnetic field, and the sensor component includes sensor structures 120 and 130 that are displaced according to the strength of the magnetic field. The magnetic field sensor 100 may be connected to the adjacent control element 240 through a connection line 250 to receive mutual signals.

The control device 240 is disposed adjacent to the plurality of sensing electrodes 113, 114, 118, and 119 constituting the magnetic field sensor 100. The plurality of sensing electrodes 113, 114, 118, 119, respectively.

Alternatively, the control device 240 may be disposed adjacent to the plurality of power supply electrodes 111, 112, 116, and 117 constituting the magnetic field sensor 100, And 117, respectively.

The control element 240 is connected to the magnetic field sensor 100 to supply a reference voltage to the magnetic field sensor 100 and receives a detection signal transmitted from the magnetic field sensor 100, And generates a signal about the strength of the magnetic field.

2, the connection between one control element 240 and the magnetic field sensor 100 is shown through one connection line 250. However, the present invention is not limited to this, The control element 240 and the magnetic field sensor 100 may be connected.

The connection line 250 may be formed of a wire as shown in FIG. 2, but the present invention is not limited thereto. The connection line 250 may include an electrode formed on the magnetic sensor 100 and a connection pad (Not shown).

A protective layer 260 is formed on the package body 210. Preferably, the protective layer 260 is formed on the package body 210 so as to surround the magnetic sensor 100 and the control device 240.

3, the protection layer 260 is formed on the package body 210 to seal the upper space of the package body 210.

The package body 210 is formed with a conductive line 230 for transmitting a current to be measured. Preferably, the conductive line 230 generates a magnetic field to be sensed by the magnetic field sensor 100.

A plurality of lead pads 220 are formed on the package body 210. The lead wires 230 are connected to one lead pad 220 at one end and connected to another lead pad 220 at the other end .

In this case, the conductor 230 in the first embodiment of the present invention extends in a substantially straight line shape such that one end is connected to the one lead pad 220 and the other end is connected to the other lead pad 220 .

At this time, the conductive line 230 is spaced apart from the magnetic field sensor 100 by a predetermined distance.

A current to be measured flows through the wire 230. When a current to be measured flows through the wire 230, a magnetic field is generated around the wire 230.

Meanwhile, when the reference current is generated in the magnetic field sensor 100, the sensor structures 120 and 130 constituting the magnetic field sensor 100 are displaced in response to the magnetic field generated by the conductive line 230.

That is, Lorentz force is generated in the sensor structures 120 and 130 according to the direction and intensity of the magnetic field generated by the conductive line 230, and the Lorentz force is generated by the generated Lorentz force. At this time, the distance or overlapped area of the sensor structures 120 and 130 changes and the capacitance value changes.

Accordingly, the control device 240 detects the change of the capacitance value or the corresponding electrical signal to detect the intensity of the current.

At this time, the intensity of the magnetic field generated by the current flowing in the conductor 230 is expressed by Equation (1).

는 자기장의 세기를 의미하고,

는 비투자율(relative permeability)을 의미하며,

는 상기 도선(230)에 흐르는 전류를 의미하고,

은 상기 도선(230)과 상기 자계 센서(100) 사이의 거리이다.At this time,

Means the intensity of the magnetic field,

Refers to relative permeability,

Means a current flowing in the lead 230,

Is the distance between the lead 230 and the magnetic field sensor 100.

The smaller the distance between the magnetic field sensor 100 and the conductive line 230 is, the greater the strength of the magnetic field generated by the conductive line 230. Accordingly, the conductive line 230 and the magnetic field sensor 100 Can be 5 占 퐉 to 20 占 퐉, preferably 10 占 퐉 to 15 占 퐉.

It should be noted that the Lorentz force generated in the magnetic field sensor 100 must act in the horizontal direction of the sensor structures 120 and 130 constituting the magnetic field sensor 100 so that the sensor structures 120 and 130 Can be maximized.

At this time, the direction of the force of the Lorentz is determined by the direction of the magnetic field generated in the lead wire 230.

Accordingly, in the present invention, the conductive line 230 and the magnetic field sensor 100 are arranged such that the force of the Lorentz acts in the horizontal direction or the direction of the magnetic field occurs in the vertical direction of the magnetic field sensor 100 do.

At this time, the direction of the magnetic field is determined by the direction of the current flowing through the lead wire 230. That is, according to the Amphor's law, when the current-carrying wire 230 is wound with the right hand and the thumb is directed in the direction of current flow, the remaining fingers indicate the direction of the magnetic field. At this time, the magnetic field forms a concentric circle shape in a plane perpendicular to the current, and the direction becomes a direction to turn the screw when advancing the right screw in the direction of the current.

In order to make the direction of the magnetic field generated by the current flowing in the wire 230 to be perpendicular to the sensor structures 120 and 130 constituting the magnetic field sensor 100, It should be formed in the same plane as the magnetic field sensor 100 and in a direction parallel to the arrangement direction of the magnetic field sensor 100.

At this time, even if the conductive line 230 is formed on the same plane as the magnetic field sensor 100, a magnetic field generated by the current flowing in the conductive line 230 occurs in the vertical direction of the sensor structures 120 and 130 I do not. In other words, the conductive line 230 is formed not on the magnetic field sensor 100 but on the same plane as the sensor structures 120 and 130 constituting the magnetic field sensor 100, The magnetic field is generated in a direction perpendicular to the sensor structures 120 and 130. In other words,

Therefore, in the first embodiment of the present invention, the conductive lines 230 are arranged on the same plane as the sensor structures 120 and 130, and parallel to the arrangement direction of the sensor structures 120 and 130 .

The magnetic field generated by the current flowing through the conductive line 230 is generated in the vertical direction of the sensor structures 120 and 130 by the arrangement of the conductive line 230 and the sensor structures 120 and 130, So that the force of the Lorentz acts in the horizontal direction to maximize the amount of displacement of the sensor structures 120 and 130.

For such an arrangement, a first groove 270 and a second groove 280 are formed in the package body 210.

The magnetic field sensor 100 is inserted into the first groove 270. That is, in the present invention, in order to minimize the volume of the magnetic sensor package, a groove may be formed in the package body 210, and the magnetic sensor 100 may be inserted into the formed groove.

The sensor structures 120 and 130 are formed in the magnetic field sensor 100 at a predetermined height in the magnetic field sensor 100.

Accordingly, in order to form the sensor structures 120 and 130 and the wire 230 on the same plane, it is essential that the first groove 270 is formed.

At this time, the depth of the first groove 270 may be determined by the height of the sensor structures 120 and 130 disposed in the magnetic field sensor 100.

For example, when the sensor structures 120 and 130 are formed at a height A from the bottom surface of the magnetic sensor 100, the first groove 270 may be formed to have a height corresponding to the A .

In this case, the second groove 280 formed in the package body 210 may be omitted. That is, since the depth of the first groove 270 is formed to correspond to the height of the sensor structures 120 and 130, the conductor 230 must be formed directly on the upper surface of the package body 210, 230 and the sensor structures 120, 130 are on the same plane.

However, in such a case, the side surface of the conductive line 230 may be exposed to the outside, which may reduce the intensity of the current flowing through the conductive line 230.

Accordingly, in the present invention, the conductor 230 is embedded in the package body 210.

A second groove 280 is formed in the package body 210 and the lead 230 is embedded in the second groove 280.

At this time, the depth of the second groove 280 may be determined by the depth of the first groove 270 and the height of the sensor structure 120, 130 formed on the magnetic sensor 100.

The height of the second groove 280 can be determined by the following equation.

Herein, D1 denotes a depth of the first groove 270, D3 denotes a lifting height of the sensor structures 120 and 130 in the magnetic field sensor 100, 2 shows the depth of the groove 280.

The magnetic field sensor 100 is inserted into the first groove 270 and the conductive line 230 is embedded in the second groove 280. The conductive line 230 contacts the magnetic sensor 100, The depth of the first groove 270 and the depth of the second groove 280 are determined so as to lie on the same plane as the sensor structures 120,

Accordingly, the magnetic field 290 can be generated in the vertical direction of the sensor structures 120 and 130 by the arrangement of the conductor 230 and the sensor structures 120 and 130 as described above.

Alternatively, as shown in FIG. 4, the magnetic field sensor 100 may be directly attached to the package body 210. That is, the first groove 270 can be eliminated.

The protrusion 215 may be formed on the package body 210 to form the sensor structures 120 and 130 of the magnetic field sensor 100 and the wire 230 on the same plane.

The protrusions 215 provide a space for forming the conductive lines 230 so that the conductive lines 230 and the sensor structures 120 and 130 are placed on the same plane.

The height of the protrusion 215 is the same as the height of the sensor structure 120 or 130 in the magnetic field sensor 100.

In the above description, the conductive line 230 has a straight line extending in a direction parallel to the direction in which the sensor structures 120 and 130 of the magnetic sensor 100 are arranged.

However, the conductive line 230 is formed in the same plane as the plane on which the sensor structures 120 and 130 are disposed while being spaced apart from the sensor structures 120 and 130 by a predetermined distance, The magnetic field generated in the wire 230 acts in a direction perpendicular to the sensor structures 120 and 130 even if the sensor structures 120 and 130 are arranged in a direction perpendicular to the direction in which the sensor structures 120 and 130 are disposed.

Accordingly, the conductive line 230 may be formed at a position of the control element shown in FIG. 2 in a direction perpendicular to the arrangement direction of the sensor structures 120 and 130.

According to the embodiment of the present invention, the magnetic field is generated in the vertical direction of the sensor structure by optimizing the arrangement of the conductor and the sensor structure through which the current to be measured flows, thereby minimizing the loss of the strength of the magnetic field required to generate Lorentz force .

In addition, according to the embodiment of the present invention, by making the direction of the magnetic field perpendicular to the reference current conductor of the driving electrode, it is possible to reduce the probability that the driving electrode receives the Lorentz force in a direction other than the horizontal direction, You can get the output value.

According to the embodiment of the present invention, by concentrating the Lorentz force in the horizontal direction, it is possible to maximize the amount of displacement of the driving electrode, thereby maximizing the output value and improving the resolution with respect to the same current amount and the same magnetic field intensity have.

Hereinafter, the magnetic field sensor 100 according to the embodiment of the present invention will be described with reference to FIG.

In the above, the sensor structures 120 and 130 disposed in the magnetic field sensor 100 refer to the driving electrode portion below. That is, the driving electrode portion and the sensor structure are created in the same meaning, and thus indicate the same components in the magnetic field sensor 100.

5, the magnetic field sensor 100 includes a fixed substrate 110, driving electrode portions 120 and 130, and a plurality of elastic portions 140, 150, 160, and 170 as MEMS elements.

MICRO ELECTRO MECHANICAL SYSTEMS (MICRO ELECTRO MECHANICAL SYSTEMS) is a technology for fabricating ultra-fine mechanical structures such as ultra-high density integrated circuits, ultra-small gears, and hard disks by processing silicon, quartz, and glass. Micromachines made with MEMS have a precision of micrometers (less than one millionth of a meter). Structurally, semiconductor microprocessing technology is used to repeat deposition and etching processes. The driving force is applied to the principle of reducing electric power consumption by generating electric current using electrostatic force and surface tension which are attracted to each other between charges.

The fixed substrate 110 of the magnetic sensor 100 including the MEMS element supports the driving electrode portions 120 and 130 and the plurality of elastic portions 140, 150, 160, and 170.

The fixed substrate 110 has a plate shape and a rectangular frame shape. The fixed substrate 110 may be a horizontally long rectangular shape and may have an area of 3 mm · 1 mm.

The fixed substrate 110 has a plurality of layered structures and may include electrode layers 115a and 115b.

The support substrate 110 may be a silicon substrate, a glass substrate, or a polymer substrate, but is not limited thereto.

The fixed substrate 110 is arranged along each side of a square by patterning an electrode layer on a supporting substrate (not shown) having a receiving space for accommodating the driving electrode parts 120 and 130 at the center thereof, And includes a plurality of electrodes 111-119.

The plurality of electrodes 111-119 may be a conductive material such as silicon, copper, aluminum, molybdenum, or tungsten. The electrodes 111-119 have a thickness of 10 to 100 탆, and preferably have a thickness of about 50 탆.

The electrodes 111-119 are adjacent to the four sensing electrodes 113, 114, 118, and 119 and the sensing electrodes 113, 114, 118, and 119 disposed in four corner areas, And protruding power electrodes 111, 112, 116, and 117.

In detail, the first sensing electrode 113 and the second sensing electrode 114, which are arranged in the corner region on the straight line along the y-axis, are formed, and the first sensing electrode 113 is adjacent to the first sensing electrode 113, A first power supply electrode 111 is formed to have a width smaller than that of the sensing electrode 113. The first power supply electrode 111 is formed in a straight line with the first power supply electrode 111 and is adjacent to the second sensing electrode 114, And the second power supply electrode 112 is formed to have a width smaller than that of the electrode 114.

Although the first and second sensing electrodes 113 and 114 are disposed in the edge regions in the embodiment, the first and second power supply electrodes 111 and 112 extend to the edge regions, When the electrodes 111 and 112 are formed adjacent to the first and second sensing electrodes 113 and 114, the widths of the first and second sensing electrodes 113 and 114 are equal to the widths of the first and second power electrodes 111 and 111, , 112).

The first power electrode 111 and the second power electrode 112 may include a predetermined spacing distance. When the spacing distance is equal to or greater than the predetermined distance, An electrode 115a may be further formed.

When the dummy electrode 115a is formed, the dummy electrode 115a is formed to have a smaller width than the first and second power supply electrodes 111 and 112 in the x-axis direction.

The third sensing electrode 118 and the third sensing electrode 118 are disposed in a line on the x-axis with the first sensing electrode 113 and the fourth sensing electrode 119 ).

A third power electrode 116 is formed adjacent to the third sensing electrode 118 to have a width smaller than that of the third sensing electrode 118. The third power electrode 116 is formed in a straight line with the third power electrode 116, A fourth power supply electrode 117 is formed adjacent to the electrode 119 to have a width smaller than that of the fourth sensing electrode 119.

The third power electrode 116 and the fourth power electrode 117 may include a predetermined spacing distance. When the spacing distance is equal to or greater than the predetermined distance, An electrode 115b may be further formed.

When the dummy electrode 115b is formed, the dummy electrode 115b is formed to have a width smaller than that of the third and fourth power supply electrodes 116 and 117.

A small accommodation space is further formed by the difference in width between the sensing electrodes 113, 114, 118 and 119 and the neighboring power supply electrodes 111, 112, 116 and 117, 140, 150, 160, and 170 are disposed.

112, 116, 117, and 118 protruding from the respective sensing electrodes 113, 114, 118, 119 toward the accommodation space to support the neighboring elastic portions 140, 150, 160, A protruding portion forming a small accommodation space may be further formed.

The driving electrode portions 120 and 130 are disposed in the accommodation space of the fixed substrate 110.

The driving electrode units 120 and 130 include a first driving electrode 120 surrounded by the first and second sensing electrodes 113 and 114 and the first and second power electrodes 111 and 112 and supplied with power, And a second driving electrode 130 surrounded by the third and fourth sensing electrodes 118 and 119 and the third and fourth power electrodes 116 and 117 and supplied with power.

The first driving electrode 120 includes a first reference electrode 121, a first variable electrode 126, and at least one first connection unit 180 connecting the first reference electrode 121 and the second reference electrode 120, which extend in the y- do.

The first reference electrode 121 and the first variable electrode 126 are formed of an electrode layer extending from the two elastic portions 140 and 150.

The first reference electrode 121 includes a bar type body connecting between the first and second elastic portions 140 and 150. The first reference electrode 121 has a larger width than the first and second elastic portions 140 and 150, .

The body is extended and extended in the x-axis direction. The extension extends to the space formed by the step in the x-axis direction formed between the first and second power supply electrodes 111 and 112 and the dummy electrode 115a. it means.

The length of the first reference electrode 121 may be 500 탆 to 5000 탆, preferably 1500 탆 to 2500 탆.

The first reference electrode 121 includes a plurality of first reference electrode protrusions 122 protruding toward the dummy electrode 115a.

The first reference electrode protrusion 122 may be formed in a comb shape and the width of the first reference electrode protrusion 212 having a predetermined length may be 1 탆 to 30 탆, Mu m.

The number of the first reference electrode protrusions 122 is determined according to the length of the first reference electrode 121, the width of the first reference electrode protrusion 112, and the spacing distance.

The first variable electrode 126 has the same shape as the first reference electrode 121 and is disposed symmetrically with respect to the first connection portion 180. Accordingly, the first driving electrode 120 can maintain the center of gravity in the x-axis direction.

That is, the first variable electrode 126 is formed as a bar type body connecting between the first and second elastic parts 140 and 150, and the first variable electrode 126 is larger than the legs of the first and second elastic parts 140 and 150 Respectively.

The width is extended in the x-axis direction, and this extension means extension to the stepped portion into the receiving space by the projecting portions of the first and second sensing electrodes 113 and 114.

The length of the first variable electrode 126 may be 500 탆 to 5000 탆, preferably 1500 탆 to 2500 탆.

The first variable electrode 126 includes a plurality of first variable electrode protrusions 127 protruding toward the second variable electrode 136.

The first variable electrode protrusions 127 may be formed in a comb shape and the width of the first variable electrode protrusions 127 may be 1 to 30 탆, preferably 3 to 4 탆. have.

The number of the first variable electrode protrusions 127 is determined according to the length of the first reference electrode 121, the width of the first variable electrode protrusions 127, and the spacing distance.

The first connection unit 180 has a region exposed between the first reference electrode 121 and the first variable electrode 126 and includes a first reference electrode 121 and a first variable electrode 126, And extend over part or all of the body.

As shown in FIG. 5, the first connection unit 180 may be at least one, and the plurality of first connection units 180 may be disposed at a predetermined interval.

The first connection unit 180 physically connects the first reference electrode 121 and the first variable electrode 126 while electrically inserting the first reference electrode 121 and the first variable electrode 126.

The first connection part 180 may have an area of 100 탆 and 300 탆 and the long side is arranged to cross the body of the first reference electrode 121 and the first variable electrode 126.

The second driving electrode 130 includes a second reference electrode 131, a second variable electrode 136, and at least one second connection unit 190 that extend in the y-axis in the accommodation space. .

The second reference electrode 131 and the second variable electrode 136 are formed as electrode layers extending from the elastic portions 160 and 170.

The second reference electrode 131 has the same shape as the first reference electrode 121 and is formed symmetrically.

The second reference electrode 131 includes a bar type body connecting between the third and fourth elastic portions 160 and 170 and protrudes from the long side of the body toward the dummy electrode 150b And includes a plurality of second reference electrode projections 132.

The second variable electrode 136 has the same shape as the second reference electrode 131 and is disposed symmetrically with respect to the second connection portion 190. Accordingly, the second driving electrode 130 can maintain the center of gravity in the x-axis direction.

That is, the second variable electrode 136 is formed of a bar type body connecting between the third and fourth elastic portions 160 and 170, and a plurality of the first variable electrodes 136 protruding toward the first variable electrode 126 And two variable electrode protrusions 137.

The first variable electrode protrusions 127 and the second variable electrode protrusions 137 are arranged so as to intersect with each other.

At this time, the electrode protrusions 127 and 137 of the first variable electrode 126 and the second variable electrode 136 are arranged so as to face each other in a central region of the magnetic field sensor, thereby forming a variable capacitor.

The variable capacitor includes protrusions 127 and 127 which are arranged so that the first variable electrode protrusions 127 of the first variable electrode 126 and the second variable electrode protrusions 137 of the second variable electrode 136 intersect with each other, The capacitance of the capacitor varies depending on the area of the capacitor 137. In this embodiment, a variable capacitor is implemented by a comb drive, which is a comb-shaped driver. However, the present invention is not limited to this, and various structures capable of implementing a variable capacitor, such as a structure using a facing distance difference, Lt; / RTI >

The first variable electrode protrusions 127 and the second variable electrode protrusions 137 are formed in a state where no voltage is applied to the first to fourth power supply electrodes 111, 112, 116, Lt; RTI ID = 0.0 > 30 um. ≪ / RTI >

The distance between one first variable electrode projection 127 and the adjacent second variable electrode projection 137 may be 1 탆 to 10 탆, preferably 2 탆 to 3 탆.

The second connection unit 190 is formed in the same manner as the first connection unit 180 and has a region exposed between the bodies of the second reference electrode 131 and the second variable electrode 136, (131) and the second variable electrode (136).

The second connection unit 190 physically connects the second reference electrode 131 and the second variable electrode 136 while electrically inserting the second reference electrode 131 and the second variable electrode 136.

The magnetic field sensor 100 includes a first elastic part 140 and a second elastic part 150 connecting the fixed substrate 110 and the first driving electrode 120, And a third elastic part 160 and a fourth elastic part 170 connecting the first elastic part 130 and the second elastic part 170. [

The first to fourth elastic portions 140, 150, 160, and 170 are formed of a double folded type spring.

The first to fourth elastic portions 140, 150, 160 and 170 are disposed in a small accommodating space defined by the power supply electrodes 111, 112, 116 and 117 and the sensing electrodes 113, 114, 118 and 119, .

That is, the first elastic portion 140 is disposed in a small space formed by the first power source electrode 111 and the first sensing electrode 113, and the second power source electrode 112 and the second sensing electrode 114 The second elastic part 150 is disposed in the small accommodating space formed by the second elastic part 150. [ The third elastic portion 160 is disposed in a small space formed by the third power supply electrode 116 and the third sensing electrode 118 and the fourth power supply electrode 117 and the fourth sensing electrode 119, The fourth elastic portion 170 is disposed in the small accommodating space formed by the second elastic portion 170. [

The first elastic portion 140 includes two fixing portions.

Each fixing part includes two springs and connects the first sensing electrode 114 and the first variable electrode 126 and connects the first power electrode 111 and the first reference electrode 121.

The first elastic part 140 electrically and physically connects the fixed substrate 110 and the first driving electrode 120.

The fixing part of the second elastic part 150 connects the second sensing electrode 114 and the second variable electrode 136 and connects the second power electrode 112 and the first reference electrode 121.

The fixed substrate 110 and the first driving electrode 120 are electrically and physically connected by the second elastic portion 150.

The fixing part of the third elastic part 1600 connects the third sensing electrode 118 and the second variable electrode 136 and connects the third power electrode 116 and the second reference electrode 131.

The fixed substrate 110 and the second driving electrode 130 are electrically and physically connected by the third elastic portion 160.

The fixed part of the fourth elastic part 170 connects the fourth sensing electrode 119 and the second variable electrode 136 and connects the fourth power electrode 117 and the second reference electrode 131.

And the fixed substrate 110 and the second driving electrode 130 are electrically and physically connected by the fourth elastic portion 170.

FIGS. 6 to 9 are views for explaining the manufacturing method of the magnetic sensor package shown in FIGS. 2 and 3 in the process order.

First, referring to FIG. 6, a package body 210 as a base for manufacturing the magnetic sensor package is prepared.

The package body 210 may be a support substrate, and may be formed of an insulating material, such as a multilayer ceramic (MLC), a glass substrate, a resin substrate, or a high-density silicon substrate.

A first groove 270 and a second groove 280 are formed in the prepared package body 210, respectively.

The first groove 270 and the second groove 280 may be formed by a mechanical drill or a laser.

At this time, the first groove 270 and the second groove 280 have different depths. That is, the first groove 270 has a first depth D1 and the second groove 280 has a second depth D2.

The first grooves 270 and the second grooves 280 have depths for forming the sensor structures 120 and 130 formed in the magnetic field sensor 100 and the wires 230 on the same plane.

That is, the depth of the second groove 280 may be determined by the depth of the first groove 270 and the height of the sensor structure 120, 130 formed on the magnetic sensor 100.

This has already been described in detail above, and a description thereof will be omitted.

Referring to FIG. 8, the magnetic field sensor 100 is inserted into the formed first groove 270, thereby fixing the inserted magnetic field sensor 100 in the first groove 270.

Thereafter, a conductive line 230 for embedding the formed second groove 280 is formed.

The second groove 280 is formed to extend substantially linearly to connect a plurality of conductive pads formed on the package body 210, and the conductive line 230 extends in a straight line shape And the second groove (280).

 The conductive line 230 may have a conductive metal material such as copper and may be formed by sputtering or plating.

Next, referring to FIG. 9, a protective layer 260 is formed to cover the upper portion of the package body 210.

As described above, the conductive line 230 and the sensor structures 120 and 130 are arranged on the same plane so as to be parallel to each other such that a magnetic field generated in the conductive line 230 is generated in the vertical direction of the sensor structures 120 and 130 do.

The magnetic field sensor 100 is inserted into the first groove 270 and the conductive line 230 is embedded in the second groove 280. The conductive line 230 contacts the magnetic sensor 100, The depth of the first groove 270 and the depth of the second groove 280 are determined so as to lie on the same plane as the sensor structures 120,

Accordingly, the magnetic field 290 can be generated in the vertical direction of the sensor structures 120 and 130 by the arrangement of the conductor 230 and the sensor structures 120 and 130 as described above.

According to the embodiment of the present invention, the magnetic field is generated in the vertical direction of the sensor structure by optimizing the arrangement of the conductor and the sensor structure through which the current to be measured flows, thereby minimizing the loss of the strength of the magnetic field required to generate Lorentz force .

In addition, according to the embodiment of the present invention, by making the direction of the magnetic field perpendicular to the reference current conductor of the driving electrode, it is possible to reduce the probability that the driving electrode receives the Lorentz force in a direction other than the horizontal direction, You can get the output value.

According to the embodiment of the present invention, by concentrating the Lorentz force in the horizontal direction, it is possible to maximize the amount of displacement of the driving electrode, thereby maximizing the output value and improving the resolution with respect to the same current amount and the same magnetic field intensity have.

FIG. 10 is a top view of the MEMS magnetic sensor package according to the second embodiment of the present invention, FIG. 11 is a top view of the sensor and the conductor shown in FIG. 10, Sectional view taken along line A-A 'in Fig.

10, the MEMS magnetic sensor package according to the second embodiment of the present invention includes a magnetic sensor 100, a package body 210, a wiring pad 220, a lead 430, a control device 240, (250), and a protective layer (260).

In this case, in the MEMS magnetic sensor package 400 according to the second embodiment of the present invention shown in FIG. 10, the same components as those of the MEMS magnetic sensor package according to the first embodiment shown in FIG. .

The magnetic sensor 100, the package body 210, the wiring pads 220, the control elements 240, the connecting lines 250 and the protective layer 260 constituting the MEMS magnetic field sensor package 400 are shown in FIG. 2 Is substantially the same as the components included in the MEMS magnetic sensor package 300, and thus a detailed description thereof will be omitted.

A conductor 430 is formed below the magnetic field sensor 100.

For this purpose, the package body 210 is formed with a groove into which the conductive wire 430 is inserted, and the conductive wire 430 is embedded in the formed groove.

The magnetic field sensor 100 is attached to the upper surface of the package body 210.

The conductive line 430 of the second embodiment is different from the conductive line 230 of the first embodiment in that the sensor structure 100 included in the magnetic field sensor 100, 130, respectively.

Since the conductor 430 and the sensor structures 120 and 130 are formed on different planes as described above, if the conductor 430 is formed in the same shape as the first embodiment, The magnetic field generated in the sensor structures 120 and 130 is generated in the horizontal direction, not in the vertical direction.

Accordingly, in the second embodiment of the present invention, the shape of the conductive line 430 is changed so that the magnetic field generated by the conductive line 430 is generated in the vertical direction of the sensor structures 120 and 130.

11, the lead 430 includes a first part 432 connected to one of the lead pads 220, a second part 432 extending from the first part 432, And a third part 436 extending from the second part 434 and connected to the other one of the lead pads 220. The second part 434 surrounds the first part 434,

The first part 432 and the third part 436 of the conductive line 430 are for connection with the lead pad 220. The first part 432 and the third part 436 may be connected to the lead pad 220, The shape and the position of the first and second light emitting diodes may be modified without being limited to those shown in Fig.

In the second embodiment of the present invention, a portion such as the second part 434 is included in the conductive line 430 so that a magnetic field generated by the conductive line 430 is transmitted to the sensor structures 120 and 130 To be generated in the vertical direction.

The second part 434 is formed to surround the first region R1. At this time, the first region R1 is determined around the second region where the magnetic field sensor 100 is formed.

That is, the first region R1 is located under the second region. Here, the first region (R1) is located vertically below the second region.

That is, as viewed from the top or bottom, at least a portion of the first region R1 overlaps with at least a portion of the second region.

At this time, the first region R1 may be located inside the second region when seen from the top or bottom, and conversely, the second region may be located inside the first region R1 have.

In other words, the first area R1 is overlapped with the second area, and the size of the first area R1 may be larger than the size of the second area R1, May include a 1-1 region overlapping with the second region and a 1-2 region extending from the 1-1 region and located around the vertical lower portion of the second region.

Accordingly, the magnetic field sensor 100 and the conductor 430 are formed on different planes. At this time, a part of the conductive line 430 may be formed on the same plane as the magnetic field sensor 100. That is, the first part 432 and the third part 436 of the conductor 430 may be formed on the same plane as the magnetic sensor 100. However, the second part 434 constituting the lead 430 is formed so as to surround the periphery of the first region R1 defined as above.

At this time, the second part 434 may contact the magnetic field sensor 100.

 That is, as shown in FIG. 10, the upper surface of the second part 434 may contact the lower surface of the magnetic field sensor 100. However, this is only an example, and the second part 434 may be formed in a region spaced apart from the magnetic sensor 100 by a predetermined distance in the vertical direction.

The second part 434 may have a circular shape as shown in FIG. The magnetic field sensor 100 is placed above the vertical portion of the inner region surrounded by the second part 434 having the circular shape.

The first region R1 as a reference for forming the second part 434 is preferably larger than the third region in which the sensor structures 120 and 130 are formed in the magnetic sensor 100 .

That is, the third region is included in the first region R1 so that the second portion 434 does not overlap with the lower region of the third region.

Accordingly, the magnetic field generated through the second part 434 of the conductor 430 is generated in the vertical direction of the sensor structures 120 and 130 below the sensor structures 120 and 130.

Meanwhile, the first area where the second part 434 is formed may be partially overlapped with the third area. At this time, if the second part 434 is wrapped around the first area partially overlapped with the third area, the second part 434 overlaps with the third area where the sensor structures 120 and 130 are formed As shown in Fig.

In this case, the magnetic field generated through the second part 434 may act in a direction perpendicular to the sensor structures 120 and 130.

However, the second part 434 may be formed in an area not overlapping with the first area where the magnetic field sensor 100 is formed (which includes all of the second area in the first area, And the second part 434 is formed in an area overlapping the third area (this corresponds to a case where the first area is all included in the third area, And the third region is larger than the first region), the strength of the magnetic field is lower than the condition described above.

Accordingly, the second part 434 overlaps with the first area where the magnetic sensor 100 is formed and is disposed in an area not overlapping with the third area where the sensor structures 120 and 130 are formed So that a magnetic field having a high intensity in the vertical direction of the sensor structures 120 and 130 is generated.

FIG. 13 is a top view of a MEMS magnetic sensor package according to a third embodiment of the present invention, FIG. 14 is a cross-sectional view of the MEMS magnetic sensor package of FIG. 13 taken along line A-A ' Sectional view for showing a modification example of the sensor package.

13, a MEMS magnetic sensor package according to a third embodiment of the present invention includes a magnetic sensor 100, a package body 210, a wiring pad 220, a lead 530, a control device 240, (250), and a protective layer (260).

In this case, in the MEMS magnetic sensor package 500 according to the third embodiment of the present invention shown in FIG. 13, the same configuration as that of the MEMS magnetic sensor package according to the first and second embodiments of the present invention shown in FIGS. Will be denoted by the same reference numerals.

The magnetic sensor 100, the package body 210, the wiring pads 220, the control elements 240, the connecting lines 250 and the protective layer 260 constituting the MEMS magnetic sensor package 500 are formed as shown in FIG. 2 Is substantially the same as the components included in the MEMS magnetic sensor package 300, and thus a detailed description thereof will be omitted.

A conductor 530 is formed on the top of the magnetic field sensor 100.

That is, in the second embodiment of the present invention, the conductive line 430 is formed in the lower region of the magnetic field sensor 100. However, in the third embodiment of the present invention, As shown in Fig.

A plurality of protrusions 540 and 550 are formed on the package body 210 so that the conductive wire 530 is seated on the protrusions 540 and 550, , And is disposed above the magnetic field sensor (100).

At this time, the shape of the lead 530 has the same shape as the lead 430 according to the second embodiment of the present invention as shown in FIGS. 10 and 11.

The conductive line 530 may include a first part 532 connected to one of the lead pads 220 and a second part 532 extending from the first part 532 to surround the lower region of the magnetic sensor 100. [ And a third part 536 extending from the second part 534 and connected to the other one of the lead pads 220. As shown in FIG.

The first part 532 and the third part 536 of the conductive line 530 are for connection with the conductive pad 220. The first part 532 and the third part 536 may be formed of a conductive material, The shape or the position of the first and second electrodes may be modified without being limited to those shown in Figs.

That is, as shown in FIG. 15, the lead pad 220 may be exposed to the outside of the protective layer 260, and the first part 532 and the third part 536 May be connected to the lead pad 220 and extend vertically into the passivation layer 260.

In the third embodiment of the present invention, a portion such as the second part 534 is included in the conductive line 530 so that a magnetic field generated by the conductive line 530 is applied to the sensor structures 120 and 130 To be generated in the vertical direction.

The second part 534 is formed so as to surround the periphery of the first area. At this time, the first region is determined based on a second region where the magnetic field sensor 100 is formed.

That is, a virtual first region is located above the second region. Here, the first region is located vertically above the second region.

That is, as viewed from the top or bottom, at least a portion of the first region overlaps with at least a portion of the second region.

At this time, the first region may be located inside the second region when viewed from the top or bottom, and conversely, the second region may be located inside the first region.

In other words, the first area overlaps with the second area, wherein the size of the first area may be larger than the size of the second area.

Accordingly, the magnetic field sensor 100 and the wire 530 are formed on different planes.

The first part 532 and the third part 536 of the wire 530 are seated on the protrusions 540 and 550 and the second part 534 is connected to the first part 532 The second part 534 is formed in a floating state in the upper area of the area where the magnetic field sensor 100 is formed.

The second part 534 may have a circular shape as shown in FIG.

The first region in which the second part 534 is formed may be partially overlapped with the third region in which the sensor structures 120 and 130 are formed in the magnetic field sensor 100.

In the second embodiment of the present invention, the second part 436 of the conductive line 430 is formed below the magnetic sensor 100. However, in the third embodiment of the present invention, A second part 534 of the magnetic field sensor 100 is formed above the vertical direction of the magnetic field sensor 100.

At this time, the magnetic field generated through the second part 436 in the second embodiment and the magnetic field generated through the second part 534 in the third embodiment are changed only in the vertical direction, When the sensor structures 120 and 130 of the sensor 100 are viewed as the center, they act in the vertical direction.

16 is a top view of a MEMS magnetic sensor package according to a fourth embodiment of the present invention.

16, a MEMS magnetic sensor package 600 according to a fourth embodiment of the present invention includes a magnetic sensor 100, a package body 210, a wiring pad 220, a lead 630, a control element 240 A connecting line 250, and a protective layer 260. [

In this case, in the MEMS magnetic sensor package 600 according to the fourth embodiment of the present invention shown in FIG. 16, the same components as those of the MEMS magnetic sensor package according to the second embodiment shown in FIG. .

The magnetic sensor 100, the package body 210, the wiring pads 220, the control elements 240, the connecting lines 250 and the protective layer 260 constituting the MEMS magnetic sensor package 600 are formed as shown in FIG. 10 Are substantially the same as those included in the MEMS magnetic sensor package 400, and therefore, detailed description thereof will be omitted.

The conductor 630 is formed below the magnetic field sensor 100.

For this, a groove for inserting the conductive wire 630 is formed in the package body 210, and the conductive wire 630 is embedded in the formed groove.

The magnetic field sensor 100 is attached to the upper surface of the package body 210.

The bending portion included in the lead 630 is formed so as to surround the periphery of the first region as described above. At this time, the first region is determined based on a second region where the magnetic field sensor 100 is formed. That is, the first region is located under the second region. Here, the first region is located vertically below the second region.

That is, as viewed from the top or bottom, at least a portion of the first region overlaps with at least a portion of the second region.

At this time, the first region may be located inside the second region when viewed from the top or bottom, and conversely, the second region may be located inside the first region.

The second part of the conductor 430 shown in FIG. 10 has a circular shape, but the second part of the conductor 630 according to the fourth embodiment of the present invention has a rectangular shape.

17 is a top view of a MEMS magnetic sensor package according to a fifth embodiment of the present invention.

17, a MEMS magnetic sensor package 700 according to a fifth embodiment of the present invention includes a magnetic sensor 100, a package body 210, a wiring pad 220, a lead 730, a control device 240 A connecting line 250, and a protective layer 260. [

Here, in the MEMS magnetic sensor package 700 according to the fifth embodiment of the present invention shown in FIG. 17, the same components as those of the MEMS magnetic sensor package according to the third embodiment shown in FIG. .

The magnetic sensor 100, the package body 210, the wiring pads 220, the control element 240, the connecting line 250 and the protective layer 260 constituting the MEMS magnetic field sensor package 700 are shown in FIG. 13 Is substantially the same as the components included in the MEMS magnetic sensor package 500, and thus a detailed description thereof will be omitted.

The conductive line 730 is formed on the magnetic field sensor 100.

In this case, the second part of the conductor in the third embodiment of the present invention has a rectangular shape and is formed in the upper region of the magnetic field sensor 100.

However, the second part of the conductor in the fifth embodiment of the present invention has a circular shape and is formed in the upper region of the magnetic field sensor 100.

The conductor may have a shape including at least one of a triangular shape, an elliptical shape, and a polygonal shape as well as a circular shape or a rectangular shape as shown in the figure.

According to the embodiment of the present invention, the magnetic field is generated in the vertical direction of the sensor structure by optimizing the arrangement of the conductor and the sensor structure through which the current to be measured flows, thereby minimizing the loss of the strength of the magnetic field required to generate Lorentz force .

In addition, according to the embodiment of the present invention, by making the direction of the magnetic field perpendicular to the reference current conductor of the driving electrode, it is possible to reduce the probability that the driving electrode receives the Lorentz force in a direction other than the horizontal direction, You can get the output value.

According to the embodiment of the present invention, by concentrating the Lorentz force in the horizontal direction, it is possible to maximize the amount of displacement of the driving electrode, thereby maximizing the output value and improving the resolution with respect to the same current amount and the same magnetic field intensity have.

The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: magnetic field sensor
120, 130: sensor structure
210: Package body
220: electrode pad
230, 430, 530, 630, 730:
240: Control element
250: connection line
260: protective layer

Claims (17)

A package body;
A magnetic sensor disposed on the package body and including a sensor structure in which a displacement is generated by a magnetic field; And
And a conductor formed on the package body for generating a magnetic field for displacement of the sensor structure by flowing a current to be measured,
Wherein the conductor and the sensor structure are formed of a metal,
Arranged on the same plane as each other
MEMS magnetic field sensor package. The method according to claim 1,
The lead wire
So that a magnetic field generated by the measurement subject current is generated in the vertical direction of the sensor structure
MEMS magnetic field sensor package. The method according to claim 1,
The sensor structure includes:
And is formed to float inside the body constituting the magnetic field sensor
MEMS magnetic field sensor package. The method of claim 3,
In the package body,
A first groove into which the magnetic field sensor is inserted,
And a second groove in which the lead wire is embedded,
The depths of the first groove and the second groove are different from each other
MEMS magnetic field sensor package. 5. The method of claim 4,
The second groove
Wherein the sensor structure has a shallower depth from the depth of the first groove by the floating height of the sensor structure
MEMS magnetic field sensor package. The method of claim 3,
Wherein the magnetic sensor is attached to an upper surface of the package body,
The lead wire is formed on a protrusion protruding above the upper surface of the package body
MEMS magnetic field sensor package. The method according to claim 6,
The height of the projection
Corresponding to the floating height of the sensor structure
MEMS magnetic field sensor package. The method according to claim 1,
The lead wire
And a linear shape extending in a direction parallel to the arrangement direction of the sensor structure formed in the magnetic field sensor,
MEMS magnetic field sensor package. The method according to claim 1,
The lead wire
And a linear sensor which is spaced apart from the magnetic sensor by a predetermined distance and extends in a direction perpendicular to the direction of arrangement of the sensor structures formed in the magnetic sensor
MEMS magnetic field sensor package. A package body;
A magnetic sensor disposed on the package body and including a sensor structure in which a displacement is generated by a magnetic field; And
And a conductor formed on the package body for generating a magnetic field for displacement of the sensor structure by flowing a current to be measured,
The lead wire
Generating a magnetic field applied in the vertical direction of the sensor structure
MEMS magnetic field sensor package. 11. The method of claim 10,
The lead wire
A package body formed to surround the first region formed in the package body,
Wherein the first region comprises:
And a second area on the package body, the second area being vertically below the second area on which the magnetic field sensor is formed,
MEMS magnetic field sensor package. 12. The method of claim 11,
Wherein the first region comprises:
A first overlapping region located on the package body and vertically below a third region in which the sensor structure is formed and overlapping the entire region of the third region; and a second overlapping region extending from the first overlapping region, And a second overlap region overlapping a portion of the first overlap region
MEMS magnetic field sensor package. 13. The method of claim 12,
The lead wire
Overlapping with a second region located vertically above the first region, and overlapping with the third region
MEMS magnetic field sensor package. 11. The method of claim 10,
The lead wire
A second region formed around the first region,
Wherein the first region comprises:
And a second area on the package body, the first area being vertically above a second area where the magnetic field sensor is formed,
MEMS magnetic field sensor package. 15. The method of claim 14,
Wherein the first region comprises:
A first overlapping region located on the package body and vertically above a third region in which the sensor structure is formed and overlapping with the entire region of the third region and a second overlapping region extending from the first overlapping region, And a second overlap region overlapping a portion of the first overlap region
MEMS magnetic field sensor package. 15. The method of claim 14,
The lead wire
Overlapping with a second region located below the first region in the vertical direction, and being overlapped with the third region
MEMS magnetic field sensor package. 13. A method according to any one of claims 11 and 14,
And a conductor surrounding the first region,
And has a shape including at least one bending portion of a triangular shape, a square shape, a circular shape, an elliptical shape, and a polygonal shape
MEMS magnetic field sensor package.

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