KR20150081582A - Photosensitive resist composition - Google Patents

Photosensitive resist composition Download PDF

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Publication number
KR20150081582A
KR20150081582A KR1020140001228A KR20140001228A KR20150081582A KR 20150081582 A KR20150081582 A KR 20150081582A KR 1020140001228 A KR1020140001228 A KR 1020140001228A KR 20140001228 A KR20140001228 A KR 20140001228A KR 20150081582 A KR20150081582 A KR 20150081582A
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South Korea
Prior art keywords
pattern
group
meth
photosensitive resin
acrylate
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KR1020140001228A
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Korean (ko)
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최한영
김현우
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동우 화인켐 주식회사
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Priority to KR1020140001228A priority Critical patent/KR20150081582A/en
Publication of KR20150081582A publication Critical patent/KR20150081582A/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Abstract

The present invention comprises a binder resin having a hydroxy group, a silane compound represented by the general formula (1), a photopolymerizable compound, a photopolymerization initiator and a solvent to produce a pattern with remarkably improved adhesion to a substrate, The present invention relates to a photosensitive resin composition.

Description

[0001] PHOTOSENSITIVE RESIST COMPOSITION [0002]

The present invention relates to a photosensitive resin composition capable of forming a pattern having excellent adhesion to a substrate.

The photosensitive resin is a representative functional polymer material practically used in production of various precision electronic and information industrial products and is currently being used for the production of high-tech industries, especially semiconductors and displays. Generally, a photosensitive resin means a polymer compound in which a chemical change of a molecular structure occurs within a short period of time by light irradiation, and a change in physical properties such as solubility, coloring, and curing for a specific solvent occurs. By using a photosensitive resin, fine precision processing is possible, energy and raw materials can be largely reduced as compared with a thermal reaction process, and work can be performed quickly and accurately in a small installation space, , Photocurable surface coating materials, and so on.

Among them, in the display field, the photosensitive resin composition is used for forming various photo-curing patterns such as a photoresist, an insulating film, a protective film, a color filter, a black matrix, and a column spacer. Specifically, the photosensitive resin composition is selectively exposed and developed by a photolithography process to form a desired photo-curable pattern. In order to improve the process yield in this process and improve the physical properties of the object to be applied, And adhesion and the like have been demanded.

As such a photosensitive resin composition, a composition containing a photopolymerizable compound and a photopolymerization initiator together with a binder resin is widely used. In addition, a photosensitive resin composition containing a black pigment in the formation of a black matrix is also used. As such a photosensitive composition, an acrylic resin having a carboxyl group in its side chain is used as a resin excellent in light resistance and little change in color.

If the pattern formed with such a photosensitive resin composition has poor adhesion to a substrate, problems such as peeling of the pattern occur in a subsequent step, resulting in lower product yield in the mass production process. As an alternative thereto, a photosensitive resin composition to which various silane coupling agents have been added has been proposed, but a photosensitive resin composition completely solved the problem of poor adhesion to a substrate has not yet been established.

Korean Patent Publication No. 2008-0046560 discloses a photosensitive resin composition containing a separate adhesion enhancer.

Korean Patent Publication No. 2008-0046560

It is an object of the present invention to provide a photosensitive resin composition capable of forming a pattern having excellent adhesion to a substrate.

1. A photosensitive resin composition comprising a binder resin having a hydroxy group, a silane compound represented by the following formula (1), a photopolymerizable compound, a photopolymerization initiator and a solvent:

[Chemical Formula 1]

Figure pat00001

(Wherein R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 2 is an alkylene group having 1 to 10 carbon atoms which may be interrupted by an ester group or a phenylene group, or R 1 and R 2 are connected to each other to form a carbon number of 4 RTI ID = 0.0 > aliphatic < / RTI > or aromatic ring;

R 3 is a direct bond, an alkylene group having 1 to 5 carbon atoms, or

Figure pat00002
ego;

R 7 is an alkylene group having 1 to 5 carbon atoms;

R 4 to R 6 independently represent an alkyl group having 1 to 5 carbon atoms or an alkoxy group having 1 to 5 carbon atoms, or at least one of R 4 to R 6 is an alkoxy group;

and n is an integer of 0 to 3).

2. The photosensitive resin composition according to 1 above, wherein the silane compound is at least one compound represented by any of the following formulas (2) to (5)

(2)

Figure pat00003

(3)

Figure pat00004

[Chemical Formula 4]

Figure pat00005

[Chemical Formula 5]

Figure pat00006
.

3. The photosensitive resin composition according to 1 above, wherein the silane compound is contained in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the binder resin.

4. The photosensitive resin composition according to 1 above, further comprising a colorant.

5. A photocurable pattern made from the composition of any of claims 1 to 4.

6. The photo-curable pattern as in the above item 5, which is an array planarization film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a color filter pattern, a black matrix pattern, a column spacer pattern or a black column spacer pattern.

7. An image display apparatus having the photo-curing pattern of the fifth aspect.

The photosensitive resin composition of the present invention can produce a pattern with remarkably improved adhesion to a substrate. As a result, deterioration of product yield due to pattern peeling can be suppressed.

The present invention comprises a binder resin having a hydroxy group, a silane compound represented by the general formula (1), a photopolymerizable compound, a photopolymerization initiator and a solvent to produce a pattern with remarkably improved adhesion to a substrate, The present invention relates to a photosensitive resin composition.

Hereinafter, the present invention will be described in detail.

<Photosensitive resin composition>

The photosensitive resin composition of the present invention comprises a binder resin having a hydroxy group, a silane compound represented by the general formula (1), a photopolymerizable compound, a photopolymerization initiator and a solvent.

Binder resin

The binder resin according to the present invention has a hydroxy group.

This may be included by polymerization including a monomer having a hydroxy group, or may be introduced after polymerization.

When the polymer is polymerized including a monomer having a hydroxyl group, it is polymerized including an ethylenically unsaturated monomer having a hydroxy group.

The ethylenically unsaturated monomer having a hydroxy group is not particularly limited and includes, for example, hydroxy (meth) acrylate, its caprolactone adduct or alkylene adduct, an ester of a polyhydric alcohol such as glycerin and Compounds, and glycidyl (meth) arylate acrylic acid adducts. Examples of the hydroxy (meth) acrylate include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate.

Examples of the caprolactone adducts of these include hydroxyethyl (meth) acrylate · caprolactone adduct, hydroxypropyl (meth) acrylate · caprolactone adduct, hydroxybutyl (meth) acrylate · capro Lactone adducts. These may be used alone or in combination of two or more.

Examples of the alkylene oxide adducts include hydroxyethyl (meth) acrylate / alkylene oxide adducts, hydroxypropyl (meth) acrylate / propylene oxide adducts, hydroxyethyl (meth) acrylate / Adducts. These may be used alone or in combination of two or more.

Examples of the ester compound of a polyvalent alcohol such as glycerin and (meth) acrylic acid include glycerin mono (meth) acrylate, glycerin di (meth) acrylate, pentaerythritol tri (meth) (Meth) acrylates of ethylene oxide adducts of trimethylolpropane, erythritol tri (meth) acrylate, methylol propane mono (meth) acrylate, ditrimethylol propane tri (meth) Di (meth) acrylate of propylene oxide adducts. These may be used alone or in combination of two or more.

The binder resin according to the present invention may be polymerized by further comprising at least one other monomer copolymerizable with the monomer.

Examples of other monomers copolymerizable with the ethylenically unsaturated monomer having a hydroxy group include unsaturated carboxylic acids such as (meth) acrylic acid; Unsubstituted or substituted alkyl ester compounds of unsaturated carboxylic acids such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate and aminoethyl (meth) acrylate; (Meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, methylcyclohexyl (meth) acrylate, cycloheptyl (Meth) acrylate, cyclohexenyl (meth) acrylate, cycloheptenyl (meth) acrylate, cyclooctenyl (meth) acrylate, mentadienyl (meth) acrylate, isobornyl An unsaturated carboxylic acid ester compound containing an alicyclic substituent group such as a phenanthryl (meth) acrylate, adamanthyl (meth) acrylate, norbornyl (meth) acrylate or pinenyl (meth) acrylate; Mono-saturated carboxylic acid ester compounds of glycols such as oligoethylene glycol monoalkyl (meth) acrylate, and unsaturated carboxylic acids containing substituent groups having aromatic rings such as benzyl (meth) acrylate and phenyl (meth) Ester compounds; But are not limited to, styrene, vinyltoluene, methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzylmethylether, m-vinylbenzylmethylether, Aromatic vinyl compounds such as ether, o-vinylbenzyl glycidyl ether, m-vinyl benzyl glycidyl ether and p-vinyl benzyl glycidyl ether; Carboxylic acid vinyl esters such as vinyl acetate and vinyl propionate; (Meth) acrylonitrile, and? -Chloroacrylonitrile; Maleimide compounds such as N-cyclohexylmaleimide and N-phenylmaleimide. These may be used alone or in combination of two or more.

When a hydroxy group is introduced after polymerization, a hydroxy group is introduced by an addition reaction of a polymerized copolymer containing an ethylenically unsaturated monomer having a carboxyl group and a photopolymerizable monomer having an epoxy group, or an ethylenically unsaturated monomer having an epoxy group A hydroxy group can be introduced by an addition reaction of a polymerized copolymer including a carboxyl group and a photopolymerizable monomer having a carboxyl group.

The molecular weight of the binder resin is not particularly limited and may be, for example, a weight average molecular weight in terms of polystyrene of 3,000 to 100,000, preferably 5,000 to 50,000. When the molecular weight is within the range of 3,000 to 100,000, the reduction in film thickness during development can be suppressed and the developability can be excellent.

The molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (Mn)) of the binder resin is not particularly limited and may be, for example, from 1.5 to 6.0, and preferably from 1.8 to 4.0. When the molecular weight distribution of the binder resin is within the above range, the developability can be excellent.

Silane  compound

When the photosensitive resin composition is coated on the substrate and cured to form a pattern, the silane compound moves to the substrate side while a part of the silane compound reacts with the binder resin and the remainder reacts with the polar group on the surface of the substrate, Thereby enhancing the adhesion of the polymer.

As such a silane compound, a compound having an isocyanate group as a substituent which reacts with the binder resin has been typically used. Since these compounds react with the binder resin mostly before moving to the substrate side, the amount of the silane compound reaching the substrate surface becomes insufficient , Which results in a problem that adhesion of the pattern to the base material is deteriorated.

However, the silane compound according to the present invention can sufficiently move to the substrate side, and can react with both the binder resin and the polar group of the surface of the substrate at a sufficient level, so that a pattern with remarkably improved adhesion to a substrate can be produced.

Also, the silane compound according to the present invention is easy to synthesize and has excellent binding force with the binder resin.

The silane compound according to the present invention is represented by the formula (1)

[Chemical Formula 1]

Figure pat00007

(Wherein R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 2 is an alkylene group having 1 to 10 carbon atoms which may be interrupted by an ester group or a phenylene group, or R 1 and R 2 are connected to each other to form a carbon number of 4 RTI ID = 0.0 &gt; aliphatic &lt; / RTI &gt; or aromatic ring;

R 3 is a direct bond, an alkylene group having 1 to 5 carbon atoms, or

Figure pat00008
ego;

R 7 is an alkylene group having 1 to 5 carbon atoms;

R 4 to R 6 independently represent an alkyl group having 1 to 5 carbon atoms or an alkoxy group having 1 to 5 carbon atoms, or at least one of R 4 to R 6 is an alkoxy group;

and n is an integer of 0 to 3).

R 1 and R 2 may be connected to each other, and the position of the carbon to which they are connected is not particularly limited. For example, the carbon at the end of R 1 and R 2 may be connected to each other, There may be intermediate carbon bonds.

From the viewpoint of improving the adhesion with the substrate of the formed pattern, R 4 to R 6 in the general formula (1) may be all alkoxy groups, and in view of ease of synthesis, the silane compound according to the present invention is preferably To 5. These may be used alone or in combination of two or more.

(2)

Figure pat00009

(3)

Figure pat00010

[Chemical Formula 4]

Figure pat00011

[Chemical Formula 5]

Figure pat00012
.

The content of the silane compound according to the present invention is not particularly limited within a range where the function of the silane compound is fulfilled. For example, 0.01 to 5 parts by weight, preferably 0.1 to 2 parts by weight, based on 100 parts by weight of the binder resin . When the content is less than 0.01 part by weight, the effect of improving the adhesion may be insignificant. If the content is more than 5 parts by weight, the cohesive strength is excessively increased and the adhesion may likewise be lowered.

Photopolymerization  compound

The photopolymerizable compound is a component for enhancing the strength of the pattern, and examples thereof include monofunctional, bifunctional or polyfunctional multimers, and preferably monomers having two or more functionalities. For example, a monofunctional acrylate such as nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate or N-vinylpyrrolidone Monomer; (Meth) acrylates such as 1,6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di Bifunctional monomers such as 3-methylpentanediol di (meth) acrylate or 3-methylpentanediol di (meth) acrylate; (Meth) acrylate, trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tri (Meth) acrylate, dipentaerythritol penta (meth) acrylate, ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (Meth) acrylate, and the like. These may be used alone or in combination of two or more.

The content of the photopolymerizable compound is not particularly limited and may be, for example, 10 to 50 parts by weight, preferably 20 to 40 parts by weight based on 100 parts by weight of the binder resin. When the content of the photopolymerizable compound is within the range of 10 to 50 parts by weight, the formed pattern may have good strength and smoothness.

Light curing Initiator

The photopolymerization initiator according to the present invention is not particularly limited as long as it can polymerize the photopolymerizable compound, and examples thereof include acetophenone compounds, benzophenone compounds, triazine compounds, At least one compound selected from the group consisting of an azo compound, a thiol compound, a thioxanthone compound, and an oxime ester compound may be used, and it is preferable to use an oxime ester compound.

Specific examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 2-hydroxy- 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1- (2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propane -1-one, 2- (4-methylbenzyl) -2- (dimethylamino) -1- (4-morpholinophenyl) butan-1-one.

Specific examples of the benzophenone compound include benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3 ', 4,4'-tetra (tert-butylperoxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and the like.

Specific examples of the triazine compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2,4 Bis (trichloromethyl) -6- [2- (5-methylfuran-1-yl) Yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan- Triazine, 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ethenyl] -1,3,5-triazine, 2,4- L-methylethyl) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine.

Specific examples of the imidazole-based compound include 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbimidazole, 2,2'- 4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetra (alkoxyphenyl) (2-chlorophenyl) -4,4 ', 5,5'-tetra (trialkoxyphenyl) biimidazole, 2,2-bis (2,6-dichlorophenyl) -4,4'5,5'-tetraphenyl-1,2'-biimidazole or an imidazole compound in which the phenyl group at the 4,4 ', 5,5' position is substituted by a carboalkoxy group , Preferably 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis , 4 ', 5,5'-tetraphenylbiimidazole, 2,2-bis (2,6-dichlorophenyl) -4,4'5,5'-tetraphenyl-1,2'-biimidazole .

Specific examples of the thioxanthone compound include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4- propanedioxanthone And the like.

Specific examples of the oxime ester compound include o-ethoxycarbonyl-α-oximino-1-phenylpropan-1-one, 1,2-octadione, (O-benzoyloxime), 1- (9-ethyl) -6- (2-methylbenzoyl- Irgacure OXE-01 (BASF), Irgacure OXE-02 (BASF), N-1919 (Adeca), NCI-831 (Ciba Geigy), CGI- Adeca).

The content of the photopolymerization initiator is not particularly limited and may be, for example, 0.1 to 10 parts by weight, preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the binder resin. When the content of the photopolymerization initiator is in the range of 0.1 to 10 parts by weight, the sensitivity of the photosensitive resin composition is increased and the exposure time is shortened, so that the productivity is improved and the fine structure can be maintained.

The photosensitive resin composition of the present invention may further include a photopolymerization initiation auxiliary agent to improve the sensitivity. As a result, productivity can be further improved.

Examples of the photopolymerization initiator include at least one compound selected from the group consisting of an amine compound, a carboxylic acid compound, and an organic sulfur compound having a thiol group.

Specific examples of the amine compound include aliphatic amine compounds such as triethanolamine, methyldiethanolamine and triisopropanolamine; aliphatic amines such as methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoic acid isoamyl, 2-ethylhexyl dimethylbenzoate, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4'-bis (dimethylamino) benzophenone (commonly known as Michler's ketone), 4,4'-bis (Diethylamino) benzophenone, and the like, and it is preferable to use an aromatic amine compound.

Concrete examples of the carboxylic acid compound include aromatic heteroacetic acid compounds. Phenylthioacetic acid, methylphenylthioacetic acid, methylphenylthioacetic acid, methylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine , Phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, and naphthoxyacetic acid.

Specific examples of the organic sulfur compound having a thiol group include 2-mercaptobenzothiazole, 1,4-bis (3-mercaptobutyryloxy) butane, 1,3,5-tris (3-mercaptobutyloxy Ethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -thione, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexacis 3-mercaptopropionate), tetraethylene glycol bis ((3-mercaptopropionate), etc.) .

menstruum

The solvent is not particularly limited as long as it can dissolve the above components, and examples thereof include ethers, aromatic hydrocarbons, ketones, alcohols, esters and amides. These may be used alone or in combination of two or more.

For example, ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether; Diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether Ethers such as acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate, and methoxypentyl acetate; Aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; Alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol and glycerin; And esters such as ethyl 3-ethoxypropionate, methyl 3-methoxypropionate and? -Butyrolactone. Of these, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, Ethyl lactate, butalactate, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, and the like.

The solvent is preferably an organic solvent having a boiling point of 100 占 폚 to 200 占 폚 in terms of coatability and dryness. Specific examples thereof include alkylene glycol alkyl ether acetates; Ketones; Ethoxypropionate, ethyl 3-ethoxypropionate and methyl 3-methoxypropionate. More preferred examples thereof include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, 3-ethoxy Ethyl propionate, methyl 3-methoxypropionate, and the like. These may be used alone or in combination of two or more.

The content of the solvent is not particularly limited and may be, for example, 50 to 150 parts by weight based on 100 parts by weight of the binder resin. When the content of the solvent is within the above range, the coating property may be good.

coloring agent

If necessary, the photosensitive resin composition of the present invention may further comprise a colorant, and the colorant may include a dye or a pigment.

The kind of the pigment is not particularly limited, and organic pigments or inorganic pigments generally used in the art can be used.

The above-mentioned pigments include various pigments used in printing ink, ink-jet ink and the like, and specifically include water-soluble azo pigments, insoluble azo pigments, phthalocyanine pigments, quinacridone pigments, isoindolinone pigments, isoindoline pigments , Anthanthrone pigments, indanthrone pigments, pravanthrone pigments, pyranthrone pigments (for example, pyranthrone pigments, perynone pigments, perynone pigments, perynone pigments, anthraquinone pigments, dianthraquinone pigments, anthrapyrimidine pigments, anthanthrone pigments, pyranthrone pigments, diketopyrrolopyrrole pigments, and the like. Specific examples of the inorganic pigment include oxides of metals such as iron, cobalt, aluminum, cadmium, lead, copper, titanium, magnesium, chromium, zinc and antimony, Oxide, carbon black and the like.

Particularly, the organic pigments and inorganic pigments may be compounds classified as pigments in the color index (published by The Society of Dyers and Colourists), and more specific examples thereof include pigments having a color index (CI) But are not limited to these.

C.I. Pigment Yellow 13, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 137, 138, 139, 147, 148, 150, 153, 154, 166, 173, 180 And 185;

C.I. Pigment Orange 13, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65 and 71;

C.I. Pigment Red 9, 97, 105, 122, 123, 144, 149, 166, 168, 176, 177, 180, 192, 208, 215, 216, 224, 242, 254, 255 and 264;

C.I. Pigment Violet 14, 19, 23, 29, 32, 33, 36, 37 and 38;

C.I. Pigment Blue 15 (15: 3, 15: 4, 15: 6, etc.), 21, 28, 60, 64 and 76;

C.I. Pigment Green 7, 10, 15, 25, 36, 47 and 58;

C.I. Pigment Brown 28;

C.I. Pigment Black 1 and 7 and the like.

The above-exemplified pigments may be used alone or in combination of two or more.

Further, carbon black, organic black pigment, titanium black, and black pigment mixed with red, blue and green can also be used.

The pigment may be used as a pigment dispersion having a uniform particle size distribution. An example of a method for uniformly dispersing the particle diameter of the pigment includes a method of dispersing the pigment by adding a pigment dispersant. According to this method, a pigment dispersion in which the pigment is uniformly dispersed in a solution can be obtained.

The pigment dispersant is added to maintain the deagglomeration and stability of the pigment, and any of those generally used in the art can be used without limitation. An acrylate-based dispersant (hereinafter also referred to as an &quot; acrylic dispersant &quot;) containing butyl methacrylate (BMA) or N, N-dimethylaminoethyl methacrylate (DMAEMA) may be used. Dispersing BYK-2000, DISPER BYK-2001, DISPER BYK-2070, DISPER BYK-2150 and DISPER BYK LPN-6919 are examples of commercially available acrylate dispersants. The acrylic dispersants exemplified above may be used alone or in combination of two or more.

As the pigment dispersant, other resin type pigment dispersants other than the acrylic dispersant may be used.

The dye can be used without any particular limitation as long as it has solubility in an organic solvent. Preferably, the dye has solubility in an organic solvent and is capable of securing reliability such as solubility in alkali developer, heat resistance, solvent resistance, etc. It is good to do.

Examples of the dyes include acid dyes having an acidic group such as sulfonic acid and carboxylic acid, salts of an acidic dye and a nitrogen-containing compound, sulfonamides of an acidic dye and derivatives thereof, and azo dyes, Phthalocyanine-based acid dyes and derivatives thereof can also be used.

Preferable examples of the dyes include compounds classified as dyes in the color index (published by The Society of Dyers and Colourists), and dyes described in dyeing notes (color dyeing).

Specific examples of the dye include C.I. As solvent dyes,

C.I. Yellow dyes such as Solvent Yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162, 163;

C.I. Red dyes such as Solvent Red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, 179;

C.I. Orange dyes such as solvent orange 2, 7, 11, 15, 26, 41, 45, 56, 62;

C.I. Blue dyes such as Solvent Blue 5, 35, 36, 37, 44, 45, 59, 67 and 70;

C.I. Violet dyes such as solvent violet 8, 9, 13, 14, 36, 37, 47, 49;

C.I. Green dyes such as Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35 and the like.

The above-exemplified dyes may be used alone or in combination of two or more.

additive

The colored photosensitive resin composition of the present invention may further contain at least one additive selected from the group consisting of a dispersant, another polymer compound, a curing agent, a surfactant, an adhesion promoter, an antioxidant, an ultraviolet absorber and an anti-

<Light curing pattern>

The present invention also provides an image display device having the photo-curable pattern made of the photosensitive resin composition and the photo-curable pattern.

The photocurable pattern made of the photosensitive resin composition has excellent adhesion to a base material. Accordingly, the resist pattern can be used in various patterns such as an array planarizing film, a protective film, an insulating film pattern, and the like in an image display apparatus, and can be used as a photoresist, a color filter, a black matrix, a column spacer, a black column spacer pattern, , But is not limited thereto.

The image display device having such a photo-curing pattern may include a liquid crystal display device, an OLED, a flexible display, and the like, but is not limited thereto, and all image display devices known in the art that can be applied are exemplified.

The photo-curing pattern can be produced by applying the above-mentioned photosensitive resin composition of the present invention onto a base material, and photo-curing and developing it.

The thickness of the pattern is not particularly limited and, for example, the thickness after curing is usually about 1 to 8 占 퐉.

The photocurable pattern of the present invention may be one prepared by the following exemplified method.

First, the photosensitive resin composition is coated on a substrate and then heated and dried to remove volatile components such as a solvent to obtain a smooth coated film.

After application, heating and drying (prebaking), or drying under reduced pressure, volatile components such as solvents are volatilized. Here, the heating temperature is usually 70 to 200 占 폚, preferably 80 to 130 占 폚. The thickness of the coating film after heat drying is usually about 1 to 8 mu m.

Ultraviolet rays are applied to the thus obtained coating film through a mask for forming a desired pattern. At this time, it is preferable to use an apparatus such as a mask aligner or a stepper so as to uniformly irradiate a parallel light beam onto the entire exposed portion and accurately align the mask and the substrate. When ultraviolet light is irradiated, the site irradiated with ultraviolet light is cured.

The ultraviolet rays may be g-line (wavelength: 436 nm), h-line, i-line (wavelength: 365 nm), or the like. The dose of ultraviolet rays can be appropriately selected according to need, and the present invention is not limited thereto. The desired pattern shape can be formed by dissolving the unexposed portion and developing the coated film after the hardening is brought into contact with the developing solution.

The developing method may be any of a liquid addition method, a dipping method, and a spraying method. Also, the base material may be inclined at an arbitrary angle during development. The developer is usually an aqueous solution containing an alkaline compound and a surfactant. The alkaline compound may be either an inorganic or an organic alkaline compound. Specific examples of the inorganic alkaline compound include sodium hydroxide, potassium hydroxide, disodium hydrogenphosphate, sodium dihydrogenphosphate, ammonium dihydrogenphosphate, ammonium dihydrogenphosphate, potassium dihydrogenphosphate, sodium silicate, potassium silicate, sodium carbonate, potassium carbonate , Sodium hydrogencarbonate, potassium hydrogencarbonate, sodium borate, potassium borate, and ammonia. Specific examples of the organic alkaline compound include tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, Monoisopropylamine, diisopropylamine, ethanolamine, and the like.

These inorganic and organic alkaline compounds may be used alone or in combination of two or more. The concentration of the alkaline compound in the alkali developer is preferably 0.01 to 10% by weight, and more preferably 0.03 to 5% by weight.

The surfactant in the alkali developer may be at least one selected from the group consisting of a nonionic surfactant, an anionic surfactant, and a cationic surfactant.

Specific examples of the nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene aryl ethers, polyoxyethylene alkyl aryl ethers, other polyoxyethylene derivatives, oxyethylene / oxypropylene block copolymers, sorbitan fatty acid esters, Polyoxyethylene sorbitan fatty acid esters, polyoxyethylene sorbitol fatty acid esters, glycerin fatty acid esters, polyoxyethylene fatty acid esters, and polyoxyethylene alkylamines.

Specific examples of the anionic surfactant include higher alcohol sulfuric acid ester salts such as sodium lauryl alcohol sulfate ester and sodium oleyl alcohol sulfate ester, alkylsulfates such as sodium laurylsulfate and ammonium laurylsulfate, sodium dodecylbenzenesulfonate And alkylarylsulfonic acid salts such as sodium dodecylnaphthalenesulfonate.

Specific examples of the cationic surfactant include amine salts such as stearylamine hydrochloride and lauryltrimethylammonium chloride, and quaternary ammonium salts. Each of these surfactants may be used alone or in combination of two or more.

The concentration of the surfactant in the developer is usually 0.01 to 10% by weight, preferably 0.05 to 8% by weight, more preferably 0.1 to 5% by weight. After development, it may be washed with water and, if necessary, subjected to post-baking at 150 to 230 ° C for 10 to 60 minutes.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to be illustrative of the invention and are not intended to limit the scope of the claims. It will be apparent to those skilled in the art that such variations and modifications are within the scope of the appended claims.

Manufacturing example  1. Preparation of binder resin

182 g of propylene glycol monomethyl ether acetate was introduced into a flask equipped with a stirrer, a thermometer reflux condenser, a dropping funnel and a nitrogen-introducing tube, and the atmosphere in the flask was changed to nitrogen in air. After raising the temperature to 100 캜, benzyl methacrylate 70.5 (0.10 mole) of monocyclohexyl methacrylate (FA-513M, Hitachi Chemical), and 136 g of propylene glycol monomethyl ether acetate were placed in a reactor equipped with a stirrer, And 3.6 g of azobisisobutyronitrile was added dropwise to the flask over a period of 2 hours from the dropping funnel and the mixture was further stirred at 100 ° C for 5 hours. Subsequently, the atmosphere in the flask was changed from nitrogen to air, and 30 g of glycidyl methacrylate (0.2 mol (50 mol% based on the carboxyl group of the methacrylic acid used in the present reaction)), 0.9 g of trisdimethylaminomethylphenol, And the reaction was continued at 110 DEG C for 6 hours to obtain a resin (A) having a solid acid value of 94 mgKOH / g. The weight average molecular weight in terms of polystyrene measured by GPC was 30,000 and the molecular weight distribution (Mw / Mn) was 2.1.

Manufacturing example  2. Silane coupling agent  Produce

2-1. Preparation of Silane Compound of Formula 2

[Reaction Scheme 1]

Figure pat00013

By an addition reaction of 3-Allyl-dihydro-furan-2,5-dione (TCI) with triethoxyhydro silane under Pt catalyst, A silane compound of formula (2) was prepared.

2-2. Preparation of silane compounds of formula (3)

[Reaction Scheme 2]

Figure pat00014

3a, 4,7,7a-tetrahydro-isobenzofuran-1,3-dione (TCI), triethoxyhydrosilane By the addition reaction under a Pt catalyst, a silane compound of the formula (3) was prepared.

2-3. Preparation of Silane Compound of Formula 4

[Reaction Scheme 3]

Figure pat00015

1,3-dioxo-1,3-dihydro-isobenzofuran-5-carbonyl chloride (TCI) and KBM- 803 (Shin-etsu), a silane compound of the formula (4) was prepared.

2-4. Preparation of silane compounds of formula (5)

[Reaction Scheme 4]

Figure pat00016

(2,6-dioxo-tetrahydro-pyran-3-yl) -propionic acid (3- (2,6-Dioxo-tetrahydro- The intermediate of the above reaction formula was prepared by a substitution reaction with chloride (Aldrich), and a silane compound of the formula (5) was prepared by an addition reaction of an intermediate and triethoxyhydrosilane under a Pt catalyst.

Example  And Comparative Example

A photosensitive resin composition having the composition and content shown in Table 1 below was prepared.

division Binder resin
(A) Photopolymerizable compound
(B) Photopolymerization initiator
(C) Silane compound
(D) menstruum
(E) Weight portion ingredient Weight portion Weight portion ingredient Weight portion Weight portion Example 1 100 B-1 30 2 D-1 One 100 Example 2 100 B-2 30 2 D-1 One 100 Example 3 100 B-1 30 2 D-2 One 100 Example 4 100 B-1 30 2 D-3 One 100 Example 5 100 B-1 30 2 D-4 One 100 Example 6 100 B-1 30 2 D-1 5.5 100 Comparative Example 1 100 B-1 30 2 D-5 One 100 Comparative Example 2 100 B-1 30 2 D-6 One 100 Comparative Example 3 100 B-1 30 2 - - 100 Comparative Example 4 - B-1 130 2 D-1 One 100 A: Binder resin of Production Example
B-1: dipentaerythritol hexaacrylate
B-2: Pentaerythritol tetraacrylate
C: 2-Benzyl-2-dimethylamino-1 (4-morpholinophenyl) butanone
D-1: The silane compound of Preparation Example 2-1
D-2: The silane compound of Preparation Example 2-2
D-3: The silane compound of Production Example 2-3
D-4: The silane compound of Production Example 2-4
D-5:

Figure pat00017

D-6:
Figure pat00018

E: Propylene glycol monomethyl ether acetate

Experimental Example . Evaluation of pattern adhesion

The photosensitive resin compositions of the above Examples and Comparative Examples were coated on a glass substrate using a spin coater and then prebaked on a hot plate at 90 캜 for 2 minutes to form a film. Thereafter, the coating film was irradiated with ultraviolet rays having an intensity of 30 mW / cm &lt; 2 &gt; at 365 nm for 10 seconds using a pattern mask. Thereafter, the resultant was developed with an aqueous solution of 0.5 wt% of KOH at 25 DEG C for 1 minute, and then washed with ultrapure water for 1 minute.

Then, the developed pattern was irradiated with ultraviolet rays having an intensity of 20 mW / cm &lt; 2 &gt; at 365 nm for 30 seconds and heated at 220 DEG C for 60 minutes to obtain a patterned film. Eleven lines each having a width of 1 mm and a length of 11 mm were formed on the obtained film sample to form 100 lattice cells each having a width of 1 mm and a length of 1 mm. The 3M tape was adhered to the formed cell and strongly strongly peeled once in the vertical direction, and then the 3M tape was once again adhered and pulled strongly once in the vertical direction to peel off the peel test, and the adhesion was evaluated according to the following criteria.

<Evaluation Criteria>

&Amp; cir &amp;: The number of peeled cells is 5 or less

○: The number of peeled cells is 6 to 10

DELTA: Number of peeled cells 11 to 20

X: Number of peeled cells is 21 or more

division Adhesion Example 1 ◎ Example 2 ◎ Example 3 ◎ Example 4 ◎ Example 5 ◎ Example 6 ○ Comparative Example 1 △ Comparative Example 2 △ Comparative Example 3 X Comparative Example 4 X

Referring to Table 2, it was confirmed that only a very small number of cells were peeled off from the pattern formed by the compositions of Examples 1 to 6, and the adhesion to the substrate was excellent.

However, in the pattern formed with the compositions of Comparative Examples 1 to 4, a large number of cells were peeled off and the adhesion to the substrate was remarkably decreased.

Claims (7)

1. A photosensitive resin composition comprising a binder resin having a hydroxyl group, a silane compound represented by the following formula (1), a photopolymerizable compound, a photopolymerization initiator and a solvent:
[Chemical Formula 1]
Figure pat00019

(Wherein R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 2 is an alkylene group having 1 to 10 carbon atoms which may be interrupted by an ester group or a phenylene group, or R 1 and R 2 are connected to each other to form a carbon number of 4 RTI ID = 0.0 &gt; aliphatic &lt; / RTI &gt; or aromatic ring;
R 3 is a direct bond, an alkylene group having 1 to 5 carbon atoms, or
Figure pat00020
ego;
R 7 is an alkylene group having 1 to 5 carbon atoms;
R 4 to R 6 independently represent an alkyl group having 1 to 5 carbon atoms or an alkoxy group having 1 to 5 carbon atoms, or at least one of R 4 to R 6 is an alkoxy group;
and n is an integer of 0 to 3).
The photosensitive resin composition according to claim 1, wherein the silane compound is at least one compound represented by any one of the following formulas (2) to (5)
(2)
Figure pat00021

(3)
Figure pat00022

[Chemical Formula 4]
Figure pat00023

[Chemical Formula 5]
Figure pat00024
.
The photosensitive resin composition according to claim 1, wherein the silane compound is contained in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the binder resin.
The photosensitive resin composition according to claim 1, further comprising a colorant.
A photocurable pattern made from the composition of any one of claims 1 to 4.
The photocurable pattern according to claim 5, wherein the pattern is an array planarizing film pattern, a protective film pattern, an insulating film pattern, a photoresist pattern, a color filter pattern, a black matrix pattern, a column spacer pattern or a black column spacer pattern.
The image display apparatus according to claim 5, wherein the photocurable pattern is formed on the substrate.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170082270A (en) * 2016-01-06 2017-07-14 동우 화인켐 주식회사 Photosensitive Resin Composition and Liquid Crystal Display Device Using the Same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170082270A (en) * 2016-01-06 2017-07-14 동우 화인켐 주식회사 Photosensitive Resin Composition and Liquid Crystal Display Device Using the Same

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