KR20150074716A - Apparatus of deposition and method of deposition using the same - Google Patents

Abstract

Deposition device and a deposition method using the same are disclosed. According to an aspect of the present invention, provided is a deposition device comprising: a deposition chamber having a first substrate withdrawn and introduced in a first radiation direction from a single central point and having a second substrate withdrawn and introduced in a second radiation direction from the central point; a first substrate loading part and a second substrate loading part arranged in the deposition chamber, having the first substrate and the second substrate loaded and mounted thereon respectively and rotating so that one side of the first substrate or the second substrate can be parallel to a virtual moving segment for connecting two arbitrary points on a first virtual radiation segment formed by the first radiation direction and a second virtual radiation segment formed by the second radiation direction respectively; a linear deposition source placed in the deposition chamber and emitting particles to be deposited toward the surfaces of the substrates; and a scanning part having the linear deposition source mounted thereon to be perpendicular to the moving segment and reciprocating the deposition source along the moving segment so that the particles to be deposited can be deposited on the surfaces of the substrates.

Description

[0001] The present invention relates to a deposition apparatus and a deposition method using the same,

The present invention relates to a deposition apparatus and a deposition method using the same. More particularly, the present invention relates to a method and apparatus for depositing a plurality of substrates in a single chamber, wherein during a deposition process of one substrate, a transfer process or an alignment process for another substrate is performed to reduce tact time The present invention relates to a deposition apparatus and a deposition method using the same, which can reduce the loss of deposition material generated during a transferring process or an aligning process with respect to a substrate.

Organic Luminescence Emitting Device (OLED) is a self-luminous self-luminous device that uses an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound, and does not require a backlight for applying light to a non- Therefore, a lightweight thin flat panel display device can be manufactured.

A flat panel display device using such an organic electroluminescent device has a fast response speed and a wide viewing angle, and is emerging as a next generation display device.

In particular, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

The organic electroluminescent device comprises an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer which are the remaining constituent layers except for the anode and the cathode. .

In the vacuum thermal deposition method, a substrate is transferred into a vacuum chamber, a shadow mask having a predetermined pattern is aligned on the transferred substrate, heat is applied to the crucible containing the organic material, and the organic material sublimated in the crucible is transferred onto the substrate As shown in FIG.

The vacuum thermal deposition method according to the related art has a problem that since the deposition process is performed for one substrate in one chamber, the deposition process for the substrate is interrupted during the substrate transfer process and the shadow mask align process, There is a problem in that it is increased.

In addition, there is a problem that the evaporation particles are continuously being sublimated in the crucible during the substrate transferring process and the mask aligning process, and the evaporation material is lost.

In the present invention, a plurality of substrates are subjected to a deposition process in one deposition chamber, and a transfer process for one substrate and a deposition process for another remaining substrate during the alignment process are performed to reduce tact time The present invention also provides a deposition apparatus and a deposition method using the same that can reduce the loss of deposition material occurring during a transferring process or an alignment process with respect to a substrate.

According to an aspect of the present invention, there is provided a deposition apparatus including: a deposition chamber in which a first substrate is drawn in and out from a center point in a first radiation direction, and a second substrate is drawn in and out in a second radiation direction from the center point; A virtual second radiation source disposed in the deposition chamber, the first substrate and the second substrate being loaded and seated, respectively, and a virtual second radiation source formed by the first radiation direction and a virtual second radiation source A first substrate loading part and a second substrate loading part rotated so that one side of the first substrate or the second substrate is parallel to a virtual moving line segment connecting arbitrary two points of each of the first substrate loading part and the second substrate loading part; A linear deposition source positioned within the deposition chamber and emitting deposition particles toward a surface of the substrate; And a scanning portion that is mounted so that the linear evaporation source is perpendicular to the moving line segment and reciprocates the evaporation source along the moving line segment so that the evaporation particles are deposited on the surface of the substrate .

The scanning unit may include a source support to which the evaporation source is coupled;

And a pair of scanning guides arranged in parallel with each other along the moving line segment and supporting the both ends of the source support so that the source support slides.

The deposition chamber may have a rectangular shape in which a long side of the cross section is parallel to the moving line.

The deposition apparatus may further include a partition wall positioned between the first substrate loading section and the second substrate loading section and extending inward from the inner wall of the deposition chamber.

A transfer chamber connected to the deposition chamber; The central point of rotation being centered about the transfer chamber to draw the first substrate into and out of the deposition chamber in the first radial direction and to draw the second substrate into the deposition chamber in the second radial direction, The robot arm may further include a robot arm.

According to another aspect of the present invention, there is provided a method of depositing an evaporation material using the evaporation apparatus, comprising the steps of: placing the first substrate in the first radiation direction in the first substrate loading section; Rotating the first substrate loading unit such that the first substrate loading unit is parallel to one side of the first substrate with respect to the moving line segment; Moving the evaporation source in the direction of the first substrate loading unit along the moving line segment by the scanning unit to deposit the deposition particles on the first substrate; Placing the second substrate in the second radial direction on the second substrate loading portion at the same time as depositing the deposition particles on the first substrate; Rotating the second substrate loading unit such that the second substrate loading unit is parallel to one side of the second substrate with respect to the moving line segment; And moving the evaporation source along the moving line toward the second substrate loading section by the scanning section to deposit the deposition particles on the second substrate.

The first substrate having been deposited is taken out of the deposition chamber, the new first substrate is loaded in the first radiation direction, and the first substrate is loaded into the first substrate loading section, .

The second substrate having been deposited is taken out of the deposition chamber, and a new second substrate is loaded in the second radial direction so as to be seated in the second substrate loading portion, .

According to an embodiment of the present invention, a plurality of substrates are subjected to a deposition process in one deposition chamber, and a transfer process for one substrate and a deposition process for another remaining substrate during the alignment process are performed, tact time.

In addition, it is possible to reduce the loss of the deposition material occurring during the transfer process or the alignment process with respect to the substrate.

1 is a cross-sectional view illustrating a configuration of a deposition apparatus according to an embodiment of the present invention.
2 is a longitudinal sectional view for explaining a configuration of a deposition apparatus according to an embodiment of the present invention;
3 is a flowchart of a deposition method using a deposition apparatus according to an embodiment of the present invention.
4 to 8 are flow charts of a deposition method using a deposition apparatus according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, embodiments of a deposition apparatus and a deposition method using the same according to the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals designate like or corresponding components A duplicate description thereof will be omitted.

FIG. 1 is a cross-sectional view for explaining a configuration of a deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view for explaining a configuration of a deposition apparatus according to an embodiment of the present invention.

Figures 1 and 2 illustrate an exemplary embodiment of the present invention that includes a central point 12, a robot arm 14, a deposition chamber 16, a first radiation 18, a second radiation 20, a first substrate 22, A first substrate loading unit 26, a moving line 27, a second substrate loading unit 28, a mask 29, an evaporation source 30, a scanning unit 32, a source support 34, A scanning guide 36, a transfer chamber 38, a moving block 39, and a partition wall 40 are shown.

The deposition apparatus according to the present embodiment has a structure in which the first substrate 22 is drawn in and out in a first radiation direction at one central point 12 and the second substrate 22 is irradiated in the second radiation direction at the center point 12 A deposition chamber (16) for drawing out; A first substrate (22) and a second substrate (22) are loaded and seated, respectively, disposed in the deposition chamber (16), and wherein a virtual first radiation fraction (18) A first substrate loading section (20) which is rotated so that one side is parallel to a virtual moving line segment (27) connecting arbitrary two points (P1, P2) of each imaginary second radiation section (20) (26) and a second substrate loading portion (28); A linear deposition source (30) located in the deposition chamber (16) and emitting deposition particles toward the surface of the substrate; The deposition source (30) is mounted on the moving line segment (27) so that the linear deposition source (30) is perpendicular to the moving line segment (27) And a scanning unit 32 for moving the scanning unit.

In the deposition apparatus according to the present embodiment, a deposition process is performed on a plurality of substrates in one chamber, and a transfer process or an alignment process is performed on another substrate during a deposition process of one substrate, ) Can be reduced and the loss of deposition material occurring during the transfer process or alignment process with respect to the substrate can be reduced.

The deposition chamber 16 is arranged so that the first substrate 22 is drawn in and out in a first radial direction at one central point 12 and the second substrate 22 is drawn in and out in a second radial direction at a central point 12. [ .

The deposition chamber 16 is where the deposition of the deposition particles against the substrate takes place therein, and the inside can be kept in a vacuum state by means of a vacuum pump. It is also possible that the interior is maintained at atmospheric pressure when the organic material deposition is performed at atmospheric pressure.

The first substrate 22 is drawn into or out of the deposition chamber 16 in a first radial direction at one central point 12 and the second substrate 22 is positioned at a central point 12 at an angle And is drawn into or out of the deposition chamber 16 in the second radial direction. That is, the first substrate 22 and the second substrate 22 are drawn or drawn in the deposition chamber 16 with a predetermined inclination.

In a cluster type deposition system, a substrate can be drawn into or drawn out of the deposition chamber 16 by a robot arm 14 provided in a transfer chamber 38 connected to the deposition chamber 16, Since the substrate is drawn into and out of the deposition chamber 16 in the radial direction from the center of rotation of the arm 14, the substrate can be drawn out into the deposition chamber 16 with a certain slope.

Therefore, when the first substrate 22 and the second substrate 22 are drawn into and out of the deposition chamber 16 by the robot arm 14, the rotation center of the robot arm 14 constituting the center point 12 The first substrate 22 is drawn out into the deposition chamber 16 in the first radial direction and the second substrate 22 is moved in the first radial direction relative to the rotational center of the robot arm 14 constituting the center point 12, And may be drawn into the deposition chamber 16 in a second radiation direction different from the direction of the second radiation.

The first substrate 22 and the second substrate 22 are not limited to being drawn and received in the deposition chamber 16 by the robot arm 14 but the first substrate 22 and the second substrate 22 may be provided in the deposition chamber 16, The deposition apparatus according to the present embodiment can also be applied to the case where the second substrate 22 is drawn in and out in the imaginary line direction crossing each other. For example, when the first substrate 22 and the second substrate 22 are drawn into and out of the deposition chamber 16 by the two robot arms 14, the rotation center of the robot arm 14 is moved to the above- The point 12 at which two imaginary line segments formed by the inclined directions of the first substrate 22 and the second substrate 22 do not constitute the center point 12 constitute the center point 12. [

The first substrate loading unit 26 and the second substrate loading unit 28 are loaded with the first substrate 22 and the second substrate 22 respectively and are placed in the first loading unit 26 and the second substrate loading unit 28, The first substrate 22 is moved relative to the imaginary moving line segment 27 connecting the arbitrary two points P1 and P2 of the first radial direction 18 and the imaginary second radial ray 20 formed by the second radial direction, The first substrate loading unit 26 and the second substrate loading unit 28 are rotated such that one side of the second substrate 22 and the second substrate 22 are parallel.

In the present embodiment, 'vertical', 'parallel' and the like refer to substantially vertical or parallel not only geometric vertical or parallel but also installation errors, processing errors and the like.

In this embodiment, the substrate loading units 26 and 28 are located at the upper part of the deposition chamber 16 so that the deposition particles are sprayed upward in the deposition source 30 to deposit on the substrate, The substrate is attached to the substrate loading portions 26 and 28 so as to face the lower portions of the portions 26 and 28. When the substrate is loaded on the substrate loading portions 26 and 28 and loaded, the masks 29 are disposed on the surface of the substrate in each of the substrate loading portions 26 and 28, and the substrate and the mask 29 are aligned.

Since the first substrate 22 and the second substrate 22 enter the deposition chamber 16 in different radial directions at one central point 12, the deposition is performed on the substrate by linear movement of the deposition source 30 The first substrate 22 and the second substrate 22 are rotated so that one side of the first substrate 22 and the second substrate 22 are parallel to the moving line segment 27.

The evaporation source 30 to be described later is linearly moved along the imaginary moving line segment 27 in the deposition chamber 16 and the evaporation source 30 is evaporated in the process of moving along the moving line segment 27 Thereby depositing the particles. This moving line segment 27 is formed at an arbitrary point P1 of an imaginary first radiation fraction 18 formed along the first radiation direction which is the drawing-out direction of the first substrate 22, Is defined as a line segment connecting an arbitrary point (P2) of the virtual second radiation component (20) formed along the second radiation direction which is the drawing-out direction of the first radiation component (20).

The linear deposition source 30 is located in the deposition chamber 16 and emits the deposition particles toward the surface of the substrate. Here, the deposition particles mean gaseous materials generated by vaporization or sublimation when the deposition material is heated, and may include gaseous organic materials obtained by heating organic materials.

The linear deposition source 30 sprays deposition particles toward the surface of the first substrate 22 or the second substrate 22. The evaporation source 30 is linearly formed corresponding to the width of the substrate. The evaporation sources 30 are arranged in parallel with the width of the substrate so as to be perpendicular to one side of the substrate, The deposition particles are deposited on the substrate while moving linearly. The deposition of the deposition particles on the substrate is performed by depositing the deposition particles sublimated in the crucible on the substrate by applying heat to the crucible of the deposition source 30 containing the deposition material.

A linear deposition source 30 is mounted on the scanning unit 32 so as to be perpendicular to the moving line 27 and a deposition source 30 is reciprocated along the moving line segment 27 so that the deposition particles are deposited on the surface of the substrate. . The linear evaporation source 30 is mounted so as to be perpendicular to the moving line segment 27 in correspondence with the width of the substrate and the scanning unit 32 is arranged to linearly move the evaporation source 30 along the moving line segment 27, The evaporated particles that are discharged from the evaporation source 30 in the movement process are deposited on the substrate.

The scanning unit 32 according to the present embodiment includes a source support 34 to which the evaporation source 30 is coupled and a source support 34 that is disposed in parallel with the moving line segment 27 and in which the source support 34 is slid, And a pair of scanning guides 36 for supporting both end portions of the scanning guide 34.

The scanning guides 36 are arranged in parallel with each other along the longitudinal direction of the moving line segments 27 on the inner wall of the deposition chamber 16 opposite to the substrate loading portions 26 and 28, The support rods 34 are supported at both ends of the pair of scanning guides 36 and slide along the scanning guides 36. Since the scanning guide 36 is formed linearly along the moving line 27, the conveying device for moving the evaporation source 30 can be made compact, and the movement control of the evaporation source 30 can be finely adjusted And the deposition on the substrate can be performed precisely.

 As the scanning guide 36, an LM (Linear Motion) guide can be used, and the source support 34 can be supported by the moving block 39 moved along the LM guide. Meanwhile, a LM motor (Linear Motion Motor) may be used as a driving unit for moving the source supporter 34, or a ball screw system may be applied.

1, the deposition chamber 16 according to the present embodiment may have a rectangular shape in which the long side of the cross section is in parallel with the moving line segment 27. The scanning guide 36 is formed in the lower portion of the deposition chamber 16 in parallel with the long side of the deposition chamber 16 and the linear deposition source 30 is disposed along the short side of the deposition chamber 16. [ The rectangular deposition chamber 16 can minimize the space occupied by the deposition apparatus.

The partition wall 40 is positioned between the first substrate loading part 26 and the second substrate loading part 28 and is configured to extend inward from the inner wall of the deposition chamber 16. The partition wall 40 serves to partition a space where deposition is performed on each of the first substrate 22 and the second substrate 22. The partition wall 40 may be formed by depositing the deposited particles on other substrates adjacent to each other during parasitic deposition .

FIG. 3 is a flowchart of a deposition method using a deposition apparatus according to an embodiment of the present invention, and FIGS. 4 to 8 are flowcharts of a deposition method using a deposition apparatus according to an embodiment of the present invention.

4 to 8 illustrate the deposition chamber 16, the first radiation 18, the second radiation 20, the first substrate 22, the second substrate 24, the first substrate loading portion 26 A moving line segment 27, a second substrate loading unit 28, an evaporation source 30, and a scanning guide 36 are shown.

The deposition method according to this embodiment is a method of depositing an evaporation material using the evaporation apparatus described above, wherein the first substrate loading section 26 is provided with the first substrate 22 in the first radiation direction ; Rotating the first substrate loading part (26) so as to be parallel to one side of the first substrate (22) with respect to the moving line segment (27); Moving the deposition source (30) along the moving line segment (27) toward the first substrate loading unit (26) by the scanning unit to deposit the deposition particles on the first substrate (22); Depositing the second substrate (22) in the second radial direction on the second substrate loading portion (28) at the same time as depositing the deposition particles on the first substrate (22); Rotating the second substrate loading unit (28) so as to be parallel to the one side of the second substrate (22) with respect to the moving line segment (27); And moving the evaporation source (30) along the moving line segment (27) toward the second substrate loading unit (28) by the scanning unit to deposit the evaporation particles on the second substrate (22) .

Referring to FIG. 4, the first substrate loading unit 26 is mounted on the first substrate 22 in the first radiation direction (S100). In a cluster type deposition system, the substrate may be drawn into or drawn out of the deposition chamber 16 by a robot arm provided in a transfer chamber connected to the deposition chamber 16, Since the substrate is radially drawn into and out of the deposition chamber 16, the substrate can be placed with a certain slope in the deposition chamber 16. [

In this step, when the first substrate 22 is placed on the first substrate loading portion 26, the mask is disposed on the surface of the first substrate 22, and the first substrate 22 and the mask 29 are aligned .

5, the first substrate loading unit 26 is rotated in parallel with the one side of the first substrate 22 with respect to the moving line 27 (S200). The moving line segment 27 is moved in a direction perpendicular to the arbitrary point of the imaginary first radiation 18 formed along the first radiation direction in the drawing-out direction of the first substrate 22, Is defined as a line segment that connects an arbitrary point of a virtual second radiation segment 20 formed along the second radiation direction. The deposition source 30 includes a scanning guide 36 formed along the moving line segment 27 The first substrate 22 is rotated in accordance with the rotation of the first substrate loading unit 26 so that one side of the first substrate 22 is parallel to the moving line 27, I will.

The evaporation source 30 linearly moves along the virtual moving line segment 27 in the deposition chamber 16 and the evaporation source 30 moves the evaporation source 30 along the moving line segment 27, Respectively.

6, the deposition source 30 is moved in the direction of the first substrate loading unit 26 along the moving line 27 by the scanning unit to deposit the deposition particles on the first substrate 22 (S300). The linear evaporation source 30 perpendicular to the moving line segment 27 is moved in a state in which the first substrate loading unit 26 is rotated such that one side of the first substrate 22 is parallel to the moving line segment 27, The substrate W is moved in the direction of the first substrate loading unit 26 along the scanning guide 36 formed along the line segment 27 to deposit the deposition particles on the entire substrate.

6, the second substrate 22 is seated in the second radial direction on the second substrate loading portion 28 simultaneously with the deposition of the deposition particles on the first substrate 22 S400). During the deposition process for the first substrate 22, the second substrate 22 may be seated on the second substrate loading portion 28 to reduce the tack time, and during the deposition process for the first substrate 22, The loading and alignment of the deposition material 22 can be performed to reduce the loss of the deposition material.

In this step, when the second substrate 22 is placed on the second substrate loading unit 28, the mask is disposed on the surface of the second substrate 22, and the mask is aligned with the second substrate 22.

In the present embodiment, the meaning of 'simultaneously' means not only that the time is the same, but also means that the step of depositing the substrate and the step of pulling the substrate are overlapped.

Then, as shown in FIG. 7, the second substrate loading unit 28 is rotated in parallel with the one side of the second substrate 22 with respect to the moving line 27 (S400). Since the evaporation source 30 linearly moves along the moving line 27 and performs deposition on the substrate in the same manner as the first substrate loading unit 26, the one side of the second substrate 22 is moved to the moving line segment 27, The second substrate loading unit 28 rotates the second substrate 22 in accordance with the rotation of the second substrate loading unit 28.

On the other hand, when deposition on the first substrate 22 is completed, the first substrate 22 on which organic material deposition is completed is drawn out from the deposition chamber 16 in the first radiation direction.

8, the evaporation source 30 is moved in the direction of the second substrate loading unit 28 along the moving line 27 by the scanning unit 32, and is then deposited on the second substrate 22, The particles are deposited (S500). The evaporation source 30 which has moved along the moving line 27 in the direction of the first substrate loading portion 26 to perform the vapor deposition on the first substrate 22 performs vapor deposition on the second substrate 22 And the deposited particles are deposited on the second substrate 22 in the process of moving along the moving line segment 27 by moving the movable line segment 27 in the direction of the second substrate loading unit 28 by the scanning unit .

A new first substrate 22 is seated in the first substrate loading portion 26 in a first radial direction during deposition on the second substrate 22 to align with the mask and the next deposition process Wait.

When the deposition of the second substrate 22 on the second substrate 22 is completed, the deposited second substrate 22 is drawn out from the deposition chamber 16 in the second radial direction, Is loaded into the loading section 28, aligned with the mask, and waits for the next deposition process.

According to the above-described method, the deposition process is performed on a plurality of substrates in one chamber, and the transfer process or the alignment process is performed on another substrate during the deposition process of one substrate to reduce the tact time And can reduce the loss of deposition material that occurs during the transfer process or alignment process with respect to the substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as set forth in the following claims It will be understood that the invention may be modified and varied without departing from the scope of the invention.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

12: Center point 14: Robot arm
16: deposition chamber 18: first radiation minute
20: second radiation minute 22, 24: substrate
26, 28: substrate loading section 27: moving line segment
29: mask 30: evaporation source
32: Scanning section 34: Source support
36: scanning guide 38: transfer chamber
39: Moving block 40:

Claims (8)

A deposition chamber in which a first substrate is drawn in and out in a first radial direction from one center point and a second substrate is drawn in and out in a second radial direction from the center point;
A virtual second radiation source disposed in the deposition chamber, the first substrate and the second substrate being loaded and seated, respectively, and a virtual second radiation source formed by the first radiation direction and a virtual second radiation source A first substrate loading part and a second substrate loading part rotated so that one side of the first substrate or the second substrate is parallel to a virtual moving line segment connecting arbitrary two points of each of the first substrate loading part and the second substrate loading part;
A linear deposition source positioned within the deposition chamber and emitting deposition particles toward a surface of the substrate;
Wherein the linear deposition source is mounted so that the linear deposition source is perpendicular to the moving line segment and the scanning section reciprocates the deposition source along the moving line segment so that the deposition particles are deposited on the surface of the substrate.
The method according to claim 1,
The scanning unit includes:
A source support to which the evaporation source is coupled;
And a pair of scanning guides arranged parallel to each other along the moving line segment and supporting both ends of the source support so that the source support slides.
The method according to claim 1,
Wherein the deposition chamber comprises:
And the long side of the cross section is in a rectangular shape parallel to the moving line.
The method according to claim 1,
And a partition wall positioned between the first substrate loading portion and the second substrate loading portion and extending inward from the inner wall of the deposition chamber.
The method according to claim 1,
A transfer chamber connected to the deposition chamber;
The central point of rotation being centered about the transfer chamber to draw the first substrate into and out of the deposition chamber in the first radial direction and to draw the second substrate into the deposition chamber in the second radial direction, And a robot arm which is connected to the robot arm.
A method of depositing an evaporation material using the evaporation apparatus according to claim 1,
Placing the first substrate in the first radial direction on the first substrate loading portion;
Rotating the first substrate loading unit such that the first substrate loading unit is parallel to one side of the first substrate with respect to the moving line segment;
Moving the evaporation source in the direction of the first substrate loading unit along the moving line segment by the scanning unit to deposit the deposition particles on the first substrate;
Placing the second substrate in the second radial direction on the second substrate loading portion at the same time as depositing the deposition particles on the first substrate;
Rotating the second substrate loading unit such that the second substrate loading unit is parallel to one side of the second substrate with respect to the moving line segment;
And moving the evaporation source along the moving line toward the second substrate loading unit by the scanning unit to deposit the deposition particles on the second substrate.
The method according to claim 6,
After depositing the deposition particles on the first substrate,
Further comprising the steps of: withdrawing the deposited first substrate from the deposition chamber and loading a new first substrate in the first radial direction to seat the first substrate on the first substrate loading portion.
The method according to claim 6,
After depositing the deposition particles on the second substrate,
Withdrawing the deposited second substrate from the deposition chamber, and loading a new second substrate in the second radial direction to seat the second substrate on the second substrate loading portion.

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