KR20150070571A - Alignment Device and Method thereof - Google Patents

Abstract

An alignment device includes a stage having an absorption hole; a push part which is formed on the side of the stage and aligns a mask and a substrate; a pressure part which is formed on the side of the stage and pressurizes the mask; a magnetic plate which is separated from the upper part of the stage; a sensing part which measures the alignment state of the mask and the substrate; and a control part which controls the push part, the pressure part, the magnetic plate, and the sensing part and aligns the mask and the substrate. The magnetic plate attaches the mask to the substrate.

Description

≪ Desc / Clms Page number 1 > Alignment Device and Method thereof &

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alignment apparatus and an alignment method, and more particularly, to an alignment apparatus and alignment method capable of more precisely aligning a thin metal mask and a flexible substrate.

In general, a flat panel display such as a liquid crystal display or an organic light emitting display includes a plurality of pairs of electric field generating electrodes and an electro-optical active layer interposed therebetween. The liquid crystal display device includes a liquid crystal layer as an electro-optical active layer, and the organic light emitting display includes an organic light emitting layer as an electro-optical active layer.

One of the pair of electric field generating electrodes is usually connected to a switching element to receive an electric signal, and the electro-optic active layer converts the electric signal into an optical signal to display an image.

Such a flat panel display requires alignment of a precise metal mask because electrodes made of metal are formed on the transparent glass substrate by tens to hundreds of micrometers (占 퐉).

A thin metal mask of about 50 mu m in the form of a coil is generally arranged and fixed in a frame for a metal mask. When a thin metal mask is arranged and aligned in the frame for metal mask having magnetism, a deformation of a pattern provided inside the thin metal mask and a distortion of the metal mask occur.

When the metal mask is aligned as described above, the precision of a pattern formed by tens to several hundreds of micrometers (m) on the glass substrate is reduced, and malfunction may occur when driving the flat panel display device.

One embodiment of the present invention seeks to provide an alignment apparatus and an alignment method. To this end, one example of the present invention is to propose a sorting device and a sorting method capable of precisely aligning a thin metal mask and a substrate.

One embodiment of the present invention relates to a method of manufacturing a semiconductor device, comprising: a stage having a suction hole; A push portion provided on a side surface of the stage to align the mask and the substrate; A pressing part provided on a side surface of the stage to press the mask; A magnetic plate spaced apart from the upper portion of the stage; A sensing unit for measuring an alignment state of the mask and the substrate; And a controller for controlling the push portion, the pressing portion, the magnetic plate, and the sensing portion to align the mask and the substrate, wherein the magnetic plate provides an alignment device for bringing the mask and the substrate into close contact with each other.

According to an embodiment of the present invention, the mask may have a thickness of 10 [mu] m to 50 [mu] m.

According to an embodiment of the present invention, the apparatus may further include a blower connected to the suction hole.

According to an embodiment of the present invention, the stage may further include a fixing portion for fixing the mask and the substrate.

According to an embodiment of the present invention, the push portion includes a push hand for pressing the mask and the substrate; And a driving unit for reciprocating the push hand.

According to an embodiment of the present invention, the squeezing unit may be a columnar sort roll.

According to one embodiment of the present invention, the magnetic plate can bring the mask into close contact with the substrate by providing a uniform magnetic force to the mask after the mask and the substrate are aligned.

According to an embodiment of the present invention, the magnetic plate may be provided on the stage so as to be movable up and down.

According to an embodiment of the present invention, the magnetic plate includes: a base plate; A plurality of magnets disposed on the base plate; And a metal sheet disposed on the magnet.

According to an embodiment of the present invention, the mask has a first alignment mark, and the substrate may have a second alignment mark.

According to an embodiment of the present invention, the sensing unit may include a camera for photographing the first alignment mark and the second alignment mark.

One embodiment of the present invention is a method of manufacturing a semiconductor device, comprising: a first carrying-in step of placing a mask on a stage; A pressing step of spreading the mask on the stage; A first aligning step of aligning the expanded mask; An adsorption step of adsorbing the aligned mask on the stage; A second carrying-in step of placing the substrate on the mask; A second alignment step of aligning the substrate so as to conform to the mask; A third carrying-in step of disposing the magnetic plate on the aligned mask and the substrate; A third aligning step of aligning the magnetic plate so as to conform to the substrate; And a cementing step of bringing the magnetic plate into contact with the substrate to closely contact the mask and the substrate.

According to an embodiment of the present invention, the mask may have a thickness of 10 [mu] m to 50 [mu] m.

According to an embodiment of the present invention, the second alignment step may include: photographing a first alignment mark provided on the mask and a second alignment mark provided on the substrate; And determining whether the first alignment mark provided on the mask and the second alignment mark provided on the substrate match with each other.

The alignment apparatus and the alignment method according to an embodiment of the present invention do not need to fabricate a frame for a metal mask suitable for each metal mask, thereby reducing the cost. Since the metal mask is not subjected to tensile welding to the metal mask frame, the process time is shortened. Since the substrate and the metal mask are bonded and transported by the magnetic plate, the accuracy of the pattern is improved. The alignment of the substrate and the mask outside the vacuum chamber containing the deposition facility is followed by the substrate and mask aligned to the deposition facility, thus reducing the cost of manufacturing the deposition facility.

1 is a perspective view schematically showing an alignment apparatus according to an embodiment of the present invention.
2 is a plan view schematically illustrating a magnetic plate according to an embodiment of the present invention.
3 is a cross-sectional view of a magnetic plate according to an embodiment of the present invention.
4A to 4H are perspective views illustrating an alignment method by the alignment apparatus of FIG.
5 is a cross-sectional view showing a state in which the mask, the substrate, and the magnetic plate are separated.
6 is a cross-sectional view showing a state where a mask, a substrate, and a magnetic plate are combined.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Thus, in some embodiments, well known process steps, well known device structures, and well-known techniques are not specifically described to avoid an undesirable interpretation of the present invention. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

An alignment apparatus according to an embodiment of the present invention may align a mask, a substrate, and a magnetic plate. The alignment apparatus of the present invention is not limited to the mask, the substrate, and the magnetic plate, and can perform the alignment operation if the object has a large area in the form of a film. Hereinafter, the case where the alignment apparatus aligns the mask and the substrate will be described.

First, the structure of the alignment apparatus will be described with reference to FIGS. 1 to 3. FIG.

1 is a perspective view schematically showing an alignment apparatus according to an embodiment of the present invention. 2 is a plan view schematically illustrating a magnetic plate according to an embodiment of the present invention. 3 is a cross-sectional view of a magnetic plate according to an embodiment of the present invention.

Before describing the structure of the alignment device 10, the substrate 30 and the mask 20 will be described as follows.

A substrate 30 is a substrate for forming an organic light emitting display (not shown) as an example of a flat panel display device. A first electrode functioning as an anode electrode is formed on the substrate 30 though not shown in FIG. 1, An organic light emitting layer is formed on the first electrode and a second electrode is formed on the organic light emitting layer to function as a cathode electrode.

The first electrode may be formed to have a predetermined pattern on the substrate 30 by vacuum deposition or sputtering. The second electrode may be formed in a predetermined pattern by forming the first electrode and the organic light emitting layer, . The organic light emitting layer may be formed by vapor deposition, spin coating, inkjet printing, or the like. The organic light emitting layer preferably has a multilayer structure including at least a light emitting layer. For example, an electron transfer layer (ETL) may be disposed between the second electrode and the organic light emitting layer, A hole transport layer (HTL) may be disposed between the first electrode and the organic light emitting layer, and a hole injection layer (HIL) may be disposed between the first electrode and the hole transport layer, An electron injection layer (EIL) may be disposed between the second electrode and the electron transport layer, and holes and electrons can be transported more smoothly into the organic emission layer due to the multi-layer structure.

Meanwhile, the organic light emitting display device having the above-described structure may be a passive matrix type, an active matrix type, or the like. In the case of an active driving type organic light emitting display, a plurality of thin film transistors for controlling the emission of the organic light emitting layer are formed on the substrate 30. [

 In the process of manufacturing the organic light emitting display having such a structure, in the process of adopting the deposition method, a mask 20 having an open region formed corresponding to each pattern is used for forming electrodes and organic light emitting layers of a predetermined pattern. Therefore, accurate alignment of the mask 20 and the substrate 30 is required to form a precise fine pattern.

Meanwhile, the mask 20 used in the present invention may be a thin metal mask having a thickness of 10 mu m to 50 mu m. Of course, various types of masks 20 can be aligned without being limited to the above example.

1 to 3, an alignment apparatus 10 according to an embodiment of the present invention includes a stage 100, a push unit 200, a press unit 300, a magnetic plate 400, a sensing unit 500 And a fixing portion 600.

The areas of the stage 100, the mask 20, the substrate 30, and the magnetic plate 400 are compared as follows. For example, the area of the stage 100, the mask 20, and the substrate 30 are large in this order. The magnetic plate 400 may be the same or smaller than the substrate 30. That is, the mask 20 is formed to have an area to be included in the stage 100, and the substrate 30 and the magnetic plate 400 are formed to be smaller than the mask 20.

Meanwhile, the core alignment target of the alignment apparatus 10 of the present invention is the mask 20 and the substrate 30 as described above. Therefore, basically, the alignment mark is formed only on the mask 20 and the substrate 30. [ However, the alignment device 10 of the present invention may also be provided with an alignment mark on the stage 100 and the magnetic plate 400 for a more precise alignment operation. The following description will be made on the assumption that the stage 100, the mask 20, the substrate 30, and the magnetic plate 400 each contain an alignment mark. Of course, the aligning operation of the stage 100 and the mask 20 and the aligning operation of the substrate 30 and the magnetic plate 400 can be performed without the movement of the push portion 200 or without the alignment mark.

A mask 20 and a substrate 30 are disposed on the stage 100. [ The stage 100 is formed larger than the mask 20, the substrate 30, and the magnetic plate 400.

The stage 100 includes a suction hole 110 and a third alignment mark 120. The stage 100 is connected to a blower 130 that sucks or supplies air through the suction hole 110. [ The blower 130 sucks or supplies air through the suction hole 110, so that the mask 20 is attracted to or separated from the stage 100. The stage 100 may further include a driving unit (not shown) for driving the blower 130 therein. The blower 130 and the driving unit are electrically connected to the controller 700.

The suction holes 110 are formed on at least one surface of the stage 100 on which the mask 20 is disposed. The blower 130 forms a negative pressure for sucking air through a suction hole 110 and a flow path (not shown) formed inside the stage 100 to fix the mask 20 to the stage 100. Accordingly, the mask 20 is attracted and fixed to the stage 100 due to the negative pressure formed by the blower 130.

The push portion 200 is provided on the side surface of the stage 100. The push portion 200 may be provided on both sides of the stage 100 in the up, down, left, and right directions, and is provided on at least two sides of the stage 100. The push portion 200 pushes the mask 20, the substrate 30, and the magnetic plate 400 disposed on the stage 100 to the center of the stage 100. The push portion 200 may be provided to slide in a direction parallel to the stage 100 and a surface contacting the mask 20, the substrate 30 and the magnetic plate 400 may be provided on the mask 20, (Not shown) may be formed to stably push the magnetic plate 400 and the magnetic plate 400.

On the other hand, the push portion 200 aligns the substrate 30 away from the mask 20. The aligned substrate 30 is seated on the mask 20 as is in the aligned position. Further, the push portion 200 aligns the magnetic plate 400 with the substrate 30 by a predetermined distance. The aligned magnetic plates 400 are seated on the substrate 30 as they are in the aligned position. The reason for spacing alignment is to prevent damage due to frictional force between the mask 20 and the substrate 30 or between the substrate 30 and the magnetic plate 400.

For example, the push portion 200 includes a push hand 210, a transfer bar 220, and a push drive portion 230. The push hand 210 has a flat contact surface to move and align the mask 20, the substrate 30, and the magnetic plate 400 disposed on the stage 100. The push driver 230 reciprocates the push hand 210. The push hand 210 reciprocates by receiving the driving force from the push driving unit 230 by the transmission bar 220 connected to the push driving unit 230. The push drive unit 230 reciprocates the push hand 210 back and forth by hydraulic pressure or pneumatic pressure. Of course, the push driving unit 230 can reciprocate the push hand 210 by a drive mechanism other than the hydraulic pressure and the pneumatic pressure. The push driver 230 is electrically connected to the controller 700.

The configuration of the push portion 200 is not limited to the above-described example, and can be variously modified to a known configuration that can be easily practiced by those skilled in the art.

Although not shown in the drawing, the stage 100 may further include a guide portion. The guide portion is located at a position corresponding to one side of the mask 20, the substrate 30 or the magnetic plate 400 with the mask 20, the substrate 30 or the magnetic plate 400 being disposed on the stage 100 As shown in FIG. That is, the guide unit guides the mask 20, the substrate 30, or the magnetic plate 400 to the center of the stage 100 by the push portion 200. The push portion 200 may not be disposed on any one of the four sides of the stage 100 when the guide portion is formed. That is, the guide portion can be formed on either side of the stage 100 where the push portion 200 is not disposed.

The pressing part 300 is provided on the side surface of the stage 100 to press the mask 20 thereon. For example, the crimping portion 300 may have the shape of an alignment roll in the shape of a cylinder. The pressing portion 300 presses the mask so that the mask 20 is not moved on the stage 100. [ That is, the crimping portion 300 prevents the mask 20 from being placed in a folded state on the stage 300, thereby preventing the mask 20 from being damaged. The crimping portion 300 should not cause damage to the mask 20 when it is in direct contact with the mask 20. [ Therefore, the outer surface of the crimping portion 300 may be made of a soft and flexible material such as sponge or silicone. The crimping portion 300 is electrically connected to the control portion 700.

The pressing part 300 is disposed on one of the side surfaces of the stage 100 and rises to the upper surface of the stage 100 during the pressing process of the mask 20 to press the mask 20 thereon.

The configuration of the pressing portion 300 is not limited to the above-described example, and can be variously modified to a well-known configuration that can be easily practiced by those skilled in the art.

The magnetic plate 400 is disposed opposite to the upper portion of the stage 100. The magnetic plate 400 is provided on the stage 100 so as to be movable up and down. Although not shown in FIG. 1, a conveying means for moving the magnetic plate 400 up and down can be provided on the side of the stage 100. The magnetic plate 400 is electrically connected to the control unit 700. The magnetic plate 400 brings the mask 20 and the substrate 30 into close contact with each other.

2 and 3, the magnetic plate 400 includes a base plate 410, a magnet 420, a metal sheet 430, and a fourth alignment mark 440.

The base plate 410 may be any metal that can be magnetized by a magnetic force so that a plurality of magnets 420 can be attached by magnetic force. For example, the base plate 410 may be a structure in which iron (Fe) is plated with nickel (Ni).

The magnet 420 is made of neodymium or the like to provide a magnetic force to the mask 20. The plurality of magnets 420 may be attached to the base plate 410 in such a manner that N poles and S poles are alternately arranged toward the mask 20 and only N poles (or S poles) To the base plate 410 in a direction facing the base plate 410.

In addition, in order to fix the magnet 420 to the base plate 410, grooves (not shown) in the form of permanent magnets 420 are provided on the lower surface of the base plate 410 in a constant arrangement, The magnet 420 can be received in the groove (not shown).

When the N poles and the S poles are alternately arranged as shown in FIG. 2, the magnets 420 may be attached to the base plate 410 without any other fixing means by the attraction of each other. However, even if the N pole and the S pole are arranged alternately, it is necessary to arrange the magnet 420 with a separate fastener and an adhesive as described above, To the base plate (410).

The plurality of magnets 420 are provided on the magnetic plate 400 so that the magnetic force can be provided to the mask 20 despite the deflection of the substrate 30 along the large area substrate 30. [ Since the magnetic plate 400 arranges and uses a plurality of magnets 420 of a smaller size, it is possible to adjust the size, the number and the arrangement method of the magnets 420 attached to the base plate 410, ) The total magnetic force can be adjusted by the required magnetic force. The magnitude of the magnetic force by the plurality of magnets 420 is sufficient to provide the magnetic force to the mask 20 despite the deflection of the center portion of the large-area substrate 30 so that the mask 20 is in close contact with the substrate 30 Do. This feature can prevent problems that may occur when the magnetic force of the magnetic plate 400 exceeds or falls below the required size range.

The metal sheet 430 is attached to the lower surface (the surface facing the mask) of the plurality of magnets 420 for the uniformity of the magnetic force by the plurality of magnets 420. For example, the metal sheet 430 includes a nickel sheet. The nickel sheet has a strong magnetization performance so that the uniform magnetic force is uniformized by the size, arrangement state, etc. of each of the plurality of magnets. Further, the nickel sheet may be used to adjust the strength of the magnetic force. For example, the strength of the magnetic force may be adjusted by using a plurality of nickel sheets having a predetermined thickness.

The configuration of the magnetic plate 400 is not limited to the above-described example, and can be variously modified to a well-known configuration that can be easily practiced by those skilled in the art.

The sensing unit 500 measures the alignment state of the mask 20 and the substrate 30. The sensing unit 500 includes a CCD (Charge-Coupled Dice) camera (not shown). The confirmation of the alignment of the mask 20, the substrate 30 and the magnetic plate 400 is performed by the third alignment mark 120 of the stage 100, the first alignment mark 21 of the mask 20, 30 and the fourth alignment marks 440 of the magnetic plate 400. In this case, The alignment state of the mask 20, the substrate 30, and the magnetic plate 400 measured by the sensing unit 500 is converted into data and transferred to the controller 700.

Meanwhile, another example of the sensing unit 500 includes a laser diode (not shown) and a CCD camera (not shown).

A laser diode (not shown) irradiates a laser beam to a predetermined region around a position where the alignment marks 21, 31, 120 and 440 are formed, and a camera (not shown) irradiates the mask 20, And detects the reflected laser beam from the light source 400. The sensing unit 500 processes the signal detected by the camera according to a set program to determine whether the mask 20, the substrate 30, and the magnetic plate 400 are aligned.

The configuration of the sensing unit 500 is not limited to the above-described example, and can be variously modified to a well-known configuration that can be easily practiced by those skilled in the art.

The fixing portion 600 fixes the mask 20 and the substrate 30. The fixing portion 600 may be disposed on at least one of the four corners of the stage 100. For example, the fixing portion 600 may have a clamp shape. During alignment of the mask 20 and the substrate 30, the fixing portion 600 can be avoided and disposed on one side of the stage 100, and after alignment of the mask 20 and the substrate 30 is completed, The portion 600 can press and fix the mask 20 or a portion of the substrate 30. [

The configuration of the fixing unit 600 is not limited to the above-described example, and can be variously modified to a known configuration that can be easily practiced by those skilled in the art.

The control unit 700 controls the push unit 200, the pressing unit 300, the magnetic plate 400, and the sensing unit 500 by a set program. For example, the control unit 700 transmits a driving signal based on the initially set alignment value to the push driving unit 230 to control the alignment of the mask 20, the substrate 30, and the magnetic plate 400.

The control unit 700 transmits a new driving signal to the push driving unit 230 according to the alignment state of the mask 20, the substrate 30 and the magnetic plate 400 measured by the sensing unit 500. The push portion 200 rearranges the mask 20, the substrate 30, and the magnetic plate 400 in accordance with the new drive signal.

In the following, a method of aligning the mask 20 and the substrate 30 using the alignment apparatus of the present invention will be described. The operation of the following components is controlled by the control unit 700.

4A to 4H are views showing an alignment method by the alignment apparatus of FIG.

Referring to FIG. 4A, a vacuum chuck 40 disposes the mask 20 on the stage 100. The vacuum chuck 40 fixes the mask 20 using a vacuum hole 41 provided in a plurality of guide portions 42 having a line shape. The vacuum chuck 40 receives the driving force by the vacuum chuck driving unit 43 and moves the mask 20.

Referring to FIG. 4B, the pressing portion 300 presses the mask 20 disposed on the stage 100. The crimping portion 300 evenly spreads the mask 20 such that there is no space between the stage 100 and the mask 20. [ The pressing portion 300 can move along the arrow direction and move smoothly so that the mask 20 is not torn.

Referring to FIG. 4C, the mask 20 is aligned with the center of the stage 100 using the push portion 200 and the sensing portion 500. The push portion 200 moves in the direction of the arrow in the four sides of the stage 100 so that the mask 20 is aligned. The sensing unit 500 measures whether the third alignment mark 120 of the stage 100 and the first alignment mark 21 of the mask 20 coincide with each other. The measured result is transmitted to the control unit 700, and the control unit 700 determines whether or not it is aligned. When the third alignment mark 120 and the first alignment mark 21 are aligned, the alignment operation of the push portion 200 is completed. If the control unit 700 determines that the mask 20 is out of the stage 100, the controller 700 transmits a new driving signal to the push unit 200. The push portion 200 rearranges the mask 20 by the transferred new driving signal. When the alignment operation is completed, the mask 20 is brought into close contact with the stage 100 through the suction hole 110 provided in the stage 100. [

Referring to FIG. 4D, the vacuum chuck 40 places the substrate 30 on the mask 20. The vacuum chuck 40 fixes the substrate 30 using a vacuum hole 41 provided in a plurality of guide portions 42 having a line shape. The vacuum chuck 40 receives the driving force by the vacuum chuck driving unit 43 and moves the substrate 30. The fixing unit 600 fixes the mask 20 at the four corners of the stage 100 so that alignment of the mask 20 is not shifted during the process of moving the substrate 30. [

Referring to FIG. 4E, the mask 20 and the substrate 30 are aligned using the push portion 200 and the sensing portion 500. As described above, the substrate 30 is spaced apart from the mask 20 by a predetermined distance during the alignment operation. The push portion 200 moves in the direction of the arrow at the four sides of the stage 100 so that the mask 20 and the substrate 30 align with each other. The sensing unit 500 measures whether or not the first alignment mark 21 of the mask 20 and the second alignment mark 31 of the substrate 30 coincide with each other. The measured result is transmitted to the control unit 700, and the control unit 700 determines whether or not it is aligned. When the first alignment mark 21 and the second alignment mark 31 are aligned, the alignment operation of the push portion 200 is completed. If the control unit 700 determines that the substrate 30 and the mask 20 are misaligned with each other, the controller 700 transmits a new driving signal to the push unit 200. The push portion 200 rearranges the substrate 30 by the transferred new driving signal. Then, the substrate 30 is lowered and brought into close contact with the mask 20.

Referring to FIG. 4F, the magnetic plate 400 disposed on the stage 100 is lowered toward the substrate 300 by using the elevating means (not shown). The fixing portion 600 fixes the mask 20 and the substrate 30 at the four corners of the stage 100 so that alignment of the mask 20 and the substrate 30 is not shifted during the movement of the magnetic plate 400 .

Referring to FIG. 4G, the substrate 30 and the magnetic plate 400 are aligned using the push portion 200 and the sensing portion 500. As described above, the magnetic plate 400 is spaced apart from the substrate 30 by a predetermined distance during the aligning operation. The push portion 200 moves in the direction of the arrow at the four sides of the stage 100 so that the substrate 30 and the magnetic plate 400 are aligned with each other. The sensing unit 500 measures whether or not the second alignment mark 31 of the substrate 30 and the fourth alignment mark 440 of the magnetic plate 400 coincide with each other. The measured result is transmitted to the control unit 700, and the control unit 700 determines whether or not it is aligned. When the second alignment mark 31 and the fourth alignment mark 440 are aligned, the alignment operation of the push portion 200 is completed. If the controller 700 determines that the magnetic plate 400 and the substrate 30 are displaced from each other, the controller 700 transmits a new driving signal to the pusher 200. The push portion 200 realigns the magnetic plate 400 by the transferred new driving signal. The magnetic plate 400 is immediately lowered and brought into close contact with the substrate 30.

Referring to FIG. 4H, the substrate 30 brought into close contact with the mask 20 by the magnetic force between the magnetic plate 400 and the mask 20 is lifted by the lifting means (not shown). The substrate 30 aligned with the mask 20 is adhered to the magnetic plate 400 and moved to the high vacuum deposition chamber. Various patterns are formed by the mask 20.

As described above, the alignment apparatus and the alignment method of the present invention can precisely align the mask 20 and the substrate 30 without a frame structure for fixing the mask 20.

In the following, the combination of the above components around the mask 20, the substrate 30, and the magnetic plate 400 will be described with reference to Figs. 5 and 6. Fig.

5 is a view showing a state in which the mask, the substrate, and the magnetic plate are separated. 6 is a cross-sectional view showing a state where a mask, a substrate, and a magnetic plate are combined.

1, 5 and 6, a substrate 30 is disposed on a mask 20 using a transfer means (not shown). Alignment between the substrate 30 and the mask 20 is performed using the alignment marks displayed on the substrate 30 and the mask 20. The magnetic plate 400 is lowered on the aligned substrate 30 and the mask 20 and is brought into close contact with the substrate 30. The base plate 410 is a plate-like plate having a flatness of a certain level or higher and serves as a reference plane for planarization of the substrate 30 where sagging occurs. A magnetic plate (400) adhered to the substrate (30) provides magnetic force to the mask (20). The mask 20 is pulled toward the magnetic plate 400 by the magnetic force of the magnetic plate 400 and is brought into complete contact with the substrate 30. In this process, the substrate 30 is spread by the base plate 410 to compensate deflection, and the close contact of the mask 20 and the substrate 30 is completed. Accordingly, the magnetic plate 400 provides a magnetic force enough to cover the deflection of the large-area substrate 30 with the mask 20, and at the same time corrects deflection of the substrate by the magnetic force.

The embodiments of the alignment apparatus and the alignment method described above are merely illustrative, and the scope of protection of the present invention may include various modifications and equivalents to those skilled in the art.

10: alignment device 20: mask
21: first alignment mark 30: substrate
31: 2nd alignment mark 40: vacuum chuck
41: vacuum hole 42: guide portion
43: vacuum chuck driving part 100: stage
110: suction hole 120: third alignment mark
130: blower 200: push part
210: push hand 220: transfer bar
230: push drive unit 300:
400: magnetic plate 410: base plate
420: magnet 430: metal sheet
440: fourth alignment mark 500: sensing part
600: Fixing part 700: Control part

Claims (14)

A stage having a suction hole;
A push portion provided on a side surface of the stage to align the mask and the substrate;
A pressing part provided on a side surface of the stage to press the mask;
A magnetic plate spaced apart from the upper portion of the stage;
A sensing unit for measuring an alignment state of the mask and the substrate; And
And a controller for controlling the push portion, the pressing portion, the magnetic plate, and the sensing portion to align the mask and the substrate,
Wherein the magnetic plate closely contacts the mask and the substrate. The method according to claim 1,
Wherein the mask has a thickness of 10 [mu] m to 50 [mu] m. The method according to claim 1,
And a blower connected to the suction hole. The method according to claim 1,
Wherein the stage further comprises a fixing portion for fixing the mask and the substrate. The method according to claim 1,
The push-
A push hand for pressing the mask and the substrate; And
And a driving unit for reciprocating the push hand. The method according to claim 1,
Wherein the pressing portion is a cylindrical roll. The method according to claim 1,
Wherein the magnetic plate closely contacts the mask by providing a uniform magnetic force to the mask after the mask and the substrate are aligned. The method according to claim 1,
Wherein the magnetic plate is provided on the stage so as to be able to move up and down. The method according to claim 1,
The magnetic plate may include:
A base plate;
A plurality of magnets disposed on the base plate; And
And a metal sheet disposed on the magnet. The method according to claim 1,
The mask having a first alignment mark,
Wherein the substrate has a second alignment mark. 11. The method of claim 10,
And the sensing unit includes a camera for photographing the first alignment mark and the second alignment mark. A first carrying-in step of placing a mask on a stage;
A pressing step of spreading the mask on the stage;
A first aligning step of aligning the expanded mask;
An adsorption step of adsorbing the aligned mask on the stage;
A second carrying-in step of placing the substrate on the mask;
A second alignment step of aligning the substrate so as to conform to the mask;
A third carrying-in step of disposing the magnetic plate on the aligned mask and the substrate;
A third aligning step of aligning the magnetic plate so as to conform to the substrate; And
And bringing the magnetic plate into contact with the substrate to bring the mask and the substrate into close contact with each other. 13. The method of claim 12,
Wherein the mask has a thickness of 10 [mu] m to 50 [mu] m. 13. The method of claim 12,
Wherein the second aligning step comprises:
Photographing a first alignment mark provided on the mask and a second alignment mark provided on the substrate; And
And determining whether or not the first alignment mark provided on the mask and the second alignment mark provided on the substrate match with each other.

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