KR20150069885A - Heat curing resin composite and light emitting element package using the same - Google Patents

Abstract

A thermosetting resin composition according to an embodiment of the present invention comprises: an epoxy resin which includes a triazine derivative, an epoxy compound, an alicyclic epoxy group and a siloxane group; a polyester-based curing agent; and an inorganic filler including SiO2 impregnated with TiO2.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a thermosetting resin composition and a light emitting device package using the same.

The present invention relates to a thermosetting resin composition, and more particularly, to a thermosetting resin composition used in a light emitting apparatus.

BACKGROUND ART Light emitting devices including light emitting devices such as light emitting diodes (LEDs) are used as various light sources. With the development of semiconductor technology, high output of light emitting devices is accelerating. In order to stably cope with a large amount of light and heat emitted from such a light emitting element, a resin composition excellent in light resistance, heat resistance and moisture resistance is required.

For this purpose, an epoxy resin composition containing a triazine derivative is used. Such an epoxy resin composition is excellent in the semi-solidification performance, but has a problem that the required level of light resistance, heat resistance and moisture resistance can not be satisfied. Further, such an epoxy resin composition is vulnerable to yellowing, and as the time passes, due to unreacted epoxy, the light transmission retention rate is lowered, which may affect the reliability of the light emitting device. Particularly, such an epoxy resin composition has a low initial reflectance and tends to be lowered in luminous flux.

SUMMARY OF THE INVENTION The present invention provides a thermosetting resin composition and a light emitting device using the same.

The thermosetting resin composition according to an embodiment of the present invention includes an epoxy resin containing a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group, a polyester curing agent, and an inorganic filler and the inorganic filler comprises a SiO ₂ TiO ₂ is impregnated.

The SiO ₂ impregnated with TiO ₂ may be contained in an amount of 20 wt% to 35 wt% of the thermosetting resin composition.

The SiO ₂ impregnated with TiO ₂ may be contained in an amount of 25 wt% to 35 wt% of the thermosetting resin composition.

The triazine derivative epoxy compound includes an isocyanurate ring, and the siloxane compound may include the following formula.

Epoxy cycloalkyl -CH ₂ O-CO- hydroxycyclohexyl alkyl ^{-OSiR 1 R 2 O- (SiR 3} R 4 O) n-SiR 5 R 6 O- hydroxycyclohexyl alkyl -CO-CH ₂ O- epoxy cycloalkyl

Wherein R ¹ to R ⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, And the epoxycycloalkyl or the cycloalkyl of the hydroxycycloalkyl is independently a cycloalkyl group having 5 to 20 carbon atoms.

The triazine derivative epoxy compound includes triglycidylisocyanurate (TGIC), and the siloxane compound may include a compound of the following formula.

Wherein R ¹ to R ⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, It is an integer.

The polyester-based curing agent may include a compound of the following formula:

Wherein R ⁷ to R ¹⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, 3.

The polyester-based curing agent may include a compound of the following formula:

Here, n is 1 to 3.

A light emitting device package according to an embodiment of the present invention includes a molded body, a light emitting element mounted on the molded body, and a molding member surrounding the light emitting element, wherein the molded body includes a triazine derivative epoxy compound and an alicyclic An epoxy resin containing a siloxane compound containing an epoxy group and a siloxane group, a polyester curing agent, and an inorganic filler, wherein the inorganic filler comprises a thermosetting resin composition comprising SiO ₂ impregnated with TiO ₂ .

According to the embodiment of the present invention, it is possible to obtain a thermosetting resin composition which is excellent in light resistance, heat resistance and moisture resistance, has a high initial reflectance, and is capable of semi-solidification. Accordingly, yellownish can be prevented even when exposed to high temperature and light for a long time, heat resistance and light resistance can be maintained, and a highly efficient light emitting device can be obtained.

Figure 1 shows an example of a SiO ₂ TiO ₂ is impregnated.
2 shows an example of a backlight unit.
3 shows an example of a lighting device.
4 shows an example of a light emitting device package.

The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms including ordinal, such as second, first, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

In the present specification, wt% can be replaced by parts by weight.

The thermosetting resin composition according to an embodiment of the present invention includes an epoxy resin containing a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group, a polyester curing agent, and an inorganic filler and, the inorganic fillers include SiO ₂ the TiO ₂ is impregnated.

At this time, 0.05 to 190 parts by weight, preferably 2.5 to 40 parts by weight, more preferably 5 to 18 parts by weight of a polyester-based curing agent may be contained relative to 10 parts by weight of the epoxy resin. When the amount of the polyester-based curing agent is less than 0.05 parts by weight based on 10 parts by weight of the epoxy resin, curability is lowered and the reliability is lowered. If the polyester curing agent is contained in an amount exceeding 190 parts by weight based on 10 parts by weight of the epoxy resin, there is a problem that the light resistance, heat resistance and moisture resistance are deteriorated due to the unreacted curing agent.

Here, the epoxy resin includes a triazine derivative epoxy compound, a siloxane compound containing an alicyclic epoxy group and a siloxane group (hereinafter referred to as a siloxane compound).

Here, the weight ratio of the triazine derivative epoxy compound to the siloxane compound may be 90:10 to 50:50. That is, the siloxane compound may be contained in an amount of 10 to 50 wt% based on the total epoxy resin. When the siloxane compound is contained in an amount less than 10 wt% of the total epoxy resin, there is a problem that adhesion with the silicone filler contained in the light emitting device is poor. When the siloxane compound contains more than 50 wt% of the total epoxy compound, the heat resistance and moisture resistance are excellent, but there is a problem that the semi-rigidification becomes difficult.

Here, the triazine derivative epoxy compound may include an isocyanurate ring. Epoxy compounds containing an isocyanurate ring are excellent in light resistance and electrical insulation. The triazine derivative epoxy compound may be, for example, triglycidylisocyanurate (TGIC) such as the following formula (1).

[Chemical Formula 1]

The siloxane compound may be represented by the following general formula (2).

(2)

Epoxy cycloalkyl -CH ₂ O-CO- hydroxycyclohexyl alkyl ^{-OSiR 1 R 2 O- (SiR 3} R 4 O) n-SiR 5 R 6 O- hydroxycyclohexyl alkyl -CO-CH ₂ O- epoxy cycloalkyl

Wherein R ¹ to R ⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, It is an integer. Here, each of the four cycloalkyls may be independently a cycloalkyl group having 5 to 20 carbon atoms. In the present specification, the epoxycycloalkyl may mean an alicyclic epoxy group.

The siloxane compound may be represented by the following general formula (3).

(3)

Here, R ¹ to R ⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne. Here, n may be set to satisfy 30 to 60 wt%, preferably 35 to 55 wt%, and more preferably 40 to 50 wt% of the following formula (4). In the present specification, the formula (4) can be referred to as a siloxane group.

[Chemical Formula 4]

If the formula (4) is less than 30 wt% of the formula (3), adhesion with the silicone filler contained in the light emitting device may be deteriorated. If the formula (4) is more than 60 wt% of the formula (3), the semi-rigidity can be difficult. When each of R ¹ to R ⁶ is a methyl group, n may be a positive integer of 2 to 8, preferably 2 to 6, more preferably 3 to 5. Even when each of R ¹ to R ⁶ is not a methyl group, n may be variously set so that the siloxane group of the formula (4) is contained in an amount of 30 to 60 wt% based on 100 wt% of the siloxane compound of the formula (3).

The epoxy resin composition according to an embodiment of the present invention may further include another epoxy compound. Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, 3,3 ', 5,5'-tetramethyl-4,4'-biphenol type epoxy resin or 4,4'-biphenol type epoxy resin Phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, naphthalene diol type epoxy resin, trisphenylol methane type epoxy resin, tetrakisphenol ethane type An epoxy resin and an epoxy resin obtained by hydrogenating an aromatic ring of a phenol dicyclopentadiene novolak type epoxy resin.

Meanwhile, the polyester curing agent included in the thermosetting resin composition according to an embodiment of the present invention may include the following formula (5).

[Chemical Formula 5]

Wherein R ⁷ to R ¹⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, 3.

The polyester-based curing agent may be represented by the following general formula (6).

[Chemical Formula 6]

Here, n is 1 to 3.

Such a polyester-based curing agent has a high heat-resistant property.

In addition, the thermosetting resin composition according to an embodiment of the present invention may further include a polyester-based curing agent (e.g., a diisocyanate,? -Hydroxylalkylamide, triglycidyl isocyanate (TGIC), uretdione, As shown in FIG.

In addition, the thermosetting resin composition according to an embodiment of the present invention may further include an acid anhydride-based curing agent. Examples of the acid anhydride-based curing agent include dodecenylsuccinic anhydride, polyadipic acid anhydride, polyazelaic anhydride, poly sebacic anhydride, poly (ethyloctadecanedioic) anhydride, poly (phenylhexadecanedioic) anhydride, methyltetrahydro There may be mentioned phthalic anhydride, phthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhydromic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, Anhydrides, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethylene glycol bistrimellitate, anhydrous hic acid, anhydrous nadic acid, methylnadic anhydride, 5- (2,5-dioxotetrahydro- Methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, 1- Methyl-dicarboxy-1 , 2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, and mixtures thereof.

In the thermosetting resin composition according to the embodiment of the present invention, the inorganic filler may be contained in an amount of 15 to 90 parts by weight based on 10 parts by weight of the epoxy resin and the polyester-based curing agent. When the inorganic filler is contained in an amount of less than 15 parts by weight based on 10 parts by weight of the epoxy compound and the polyester curing agent, high thermal conductivity, low thermal expansion and high temperature heat resistance are not guaranteed and the strength is lowered. The high thermal conductivity, low thermal expansion, and high temperature heat resistance are better as the amount of the inorganic filler added is larger, but it is not improved according to the volume fraction thereof, and is remarkably improved from a certain amount. However, if the inorganic filler is contained in an amount exceeding 90 parts by weight based on 10 parts by weight of the epoxy resin and the polyester-based curing agent, the ratio of the epoxy resin serving as the binder between the inorganic fillers is lowered, .

Inorganic filler contained in the thermosetting resin composition according to an embodiment of the present invention may be one selected from SiO ₂ and mixtures thereof with a SiO _2, TiO _2, TiO ₂ impregnated.

Here, SiO ₂ is 1 to 100? And TiO ₂ is a spherical particle having a size of 100 to 500 nm. The SiO ₂ as the inorganic filler can improve the mechanical strength of the resin composition, the use of TiO ₂ as inorganic fillers can increase the reflectance of the resin composition. However, TiO ₂ tends to aggregate with each other. Therefore, when TiO ₂ is added so as to obtain a required reflectance, there is a problem that the mechanical strength of the resin composition is lowered due to aggregation.

Accordingly, an embodiment of the present invention further includes SiO ₂ impregnated with TiO ₂ as an inorganic filler. Figure 1 shows an example of a SiO ₂ TiO ₂ is impregnated. As described above, when SiO ₂ impregnated with TiO ₂ is used as an inorganic filler, it is possible to prevent the aggregation phenomenon between TiO ₂ , thereby satisfying both the reflectance and the mechanical strength. Here, TiO ₂ in SiO ₂ impregnated with TiO ₂ may be included in 2 to 3 parts by weight with respect to 10 parts by weight of SiO ₂ . If TiO ₂ is contained in an amount of less than 2 parts by weight based on 10 parts by weight of SiO ₂ , a desired level of reflectance may not be obtained. If TiO ₂ is contained in an amount of more than 3 parts by weight based on 10 parts by weight of SiO ₂ , the required level of mechanical strength can not be obtained.

According to one embodiment of the present invention, SiO ₂ impregnated with TiO ₂ may be contained in an amount of 20 to 35 wt%, preferably 25 to 35 wt% of the entire thermosetting resin composition. When SiO ₂ impregnated with TiO ₂ is contained in an amount of less than 20 wt% or more than 35 wt% of the entire epoxy resin composition, the initial reflectance of the thermosetting resin composition is lowered and the strength of the device may be lowered.

The inorganic filler may further comprise one of alumina, boron nitride, magnesium oxide, aluminum nitride, carbon nanotubes, graphite, carbon fibers and mixtures thereof.

The thermosetting resin composition according to an embodiment of the present invention may further include a curing accelerator. The curing accelerator may be, for example, tertiary amines, imidazoles, their organic carboxylates, organic carboxylic acid metal salts, metal-organic chelate compounds, aromatic sulfonium salts, organophosphine compounds, salts thereof, phosphorus- (E.g., 2-ethyl-4-methylimidazole, methyl-tributylphosphonium-dimethylphosphate, quaternary phosphonium bromide) and mixtures thereof.

The thermosetting resin composition according to an embodiment of the present invention may further include an additive. The additives may be, for example, dispersants, leveling agents, antioxidants, and the like. The antioxidant may be at least one of, for example, a phenolic antioxidant, a phosphorus antioxidant, and a sulfur-based antioxidant.

Examples of the phenolic antioxidant include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6- Butyl-4-hydroxyphenyl) propionate, 2,2'-methylenebis (4-methyl-6-t- butylphenol), 4,4'-butylidenebis Methyl-6-t-butylphenol), 3,9-bis [1,1-dimethyl-2- { , 4,8,10-tetraoxyaspiro [5.5] undecane, 1,1,3-tris (2-methyl-4-hydroxy-5-t-butylphenyl) butane, 1,3,5- 2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene and the like can be used.

Examples of the phosphorus antioxidant include triphenyl phosphite, diphenyl alkyl phosphite, phenyldialkyl phosphite, phosphorus tri (nonylphenyl), trilauryl phosphite, trioctadecyl phosphite, distearyl pentaerythritol diphosphite, tris (2,4- Di (tert-butylphenyl) phosphite, diisodecyl pentaerythritol diphosphite, di (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, tristearyl sulfotriphosphite, tetrakis Di-tert-butylphenyl) -4,4'-biphenyl diphosphite and the like can be used.

Examples of the sulfur-based antioxidant include dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearyl-3,3'-thiodipropionate, etc. Can be used.

These antioxidants may be used alone or in combination.

The thermosetting resin composition according to an embodiment of the present invention may further include a releasing agent. The releasing agent can improve release after molding of the thermosetting resin composition. The release agent may be one selected from ester waxes such as carnauba wax, montanic acid, stearic acid, higher fatty acids, higher fatty acid metal salts and montanic acid esters, polyethylene waxes, polyolefin waxes and compounds thereof .

The thermosetting resin composition according to one embodiment of the present invention can be applied to a backlight or a reflection plate of a lighting device, a molded article of a light emitting device package, a molding member, a sealing member, or the like.

2 shows an example of a backlight unit.

Referring to FIG. 2, the backlight unit 200 includes a light guide plate 210, a light emitting module 220, a reflector 230, and a bottom cover 240.

The light guide plate 210 diffuses light into a surface light source. The light emitting module 220 is a light source of a display device in which a backlight unit is installed, and provides light to the light guide plate 210. The light emitting module 220 includes a substrate 222 and at least one light emitting device package 224 and the light emitting device package 224 may be mounted on the substrate 222. The light emitting device package 224 may include a molded product including a light emitting device and a thermosetting resin composition according to an embodiment of the present invention.

The reflection plate 230 is formed under the light guide plate 210 and reflects the light incident on the lower surface of the light guide plate 210 so as to face upward, thereby improving the brightness of the backlight unit. The thermosetting resin composition according to one embodiment of the present invention can be applied to the reflection plate 230.

The bottom cover 240 collects the light guide plate 210, the light emitting module 220, and the reflection plate 230. For this purpose, the bottom cover 240 may be in the shape of a box having an opened top surface, but is not limited thereto.

3 shows an example of a lighting device.

3, the lighting device 300 includes a cover 310, a reflection plate 320, a light emitting module 330, a case 340, and a connection terminal 350. [

The cover 310 receives the reflection plate 320 therein and is disposed on the light emitting module 330 and can be coupled to the case 340.

The light emitting module 330 is housed in the case 340. The connection terminal 350 is connected to the case 340 and can supply an external power source (not shown) to the light emitting module 330. The connection terminal 350 is illustrated as being connected to an external power source in a socket manner, but is not limited thereto.

The light emitting module 330 includes a substrate 332 and at least one light emitting device package 334 and at least one light emitting device package 334 may be mounted on the substrate 332. The light emitting device package 334 may include a molded product including a light emitting device and a thermosetting resin composition according to an embodiment of the present invention.

The reflection plate 320 is disposed between the cover 310 and the light emitting module 330 and can reflect light from the light emitting module 330. At this time, the reflection plate 320 may be in the form of a plate having a hole. The thermosetting resin composition according to one embodiment of the present invention can be applied to a reflector of a lighting device.

4 shows an example of a light emitting device package.

Referring to FIG. 4, the light emitting device package 400 includes a molded body 410, a light emitting device 420 mounted on the molded body 410, and a molding member 430 surrounding the light emitting device 420. The formed body 410 may be made of the thermosetting resin composition according to an embodiment of the present invention. The molded body 410 includes an inclined surface surrounding the light emitting device 420 and protects the light emitting device 420 and reflects light emitted from the light emitting device 420.

The light emitting device 420 has a pair of electrodes, and the positive electrode and the negative electrode are connected to the leads 412 and 414 through the wires 440, respectively. The molding member 430 surrounds and protects the light emitting device 420. The molding member 430 may include, for example, a thermosetting resin composition according to one embodiment of the present invention. Further, the molding member 430 may further include a phosphor to change the wavelength of the light emitted from the light emitting device 420.

Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples.

≪ Example 1 >

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (VI) is a 3 to 2 to 5) and an inorganic filler 80wt% (here, the weight ratio of SiO _2, TiO ₂ and TiO SiO _2, the _second is impregnated is 38 22 20, TiO ₂ is impregnated with SiO ₂ in a weight ratio of TiO ₂ and SiO ₂ is to obtain the product of example 1 after heat treatment a mixture of 2 to 8).

≪ Example 2 >

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (6) is 3 to 2 to 5) and an inorganic filler 80wt% (here, SiO _2, and the mass ratio of TiO ₂ and TiO SiO _{2, 2} is impregnated with 34 to 21 versus 25, the TiO2-impregnated SiO ₂ , the mass ratio of TiO ₂ and SiO ₂ was 2 to 8), and the result of Example 2 was obtained after the heat treatment.

≪ Example 3 >

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (VI) is a 3 to 2 to 5) and an inorganic filler 80wt% (here, SiO _2, TiO ₂ and TiO ₂ is impregnated with a weight ratio of SiO ₂ is 30 20 30, TiO ₂ is impregnated with SiO ₂ in a weight ratio of TiO ₂ and SiO ₂ are heat-treated by mixing 2 to 8) to give the product of example 3.

<Example 4>

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (VI) is a 3 to 2 to 5) and an inorganic filler 80wt% (here, SiO _2, TiO ₂ and TiO ₂ is impregnated with a weight ratio of SiO ₂ is 26 19 35, and, TiO ₂ is impregnated with SiO ₂ in a weight ratio of TiO ₂ and SiO ₂ are heat-treated by mixing 2 to 8) to give the product of example 4.

&Lt; Comparative Example 1 &

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (6) is 3 to 2 to 5) and an inorganic filler 80wt% (here, SiO _2, the weight ratio of TiO ₂ and TiO SiO _2, the _second is impregnated is heat-treated by mixing 54 26 0) The result of Comparative Example 1 was obtained.

&Lt; Comparative Example 2 &

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (VI) is a 3 to 2 to 5) and an inorganic filler 80wt% (here, the weight ratio of SiO _2, TiO ₂ and TiO SiO _2, the _second is impregnated is 46 24 10, TiO ₂ is impregnated with SiO ₂ in a weight ratio of TiO ₂ and SiO ₂ is 2 to 8) the mixture to obtain a product of the heat treatment in Comparative example 2.

&Lt; Comparative Example 3 &

The epoxy compound of Chemical Formula 1, epoxy compound of Chemical Formula 3 wherein each of R ¹ to R ⁶ is a methyl group and n is 2 and 20 wt% of a curing agent of Chemical Formula 6 (wherein the epoxy compound of Chemical Formula 1, the epoxy compound of Chemical Formula 3, the weight ratio of the epoxy compound of formula (VI) is a 3 to 2 to 5) and an inorganic filler 80wt% (here, SiO _2, TiO ₂ and TiO ₂ is impregnated with a weight ratio of SiO ₂ is 22 18 40, TiO ₂ is impregnated with SiO ₂ in a weight ratio of TiO ₂ and SiO ₂ is 2 to 8) the mixture to obtain a product of the heat treatment in Comparative example 3.

The results of Examples 1 to 4 and Comparative Examples 1 to 3 were irradiated with light of 450 nm to measure the initial reflectance. Table 1 shows the results.

Experiment number Initial reflectance Example 1 94% Example 2 95% Example 3 96% Example 4 95% Comparative Example 1 92% Comparative Example 2 93% Comparative Example 3 93%

Comparing Examples 1 to 4 and Comparative Examples 1 to 3, the contents of epoxy resin, curing agent and inorganic filler are all the same, and the content ratio of SiO ₂ and TiO ₂ contained in the inorganic filler is 54 to 26 . However, in the embodiment comprising the TiO ₂ is impregnated with SiO ₂ as an inorganic filler examples 1 to 4 the initial reflectivity of more than 94%, or an inorganic filler in Comparative Example 1 including only the TiO ₂ and SiO _2, the initial reflectivity is 92% . Further, in Comparative Examples 2 to 3, 20 to 35wt% is TiO SiO _{2, 2} is impregnated with the entire thermosetting resin composition as compared to that containing the TiO SiO _{2, 2} is impregnated with a 10wt% or 40wt% of the whole thermosetting resin composition It can be seen that the initial reflectance of Examples 1 to 4 is higher. In particular, in Examples 2 to 4, in which SiO ₂ impregnated with TiO ₂ is contained in an amount of 25 to 35 wt% of the entire thermosetting resin composition, it can be seen that the initial reflectance is 95% or more.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

Claims (8)

An epoxy resin containing a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group,
Polyester-based curing agents, and
An inorganic filler,
Thermosetting resin composition of the inorganic fillers include SiO ₂ of the TiO ₂ impregnated. The method according to claim 1,
Wherein the SiO ₂ impregnated with TiO ₂ is contained in an amount of 20 wt% to 35 wt% of the thermosetting resin composition. 3. The method of claim 2,
Wherein the SiO ₂ impregnated with TiO ₂ is contained in an amount of 25 wt% to 35 wt% of the thermosetting resin composition. The method according to claim 1,
The triazine derivative epoxy compound includes an isocyanurate ring,
Wherein the siloxane compound is a thermosetting resin composition comprising:
Epoxy cycloalkyl -CH ₂ O-CO- hydroxycyclohexyl alkyl ^{-OSiR 1 R 2 O- (SiR 3} R 4 O) n-SiR 5 R 6 O- hydroxycyclohexyl alkyl -CO-CH ₂ O- epoxy cycloalkyl
Wherein R ¹ to R ⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, And the epoxycycloalkyl or the cycloalkyl of the hydroxycycloalkyl is independently a cycloalkyl group having 5 to 20 carbon atoms. 5. The method of claim 4,
Wherein the triazine derivative epoxy compound comprises triglycidylisocyanurate (TGIC)
Wherein the siloxane compound is a thermosetting resin composition comprising a compound represented by the following formula:

Wherein R ¹ to R ⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, It is an integer. The method according to claim 1,
Wherein the polyester curing agent is a thermosetting resin composition comprising a compound represented by the following formula:

Wherein R ⁷ to R ¹⁶ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, 3. The method according to claim 6,
Wherein the polyester curing agent is a thermosetting resin composition comprising a compound represented by the following formula:

Here, n is 1 to 3. Shaped body,
A light emitting element mounted on the molded body, and
And a molding member surrounding the light emitting element,
The formed body is a triazine (triazine) derivatives, epoxy compounds, and alicyclic epoxy group and an epoxy resin containing a siloxane compound containing a siloxane group, including a polyester-based curing agent, and an inorganic filler, the inorganic filler is TiO ₂ is impregnated with And a thermosetting resin composition comprising SiO ₂ .

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