KR20150066439A - Method for Manufacturing Bimetallic or Intermetallic Precursor for Manufacturing CZTS Light Absorbing Compound of Solar Cell - Google Patents
Method for Manufacturing Bimetallic or Intermetallic Precursor for Manufacturing CZTS Light Absorbing Compound of Solar Cell Download PDFInfo
- Publication number
- KR20150066439A KR20150066439A KR1020140139683A KR20140139683A KR20150066439A KR 20150066439 A KR20150066439 A KR 20150066439A KR 1020140139683 A KR1020140139683 A KR 1020140139683A KR 20140139683 A KR20140139683 A KR 20140139683A KR 20150066439 A KR20150066439 A KR 20150066439A
- Authority
- KR
- South Korea
- Prior art keywords
- bimetallic
- precursor
- intermetallic
- reducing agent
- solar cell
- Prior art date
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Abstract
Description
본 발명은 태양전지의 CZTS계 광흡수 조성물 제조에 필요한 바이메탈릭(bimetallic) 또는 인터메탈릭(intermetallic) 전구체의 제조 방법에 관한 것이다.The present invention relates to a method for producing a bimetallic or intermetallic precursor necessary for manufacturing a CZTS-based light absorbing composition of a solar cell.
태양전지는 개발초기 때부터 비싼 제조 과정의 광-흡수층 및 반도체 물질로서 규소(Si)를 사용하여 제작되어 왔다. 태양전지를 더욱 경제적으로 산업 이용이 가능하도록 제조하기 위해, 박막 태양전지의 구조물로 저비용의 CIGS(구리-인듐-갈륨-설포-다이-셀레나이드, Cu(In, Ga)(S, Se)2)와 같은 광-흡수 물질을 이용한 제품이 개발되어 왔다. 상기 CIGS계의 태양전지는 전형적으로 후면 전극층, n-형 접합부, 및 p-형 흡수제층으로 구성된다. 한편, 기존발명에서 CIS층이 기재된 태양 전지가 19%를 초과하는 전력 변환 효율을 갖는 것으로 언급된바 있다. 상기와 같이 CIGS계의 박막 태양 전지에 대한 잠재성에도 불구하고, 인듐 및 셀레늄의 독성 및 고가의 비용은 CIGS계의 광흡수층을 이용한 박막 태양전지의 광범위한 용도 및 적용성에 대한 주요한 장애가 되고 있다. Since the early days of development, solar cells have been fabricated using expensive fabrication processes of light-absorbing layers and silicon (Si) as semiconductor materials. (CIGS), Cu (In, Ga) (S, Se) 2 (CIGS) as a structure of a thin film solar cell to manufacture a solar cell more economically and industrially usable ) Have been developed. The CIGS-based solar cell typically comprises a back electrode layer, an n-type junction, and a p-type absorber layer. On the other hand, it has been mentioned that the solar cell in which the CIS layer is described in the existing invention has a power conversion efficiency exceeding 19%. Despite the potential for CIGS thin film solar cells as described above, the toxicity and high cost of indium and selenium have become major obstacles to the broad application and applicability of thin film solar cells using the CIGS type light absorbing layer.
따라서, 상기 CIGS계의 광흡수층에 대한 대안으로 구리, 아연, 주석, 황 원소를 포함하는 CZTS(Cu2ZnSnS4)계 태양전지가 주목되고 있다. 상기 CZTS는 약 1.5eV의 직접 밴드갭(direct band gap) 및 104 ㎝-1초과의 흡수계수를 갖고 있고, 비교적 독성 또는 고가의 원소를 적게 포함하고 있는 장점이 있고, 1996년, 처음 CZTS 헤테로접합 PV 전지에 대해 보고 되었지만, 현재까지도 CZTS를 기반으로 한 태양전지의 기술은 CIGS의 태양전지의 기술 보다 뒤 처져 있고, CZTS전지에 대한 전류 기록 효율이 아직 많이 부족한 상태이다. Accordingly, CZTS (Cu 2 ZnSnS 4 ) -based solar cells including copper, zinc, tin and sulfur elements have attracted attention as an alternative to the CIGS-based light absorbing layer. The CZTS has a direct band gap of about 1.5 eV and an absorption coefficient of more than 10 < 4 > cm < -1 & gt ;, and has an advantage of containing relatively less toxic or expensive elements. In 1996, Although reported for junction PV cells, to date, CZTS based solar cell technology is behind CIGS solar cell technology, and current recording efficiency for CZTS cells is still insufficient.
이러한 CIGS계 또는 CZTS계 태양전지는 수 마이크론 두께의 광흡수층을 형성하여 태양전지를 제조하는데, 광흡수층의 제조방법으로는 크게 전구체가 필요 없는 진공 증착법과 전구체로 박막을 형성한 다음 열처리를 통해 CIGS 박막을 형성하는 스퍼터링(sputtering), 전기증착법(electrodeposition), 및 최근, 비진공 하에서 전구체 물질을 도포한 후 이를 열처리 하는 잉크 코팅 방법이 소개되었다. 이 중, 잉크 코팅 방법은 공정 단가를 낮출 수 있으며, 대면적을 균일하게 제조할 수 있어 최근 연구가 활발하게 진행되고 있으며, 잉크 코팅 방법에 사용되는 전구체로는 금속 칼코게나이드 화합물, 바이메탈릭 금속 입자, 인터메탈릭 금속 입자, 또는 금속 산화물 등 여러 형태의 화합물 또는 금속이 사용된다.The CIGS-based or CZTS-based solar cell is fabricated by forming a light absorbing layer having a thickness of several microns. In the manufacturing method of the light absorbing layer, a vacuum evaporation method in which a precursor is not largely required, a thin film is formed by a precursor, Recently, an ink coating method has been introduced in which a thin film is formed by sputtering, electrodeposition, and a method of applying a precursor material under a non-vacuum condition and then heat-treating the precursor material. Among them, the ink coating method can lower the process cost and can produce a large area uniformly, and recent studies have been actively conducted. As the precursors used in the ink coating method, metal chalcogenide compounds, bimetallic metals Particles, intermetallic metal particles, or metal oxides are used.
이와 관련하여, 바이메탈릭 또는 인터메탈릭 금속 입자는 금속염을 용매에 용해시켜 금속염 용액을 제조한 후, 드로핑 깔때기(dropping funnel)를 이용하여 상기 금속염 용액을 강력한 환원제 용액에 점적 반응시켜 제조할 수 있다.In this connection, bimetallic or intermetallic metal particles can be prepared by dissolving a metal salt in a solvent to prepare a metal salt solution, followed by dropwise reaction of the metal salt solution with a strong reducing agent solution using a dropping funnel .
도 1은 점적 반응에 의한 바이메탈릭 또는 인터메탈릭 전구체를 합성하는 방법을 모식적으로 나타내고 있다.FIG. 1 schematically shows a method for synthesizing a bimetallic or intermetallic precursor by a pointwise reaction.
도 1을 참조하면, 반응기(10)의 하부에 교반기(11)가 구비되어 있고, 반응기(10) 내부에는 환원제 용액(20)이 포함되어 있으며, 반응기(10) 상단에는 드로핑 깔때기(30)가 위치하고 있다. 드로핑 깔때기(30)는 내부에 금속염 용액(40)을 포함하고 있고, 드로핑 깔때기(30)의 하부를 통해 금속염 용액의 방울(41)이 반응기(10) 내부로 점적 된다.1, a
이 때, 금속염 용액의 방울(droplet)의 크기는 1~3 mm 정도로 크고, 금속염 용액과 환원제 용액의 반응 속도는 매우 빠르며, 금속염 용액의 방울이 환원제 용액 위에 떨어지는 범위가 매우 좁기 때문에, 환원제 용액을 교반하면서 점적 반응을 진행하더라도, 금속염 용액의 방울이 일정 크기 이하로 분산되기 어렵다. 또한, 금속염 용액의 방울이 떨어지는 일부 영역에서만 반응이 일어나므로, 이로부터 합성되는 바이메탈릭 또는 인터메탈릭 전구체 입자의 응집이 심해지고, 불균일한 반응으로 인해 전구체 입자의 조성이 불균일해진다는 문제가 있다. At this time, the droplet size of the metal salt solution is as large as 1 to 3 mm, the reaction rate of the metal salt solution and the reducing agent solution is very fast, and the range of drop of the metal salt solution falls on the reducing agent solution is very narrow, It is difficult for the droplets of the metal salt solution to be dispersed below a certain size. In addition, since the reaction occurs only in a part of the metal salt solution in which droplets are dropped, agglomeration of the bimetallic or intermetallic precursor particles synthesized therefrom becomes serious, and the composition of the precursor particles becomes uneven due to the uneven reaction.
따라서, 상기 문제점들을 해결할 수 있는 바이메탈릭 또는 인터메탈릭 전구체 입자의 제조 방법에 대한 필요성이 높은 실정이다. Therefore, there is a high need for a method for producing bimetallic or intermetallic precursor particles capable of solving the above problems.
본 발명은 상기와 같은 종래기술의 문제점과 과거로부터 요청되어온 기술적 과제를 해결하는 것을 목적으로 한다.SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art and the technical problems required from the past.
본 출원의 발명자들은 심도 있는 연구와 다양한 실험을 거듭한 끝에, 구리(Cu)염, 아연(Zn)염, 및 주석(Sn)염으로 이루어진 군에서 선택되는 2종 이상의 금속염들이 용매에 녹아있는 금속염 용액을 분사(spray)방식으로 환원제 용액에 투입하여 전구체를 제조하는 경우, 소망하는 크기의 균일한 전구체 입자를 얻을 수 있고, 전구체 입자간 응집이 일어나지 않으며 불균일한 반응이 억제됨을 확인하고, 본 발명을 완성하기에 이르렀다. The inventors of the present application have conducted intensive research and various experiments and have found that a metal salt in which two or more metal salts selected from the group consisting of copper (Cu) salt, zinc (Zn) salt and tin It was confirmed that uniform precursor particles having a desired size can be obtained when the solution is injected into the reducing agent solution in the form of a spray and the precursor particles of a desired size can be obtained and coagulation between the precursor particles does not occur and nonuniform reaction is suppressed, .
따라서, 본 발명에 따른 태양전지의 CZTS계 광흡수 조성물 합성에 필요한 바이메탈릭(bimetallic) 또는 인터메탈릭(intermetallic) 전구체를 제조하는 방법은, (a) 구리(Cu)염, 아연(Zn)염, 및 주석(Sn)염으로 이루어진 군에서 선택되는 2종 이상의 금속염들을 용매에 녹여 금속염 용액을 준비하는 과정; (b) 환원제를 용매에 녹여 환원제 용액을 준비하는 과정; 및 (c) 상기 금속염 용액을 분사(spray)방식으로 상기 환원제 용액에 투입하는 과정;을 포함하는 것을 특징으로 한다. Accordingly, a method for producing a bimetallic or intermetallic precursor necessary for the synthesis of a CZTS-based light absorbing composition of a solar cell according to the present invention comprises the steps of: (a) mixing a copper (Cu) salt, a zinc (Zn) Preparing a metal salt solution by dissolving at least two kinds of metal salts selected from the group consisting of tin (Sn) salts in a solvent; (b) preparing a reducing agent solution by dissolving the reducing agent in a solvent; And (c) injecting the metal salt solution into the reducing agent solution by a spray method.
본 출원의 발명자들이 확인한 바에 따르면, 상기의 바이메탈릭 또는 인터메탈릭 전구체의 제조방법은, 점적 반응에 의한 제조방법에 비해 더욱 균일한 크기의 전구체 입자를 얻을 수 있고, 분사방식의 조절을 통해 소망하는 정도로 전구체 입자의 크기를 조절할 수 있으며, 금속염 용액을 환원제 용액에 고르게 분산시킬 수 있어 불균일한 반응을 억제하고 입자의 조성을 균일하게 하는 효과가 있다.The inventors of the present application have found that the method for producing a bimetallic or intermetallic precursor can obtain precursor particles having a more uniform size than a production method by a point reaction, And the metal salt solution can be evenly dispersed in the reducing agent solution, thereby suppressing uneven reaction and uniformizing the composition of the particles.
하나의 구체적인 예에서, 상기 구리(Cu)염, 아연(Zn)염, 및 주석(Sn)염은 각각 독립적으로 염화물(chloride), 브롬화물(bromide), 요오드화물(iodide), 질산염(nitrate), 아질산염(nitrite), 황산염(sulfate), 아세트산염(acetate), 아황산염(sulfite), 아세틸아세토네이트염(acetylacetoante) 및 수산화물(hydroxide)로 이루어진 군에서 선택되는 하나 이상의 형태일 수 있고, 주석(Sn)염의 경우에는 2가 및 4가의 염이 한정되지 아니하고 모두 사용 가능하다.In one specific example, the copper (Cu) salt, the zinc (Zn) salt and the tin (Sn) salt are each independently selected from the group consisting of chloride, bromide, iodide, nitrate, Nitrate, sulfate, acetate, sulfite, acetylacetoante, and hydroxide, and may be at least one selected from the group consisting of tin (Sn), tin ) Salts are not limited to divalent and tetravalent salts, all of them are usable.
하나의 구체적인 예에서, 상기 과정(a)의 용매는 물, DEG(diethylene glycol), 메탄올(methanol), 오레일아민(oleylamine), 에틸렌글리콜(ethyleneglycol), 트리에틸렌글리콜(triethylene glycol), 디메틸설폭사이드(dimethyl sulfoxide), 디메틸포름아마이드(dimethyl formamide) 및 NMP(N-methyl-2-pyrrolidone)로 이루어진 군에서 선택되는 하나 이상일 수 있다.In one specific example, the solvent of step (a) is selected from the group consisting of water, diethylene glycol, methanol, oleylamine, ethyleneglycol, triethylene glycol, And may be at least one selected from the group consisting of dimethyl sulfoxide, dimethyl formamide and N-methyl-2-pyrrolidone (NMP).
한편, 상기 금속염 용액에는 캡핑제(capping agent)가 더 포함될 수 있으며, 상기 캡핑제는 용액 공정 중에 포함됨으로써 전구체 입자의 크기와 입자의 상을 조절할 뿐만 아니라, N, O, S 등의 원자를 포함하고 있으므로 상기 원자들의 비공유전자쌍(lone pair electron)에 의해 금속 입자 표면에 쉽게 바인딩(binding)하여 표면을 감싸므로 전구체 입자의 산화를 방지해 줄 수 있다.Meanwhile, the metal salt solution may further include a capping agent. The capping agent is included in the solution process to control the size of the precursor particles and the phase of the particles, as well as atoms such as N, O, S So that the surface of the precursor particles can be prevented from being oxidized by easily binding to the surface of the metal particles by lone pair electrons of the atoms and covering the surface of the metal particles.
이러한 캡핑제는 특별히 한정되지는 않으나, 예를 들어, L-주석산 나트륨(sodium L-tartrate dibasic dehydrate), 타르타르산 나트륨 칼륨(potassium sodium tartrate), 소듐 아크릴산(sodium acrylate), 폴리(아크릴산 소듐염)(Poly(acrylic acid sodium salt)), 시트르산 나트륨(sodium citrate), 시트르산 삼나트륨(trisodium citrate), 시트르산 디나트륨(disodium citrate), 소비톨(sorbitol), 트리에틸포스페이트(triethyl phosphate), 에틸렌디아민(ethylene diamine), 프로필렌디아민(propylene diamine), 에탄디티올(1,2-ethanedithiol), 및 에탄티올(ethanethiol)로 이루어진 군에서 선택되는 하나 이상일 수 있다.Examples of such a capping agent include, but are not limited to, sodium L-tartrate dibasic dehydrate, potassium sodium tartrate, sodium acrylate, poly (sodium acrylate) Such as poly (acrylic acid sodium salt), sodium citrate, trisodium citrate, disodium citrate, sorbitol, triethyl phosphate, ethylene diamine, propylene diamine, 1,2-ethanedithiol, and ethanethiol. In the present invention,
하나의 구체적인 예에서, 상기 환원제는 유독한 하이드라진 등이 아닌 유기 환원제 및/또는 무기 환원제일 수 있고, 상세하게는, LiBH4, NaBH4, KBH4, Ca(BH4)2, Mg(BH4)2, LiB(Et)3H, NaBH3(CN), NaBH(OAc)3, 아스코르브산(ascorbic acid) 및 트리에탄올아민(triethanolamine)으로 이루어진 군에서 선택되는 1종 이상일 수 있다.In one specific example, the reducing agent may be an organic reducing agent and / or an inorganic reducing agent other than toxic hydrazine, and specifically, LiBH4, NaBH4, KBH4, Ca (BH4)2, Mg (BH4)2, LiB (Et)3H, NaBH3(CN), NaBH (OAc)3, Ascorbic acid, and triethanolamine. [0027] The term " a "
이때, 상기 환원제는 용액 공정 과정에서 포함되는 금속염 총량 대비 몰비로 1배 내지 20배로 포함될 수 있다.At this time, the reducing agent may be included at a molar ratio of 1 to 20 times the total amount of metal salts contained in the solution process.
환원제의 함량이 금속염에 대하여 너무 적게 포함될 경우에는 금속염의 환원이 충분히 일어나지 못하므로, 지나치게 작은 크기 또는 적은 양의 바이메탈릭 또는 인터메탈릭 전구체 입자만을 얻을 수 있거나 또는 원하는 원소 비의 입자를 얻기 어렵다. 또한, 환원제의 함량이 금속염 함량에 대해 20배를 초과하여 포함되는 경우에는 정제 과정에서의 환원제 및 부산물을 제거하기가 원활하지 않은 문제점이 있어 바람직하지 않다.When the content of the reducing agent is too small in the amount of the metal salt, reduction of the metal salt is not sufficiently performed, so that only an excessively small size or a small amount of bimetallic or intermetallic precursor particles can be obtained or it is difficult to obtain particles having a desired element ratio. If the content of the reducing agent is more than 20 times the amount of the metal salt, it is not preferable to remove the reducing agent and the by-products in the purification process.
하나의 구체적인 예에서, 상기 과정(c)에서 상기 금속염 용액은 노즐이 구비된 분사장치를 이용하여 환원제 용액에 투입될 수 있다.In one specific example, in the step (c), the metal salt solution may be injected into the reducing agent solution using an injector equipped with a nozzle.
이 때, 상기 노즐의 내경은 100 μm 내지 9 mm일 수 있고, 상세하게는 150 μm 내지 500 μm 일 수 있다. 노즐의 내경이 100 μm 미만인 경우에는 작은 석출 입자로도 노즐이 쉽게 막힐 수 있고, 9 mm 초과하는 경우에는 금속염 용액이 소망하는 크기의 방울로 분사되지 않을 수 있어 바람직하지 않다. In this case, the inner diameter of the nozzle may be 100 μm to 9 mm, and more specifically, 150 μm to 500 μm. If the inner diameter of the nozzle is less than 100 mu m, the nozzle can be easily clogged even with small precipitate particles, and if it exceeds 9 mm, the metal salt solution may not be sprayed with droplets of a desired size.
상기 분사장치는 불활성 가스 또는 공기를 캐리어 가스(carrier gas)로 사용할 수 있으며, 상기 불활성 가스는, 예를 들어, 헬륨(He), 질소(N2), 네온(Ne), 아르곤(Ar), 크립톤(Kr), 및 제논(Xe)으로 이루어진 군에서 선택되는 1종 이상일 수 있다.The inert gas may be an inert gas such as helium (He), nitrogen (N 2 ), neon (Ne), argon (Ar) Krypton (Kr), and xenon (Xe).
상기 분사장치의 분사압은 0.1 bar 이상 내지 6 bar 이하일 수 있으며, 상세하게는 1 bar 이상 내지 3 bar 이하일 수 있다. 분사장치의 분사압이 0.1 bar 미만인 경우에는 분사압이 너무 약하여 금속염 용액의 순간 정체가 있을 수 있는 바, 금속염 용액이 균일한 크기의 방울로 분사되지 않는 문제가 있으며, 6 bar 초과인 경우에는 금속염 용액이 반응기 내부의 환원제 용액에 투입되는 분사면적이 필요이상으로 넓어지게 되고 상기 분사면적에 상응하는 크기의 반응기를 사용하는 경우 공정비용이 증가하므로 비효율적이다. The jetting pressure of the jetting device may be from 0.1 bar to 6 bar, and more specifically from 1 bar to 3 bar. If the jetting pressure of the jetting apparatus is less than 0.1 bar, the jetting pressure is too weak to cause momentary stagnation of the metal salt solution. In this case, the metal salt solution may not be sprayed with uniform size droplets. The injection area injected into the reducing agent solution in the reactor becomes wider than necessary and the use of the reactor having the size corresponding to the injection area increases the process cost and is inefficient.
한편, 상기 분사장치에서 노즐의 분사각은 수평면을 기준으로 하향 30도 이상 내지 90도 이하일 수 있다. 노즐의 분사각이 30도 미만인 경우에는 금속염 용액의 분사 거리가 증가하여 분사 된 금속염 용액 방울이 반응기 기벽에 접촉 후, 기벽을 타고 내려와 환원제 용액에 투입 될 수 있다. 이 경우, 기벽 근처의 환원제 용액에는 기타 다른 부분의 환원제 용액에 비해 더 많은 양의 금속염 용액이 투입되므로 반응의 불균일성이 초래 될 수 있다.The injection angle of the nozzles in the injector may be from 30 degrees to 90 degrees downward from the horizontal plane. If the spray angle of the nozzle is less than 30 degrees, the spraying distance of the metal salt solution is increased, so that the sprayed metal salt droplet contacts the reactor wall, and then falls down on the wall to enter the reducing agent solution. In this case, the reducing agent solution near the barrier wall may be injected with a larger amount of the metal salt solution than the other reducing agent solution, which may result in non-uniformity of the reaction.
본 발명은 또한, 상기의 제조 방법에 의해 제조된 바이메탈릭 또는 인터메탈릭 전구체를 제공한다.The present invention also provides a bimetallic or intermetallic precursor produced by the above-described production method.
이때, 상기 바이메탈릭 또는 인터메탈릭 전구체는, 하나의 구체적인 예에서, 20 nm 이상 내지 300 nm 이하의 평균 입경을 갖는 입자일 수 있으며, 상세하게는 20 nm 이상 내지 100 nm 이하의 평균 입경을 갖는 입자일 수 있다.In one specific example, the bimetallic or intermetallic precursor may be particles having an average particle diameter of 20 nm or more and 300 nm or less, more specifically, particles having an average particle diameter of 20 nm or more and 100 nm or less Lt; / RTI >
상기 범위를 벗어나 평균 입경이 20 nm 미만인 경우에는 박막 제조 시 크랙(crack)이 생기는 경우가 많으며, 평균 입경이 200 nm를 초과하는 경우에는 코팅막이 치밀하지 못하고 박막 제조를 위한 열처리 후 공극(void)이 생기는 경우가 많아, 우수한 막 특성을 얻기가 어려운 바, 바람직하지 않다.If the average particle diameter is less than 20 nm, cracks are likely to occur during the production of the thin film. If the average particle diameter exceeds 200 nm, the coating film is not dense and voids are formed after the heat treatment for producing the thin film. And it is difficult to obtain excellent film characteristics, which is not preferable.
본 발명은 또한, 상기 바이메탈릭 또는 인터메탈릭 전구체를 포함하는 태양전지용 광흡수 조성물을 제공하고, 상기 광흡수 조성물에 기반한 광흡수층을 포함하는 박막을 제공한다. The present invention also provides a light absorbing composition for a solar cell comprising the bimetallic or intermetallic precursor and provides a thin film comprising a light absorbing layer based on the light absorbing composition.
구체적으로 본 발명에 따른 박막은, Specifically, in the thin film according to the present invention,
(d) 상기의 바이메탈릭 또는 인터메탈릭 전구체 입자를 용매에 분산하여 잉크를 제조하는 과정;(d) dispersing the bimetallic or intermetallic precursor particles in a solvent to prepare an ink;
(e) 전극이 형성된 기재 상에 상기 잉크를 코팅하는 과정; 및(e) coating the ink on a substrate on which electrodes are formed; And
(f) 상기 전극이 형성된 기재 상에 코팅된 잉크를 건조한 후 열처리 하는 과정;(f) drying the ink coated on the substrate on which the electrode is formed, followed by heat treatment;
을 포함하여 제조될 수 있다.. ≪ / RTI >
이때, 상기 잉크는 바이메탈릭 또는 인터메탈릭 전구체 입자 외에 S를 포함하는 전구체 입자 및/또는 Se를 포함하는 전구체 입자를 추가로 용매에 분산하여 제조할 수 있다.At this time, the ink may be prepared by further dispersing the precursor particles containing S and / or the precursor particles containing Se in addition to the bimetallic or intermetallic precursor particles.
하나의 구체적인 예에서, 상기 과정(d)의 용매는 일반적인 유기 용매라면 특별히 제한없이 사용할 수 있는데 알칸계(alkanes), 알켄계(alkenes), 알킨계(alkynes), 방향족 화합물계(aromatics), 케톤계(ketons), 니트릴계(nitriles), 에테르계(ethers), 에스테르계(esters), 유기할로겐화물계(organic halides), 알코올계(alcohols), 아민계(amines), 티올계(thiols), 카르복실산계(carboxylic acids), 수소화인계(phosphines), 아인산계(phosphites), 인산염계(phosphates), 술폭시화물계(sulfoxides), 및 아미드계(amides) 중에서 선택된 유기용매를 단독으로 사용하거나 이들 중에서 선택된 하나 이상의 유기용매가 혼합된 형태로 사용할 수 있다. In one specific example, the solvent of the process (d) may be any organic solvent as long as it is not particularly limited, and examples thereof include alkanes, alkenes, alkynes, aromatics, ketones Ketones, nitriles, ethers, esters, organic halides, alcohols, amines, thiols, kerosene, and the like. Organic solvents selected from carboxylic acids, phosphines, phosphites, phosphates, sulfoxides, and amides may be used alone or in combination with one or more of them And one or more selected organic solvents may be used in a mixed form.
구체적으로, 상기 알코올계 용매는 에탄올, 1-프로판올(1-propanol), 2-프로판올(2-propanol), 1-펜타놀(1-pentanol), 2-펜타놀(2-pentanol), 1-헥사놀(1-hexanol), 2-헥사놀(2-hexanol), 3-헥사놀(3-hexanol), 헵타놀(heptanol), 옥타놀(octanol), EG(ethylene glycol), DEGMEE(diethylene glycol monoethyl ether), EGMME(ethylene glycol monomethyl ether), EGMEE(ethylene glycol monoethyl ether), EGDME(ethylene glycol dimethyl ether), EGDEE(ethylene glycol diethyl ether), EGMPE(ethylene glycol monopropyl ether), EGMBE(ethylene glycol monobutyl ether), 2-메틸-1-프로판올(2-methyl-1-propanol), 시클로펜탄올(cyclopentanol), 시클로헥산올(cyclohexanol), PGPE(propylene glycol propyl ether), DEGDME(diethylene glycol dimethyl ether), 1,2-PD(1,2-propanediol), 1,3-PD(1,3-propanediol), 1,4-BD(1,4-butanediol), 1,3-BD(1,3-butanediol), 알파테르피네올(α-terpineol), DEG (diethylene glycol), 글리세롤(glycerol), 2-에틸아미노 에탄올(2-(ethylamino)ethanol), 2-(메틸아미노)에탄올(2-(methylamino)ethanol), 및 2-아미노-2-메틸-1-프로판올(2-amino-2-methyl-1-propanol) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.Specifically, the alcohol-based solvent is selected from the group consisting of ethanol, 1-propanol, 2-propanol, 1-pentanol, 2- Hexanol, 2-hexanol, 3-hexanol, heptanol, octanol, EG (ethylene glycol), DEGMEE (diethylene glycol) monoethyl ether (EGMME), ethylene glycol monoethyl ether (EGMEE), ethylene glycol dimethyl ether (EGDEE), ethylene glycol monopropyl ether (EGMPE), ethylene glycol monobutyl ether 2-methyl-1-propanol, cyclopentanol, cyclohexanol, propylene glycol propyl ether (PGPE), DEGDME (diethylene glycol dimethyl ether), 1 (1,3-propanediol), 1,4-BD (1,4-butanediol), 1,3-BD (1,3-butanediol) Alpha-terpineol, DEG (diethylene glycol), glycerol, 2-ethylamino ethanol, (2-amino-2-methyl-1-propanol), 2- (methylamino) ethanol, 2- It can be used every day.
상기 아민계 용매는 트리에틸아민(triethyl amine), 디부틸 아민(dibutyl amine), 디프로필 아민(dipropyl amine), 부틸 아민(butylamine), 에탄올 아민(ethanolamine), DETA(Diethylenetriamine), TETA(Triethylenetetraine), 트리에탄올아민(Triethanolamine), 2-아미노에틸 피페라진(2-aminoethyl piperazine), 2-하드록시에틸 피페라진(2-hydroxyethyl piperazine), 다이부틸아민(dibutylamine), 및 트리스(2-아미노에틸)아민(tris(2-aminoethyl)amine) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The amine-based solvent is selected from the group consisting of triethylamine, dibutylamine, dipropylamine, butylamine, ethanolamine, DETA (diethylenetriamine), TETA (triethylenetetraine) Triethanolamine, 2-aminoethyl piperazine, 2-hydroxyethyl piperazine, dibutylamine, and tris (2-aminoethyl) amine (tris (2-aminoethyl) amine).
상기 티올계 유기용매는 1,2-에탄디티올(1,2-ethanedithiol), 펜탄티올 (pentanethiol), 헥산티올(hexanethiol), 및 메르캅토에탄올(mercaptoethanol) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The thiol-based organic solvent may be used for one or more kinds of mixing selected from 1,2-ethanedithiol, pentanethiol, hexanethiol, and mercaptoethanol. .
상기 알칸계(alkane) 용매는 헥산(hexane), 헵탄(heptane), 옥탄(octane) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The alkane solvent may be one or more kinds of mixed solvents selected from the group consisting of hexane, heptane and octane.
상기 방향족 화합물계(aromatics) 용매는 톨루엔(toluene), 자일렌(xylene), 니트로벤젠(nitrobenzene), 피리딘(pyridine) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The aromatic solvent may be one or more kinds of mixed solvents selected from the group consisting of toluene, xylene, nitrobenzene, and pyridine.
상기 유기할로겐화물계(organic halides) 용매는 클로로포름(chloroform), 메틸렌 클로라이드(methylene chloride), 테트라클로로메탄(tetrachloromethane), 디클로로에탄(dichloroethane), 및 클로로벤젠(chlorobenzene) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The organic halide solvent may be at least one compound selected from the group consisting of chloroform, methylene chloride, tetrachloromethane, dichloroethane, and chlorobenzene. have.
상기 니트릴계(nitrile) 용매는 아세토니트릴(acetonitrile)일 수 있다.The nitrile solvent may be acetonitrile.
상기 케톤계(ketone) 용매는 아세톤(acetone), 시클로헥사논(cyclohexanone), 시클로펜타논(cyclopentanone), 및 아세틸 아세톤(acetyl acetone) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The ketone solvent may be one or more kinds of mixed solvents selected from the group consisting of acetone, cyclohexanone, cyclopentanone, and acetyl acetone.
상기 에테르계(ethers) 용매는 에틸에테르(ethyl ether), 테트라하이드로퓨란(tetrahydrofurane), 및 1,4-다이옥산(1,4-dioxane) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다. The ethers solvent may be one or more daily for mixing selected from ethyl ether, tetrahydrofurane, and 1,4-dioxane.
상기 술폭시화물계(sulfoxides) 용매는 DMSO(dimethyl sulfoxide), 및 술포란(sulfolane) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The sulfoxides solvent may be one or more daily for mixing selected from dimethyl sulfoxide (DMSO) and sulfolane.
상기 아미드계(amide) 용매는 DMF(dimethyl formamide), 및 NMP(n-methyl-2-pyrrolidone) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The amide solvent may be one or more kinds of mixed solvents selected from DMF (dimethyl formamide), and NMP (n-methyl-2-pyrrolidone).
상기 에스테르계(ester) 용매는 에틸락테이트(ethyl lactate), r-부틸로락톤(r-butyrolactone), 및 에틸아세토아세테이트(ethyl acetoacetate) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.The ester solvent may be one or more daily for mixing selected from ethyl lactate, r-butyrolactone, and ethyl acetoacetate.
카르복실산계(carboxylic acid) 용매는 프로피온산(propionic acid), 헥산 산(hexanoic acid), 메소-2,3-디메르캅토숙신산(meso-2,3-dimercaptosuccinic acid), 티오락틱산(thiolactic acid), 및 티오글리콜산(thioglycolic acid) 중에서 선택되는 하나 이상의 혼합 용매일 수 있다.Carboxylic acid solvents include propionic acid, hexanoic acid, meso-2,3-dimercaptosuccinic acid, thiolactic acid, , And thioglycolic acid. ≪ / RTI >
그러나, 상기 용매들은 하나의 예시일 수 있으며 이에 한정되지 않는다.However, the solvents may be but one example.
경우에 따라서는, 상기 과정(d)의 잉크에 첨가제를 더 첨가하여 제조될 수 있다.In some cases, it may be prepared by further adding an additive to the ink of the process (d).
상기 첨가제는 예를 들어, 분산제, 계면활성제, 중합체, 결합제, 가교결합제, 유화제, 소포제, 건조제, 충전제, 증량제, 증점화제, 필름 조건화제, 항산화제, 유동제, 평활성 첨가제, 및 부식 억제제로 이루어진 군에서 선택되는 어느 하나 이상일 수 있고, 상세하게는 폴리비닐피로리돈(polyvinylpyrrolidone: PVP), 폴리비닐알코올(Polyvinylalcohol), 안티테라 204(Anti-terra 204), 안티테라 205(Anti-terra 205), 에틸 셀룰로오스(ethyl cellulose), 및 디스퍼스BYK110(DispersBYK110)으로 이루어진 군에서 선택되는 어느 하나 이상일 수 있다.The additive may, for example, comprise a dispersant, a surfactant, a polymer, a binder, a crosslinking agent, an emulsifier, a defoamer, a desiccant, a filler, an extender, a thickener, a film conditioning agent, an antioxidant, a flow agent, Polyvinylpyrrolidone (PVP), polyvinyl alcohol, Anti-terra 204, Anti-terra 205, and the like can be used. Ethyl cellulose, and DISPERS BYK 110 (DispersBYK 110).
상기 과정(e)의 코팅층을 형성하는 방법은, 예를 들어, 습식 코팅, 분무 코팅, 스핀 코팅, 닥터 블레이드(doctor blade) 코팅, 접촉 프린팅, 상부 피드 리버스(feed reverse) 프린팅, 하부 피드 리버스(feed reverse) 프린팅, 노즐 피드 리버스(nozzle feed reverse) 프린팅, 그라비어(gravure) 프린팅, 마이크로그라비어(micro gravure) 프린팅, 리버스 마이크로그라비어(reverse micro gravure) 프린팅, 롤러 코팅, 슬롯 다이(slot die) 코팅, 모세관 코팅, 잉크젯 프린팅, 젯(jet) 침착, 분무 침착으로 이루어진 군에서 선택되는 어느 하나 일 수 있다. The method of forming the coating layer of the process (e) may be performed by, for example, a wet coating, a spray coating, a spin coating, a doctor blade coating, a contact printing, an upper feed reverse printing, feed reverse printing, nozzle feed reverse printing, gravure printing, micro gravure printing, reverse micro gravure printing, roller coating, slot die coating, Capillary coating, inkjet printing, jet deposition, spray deposition, and the like.
한편, 태양전지의 박막을 제조하기 위해서는 셀렌화 공정을 더 포함할 수 있고, 셀렌화(selenization) 공정이란 16족 원소인 S 또는 Se를 박막에 공급하는 것으로 금속 및 16족 원소로 이루어진 물질인 칼코게나이드 화합물을 제조하기 위한 것이다. 여기서 칼코게나이드 화합물은 지상용 태양 스펙트럼 내에서 양호한 광학 밴드갭(band-gap) 값을 갖기 때문에 광기전력 적용을 위한 유용한 후보 물질이 된다.In order to manufacture a thin film of a solar cell, a selenization process may be further included. In the selenization process, a Group 16 element, S or Se, is supplied to the thin film, To prepare a coenanide compound. Here, the chalcogenide compound is a useful candidate material for photovoltaic application because it has a good optical band-gap value in the ground-based solar spectrum.
상기와 같은 S 또는 Se를 공급하는 셀렌화 공정은 다양한 방법에 의해 이루어질 수 있다.The selenization process for supplying S or Se as described above may be performed by various methods.
첫 번째 예에서, 상기 과정(d)에서 바이메탈릭 또는 인터메탈릭 전구체 입자와 함께 S 원소를 포함하는 전구체 입자 및/또는 Se 원소를 포함하는 전구체 입자를 용매에 분산하여 잉크를 제조하면, 열처리를 통해 셀렌화 공정과 같은 효과를 달성할 수 있다. 또한, 그 밖에 S 및/또는 Se 자체를 입자 형태로 용매에 추가 분산시켜 잉크를 제조할 수도 있다.In the first example, when the ink is produced by dispersing the precursor particles containing the S element and / or the Se element in the solvent together with the bimetallic or intermetallic precursor particles in the step (d) An effect similar to that of the selenization process can be achieved. In addition, the ink may be prepared by further dispersing S and / or Se itself in the form of particles in a solvent.
두 번째 예에서, 상기 과정(f)의 열처리를 S 또는 Se 원소가 존재하는 조건에서 함으로써 달성될 수 있다.In the second example, the heat treatment of the process (f) can be accomplished under the condition that the S or Se element is present.
상세하게는, 상기 S 또는 Se 원소가 존재하는 조건은 H2S 또는 H2Se의 가스 형태로 공급하거나, Se 또는 S를 가열하여 기체로 공급함으로써 가능하다.Specifically, the condition in which the S or Se element is present may be supplied in the form of a gas of H 2 S or H 2 Se, or by heating Se or S to supply the gas.
세 번째 예에서, 상기 과정(e) 이후에 S 또는 Se를 적층한 후 과정(f)를 진행하여 달성될 수 있다. 상세하게는, 상기 적층은 용액 공정에 의하여 이루어질 수 있고 증착 방법에 의해 이루어질 수도 있다.In the third example, step (f) may be performed after stacking S or Se after step (e). Specifically, the lamination may be performed by a solution process or may be performed by a deposition method.
한편, 상기와 같이 제조된 박막은 0.5 ㎛ 내지 3.0 ㎛의 범위 내에서 두께를 가질 수 있으며, 더욱 상세하게는 박막의 두께는 0.5 ㎛ 내지 2.5 ㎛일 수 있다.On the other hand, the thin film produced as described above may have a thickness within the range of 0.5 to 3.0 mu m, and more specifically, the thickness of the thin film may be 0.5 to 2.5 mu m.
박막의 두께가 0.5 ㎛ 미만인 경우에는 광흡수층의 밀도와 양이 충분치 못해 소망하는 광전 효율을 얻을 수 없고, 박막이 3.0 ㎛를 초과하는 경우에는, 전하운반자(carrier)가 이동하는 거리가 증가함에 따라 재결합(recombination)이 일어날 확률이 높아지므로 이로 인한 효율 저하가 발생하게 된다.When the thickness of the thin film is less than 0.5 탆, the density and quantity of the light absorbing layer are not sufficient and the desired photoelectric efficiency can not be obtained. When the thickness of the thin film exceeds 3.0 탆, The probability of recombination is increased, resulting in a reduction in efficiency.
더 나아가, 본 발명은 상기 박막을 사용하여 제조되는 박막 태양전지를 제공한다.Furthermore, the present invention provides a thin film solar cell manufactured using the thin film.
박막 태양전지를 제조하는 방법은 당업계에 이미 알려져 있으므로 본 명세서에는 그에 대한 설명을 생략한다.Methods for fabricating thin film solar cells are well known in the art and will not be described herein.
이상에서 설명한 바와 같이, 본 발명에 따른 바이메탈릭 또는 인터메탈릭 전구체의 제조방법은 분사(spray)방식을 이용함으로써, 기존의 점적 반응에 의한 제조방법에 비해 더욱 균일한 크기의 전구체 입자를 얻을 수 있고, 분사방식의 조절을 통해 소망하는 정도로 전구체 입자의 크기를 조절할 수 있으며, 금속염 용액을 환원제 용액에 고르게 분산시킬 수 있어 불균일한 반응을 억제하고 입자의 조성을 균일하게 하는 효과가 있다.INDUSTRIAL APPLICABILITY As described above, the method for producing a bimetallic or intermetallic precursor according to the present invention can obtain precursor particles having a more uniform size than a conventional manufacturing method using a spray method, , The size of the precursor particles can be controlled to a desired extent by controlling the injection method, and the metal salt solution can be evenly dispersed in the reducing agent solution, thereby suppressing uneven reaction and uniformizing the composition of the particles.
도 1은 종래의 점적 반응에 의한 바이메탈릭 또는 인터메탈릭 전구체의 제조방법을 나타낸 모식도이다.
도 2 및 도 3은 각각 본 발명의 하나의 실시예에 따른 분사(spray) 방식에 의한 바이메탈릭 또는 인터메탈릭 전구체의 제조 방법을 나타낸 모식도이다. FIG. 1 is a schematic view showing a method for producing a bimetallic or intermetallic precursor by a conventional point reaction.
FIGS. 2 and 3 are schematic views showing a method of producing a bimetallic or intermetallic precursor by a spray method according to one embodiment of the present invention, respectively.
이하에서는, 본 발명의 실시예에 따른 도면을 참조하여 설명하지만, 이는 본 발명의 더욱 용이한 이해를 위한 것으로, 본 발명의 범주가 그것에 의해 한정되는 것은 아니다.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited by the scope of the present invention.
도 2 및 도 3은 금속염 용액을 분사(spray) 방식에 의해 환원제 용액에 투입하여 바이메탈릭 또는 인터메탈릭 전구체를 제조하는 방법을 나타낸 모식도이다.FIGS. 2 and 3 are schematic views showing a method for producing a bimetallic or intermetallic precursor by injecting a metal salt solution into a reducing agent solution by a spray method.
우선, 도 2를 참조하면, 반응기(10)의 하부에 교반기(11)가 구비되어 있고, 반응기(10) 내부에는 환원제 용액(20)이 포함되어 있으며, 반응기(10)의 좌측상단에는 분사 장치(50)가 위치하고 있다. 분사 장치(50)에는 노즐(51)이 구비되어 있고, 수평면을 기준으로 노즐(51)의 분사각이 하향으로 약 35도를 이루고 있다. Referring to FIG. 2, a
도 2와 비교하여 도 3을 참조하면, 분사 장치(50)가 반응기(10)의 중앙상단에 위치하고 있으며, 노즐(51)의 분사각은 수평면을 기준으로 하향 90도를 이루고 있다는 점에서 차이가 있다. 3, the
이러한 분사 장치(50)를 통해 금속염 용액은 환원제 용액(20)에 투입되는데, 구체적으로 금속염 용액 방울들(42)은 캐리어 가스의 압력으로 분사 장치(50)의 노즐(51)을 통해 미세한 크기로 분산되어 반응기(10) 내부의 환원제 용액(20)으로 투입 된다.Specifically, the metal
본 발명에 따른 분사 장치를 이용하여 바이메탈릭 또는 인터메탈릭 전구체를 제조하는 경우, 균일한 크기의 전구체 입자를 얻을 수 있고, 분사압 및/또는 노즐의 내경을 조절하면 금속염 용액 방울들의 크기를 조절할 수 있으므로 이로 인해 소망하는 크기의 바이메탈릭 또는 인터메탈릭 전구체 입자를 얻을 수 있다. 또한, 균일한 크기의 금속염 용액의 방울들이 환원제 용액에 투입되는 경우 불균일한 반응이 억제되고, 반응 후 바이메탈릭 또는 인터메탈릭 전구체 입자들의 조성이 균일하게 얻어지는 효과가 있다.
When the bimetallic or intermetallic precursor is produced using the spraying apparatus according to the present invention, uniform size precursor particles can be obtained, and the size of the metal salt solution droplets can be controlled by controlling the injection pressure and / or the inner diameter of the nozzle So that bimetallic or intermetallic precursor particles of the desired size can be obtained. In addition, when droplets of the metal salt solution of a uniform size are put into the reducing agent solution, uneven reaction is suppressed, and after the reaction, the composition of the bimetallic or intermetallic precursor particles is uniformly obtained.
본 발명이 속한 분야에서 통상의 지식을 가진 자라면 상기 내용을 바탕으로 본 발명의 범주 내에서 다양한 응용 및 변형을 행하는 것이 가능할 것이다.Those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims (16)
(a) 구리(Cu)염, 아연(Zn)염, 및 주석(Sn)염으로 이루어진 군에서 선택되는 2종 이상의 금속염들을 용매에 녹여 금속염 용액을 준비하는 과정;
(b) 환원제를 용매에 녹여 환원제 용액을 준비하는 과정; 및
(c) 상기 금속염 용액을 분사(spray)방식으로 상기 환원제 용액에 투입하는 과정;
을 포함하는 것을 특징으로 하는 바이메탈릭 또는 인터메탈릭 전구체의 제조 방법.A method of producing a bimetallic or intermetallic precursor for the production of a CZTS-based light absorbing composition of a solar cell,
(a) preparing a metal salt solution by dissolving at least two metal salts selected from the group consisting of copper (Cu) salts, zinc (Zn) salts, and tin (Sn) salts in a solvent;
(b) preparing a reducing agent solution by dissolving the reducing agent in a solvent; And
(c) injecting the metal salt solution into the reducing agent solution in a spraying manner;
≪ / RTI > wherein the precursor is a bismaleimide precursor.
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