KR20150057245A - Cleaning device of carrier head in chemical mechanical polishing system - Google Patents

Cleaning device of carrier head in chemical mechanical polishing system Download PDF

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Publication number
KR20150057245A
KR20150057245A KR1020130140332A KR20130140332A KR20150057245A KR 20150057245 A KR20150057245 A KR 20150057245A KR 1020130140332 A KR1020130140332 A KR 1020130140332A KR 20130140332 A KR20130140332 A KR 20130140332A KR 20150057245 A KR20150057245 A KR 20150057245A
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KR
South Korea
Prior art keywords
cleaning
nozzle
carrier
membrane
cleaning liquid
Prior art date
Application number
KR1020130140332A
Other languages
Korean (ko)
Inventor
모연민
Original Assignee
주식회사 케이씨텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020130140332A priority Critical patent/KR20150057245A/en
Publication of KR20150057245A publication Critical patent/KR20150057245A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Abstract

The present invention relates to a cleaning device for a carrier head of a chemical mechanical polishing system, which comprises a retainer ring and a cleaning device for cleaning a carrier head having a membrane which is fixed in a space surrounded by the retainer ring and which pressurizes the wafer located on the bottom during the chemical mechanical polishing process An apparatus, comprising: a rotatably driven nozzle carrier; A plurality of first cleaning nozzles arranged on the nozzle carrier in a form crossing the membrane and spraying the cleaning liquid upward; A plurality of second cleaning nozzles arranged in the nozzle carrier in a circular shape corresponding to the circular boundary of the retainer ring and the membrane to jet the cleaning liquid upward; A plurality of first cleaning nozzles provided on a rotating nozzle carrier for spraying a cleaning liquid to the bottom surface of the membrane of the carrier head under high pressure to clean the surface of the membrane, The second cleaning nozzle is used to accurately clean the cleaning liquid by injecting the cleaning liquid into the grooves between the retainer ring and the membrane to clean the carrier head used in the chemical mechanical polishing process in a short time in a groove between the retainer ring and the membrane A cleaning device for a carrier head of a chemical mechanical polishing system capable of cleanly cleaning and removing foreign matters is provided.

Description

TECHNICAL FIELD [0001] The present invention relates to a cleaning device for cleaning a carrier head of a chemical mechanical polishing system,

The present invention relates to a cleaning device for a carrier head of a chemical mechanical polishing system, and more particularly to a cleaning device for cleaning a carrier head used in a chemical mechanical polishing process, To a cleaning device.

BACKGROUND ART In general, a chemical mechanical polishing (CMP) process is known as a standard process for polishing a surface of a substrate by relatively rotating between a substrate such as a wafer for manufacturing a semiconductor provided with a polishing layer and a polishing table.

The chemical mechanical polishing process is performed by rotating the wafer while pressurizing the wafer with the carrier head 90, rotating the polishing pad on which the wafer abuts, and supplying the slurry to the polishing surface of the wafer, The polishing process is carried out simultaneously.

Therefore, the turbulent particles and the slurry are mixed with the polishing surface of the wafer during the chemical mechanical polishing process. Therefore, in order to planarize the wafer while adjusting the thickness of the wafer, foreign substances such as particles must be removed from the wafer newly introduced into the chemical mechanical polishing process.

In this connection, Korean Patent Registration No. 10-1130888 '' Cleaning unit of carrier head of chemical mechanical polishing apparatus and movable chemical mechanical polishing system using the same '', a cleaning unit 1 of the carrier head of the type shown in FIG. 1 Lt; / RTI > The cleaning unit 1 of the conventional carrier head includes a nozzle carrier 10 arranged in a rotatable and linear arrangement, a plurality of spray nozzles 20 arranged in a line on the nozzle carrier 10, a nozzle carrier 10, A connecting portion 35 for connecting the collection container 30 in a cantilevered manner and a swivel drive motor 40 for rotating the connecting portion 35 and the collection container 30 to the swivel motion 40d .

Here, the nozzle carrier 10 is fixed on the basis of the rotation center 15, and the injection nozzle 20 is rotated by the rotary motor 18 through the belt 17, 90 at a high pressure. At this time, the cleaning liquid is supplied to the nozzle carrier 10 through the cleaning liquid supply units 55 and 56 (the connection pipe between them is not shown), and the cleaning liquid is injected upward through the respective injection nozzles 20.

2, the carrier head 90 rotates while pressing the wafer W into the flexible membrane 91 surrounded by the retainer ring 92 during the chemical mechanical polishing process. Although not shown in the drawings, grooves are formed in the bottom surface of the retainer ring 92 so that even when the chemical mechanical polishing process is performed while the retainer ring 92 is kept in close contact with the polishing pad, Is supplied to the wafer through the grooves. The abrasive grains and the slurry separated from the wafer W are mixed with the peripheral pure water and mixed with the retainer ring 92 and the membrane 91 while the chemical mechanical polishing process is performed, And the gap (93) between the membranes (91).

However, the cleaning unit 1 of the conventional carrier head can smoothly clean the bottom surface of the membrane 91 of the carrier head and the bottom surface of the retainer ring 92 because the nozzle carrier 10 is formed in a linear shape and rotated , It is inevitable that the spraying of the cleaning liquid with sufficient water pressure is limited to the space between the membrane 91 and the retainer ring 92,

Particularly, since the cleaning unit 1 of the conventional carrier head is a cantilever structure in which the nozzle carrier 10 is extended from the center axis of the rotation to the connecting portion 35, the nozzle carrier 10 Even if some nozzles 10 of the nozzle carrier 10 are accurately arranged in the groove of the membrane 91 and the groove of the retainer ring 92 because a deflection that is inclined by a predetermined angle alpha is generated from the horizontal plane 95 The direction in which the cleaning liquid is ejected from the nozzle 10 is not aligned with the grooves and the direction in which the cleaning liquid is ejected from the cleaning nozzle 10 is not accurately sprayed in the vertical direction so that the cleaning liquid does not reach the groove deeply , There is a limit in that the carrier head 90 can not be cleaned properly.

When the chemical mechanical polishing process is resumed, foreign substances held deep in the groove 93 are partially lowered downwardly in accordance with the rotation of the carrier head 90 and the chemical mechanical polishing process of the new wafer W is made uneven It has been causing the Therefore, it is urgently required to clean the carrier head 90 after the chemical mechanical polishing process.

SUMMARY OF THE INVENTION In order to solve the above-described problems, it is an object of the present invention to provide a cleaning device for a carrier head of a chemical mechanical polishing system that allows cleaning of a carrier head used in a chemical mechanical polishing process in a cleaner and shorter time do.

Particularly, the present invention aims at effectively removing high-pressure foreign matter adhering to the groove by accurately spraying the cleaning liquid to the concave groove between the membrane and the retainer of the carrier head subjected to the chemical mechanical polishing process.

Therefore, when the wafer carrier is mounted on a plurality of polishing plates on a polishing path while moving the wafer along the circulating path, the slurry and the abrasive particles sandwiched by the inner edge of the retainer ring of the carrier head holding the wafer are reliably removed Thereby ensuring a constant polishing quality even when polishing is performed while the substrate carrier unit continuously moves along the circulating path.

In order to achieve the above object, the present invention provides a cleaning device for a carrier head having a retainer ring and a membrane fixed in a space surrounded by the retainer ring and pressing a wafer positioned on the bottom during a chemical mechanical polishing process, A nozzle carrier; A plurality of first cleaning nozzles arranged on the nozzle carrier in a form crossing the membrane and spraying the cleaning liquid upward; A plurality of second cleaning nozzles arranged in the nozzle carrier in a circular shape corresponding to the circular boundary of the retainer ring and the membrane to jet the cleaning liquid upward; Wherein the cleaning liquid is injected upward from the first cleaning nozzle and the second cleaning nozzle while the nozzle carrier rotates, and a cleaning device for cleaning the carrier head of the chemical mechanical polishing system.

This is because a plurality of first cleaning nozzles provided on a rotating nozzle carrier are used to perform cleaning by spraying a cleaning liquid on the bottom surface of the membrane of the carrier head under high pressure and to carry out a plurality of second cleaning steps arranged in the shape of grooves located at the boundary between the retainer ring and the membrane The carrier head that has been used in the chemical mechanical polishing process is cleaned by a nozzle to accurately clean the foreign substance trapped in the groove between the retainer ring and the membrane within a short period of time by spraying the cleaning liquid precisely with high pressure into the interior of the groove between the retainer ring and the membrane So that it can be cleaned and removed.

Particularly, a large number of second cleaning nozzles are distributed in a circular array corresponding to the grooves between the retainer ring and the membrane of the carrier head in which foreign matter intensively remains, and the cleaning liquid is concentratedly injected into the grooves at a high pressure, It is possible to completely remove the foreign substances which are deeply entangled.

At this time, the first cleaning nozzles are arranged across the center of the membrane to clean the bottom surface of the membrane as a whole.

A third cleaning nozzle disposed outside the second cleaning nozzle for spraying the cleaning liquid upward toward the surface of the retainer ring; As shown in FIG.

A cleaning liquid passage communicating with the first cleaning nozzle and the second cleaning nozzle is installed in the nozzle carrier so that a cleaning liquid sprayed through the first cleaning nozzle and the second cleaning nozzle is supplied through the cleaning liquid passage.

A recovery container for recovering contaminated cleaning liquid falling after cleaning the carrier head; So that the contaminated cleaning liquid mixed with the slurry and the abrasive particles is discharged separately, thereby facilitating the treatment of the foreign matter.

Above all, the nozzle carrier is rotatably supported with respect to the collection container, and the collection container is configured to be supported at both ends. This makes it possible to accurately align the second cleaning nozzle located in the nozzle carrier with the circular groove between the retainer ring and the membrane, The amount of deflection of the nozzle carrier is minimized and even if deflection occurs, the nozzle carrier located at the center of the deflection can be maintained in a horizontal state, so that the second cleaning nozzle of the nozzle carrier does not spray the cleaning liquid in an oblique direction It is possible to inject the cleaning liquid precisely in the vertical direction so that the cleaning liquid can flow deeply into the circular groove between the retainer ring and the membrane to obtain a favorable effect of reliably cleaning and removing the foreign matter caught in the groove.

At this time, the drive motor for rotating the nozzle carrier is fixed to the lower central portion of the recovery container, and the nozzle carrier is tilted to one side due to the self weight of the drive motor, It is possible to prevent the high-pressure injection from being accurately performed.

According to the present invention, the cleaning liquid is jetted at a high pressure on the bottom surface of the membrane of the carrier head and the bottom surface of the retainer ring by a plurality of first cleaning nozzles and third cleaning nozzles provided in the rotating nozzle carrier, A plurality of second cleaning nozzles arranged in a nozzle carrier in the shape of a groove located at a boundary, precisely injecting a cleaning liquid into the circular grooves between the retainer ring and the membrane to clean the carrier head used in the chemical mechanical polishing process for a short time It is possible to obtain an advantageous effect of clean cleaning and removal in the inside.

Particularly, the present invention is characterized in that a plurality of second cleaning nozzles are distributed in a circular array corresponding to the grooves between the retainer ring and the membrane of the carrier head in which foreign matters are intensively left, and the recovery container provided with the nozzle carrier is supported at both ends, Even if a deflection amount is generated, the cleaning nozzle fixed to the nozzle carrier can jet the cleaning liquid in the vertical direction, so that the second cleaning nozzle circularly distributed in the nozzle carrier deeply sucks the cleaning liquid into the circular groove between the retainer ring of the carrier head and the membrane. It is possible to obtain a merit that the foreign matter deeply inserted into the groove of the carrier head can be completely removed.

1 is an exploded perspective view showing a cleaning device of a conventional carrier head of a chemical mechanical polishing system,
2 is a schematic diagram schematically showing the configuration of a carrier head during a chemical mechanical polishing process,
FIG. 3 is a schematic view showing a state in which the carrier head is cleaned by the cleaning apparatus of FIG. 1;
4 is a perspective view showing a cleaning device of a carrier head according to an embodiment of the present invention,
Figure 5 is a top view of the nozzle carrier of Figure 4,
Figure 6 is a partial longitudinal cross-sectional view of the cleaning device of the carrier head of Figure 4,
Fig. 7 is a schematic view showing a state in which the carrier head is cleaned by the cleaning device of Fig. 4; Fig.

Hereinafter, the cleaning apparatus 100 of the carrier head of the chemical mechanical polishing system according to an embodiment of the present invention will be described in detail. However, in describing an embodiment of the present invention, the same or similar reference numerals are given to the same or similar components as those in the conventional configuration, and a description thereof will be omitted for the sake of clarity of the present invention.

Fig. 4 is a perspective view showing the cleaning device of the carrier head according to the embodiment of the present invention, Fig. 5 is a plan view of the nozzle carrier of Fig. 4, Fig. 6 is a partial longitudinal cross-sectional view of the cleaning device of the carrier head of Fig. Is a schematic view showing a state in which the carrier head is cleaned by the cleaning device of Fig.

As shown in the drawing, a cleaning apparatus 100 according to an embodiment of the present invention is fixed in a space surrounded by a retainer ring 92 and a retainer ring 92, so that a wafer W , Comprising a nozzle carrier (110) in which a plurality of cleaning nozzles (200) are positionally fixed and driven to rotate (120d), and a nozzle carrier (110) A pair of sliders 125 for moving the collecting container 120 along the guide member 180 in a state where the collecting container 120 is supported at both ends of the collecting container 120, And a rotation drive motor 130 for rotating the carrier 110. [

5, the nozzle carrier 110 is formed of a circular band 220A having a size similar to that of the bottom surface of the carrier head 90 and a straight band 210A crossing therebetween, A plurality of cleaning nozzles 200 for spraying the cleaning liquid at a high pressure upward are installed in the straight strips.

More specifically, a plurality of first cleaning nozzles 210 are linearly arranged on the straight line 210A of the nozzle carrier 110, and the cleaning liquid is directed vertically toward the bottom surface of the membrane 91 of the carrier head 90 High pressure spraying. The first cleaning nozzle 210 is provided at a position aligned with the center of the membrane 91 so that when the cleaning liquid is sprayed from the first cleaning nozzle 210 while the nozzle carrier 110 rotates, Is cleanly cleaned.

Above all, a plurality of second cleaning nozzles 220 are circularly arranged in the ring-shaped zone 220A of the nozzle carrier 110 so as to be formed between the membrane 91 of the carrier head 90 and the retainer ring 92 And is aligned with the groove 93. That is, the diameter of the imaginary line 220c connecting the center of the second cleaning nozzle 220 coincides with the diameter of the groove 93 formed between the membrane 91 of the carrier head 90 and the retainer ring 92 do. Accordingly, when the cleaning liquid is jetted upward from the second cleaning nozzle 220 while the nozzle carrier 110 rotates, the cleaning liquid jetted from the plurality of second cleaning nozzles 220 in the vertical direction flows toward the membrane of the carrier head 90 The slurry or the abrasive particles sandwiched in the grooves 93 are discharged to the outside while the cleaning liquid deeply and more flowed into the grooves 93 formed between the retainer ring 91 and the retainer ring 92 intensively flows, It is possible to clean the inside of the groove 93 having many foreign substances cleanly.

On the other hand, the outer region 230A of the circular imaginary line 220c coinciding with the groove 93 formed between the membrane 91 of the carrier head 90 and the retainer ring 92, A plurality of third cleaning nozzles 230 are arranged to clean the bottom surface of the retainer ring 92. [ Although the third cleaning nozzle 230 for cleaning the retainer ring 92 is illustrated as being formed at the extended position with the first cleaning nozzle 210 as an example, Lt; / RTI > direction. However, the bottom surface of the membrane 91 and the retainer ring 92 are relatively easy to clean, and in the groove 93 formed between the membrane 91 of the carrier head 90 and the retainer ring 92, It is preferable that the second cleaning nozzles 220 are disposed in a larger number than the first cleaning nozzles 210 and the third cleaning nozzles 230.

The cleaning liquid 77 is supplied from the cleaning liquid supply source 280 through the cleaning liquid supply pipe 270 to the cleaning liquid passage 110c of the nozzle carrier 110 through the connector 270c As the cleaning liquid 77 is filled, the cleaning liquid 77 is ejected upward from the plurality of cleaning nozzles 210, 220, 230, and 200. The connector 270c is fixed to the recovery container 120 and does not rotate so that the nozzle carrier 110 is rotationally driven so that the cleaning liquid is prevented from leaking between the connector 270c and the nozzle carrier 110, Sealed. On the other hand, a configuration for supplying the cleaning liquid to the cleaning liquid passage of the nozzle carrier 110 from the cleaning liquid supply source may adopt a configuration disclosed in Korean Patent Registration No. 10-1130888 filed and filed by the present applicant.

Meanwhile, the nozzle carrier 110 is rotationally driven by the rotation driving motor 130 located at the bottom of the center of the recovery container 120. The coupling member 135 integrally coupled to the nozzle carrier 110 is supported by the rotation support shaft 135b with respect to the rotation shaft 132 of the rotation drive motor 130, And is rotationally driven. Since the drive motor 130 for rotating the nozzle carrier 110 is located at the center of the bottom surface of the collection container 120 as described above, the collection container 120 does not move toward one side due to its own weight, do. Reference numeral 133 denotes a bracket for fixing the rotation driving motor 130 to the recovery container 120.

The recovery container 120 has a receiving portion 120c therein so that the rotation center of the nozzle carrier 110 is rotatably installed at the center of the collection container 120. [ When the cleaning liquid is injected upward from the plurality of cleaning nozzles 200 in a state in which the recovery vessels 120 are aligned so that their centers are aligned with each other on the bottom surface of the carrier head 90, the slurry, abrasive grains Contaminated cleaning liquid mixed with foreign matters such as dust and the like is collected by the recovery container 120 and discharged to the outside.

The recovery container 120 is symmetrically coupled to a pair of sliders 125 disposed at intervals of 180 degrees or integrally formed symmetrically with the slider 125 and moved together. The slider 125 moves along a predetermined path along a guide member 180 such as a rail or a lead screw. For example, the guide member 180 is a guide rail in which permanent magnets of N poles and S poles are alternately attached, and the slider 125 is provided with a coil 125 facing the permanent magnet, (120s) to the driving principle of the linear motor in which the slider (125) moves due to the current applied to the slider (125). Thus, backlash in the moving direction and the vertical support direction can be minimized while precisely controlling the position, Control can be performed.

Thus, the recovery container 120 is installed in a state where both ends of the recovery container 120 are supported by the pair of sliders 125. Therefore, the nozzle carrier 110 installed inside the recovery container 120 is also supported by the pair of sliders It becomes a supported state. That is, when the recovery container 120 is located at the center of symmetry of the pair of sliders 125, the center of rotation of the nozzle carrier 110 is at the center of the recovery container 120, And is positioned at the center of the recovery container 120.

Therefore, even if deflection occurs due to the self weight of the nozzle carrier 110, the recovery container 120 and the rotation drive motor 130, the amount of deflection of the recovery container 120 and the nozzle carrier 110 supported at both ends is greatly suppressed Even if deflection of the recovery container 120 and the nozzle carrier 110 occurs, the nozzle carrier 110 located at the center of the nozzle carrier 110 is not tilted to one side, The cleaning nozzle 200 located at the uppermost position can always spray the cleaning liquid 77 in the vertical direction.

7, the cleaning device 100 of the carrier head according to an embodiment of the present invention as described above may be configured such that the center of the membrane 91 and the center of the nozzle carrier 110 coincide with each other The groove 93 formed between the membrane 91 of the carrier head 90 and the retainer ring 92 and the groove 93 formed between the membrane 91 and the retainer ring 92 are moved to the bottom surface of the carrier head 90 by the pair of sliders 125, Lt; RTI ID = 0.0 > 220 < / RTI > At the same time, since the collection container 120 and the nozzle carrier 110 are supported at both ends by the pair of sliders 125, the deflection amount is suppressed to a very small range, and the nozzle carriers 110 can be maintained in a horizontal state without being tilted to one side.

In this state, when the cleaning liquid 77 is supplied from the cleaning liquid supply source 280 while the nozzle carrier 110 is rotated by driving the rotation drive motor 130 and the cleaning liquid 77 is sprayed upward from the cleaning nozzle 200 The bottom surface of the membrane 91 is cleanly cleaned by the cleaning liquid jetted from the first cleaning nozzle 210 and the bottom surface of the retainer ring 92 is cleanly cleaned by the cleaning liquid jetted from the third cleaning nozzle 230, The cleaning liquid injected in the vertical direction from the second cleaning nozzle 220 arranged in a circular shape flows deeply into the grooves 93 recessed between the membrane 91 and the retainer ring 92, It is possible to obtain an advantageous effect that the carrier head 90 used in the chemical mechanical polishing process can be cleaned and removed in a shorter time in a shorter time by completely removing the foreign particles such as the abrasive particles and slurry .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Modified, modified, or improved.

W: Wafer 90: Carrier head
91: Membrane 92: Retainer ring
93: groove 110: nozzle carrier
110c: cleaning liquid passage 120: recovery container
125: Slider 130: Rotary drive motor
135: connecting member 200: cleaning nozzle
210: first cleaning nozzle 220: second cleaning nozzle
230: third cleaning nozzle 270: cleaning liquid supply pipe
280: source of cleaning liquid

Claims (11)

A cleaning apparatus for a carrier head having a retainer ring and a membrane fixed within a space surrounded by the retainer ring to press a wafer located on the bottom during a chemical mechanical polishing process,
A nozzle carrier rotatably driven;
A plurality of first cleaning nozzles arranged on the nozzle carrier in a form crossing the membrane and spraying the cleaning liquid upward;
A plurality of second cleaning nozzles arranged in the nozzle carrier in a circular shape corresponding to the circular boundary of the retainer ring and the membrane to jet the cleaning liquid upward;
Wherein the cleaning liquid is injected upward from the first cleaning nozzle and the second cleaning nozzle while the nozzle carrier rotates.
The method according to claim 1,
A third cleaning nozzle disposed outside the second cleaning nozzle for spraying the cleaning liquid upward toward the surface of the retainer ring;
Further comprising a polishing pad for polishing the carrier head of the chemical mechanical polishing system.
The method according to claim 1,
Wherein the first cleaning nozzles are arranged across the center of the membrane. ≪ RTI ID = 0.0 > 8. < / RTI >
The method according to claim 1,
Wherein the number of the second cleaning nozzles is larger than that of the first cleaning nozzles.
The method according to claim 1,
Wherein a cleaning liquid passage communicating with the first cleaning nozzle and the second cleaning nozzle is provided in the nozzle carrier so that a cleaning liquid injected through the first cleaning nozzle and the second cleaning nozzle is supplied through the cleaning liquid passage Of the carrier head of the chemical mechanical polishing system.
The method according to claim 1,
A recovery container for recovering contaminated cleaning liquid falling after cleaning the carrier head;
Further comprising a polishing pad for polishing the carrier head of the chemical mechanical polishing system.
7. The method according to any one of claims 1 to 6,
Wherein the nozzle carrier is rotatably supported with respect to the recovery container, and the recovery container is supported at both ends.
8. The method of claim 7,
Wherein the recovery container is positioned at the center of the pair of sliders and supported at both ends by the slider, and the center of rotation of the nozzle carrier is located at the center of the recovery container.
9. The method of claim 8,
And the recovery container moves along the guide member while being supported at both ends thereof.
10. The method of claim 9,
Wherein the slider moves along the guide member on the principle of a linear motor.
9. The method of claim 8,
Wherein the drive motor for rotating the nozzle carrier is fixed to a lower central portion of the recovery container.


KR1020130140332A 2013-11-19 2013-11-19 Cleaning device of carrier head in chemical mechanical polishing system KR20150057245A (en)

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KR1020130140332A KR20150057245A (en) 2013-11-19 2013-11-19 Cleaning device of carrier head in chemical mechanical polishing system

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Application Number Priority Date Filing Date Title
KR1020130140332A KR20150057245A (en) 2013-11-19 2013-11-19 Cleaning device of carrier head in chemical mechanical polishing system

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102403582B1 (en) * 2020-11-27 2022-05-30 주식회사 일레븐전자 ring cleaning apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102403582B1 (en) * 2020-11-27 2022-05-30 주식회사 일레븐전자 ring cleaning apparatus

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