KR20150054434A - Led pad, manufacturing method of the led pad and personal therapy apparatus comprising the led pad - Google Patents

Abstract

The present invention relates to an LED pad, a manufacturing method thereof, and a personal treatment apparatus including the same. The LED pad includes: a lower silicone case; an upper silicon case which is coupled to the lower silicon case along the boundary surfaces of the lower silicon case; an LED module which includes multiple LEDs and a flexible substrate having the LEDs mounted on the surface and is arranged on the silicon case formed by the coupling of the upper and lower silicon cases. The present invention enables the LED pad to come in close contact with a user′s body due to the flexibility thereof, is capable of being isolated from the contamination from the outside, and increases the efficiency of the usage and light emission of the LEDs.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a LED apparatus, and more particularly,

The present invention relates to an LED pad, a method of manufacturing an LED pad, and a personal therapy apparatus including the LED pad. More particularly, the present invention relates to an LED light source apparatus capable of being isolated from external exposure, An LED pad, a method of manufacturing an LED pad, and a personal therapy apparatus including an LED pad.

Infrared Near Infrared Ray (for example, light in a wavelength range of 700 nm to 3000 nm) is known to have various effects. It is known that when such near-infrared rays are exposed to the body, nitrogen oxides are formed in the body, thereby expanding blood vessels, generating blood vessels, generating collagen, or relieving pain.

A personal treatment apparatus using a light emitting diode (LED) that emits near-infrared rays with attention to such effects is known. The personal treatment apparatus includes a plurality of near-infrared LEDs and a substrate on which the plurality of near-infrared LEDs are mounted, and a case for accommodating the substrate and the near-infrared LED and isolating the substrate from the outside.

Such existing personal therapy apparatuses have various problems in being used for general personal use.

First, the existing personal treatment apparatus is configured to protect the internal component using a hard type case to protect a plurality of near-infrared LEDs and a substrate on which the plurality of near-infrared LEDs are mounted from external exposure, (For example, forearm, knee, etc.), and the effect of near-infrared rays can not be maximized.

In the existing personal treatment apparatus, there is a case where transparent silicone is used for transmitting the light of the near-infrared LED, but this transparent silicone is used as a filler for protecting the substrate or the near-infrared LED, There is a problem in that it can not be completely isolated and causes defects or the function of the personal therapy apparatus itself can not be utilized properly due to exposure of external pollutants.

On the other hand, the near-infrared LED of the existing personal treatment apparatus generates a lot of heat according to the light emission, and the heat is measured at the highest temperature at the position where the near-infrared LED is mounted and relatively low temperature is measured as the distance from each near- do.

There is a limit to the change in the temperature in the existing personal therapy apparatus to be used in close contact with the skin of the body. That is, the light output of the near-infrared LED can not be increased in order to prevent the image due to the high temperature at the local position of the specific surface of the existing personal treatment apparatus, and thus there is a limitation in the treatment or effect thereof.

In addition, existing personal therapy apparatuses have limitations in efficiently utilizing the light emitted from the near-infrared LED, and there are also limitations in using this personal therapy apparatus in combination with other products.

Thus, there is a need for a personal therapy apparatus including an LED pad, an LED pad manufacturing method, and an LED pad, which can solve various problems caused by the existing personal treatment apparatus.

Disclosure of the Invention The present invention has been devised to solve the above-mentioned problems, and it is an object of the present invention to provide an LED pad, a method of manufacturing an LED pad, and a personal treatment device including an LED pad, by providing flexibility to the LED pad itself, The purpose is to do.

The present invention also relates to an LED pad and an LED pad which can be isolated from exposure to external pollution or external moisture and can solve problems such as short circuit of a circuit in a substrate or a substrate in an LED pad And a personal therapy apparatus including the LED pad.

The present invention also provides an LED pad, a method of manufacturing an LED pad, and a method of manufacturing an LED pad for personal use including an LED pad, wherein the case accommodating the near-infrared LED is integrally joined using silicon to provide high flexibility to the LED pad, The purpose of the present invention is to provide a therapeutic device.

The present invention also relates to a light emitting diode (LED) pad, a light emitting diode (LED) pad, and a light emitting diode (LED) pad for dispersing heat emitted from a near-infrared LED to uniformly maintain the temperature of the LED pad, A manufacturing method thereof, and a personal therapy apparatus including an LED pad.

Another object of the present invention is to provide an LED pad, a method of manufacturing an LED pad, and a personal therapeutic apparatus including an LED pad, which enable efficient use of light emitted from a near-infrared LED and enable convenient use with other products. .

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, unless further departing from the spirit and scope of the invention as defined by the appended claims. It will be possible.

According to another aspect of the present invention, there is provided an LED pad comprising a transparent upper silicon case, a plurality of LEDs, and a flexible substrate on which the plurality of LEDs are mounted, And an LED module located within the silicon case, which is comprised of a combination of a lower silicon case and an upper silicon case.

The flexible substrate of the LED module also includes a reflective layer that reflects light incident through the upper silicon case and is located on the surface of the flexible substrate.

The flexible board of the LED module also includes a heat conductive layer formed on a surface opposite to a surface on which a plurality of LEDs are mounted and the heat dissipated by the plurality of LEDs is dispersed.

The LED module further includes a power connector that supplies power to the plurality of LEDs and is mounted on the flexible board. The power connector supplies power to the plurality of LEDs through the PCB pattern formed on the heat conductive layer, By the thickness of the interface.

The LED pad further includes at least one adhesive pad coupled to the lower silicon case to enable the LED pad to be fixed, wherein the thermally conductive layer is a copper foil, and the combination of the lower silicon case and the upper silicon case comprises a lower silicon case Chemical bonding between the constituent molecules of the upper silicon case, and the plurality of LEDs are LEDs emitting near-infrared rays.

According to another aspect of the present invention, there is provided a method of manufacturing an LED pad, comprising the steps of: (a) mounting an LED module including a plurality of LEDs and a flexible substrate on which the plurality of LEDs are mounted on a lower silicon case; ) Shaping the upper silicon case to engage the lower silicon case along the interface of the lower silicon case with transparent liquid silicone.

The LED module further includes a power connector that supplies power to the plurality of LEDs and is mounted on the flexible board and protrudes from the flexible board by a thickness of the interface, Further comprising the step of adding a material to the power supply port to prevent the entry of clear liquid silicon and removing the added material after step (b).

In accordance with another aspect of the present invention, there is provided a personal therapy apparatus including an LED pad, the apparatus comprising: a lower silicon case and a lower silicon case along an interface between the lower silicon case and the lower silicon case; And an LED module located in a silicon case, which is comprised of a combination of a lower silicon case and an upper silicon case, including a flexible substrate with LEDs mounted thereon, wherein the LED pad and the power supplied to the plurality of LEDs of the LED pad are controlled And the controller interrupts power supply after a specified time elapses after the start of power supply to the plurality of LEDs.

INDUSTRIAL APPLICABILITY The LED pad, the method of manufacturing the LED pad, and the personal treatment apparatus including the LED pad according to the present invention provide flexibility to the LED pad itself, thereby enabling easy adhesion to the body part.

In addition, the personal therapy apparatus including the LED pad, the LED pad manufacturing method, and the LED pad according to the present invention as described above can be isolated from exposure to external pollution or external moisture, and further, And the like can be solved.

Also, according to the present invention, the case for accommodating the near-infrared LED is integrally combined with the case using the silicone to easily disassemble the LED pad, So that it can be provided.

In addition, the personal therapy apparatus including the LED pad, the LED pad manufacturing method, and the LED pad according to the present invention as described above disperses heat emitted from the near-infrared LED to uniformly maintain the temperature of the LED pad, It is possible to prevent an image and increase the light output of the near-infrared LED, thereby maximizing the effect of exposure of near-infrared rays.

In addition, the personal therapy apparatus including the LED pad, the LED pad manufacturing method, and the LED pad according to the present invention as described above can effectively utilize the light emitted from the near-infrared LED and conveniently use it with other products have.

The effects obtained by the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description will be.

1 is a diagram showing an exemplary configuration of a personal treatment apparatus.
2 is a view showing the appearance of the LED pad.
Fig. 3 is an exploded view of components constituting the LED pad.
Fig. 4 is a view showing a manufacturing process flow of an LED pad.
5 is a partial cross-sectional view of an LED pad produced according to the manufacturing process of FIG.

The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, in which: It can be easily carried out. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a diagram showing an exemplary configuration of a personal treatment apparatus.

1 further includes a power adapter 300 including an LED pad 100 and a controller 200 and further for supplying DC power to the controller 200 or the LED pad 100 can do.

The LED pad 100 is connected to the controller 200 and is connected to the LED 122 included in the LED pad 100 using the DC power supplied from the controller 200. [ As shown in FIG.

The LED pad 100 includes an LED module 120 configured to output light of the LED 122 including a plurality of LEDs 122 and a silicon And a silicon case 110 made of a silicon material.

The LED pad 100 is made of a material capable of bending a main part, and can be easily attached to the skin of a user using the personal treatment apparatus. Therefore, the LED pad 100 can be closely attached to various skin parts, .

The LED pad 100 will be described in detail with reference to FIGS. 2 to 3 and FIG. 5. FIG.

The controller 200 is capable of controlling the LED pad 100. The controller 200 can control the power supplied to the LED pad 100, including a case and a microcomputer (or a processor) mounted on the board included in the case. The supplied power is transmitted to the LED pad 100 through a power cable connected between the LED pad 100 and the controller 200 so that the LED 122 of the LED pad 100 can be driven do.

To this end, the microcomputer receives an input of a button (for example, an On / Off button) or a volume switch attached to the case and outputs the DC power received through the power adapter 300 or the DC power received from the DC power source DC power may be supplied to the LED pad 100 or the amount of light of the LED 122 may be increased or decreased according to the adjustment of the volume switch.

In order to prevent overexposure of the LED 122 light to the skin, the microcomputer may include an internal timer in hardware or software to drive the timer after the start of transmission of the DC power, The supply of DC power is stopped. The designated time can be fixed by the microcomputer at all times (for example, 30 minutes, etc.) or by a button or a dip switch attached on the case.

The supply and the interruption of the DC power may be performed by using a switch such as a transistor mounted on a board included in the controller 200. [

The power adapter 300 is connected to a power outlet and converts the AC power to DC power to be used for the controller 200 or the LED pad 100 and supplies the converted DC power to the controller 200 through the power cable.

The DC power thus converted may be used to drive the LED 122 of the LED pad 100 or to drive the microcomputer of the controller 200 and may be a power source of a specific power level between 12 volts and 24 volts, for example. have.

The LED pad 100 can be used independently and directly in close contact with the skin or the like of the body. Alternatively, the LED pad 100 may be secured to a belt configured to be secured to a particular body part (e.g., using a so-called Fastner). Such a belt may be fixed to, for example, a waist, an ankle, a cuff, a thigh or the like, and the LED pad 100 fixed to the belt may be in direct contact with a specific body part so as to emit near- do.

2 is a view showing the appearance of the LED pad 100. As shown in Fig.

Referring to FIG. 2, the LED pad 100 protects the internal components, isolates and protects the LED pad 100 from contaminants or moisture, As shown in Fig.

The case (see FIG. 2 (a)) which is in direct contact with the body part of the LED pad 100 is made of transparent silicone so that the light transmittance can be increased and the case (see FIG. 2 Is made of transparent or colored silicon.

Of course, the front case is made transparent so that light can be transmitted in both directions between the LED pad 100 and the body part that the LED pad 100 touches.

On the other hand, two or more adhesive pads 130 are bonded to the rear case in a case (see Fig. 2 (b)) of the rear surface of the LED pad 100. [ Such an adhesive pad 130 may be a so-called fastener tape. The number of the adhesive pads 130 and the bonding position of the adhesive pad 130 on the rear surface of the LED pad 100 may be determined depending on the size of the LED pad 100 or the shape of the belt on which the LED pad 100 is fixed May be one or more than two and may be located in various positions.

2, the LED pad 100 includes an LED module 120 including a plurality of LEDs 122, and the LED module 120 is integrally formed on the outside of the LED module 120 And is configured to be completely shielded from the outside and protected inside the silicon case 110 by the silicon case 110 coupled to the silicon case 110. Thereby being protected from the influx of external contaminants.

2B), a power connector groove 112-1 is formed. The power connector groove 112-1 is connected to a power connector (not shown) for connecting to a plug of an external power cable 123).

3 is an exploded view of the constituent elements of the LED pad 100. As shown in FIG. 3, the LED pad 100 includes a lower silicon case 112 (see FIG. 3A) constituting the silicon case 110 and a lower silicon case 112 A silicon case 110 which is chemically bonded to the upper silicon case 111 and the upper silicon case 111 (see FIG. 3 (c)) and which is composed of a combination of the upper silicon case 111 and the lower silicon case 112, And the LED module 120 is located at a predetermined position.

The lower silicon case 112 is made of a material (for example, silicone rubber) having a transparent or colored (for example, white) component added thereto and is formed by injection molding or the like, An interface 112-2 protruding through the outer periphery of the lower silicon case 112 so as to be able to receive the LED module 120 in combination with the silicon case 111 and the interface 112-2 between the interface 112-2 and the lower silicon case 112 And an LED module accommodating space 112-3 formed by the inner bottom surface of the LED module accommodating space 112-3. The lower silicon case 112 may be previously formed.

The LED module 120 includes a flexible PCB 121, a plurality of LEDs 122 mounted on or mounted on the flexible substrate 121, a power connector (not shown) mounted or mounted on the flexible substrate 121 123 and is configured to be located in the silicon case 110 formed by the combination of the upper silicon case 111 and the lower silicon case 112 (preferably chemical bonding by the same constituent molecules).

Here, the flexible substrate 121 includes a heat conductive layer 121-2 facing the inner bottom surface of the lower silicon case 112, And a reflective layer 121-1 located on the surface of the flexible substrate 121 opposite to the layer 121-2 and facing the upper silicon case 111. The flexible substrate 121 has a plurality of LEDs 122 may be mounted through SMT (Surface Mounting Technology) or the like. Accordingly, the heat conduction layer 121-2 is formed on the surface opposite to the surface on which the plurality of LEDs 122 are mounted.

Here, the heat conduction layer 121-2 is configured to disperse heat dissipated as each of the plurality of LEDs 122 emits light according to a power input. The heat conduction layer 121-2 is formed of a conductive silver Copper, aluminum, and the like, and may be a copper foil used for patterning the PCB of the flexible substrate 121. Alternatively, the thermally conductive layer 121-2 may be separately attached to the flexible substrate 121. In this case, the thermally conductive layer 121-2 may be insulated from the copper foil or the like due to PCB patterning of the flexible substrate 121 Lt; / RTI >

The copper foil can transmit an electrical signal, and a PCB pattern for transmitting an electrical signal on the copper foil can also be formed. The heat conduction layer 121-2 may also include a PCB pattern for transferring a power supply signal supplied from the power supply connector 123 to each of the plurality of LEDs 122 or one LED 122. [

And a copper foil (copper foil remaining unremoved from the flexible substrate 121) or a copper foil to be separately attached, other than the PCB pattern for transferring an electric signal, is used for dispersing heat according to the present invention. And a copper foil portion (or a copper foil attached separately) for dissipating the remaining heat without being removed from the flexible board 121 and a copper foil portion of the PCB pattern (which portion can also serve as heat dissipation) .

This heat conductive layer 121-2 disperses the heat caused by the light emission by each of the LEDs 122 due to the metal characteristics to the vicinity of the position of the LEDs 122 thereby lowering the temperature at the LEDs 122, Thereby allowing the pad 100 to maintain a uniform temperature.

The heat conductive layer 121-2 is formed on the flexible substrate 121 of the LED pad 100 to lower the temperature at the position of the LED 122 due to the light emission of the LED 122, (For example, a power supply level input from the power supply connector 123 is increased or a current is set higher) can be emitted to the skin to be adhered so that the temperature around the skin 122 can be kept constant Furthermore, it is possible to prevent localized images on the skin, thereby maximizing the effect of near-infrared rays and the like.

The portion of the metal (copper foil) exclusively used for dispersing the heat of the heat conduction layer 121-2 is at least equal to the area area of at least two LEDs 122 mounted on the flexible substrate 121, 122). ≪ / RTI > For example, in the case where two LEDs 122 are arranged at 1 cm intervals, and the size of each LED 122 is 0.5 cm * 0.5 cm, the heat conduction layer 121-2 for dispersion of heat is at least 1.5 cm * 0.5 cm or more so as to disperse the heat between the LEDs 122 around and maintain the temperature constant.

A dedicated metal portion for dispersing the heat of the heat conduction layer 121-2 is preferably a metal pattern that is formed on the entire surface of the flexible substrate 121 except for the PCB pattern that may include the heat conduction layer 121-2 and the insulating portion of the PCB pattern. Lt; / RTI > region.

The reflection layer 121-1 is formed on the surface opposite to the thermally conductive layer 121-2 on the flexible substrate 121. The reflection layer 121-1 is made incident through the transparent upper silicon case 111 And is positioned on the surface of the flexible substrate 121 on the upper silicon case 111 side.

The reflective layer 121-1 may be, for example, a white film having high reflectance of light or a white paint (or ink). Accordingly, such a white film may be adhered to the surface of the flexible substrate 121 or a white paint (or ink) may be applied to the surface of the flexible substrate 121. The reflective layer 121-1 is formed on the surface of the flexible substrate 121 at least at positions where the LEDs 122 are mounted.

Due to the reflective layer 121-1, the near-infrared light emitted through the LED 122 is reflected again without loss, so that the near-infrared light can be utilized very efficiently.

The heat conductive layer 121-2 and the reflective layer 121-1 formed on the flexible substrate 121 as described above can increase the output of the near infrared light and efficiently utilize the light. Accordingly, it is possible to maximize the utilization of the near-infrared ray light with the same power consumption and the higher near-infrared ray light output, thereby maximizing the therapeutic effect and the cosmetic effect according to the near-infrared ray.

The plurality of LEDs 122 included in the LED module 120 and mounted on the flexible substrate 121 are LEDs 122 for emitting (or outputting) light of a designated wavelength band, for example, LED package.

The LED 122 is an LED package that emits light in a wavelength band such as near-infrared light, visible light, ultraviolet light, and the like, and preferably emits near-infrared light.

The plurality of LEDs 122 are mounted on the flexible substrate 121 at regular intervals, as can be seen in FIG. 3 (b).

The power supply connector 123 included in the LED module 120 is mounted on the flexible substrate 121 and supplies power to the plurality of LEDs 122. The power connector 123 includes a power connector that is opened (or opened) to receive a plug of the power cable and a contact point for coupling with the plug through the power connector, The power is supplied to the plurality of LEDs 122 through the heat conduction layer 121-2 or the PCB pattern formed separately.

The power connector 123 may be a connector of a standardized standard and may be a connector defined in a universal serial bus (USB), for example, for transmitting and receiving power and data. For example, mini) USB connector.

The power connector 123 is protruded from the boundary of the flexible substrate 121 and is preferably protruded by the thickness of the interface 112-2 formed in the lower silicon case 112 Respectively. The power source connector 123 and the silicon case 110 can be integrally combined and facilitate the coupling of the LED module 120 including the power source connector 123 and the lower silicon case 112. [

Referring again to FIG. 3, FIG. 3 (c) shows the upper silicon case 111.

The upper silicon case 111 is formed through injection molding or the like using transparent liquid silicone and is chemically bonded to the lower silicon case 112. The upper silicon case 111 is configured to protect components (for example, the LED 122 and the flexible substrate 121) of the LED module 120 from an external impact due to warping of the LED pad 100 or the like The transparent liquid silicon is filled along the boundary of the parts.

The upper silicon case 111 is chemically combined with constituent molecules of the lower silicon case 112 along the lower silicon case 112 including the same constituent molecules and the interface 112-2 to integrally form a silicon case 110). The upper silicon case 111 is configured to be transparent for transmission of light.

The upper silicon case 111 and the lower silicon case 112 are integrally joined together to maximize the flexibility of the LED pad 100 together with the flexible substrate 121 of the LED module 120, 120 are themselves isolated by the silicone case 110, thereby protecting the LED module 120 from various kinds of contamination and moisture, and further, it is possible to reduce problems such as short-circuiting and opening of the LED module 120 through an external impact or the like.

The upper silicon case 111 is formed in a shape of a lower silicon case 112 on which the LED module 120 is mounted through injection molding using a mold machine. Let's take a closer look.

Fig. 4 is a view showing a manufacturing process flow of the LED pad 100. Fig.

In order to fabricate the LED pad 100, the LED module 120 is prepared in step S110. The preparing step of the LED module 120 includes preparing a flexible substrate 121 including a heat conduction layer 121-2 and a reflective layer 121-1 and forming a circuit, The power connector 122 and the power connector 123 may be mounted.

The power supply connector 123 included in the LED module 120 may include various holes or the like depending on the shape and structure of the power supply connector or the power supply connector 123 that is opened to the outside in order to accommodate the plug of the power supply cable The power connection or various holes need to be prevented from entering the transparent liquid silicon through injection molding or the like. If the silicon is introduced into a power supply connection or a hole, the function of the power supply connector 123 can not be exerted and the quality of the product may be deteriorated.

To this end, in step 120, a specific material is added to the power connection or other open portion (hole, etc.) of the power connector 123 to prevent transparent liquid silicon from entering or penetrating into the power connector 123.

For example, it is possible to insert or adhere a high-viscosity silicone or adhesive tape or a specific material for preventing inflow to the hole or the like so as to prevent the inflow of transparent liquid silicone when forming into this hole, It is possible to insert transparent liquid silicon into the power connection port by inserting a metallic material (for example, a brass-type base) or a transparent liquid silicone in the form of a plug of the power cable in advance.

Thereafter, in step S130, the power source connector groove 112-1 and the LED module accommodation space 112-3 are formed in a transparent or colored (for example, white or orange, or the like) The LED module 120 is mounted. The LED module 120 includes a plurality of LEDs 122, a power connector 123, and a flexible board 121 on which the plurality of LEDs 122 and the power connector 123 are mounted. This mounting process can be easily carried out using the power supply connector 123 protruded from the boundary of the flexible substrate 121 by the thickness of the interface surface 112-2 of the lower silicon case 112. [

Step S130 may be performed on a mold for injection molding or the like.

In step 140, transparent liquid silicon is injected into the lower silicon case 112 on which the LED module 120 is mounted to mold the upper silicon case 111.

The lower silicon case 112 is also made of a silicon material, and the upper silicon case 111 is also made of a silicon material. In this step S140, the portions (e.g., interface 112-2) of the lower silicon case 112 exposed to the transparent liquid silicon are chemically bonded using the same constituent molecules as the transparent liquid silicon, Thereby forming a silicon case 110 which is not easily separated.

Thus, step S140 may be performed to chemically bond the transparent liquid silicon along the interface 112-2 of the lower infrared silicone case 112, Transparent liquid silicone is injected into the plurality of LEDs 122 to serve as a filler or a buffering agent capable of alleviating the external impact.

Then, in step S140, the transparent liquid silicone is formed through a curing operation or the like, and the LED module 120 inside is completely isolated from the outside and sealed.

Thereafter, in step S150, when the molding is completed through the completion of the curing operation through the mold, the material added to the power connection part is removed, thereby completing the fabrication of the LED pad 100. [

Here, the material added to the holes of the power supply connector may not be removed depending on the characteristics of the added material.

The LED pad 100 manufactured as described above is constructed such that the silicon case 110 can completely protect the entire LED module 120 from the outside and can form the silicon case 110 by the chemical bonding action, The LED pad 100 having various advantages can be provided to the user.

FIG. 5 is a partial cross-sectional view of the LED pad 100 produced according to the manufacturing process of FIG. This sectional view is a cross-sectional view taken along the line A-A in FIG. 2 and is formed by cutting the front surface of the upper silicon case 111 in the rear direction of the lower silicon case 112.

As can be seen from FIG. 5, the lower silicon case 112 (see FIG. 5), which extends from the interface 112-2 of the lower silicon case 112 to the interface 112-2 to form the LED module accommodating space 112-3, Is exposed to the transparent liquid silicon at the time of molding through the mold and is chemically bonded with the liquid silicone so that the silicon on the outer side of the LED module 120 forms one case.

Also the space between the LED 122 on the flexible substrate 121 and the LED 122 or between the interface 112-2 is filled with liquid silicone so that it can function as a filler or buffer.

Accordingly, it is possible to maximize the flexibility of the LED pad 100, prevent external contamination, alleviate impact, and provide a robust personal treatment apparatus.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. The present invention is not limited to the drawings.

100: LED pad
110: Silicone case
111: upper silicon case 112: lower silicon case
112-1: Power connector groove 112-2: Interface
112-3: LED module accommodation space
120: LED module
121: Flexible substrate
121-1: reflective layer 121-2: thermally conductive layer
122: LED 123: Power connector
130: Adhesive pad
200: controller 300: power adapter

Claims (8)

A lower silicon case;
A transparent upper silicon case coupled to the lower silicon case along an interface of the lower silicon case; And
And an LED module located in a silicon case including a combination of the lower silicon case and the upper silicon case including a plurality of LEDs and a flexible substrate on which the plurality of LEDs are mounted.
LED pads. The method according to claim 1,
Wherein the flexible substrate of the LED module comprises a reflective layer that reflects light incident through the upper silicon case and is positioned on a surface of the flexible substrate,
LED pads. The method according to claim 1,
Wherein the flexible substrate of the LED module includes a heat conductive layer formed on a surface opposite to a surface on which the plurality of LEDs are mounted and the heat dissipated by the plurality of LEDs is dispersed,
LED pads. The method of claim 3,
Wherein the LED module further comprises a power connector for supplying power to the plurality of LEDs and mounted on the flexible board,
Wherein the power supply connector supplies power to the plurality of LEDs through a PCB pattern formed on the thermally conductive layer and is mounted on the flexible substrate by a thickness of the interface,
LED pads. The method of claim 3,
Further comprising one or more adhesive pads coupled to the lower silicon case to enable the LED pads to be secured,
Wherein the thermally conductive layer is a copper foil,
The combination of the lower silicon case and the upper silicon case is a chemical bond between constituent molecules of the lower silicon case and the upper silicon case,
Wherein the plurality of LEDs are LEDs that emit near-
LED pads. A method of manufacturing an LED pad,
(a) mounting an LED module on a lower silicon case, the LED module including a plurality of LEDs and a flexible substrate on which the plurality of LEDs are mounted; And
(b) molding the upper silicon case to engage the lower silicon case along the interface of the lower silicon case with transparent liquid silicone.
LED pad manufacturing method. The method according to claim 6,
Wherein the LED module further comprises a power supply connector that supplies power to the plurality of LEDs and is mounted on the flexible substrate and protrudes from the flexible substrate by a thickness of the interface,
The LED pad manufacturing method includes the steps of: adding a material for preventing the inflow of the transparent liquid silicon to the power connector of the power connector before step (a); And removing the added material after step (b).
LED pad manufacturing method. A personal therapy apparatus comprising an LED pad,
An LED pad according to claim 1; And
And a controller for controlling power supplied to a plurality of LEDs of the LED pad,
The controller stops the power supply at a predetermined time after the start of power supply to the plurality of LEDs,
Personal therapy devices.

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