KR20150050360A - Fingerprint sensor package and portable electronic device having the same - Google Patents

Abstract

The present invention relates to a fingerprint sensor package and a portable electronic device having the same, wherein the sensing sensitivity of the fingerprint sensor package can be improved and the fingerprint sensor package can be miniaturized. The fingerprint sensor package according to an embodiment of the present invention comprises: a base substrate; a fingerprint sensor; a cover layer; and a bump, wherein the fingerprint sensor is arranged on top of the base substrate to sense a fingerprint, the cover layer is arranged above the base substrate and the fingerprint sensor, and the bump is electrically connected to the fingerprint sensor, transmits driving signals for sensing a fingerprint and is arranged on top of the surface of the fingerprint sensor.

Description

[0001] FINGERPRINT SENSOR PACKAGE AND PORTABLE ELECTRONIC DEVICE HAVING THE SAME [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a fingerprint sensor package and a portable electronic device having the fingerprint sensor package. More particularly, the present invention relates to a fingerprint sensor package and a portable electronic device having the same.

Background Art [0002] A fingerprint sensor is a sensor for detecting fingerprints of a human being and is widely used as a means for enhancing security in portable electronic devices such as a mobile terminal and a tablet PC. That is, the user is registered and authenticated through the fingerprint sensor, thereby protecting the data stored in the portable electronic device and preventing the security accident in advance.

In recent years, fingerprint sensors have been increasingly required as an input device technology. For example, in a portable electronic device, a navigation function for performing operation of a pointer such as a cursor is integrated into a fingerprint sensor. Is called a biometric track pad (BTP). In addition, a switching function that receives information from a user may be incorporated into the fingerprint sensor.

Hereinafter, a configuration of a conventional portable electronic device (smart phone) equipped with a biometric trackpad will be described with reference to the drawings.

FIG. 1 is a schematic view illustrating a conventional portable electronic device equipped with a biometric trackpad, and FIG. 2 is a cross-sectional view illustrating a conventional biometric trackpad. Referring to FIG.

1 and 2, the portable electronic device 100 includes a display unit 110 having a touch screen function, a display unit 110, and a display unit 110. The display unit 110 forms a front surface of the portable electronic device 100 A cover glass 120, and a biometric trackpad 130.

The biometric trackpad 130 has a fingerprint sensor 133 provided on the substrate 131 and covered with an encapsulating material 132. The fingerprint sensor 133 may be electrically connected to the substrate 131 by a bonding wire 134. The fingerprint sensor 133 detects the fingerprint of the user or detects the finger movement of the user so that the pointer can be operated.

A protective layer 135 made of a glass material may be provided on the encapsulation material 132 and a bezel 136 may be provided on the edge of the biometrics trackpad 130. The bezel 136 has a function of dividing a sensing area capable of sensing a fingerprint through the fingerprint sensor 133 and a driving signal for detecting the fingerprint by using the subject As shown in Fig. For this purpose, the conventional bezel 136 is formed of a metal such as stainless steel.

Accordingly, the conventional portable electronic device having the biometric trackpad has the following problems.

First, the shape and the color implementation of the bezel 136 were limited, and the processing cost was high. For example, the conventional bezel 136 is typically implemented in silver color as a rounded square with a rounded corner, and a number of additional processes are required to achieve a shape or color other than that, and a process for attaching the bezel 136 is also required As a result, process time and cost have increased. As a result, there is a problem that the design of the portable electronic device 100 becomes coarse or the overall manufacturing cost rises.

Since the bezel 136 is provided at the edge of the biometric trackpad 130, the distance between the bezel 136 and the sensing area where the fingerprint is sensed through the fingerprint sensor 133 is separated. Therefore, there is a limit to improve the fingerprint sensing performance without increasing the driving signal through the bezel 136. [ Further, since the bezel 136 is provided separately on the outer side of the sealing material 132, there is a problem that the entire size of the biometrical track pad 130 is increased.

This problem does not occur only in the case of the biometric trackpad but is common in the fingerprint sensor package provided with the bezel.

SUMMARY OF THE INVENTION The present invention provides a fingerprint sensor package having improved sensing sensitivity and miniaturization, and a portable electronic device having the fingerprint sensor package.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a base substrate; A fingerprint sensor provided on the base substrate to detect a fingerprint; A cover layer provided on the base substrate and the fingerprint sensor; And a bump electrically connected to the fingerprint sensor and transmitting a drive signal for sensing a fingerprint, wherein the bump is provided on a surface of the fingerprint sensor.

In one embodiment of the present invention, the cover layer may have a conductive portion located on the top of the bump and electrically connected to the bump.

In one embodiment of the present invention, the conductive portion may include a conductive coating layer provided on a rim of the cover layer.

In one embodiment of the present invention, the bump may be electrically connected to a bonding pad on the surface of the fingerprint sensor.

In an embodiment of the present invention, an encapsulating material may be filled between the base substrate and the cover layer, and the bump may be surrounded by the encapsulating material.

In an embodiment of the present invention, the bumps may be spaced apart from the sensing unit on the surface of the fingerprint sensor, and may be provided on both sides of the fingerprint sensor in the width direction of the fingerprint sensor.

In one embodiment of the present invention, the bumps may be provided at regular intervals along the longitudinal direction of the line portions provided on the edge of the fingerprint sensor on the surface of the fingerprint sensor and electrically connected to the bonding pads on the fingerprint sensor have.

In an embodiment of the present invention, the fingerprint sensor may be a biometric trackpad (BTP) having a fingerprint sensing function and a pointer manipulation function.

According to another aspect of the present invention, there is provided a portable electronic device including the fingerprint sensor package.

According to an embodiment of the present invention, a sensing unit for fingerprint sensing and a bump for sending a driving signal are provided on the surface of the fingerprint sensor, so that a sensing area and a dispensing area where fingerprint sensing is performed on the fingerprint sensor are simultaneously implemented . As described above, since the sensing area and the transmitting area are formed close to each other, the driving signal sending operation can be further improved, and the sensing sensitivity can be improved.

Further, according to an embodiment of the present invention, a bezel of a conventional fingerprint sensor package is not required by transmitting a driving signal from a bump. Therefore, the volume of the bezel of the conventional fingerprint sensor package can be reduced, thereby enabling miniaturization of the fingerprint sensor package and cost reduction. Further, since the bezel is unnecessary, the process can be simplified.

Further, according to the embodiment of the present invention, since the conductive portion electrically connected to the bump is provided widely in the cover layer, the range of the drive signal transmitted from the bump can be broadened.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view illustrating a conventional portable electronic device equipped with a biometric trackpad. FIG.
2 is a cross-sectional view illustrating a conventional biometric trackpad.
3 is a cross-sectional view illustrating a fingerprint sensor package according to an embodiment of the present invention.
4 is an enlarged view of a portion 'A' in FIG.
5 is a plan view illustrating a fingerprint sensor package according to an embodiment of the present invention.
6 is an enlarged view mainly showing the fingerprint sensor and the bump in the portion 'B' in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a cross-sectional view illustrating a fingerprint sensor package according to an embodiment of the present invention. FIG. 4 is an enlarged view of a portion 'A' And FIG. 6 is an enlarged view mainly showing the fingerprint sensor and the bump in the portion 'B' in FIG.

3 to 6, a fingerprint sensor package 10 according to an embodiment of the present invention includes a base substrate 20, a fingerprint sensor 30, a cover layer 40, and a bump 50 Lt; / RTI >

Here, the fingerprint sensor 30 may be provided on the base substrate 20 to sense a fingerprint. The cover layer 40 may be provided on the base substrate 20 and the fingerprint sensor 30.

 The bump 50 is electrically connected to the fingerprint sensor 30 and can transmit a drive signal for fingerprint detection. Further, the bump 50 may be provided on the surface of the fingerprint sensor 30. Accordingly, the sensing area 90 for sensing the fingerprint and the dispensing area 91 for transmitting the driving signal for sensing the fingerprint can be formed on the fingerprint sensor 30, thereby improving the sensing performance . In addition, since a separate bezel is unnecessary as in the prior art, the process can be simplified, and the cost and size can be reduced.

In detail, a " fingerprint sensor package " according to an embodiment of the present invention refers to an electronic device part having a fingerprint sensor. If the fingerprint sensor package is capable of sending a driving signal for sensing a fingerprint and receiving a sensing signal from a finger Should be interpreted as including.

The fingerprint sensor package 10 may be provided in a portable electronic device. Here, the portable electronic device includes a portable phone, a smart phone, a PDA, a tablet PC, a notebook computer, a portable sound recorder (MP3 player), and the like.

The base substrate 20 is a substrate on which a fingerprint sensor 30 or the like is mounted and on which electric signal information is transmitted. The base substrate 20 may be, for example, a printed circuit board (PCB). Although not shown, a lead frame may be attached to the lower portion of the base substrate 20 by resin injection or surface mounting technology (SMT).

The base substrate 20 is provided with a connection pad 21, and a plurality of connection pads 21 may be provided.

The fingerprint sensor 30 includes a main body 31, a sensing unit 32 provided on the upper surface of the main body 31, and a bonding pad 33.

The sensing unit 32 may be provided at a central portion of the main body 31 and may have a sensing area in which pixels are arrayed. The sensing unit 32 can find the difference in capacitance due to the height difference of the fingerprint of the finger according to the shape of the mountain and the valley of the finger and can scan the image of the fingerprint as the finger moves to produce a fingerprint image .

The bonding pad 33 may be spaced apart from the sensing unit 32. The bonding pads 33 may be provided along the edges of the main body 31, and a plurality of bonding pads 33 may be provided. The bonding pads 33 may be electrically connected to the connection pads 21 on the base substrate 20 by the bonding wires 22 but are not limited to such connection methods. Further, the bonding wire 22 may be, for example, a gold wire, but is not limited to such a material.

The fingerprint sensor 30 is provided on the base substrate 20 to detect the fingerprint. The fingerprint sensor 30 may be a biometric trackpad (BTP) having both a fingerprint sensing function and a pointer manipulation function.

In addition, the fingerprint sensor 30 may include a pointer manipulation function for sensing an input signal or static electricity according to whether a user's finger, which is a subject, is approaching or moving, and moving a pointer such as a cursor based on the movement.

In addition, the fingerprint sensor 30 may include an input function for receiving information or commands desired by the user. For example, the fingerprint sensor 30 may be provided with a dome switch or the like, which is used to select a pointed menu or an icon, either integrally or separately.

The fingerprint sensor 30 basically has a fingerprint detection function. For this purpose, the fingerprint sensor 30 may store information on the characteristic points of the fingerprint (e.g., the areas where the fingerprint is divided, such as the 'Y' point), and compare the characteristic points to detect whether the fingerprint matches have. In this case, the time taken to detect the fingerprint can be shortened, and the miniaturization can be achieved through the simplification of the processor, so that the mountability to the electromagnetic can be improved.

The fingerprint sensor 30 may be mounted on the base substrate 20 by, for example, epoxy bonding.

The bump 50 may be provided on the surface of the fingerprint sensor 30, specifically on the surface of the main body 31 of the fingerprint sensor 30. [

A line portion 60 may be provided between the sensing portion 32 and the bonding pad 33 on the surface of the main body 31 of the fingerprint sensor 30. The line portion 60 may be provided between the fingerprint sensor 30 In the width direction. The line portion 60 may be electrically connected to the bonding pad 33. For example, one end of the line portion 60 may be connected to one of the bonding pads 33a. The line portion 60 may be a redistribution layer (RDL).

The bumps 50 may be provided at regular intervals in the line portions 60 along the longitudinal direction of the line portions 60 and may be electrically connected to the line portions 60. Through this, the bump 50 can be electrically connected to the bonding pad 33a. The bump 50 may be electrically connected to the fingerprint sensor 30 to transmit a driving signal for sensing the fingerprint. That is, the bump 50 can function as an antenna for transmitting a driving signal to the side of the user's finger, which is a subject.

The bumps 50 may be provided on both sides of the main body 31 of the fingerprint sensor 30 in the width direction on the surface of the main body 31 of the fingerprint sensor 30 and spaced apart from the sensing portion 32 . Accordingly, a sensing area 90 in which fingerprint sensing is performed through the sensing part 32 and a transmission area 91 in which a driving signal is transmitted through the bump 50 can be implemented simultaneously in the fingerprint sensor 30 . As described above, since the sensing area 90 and the dispensing area 91 are formed close to each other, the driving signal sending operation can be further improved, and the sensing sensitivity can be improved.

In addition, the bezel of the conventional fingerprint sensor package is not required by transmitting the driving signal from the bump 50. [ Accordingly, the volume of the conventional fingerprint sensor package can be reduced as much as that of the bezel of the fingerprint sensor package, thereby making it possible to miniaturize the fingerprint sensor package 10 and to achieve a CSP (chip scale package). Further, since the bezel is unnecessary, the cost can be reduced and the process can be simplified.

The cover layer 40 may be provided on the base substrate 20 and the fingerprint sensor 30. Between the base substrate 20 and the cover layer 40, an encapsulant 70 may be filled. Accordingly, the bump 50 can be surrounded by the sealing material 70, and the bonding wire 22 can be covered with the sealing material 70 and fixed. The sealing material 70 may be an epoxy molding compound (EMC).

The cover layer 40 may be provided on the top of the sealing material 70.

The cover layer 40 may be a coating layer, and the cover layer 40 may have a conductive portion 41. The conductive part 41 may include a conductive coating layer. Here, the material of the conductive coating layer is not particularly limited.

The conductive portion 41 may be located on the top of the bump 50 and may be in electrical contact with the bump 50 by being in close contact with the bump 50. The conductive portions 41 may be provided at both ends in the longitudinal direction of the cover layer 40 in the width direction so that the conductive portions 41 can be positioned above the bumps 50. [ The conductive portion 41 is electrically connected to the bump 50 so that the drive signal sent out from the bump 50 can be sent to the outside of the fingerprint sensor package 10. [ Since the conductive portions 41 are formed to be wide at both ends of the cover layer 40, the range of delivery of the drive signal transmitted from the bumps can be wide.

The upper surface of the conductive portion 41 in the cover layer 40 and the upper surface of the cover portion 42 formed between the conductive portion 41 and located above the sensing portion 32 of the fingerprint sensor 30 are the same Or may be formed to have a height difference. If the upper surface of the conductive part 41 is formed higher than the upper surface of the cover part 42, it can help the user to recognize the area where the fingerprint sensor package 10 is located in the portable electronic device.

The cover part 42 may be provided at a position corresponding to the sensing part 32 of the fingerprint sensor 30 and the conductive part 41 may be provided at the body 31 of the fingerprint sensor 30, And the upper portion of the sealing material 70 on the base substrate 20. The boundary between the sensing region 90 and the dispensing region 91 is formed at the boundary portion between the cover portion 42 and the conductive portion 41, that is, at both ends in the longitudinal direction of the sensing portion 32 of the fingerprint sensor 30 .

In addition, the cover layer 40 may be patterned with a hairline. The hairline is in the form of a thin solid line that can provide the user with a luxurious aesthetics or provide the user with the feeling that their fingers are aware of their presence when they contact the cover layer 40. [

The cover layer 40 may be a glass substrate. In this case, the conductive portion 41 may be formed by providing a conductive coating layer on at least one surface of the glass substrate. When the cover layer 40 is formed of a glass substrate, the cover layer 40 may be integrally formed with the cover glass of the portable electronic device. Accordingly, it is possible to form the entire front surface of the portable electronic device with the cover glass, which is advantageous from the viewpoint of design, and the cost can also be reduced.

When the cover layer 40 is formed of a cover glass of a portable electronic device, a hair line can be formed on all or a part of the cover layer 40, which can help the user to recognize the position of the fingerprint sensor.

The cover layer 40 may be in the form of powder and may be provided on the sealing material 70 by a method such as injection molding.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: fingerprint sensor package
20: base substrate
30: Fingerprint sensor
33, 33a: bonding pad
40: Cover layer
41:
50: Bump
60: Line section
70: sealing material
90: detection area
91: transmission area

Claims (9)

A base substrate;
A fingerprint sensor provided on the base substrate to detect a fingerprint;
A cover layer provided on the base substrate and the fingerprint sensor; And
And a bump electrically connected to the fingerprint sensor and transmitting a drive signal for fingerprint detection,
Wherein the bumps are provided on a surface of the fingerprint sensor. The method according to claim 1,
Wherein the cover layer has a conductive portion located on the top of the bump and electrically connected to the bump. 3. The method of claim 2,
Wherein the conductive portion includes a conductive coating layer provided on an edge of the cover layer. The method according to claim 1,
Wherein the bump is electrically connected to a bonding pad on a surface of the fingerprint sensor. The method according to claim 1,
Wherein an encapsulating material is filled between the base substrate and the cover layer, and the bump is surrounded by the encapsulating material. The method according to claim 1,
Wherein the bumps are spaced apart from a sensing portion on the surface of the fingerprint sensor and are provided on both sides of the fingerprint sensor in a width direction of the fingerprint sensor. The method according to claim 1,
Wherein the bumps are provided at regular intervals along a longitudinal direction of a line portion provided on an edge of the fingerprint sensor on a surface of the fingerprint sensor and electrically connected to bonding pads on a surface of the fingerprint sensor. The method according to claim 1,
Wherein the fingerprint sensor is a biometric trackpad (BTP) having a fingerprint sensing function and a pointer manipulation function. A portable electronic device comprising a fingerprint sensor package according to any one of claims 1 to 8.

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