KR20150035114A - Substrate for RGB LED chip and method of fabricating RGB LED package - Google Patents

Substrate for RGB LED chip and method of fabricating RGB LED package Download PDF

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Publication number
KR20150035114A
KR20150035114A KR20130115322A KR20130115322A KR20150035114A KR 20150035114 A KR20150035114 A KR 20150035114A KR 20130115322 A KR20130115322 A KR 20130115322A KR 20130115322 A KR20130115322 A KR 20130115322A KR 20150035114 A KR20150035114 A KR 20150035114A
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South Korea
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light emitting
emitting diode
electrode pattern
diode chip
current amount
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KR20130115322A
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Korean (ko)
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인치현
김상민
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서울바이오시스 주식회사
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Priority to KR20130115322A priority Critical patent/KR20150035114A/en
Publication of KR20150035114A publication Critical patent/KR20150035114A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

A substrate for an RGB LED chip includes a substrate body, a first electrode pattern which is arranged on the substrate body and is connected to one electrode pad of the RGB LED chip, a second electrode pattern which is arranged on the substrate body and is connected to the other electrode part of the RGB LED chip, and a current level control region which is arranged on one of the first electrode pattern and the second electrode pattern and locally limits the current migration to the RGB LED chip.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate for an RGB light emitting diode chip, and a method of manufacturing a RGB light emitting diode package using the substrate.

The present invention relates to a substrate for an RGB light emitting diode chip and a method of manufacturing an RGB light emitting diode package using the same.

BACKGROUND OF THE INVENTION [0002] Light emitting diodes (LEDs) having low power consumption and longer lifetime are widely used as light sources for various lighting apparatuses. Such a light emitting diode is widely used as a light source for a large display device such as a thin light unit for a mobile phone or a liquid crystal display, and for illumination. A light emitting diode element is an element that converts electric energy into light energy to generate light, and generally comprises an active layer having a heterojunction structure of a p-type semiconductor and an n-type semiconductor and emitting various light. The light emitting diode is typically used in the form of a light emitting diode package in which the light emitting diode chip is mounted on a substrate such as a printed circuit board (PCB) or a submount including a wiring layer and an insulating layer.

One of them is a method of mounting an RGB light emitting diode chip on a substrate having an electrode pattern. Here, the RGB light emitting diode chip is a red (R) light emitting diode chip, A green (G) light emitting diode chip, and a blue (B) light emitting diode chip. That is, a red (R) light emitting diode chip, a green (G) light emitting diode chip, and a blue (B) light emitting diode chip are mounted on one substrate to emit white light in which mixed light emitted from each light emitting diode chip is mixed . In this case, each of the light emitting diode chips share an electrode of the substrate, and it is therefore difficult to individually adjust the amount of current supplied to each light emitting diode chip. Therefore, after the RGB light emitting diode chip is mounted on the substrate, it is impossible to control the color coordinates and change the directing angle without replacing the RGB light emitting diode chip.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate for an RGB light emitting diode chip which can adjust the color coordinates of emitted light and change the directivity angle even after mounting an RGB light emitting diode chip on a substrate.

Another object of the present invention is to provide a method of manufacturing an RGB light emitting diode package using such a substrate.

A substrate for an RGB light emitting diode chip according to an exemplary embodiment includes a substrate body, a first electrode pattern disposed on the substrate body and connected to one electrode pad of the RGB light emitting diode chip, A second electrode pattern connected to the electrode pad, and a current amount control region disposed in at least one of the first electrode pattern and the second electrode pattern to locally restrict current movement to the RGB light emitting diode chip.

A method of manufacturing an RGB light emitting diode package according to an exemplary embodiment includes disposing a substrate body, a first electrode pattern and a second electrode pattern disposed on a substrate body, and at least one of a first electrode pattern and a second electrode pattern Preparing a substrate including a current amount control region that locally restricts current movement to the RGB light emitting diode chip; A step of mounting a chip on a substrate, a step of detecting a color coordinate of light emitted from the RGB light emitting diode chip, and a step of locally changing the amount of current in the current amount controlling region to adjust the color coordinates of the light.

According to an embodiment of the present invention, even after the RGB light emitting diode chip is mounted on the substrate, it is possible to adjust the color coordinates of the light emitted without replacing the RGB light emitting diode chip and change the directivity angle.

1 is a layout diagram showing a substrate for an RGB light emitting diode chip according to an example.
FIG. 2 is a layout diagram illustrating a process of adjusting the amount of current of the substrate of FIG. 1; FIG.
3 is a layout diagram showing a substrate for an RGB light emitting diode chip according to another example.
4 is a layout diagram showing a substrate for a RGB light emitting diode chip according to another example.
5 is a layout diagram showing a substrate for a RGB light emitting diode chip according to another example.
6 is a layout diagram showing a substrate for a RGB light emitting diode chip according to another example.
FIG. 7 is a flowchart illustrating a method of manufacturing an RGB light emitting diode package according to an exemplary embodiment. Referring to FIG.

1 is a layout diagram showing a substrate for an RGB light emitting diode chip according to an example. And FIG. 2 is a layout diagram for explaining a current amount adjustment process of the substrate of FIG. Referring to FIGS. 1 and 2, a substrate 100 according to an exemplary embodiment has a structure in which a first electrode pattern 110 and a second electrode pattern 120 are disposed on a substrate body 102. In one example, such a substrate 100 may be a printed circuit board (PCB) or a submount. The substrate body 102 is made of an insulating material. The first electrode pattern 110 and the second electrode pattern 120 are disposed to face each other. The first electrode pattern 110 is disposed above the upper surface of the substrate body 102 and the second electrode pattern 120 is disposed below the upper surface of the substrate body 102, For example, the first electrode pattern 110 and the second electrode pattern 120 may be arranged in various forms on the upper surface of the substrate body 102.

The first electrode pattern 110 includes a first electrode pattern frame 111 having a rectangular shape. The second electrode pattern 120 includes a second electrode pattern frame 121 and a plurality of second branch electrode patterns 121 branched from the second electrode pattern frame 121 and extending toward the first electrode pattern frame 111. [ (122, 123, 124). On the substrate body 102, RGB light emitting diode chips, that is, a red (R) light emitting diode chip 104, a green (G) light emitting diode chip 105, and a blue (B) The chips 106 are arranged to be spaced apart from each other. The upper portions of the red (R) light emitting diode chip 104, the green (G) light emitting diode chip 105 and the blue (B) light emitting diode chip 106 are connected to the first electrode pattern frame 111). The lower portion of the red (R) light emitting diode chip 104 overlaps with the end of the second branch electrode pattern 123 of the second electrode pattern 120. The lower portion of the green (G) light emitting diode chip 105 overlaps with the end of the second branch electrode pattern 122 of the second electrode pattern 120. The lower portion of the blue (B) light emitting diode chip 106 overlaps with the end of the second branch electrode pattern 124 of the second electrode pattern 120. In this example, the red (R) light emitting diode chip 104, the green (G) light emitting diode chip 105, and the blue (B) light emitting diode chip 106, (120). Although not shown in the drawings, the pads disposed on the lower surface of the red (R) light emitting diode chip 104, green (G) light emitting diode chip 105, and blue (B) light emitting diode chip 106, Or flip-bonded to the first electrode pattern 110 and the second electrode pattern 120 through connection means such as solder or the like, and the light from each light emitting diode chip is emitted through the back surface of the light emitting diode chip.

The current control regions 130, 140, and 150 are disposed in the second branch electrode patterns 122, 123, and 124 of the second electrode pattern 120, respectively. The current amount regulating region 130 is disposed between the overlapping region of the second branch electrode pattern 122 and the green (G) light emitting diode chip 105 and the second electrode pattern frame 121, . The current amount regulating region 140 is disposed between the overlap region of the red (R) light emitting diode chip 104 and the second electrode pattern frame 121 in the region of the second branch electrode pattern 123 disposed at the left edge. The current amount regulating region 150 is disposed between the overlap region of the blue (B) light emitting diode chip 106 and the second electrode pattern frame 121 in the region of the second branch electrode pattern 124 disposed at the right edge. In this example, all of the current amount regulating regions are disposed in each of the second branch electrode patterns 121, 122, and 123. However, in one example, the current amount regulating regions 130, 140, Some may be omitted.

Current amount control patterns 132 for controlling the amount of current flowing between the second electrode pattern frame 121 and the green (G) light emitting diode chip 105 are formed in the current amount control region 130 in the second branch electrode pattern 122 . A current amount control pattern 142 for controlling the amount of current flowing between the second electrode pattern frame 121 and the red (R) LED chip 104 is formed in the current amount control region 140 in the second branch electrode pattern 123, Respectively. A current amount control pattern 152 for controlling the amount of current flowing between the second electrode pattern frame 121 and the blue (B) light emitting diode chip 106 is formed in the current amount control region 150 in the second branch electrode pattern 124, Respectively. In one example, each of the current amount regulating patterns 132, 142, and 152 has a stripe shape elongated along the current moving direction.

In one example, each of the current amount control patterns 132, 142, and 152 may be a fuse pattern. In this case, at least a part of the current amount control patterns 132, 142 and 152 can be turned off by the laser irradiation, and the movement of the current is cut off at the turned off part. The current path between the current amount control patterns 152a and 152b may be cut off by cutting the current amount control patterns 152a and 152b among the current amount control patterns 152 as shown in FIG. have. The amount of current supplied to the red (B) light emitting diode chip 106 is smaller than the amount of current supplied to the red (R) light emitting diode chip 104 and the green (G) light emitting diode chip 105, (G) light emitting diode chip 105, and the blue (B) light emitting diode chip 106 can be relatively reduced, thereby reducing the amount of current supplied to the red (R) light emitting diode chip 104, The color coordinates of white light mixed with light can be adjusted.

3 is a layout diagram showing a substrate for an RGB light emitting diode chip according to another example. Referring to FIG. 3, a substrate 200 according to an exemplary embodiment of the present invention includes a substrate body 202 having a first electrode pattern 210 and a second electrode pattern 220 disposed thereon. In one example, such a substrate 200 may be a printed circuit board (PCB) or a submount. The substrate body 202 is made of an insulating material. The first electrode pattern 210 and the second electrode pattern 220 are disposed to face each other. In this example, the first electrode pattern 210 is disposed above the top surface of the substrate body 202 and the second electrode pattern 220 is disposed below the top surface of the substrate body 202, As an example, the first electrode pattern 210 and the second electrode pattern 220 may be arranged in various forms on the upper surface of the substrate body 202.

The first electrode pattern 210 includes a first electrode pattern frame 211 and a plurality of first branched electrodes 211 branched from the first electrode pattern frame 211 and extending toward the second electrode pattern 120, Patterns 212, 213, and 214, respectively. The second electrode pattern 220 includes a second electrode pattern frame 221 and a plurality of third branched electrodes 232 extending from the second electrode pattern frame 221 toward the first electrode pattern 210, Patterns 222, 223, and 224, respectively. On the substrate body 202, RGB light emitting diode chips, i.e., a red (R) light emitting diode chip 204, a green (G) light emitting diode chip 205, and a blue (B) Chips 206 are spaced apart from one another. The upper and lower portions of the red (R) light emitting diode chip 204 are overlapped with the ends of the first branch electrode pattern 213 and the second branch electrode pattern 223, respectively. The upper and lower portions of the green (G) light emitting diode chip 205 are overlapped with the ends of the first branch electrode pattern 212 and the second branch electrode pattern 222, respectively. The upper and lower portions of the blue (B) light emitting diode chip 206 are overlapped with the ends of the first branch electrode pattern 214 and the second branch electrode pattern 224, respectively.

In this example, the red (R) light emitting diode chip 204, the green (G) light emitting diode chip 205, and the blue (B) light emitting diode chip 206, (Not shown). Although not shown in the drawing, the pads disposed on the lower surface of the red (R) light emitting diode chip 204, the green (G) light emitting diode chip 205, and the blue (B) light emitting diode chip 206, Or flip-bonded to the first electrode pattern 210 and the second electrode pattern 220 through connection means such as solder, and the light from each light emitting diode chip is emitted through the back surface of the light emitting diode chip.

Current adjustment regions 230, 240, and 250 are disposed in the second branch electrode patterns 222, 223, and 224 of the second electrode pattern 220, respectively. The current amount regulating region 230 is disposed between the overlap region of the green (G) light emitting diode chip 205 and the second electrode pattern frame 221 among the second branch electrode patterns 222 disposed at the center . The current amount regulating region 240 is disposed between the overlap region of the red (R) light emitting diode chip 204 and the second electrode pattern frame 221 in the second branch electrode pattern 223 region disposed at the left edge. A current amount regulating region 250 is disposed between a region overlapping the blue (B) light emitting diode chip 206 and the second electrode pattern frame 221 in a region of the second branch electrode pattern 224 disposed on the right edge. In this example, although the current amount control regions are all disposed in each of the second branch electrode patterns 221, 222, and 223, this is one example of the current amount control regions 230, 240, and 250 Some may be omitted.

Current amount control patterns 232 for controlling the amount of current flowing between the second electrode pattern frame 221 and the green (G) light emitting diode chip 205 are formed in the current amount control region 230 in the second branch electrode pattern 222 . A current amount control pattern 242 for controlling the amount of current flowing between the second electrode pattern frame 221 and the red (R) light emitting diode chip 204 is formed in the current amount control region 240 in the second branch electrode pattern 223, Respectively. A current amount control pattern 252 for controlling the amount of current flowing between the second electrode pattern frame 221 and the blue (B) light emitting diode chip 206 is formed in the current amount control region 250 in the second branch electrode pattern 224, Respectively. In one example, each of the current amount regulating patterns 232, 242, and 252 has a stripe shape extending long along the current moving direction.

In this example, the current amount control regions 260, 270, and 280 are also disposed in the first branch electrode patterns 212, 213, and 214 of the first electrode pattern 210, respectively. A current amount regulating region 260 is disposed between the first electrode pattern 212 and the first electrode pattern frame 211 in the overlapping region with the green (G) light emitting diode chip 205 . A current amount regulating region 270 is disposed between a region of the first branch electrode pattern 213 disposed on the left edge and the region overlapping the red (R) light emitting diode chip 204 and the first electrode pattern frame 211. The current amount regulating region 280 is disposed between the first electrode pattern 214 and the first electrode pattern frame 211 in the overlapping region with the blue (B) light emitting diode chip 206. In this example, all of the current amount control regions are disposed in each of the first branch electrode patterns 211, 212, and 213. However, in one example, the current amount control regions 260, 270, and 280 Some may be omitted.

A current amount control pattern 262 for controlling the amount of current flowing between the first electrode pattern frame 211 and the green (G) light emitting diode chip 205 is formed in the current amount control region 260 in the first branch electrode pattern 212 . A current amount control pattern 272 for controlling the amount of current flowing between the first electrode pattern frame 211 and the red (R) light emitting diode chip 204 is formed in the current amount control region 270 in the first branch electrode pattern 213, Respectively. A current amount control pattern 282 for controlling the amount of current flowing between the first electrode pattern frame 211 and the blue (B) light emitting diode chip 206 is formed in the current amount control region 280 in the first branch electrode pattern 214, Respectively. In one example, each of the current amount regulating patterns 262, 272, and 282 has a stripe shape elongated along the current moving direction.

In one example, each of the current amount regulation patterns 232, 242, 252, 262, 272, and 282 may be a fuse pattern. In this case, at least a part of the current amount control patterns 132, 142, 152, 262, 272 and 282 can be turned off by laser irradiation as described with reference to FIG. 2, do. The amount of current supplied to the red (R) light emitting diode chip 204, the green (G) light emitting diode chip 205, and the blue (B) light emitting diode chip 206 can be reduced by reducing the amount of current in the current- The light emitted from the red (R) light emitting diode chip 204, the green (G) light emitting diode chip 205 and the blue (B) light emitting diode chip 206 are mixed with the color coordinates Can be adjusted.

4 is a layout diagram showing a substrate for a RGB light emitting diode chip according to another example. Referring to FIG. 4, a substrate 300 according to an exemplary embodiment of the present invention includes a substrate body 302 on which a first electrode pattern 310 and a second electrode pattern 320 are disposed. In one example, such a substrate 300 may be a printed circuit board (PCB) or a submount. The substrate body 302 is made of an insulating material. The first electrode pattern 310 and the second electrode pattern 320 are disposed to face each other. The first electrode pattern 310 is disposed above the upper surface of the substrate body 302 and the second electrode pattern 320 is disposed below the upper surface of the substrate body 302, For example, the first electrode pattern 310 and the second electrode pattern 320 may be arranged in various forms on the upper surface of the substrate body 302.

The first electrode pattern 310 includes a first electrode pattern frame 311 having a rectangular shape. The second electrode pattern 320 includes a second electrode pattern frame 321 and a plurality of second branch electrode patterns 331 branched from the second electrode pattern frame 321 and extending toward the first electrode pattern frame 311. [ (322, 323, 324). On the substrate body 302, RGB light emitting diode chips, that is, a red (R) light emitting diode chip 304, a green (G) light emitting diode chip 305, and a blue (B) light emitting diode chip 306, (310) and the second electrode pattern (320).

In this example, the RGB light emitting diode chips 304, 305, and 306 have a horizontal structure. Accordingly, the positive and negative electrodes of the RGB light emitting diode chips 304, 305, Electrode pattern 320 by wire bonding. Specifically, the first pad 304-1 and the second pad 304-2 are disposed on the upper surface of the red (R) light emitting diode chip 304. The first pad 304-1 is connected to the first electrode pattern frame 311 through a wire 361. [ The second pad 304-2 is connected to the second branch electrode pattern 323 through the wire 371. [ The first pad 305-1 and the second pad 305-2 are also disposed on the upper surface of the green (G) light emitting diode chip 305. [ The first pad 305-1 is connected to the first electrode pattern frame 311 through a wire 362. [ The second pad 305-2 is connected to the second branch electrode pattern 322 through the wire 372. [ The first pad 306-1 and the second pad 306-2 are also disposed on the upper surface of the blue (B) light emitting diode chip 306. The first pad 306-1 is connected to the first electrode pattern frame 311 through a wire 363. The second pad 306-2 is connected to the second branch electrode pattern 324 through the wire 373. [

The current amount control regions 330, 340, and 350 are disposed in the second branch electrode patterns 322, 323, and 324 of the second electrode pattern 320, respectively. The current amount control region 330 is disposed between the overlap region of the green (G) light emitting diode chip 305 and the second electrode pattern frame 321 in the region of the second branch electrode pattern 322 disposed at the center . The current amount control region 340 is disposed between the overlap region of the red (R) light emitting diode chip 304 and the second electrode pattern frame 321 in the second branch electrode pattern 323 disposed at the left edge. The current amount regulating region 350 is disposed between the overlapping region of the second branch electrode pattern 324 disposed on the right edge with the blue (B) light emitting diode chip 306 and the second electrode pattern frame 321. In this example, all of the current amount control regions are disposed in each of the second branch electrode patterns 321, 322, and 323, but this is an example of the current amount control regions 330, 340, and 350 Some may be omitted.

Current amount control patterns 332 for controlling the amount of current flowing between the second electrode pattern frame 321 and the green (G) light emitting diode chip 305 are formed in the current amount control region 330 in the second branch electrode pattern 322 . A current amount control pattern 342 for controlling the amount of current flowing between the second electrode pattern frame 321 and the red (R) LED chip 304 is formed in the current amount control region 340 in the second branch electrode pattern 323, Respectively. A current amount control pattern 352 for controlling the amount of current flowing between the second electrode pattern frame 321 and the blue (B) light emitting diode chip 306 is formed in the current amount control region 350 in the second branch electrode pattern 324. [ Respectively. In one example, each of the current amount regulating patterns 332, 342, and 352 has a stripe shape elongated along the current moving direction.

In one example, each of the current amount regulation patterns 332, 342, and 352 may be a fuse pattern. In this case, at least a part of the current amount control patterns 332, 342, and 352 can be turned off by laser irradiation, and the movement of the current is cut off at the turned off portion. That is, as described with reference to FIG. 2, at least a part of the current amount adjustment patterns 332, 342, and 352 may be cut to cut off the current path between the current amount adjustment patterns. The amount of current supplied to the red (R) light emitting diode chip 304, the green (G) light emitting diode chip 305, and the blue (B) light emitting diode chip 306 is relatively The light emitted from the red (R) light emitting diode chip 304, the green (G) light emitting diode chip 305, and the blue (B) light emitting diode chip 306 is mixed with the mixed white light You can adjust the color coordinates.

5 is a layout diagram showing a substrate for a RGB light emitting diode chip according to another example. Referring to FIG. 5, a substrate 400 according to an exemplary embodiment of the present invention includes a substrate body 402 having a first electrode pattern 410 and a second electrode pattern 420 disposed thereon. In one example, such a substrate 400 may be a printed circuit board (PCB) or a submount. The substrate body 402 is made of an insulating material. The first electrode pattern 410 and the second electrode pattern 420 are disposed to face each other. The first electrode pattern 410 is disposed above the upper surface of the substrate body 402 and the second electrode pattern 420 is disposed below the upper surface of the substrate body 402, As an example, the first electrode pattern 410 and the second electrode pattern 420 may be arranged in various forms on the upper surface of the substrate body 402.

The first electrode pattern 410 includes a first electrode pattern frame 411 having a rectangular shape. The second electrode pattern 420 includes a second electrode pattern frame 421 and a plurality of second branch electrode patterns 421 branched from the second electrode pattern frame 421 and extending toward the first electrode pattern frame 411. [ (422, 423, 424). On the first electrode pattern 410, RGB light emitting diode chips, that is, a red (R) light emitting diode chip 404, a green (G) light emitting diode chip 405, and a blue (B) light emitting diode chip 406, Respectively.

In this example, the RGB light emitting diode chips 404, 405, and 406 have a vertical structure in which the positive electrode and the negative electrode are disposed on the lower surface and the upper surface, respectively. Accordingly, the positive electrodes of the RGB light emitting diode chips 404, 405, and 406 are connected to the first electrode pattern frame 411 through connecting means such as a bump or a solder ball, and the negative electrode is connected to the second electrode pattern 420 and the wire And are electrically connected through bonding. That is, although not shown, an electrode pad is disposed on the lower surface of the red (R) light emitting diode chip 404, and the electrode pad is connected to the first electrode pattern frame 411 through a bump or a solder ball. Similarly, electrode pads are disposed on the lower surface of the green (G) light emitting diode chip 405, and the electrode pads are also connected to the first electrode pattern frame 411 through bumps or solder balls. Also, an electrode pad is disposed on the lower surface of the blue (B) light emitting diode chip 406. The electrode pad is also connected to the first electrode pattern frame 411 through a bump or a solder ball. A pad 404-1 is disposed on the upper surface of the red (R) light emitting diode chip 404, and the pad 404-1 is connected to the second branch electrode pattern 423 through the wire 461. [ A pad 404-2 is also disposed on the upper surface of the green (G) light emitting diode chip 405, and the pad 404-2 is connected to the second branch electrode pattern 422 through the wire 462. A pad 404-3 is also disposed on the upper surface of the blue (B) light emitting diode chip 406. The pad 404-1 is connected to the second branch electrode pattern 424 through a wire 463 .

The current amount control regions 430, 440 and 450 are disposed in the second branch electrode patterns 422, 423 and 424 of the second electrode pattern 420, respectively. The current amount control region 430 is disposed between the second electrode pattern 421 and the second electrode pattern 422, which is located at the center of the second electrode pattern 421, between the overlap region of the green (G) light emitting diode chip 405 and the second electrode pattern 421 . A current amount regulating region 440 is disposed between a region of the second branch electrode pattern 423 disposed on the left edge and the region overlapping the red (R) light emitting diode chip 404 and the second electrode pattern frame 421. The current amount control region 450 is disposed between the overlap region of the blue (B) light emitting diode chip 406 and the second electrode pattern frame 421 in the second branch electrode pattern 424 region disposed at the right edge. In this example, all of the current amount regulating regions are disposed in each of the second branch electrode patterns 421, 422, and 423, but this is one example of the current amount regulating regions 430, 440, and 450 Some may be omitted.

A current amount control pattern 432 for controlling the amount of current flowing between the second electrode pattern frame 421 and the green (G) light emitting diode chip 405 is formed in the current amount control region 430 in the second branch electrode pattern 422 . A current amount control pattern 442 for controlling the amount of current flowing between the second electrode pattern frame 421 and the red (R) LED chip 404 is formed in the current amount control region 440 in the second branch electrode pattern 423, Respectively. A current amount control pattern 452 for controlling the amount of current flowing between the second electrode pattern frame 421 and the blue (B) light emitting diode chip 406 is formed in the current amount control region 450 in the second branch electrode pattern 424. [ Respectively. In one example, each of the current amount regulating patterns 432, 442, and 452 has a stripe shape elongated along the current moving direction.

In one example, each of the current amount regulating patterns 432, 442, and 452 may be a fuse pattern. In this case, at least a part of the current amount control patterns 432, 442, and 452 can be turned off by laser irradiation, and the movement of the current is cut off at the turned off portion. That is, as described with reference to FIG. 2, at least a part of the current amount adjustment patterns 432, 442, and 452 may be cut to cut off the current path between the current amount adjustment patterns. The amount of current supplied to the red (R) light emitting diode chip 404, the green (G) light emitting diode chip 405 and the blue (B) light emitting diode chip 406 is relatively The light emitted from the red (R) light emitting diode chip 404, the green (G) light emitting diode chip 405, and the blue (B) light emitting diode chip 406 is mixed with the mixed white light You can adjust the color coordinates.

6 is a layout diagram showing a substrate for a RGB light emitting diode chip according to another example. Referring to FIG. 6, a substrate 500 according to an exemplary embodiment has a structure in which a first electrode pattern 510 and a second electrode pattern 520 are disposed on a substrate body 502. In one example, such a substrate 500 may be a printed circuit board (PCB) or a submount. The substrate body 502 is made of an insulating material. The first electrode pattern 510 and the second electrode pattern 520 are disposed to face each other. In this example, the first electrode pattern 510 is disposed above the upper surface of the substrate body 502 and the second electrode pattern 520 is disposed below the upper surface of the substrate body 502, As an example, the first electrode pattern 510 and the second electrode pattern 520 may be arranged in various forms on the upper surface of the substrate body 502.

The first electrode pattern 510 includes a first electrode pattern frame 511 having a rectangular shape. The second electrode pattern 520 includes a second electrode pattern frame 521 and a plurality of second branch electrode patterns 521 branched from the second electrode pattern frame 521 and extending toward the first electrode pattern frame 511. [ (522, 523, 524). The RGB LED single chip 505 is disposed on the first electrode pattern 510 and the second electrode pattern 520.

In this example, the single RGB light emitting diode chip 505 includes a red (R) light emitting diode cell 504a, a green (G) light emitting diode cell 504b, and a blue (B) light emitting diode cell 504c Chip structure. Although not shown in the drawing, the red (R) light emitting diode cell 504a is connected to the first electrode pattern frame 511 and the second branch electrode pattern 523 through a wiring structure in a single chip. The green (G) light emitting diode cell 504b is also connected to the first electrode pattern frame 511 and the second branch electrode pattern 522 through a wiring structure inside the single chip. Similarly, the blue (B) light emitting diode cell 504c is also connected to the first electrode pattern frame 511 and the second branch electrode pattern 524 through the wiring structure inside the single chip. The red (R) light emitting diode cell 504a, the green (G) light emitting diode cell 504b, and the blue (B) light emitting diode cell 504c disposed in the RGB light emitting diode single chip 505 may be a vertical structure And may be a horizontal structure. In this case, the wiring scheme in a single chip may vary depending on whether the structure is a vertical structure or a horizontal structure.

The current control regions 530, 540 and 550 are disposed in the second branch electrode patterns 522, 523 and 524 of the second electrode pattern 520, respectively. The current amount regulating region 530 is disposed between the overlap region of the RGB LED single chip 505 and the second electrode pattern frame 521 in the second branch electrode pattern 522 disposed at the center. The current amount regulating region 540 is disposed between the overlapping region of the second branch electrode pattern 523 disposed on the left edge with the RGB LED single chip 505 and the second electrode pattern frame 521. The current amount control region 550 is disposed between the RGB LED single chip 505 and the second electrode pattern frame 521 in the second branch electrode pattern 524 disposed at the right edge. In this example, although the current amount control regions are all disposed in each of the second branch electrode patterns 521, 522, and 523, this is one example of the current amount control regions 530, 540, and 550 Some may be omitted.

Current amount control patterns 532 for controlling the amount of current flowing between the second electrode pattern frame 521 and the green (G) light emitting diode cell 504b are formed in the current amount control region 530 in the second branch electrode pattern 522 . A current amount control pattern 542 for controlling the amount of current flowing between the second electrode pattern frame 521 and the red (R) light emitting diode cell 504a is formed in the current amount control region 540 in the second branch electrode pattern 523, Respectively. A current amount control pattern 552 for controlling the amount of current flowing between the second electrode pattern frame 521 and the blue (B) light emitting diode cell 504c is formed in the current amount control region 550 in the second branch electrode pattern 524. [ Respectively. In one example, each of the current amount regulating patterns 532, 542, and 552 has a stripe shape elongated along the current moving direction.

In one example, each of the current amount regulation patterns 532, 542, and 552 may be a fuse pattern. In this case, at least a part of the current amount control patterns 532, 542 and 552 can be turned off by the laser irradiation, and the movement of the current is cut off at the turned off part. That is, as described with reference to FIG. 2, at least a part of the current amount adjustment patterns 532, 542, and 552 may be cut to cut off the current path between the current amount adjustment patterns. The amount of current supplied to the red (R) light emitting diode cell 504a, the green (G) light emitting diode cell 504b, and the blue (B) light emitting diode cell 504c is relatively And the light emitted from the red (R) light emitting diode cell 504a, the green (G) light emitting diode cell 504b, and the blue (B) light emitting diode cell 504c is mixed with the mixed white light You can adjust the color coordinates.

FIG. 7 is a flowchart illustrating a method of manufacturing an RGB light emitting diode package according to an exemplary embodiment. Referring to FIG. Referring to FIG. 7 together with FIG. 1, an RGB light emitting diode chip is mounted on the substrate 100 described with reference to FIG. 1 (Step 710). In one example, the RGB light emitting diode chip includes a red (R) light emitting diode chip, a green (G) light emitting diode chip, and a blue (B) light emitting diode chip. In another example, the RGB light emitting diode chip may be a single chip structure in which the RGB light emitting diode chip includes a red (R) light emitting diode cell, a green (G) light emitting diode cell, and a blue (B) light emitting diode cell. Next, a color coordinate of light emitted from the RGB light emitting diode chip is detected (step 720). In one example, the color coordinates of the light can be detected using a photo detector. A plurality of photodetectors may be used for color coordinate detection.

Next, the color coordinates of the detected light are analyzed to determine whether or not cutting of the fuse pattern is necessary (step 730). In one example, the analysis of the detected color coordinates may be performed automatically through a controller connected to the photodetector. For example, in a state in which allowable data for a light color coordinate is input, it is determined whether or not the color coordinate of the light detected by the controller operation is within the input data range, and then, when the data range is out of the input data range, The fuse pattern is cut through laser irradiation (step 740). For this purpose, a process of photographing an image of a fuse pattern in advance and determining a fuse pattern to be cut using the sensed image may be performed. After correcting the color coordinates of the light through the cutting of the fuse pattern, step 720 is again performed. This process is repeated until the color coordinates of the detected light are within the input data range, that is, until the fuse pattern cutting is no longer needed .

100: substrate 104, 105, 106: RGB light emitting diode chip
110 ... first electrode pattern 111 ... first electrode pattern frame
120 ... second electrode pattern 121 ... second electrode pattern frame
122, 123, 124 ... second branch electrode pattern
130, 140, 150 ... Amount of current control region
132, 142, 152 ... Ampere adjustment pattern (fuse pattern)

Claims (20)

A substrate body;
A first electrode pattern disposed on the substrate body and connected to one electrode pad of the RGB light emitting diode chip;
A second electrode pattern disposed on the substrate body and connected to another electrode pad of the RGB light emitting diode chip; And
And a current amount control region disposed in at least one of the first electrode pattern and the second electrode pattern to locally restrict current movement to the RGB LED chip. The method according to claim 1,
Wherein the RGB light emitting diode chip includes a red (R) light emitting diode chip, a green (R) light emitting diode chip, and a blue (B) light emitting diode chip. 3. The method of claim 2,
The red (R) light emitting diode chip, the green (R) light emitting diode chip, and the blue (B) light emitting diode chip may be a substrate for a RGB light emitting diode chip having a horizontal structure. The method of claim 3,
The R, G and B light emitting diode chips of the vertical structure are connected to the first electrode pattern and the second electrode pattern through a wire, and the RGB light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip, A substrate for a chip. 3. The method of claim 2,
Wherein the red (R) light emitting diode chip, the green (R) light emitting diode chip, and the blue (B) light emitting diode chip are vertical type substrates for a RGB light emitting diode chip. 6. The method of claim 5,
The vertical (red), green (R) and blue (B) light emitting diode chips are connected to the first electrode pattern and the second electrode pattern through pads and wires, respectively. A substrate for a light emitting diode chip. The method according to claim 1,
The RGB light emitting diode chip is a single chip structure having a red (R) light emitting diode cell, a green (R) light emitting diode cell, and a blue (B) light emitting diode cell. The method of claim 1,
Wherein the first electrode pattern comprises a first electrode pattern frame having a rectangular shape. 9. The method of claim 8,
The second electrode pattern includes a second electrode pattern frame and a plurality of second branch electrode patterns branched from the second electrode pattern frame and extending toward the first electrode pattern frame. . 10. The method of claim 9,
Wherein the current amount control region is disposed in at least one of the plurality of second branch electrode patterns. The method according to claim 1,
Wherein the first electrode pattern comprises a first electrode pattern frame and a plurality of first branch electrode patterns branched from the first electrode pattern frame and extending toward the second electrode pattern. 12. The method of claim 11,
Wherein the second electrode pattern includes a second electrode pattern frame and a plurality of second branch electrode patterns branched from the second electrode pattern frame and extending toward the first electrode pattern. 13. The method of claim 12,
Wherein the current amount controlling region is disposed in at least one of the plurality of first branch electrode patterns and the plurality of second branch electrode patterns. The method according to claim 1,
Wherein the current amount control region includes a plurality of current amount control patterns for blocking a current path for a current under a predetermined condition. 15. The method of claim 14,
Wherein the current amount control pattern includes a fuse pattern cut by laser irradiation. A first electrode pattern and a second electrode pattern disposed on the substrate body, and a second electrode pattern disposed on at least one of the first electrode pattern and the second electrode pattern, the current movement to the RGB light emitting diode chip being locally The method comprising: preparing a substrate including a current-controlling region which confines a current-controlling region;
Mounting RGB light emitting diode chips on a substrate such that different electrode pads of the RGB light emitting diode chip are connected to the first electrode pattern and the electrode pattern, respectively;
Detecting a color coordinate of light emitted from the RGB light emitting diode chip; And
And adjusting a color coordinate of the light by locally changing a current amount of the current amount control region. 17. The method of claim 16,
Wherein the step of detecting a color coordinate of light emitted from the RGB light emitting diode chip is performed using a photodetector. 17. The method of claim 16,
Wherein the current amount controlling region includes a plurality of fuse patterns blocking a current path in a predetermined condition. 19. The method of claim 18,
Wherein the adjusting of the color coordinates of the light by locally changing the amount of current in the current amount adjusting region is performed by cutting a part of the fuse pattern in the current amount adjusting region. 20. The method of claim 19,
Wherein the cutting of the fuse pattern is performed using laser irradiation.
KR20130115322A 2013-09-27 2013-09-27 Substrate for RGB LED chip and method of fabricating RGB LED package KR20150035114A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10230021B2 (en) 2015-09-30 2019-03-12 Samsung Electronics Co., Ltd. Light emitting device package
KR20210059440A (en) 2019-11-15 2021-05-25 주식회사 글로우원 Large Display Apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10230021B2 (en) 2015-09-30 2019-03-12 Samsung Electronics Co., Ltd. Light emitting device package
US10629782B2 (en) 2015-09-30 2020-04-21 Samsung Electronics Co., Ltd. Light emitting device package
US10903397B2 (en) 2015-09-30 2021-01-26 Samsung Electronics Co., Ltd. Light emitting device package
KR20210059440A (en) 2019-11-15 2021-05-25 주식회사 글로우원 Large Display Apparatus

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