KR20150025973A - A composition for use of an anisotropic conductive film causing no harmfulness to human body, an anisotropic conductive film, and a semiconductive device connected by the film - Google Patents

A composition for use of an anisotropic conductive film causing no harmfulness to human body, an anisotropic conductive film, and a semiconductive device connected by the film Download PDF

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KR20150025973A
KR20150025973A KR20130104211A KR20130104211A KR20150025973A KR 20150025973 A KR20150025973 A KR 20150025973A KR 20130104211 A KR20130104211 A KR 20130104211A KR 20130104211 A KR20130104211 A KR 20130104211A KR 20150025973 A KR20150025973 A KR 20150025973A
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anisotropic conductive
conductive film
solvent
composition
film
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KR20130104211A
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Korean (ko)
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KR101631359B1 (en
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김이주
고연조
강경구
김규봉
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제일모직주식회사
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)

Abstract

The present invention relates to a process for preparing a resin composition comprising a binder portion, a cured portion, a radical reaction initiator, a conductive particle, and a first solvent having a Hansen Solubility Parameter of 17 to 20 and a boiling point of 70 to 100 ° C and a Hansen Solubility Parameter 17-20 and a second solvent having a boiling point of more than 100 to 130 캜, an anisotropic conductive film and a semiconductor device connected by the film.

Description

TECHNICAL FIELD [0001] The present invention relates to a composition for anisotropic conductive film which is harmless to human body, an anisotropic conductive film, and a semiconductor device connected to the anisotropic conductive film by a semiconductive device, the film}

The present invention relates to a composition for an anisotropic conductive film which is harmless to the human body, an anisotropic conductive film, and a semiconductor device connected by the film.

Anisotropic Conductive Film (ACF) is a film-like adhesive in which conductive particles such as metal coated plastics or metal particles are dispersed, and is widely used for circuit connection in the field of flat panel displays and component mounting in the semiconductor field. When anisotropic conductive film is placed between the circuits to be connected and subjected to a thermocompression process under a certain condition, the circuit terminals are electrically connected by the conductive particles, and the space between the adjacent circuit terminals is covered with the insulating adhesive resin So that the conductive particles exist independently of each other, so that the insulating property is given.

The anisotropic conductive adhesive film is generally prepared by mixing a polymer binder dissolved in various kinds of solvents with a monomer, an additive, a radical reaction initiator, conductive particles or the like, coating the resultant in a film form, and then volatilizing the solvent with heat. In a curing system using a radical reaction initiator, toluene and methyl ethyl ketone, which are rapidly volatilized by heat after coating on a film and have high solubility in polymer binders and the like, have been widely used (Korean Patent Application Publication No. 10-2013-0068891 And Korean Patent Application Publication No. 10-2012-0076185). However, toluene, methyl ethyl ketone, and the like are known to cause reproductive toxicity upon exposure to human body. Since a toxic solvent is used for the production of the anisotropic conductive film as described above, a volatile solvent harmful to the human body remains on the anisotropic conductive film. Such volatile solvent volatilizes as the film receives heat during the bonding process, It can harm the health of workers. In order to minimize this, there is a method in which the film is dried for a long time with a high heat in a drying process in which the solvent is volatilized after the coating. However, in this case, the surface of the film is dried first, Some of the processes may not be able to maintain the original properties due to the progress of the curing reaction.

Recently, environmental and worker health problems are becoming more and more a social issue, and when a product containing harmful substances is used, a situation that directly harms the health of workers may be caused. have. Therefore, the necessity for products containing no human harmful substances has been increasing day by day, but there has been no efforts to remove such harmful substances from existing anisotropic conductive films, but rather the tendency to add more harmful substances in order to improve the physical properties of the product There is an urgent need for a method for solving this problem.

Korean Patent Application Publication No. 10-2013-0068891 Korean Patent Application Publication No. 10-2012-0076185

none

The present invention aims to provide a composition and film for an anisotropic conductive film that is harmless to the human body. Specifically, it is intended to provide a composition and film for environmentally friendly anisotropic conductive films which do not detract from carcinogenicity, hepatotoxicity, occupational disease, reproductive toxicity or health even if exposed to human body.

It is another object of the present invention to provide a composition for an anisotropic conductive film and a film which are harmless to the human body and good in connection reliability and adhesive strength to maintain the inherent physical properties as an anisotropic conductive adhesive.

According to an embodiment of the present invention, there is provided a process for preparing a resin composition comprising a binder portion, a hardened portion, a radical reaction initiator, a conductive particle, and a first solvent having a Hansen Solubility Parameter of 17 to 20 and a boiling point of 70 to 100 ° C and a Hansen solubility parameter A Hansen Solubility Parameter) of 17 to 20 and a boiling point of more than 100 to 130 캜, provided that the solvent is not toluene or methyl ethyl ketone.

According to another example of the present invention, there is provided an anisotropic conductive film comprising a binder portion, a hardened portion, a radical reaction initiator and conductive particles, and containing 0 to 1 ppm or less of methyl ethyl ketone, and 0 to 10 ppm or less of toluene / RTI >

According to still another embodiment of the present invention, there is provided a semiconductor device connected by the anisotropic conductive film.

The composition and the film for an anisotropic conductive film according to one embodiment of the present invention do not cause toxicity to the human body by using a harmless solvent and do not cause carcinogenicity, hepatotoxicity, occupational disease, reproductive toxicity or health damage.

Further, the use of a solvent which is harmless to the human body and has a good liquid stability with the binder is used, whereby the physical properties such as adhesion and connection resistance are excellent.

1 shows a first and second connected members 50 and 60 including a first electrode 70 and a second electrode 80 connected to each other by an anisotropic conductive film according to an example of the present invention. And FIG.
2 is a photomicrograph of an anisotropic conductive film of Comparative Example 1 showing that the composition for anisotropic conductive film shows agglomeration of conductive particles due to phase separation over time.
FIG. 3 is a microphotograph of the anisotropic conductive film of Example 1 showing that the composition for anisotropic conductive films is not phase-separated over time and that the conductive particles are uniformly dispersed.

The composition for anisotropic conductive films according to an embodiment of the present invention is characterized by comprising a binder portion, a curing portion, a radical reaction initiator, a conductive particle, and a first component having a Hansen Solubility Parameter of 17 to 20 and a boiling point of 70 to 100 캜 A solvent and a second solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of more than 100 to 130 ° C, provided that the solvent is not toluene or methyl ethyl ketone. As a solvent that can be used in the composition for anisotropic conductive films, a harmful component such as methyl ethyl ketone or toluene is excluded. Accordingly, the solvent which can be used in the present invention is a solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 ° C, a Hansen solubility parameter of 17 to 20 and a boiling point of 100 And not more than 130 캜, wherein the first solvent and the second solvent are harmless to the human body. Another composition for an anisotropic conductive film according to another embodiment of the present invention includes a binder portion, a curing portion, a radical reaction initiator, a conductive particle, and at least two solvents having Hansen Solubility Parameter of 17 to 20 and harmless to the human body .

The Hansen solubility parameters herein can be defined by the following equation:

[Formula 1]

隆 t 2 = 隆 d 2 + 隆 p 2 + 隆 h 2

In Equation (1)

? t is the Hansen solubility parameter ,? d is the dispersion energy between molecules ,? p is the energy of the intramolecular dipole forces between the molecules, and ? h represents the hydrogen bonding energy between the molecules.

In the range of the above-described Hansen solubility parameters, the binder part or the radical reaction initiator and the solution stability are good, and the solubility is high, so that the adhesiveness and the connection reliability of the anisotropic conductive film can be maintained. Two or more solvents having the aforementioned Hansen solubility parameter may be used together. Examples of the solvent having a Hansen solubility parameter of 17 to 20 and harmless to the human body include alkyl acetates such as methyl acetate, ethyl acetate and butyl acetate, and alcohols such as isopropyl alcohol and isobutyl alcohol . Specifically, a first solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 ° C, a second solvent having a Hansen Solubility Parameter of 17 to 20 and a boiling point of more than 100 to 130 ° C A solvent may be used together. The first solvent may be any solvent as long as it has a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 ° C and is harmless to the human body. Examples of the solvent include ethyl acetate, isopropyl acetate, have. The second solvent may be any solvent as long as it has a Hansen solubility parameter of 17 to 20 and a boiling point of more than 100 to 130 ° C and is harmless to the human body. Examples of the solvent include butyl acetate, isopropanol, iso Butyl alcohol, and the like. Methyl ethyl ketone or toluene, which is a commonly used solvent in a radical reaction system using a radical reaction initiator, is absorbed in the human body and causes reproductive toxicity, and thus is excluded from the solvent that can be used in the present invention.

The Hansen solubility parameters of typical solvents are as shown in Table 1 below. Methyl ethyl ketone or toluene is usually used for the composition for anisotropic conductive films because of its high volatility and high solubility.

menstruum 隆 / MPa ½ menstruum 隆 / MPa ½ δ t δ d δ p δ h δ t δ d δ p δ h n-butane 14.1 14.1 0 0 Acetone 20 15.5 10.4 7 n-pentane 14.5 14.5 0 0 Methyl ethyl ketone 19 16 9 5.1 n-hexane 14.9 14.9 0 0 Methanol 29.6 15.1 12.3 22.3 n-heptane 15.3 15.3 0 0 ethanol 26.5 15.8 8.8 19.4 n-octane 15.5 15.5 0 0 Allyl alcohol 25.7 16.2 10.8 16.8 benzene 18.6 18.4 0 2 1-propanol 24.5 16 6.8 17.4 toluene 18.2 18 1.4 2 2-propanol 23.5 15.8 6.1 16.4 naphthalene 20.3 19.2 2 5.9 1-butanol 23.1 16 5.7 15.8 Styrene 19 18.6 One 4.1 2-butanol 22.2 15.8 5.7 14.5 o-xylene 18 17.8 One 3.1 Ethyl formate 18.7 15.5 7.2 7.6 Ethylbenzene 17.8 17.8 0.6 1.4 Propylene 1,2-carbonate 27.3 20 18 4.1 Chloromethane 17 15.3 6.1 3.9 Diethyl carbonate 17.9 16.6 3.1 6.1 Methylene chloride 20.3 18.2 6.3 6.1 Isobutyl acetate 16.8 15.1 3.7 6.3 1,1-dichloroethylene 18.8 17 6.8 4.5 chloroform 19 17.8 3.1 5.7 Ethylene dichloride 20.9 19 7.4 4.1

The majority of the solvents listed in Table 1 are known to cause carcinogenicity, hepatotoxicity, occupational disease, reproductive toxicity or health hazard when absorbed into the human body. For example, benzene, formaldehyde, chloroform, trichlorethylene, 1,3-butadiene, carbon tetrachloride or ethylene oxide are known as carcinogenic substances. For example, N, N-Dimethylformaldehyde (N, N-Dimethylformaldehyde) is known to be a toxic substance. In addition, N, N-dimethylacetyllacetamide, n-hexane and the like are occupational disease-inducing toxic substances, and 2-methoxyethanol, 2-ethoxy 2-Ethoxyethanol, 2-Methoxyethyl Acetate, 2-Ethoxyethyl Acetate, Bis (2-methoxyethyl) Ether, ), Toluene, o, m, p-xylene, and methyl ethyl ketone are known as reproductive toxicants (see Table 2).

List of hazardous materials division Material name English name CAS number standard One benzene Benzene 71-43-2 Carcinogenicity 2 Formaldehyde Formaldehyde 50-00-0 Carcinogenicity 3 Trichlorethylene Trichlorethylene (TCE) 79-01-6 Carcinogenicity 4 1,3-butadiene 1,3-Butadiene 106-99-0 Carcinogenicity 5 Carbon tetrachloride Carbon tetrachloride 56-23-5 Carcinogenicity 6 chloroform Chloroform 67-66-3 Carcinogenicity 7 Ethylene oxide Ethylene Oxide 75-21-8 Carcinogenicity 8 N, N-dimethylformaldehyde N, N-Dimethylformaldehyde 68-12-2 Hepatotoxicity 9 N, N-dimethylacetamide N, N-Dimethylacetamide 127-19-5 Occupational Disease Induction 10 Normal hexane n-Hexane 110-54-3 Occupational Disease Induction 11 2-methoxyethanol 2-Methoxyethanol 109-86-4 Reproductive toxicity 12 2-ethoxyethanol 2-Ethoxyethanol 110-80-5 Reproductive toxicity 13 2-methoxyacetate 2-methoxyacetate 110-49-6 Reproductive toxicity 14 2-ethoxyethyl acetate 2-Ethoxyethyl Acetate 111-15-9 Reproductive toxicity 15 Bis (2-methoxyethyl) ether Bis (2-methoxyethyl) Ether 111-96-6 Reproductive toxicity 16 toluene Toluene 108-88-3 Reproductive toxicity 17 o, m, p-xylene o, m, p-Xylene 1330-20-7 Reproductive toxicity 18 Methyl ethyl ketone MethylEthyl Ketone 78-93-3 Reproductive toxicity

Despite the fact that most of the solvents used in adhesives are harmful to human health, they do not have a substitute solvent.

In the present invention, the solvent that can be used in the composition for anisotropic conductive films should not only be a harmless component to the human body but also have good solubility with the binder part and radical reaction initiator, or stable liquid stability. The use of a solvent having a Hansen solubility parameter of 17 to 20 in the present invention is advantageous in terms of solubility with the binder part and radical reaction initiator, and stability of the crude liquid. Further, the use of a solvent having a Hansen solubility parameter of 17 to 20 is advantageous in terms of adhesiveness and connection reliability.

More specifically, one aspect of the present invention is a process for preparing a polyurethane foam having a first solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 ° C, a Hansen solubility parameter of 17 to 20 and a boiling point of more than 100 Lt; 0 > C to 130 < 0 > C may be used together. Accordingly, the composition for anisotropic conductive films according to another embodiment of the present invention is characterized by having a binder portion, a curing portion, a radical reaction initiator, a conductive particle, a Hansen Solubility Parameter of 17 to 20 and a boiling point of 70 to 100 캜 And a second solvent having a Hansen Solubility Parameter of 17 to 20 and a boiling point of more than 100 to 130 캜. Mixing of two or more kinds of solvents having different boiling points can improve the non-planarity of the film due to the solvent being easily volatilized as compared with the case where only one kind of solvent is used, and also the liquid stability of the composition can be improved. Examples of the solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 캜 include ethyl acetate and isopropyl acetate. The Hansen solubility parameter is 17 to 20, Examples of the solvent having a temperature of more than 100 to 130 DEG C Butyl acetate, isopropanol, isobutyl alcohol, and the like. Accordingly, the composition for anisotropic conductive films according to another embodiment of the present invention may include a binder portion, a curing portion, a radical reaction initiator, conductive particles, and ethyl acetate and butyl acetate.

According to still another embodiment of the present invention, there is provided an anisotropic conductive film which is harmless to the human body including a binder portion, a hardened portion, a radical reaction initiator and conductive particles. When the term "harmless to the human body" is used herein, it means that it can be safely used on human exposure for a long period without causing carcinogenicity, hepatotoxicity, occupational disease, reproductive toxicity or health problems. Specifically, when the term "harmless to the human body" is used, it may mean that the harmful substance is not substantially present in the film. More specifically, the content of harmful substances is 0 ppm or less than 10 ppm. More specifically 0 ppm, 5 ppm or less, or 0 ppm or 1 ppm or less. Examples of harmful substances to human body include benzene, formaldehyde, trichlorethylene, 1,3-butadiene, carbon tetrachloride, chloroform, ethylene oxide, N, N- dimethylformaldehyde, N, , N-hexane, 2-methoxyethanol, 2-ethoxyethanol, 2-methoxyacetate, 2-ethoxyethyl acetate, bis (2- methoxyethyl) ether, toluene, ortho, meta, para- Or methyl ethyl ketone.

The anisotropic conductive film according to another embodiment of the present invention includes a binder portion, a curing portion, a radical reaction initiator, and conductive particles, and contains 0 to 1 ppm of methyl ethyl ketone and 0 to 10 ppm or less of toluene . When methyl ethyl ketone or toluene is used for the production of the anisotropic conductive film, it is inevitable that the solvent remains in the film even if a considerable amount of the solvent is volatilized through the drying step of the solvent. In the present invention, since methyl ethyl ketone or toluene is not used as a solvent at all during the production of the anisotropic conductive film, methyl ethyl ketone or toluene is not substantially present in the film. Thus, a content of methyl ethyl ketone of 0 to 1 ppm or less and a content of toluene of 0 to 10 ppm or less indicates that the components are substantially not detected in the film. Specifically, the methyl ethyl ketone may be 0 to 0.5 ppm or less, and the toluene may be 0 to 5 ppm or less. More specifically, the methyl ethyl ketone and the toluene may all be 0 ppm. Specifically, an anisotropic conductive film composition is prepared and stirred for 1 hour at 25 DEG C, the composition is coated on the release film to a thickness of 16 mu m, Which may mean the content of solvent measured after 15 minutes of drying.

According to still another embodiment of the present invention, there is provided an anisotropic conductive film comprising a binder portion, a hardened portion, a radical reaction initiator, and conductive particles, and substantially free from a harmful solvent to the human body.

The anisotropic conductive film according to another embodiment of the present invention includes a binder portion, a curing portion, a radical reaction initiator, and conductive particles, and contains 0 to 1 ppm of methyl ethyl ketone, 0 to 10 ppm of toluene, 1 ppm or less of benzene. Generally, benzene is used as an organic solvent in the binder part, part of the organic solvent, or decomposed benzoyl peroxide, which is a radical reaction initiator, and remains in the anisotropic conductive film to cause cancer in the human body. In the present invention, the presence of benzene in the film can be ruled out by using a solvent having good stability of liquid solution with other radical reaction initiator and having a binder part and a liquid solution stability and having a Hansen solubility parameter of 17 to 20 . Specifically, benzene in the anisotropic conductive film according to an exemplary embodiment of the present invention may be 0 ppm.

The anisotropic conductive film according to another embodiment of the present invention includes a binder portion, a curing portion, a radical reaction initiator, and conductive particles, and has a Hansen Solubility Parameter of 17 to 20 and a trace amount of a harmless solvent can do.

The anisotropic conductive film according to another embodiment of the present invention includes a binder portion, a curing portion, a radical reaction initiator, and conductive particles, and has a Hansen Solubility Parameter of 17 to 20 and a boiling point of 70 to 100 캜 And a second solvent having a first solvent and a Hansen Solubility Parameter of 17 to 20 and a boiling point of more than 100 to 130 ° C. The first solvent and the second solvent may remain in the anisotropic conductive film in an amount of more than 10 ppm, specifically more than 100 ppm.

Another example of the present invention provides a semiconductor device connected by the anisotropic conductive film disclosed in the present application. The semiconductor device includes: a first connected member containing a first electrode; A second connected member containing a second electrode; And an anisotropic conductive film according to the present invention, which is located between the first connected member and the second connected member and connects the first electrode and the second electrode. FIG. 1 is a cross-sectional view of a first connected member 50 and a second connected member 50 including a first electrode 70 and a second electrode 80 connected to each other by an anisotropic conductive film according to another example of the present invention 60). ≪ / RTI > When the anisotropic conductive film is placed between the first and second connected members 50 and 60 where the first electrode 70 is formed and the second connected member 60 is formed and the first electrode 70 and the second electrode 80 are formed, And the second electrodes 80 are connected to each other through the conductive particles 40. [

Examples of the respective components of the composition of the anisotropic conductive film which can be used together with the solvent shown in the present invention are described below, but these are provided by way of example only, and the invention is not limited thereto.

Binder part

The composition for anisotropic conductive films of the present invention may include a binder part serving as a matrix of the film. Examples of the binder portion include at least one selected from the group consisting of acrylic, urethane acrylate, acrylonitrile, styrene-acrylonitrile, butadiene, polyamide, olefin, urethane and silicone resins . For example, the binder part may be selected from the group consisting of an acrylic resin and a urethane acrylate resin. For example, the binder portion may include an acrylic resin; And nitrile butadiene rubber (NBR) resins and urethane-based resins.

The binder portion may be contained in an amount of 40 to 80% by weight based on the solid content in the composition for anisotropic conductive films. Within this range, film formation can be made well.

Hardening portion

The composition for anisotropic conductive films of the present invention may include a curing portion. Examples of the hardened portion may include a radical reactive acrylic hardened portion. Examples of the acryl-based cured part include urethane (meth) acrylate and (meth) acrylate monomers.

Urethane (meth) acrylate contains a urethane bond and a double bond at both ends. The polymerization reaction for producing urethane (meth) acrylate is not particularly limited. (Meth) acrylate monomers include, but are not limited to, 1,6-hexanediol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2- Hydroxypropyl (meth) acrylate, 4-butanediol (meth) acrylate, 2-hydroxyethyl (meth) acryloylphosphate, 4 (Meth) acrylate, trimethylolethane di (meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropane di (meth) acrylate, (Meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (Meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxy adduct nonylphenol (meth) acrylate, ethylene glycol di (meth) acrylate, triethylene glycol Acrylates such as di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, tripropylene glycol di (Meth) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxy-t-glycol (meth) acrylate, 2-methacryloyloxy methyl phosphate, 2- Roil But are not limited to, at least one selected from the group consisting of hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose, hydroxyethylcellulose,

The curing portion may be contained in an amount of 10-40 wt% based on the solid content in the composition for anisotropic conductive films. Within the above range, properties such as adhesion and appearance can be excellent, and reliability and stability can be obtained.

Radical  reaction Initiator

The composition for the anisotropic conductive film of the present invention may use at least one of a photopolymerization initiator and a thermosetting initiator as a radical reaction initiator. Specifically, a thermosetting initiator can be used.

The radical reaction initiator may be contained in an amount of 0.5-10% by weight based on the solid content in the composition for anisotropic conductive films. Within the above range, a sufficient reaction required for curing takes place, and excellent physical properties can be expected in adhesion strength, reliability, etc. after bonding through formation of an appropriate molecular weight.

Examples of the radical reaction initiator include a human free initiator such as lauryl peroxide, cumene hydroperoxide and the like. Benzoyl peroxide is not used herein because it contains a benzene ring which is a carcinogenic substance in the film.

Conductive particle

The composition for anisotropic conductive films of the present invention includes conductive particles which impart conductivity.

The conductive particles may be contained in an amount of 1-20% by weight based on the solid content in the composition for anisotropic conductive films. Within the above range, electrical conduction may be appropriately performed, and short-circuiting may not occur. The suitable amount of the conductive particles is determined depending on the use of the anisotropic conductive film and the content thereof may be varied.

Examples of the conductive particles include metal particles including gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder and the like; carbon; (Au), silver (Ag), nickel (Ni), copper (Cu), solder, and the like by using a resin including polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, Coated metal; One or more insulating particles coated with insulating particles may be used.

The size of the conductive particles is not particularly limited, but a diameter of 1 탆 to 20 탆 may be preferable for adhesion and connection reliability.

In addition, the composition for anisotropic conductive films of the present invention may further include a silane coupling agent and / or titanium oxide to provide additional physical properties without impairing basic physical properties. The additive is not particularly limited, but may be contained in an amount of 0.01 to 10% by weight in the composition for an anisotropic conductive film on the basis of a solid content.

The present invention provides an anisotropic conductive film formed from the composition for an anisotropic conductive film of the present invention. No special equipment or equipment is required to form the anisotropic conductive film. For example, after the composition for anisotropic conductive film of the present invention is dissolved in an organic solvent harmless to human body and liquefied, the conductive particles are agitated for a certain time within a speed range at which the conductive particles are not pulverized, And then dried for a predetermined time to volatilize the organic solvent or further cure by ultraviolet ray to obtain an anisotropic conductive film having a thickness of 4-40 탆.

Hereinafter, the present invention will be described in more detail by describing Examples, Comparative Examples and Experimental Examples. However, the following examples, comparative examples and experimental examples are merely examples of the present invention and should not be construed as limiting the scope of the present invention.

Example

Example  1: Preparation of composition harmless to human body for anisotropic conductive film

10% by weight of an NBR resin (N-34, manufactured by Nippon Zeon) based on the total solid weight of the composition as the binder resin part serving as a matrix for film formation; 30% by weight of a polyurethane binder (NPC7007T, NANUX); 20 wt% of urethane acrylate (NPC7000, NANUX); (Ethyl acetate: Hansen solubility parameter: 18.2; boiling point: 77 占 폚; butyl acetate: Hansen solubility parameter: 17.4; boiling point: 125 to 127 占 폚) in an amount of 10% by weight based on 100 parts by weight of an acrylic binder (AOF- ).

2% by weight of pentaerythritol tri (meth) acrylate which is a radical polymerization type (meth) acrylate monomer as a reactive monomer; 10% by weight of 4-hydroxybutyl (meth) acrylate; 7.5% by weight of dimethyloltricyclodecane diacrylate; And 2.5% by weight of lauryl peroxide as a radical reaction initiator were dissolved in ethylacetate / butyl acetate, and 8% of powdered nickel particles were added as a filler for imparting conductivity to the anisotropic conductive film to prepare an anisotropic conductive film composition .

Comparative Example  1: Preparation of composition for anisotropic conductive film

A composition was prepared in the same manner as in Example 1, except that the solvent was changed to ethanol (Hansen solubility parameter: 26.5, boiling point: 78 ° C).

Comparative Example  2: Preparation of composition for anisotropic conductive film

A composition was prepared in the same manner as in Example 1, except that the solvent used in Example 1 was methylcyclohexane (Hansen solubility parameter: 16, boiling point: 101 ° C).

Comparative Example  3: Preparation of composition for anisotropic conductive film

Except that 10 wt% of an NBR resin (N-34, Nippon Zeon) was dissolved in toluene / methyl ethyl ketone (ratio 1: 1 (weight ratio)) in Example 1, A composition was prepared.

Experimental Example : Preparation of Anisotropically Conductive Film and Measurement of its Properties

100 g of the anisotropic conductive film composition prepared in the above Examples and Comparative Examples were each stirred at 25 캜 for 1 hour, coated on the release film to a thickness of 16 탆 and dried at 70 캜 for 15 minutes to volatilize the solvents used An anisotropic conductive film was obtained. The initial adhesive force, initial connection resistance, reliability adhesive strength, reliability of connection resistance, solution stability, and residual solvent content of the anisotropic conductive film thus produced were evaluated, and the results are shown in Tables 3 and 4.

1. Adhesion

Each of the produced films was coated with a PCB (pitch: 200 占 퐉, terminal width 100 占 퐉, terminal distance 100 占 퐉, terminal height 35 占 퐉) and COF film (pitch 200 占 퐉, terminal width 100 占 퐉, Mu m) and connected under the following conditions.

1) pressing condition; 70 DEG C, 1 second, 1.0 MPa

2) This pressing condition; 150 DEG C, 4 seconds, 4.0 MPa

For the five specimens thus prepared, a UTM (Universal Testing Machine, H5KT,

Hounsfield) 1) After loading the load cell 2) After loading the load cell, install the grip to complete the measurement preparation. 3) After the sample is gripped by the grip, use a 90 ° peel method for tensile test speed 50mm / min The results are shown in Table 3 as the average initial adhesive strength. For reliability evaluation, the connected film was stored in a high-temperature and high-humidity chamber maintained at 85 ° C and 85% RH for 500 hours, and the average value was calculated by measuring the adhesive force in the same manner as described above.

2. Connection resistance

The connection resistance was measured by a 2 point probe method after measuring the connection resistance (measurement equipment: Keithley 2000 Multimeter) (initial connection resistance) and keeping it in a constant temperature and humidity condition for reliability evaluation, (500 Hr connection resistance). The two-point probe method can use a resistance measuring device, which measures the resistance between two points using two probes connected to the device. The resistance measuring device applies 1mA and the resistance is calculated by the measured voltage. In the reliability evaluation, the circuit connection was stored in a high-temperature and high-humidity chamber maintained at 85 ° C and 85% RH for 500 hours, and the connection resistance was measured to calculate an average value.

3. Liquid solution  stability

100 g of the anisotropic conductive film composition prepared in the above Examples and Comparative Examples was allowed to stand at room temperature for 8 to 12 hours and then coated on the release film to a thickness of 16 탆 in order to confirm whether or not the phase was kept in a stable state. The coated surface is observed by drying in an oven for 15 minutes. Check whether the conductive particles are clumped or not by a microscope. As shown in FIG. 2, phase separation occurred and the conductive particles were in a loose state as 'poor', and it was judged as 'good' that the conductive particles were uniformly dispersed throughout without any phase separation as shown in FIG.

Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Initial adhesion (gf / cm) 940 650 680 910 Initial connection resistance (Ω) 0.35 0.57 0.63 0.35 Reliability Adhesion (gf / cm) 730 420 450 740 Reliability Connection resistance (Ω) 0.68 4.78 5.62 0.68 Liquid solution stability Good Bad Bad Good

4. Solvent Residue

Further, 100 g of the anisotropic conductive film prepared in the above Examples and Comparative Examples was subjected to component analysis on the content of solvent by the method described in EPA 5021, 8260 using GC / MC, and the results are shown in Table 4 below.

Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 toluene N.D. N.D. N.D. 80ppm Methyl ethyl ketone N.D. N.D. N.D. 40 ppm benzene N.D. N.D. N.D. N.D.

ND: not detected (not detected)

As can be seen from the results of Tables 3 and 4, when the Hansen solubility parameter is more than 20 or less than 17, the stability of the crude liquid of the composition is lowered and the physical properties of the film are lowered. In the film using toluene or methyl ethyl ketone as a solvent, It can be seen that the substance is detected. The film composition and the film according to one example of the present invention do not contain human harmful substances and exhibit a safe and excellent adhesive force, connection reliability and liquid stability.

Claims (11)

A first solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 ° C and a Hansen solubility parameter of 17 to 20 And a second solvent having a boiling point of more than 100 and not more than 130 캜, with the proviso that the solvent is not toluene or methyl ethyl ketone. The composition for an anisotropic conductive film according to claim 1, wherein the first solvent is at least one of methyl acetate or ethyl acetate, and the second solvent is at least one of butyl acetate, isopropyl alcohol and isobutyl alcohol. The composition for an anisotropic conductive film according to claim 2, wherein the first solvent is ethyl acetate and the second solvent is butyl acetate. The composition for an anisotropic conductive film according to claim 1, wherein the radical reaction initiator is lauryl peroxide or cumene hydroperoxide. An anisotropic conductive film comprising a binder portion, a hardened portion, a radical reaction initiator, and conductive particles, wherein the anisotropic conductive film comprises 0 to 1 ppm methyl ethyl ketone, and 0 to 10 ppm toluene or less. The anisotropic conductive film according to claim 5, wherein the anisotropic conductive film has a first solvent having a Hansen solubility parameter of 17 to 20 and a boiling point of 70 to 100 ° C and a second solvent having a Hansen solubility parameter of 17 to 20 and a boiling point Lt; RTI ID = 0.0 > 130 C < / RTI > or less. The anisotropic conductive film of claim 6, wherein the first solvent is at least one of methyl acetate or ethyl acetate, and the second solvent is at least one of butyl acetate, isopropyl alcohol, and isobutyl alcohol. The anisotropic conductive film according to claim 5, wherein the radical reaction initiator is lauryl peroxide or cumene hydroperoxide. The anisotropic conductive film according to claim 5, wherein the anisotropic conductive film contains benzene in an amount of 0 to 1 ppm or less. A radical reaction initiator, conductive particles, ethyl acetate and butyl acetate. A first connected member containing a first electrode;
A second connected member containing a second electrode; And
Formed from the composition for an anisotropic conductive film according to any one of claims 1 to 4, which is located between the first to-be-connected members and the second to-be-connected members and connects the first electrode and the second electrode An anisotropic conductive film or an anisotropic conductive film according to any one of claims 5 to 9.
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