KR20150011541A - Optical semiconductor illuminating apparatus - Google Patents

Optical semiconductor illuminating apparatus Download PDF

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Publication number
KR20150011541A
KR20150011541A KR1020130086594A KR20130086594A KR20150011541A KR 20150011541 A KR20150011541 A KR 20150011541A KR 1020130086594 A KR1020130086594 A KR 1020130086594A KR 20130086594 A KR20130086594 A KR 20130086594A KR 20150011541 A KR20150011541 A KR 20150011541A
Authority
KR
South Korea
Prior art keywords
optical member
optical
edge
semiconductor
substrate
Prior art date
Application number
KR1020130086594A
Other languages
Korean (ko)
Inventor
김진종
유민욱
김정화
Original Assignee
주식회사 포스코엘이디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 포스코엘이디 filed Critical 주식회사 포스코엘이디
Priority to KR1020130086594A priority Critical patent/KR20150011541A/en
Priority to PCT/KR2013/010722 priority patent/WO2015012443A1/en
Priority to US14/093,070 priority patent/US9062858B2/en
Publication of KR20150011541A publication Critical patent/KR20150011541A/en
Priority to US14/713,570 priority patent/US20150247624A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources

Abstract

The present invention relates to an optical semiconductor illuminating apparatus which includes a housing which receives a heat sink; a substrate arranged in the heat sink; semiconductor optical devices which have a driving IC arranged in the center of the substrate and are adjacent around the driving IC; a first optical member which faces the semiconductor optical devices and transmits and reflects light emitted from the semiconductor optical devices, and has a vent hole which is vertically penetrated by corresponding to the driving IC; and a second optical member which is combined with the upper side of the housing and refracts light which transmits or is reflected from the first optical member and distributes it. The present invention relates to an optical semiconductor illuminating apparatus which uses semiconductor optical devices as a light source by using limited space and area to correspond to a single lens and also performs uniform and smooth heat dissipation.

Description

[0001] OPTICAL SEMICONDUCTOR ILLUMINATION APPARATUS [0002]

The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus capable of handling a plurality of semiconductor optical devices as a single light source by utilizing a limited space and area, And more particularly, to an optical semiconductor lighting device capable of being made to be made of a semiconductor.

Optical semiconductors using light sources such as LEDs (light emitting diodes), organic light emitting diodes (LEDs), laser diodes, organic light emitting diodes, etc. have lower power consumption than those of incandescent lamps and fluorescent lamps, have a long service life and excellent durability, It is one of the parts popularly used for illumination.

The lighting device based on the above-described optical semiconductor is characterized in that a housing having a heat sink is coupled to a socket base having the same shape as a halogen lamp or incandescent lamps, an optical semiconductor as a light source is arrayed in the housing, A structure in which a member is mounted is also being released.

When such an illumination device is fabricated with a small bulb-type lighting device called so-called candle light, it is not only difficult to efficiently arrange optical semiconductors on a narrow and limited substrate when arraying optical semiconductors on a substrate, There is a problem that the heat radiation performance can not be exerted smoothly due to its structural characteristics.

Therefore, it is urgent to develop a device capable of efficiently disposing circuit components and semiconductor optical elements in a limited space and area, and exerting heat-generating performance smoothly.

Utility Model Application No. 20-2009-0006686

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide an optical semiconductor lighting device which can handle a plurality of semiconductor optical devices as a single light source by using a limited space and area, .

It is another object of the present invention to provide an optical semiconductor lighting apparatus that can uniformly and smoothly perform heat dissipation.

According to an aspect of the present invention, there is provided a heat sink comprising: a housing for receiving a heat sink; A substrate disposed on the heat sink; A semiconductor optical device in which a driving IC is disposed at a center of the substrate and a plurality of semiconductor optical devices are disposed adjacent to the driving IC with the driving IC as a center; A first optical member that faces the plurality of semiconductor optical devices and transmits or reflects light emitted from the semiconductor optical device and forms a vent hole vertically penetrating the driving IC in correspondence with the driving IC; And a second optical member coupled to an upper side of the housing and refracting light transmitted or reflected from the first optical member to form a light distribution; The optical semiconductor lighting device according to the present invention can be provided.

Here, the first optical member may include a main body having the vent hole formed therein, and an insulating flange extending from a lower end edge of the main body to be in contact with a top edge of the substrate, wherein light emitted from the plurality of semiconductor optical elements And are collected at the edge of the vent hole and are transmitted or reflected through the side and upper end portions of the main body.

In this case, the first optical member includes a truncated conical body formed with the vent hole and becoming gradually narrower toward the upper side.

The vent hole includes an inverted truncated-cone-shaped bent portion formed vertically through the central portion of the main body of the first optical member disposed on the upper side of the substrate and gradually increasing from the bottom of the main body toward the upper side, And a funnel-shaped reflector formed to be gradually widened from an upper end portion of the main body to an upper surface edge of the main body.

The first optical member includes a main body having the vent hole formed therein and a light collecting portion formed on the bottom surface of the main body and disposed at the edge of the vent hole in correspondence with the plurality of semiconductor optical devices .

Further, the light condensing portion is protruded in a ring-like shape convex toward the plurality of semiconductor optical devices.

The second optical member is semi-elliptical in cross section cut in the minor axis direction with respect to the long axis, and the thickness of the lower end edge of the second optical member is thicker than the thickness of the upper end of the second optical member .

The optical semiconductor lighting apparatus further includes a ring step formed to be stepped along the inner side of the lower end edge of the second optical member and fixing the upper edge of the housing while fixing the lower end edge of the first optical member .

The heat sink further includes a mounting groove disposed on the substrate on an upper surface thereof. The lower end edge of the second optical member covers the edge of the mounting groove, and the upper surface edge of the substrate is connected to the first optical member And the drive IC and the plurality of semiconductor optical elements are insulated by the first and second optical members to be protected from the withstand voltage.

Further, the heat sink is a non-insulator, and the housing and the first and second optical members are insulators.

In addition, the 'semiconductor optical device' described in the claims and the detailed description means such as a light emitting diode chip or the like which includes or uses an optical semiconductor.

The 'semiconductor optical device' may include a package level including various kinds of optical semiconductor devices including the above-described light emitting diode chip.

According to the present invention having the above-described configuration, the following effects can be achieved.

First, a plurality of semiconductor optical elements are disposed on the basis of a driving IC as a reference in a limited and narrow area of a substrate, and a second optical member serving as a lens corresponding to a plurality of semiconductor optical elements while covering the top edge of the substrate By mounting a plurality of light sources as a single light source and coping with a single lens, it is possible to reduce fabrication and design costs and realize smooth light distribution.

In addition, the present invention can realize heat dissipation performance by uniformly and smoothly dissipating heat by the second optical member having vent holes that are vertically passing through the driving IC.

1 is an exploded perspective view showing an overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention;
2 is a cross-sectional schematic view showing the overall structure of an optical semiconductor lighting device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a schematic cross-sectional view illustrating the overall structure of an optical semiconductor lighting device according to an embodiment of the present invention.

It is understood that the present invention is a structure including the substrate 110, the heat sink 200, the housing 300, and the first and second optical members 410 and 420 as shown in the drawings.

The substrate 110 has a driving IC 120 disposed at the center and a plurality of semiconductor optical devices 130 disposed adjacent to the driving IC 120 with the driving IC 120 as a center. a light emitting diode (LED), a light emitting diode (LED), a light emitting diode (LED), and a light emitting diode can do.

The heat sink 200 is provided with a substrate 110 for improving heat generation from the driving IC 120 and the semiconductor optical device 130.

The housing 300 accommodates the heat sink 200 to provide a mounting space for the first optical member 410 to be described later.

The first optical member 410 is fixed to the upper surface edge of the substrate 110 by the lower edge of the second optical member 420 and forms a vent hole 411 penetrating through the upper surface of the substrate 110 in correspondence with the driving IC 120 The second optical member 420 is also used as an application for realizing a heat dissipation performance by inducing uniform and smooth heat dissipation through the vent hole 411 while performing the function of the optical member itself.

The second optical member 420 is coupled to the upper side of the housing 300 to change the light distribution area through light diffusion or scattering and protect the drive IC 120 and the semiconductor optical device 130 from external impact It also plays a role in this.

Therefore, if the first optical member 410 is for primarily controlling the light distribution, the second optical member 420 can be light-guided to secondarily control the lighting device having a light distribution area at a wider range of light distribution angles Of course.

More specifically, the first optical member 410 faces a plurality of semiconductor optical devices 130, and the first optical member 410 collects and reflects light emitted from the plurality of semiconductor optical devices 130 The light distribution control is performed.

In addition, the second optical member 420 performs secondary light distribution control to refract light transmitted or reflected from the first optical member 410 in an unspecified direction to form various light distribution.

It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention.

A plurality of semiconductor optical devices 130 function as a light source, and more specifically, it is advantageous in terms of layout design that the semiconductor optical devices 130 are disposed radially with the driving IC 120 as a center.

Meanwhile, the heat sink 200 performs a heat dissipation function as described above, and is generally made of a non-insulative material, such as aluminum or aluminum alloy, which is excellent in heat radiation performance.

The housing 300 and the first and second optical members 410 and 420 are made of an insulator with respect to the heat sink 200 which is a non-insulator. In order to protect the driver IC 120 and the semiconductor optical devices 130 from the withstand voltage, It will be advantageous.

The heat sink 200 is housed in a housing 300 to which a socket base 500 is coupled at a lower end.

More specifically, the heat sink 200 includes a cone 210, which is a metal material having a shape gradually becoming smaller toward the lower side, and it can be understood that the substrate 110 is disposed on the upper surface of the cone 210.

In detail, the housing 300 receives the heat sink 200, which is a non-insulator, on which the substrate 110 is disposed, and it can be seen that the housing 300 includes a cone 310 and a connecting portion 320 .

The cone 310 has an upper surface opened and an inner space for accommodating the heat sink 200 on which the substrate 110 is disposed and has a shape gradually becoming narrower toward the lower side. (410, 420) is mounted.

The connecting portion 320 extends from the lower portion of the cone portion 310 and is coupled to the socket base 500 to provide a space for electrically connecting the substrate 110 and the socket base 500 to each other.

The housing 300 may further include a step 332 for providing convenience for a series of operations for accurately fastening and fixing the heat sink 200.

The step portion 332 is stepped on the upper edge of the cone portion 310 so that the top edge of the heat sink 200 is disposed.

It is preferable that the heat sink 200 further includes a sleeve 215 disposed on the step portion 332 so as to be stepped on the upper edge of the cone 210 which is gradually narrowed toward the lower side.

The upper surface edge of the substrate 110 is covered with the lower edge of the first optical member 410 and the lower edge of the second optical member 420 described later covers the lower edge of the first optical member 410, The driving IC 120 and the plurality of semiconductor optical devices 130 may be insulated by the first and second optical members 410 and 420 to be protected from the withstand voltage.

The second optical member 420 is coupled to the upper side of the housing 300 as described above. In order to realize the so-called candle-like feeling as described above, the second optical member 420 has a semi-elliptical Shape.

Thus, the second optical member 420 may give a feeling of burning candles on the upper side of the housing 300 as a whole.

The thickness t2 of the lower end of the second optical member 420 is preferably larger than the thickness t1 of the upper end of the second optical member 420 for various light distribution implementations,

That is, the thickness of the second optical member 420 gradually increases from the upper end to the lower end of the second optical member 420. However, the second optical member 420 may be deflected through the second optical member 420, which is transparent or translucent, It is said that the direction of the irradiation of light is wide and diverse.

That is, the refractive index of the second optical member 420 increases as the thickness of the second optical member 420 gradually increases from the upper end portion to the lower end portion of the second optical member 420, The light that is transmitted or reflected from the light source 410 is irradiated while being bent at a larger angle, thereby realizing the light distribution in various directions, as well as being a technical means for fully realizing the downstream light.

More specifically, since the refractive index is large at a position near the lower end edge of the second optical member 420, the light transmitted or reflected from the first optical member 410 is again bent at a large angle and transmitted, .

The optical semiconductor lighting device according to an embodiment of the present invention may be used to fix and secure the second optical member 420 and the cone 310 of the housing 300 to each other, A ring step 411 may be provided for fixing.

That is, the ring step 411 is stepped along the inner side of the lower end edge of the second optical member 420, and fixes the lower end edge of the first optical member 410.

Meanwhile, the first optical member 410 is a structure including the main body 412 and the insulating flange 414 for performing the function of the optical member as well as the heat radiation performance as described above.

The main body 412 has a vent hole 411 penetrating the center portion vertically and the vent hole 411 is arranged to correspond to the center portion of the substrate 110 on which the driving IC 120 is disposed.

The insulating flange 414 extends from the lower end edge of the body 412 and contacts the upper surface edge of the substrate 110 and engages the ring edge 411 described above formed along the inner edge of the lower edge of the second optical member 420 It is fixed.

As can be seen in more detail, the shape of the main body 412 is a truncated cone shape gradually becoming narrower toward the upper side. The inclined outer surface of the main body 412 can be appropriately formed with respect to the insulating flange 414 It is possible to replace the component whose angle of inclination is changed and mount it on the substrate 110, thereby making it possible to adjust the light distribution angle.

The structure of the vent hole 411 will be described in more detail with reference to the structure including the bent portion 411v and the reflecting portion 411r as shown in FIG.

The bent portion 411v is vertically formed in the central portion of the main body 412 of the first optical member 410 disposed on the upper side of the substrate 110 and extends in the vertical direction from the bottom surface of the main body 412 toward the upper side, Shape.

The shape of the inverted truncated cone which gradually widens toward the upper side of the vent portion 411v is designed to induce a smooth rise of the heat since the volume of the heat that radiates toward the upper side is expanded and increased.

The reflector 411r has a funnel shape gradually increasing from the upper end of the vent portion 411v to the upper surface edge of the main body 412. Specifically, the reflector 411r is disposed at the upper portion of the main body 412 toward the center of the main body 412 Is formed by inclined surfaces 411s inclined downward and is a technical means for irradiating light from the semiconductor optical device 130 over a wider area.

That is, since the light emitted from the plurality of semiconductor optical devices 130 is reflected by being bent at various angles with respect to the inclined plane 411s, it is possible to adjust the light distribution in the various directions along with the second optical member 420 It will be done.

The first optical member 410 is formed on the bottom surface of the main body 412 and has a light collecting part 430 disposed at the edge of the vent hole 411 in a ring shape corresponding to the plurality of semiconductor optical devices 130 .

The light collecting part 430 is a technical means for allowing the body 422 to function as a single lens by treating a plurality of semiconductor optical devices 130 disposed on the substrate 110 as one light source.

Specifically, the optical waveguide is a structure in which the optical waveguide is protruded in a ring-like shape convexly toward the plurality of semiconductor optical devices 130, and has a structure in which an arc is connected to both ends of a substantially straight section.

The light emitted from the plurality of semiconductor optical devices 130 is collected at the light collecting part 430 and a part of the light is transmitted through the outer surface of the main body 412 or is reflected by the reflecting surface 411s of the upper surface of the main body 412 And it will be reflected in various directions through the reflection part 411r.

Since the second optical member 420 is structurally structured such that its thickness becomes thicker from the upper end portion to the lower end portion, the light transmitted or reflected in various directions from the first optical member 410 is refracted and transmitted through the different refractive index, As well as light distribution control in various directions.

As described above, the present invention provides an optical semiconductor lighting apparatus that can treat a plurality of semiconductor optical devices as a single light source by using a limited space and area, and can cope with a single lens and uniformly and smoothly perform heat dissipation Which is the basic technical idea.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

110 ... substrate
120 ... driving IC
130 ... semiconductor optical device
200 ... Heat sink
300 ... housing
410 ... first optical member
420 ... second optical member
500 ... socket base

Claims (10)

A housing for receiving the heat sink;
A substrate disposed on the heat sink;
A semiconductor optical device in which a driving IC is disposed at a center of the substrate and a plurality of semiconductor optical devices are disposed adjacent to the driving IC with the driving IC as a center;
A first optical member that faces the plurality of semiconductor optical devices and transmits or reflects light emitted from the semiconductor optical device and forms a vent hole vertically penetrating the driving IC in correspondence with the driving IC; And
A second optical member coupled to an upper side of the housing and refracting light transmitted or reflected from the first optical member to form a light distribution; And a light emitting diode (LED).
The method according to claim 1,
Wherein the first optical member comprises:
A body having the vent hole formed therein,
And an insulating flange extending from a lower edge of the body and contacting an upper edge of the substrate,
Wherein the light emitted from the plurality of semiconductor optical devices is collected at the edge of the vent hole and is transmitted or reflected through the side surface and the upper end of the main body.
The method according to claim 1,
Wherein the first optical member comprises:
And a truncated cone body formed with the vent hole and becoming gradually narrower toward the upper side.
The method according to claim 1,
The vent hole
A bent portion having an inverted truncated conical shape formed vertically through the central portion of the main body of the first optical member disposed on the upper side of the substrate and gradually increasing from the bottom of the main body toward the upper side,
And a funnel-shaped reflector formed to be gradually widened from an upper end of the vent portion to an upper surface edge of the main body.
The method according to claim 1,
Wherein the first optical member comprises:
A body having the vent hole formed therein,
And a light collecting portion formed on a bottom surface of the main body and disposed at an edge of the vent hole in correspondence with the plurality of semiconductor optical devices.
The method of claim 5,
The light-
And protrudes convexly toward the plurality of semiconductor optical devices.
The method according to claim 1,
Wherein the second optical member comprises:
Sectional shape cut in a minor axis direction with respect to a major axis,
And the thickness of the lower end edge of the second optical member is thicker than the thickness of the upper end of the second optical member.
The method according to claim 1,
In the optical semiconductor lighting device,
Further comprising a ring step formed to be stepped along an inner side of a lower end edge of the second optical member and fixing an upper edge of the housing while fixing a lower edge of the first optical member.
The method according to claim 1,
Wherein the heat sink further comprises a seating groove disposed on the substrate on an upper surface thereof, the lower end edge of the second optical member covers the edge of the seating groove, the upper surface edge of the substrate is covered with the first optical member, Wherein the driving IC and the plurality of semiconductor optical elements are insulated by the first and second optical members to be protected from withstand voltage.
The method according to claim 1,
Wherein the heat sink is a non-insulator, and the housing and the first and second optical members are insulators.
KR1020130086594A 2013-07-23 2013-07-23 Optical semiconductor illuminating apparatus KR20150011541A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020130086594A KR20150011541A (en) 2013-07-23 2013-07-23 Optical semiconductor illuminating apparatus
PCT/KR2013/010722 WO2015012443A1 (en) 2013-07-23 2013-11-25 Optical semiconductor lighting apparatus
US14/093,070 US9062858B2 (en) 2013-07-23 2013-11-29 Optical semiconductor lighting apparatus
US14/713,570 US20150247624A1 (en) 2013-07-23 2015-05-15 Optical semiconductor lighting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130086594A KR20150011541A (en) 2013-07-23 2013-07-23 Optical semiconductor illuminating apparatus

Publications (1)

Publication Number Publication Date
KR20150011541A true KR20150011541A (en) 2015-02-02

Family

ID=52487918

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130086594A KR20150011541A (en) 2013-07-23 2013-07-23 Optical semiconductor illuminating apparatus

Country Status (1)

Country Link
KR (1) KR20150011541A (en)

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