KR20150009172A - Method for Champering of a window substrate - Google Patents

Abstract

The present invention relates to a window substrate chamfering method. According to the present invention, the pressure that is applied onto a cutting surface of a window substrate by a chamfering means for chamfering the cutting surface while moving in contact with the cutting surface is kept constant so that damage to a protruding part can be prevented.

Description

[0001] The present invention relates to a method for chamfering a window substrate,

The present invention relates to a method of chamfering a window substrate.

Generally, the cutting and chamfering process of the flat panel display window substrate is performed in the following manner.

First, there is a mechanical cutting method. The system is mechanically engraved on the glass plate by dragging the diamond or carbide grinding wheel across the glass surface, and then cutting the glass plate along the scale to produce a cut edge. Typically, such a mechanical cutting method results in a lateral crack at a depth of about 100 to 150 탆, which cracks originate from the cutting line of the chewing wheel. Since the lateral crack reduces the strength of the window substrate, the cut surface of the window substrate must be polished and removed.

Next, there is a non-contact cutting method through a laser. The method is based on the fact that as the laser expands the glass surface by moving along a predetermined path on the glass surface past the check at the edge of the window substrate, the cooler moves along its trailing edge to stretch the surface, The crack is thermally propagated to cut the window substrate.

The cut surface of the above-mentioned mechanical or laser-cut window substrate is sharp, its surface is uneven and is vulnerable to external impact, so it must undergo chamfering process.

The chamfering process generally involves a step of rotating the polishing wheel to perform polishing, that is, machining of the cut surface, i.e. chamfering. The smoothness of the cut surface is improved and the strength is increased through the chamfering process. However, since the pressure is not uniformly applied to the cut surface, the protruded portion may be broken and fall off, and development of a technique for improving the smoothness is required.

Korean Patent No. 895830 discloses an edge processing method of a flat panel display glass substrate.

Korean Patent No. 895830

It is an object of the present invention to provide a chamfering method of a window substrate which can prevent damage to a protruding portion of a cut surface.

1. A method of chamfering a window substrate, wherein chamfering means for chamfering the chamfered surface while keeping contact with the chamfered surface of the window substrate maintains a constant pressure applied to the chamfered surface.

2. The method of chamfering a window substrate according to 1 above, wherein the deviation of the pressure applied by the chamfering means to the cut surface is 20% or less of the average pressure.

3. The method of claim 1, wherein the moving speed of the chamfering means is 100 to 800 mm / minute.

4. The method of claim 1, wherein the moving speed of the chamfering means is inversely proportional to the surface roughness of the cut surface.

5. The method of claim 1, wherein the chamfering means is a cylindrical chamfered wheel rotating at 10,000 to 50,000 rpm.

6. The method for chamfering a window substrate according to claim 1, further comprising a step of etching the chamfered portion.

7. The method of claim 6, wherein the etching process is performed for 20 seconds to 10 minutes.

8. The method for chamfering a window substrate according to claim 1, wherein the pressure is maintained by pressure adjusting means including a pressure transmitting portion, a pressure measuring portion and a pressure adjusting portion.

9. The method of chamfering a window substrate according to claim 8, wherein the pressure transmitting portion is connected to the chamfering means through a connecting portion and has a pressure transmitting means for transmitting a pressure transmitted from the connecting portion to a pressure measuring portion at an end thereof.

10. The method of claim 9, wherein the pressure transmitting means is a cylinder or a spring.

11. The method of claim 8, wherein the pressure measuring section measures the pressure applied from the end of the pressure transmitting portion.

12. The method for chamfering a window substrate according to claim 8, wherein the pressure regulating portion is connected to the pressure measuring portion and adjusts the pressure by pushing or pulling the pressure measuring portion according to the degree of the applied pressure.

It is possible to prevent the projected portion of the cut surface of the window substrate of the present invention from being damaged. Thus, the strength of the substrate can be prevented from lowering, and the process yield can be remarkably improved.

Fig. 1 shows an example of a unit glass product 100 obtained by cutting from a large-area glass 1. Fig.
2 schematically shows a chamfering means and a pressure adjusting means according to an embodiment of the present invention.

The present invention relates to a chamfering method for a window substrate capable of preventing damage to protruding portions by maintaining the pressure applied to the cut surface by chamfering means for chamfering the chamfered surface while moving in contact with a cut surface of a window substrate .

Hereinafter, the present invention will be described in detail.

FIG. 1 shows an example of a unit glass product 100 obtained by cutting from a large-area glass 1. This large-size glass 1 is cut into a unit glass product 100 of a desired size, It can be used as a window substrate applied to the front of the display. Examples of such a cutting step include a mechanical method of cutting with a diamond wheel or the like and an optical method of cutting with a laser.

The cut surface of the window substrate cut by such a method is not uniform and sharp, and is vulnerable to external impact and weak in strength. Therefore, a chamfering step for making the cut surface smooth is required.

A typical method of performing chamfering is to perform chamfering by bringing the chamfering means into contact with the chamfered surface. However, since the chamfered surface has uneven surfaces, when the conventional method is used, pressure is excessively applied to the chamfered portion, have. In this case, the strength around the part is lowered and the periphery needs to be taken evenly. Therefore, the chamfering amount is increased, the glass substrate is wasted, the chamfering means is worn, and the replacement cycle is shortened.

However, according to the present invention, chamfering can be prevented by applying chamfering pressure uniformly to the entire cut surface area.

The method of chamfering a window substrate according to the present invention is performed by applying chamfering means moving in contact with a cut surface of a window substrate with uniform pressure across the cut surface.

The chamfering means according to the present invention is not particularly limited, and means commonly used for chamfering a window substrate in the art can be used, for example, a chamfer wheel.

In the present invention, the uniform pressure includes not only completely the same pressure but also substantially the same level so as to prevent damage to the protruding portion of the cut surface. For example, the deviation of the pressure exerted by the chamfering means on the cut surface may be less than 20% of the mean pressure. When the deviation of the pressure is within the above range, the protruding portion of the cut surface can be prevented from being damaged.

The moving speed of the chamfering means is not particularly limited and may be appropriately selected so as to be chamfered uniformly without breaking the protruding portion of the cut surface, and may be, for example, 100 to 800 mm / min. When the moving speed is within the above range, the cut surface can be evenly chamfered without damage. From such a viewpoint, it may preferably be 150 to 700 mm / min.

Preferably, the moving speed of the chamfering means may be in inverse proportion to the surface roughness Ra of the cut surface.

As the moving speed of the chamfering means increases, the amount of impact applied to the chamfering surface increases. Therefore, when the moving speed of the chamfering means decreases as the surface roughness of the cut surface of the window substrate increases, the effect of preventing the protrusion of the chamfering surface can be maximized .

The process time can be shortened by increasing the moving speed of the chamfering means in the case where the surface roughness is low and there is little fear of damage.

When the chamfering means is a cylindrical chamfer wheel, the chamfering means performs chamfering while rotating. In such a case, the rotational speed of the chamfering means is not particularly limited, and may be, for example, 10,000 to 50,000 rpm. When the rotational speed of the chamfering means is within the above range, chamfering can be easily performed while suppressing damage to the protruding portion. From such a viewpoint, it may preferably be 12,000 to 45,000 rpm.

The chamfered surface in contact with the cut surface of the window substrate of the chamfering means may typically include diamond particles, abrasive, carbide particles, etc. as a cutting medium interspersed with a suitable matrix, i.e., a binder (e.g., resin or metal bonding matrix).

The particle size of the cutting medium is not particularly limited, and may be, for example, 200 to 1200 mesh, preferably 250 to 1000 mesh, more preferably 400 to 800 mesh. When the particle size of the cutting medium is within the range of 200 to 1200 meshes, chamfering can be easily performed while suppressing the damage of the projections.

If necessary, the chamfering method of the window substrate of the present invention may further include a step of etching the chamfered portion.

The etching process improves the smoothness of the chamfered portion, thereby maximizing the effect of preventing damage.

The etching method is not particularly limited. For example, the window substrate may be immersed in an etchant commonly used in the art, or the etchant may be sprayed onto the chamfered portion. Preferably, the window substrate is immersed in an etchant Can be performed.

The etching solution according to the present invention includes fluorine compounds. The fluorine compound is not particularly limited as long as it is a compound capable of emitting fluorine ions in an aqueous solution as a main component for etching a window substrate, and a compound commonly used in the art can be used.

The content of the fluorine compound is not particularly limited and may be, for example, 4 to 12% by weight, preferably 4 to 10% by weight, and more preferably 5 to 9% by weight based on the total weight of the etching solution. When the content of the fluorine compound is 4 to 12% by weight, it is possible to maximize the effect of preventing damage due to the smoothness improvement of the chamfered portion.

If necessary, the etchant according to the present invention may further include an additive having etchability, which is commonly used in the art, in addition to fluorine compounds for improving etching performance.

The etching solution may further include additives such as surfactants conventionally used in the art as needed, and it includes residual water.

The temperature of the etching solution is not particularly limited and can be suitably selected. For example, it may be 15 to 40 캜, preferably 18 to 38 캜, more preferably 20 to 35 캜. When the temperature of the etching solution is within the range of 15 to 35 占 폚, it is possible to maximize the effect of preventing damage due to the smoothness improvement of the chamfered portion.

The execution time of the etching process is not particularly limited within the range capable of performing the above function, and can be, for example, 20 seconds to 10 minutes, preferably 1 minute to 8 minutes, more preferably 1 minute to 5 minutes Minute. When the etching time is 20 seconds to 10 minutes, it is possible to maximize the effect of preventing damage due to the smoothness improvement of the chamfered portion.

Fig. 2 schematically shows an embodiment of the chamfering means 200 and the pressure adjusting means 300 used in the chamfering method of the window substrate of the present invention.

The chamfering means 200 is a chamfering wheel. The chamfering means 200 moves in contact with the cut surface of the window substrate, and exerts uniform pressure on the entire cut surface to perform chamfering.

The chamfered surface in contact with the cut surface of the window substrate of the chamfering means 200 may include the above-mentioned cutting medium.

In the case where the moving speed of the chamfering means 200 is inversely proportional to the surface roughness of the cut surface of the window substrate, the measurement of the surface roughness of the cut surface and the adjustment of the moving speed of the chamfering means 200 are performed by a conventional configuration known in the art .

The maintenance of the pressure can be performed by the pressure regulating means 300.

The pressure regulating means 300 senses the pressure applied by the chamfering means 200 to the cut surface so that it can be maintained at a certain level. For this, the pressure regulating means 300 may include a pressure transmitting portion 310, a pressure measuring portion 320, and a pressure regulating portion 330.

The pressure transmitting portion 310 is connected to the chamfering means 200 through a connecting portion 311 and is connected to a pressure transmitting portion such as a cylinder or a spring for transmitting the pressure transmitted from the connecting portion 311 to the pressure measuring portion 320, (312).

The pressure measuring part 320 measures the pressure applied from the end of the pressure transmitting part 310 in real time.

The pressure regulating unit 330 is connected to the pressure measuring unit 320 and adjusts the pressure by pushing or pulling the pressure measuring unit 320 according to the degree of the applied pressure to maintain the pressure uniformly.

Specifically, when the chamfering means 200 contacts the protruding portion of the cut surface and the pressure applied to the cut surface increases during the chamfering process, the pressure transmitting portion 310 connected to the chamfering means 200 transmits the pressure, The pressure measuring unit 320 measures the pressure. When the pressure measuring unit 320 detects the upward pressure, the pressure adjusting unit 330 pulls the pressure measuring unit 320 in the direction opposite to the pressure, thereby reducing the pressure applied by the chamfering means 200 to the cut surface .

In the opposite case, the pressure adjusting portion 330 pushes the pressure measuring portion 320 in the direction opposite to the pressure, thereby increasing the pressure applied by the chamfering means 200 to the cut surface.

In the present invention, the window substrate is not particularly limited as long as it is durable enough to be protected from external force by being applied to a liquid crystal display device, a touch screen panel, and the like, Can be used without any particular limitation. For example, glass, polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET) polyethyelene terepthalate, polyphenylene sulfide (PPS), polyallylate, polyimide, polycarbonate (PC), cellulose triacetate (TAC), cellulose acetate propionate acetate propionate, CAP), and the like can be used. Preferably, glass can be used, and more preferably, tempered glass can be used.

The object to which the window substrate according to the present invention is applied is not particularly limited. For example, it may be used as a transparent protection window of a monitor, a television, or the like, or may be applied to a touch screen panel or the like.

When the window substrate is applied to the touch screen panel, a laminated structure including electrode patterns may be formed on one surface thereof before chamfering.

Such a laminated structure can be adopted without limitation for the lamination structure known in the art depending on the specific use of the touch screen panel and the like. For example, at least one or more layers of an electrode pattern, an insulating layer, a BM, an index matching layer (transparent dielectric layer), a protective layer, and a scattering prevention layer may be used to form a stacked structure in various order. no.

The electrode pattern detects the static electricity generated by the human body and connects it to the electric signal when the finger is brought into contact with the display part which is the touch area of the image sensor.

The conductive material used for forming the electrode pattern is not particularly limited and examples thereof include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), cadmium tin oxide ), PEDOT (poly (3,4-ethylenedioxythiophene)), carbon nanotubes (CNT), and metal wires. These may be used alone or in combination of two or more.

The metal used for the metal wire is not particularly limited, and examples thereof include silver (Ag), gold, aluminum, copper, iron, nickel, titanium, tellurium, chromium and the like. These may be used alone or in combination of two or more.

An electrode pattern circuit may be formed on the non-display portion corresponding region of the electrode pattern. The electrode pattern circuit serves to transmit an electrical signal generated in the electrode pattern to the FPCB, an IC chip or the like by touching the window substrate display portion. The electrode pattern circuit can be formed by the same method using the same material as the electrode pattern.

The insulating layer prevents electrical shorting of the electrode. The material is not particularly limited, and may be formed of, for example, a metal oxide such as silicon oxide, a polymer, and an acrylic resin.

The BM (nonconductive pattern) forms an opaque decorative layer in the non-display portion at the edge of the window substrate so that the display portion, which is the touch region, is partitioned at the central portion of the window substrate in order to prevent the substrate,

The nonconductive pattern may be formed of a conventionally used composition for forming a nonconductive pattern including a binder resin, a polymerizable compound, a polymerization initiator, a pigment, a solvent and the like.

The composition for forming a nonconductive pattern may further comprise a nonconductive metal, a nonconductive oxide or a mixture thereof.

The kind of the nonconductive metal is not particularly limited, and examples thereof include tin or a silicon aluminum alloy.

The kind of the nonconductive oxide is not particularly limited, and examples thereof include titanium dioxide (TiO ₂ ), silicon dioxide (SiO ₂ ), and mixtures thereof.

The index matching layer may be formed comprising niobium oxide, silicon oxide, or mixtures thereof.

The protective layer serves to prevent contamination and breakage of the laminated structure including the electrode pattern from the outside.

The anti-scattering layer protects each of the patterns and prevents scattering of the window substrate when the window substrate ruptures.

The material of the anti-scattering film provides durability and is not particularly limited as long as it is a transparent material, and may be, for example, PET (polyethylen terephthalate).

The method of forming the anti-scattering film is not particularly limited, and examples thereof include a spin coating method, a roll coating method, a spray coating method, a dip coating method, a flow coating method, a doctor blade method, inkjet printing, screen printing, pad printing, gravure printing, offset printing, flexography printing, stencil printing, imprinting, and the like.

1: Large-area glass 100: Unit glassware
200: chamfer means 300: pressure adjusting means
310: pressure transmitting portion 311: connecting portion
312: pressure transmitting means 320: pressure measuring unit
330: Pressure regulator

Claims (12)

Wherein the chamfering means for chamfering the cut surface while moving in contact with the cut surface of the window substrate maintains a constant pressure applied to the cut surface.
The chamfering method of a window substrate according to claim 1, wherein the deviation of the pressure applied by the chamfering means to the cut surface is 20% or less of the average pressure.
The method according to claim 1, wherein the moving speed of the chamfering means is 100 to 800 mm / minute.
The method according to claim 1, wherein the moving speed of the chamfering means is inversely proportional to the surface roughness of the cut surface.
The method according to claim 1, wherein the chamfering means is a cylindrical chamfered wheel rotating at 10,000 to 50,000 rpm.
The method according to claim 1, further comprising a step of etching the chamfered portion.
7. The method of claim 6, wherein the etching process is performed for 20 seconds to 10 minutes.
The method for chamfering a window substrate according to claim 1, wherein the pressure is maintained by pressure adjusting means including a pressure transmitting portion, a pressure measuring portion, and a pressure adjusting portion.
The chamfering method for a window substrate according to claim 8, wherein the pressure transmitting portion is provided with a pressure transmitting means connected to the chamfering means through a connecting portion and transmitting a pressure transmitted from the connecting portion to a pressure measuring portion at an end thereof.
The method according to claim 9, wherein the pressure transmitting means is a cylinder or a spring.
9. The method of claim 8, wherein the pressure measuring section measures the pressure applied from the end of the pressure transmitting section.
The method according to claim 8, wherein the pressure regulating portion is connected to the pressure measuring portion and adjusts the pressure by pushing or pulling the pressure measuring portion according to the degree of the applied pressure.

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