KR20150008272A - Burn-in socket module - Google Patents

Burn-in socket module Download PDF

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Publication number
KR20150008272A
KR20150008272A KR1020130081791A KR20130081791A KR20150008272A KR 20150008272 A KR20150008272 A KR 20150008272A KR 1020130081791 A KR1020130081791 A KR 1020130081791A KR 20130081791 A KR20130081791 A KR 20130081791A KR 20150008272 A KR20150008272 A KR 20150008272A
Authority
KR
South Korea
Prior art keywords
dut board
contact
burn
connector
contact pin
Prior art date
Application number
KR1020130081791A
Other languages
Korean (ko)
Inventor
김한일
Original Assignee
(주)마이크로컨텍솔루션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)마이크로컨텍솔루션 filed Critical (주)마이크로컨텍솔루션
Priority to KR1020130081791A priority Critical patent/KR20150008272A/en
Publication of KR20150008272A publication Critical patent/KR20150008272A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details

Abstract

The present invention relates to a burn-in socket assembly. More specifically, the burn-in socket assembly includes: a burn-in socket; a DUT board electrically connected to the burn-in socket; and a connector which connects the DUT board and a main board of a burn-in socket testing apparatus. The connector includes an interpolation unit storing the inserted DUT board, and at least a part of the DUT board is inserted into the interpolation unit while having a part of the side surface coming in contact with the inner side surface of the interpolation unit. A terminal array comprising multiple terminal units is formed on a side surface of the DUT board, and a contact pin array including multiple contact pins can be formed on the inner side surface of the interpolation unit. The DUT board and the connector can be electrically connected when the respective terminal units and contact pins come in contact with each other.

Description

BURN-IN SOCKET MODULE < RTI ID = 0.0 >

The present invention relates to a burn-in socket assembly, and more particularly to a burn-in socket assembly for connecting a burn-in socket, a DUT board electrically connected to the burn-in socket, a main board of the DUT board and a burn- Wherein the connector includes an insert portion into which the DUT board can be inserted, wherein at least a portion of the DUT board is inserted into the insert portion, And a contact pin array formed by a plurality of contact pins is formed on an inner side surface of the interpolation part, and the terminal pins are connected to the respective terminal parts, And the contact pins are brought into contact with each other to electrically connect the DUT board and the connector.

In general, in order to verify the durability and reliability of a device in a semiconductor device testing process, a semiconductor device is mounted on a test socket, which is then coupled to a DUT (Device Under Test) board and electrically connected to the test board at a high temperature of about 120 ° C The test will be performed. This device test process is called a burn-in test, and a burn-in socket is used for this burn-in test.

However, such a burn-in socket is mounted on the DUT board as described above, and a connector for connecting the DUT board and the test board of the test equipment is separately provided so that the DUT board can be electrically connected to the test board do.

Therefore, it is important that the electrical connection between the connector and the DUT board is completed. Although various connection schemes have been proposed for this purpose, it is not easy to connect and detach and repeatedly used. There are many problems. Recently, surface mounting method (SMT) has been applied by soldering. However, surface mounting method is completely combined. Therefore, it is difficult to separate if there is a problem afterward, There is a problem in that it must be discarded at once.

Therefore, there is an urgent need to develop a coupling method between a DUT board and a connector that can solve such a problem.

Public utility model 20-2009-0008963

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a DUT board, which is electrically connected to a burn-in socket, Wherein the connector includes an insertion portion into which the DUT board can be inserted, wherein at least a portion of the DUT board is inserted into the insertion portion, and a portion of the side portion And a contact pin array formed by a plurality of contact pins is provided on an inner side surface of the interpolation unit, and each of the plurality of contact pin arrays In which the terminal portion of the DUT board and the contact pin are brought into contact with each other to electrically connect the DUT board and the connector.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a burn-in socket assembly which includes a burn-in socket, a DUT board electrically connected to the burn- And a connector for connecting a main board of the test equipment to the burn-in test equipment, wherein the connector includes an interpolation unit into which the DUT board can be inserted, Wherein a portion of a side surface of the DUT board is configured to be in contact with an inner surface of the inner portion, a terminal array composed of several terminal portions is provided on a side surface of the DUT board, and a plurality of contact pins A contact pin array is provided, and each of the terminal portions and the contact pin are in contact with each other to electrically connect the DUT board and the connector.

Preferably, according to an embodiment of the present invention, the contact pin includes a contact portion exposed from the inner side surface of the interpolation portion and contacting the terminal portion, and the contact portion has a curved portion having a predetermined curvature.

Preferably, according to an embodiment of the present invention, the contact portion is configured to elastically displace laterally as it contacts the terminal portion.

Preferably, according to an embodiment of the present invention, the connector includes a receiving groove in which the contact pin is received, and the volume of the receiving groove is set such that the contact pin displaces and / Or deformation of the contact pin.

Preferably, according to an embodiment of the present invention, a step is formed in the lower portion of the interpolation unit such that the DUT board is inserted by a predetermined depth to fix the position.

Preferably, according to an embodiment of the present invention, an engagement portion protruding inwardly is formed on the inner side of the above-mentioned interpolation portion so as to catch at least one portion of the DUT board.

According to the burn-in socket assembly according to the present invention, it is possible to easily remove the DUT board.

In addition, close contact between the contact pin and the terminal portion and fixation and support of the DUT board can be achieved.

Thus, not only a reliable electrical connection between the connector and the DUT board is achieved, but accidental disconnection of the DUT board can be prevented. In addition, it is possible to prevent the connector from being damaged in spite of repetitive disassembly of the DUT board.

Also, unlike the conventional connector structure, since the male connector and the female connector structure can be omitted, a simple structure of the connector structure can be achieved and the production cost can be reduced. In addition, since the refrigerant phenomenon is eliminated due to the SMD type, the reliability of use can be greatly improved.

1 is a view illustrating a burn-in socket assembly according to an embodiment of the present invention.
2 is an exploded view of the burn-in socket assembly shown in FIG.
3 is a view showing a terminal array formed on a side surface of the DUT board shown in FIG.
4 is a view showing a contact pin array formed in an interpolation part of the connector shown in Fig.
5 is a cross-sectional view of the connector.
6 is a cross-sectional view illustrating a connector of a burn-in socket assembly and a DUT board connected to each other according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Spatially relative terms such as " lower ", "upper ", " side ", and the like are used to easily describe one member or components and other members or components Spatially relative terms should be understood to include, in addition to the directions shown in the drawings, terms that include different orientations of the elements at the time of use or operation. For example, when reversing a member shown in the figure, Quot; upper "of the other member may be placed" lower " of the other member. Thus, by way of example, the term "upper" may include both downward and upward directions. Quot; left < / RTI > direction "may be" back and forth "depending on the viewpoint, Therefore, the time may include a number of different directions.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used in the specification, "comprises" and / or "comprising " do not exclude the presence or addition of one or more other members other than the recited member.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

In the drawings, the thickness and size of each part are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, in the embodiment, the directions mentioned in the process of describing the structure of the present invention are based on those described in the drawings. In the description of the structure constituting the present invention in the specification, reference points and positional relations with respect to directions are not explicitly referred to, reference is made to the related drawings.

1 is an exploded view of the burn-in socket assembly shown in Fig. 1, Fig. 3 is a side view of the burn-in socket assembly shown in Fig. 2, FIG. 4 is a view showing a contact pin array formed in an inner portion of the connector shown in FIG. 2, FIG. 5 is a cross-sectional view of the connector, and FIG. Sectional view showing the connector of the burn-in socket assembly according to the example and the DUT board connected to each other.

Referring to FIG. 1, a burn-in socket 10 assembly according to the present invention includes a burn-in socket 10, a DUT board 20 electrically connected to the burn-in socket 10, (20) and a main board (40) of a burn-in test equipment, wherein the connector (30) comprises a connector (30) for inserting the DUT board (20) Wherein at least a portion of the DUT board 20 is inserted into the insertion portion 310 and a portion of the side surface of the insertion portion 310 is in contact with the inner surface of the insertion portion 310, A terminal array 210 including a plurality of terminal portions 212 is provided on a side surface of the board 20 and a contact pin array 320 composed of several contact pins 330 is formed on the inner surface of the interpolation portion 310 And the DUT board 20 and the connector 30 are electrically connected to each other by the terminal portions 212 and the contact pins 330 being in contact with each other .

The burn-in socket 10 may correspond to various types of burn-in sockets 10, and is not limited in its form and use. As an example, it may be a TSOP-type burn-in socket 10 and auxiliary coupling means may be provided to secure the coupling between the DUT board 20 and the connector 30, It is not limited like this.

The burn-in socket 10 is disposed on the DUT board 20 and can be electrically connected to the DUT board 20. The DUT board 20 may be a general PCB, but is not limited thereto.

The DUT board 20 is connected to the main board 40 of the burn-in test equipment, and a predetermined connector 30 may be provided to achieve the connection. The connector 30 may be a member for mediating a connection between the main board 40 of the burn-in test equipment and the DUT board 20.

The DUT board 20 is connected to the connector 30 and the connector 30 may include an insertion portion 310 into which at least a portion of the DUT board 20 is inserted.

In the drawing, the insertion unit 310 is illustrated as being upwardly moved so that the DUT board 20 moves downward from the upward direction and is inserted into the insertion unit 310, but the present invention is not limited thereto. At least a portion of the side surface of the DUT board 20 is connected to the inner surface of the inner portion 310 of the connector 30 as the DUT board 20 is inserted into the insertion portion 310 of the connector 30, As shown in FIG.

The DUT board 20 includes a terminal array 210 including a plurality of terminal portions 212 and a contact pin array 330 including a plurality of contact pins 330 on the inner surface of the inserting portion 310. [ (320) may be provided. The terminal portions 212 and the contact pins 330 may be in contact with each other as the side surface of the DUT board 20 and the inner surface of the internal portion 310 of the connector 30 are in contact with each other The DUT board 20 and the connector 30 can be electrically connected to each other.

The DUT board 20 is inserted into the insertion portion 310 formed in the connector 30 and the contact pin 330 and the terminal portion 212 are brought into contact with each other so that the electrical connection between the DUT board 20 and the connector 30 A simple and easy connection between the DUT board 20 and the connector 30 can be achieved.

The contact pin 330 may include a contact portion 332 exposed from the inner surface of the insertion portion 310 and contacting the terminal portion 212. The contact portion 332 may have a predetermined curvature And the curved direction of the curved portion 334 may be the same as the insertion direction of the DUT board 20.

That is, when the DUT board 20 is inserted into the insertion portion 310 as the at least one portion of the contact pin 330 is exposed from the inner surface of the insertion portion 310, And a contact portion 332 contacting the terminal portion 212 provided on the side surface. The electrical connection between the DUT board 20 and the connector 30 can be achieved as the contact portion 332 contacts the terminal portion 212 of the terminal array 210. [

At this time, preferably, the contact pins 330 are elastically deformed in the lateral direction in accordance with the contact of the terminal portions 212.

That is, as the DUT board 20 is inserted downward, the terminal portions 212 formed on the side of the DUT board 20 and the contact pins 330 are laterally contacted with each other, 330 may be elastically deformed laterally. Preferably, the degree of deformation may have a suitable deformation size so that the contact pin 330 can be restored to its original shape when the DUT board 20 is detached from the connector 30. [ That is, deformation within the extent that the restoration performance according to the elastic force is maintained is preferable.

On the other hand, when the contact pin 330 is elastically deformed laterally, it can be understood that the contact portion 332 is displaced like a lateral tilting. The contact portion 332 of the contact pin 330 comes into contact with the terminal portion 212 and is displaced in the lateral direction to be displaced in the lateral direction due to the contact of the contact portion 332 It can be understood that it is tilted about the lower portion.

The contact portion 332 may have a curved portion 334 having a predetermined curvature and the curved direction of the curved portion 334 may be the same as the insertion direction of the DUT board 20.

That is, as shown in FIG. 5, when the DUT board 20 is inserted in the downward direction from the upward direction, the curved portion 334 may be curved in the vertical direction. When the contact portion 332 of the contact pin 330 and the terminal portion are in contact with each other in the process of inserting the DUT board 20 into the insertion portion 310, the contact portion 332 contacts the contact pin 330 The DUT board 20 can be inserted without difficulty and the DUT board 20 can be easily inserted and the contact pin 330 and the terminal portion 212 can be closely contacted with each other, Can be achieved.

Preferably, the connector 30 includes a receiving groove 342 in which the contact pin 330 is received, and the volume of the receiving groove 342 is smaller than the volume of the receiving groove 342 when the contact pin 330 is received And may be formed larger than the volume of the contact pin 330 so as to be displaced and / or deformed in the groove 342.

As shown in FIG. 5, the connector 30 may include a receiving groove 342 through which the contact pin 330 can be received and fixed. At this time, the contact pin 330 and / or the receiving groove 342 may include a predetermined protrusion and groove so that the contact pin 330 can be received in the receiving groove 342 and be firmly fixed.

The receiving groove 342 may be formed in the connector body 340 that forms the main body of the connector 30. The volume of the receiving groove 342 is formed to be larger than the volume of the contact pin 330 so that the contact pin 330 can be displaced and / or deformed in the receiving groove 342 in accordance with application of an external force, You can have a tolerance.

That is, when the DUT board 20 is inserted into the insertion portion 310 and the contact pin 330 and the terminal portion 212 are in contact with each other, the contact pin 330 may be deformed and / or displaced. The volume of the receiving groove 342 in which the contact pin 330 is received is configured to be larger than the volume of the contact pin 330 so that the contact pin 330 can be easily deformed and / Lt; / RTI >

For example, the width of the receiving groove 342 may be larger than the width of the curved portion 334 of the contact pin 330. 5, the width L of the receiving groove 342 may be larger than the width P of the curved portion 334 in the lateral direction. Accordingly, when the DUT board 20 is inserted into the insertion portion 310 and the contact pin 330 and the terminal portion 212 are in contact with each other, the contact pin 330 may be pushed backward to be deformed and displaced.

On the other hand, the present invention is not limited to the above, and at least a portion of the receiving groove 342 may be elongated or may have a wide width to achieve the deformation and / or displacement of the contact pin 330 as described above.

At this time, the contact pins 330 may be made of a material having elasticity so as to have a predetermined restoring force in addition to the electrical conductivity so that the contact pins 330 and the terminal portions 212 can be closely contacted with each other . 5, in the initial state in which the contact pin 330 and the terminal portion 212 are not in contact with each other, the contact pin 330 protrudes at a predetermined interval in the inward direction of the interpolation unit 310 . ≪ / RTI > The terminal portion 212 pushes the contact pin 330 back and forth so that the contact between the terminal portion 212 and the contact pin 330 can be prevented Can be achieved.

Preferably, a step 350 is formed in the lower portion of the interpolation unit 310 so that the DUT board 20 is inserted by a predetermined depth to fix the position.

That is, a predetermined step 350 is formed in the lower part of the interpolation part 310, and the step 350 is formed in the DUT board 20 when the DUT board 20 is inserted into the insertion part 310, So that the DUT board 20 can be fixed in position at a predetermined height.

By such a step, the DUT board 20 is fixed in position at a predetermined height, so that the contact between the contact pin 330 and the terminal portion 212 is achieved, and a reliable electrical connection can be secured.

Preferably, the inner part of the interpolation part 310 is formed with a latch part protruding inwardly so that at least one part of the DUT board 20 is caught.

For example, as shown in FIGS. 5 and 6, a predetermined protrusion 360 is provided on an upper portion of the contact pin array 320, and the protrusion 360 protrudes from the DUT board 20 The DUT board 20 can be inserted and fixed in the insertion portion 310 by finely anchoring the DUT board 20 when the insertion portion 310 is inserted into the insertion portion 310. [ Preferably, the width of the protrusion 360 may be somewhat fine so that the easy removal of the DUT board 20 can be achieved. Since the protrusion 360 is made of a material having a predetermined elasticity, .

According to the above-described structure, it is possible to achieve close contact between the contact pin 330 and the terminal portion 212, and fixation and support of the DUT board 20 by the contact pin 330.

Accordingly, a reliable electrical connection between the connector 30 and the DUT board 20 is achieved, and an accident that the DUT board 20 is unintentionally disengaged can be prevented. In addition, the easy detachment of the DUT board 20 can be made, and the connector 30 can be prevented from being damaged even when the DUT board 20 is repeatedly detached.

In addition, unlike the conventional connector structure, since the male connector and the female connector structure can be omitted, a simple structure of the connector 30 can be achieved, so that the production cost can be reduced. In addition, since the refrigerant phenomenon is eliminated due to the SMD type, the reliability of use can be greatly improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

1: burn-in socket assembly 10: burn-in socket
20: DUT board 30: connector
40: main board 210: terminal array
212: terminal portion 310:
320: contact pin array 330: contact pin
332: contact portion 334:
340: connector body 342: insertion hole
350: Step 360:

Claims (6)

A burn-in socket assembly comprising a burn-in socket, a DUT board electrically connected to the burn-in socket, and a connector connecting the DUT board and the main board of the burn-in test equipment,
Wherein the connector includes an interpolation unit into which the DUT board can be inserted,
Wherein the DUT board is configured such that at least one portion thereof is inserted into the interpolation portion, and that a portion of the side surface is in contact with the inner surface of the interpolation portion,
On the side surface of the DUT board, a terminal array composed of several terminal portions is provided,
The inner surface of the interpolation unit is provided with a contact pin array composed of several contact pins,
Wherein each of the terminal portions and the contact pins are in contact with each other to electrically connect the DUT board and the connector. The method according to claim 1,
The contact pin
And a contact portion exposed from the inner side surface of the above-mentioned interpolation portion and contacting the terminal portion,
Wherein the contact portion has a curved portion with a predetermined curvature. The method of claim 2,
The contact portion
And is elastically displaced laterally as it contacts the terminal portion. The method according to claim 1,
Wherein the connector includes a receiving groove in which the contact pin is received,
Wherein the volume of the receiving groove is formed larger than the volume of the contact pin so that the contact pin can be displaced and / or deformed in the receiving groove according to application of an external force. The method according to claim 1,
In the lower part of the above-mentioned interpolation section,
Wherein the stepped portion is formed such that the DUT board is inserted by a predetermined depth to be fixed in position. The method according to claim 1,
And the inner portion of the inner portion is provided with an inwardly protruding engaging portion for engaging at least a portion of the DUT board.
KR1020130081791A 2013-07-11 2013-07-11 Burn-in socket module KR20150008272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130081791A KR20150008272A (en) 2013-07-11 2013-07-11 Burn-in socket module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130081791A KR20150008272A (en) 2013-07-11 2013-07-11 Burn-in socket module

Publications (1)

Publication Number Publication Date
KR20150008272A true KR20150008272A (en) 2015-01-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102312971B1 (en) * 2021-07-13 2021-10-14 김상주 Connector for board with simplified mating structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102312971B1 (en) * 2021-07-13 2021-10-14 김상주 Connector for board with simplified mating structure

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