KR20140146744A

KR20140146744A - Bobbin for speaker device and speaker device using same

Info

Publication number: KR20140146744A
Application number: KR1020130069380A
Authority: KR
Inventors: 심정보
Original assignee: 심정보
Priority date: 2013-06-18
Filing date: 2013-06-18
Publication date: 2014-12-29

Abstract

The present invention relates to a bobbin of a speaker device. The bobbin of the speaker device according to the present invention includes an inner circumference and an outer circumference. A voice coil is wound around at least part of the outer circumference. The bobbin includes: a heat dispersion layer which forms the outer circumference, has a first heat conductivity, and disperses heat generated from the voice coil on a surface through conduction; and a heat blocking layer which forms the inner circumference, has a second heat conductivity which is lower than the first heat conductivity, and blocks the radiation of the heat from the voice coil to a magnetic circuit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bobbin for a speaker device,

The present invention relates to a bobbin of a speaker device. And more particularly to a bobbin of a speaker device capable of improving acoustic performance of a speaker device.

The voice coil of the speaker device has a high resistance component because of its small cross-sectional area. As a result, the internal temperature of the speaker device rises to about 150 ° C to 300 ° C. However, the magnet that provides the driving force to the voice coil functions as a magnet at a temperature above the Curie temperature. Therefore, if the internal temperature of the speaker device is increased, the magnetic field strength of the magnet constituting the magnetic circuit is lowered or eliminated to lower the driving force of the speaker, thereby lowering SPL (Sound Pressure Level). Particularly, since the size of the speaker is small, a SPL drop problem due to use in a TV speaker or a micro speaker for IT equipment in which a voice coil and a magnet are arranged adjacent to each other seriously occurs.

Fig. 1 shows a conventional bobbin 10 of a speaker device for a TV part, and Fig. 2 shows a heat flow in a conventional speaker device. As shown in FIGS. 1 and 2, the conventional bobbin 10 is made by winding a voice coil 13 on a polyimide film 11, such as a Kapton film of Dupont Co., and aligning the lead wires and reinforcing the bobbin 10 A paper film 12 such as a kraft paper. The paper film 11 and the polyimide film 12 having a low thermal conductivity do not play a role of dispersing heat in a continuous high temperature environment, and the heat generated in the voice coil 13 is radiated to the adjacent magnetic To the magnet (21) and plate (22) of the circuit (20). The heated plate 22 further conveys the heat incident by the conduction to the magnet 21. The magnetic field strength of the magnet 21 is reduced through the heat transfer process.

In order to solve such a problem, a method of forming a heat outlet or attaching a heat sink to the yoke 23 has been proposed. The structure for forming the heat outlet is disclosed in Korean Utility Model Registration No. 20-0218617. The method of forming the heat outlet simply discharges a part of the convection heat to the outside, and it can not directly block the radiant heat to the magnetic circuit, and the heat radiation effect is insufficient. In addition, there is a problem in that vibration of the diaphragm can be reduced because the heat exhaust port can not maintain the closed state of the rear surface of the diaphragm.

The structure for attaching the heat sink is disclosed in Korean Utility Model Registration No. 20-0218617. The structure for attaching the heat sink partly discharges the conduction heat of the heated yoke through the heat sink, so that it can not directly block the radiant heat to the magnetic circuit, and the heat radiation effect is insufficient. Also, in the structure in which the bottom surface of the yoke is formed like the bottom surface of the frame, the side surface of the yoke is not exposed, so that the yoke must extend below the bottom surface of the frame in order to generate a heat sink. However, this structure has a problem in that the thickness of the speaker device is increased, and thus the IT device which is thinned and shortened can not meet the slimming requirement of the speaker device.

On the other hand, the problem of deterioration of the magnet due to heat is more problematic in a component type speaker device using a single driving circuit. Currently, a speaker device using a planar diaphragm uses a plurality of driving circuits as a slim TV speaker device commercialized. Such a structure is disclosed in Korean Patent Laid-Open Publication No. 10-2010-0011199. According to this structure, the input currents can be evenly distributed to the plurality of voice coils connected in parallel to each other, thereby reducing the heat generated in the individual voice coils. However, since a speaker device using a plurality of drive circuits requires a large number of expensive components such as a magnet, a yoke, a plate, and a voice coil as the number of drive circuits, the manufacturing cost increases and the manufacturing process becomes complicated.

Korean Patent Publication No. 10-2004-0050960 Korean Utility Model Registration No. 20-0218617 Korean Patent Publication No. 10-2010-0011199

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to prevent the SPL deterioration of the speaker device by minimizing heat flow into the magnet by dispersing heat generated from the voice coil, .

Since the bobbin of the speaker device according to the embodiment of the present invention effectively blocks the heat generated from the voice coil from flowing into the magnet, the deterioration of the magnet due to heat generated in the voice coil, even if the input current is concentrated in the single voice coil, Another object of the present invention is to reduce the manufacturing cost of the speaker device and to simplify the manufacturing process to improve the yield of the speaker device.

In order to achieve the above object, a bobbin of a speaker device according to the present invention is characterized in that the bobbin includes an inner circumferential surface and an outer circumferential surface, and a voice coil is wound on at least a part of the outer circumferential surface, A heat dissipation layer having heat dissipated from the voice coil and dispersed to the surface through conduction; And a heat shield layer forming the inner circumferential surface and having a second thermal conductivity lower than the first thermal conductivity and blocking radiation to the magnetic circuit of heat generated in the voice coil.

In the bobbin of the speaker device according to the embodiment of the present invention, the heat fault layer preferably has a second thermal conductivity (unit: W / (mK)) of at least 1/100 of the first thermal conductivity of the heat dispersion layer, .

In the bobbin of the speaker device according to the embodiment of the present invention, it is preferable that the heat dispersion layer has the first thermal conductivity of 100 W / (m · K) or higher and the thermal barrier layer has the second thermal conductivity of 1 W / (m 占)) or less.

In the bobbin of the speaker device according to the embodiment of the present invention, the heat dispersion layer is formed to a thickness of 0.01 to 0.1 mm, and the heat insulation layer is formed to a thickness of 0.01 to 0.1 mm.

In the bobbin of the speaker device according to the embodiment of the present invention, the heat dispersion layer is formed of a metal sheet or a carbon-based heat dissipation sheet, and the heat insulation layer is formed of a polymer film.

In the bobbin of the speaker device according to the embodiment of the present invention, the heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet, and the heat dissipation layer is formed by applying a polymer solution to the inner surface of the heat dissipation layer .

The bobbin of the speaker device according to the embodiment of the present invention is characterized in that the heat fault layer is formed of a polymer film and the heat dispersion layer is formed by depositing metal on the outer surface of the heat fault layer.

In the bobbin of the speaker device according to the embodiment of the present invention, the heat dispersion layer is in thermal contact with the bottom surface of the diaphragm having the third thermal conductivity of at least the second thermal conductivity of the heat fault layer.

In the bobbin of the speaker device according to the embodiment of the present invention, a portion of the heat dispersion layer under the voice coil is exposed through the outer peripheral surface of the bobbin.

A bobbin of a speaker device according to another embodiment of the present invention includes an inner circumferential surface and an outer circumferential surface, and a voice coil is wound on at least a part of the outer circumferential surface of the bobbin. A heat fault layer formed on an outer circumferential surface of the support layer and having a second thermal conductivity and blocking radiation of heat generated in the voice coil to a magnetic circuit; And a heat dissipation member which is formed on an outer circumferential surface of the heat fault layer so as to include an area where the voice coil is wound and has a first thermal conductivity higher than the second thermal conductivity and disperses heat generated from the voice coil to a surface through conduction And a layer.

In the bobbin of the speaker device according to the embodiment of the present invention, the support layer is formed of a polymer film or a paper film, the heat dispersion layer is formed of a metal sheet or a carbon-based heat radiation sheet, And is formed of a film.

In the bobbin of the speaker device according to the embodiment of the present invention, the support layer is formed of a polymer film or a paper film, the heat dispersion layer is formed of a metal sheet or a carbon-based heat radiation sheet, And a polymer solution is applied to the inner circumferential surface of the heat acid layer or the outer circumferential surface of the support layer.

In the bobbin of the speaker device according to the embodiment of the present invention, the support layer is formed of a polymer film or a paper film, the heat fault layer is formed of a polymer film, and the heat dispersion layer is made of a metal Is formed.

In the bobbin of the speaker device according to the embodiment of the present invention, the support layer is formed of a polymer film or a paper film, the heat fault layer is formed by applying a polymer solution to the outer surface of the support layer, And is formed by depositing a metal on the outer surface of the heat fault layer.

A bobbin of a speaker device according to another embodiment of the present invention includes an inner circumferential surface and an outer circumferential surface, and a voice coil is wound on at least a part of the outer circumferential surface of the bobbin. A heat dissipation layer formed on an outer circumferential surface of the support layer so as to include at least an area where the voice coil is wound, the heat dissipation layer having a first thermal conductivity and dispersing heat generated from the voice coil to the surface through conduction; And a heat shielding layer formed on an inner circumferential surface of the support layer and having a second thermal conductivity lower than the first thermal conductivity and blocking radiation from the voice coil to the magnetic circuit.

In the bobbin of the speaker device according to the embodiment of the present invention, the supporting layer may be formed of any one of a metal sheet, a carbon-based heat-radiating sheet, a polymer film or a paper film, and the heat- And the heat fault layer is formed of a polymer film.

In the bobbin of the speaker device according to the embodiment of the present invention, the supporting layer may be formed of any one of a metal sheet, a carbon-based heat-radiating sheet, a polymer film or a paper film, and the heat- And the heat fault layer is formed by applying a polymer solution to the inner surface of the support layer.

In the bobbin of the speaker device according to the embodiment of the present invention, the supporting layer may be formed of a metal sheet, a carbon-based heat-radiating sheet, a polymer film, or a paper film, the heat insulating layer is formed of a polymer film, The dispersion layer is formed by depositing a metal on the outer peripheral surface of the support layer.

In the bobbin of the speaker device according to the embodiment of the present invention, the supporting layer is formed of any one of a metal sheet, a carbon-based heat-radiating sheet, a polymer film or a paper film, and the heat- And the heat fault layer is formed by applying a polymer solution to the inner surface of the support layer.

In the bobbin of the speaker device according to the embodiment of the present invention, a part of the lower part of the voice coil is exposed through the outer peripheral surface of the bobbin in the heat dispersion layer or the support layer.

Finally, a speaker device according to the present invention includes: a diaphragm; A single bobbin formed at the center of the bottom of the diaphragm; A voice coil wound on the bobbin; A magnetic circuit configured to include a magnet, a plate, and a yoke, the voice coil being disposed in a space between the yoke and the plate, and supplying magnetism to the voice coil; And a frame on which the magnetic circuit is mounted and to which an edge of the diaphragm is attached, wherein the bobbin forms an outer circumferential surface of the bobbin, and has a first thermal conductivity and conducts heat generated from the voice coil A heat dissipation layer dispersed to the surface through the substrate; And a heat shield layer which forms an inner circumferential surface of the bobbin and has a second thermal conductivity lower than the first thermal conductivity and blocks radiation of heat generated in the voice coil to a magnetic circuit.

According to the above configuration, the bobbin of the speaker device according to the present invention minimizes heat flow into the magnet by dispersing heat generated from the voice coil, thereby preventing SPL deterioration of the speaker device.

Since the bobbin of the speaker device according to the embodiment of the present invention effectively blocks the heat generated from the voice coil from flowing into the magnet, the deterioration of the magnet due to heat generated in the voice coil, even if the input current is concentrated in the single voice coil, It is possible to reduce the manufacturing cost of the speaker device, simplify the manufacturing process, and improve the yield of the speaker device.

1 is a three-dimensional view showing a bobbin of a speaker device according to the prior art;
2 is a sectional view showing a bobbin and a magnetic circuit of a speaker device according to the prior art;
3 is a three-dimensional view showing a bobbin of a speaker device according to a first embodiment of the present invention;
4 is a sectional view showing a bobbin and a magnetic circuit according to the first embodiment of the present invention;
5 is a three-dimensional view showing a bobbin of a speaker device according to a second embodiment of the present invention;
6 is a sectional view showing a bobbin and a magnetic circuit according to a second embodiment of the present invention;
7 is a three-dimensional view showing a bobbin of a speaker device according to a third embodiment of the present invention;
8 is a sectional view showing a bobbin and a magnetic circuit according to a third embodiment of the present invention;
9 is a sectional view of a speaker device including a bobbin according to the first embodiment of the present invention.

Hereinafter, a bobbin of a speaker device according to the present invention will be described with reference to the drawings. The following description is for the understanding of the invention, and the scope of the present invention is not limited by the drawings and the description presented herein.

&Lt; Embodiment 1 >

Hereinafter, the bobbin of the speaker device according to the first embodiment of the present invention will be described with reference to FIGS. 3 and 4. FIG.

The bobbin 110 includes an inner circumferential surface and an outer circumferential surface, and a voice coil 113 is wound around at least a portion of the outer circumferential surface. The bobbin 110 includes a heat dispersion layer 111 and a heat shield layer 112.

The heat dissipating layer 111 forms the outer peripheral surface of the bobbin 110 and has a relatively high first thermal conductivity and has a function of dispersing the heat generated from the voice coil 113 to the outer peripheral surface of the bobbin 110 through conduction .

The heat shield layer 112 forms an inner circumferential surface of the bobbin 110 and has a second thermal conductivity lower than the first thermal conductivity of the heat dispersion layer 111. Heat generated in the voice coil 113 is transmitted to the inner peripheral surface of the bobbin 110 To the magnetic circuit (20).

As the second thermal conductivity of the heat fault layer 112 is greater than the first thermal conductivity of the heat dissipation layer 111, the heat dissipation structure is advantageous, and the second thermal conductivity is selected to be less than 1/100 of the first thermal conductivity .

In this case, the heat dispersion layer 111 is selected from materials having a first thermal conductivity of 100 W / (m · K) or more, and the thermal insulation layer 112 is a material having a second thermal conductivity of 1 W / (m · K) It is more preferable to select it.

As the material of the heat dispersion layer 111, a metal thin film such as a copper thin film or an aluminum thin film having high thermal conductivity, or a carbon-based heat dissipation sheet such as a carbon sheet, a carbon nanotube (CNT) sheet or a graphene sheet, Other heat dissipation materials known in the art can be selected. Meanwhile, since the voice coil 113 itself includes an insulating coating, the heat dispersing layer 111 may be an electrically conductive material instead of an electrically insulating material.

As the material of the heat fault layer 112, a polymer film such as a polyimide film having low thermal conductivity, a paper film, and the like can be exemplified, but other heat insulating materials known in the art can be selected. However, the material having a high melting point is selected as the heat fault layer 112 so as not to be thermally deformed according to the temperature increase inside the speaker device.

On the other hand, the heat dispersion layer 111 or the heat failure layer 112 is selected as a lightweight material having a low specific gravity and minimized in thickness to increase the weight of the vibration system defined by the weight of the bobbin 110 and the diaphragm 30 Minimizing it is desirable for speaker performance. For this purpose, the heat dispersion layer 111 is formed to a thickness of 0.01 to 0.1 mm, for example, and the thermal insulation layer 112 is formed to a thickness of 0.01 to 0.1 mm, for example. The numerical value of the thickness of the heat dispersion layer 111 is a minimum thickness that allows the general metal sheet to maintain the shape of the bobbin 110 in the form of a ring and the thickness of the thermal barrier layer 112 is the thickness of the conventional bobbin 10, It is the general thickness of the mid film. On the other hand, if any one of the heat dispersion layer 111 and the heat failure layer 112 is formed to have a sufficient thickness to ensure rigidity, the thickness of the other layer can be made thinner.

The heat flow by the bobbin 110 according to the embodiment of the present invention will be described with reference to FIG. The heat generated in the voice coil 113 is incident on the heat dispersion layer 111 through direct conduction. The heat dissipation layer 111 has a high thermal conductivity so that heat is quickly dispersed through the surface and rapidly dissipates heat in the direction of the outer circumferential surface of the bobbin 110 through the surface. 2, the voice coil 113 is generally wound to occupy an area of ½ or less of the outer circumferential surface of the entire bobbin 111. Therefore, the heat generated in the voice coil 113 is concentrated in the lower portion of the bobbin 110 The voice coil 113 is uniformly dispersed to the upper side of the bobbin 110 not wound and heat is radiated through the entire outer peripheral surface of the bobbin 110 through the radiation. At this time, since the bottom surface of the heat dissipation layer 111 is in contact with the heat fault layer 112 having low thermal conductivity, radiation to the magnetic circuit 20 through the inner circumferential surface of the bobbin 110 is minimized.

The bobbin 110 according to the present invention is superior in heat release performance compared to the conventional bobbin 10 due to the structure in which the heat dispersion layer 111 and the heat shield layer 112 are laminated (Which has been confirmed to have twice as much heat dissipation performance as the conventional bobbin 10), thereby reducing the deterioration of the magnet due to heat, thereby minimizing the problem of lowering the SPL due to the use of the speaker device Offer.

It is preferable that the heat dispersion layer 111 is formed so as to extend to the uppermost side of the bobbin 110 at the upper portion and less than the lowermost layer of the bobbin 110 at the lower portion.

3, the heat dissipating layer 111 is directly attached to the bottom surface of the diaphragm 30 to have a structure in which the heat dissipating layer 111 extends to the uppermost side of the bobbin 110, as shown in FIG. The entirety of the diaphragm 30 or the entirety of the diaphragm 30 is covered with a metal sheet such as an aluminum sheet or a carbon-based heat-radiating sheet so that the overall thermal conductivity of the diaphragm 30 or the bottom surface thereof is at least the second thermal conductivity of the thermal insulation layer 112 The heat dispersed through the heat dissipating layer 111 is dispersed not only in the bobbin 110 but also in a larger area through the bottom surface of the diaphragm 30 and further away from the magnetic circuit 20 The thermal efficiency is improved. It is more preferable to bond the bobbin 110 and the diaphragm 30 using a heat-dissipative adhesive having a high thermal conductivity in order to minimize the thermal resistance at the interface between the heat dispersion layer 111 and the bottom surface of the diaphragm 30. [

According to the embodiment in which the heat dispersion layer 111 is formed so as not to reach the lowest layer of the bobbin 110, heat radiation through the lower end of the heat dispersion layer 111 is exposed through the outer peripheral surface of the bobbin 110, It is possible to effectively block the heat fault layer 112 and to further improve the heat radiation efficiency.

Hereinafter, various embodiments of the method of manufacturing the bobbin 110 according to the first embodiment of the present invention will be described.

First, the heat dispersion layer 111 may be formed of a metal thin film such as an aluminum thin film or a carbon-based heat dissipation sheet such as a carbon sheet or a graphene sheet, and may be formed of a polymer film such as a heat shield layer 112 polyimide film. According to this embodiment, there is an effect that the rigidity of the bobbin 110 can be secured by the heat dispersion layer 111 and the heat shield layer 112.

Next, the heat dispersion layer 111 is formed of a metal thin film such as an aluminum thin film or a carbon-based heat dissipation sheet such as a carbon sheet or a graphene sheet. The heat failure layer 112 has a low thermal conductivity And then drying the resultant polymer solution. According to this embodiment, it is possible to easily form the bobbin 110 having a multilayer structure by forming the heat fault layer 112 on the bottom surface of the heat dispersing layer 111 in the sheet state before cutting.

Finally, the heat fault layer 112 is formed of a polymer film of low thermal conductivity, and the heat dissipation layer 111 is formed by depositing metal on the outer circumferential surface of the heat fault layer 112 by sputtering, e-beam, plating or the like . According to this embodiment, it is possible to easily form the bobbin 110 having a multilayer structure by forming the heat dispersion layer 112 on the top surface of the heat fault layer 112 in the sheet state before cutting.

9 shows a speaker device including a bobbin 110 according to a first embodiment of the present invention. The speaker device may be configured to include not only the bobbin 110 of the first embodiment but also the bobbin 120 of the second embodiment described later and the bobbin 130 of the third embodiment.

9, the speaker device according to the first embodiment of the present invention comprises a diaphragm 30, a bobbin 110, a voice coil 113, a magnetic circuit 20 and a frame 30 . The magnetic circuit 30 includes a magnet 21, a plate 22 and a yoke 23. The voice coil 113 is disposed in a space between the yoke 23 and the plate 22, And performs a function of supplying magnetism to the voice coil 113 by the magnet 21.

The frame 40 is mounted with the magnetic circuit 20, and the edge of the diaphragm 30 is attached.

The bobbin 110 has a relatively high first thermal conductivity and has a heat dissipation layer 111 that disperses heat generated from the voice coil 113 to the outer peripheral surface of the bobbin 110 through conduction and a relatively low second thermal conductivity And a heat fault layer 112 for blocking radiation from the voice coil 113 to the magnetic circuit. According to this structure, since the heat generated from the voice coil 113 is effectively blocked from flowing into the magnet 21, unlike a conventional speaker device for parts including a plurality of driving circuits, It is possible to reduce the manufacturing cost of the speaker device and to simplify the manufacturing process.

&Lt; Embodiment 2 >

Hereinafter, the bobbin 120 of the speaker device according to the second embodiment of the present invention will be described with reference to FIGS. 5 and 6. FIG. The second embodiment further includes a support layer 124 and has a structure in which a heat fault layer 122 and a heat dispersion layer 121 are laminated on the outer circumferential surface of the support layer 124. Hereinafter, the repetitive description of the first embodiment will be omitted.

The bobbin 120 of the speaker device according to the second embodiment of the present invention includes the support layer 124, the heat dispersion layer 121, and the heat shield layer 122.

The support layer 124 forms the contour of the bobbin 120. The material of the support layer 124 is not particularly limited and may be a metal thin film, a polymer film, a paper film, or the like. The thermal conductivity of the support layer 124 is not particularly limited, but it is preferable to select a material having a low thermal conductivity to enhance the function of the thermal barrier layer 122 to perform the same function as the thermal barrier layer 122.

The heat fault layer 122 is formed on the outer circumferential surface of the support layer 124 and has a relatively low second thermal conductivity and functions to block radiation from the voice coil 123 to the magnetic circuit 20.

The heat dispersion layer 121 is formed on the outer circumferential surface of the thermal insulation layer 122 so as to include the region where the voice coil 123 is wound and has a first thermal conductivity higher than the second thermal conductivity and is generated in the voice coil 123 And distributes the heat to the surface through conduction.

The second thermal conductivity of the heat fault layer 122 is preferably less than 1/100 of the first thermal conductivity of the heat dispersion layer 121. The thermal dispersion layer 121 may have a thermal conductivity of 100 W / It is preferable to select the material having the first thermal conductivity and the thermal insulation layer 122 as the material having the second thermal conductivity equal to or less than 1 W / (m · K).

In this case, the heat dispersion layer 121 may be formed to a thickness of 0.01 to 0.1 mm in order to minimize an increase in weight of the vibration system, and the thermal insulation layer 122 may be formed to a thickness of 0.01 to 0.1 mm.

It is preferable that the heat dispersion layer 121 extends to the uppermost end of the bobbin 120 and is brought into thermal contact with the bottom surface of the diaphragm 30 in the same manner as the first embodiment, It is preferable to extend the bottom end of the bobbin 120 so as not to reach the lowermost end of the bobbin 120 to expose the lower end heat shield layer 122 to the outer peripheral surface of the bobbin 120 as shown in FIG.

Hereinafter, various embodiments of the method of manufacturing the bobbin 120 according to the second embodiment of the present invention will be described. First, the support layer 124 is formed of a polymer film or a paper film, the heat dispersion layer 121 is formed of a metal thin film or a carbon-based heat dissipation sheet, and is formed of a polymer film such as a heat fault layer 122 polyimide film .

Next, the support layer 124 is formed of a polymer film or a paper film, the heat dispersion layer 121 is formed of a metal sheet or a carbon-based heat radiation sheet, and the heat failure layer 122 is formed on the inner circumferential surface of the heat dispersion layer 121 And can be formed by applying a polymer solution on the outer peripheral surface of the support layer 124.

Next, the support layer 124 is formed of a polymer film or a paper film, the heat fault layer 122 is formed of a polymer film, and the heat dispersion layer 121 is formed by depositing metal on the outer circumferential surface of the heat fault layer 122 .

The thermal barrier layer 122 is formed by applying a polymer solution to the outer circumferential surface of the support layer 124. The thermal barrier layer 121 is formed on the outer peripheral surface of the thermal barrier layer 122, And then depositing a metal thereon.

&Lt; Third Embodiment >

Hereinafter, the bobbin 130 of the speaker device according to the third embodiment of the present invention will be described with reference to FIGS. 7 and 8. FIG. The bobbin 130 according to the third embodiment is the same as the second embodiment in that the bobbin 130 includes the support layer 134, the heat dispersion layer 131 and the heat failure layer 132, (131) and the railway fault layer (132).

The bobbin 130 of the speaker device according to the third embodiment includes a support layer 134, a heat dispersion layer 131, and a heat shield layer 132.

The support layer 134 functions to form the contour of the bobbin 130. The material of the bobbin 130 is not particularly limited, and can be selected to be irrelevant to the thermal conductivity. For example, when a metal sheet or a carbon-based heat dissipation sheet having high thermal conductivity is used as the support layer 134, the support layer 134 functions as a part of the heat dispersion layer 131. On the other hand, when a polymer film or paper film having a low thermal conductivity is used as the support layer 134, the support layer 134 functions as a part of the heat fault layer 132.

The heat dispersion layer 131 is formed on the outer circumferential surface of the support layer 134 so as to include at least the region where the voice coil 133 is wound and has a first thermal conductivity and has a function of dispersing heat generated from the voice coil to the surface through conduction .

The heat fault layer 132 is formed on the inner circumferential surface of the support layer 134 and has a second thermal conductivity lower than the first thermal conductivity and functions to prevent heat generated in the voice coil from being copied to the magnetic circuit 20.

The second thermal conductivity of the heat fault layer 132 is preferably less than 1/100 of the first thermal conductivity of the heat dissipation layer 131. The heat dissipation layer 131 may have a thermal conductivity of 100 W / It is preferable to select the material having the first thermal conductivity and the thermal insulation layer 132 to be selected as the material having the second thermal conductivity of 1 W / (mK) or less.

At this time, the heat dispersion layer 131 may be formed to a thickness of 0.01 to 0.1 mm in order to minimize an increase in the weight of the vibration system, and the thermal insulation layer 132 may be formed to a thickness of 0.01 to 0.1 mm.

The heat dissipation layer 131 is preferably extended to the uppermost end of the bobbin 130 and is in thermal contact with the bottom surface of the diaphragm 30 in the same manner as in the first embodiment, The thermal barrier layer 132 of the lower end is exposed to the outer circumferential surface of the bobbin 130 as shown in FIG. 8 or the support layer 134 Is exposed on the outer circumferential surface of the bobbin 130.

Hereinafter, various embodiments of the method of manufacturing the bobbin 120 according to the third embodiment of the present invention will be described. First, the supporting layer 134 is formed of a metal sheet, a carbon-based heat-radiating sheet, a polymer film, or a paper film, the heat-dispersing layer 131 is formed of a metal sheet or a carbon- It can be formed into a polymer film.

Next, the support layer 134 is formed of a metal sheet, a carbon-based heat dissipation sheet, a polymer film, or a paper film, the heat dissipation layer 131 is formed of a metal sheet or a carbon-based heat dissipation sheet, ) Can be formed by applying a polymer solution on the inner peripheral surface of the support layer 134. [

Next, the support layer 134 is formed of a metal sheet, a carbon-based heat dissipation sheet, a polymer film, or a paper film, the heat fault layer 132 is formed of a polymer film, and the heat dispersion layer 131 is formed of a support layer 134) by depositing a metal on the outer circumferential surface.

Finally, the support layer 134 is formed of a metal sheet, a carbon-based heat dissipation sheet, a polymer film, or a paper film. The heat dissipation layer 131 is formed by depositing metal on the outer circumferential surface of the support layer 134, 132 may be formed by applying a polymer solution to the inner peripheral surface of the support layer 131.

20: magnetic circuit 21: magnet
22: plate 23: yoke
110, 120, 130: bobbin 111, 121, 131:
112, 122, 132: train fault layer 113, 123, 133: voice coil

Claims

A bobbin including an inner circumferential surface and an outer circumferential surface, wherein a voice coil is wound on at least a part of the outer circumferential surface,
A heat dissipation layer forming the outer circumferential surface and having a first thermal conductivity and dispersing heat generated from the voice coil to the surface through conduction; And
And a heat shield layer which forms the inner circumferential surface and has a second thermal conductivity lower than the first thermal conductivity and blocks radiation of heat generated in the voice coil to a magnetic circuit.

2. The method according to claim 1,
(Unit: W / (m 占))) of at least 1/100 of the first thermal conductivity of the heat dispersion layer.

3. The method of claim 2,
The heat dissipation layer has the first thermal conductivity of 100 W / (mK) or more,
Wherein the heat insulating layer has the second thermal conductivity of 1 W / (m · K) or less.

The method according to claim 1,
The heat dispersion layer is formed to a thickness of 0.01 to 0.1 mm,
Wherein the heat fault layer is formed to a thickness of 0.01 to 0.1 mm.

The method according to claim 1,
The heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet,
Wherein the heat fault layer is formed of a polymer film.

The method according to claim 1,
The heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet,
Wherein the heat insulating layer is formed by applying a polymer solution to the inner surface of the heat dissipation layer.

The method according to claim 1,
The heat fault layer is formed of a polymer film,
Wherein the heat dissipation layer is formed by depositing a metal on the outer surface of the heat fault layer.

The method according to claim 1,
Wherein the heat dissipation layer is in thermal contact with a bottom surface of the diaphragm having a third thermal conductivity of at least the second thermal conductivity of the heat fault layer.

The method according to claim 1,
Wherein the heat dissipation layer is formed such that a portion of the lower portion of the voice coil is exposed through the outer peripheral surface of the bobbin.

A bobbin including an inner circumferential surface and an outer circumferential surface, wherein a voice coil is wound on at least a part of the outer circumferential surface,
A support layer forming an outer shape of the bobbin;
A heat fault layer formed on an outer circumferential surface of the support layer and having a second thermal conductivity and blocking radiation of heat generated in the voice coil to a magnetic circuit; And
A heat dissipation layer formed on an outer circumferential surface of the heat fault layer so as to include an area where the voice coil is wound and having a first thermal conductivity higher than the second thermal conductivity and dispersing heat generated from the voice coil to a surface through conduction, The bobbin of the speaker device.

11. The method according to claim 10,
(Unit: W / (m 占))) of at least 1/100 of the first thermal conductivity of the heat dispersion layer.

12. The method of claim 11,
The heat dissipation layer has the first thermal conductivity of 100 W / (mK) or more,
Wherein the heat insulating layer has the second thermal conductivity of 1 W / (m · K) or less.

11. The method of claim 10,
The heat dispersion layer is formed to a thickness of 0.01 to 0.1 mm,
Wherein the heat fault layer is formed to a thickness of 0.01 to 0.1 mm.

11. The method of claim 10,
The support layer may be formed of a polymer film or a paper film,
The heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet,
Wherein the heat fault layer is formed of a polymer film.

11. The method of claim 10,
The support layer may be formed of a polymer film or a paper film,
The heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet,
Wherein the heat insulating layer is formed by applying a polymer solution on the inner circumferential surface of the heat dissipation layer or the outer circumferential surface of the support layer.

11. The method of claim 10,
The support layer may be formed of a polymer film or a paper film,
The heat fault layer is formed of a polymer film,
Wherein the heat dissipation layer is formed by depositing a metal on the outer surface of the heat fault layer.

11. The method of claim 10,
The support layer may be formed of a polymer film or a paper film,
The heat fault layer is formed by applying a polymer solution to the outer peripheral surface of the support layer,
Wherein the heat dissipation layer is formed by depositing a metal on the outer surface of the heat fault layer.

11. The method of claim 10,
Wherein the heat dissipation layer is in thermal contact with a bottom surface of the diaphragm having a third thermal conductivity of at least the second thermal conductivity of the heat fault layer.

11. The method of claim 10,
Wherein the heat dissipation layer is formed such that a portion of the lower portion of the voice coil is exposed through the outer peripheral surface of the bobbin.

A bobbin including an inner circumferential surface and an outer circumferential surface, wherein a voice coil is wound on at least a part of the outer circumferential surface,
A support layer forming an outer shape of the bobbin;
A heat dissipation layer formed on an outer circumferential surface of the support layer so as to include at least an area where the voice coil is wound, the heat dissipation layer having a first thermal conductivity and dispersing heat generated from the voice coil to the surface through conduction; And
And a heat shield layer formed on an inner circumferential surface of the support layer and having a second thermal conductivity lower than the first thermal conductivity and blocking radiation to the magnetic circuit generated in the voice coil, .

21. The method of claim 20,
(Unit: W / (m 占))) of at least 1/100 of the first thermal conductivity of the heat dispersion layer.

22. The method of claim 21,
The heat dissipation layer has the first thermal conductivity of 100 W / (mK) or more,
Wherein the heat insulating layer has the second thermal conductivity of 1 W / (m · K) or less.

21. The method of claim 20,
The heat dispersion layer is formed to a thickness of 0.01 to 0.1 mm,
Wherein the heat fault layer is formed to a thickness of 0.01 to 0.1 mm.

21. The method of claim 20,
Wherein the support layer is formed of a metal sheet, a carbon-based heat-radiating sheet, a polymer film, or a paper film,
The heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet,
Wherein the heat fault layer is formed of a polymer film.

21. The method of claim 20,
Wherein the support layer is formed of a metal sheet, a carbon-based heat-radiating sheet, a polymer film, or a paper film,
The heat dissipation layer is formed of a metal sheet or a carbon-based heat dissipation sheet,
Wherein the heat insulating layer is formed by applying a polymer solution to the inner surface of the support layer.

21. The method of claim 20,
Wherein the support layer is formed of a metal sheet, a carbon-based heat-radiating sheet, a polymer film, or a paper film,
The heat fault layer is formed of a polymer film,
Wherein the heat dissipation layer is formed by depositing a metal on the outer circumferential surface of the support layer.

21. The method of claim 20,
Wherein the support layer is formed of a metal sheet, a carbon-based heat-radiating sheet, a polymer film, or a paper film,
The heat dissipation layer is formed by depositing a metal on the outer peripheral surface of the support layer,
Wherein the heat insulating layer is formed by applying a polymer solution to the inner surface of the support layer.

21. The method of claim 20,
Wherein the heat dissipation layer is in thermal contact with a bottom surface of the diaphragm having a third thermal conductivity of at least the second thermal conductivity of the heat fault layer.

21. The method of claim 20,
Wherein the heat dissipation layer or the support layer is exposed through a portion of the lower portion of the voice coil through the outer peripheral surface of the bobbin.

tympanum;
A single bobbin formed at the center of the bottom of the diaphragm;
A voice coil wound on the bobbin;
A magnetic circuit configured to include a magnet, a plate, and a yoke, the voice coil being disposed in a space between the yoke and the plate, and supplying magnetism to the voice coil; And
And a frame on which the magnetic circuit is seated and to which an edge of the diaphragm is attached,
A heat dissipation layer forming an outer circumferential surface of the bobbin and having a first thermal conductivity and dispersing heat generated from the voice coil to the surface through conduction; And
And a heat shield layer forming an inner circumferential surface of the bobbin and having a second thermal conductivity lower than the first thermal conductivity and blocking radiation from the voice coil to the magnetic circuit.