KR20140141112A - Anisotropic conductive film, the composition thereof and the display device using thereof - Google Patents

Abstract

The present invention relates to an anisotropic conductive film, a composition thereof, and a display device using the same, and more specifically, to an anisotropic conductive film including conductive particles where surfaces of metal core particles are coated with silver (Ag), wherein a viscosity range of the anisotropic conductive film at 30 °C is 100,000 to 1,000,000 Pa·s according to ARES measurement and the lowest melting viscosity range is 1,000 to 9,000 Pa·s. The present invention can prevent signal interference even in a micro pitch electrode as connection resistance is low, and can be used in low temperature and high temperature connection processes.

Description

TECHNICAL FIELD [0001] The present invention relates to an anisotropic conductive film, a composition thereof, and a display device using the same. ≪ Desc / Clms Page number 1 >

The present invention relates to an anisotropic conductive film, a composition thereof and a display device using the same.

Anisotropic conductive film (ACF) generally refers to a film-shaped adhesive in which conductive particles are dispersed in a resin such as an epoxy resin, and is an electrically conductive film having electrical conductivity in the thickness direction of the film, Means a polymer membrane having anisotropy and adhesion.

When the anisotropic conductive film is placed between the circuit to be connected and subjected to a heating and pressing process under a certain condition, the circuit terminals are electrically connected by the conductive particles, and the insulating adhesive resin is filled between the adjacent electrodes The conductive particles are allowed to exist independently of each other, thereby giving high insulating properties.

However, pitches between electrodes and circuits are gradually becoming finer in accordance with trends of the display industry, which is in the trend of becoming larger and thinner in recent years, and a temperature deviation is seriously generated due to the heat radiation effect of each PCB pattern. Circuit terminals.

Further, there is a growing demand for anisotropic conductive films which are required to improve the fineness of the conductive particles used in the anisotropic conductive film and to improve the particle diameter accuracy due to miniaturization of the wiring, and to secure excellent connection reliability and insulation reliability. It is necessary to develop a connecting material that lowers resistance in order to prevent signal interference of the fine pitch electrode due to such a phenomenon.

Korean Patent Publication No. 10-2011-0074321 (published on June 30, 2011)

Accordingly, the present invention is to provide an anisotropic conductive film having excellent initial connection resistance, high temperature and high humidity evaluation, and excellent connection resistance after thermal shock evaluation, a composition thereof, and a display device using the same.

Specifically, the anisotropic conductive film according to the ARES measurement includes conductive particles having a viscosity range of 30 占 폚 and a minimum melt viscosity range and coated with silver on the surface of the metal core particles, and the low temperature process and the high temperature process ) And a connection resistance at a wide temperature margin of 0.04? Or less, a composition thereof, and a display device using the same.

According to one embodiment of the present invention, the anisotropic conductive film according to the ARES measurement has a viscosity range of 30 to 100,000 Pa · s at 30 ° C., a minimum melt viscosity range of 1,000 to 9,000 Pa · s, (Ag) is coated on the surface of the anisotropic conductive film.

According to another example of the present invention, an anisotropic conductive film is placed between a first member to be connected and a second member to be connected and pressure-bonded under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And an initial connection resistance measured after final compression under the pressure conditions of 100 to 250 DEG C for 1 to 5 seconds and 2.0 to 5.0 MPa is 0.04 or less in both of the main compression temperature conditions of 100 to 250 DEG C to provide.

According to another example of the present invention, an anisotropic conductive film is placed between a first member to be connected and a second member to be connected and pressure-bonded under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And after the main compression under the pressure conditions of 100 to 250 DEG C for 1 to 5 seconds and 2.0 to 5.0 MPa, the anisotropic conductive film was allowed to stand for 250 hours and 500 hours under the conditions of 85 DEG C and 85% And the resistance is 0.04? Or less, respectively.

According to another example of the present invention, an anisotropic conductive film is placed between a first member to be connected and a second member to be connected and pressure-bonded under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And after the main compression under the pressure conditions of 100 to 250 ° C for 1 to 5 seconds and 2.0 to 5.0 MPa, the anisotropic conductive film is subjected to thermal shock evaluation at 250 cycles and 500 cycles under the conditions of -40 to 100 ° C and 1 cycle / And the resistance is 0.04? Or less, respectively.

According to another embodiment of the present invention, an anisotropic conductive adhesive layer comprises 1 to 25% by weight of a thermoplastic resin based on the total weight of the solid or adhesive layer composition; 20 to 70% by weight of an acrylate modified urethane resin; 10 to 30% by weight of an acrylic copolymer; 1 to 40% by weight of a radically polymerizable substance; 0.5 to 10% by weight of an organic peroxide; 0.1 to 20% by weight of inorganic particles; And 0.1 to 20% by weight of conductive particles silver-coated on the surface of the metal core particles, and a composition thereof.

According to another embodiment of the present invention, there is provided a driver circuit comprising: a driver circuit; panel; And an anisotropic conductive film according to an embodiment of the present invention.

According to the present invention, the anisotropic conductive film according to the ARES measurement has a viscosity range of 30 to 100,000 Pa · s at 30 ° C., a minimum melt viscosity range of 1,000 to 9,000 Pa · s, and silver (Ag) An anisotropic conductive film having a connection resistance of not more than 0.04? After an initial connection resistance, a high-temperature high-humidity evaluation, and a thermal shock evaluation after a low-temperature process and a high-temperature process (100 ° C to 250 ° C) Signal interference of the pitch electrode can be prevented, compression at a low temperature is easy, and the product stability of the anisotropic conductive film is improved.

1 is a conceptual diagram for explaining a minimum melt viscosity and a measuring method thereof according to the present invention.
Fig. 2 shows the viscosity range of the anisotropic conductive film according to the ARES measurement of the anisotropic conductive film according to an embodiment of the present invention, and the range of the lowest melt viscosity at a temperature of 70 to 85 캜.
3A and 3B are reference image data for determining the stability of an anisotropic conductive film product according to an embodiment of the present invention.

Hereinafter, the present invention will be described in more detail. Those skilled in the art will appreciate that various modifications, additions, and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

According to one example of the present invention, the anisotropic conductive film according to the ARES measurement has a viscosity range of 30 to 100,000 Pa · s at 30 ° C., a minimum melt viscosity range of 1,000 to 9,000 Pa · s, Or an anisotropic conductive film containing conductive particles coated with silver (Ag).

In general, raising the temperature of the adhesive and the viscosity is the temperature rise by the initial (A ₁ section) gradually decreases, reaches a certain moment (T ₀₎ is melted adhesive is exhibits a viscosity (η ₀₎ of the lowest. When the temperature is further increased, the curing progresses (A ₂ section) and the viscosity gradually increases. When the curing is completed (A ₃ section), the viscosity is kept substantially constant. The viscosity at the temperature T ₀ η ₀ means "lowest melt viscosity" (see Fig. 1).

The " viscosity range of 30 占 폚 of the anisotropic conductive film according to ARES measurement "in the present invention means the viscosity range of the anisotropic conductive film measured when the temperature of the anisotropic conductive film is 30 ° C using ARES (Advanced Rheometric Expansion System) , The "lowest melt viscosity" means the lowest melt viscosity value among the melt viscosity values of the film measured using ARES. The anisotropic conductive film having the viscosity range of 30 to 100,000 Pa · s and the lowest melt viscosity of 1,000 to 9,000 Pa · s of the anisotropic conductive film of the present invention can be obtained by compression at a low temperature within the above- And the stability of the film can be improved. In this case, the temperature range indicating the lowest melt viscosity may be 70 to 85 ° C, and the lowest melt viscosity range at this temperature may be 1,000 to 9,000 Pa · s, preferably 3,000 to 7,000 Pa · s , And more preferably from 3,500 to 5,000 Pa · s.

The anisotropic conductive film having the viscosity range of 30 占 폚 and the lowest melt viscosity range can be obtained by using silver coated metal core particles at an initial connection resistance at a wide temperature margin such as a low temperature process and a high temperature process (100 占 폚 to 250 占 폚) And the connection resistance after the evaluation of the thermal shock is 0.04? Or less, so that the signal interference of the fine pitch electrode can be prevented. The range of the viscosity at 30 캜 and the minimum melt viscosity of the anisotropic conductive film according to the ARES measurement is not particularly limited and can be measured according to a method commonly used in the art. A non-limiting example of the above 30 ° C viscosity range and the method of measuring the lowest melt viscosity is as follows: Using a ARES G2 rheometer (TA Instruments), a sample thickness of 150 μm, a heating rate of 10 ° C./minute, a frequency of 10 rad / Sec, the viscosity of the anisotropic conductive film is measured at 30 to 200 ° C.

Metal core particle

The metal core particles that can be coated with silver are not particularly limited and any conductive metal particles can be used. Preferably, the metal core particles include gold (Au), nickel (Ni), copper (Cu) ), Platinum (Pt), molybdenum (Mo), or tungsten (W) particles can be used, and copper particles are more preferably used. The particle diameter of the metal core particles is not particularly limited, but may be preferably 1 to 10 μm, more preferably 1 to 8 μm, depending on the pitch of the applied circuit. Adhesion and connection reliability can be maintained within the above range.

According to another embodiment of the present invention, in the conductive particles coated with silver on the surface of the metal core particle, preferably, the silver may be coated with 3 to 100% of the surface area of the metal core particle, The shape of the coated silver may be islands. As described above, in order to reduce the flow-spacing of the pressed portion during low-temperature squeezing, highly reliable anisotropic conductive films can be manufactured with less contact area by coating the metal core particles with silver having high conductivity. The method of measuring the surface area coated with silver is not particularly limited and a method commonly used in the technical field of the present invention can be used. A non-limiting example of a method for measuring the surface area of a silver coated substrate is as follows: Photographing a conductive particle at a rate of 10,000 times using an FE-SEM (Hitach, S-4800 (Type-II) Then, the total area of one conductive particle and the coated area of the conductive particle are measured using the contrast of the image with an image analyzer program, i-solution (IMT wchnology). The area ratio of the coated area is calculated using the following formula (1), and then the average value of ten values obtained by randomly measuring the coating area ratio is taken.

[Equation 1]

Coated area ratio (%) = (total area of one conductive particle - coated area of conductive particles) / total area of one conductive particle x 100

According to another embodiment of the present invention, the anisotropic conductive film according to ARES measurement has a viscosity range of 30 to 100,000 Pa · s at 30 ° C., a minimum melt viscosity range of 1,000 to 9,000 Pa · s, The anisotropic conductive film comprising conductive particles coated with silver (Ag) may contain 1 to 25% by weight of a thermoplastic resin based on the total weight of the anisotropic conductive adhesive layer solid or adhesive layer composition; 20 to 70% by weight of an acrylate modified urethane resin; 10 to 30% by weight of an acrylic copolymer; 1 to 40% by weight of a radically polymerizable substance; 0.5 to 10% by weight of an organic peroxide; And 0.1 to 20% by weight of silver-coated conductive particles on the surface of the metal core particles.

Hereinafter, a composition for producing an anisotropic conductive film according to an embodiment of the present invention will be described. An anisotropic conductive film according to an embodiment of the present invention includes an anisotropic conductive adhesive layer and a base film adhered to the back surface of the anisotropic conductive adhesive layer, wherein the adhesive layer and the adhesive layer composition for forming the adhesive layer comprise thermoplastic resin; Acrylate modified urethane resins; Acrylic copolymers; Radical polymeric materials; Organic peroxides; Inorganic particles and conductive particles coated with silver on the surfaces of the metal core particles.

Binder resin

The binder resin used in the present invention is not particularly limited, and resins commonly used in the art can be used.

As the binder resin used in the present invention, one or more selected from the group consisting of a thermoplastic resin, an acrylate modified urethane resin and an acrylic copolymer may be used in combination. Preferably, the thermoplastic resin may be an acrylonitrile butadiene copolymer, and the polyurethane resin may be a polyurethane acrylate.

Specifically, 1 to 25% by weight of a thermoplastic resin is added to the solid content of the anisotropic conductive adhesive layer or the total weight of the adhesive layer composition; 20 to 70% by weight of an acrylate modified urethane resin; And 10 to 30% by weight of an acrylic copolymer. It is possible to exhibit the intended melt viscosity of the present invention within the above-mentioned content range, and there is an advantage that excellent film forming ability and adhesion can be ensured.

Each resin will be described in detail below.

end. Thermoplastic resin

Examples of the thermoplastic resin include an olefin resin including polyethylene, polypropylene and the like, a butadiene resin, an epoxy resin, a phenoxy resin, a polyamide resin, a polyimide resin, a polyester resin, a silicone resin, Based resin, a polyvinyl butyral resin, and an ethylene-vinyl acetate copolymer, which may be used alone or in combination of two or more. More preferably, it may be a butadiene-based resin.

Examples of the butadiene resin include acrylonitrile-butadiene copolymer, styrene butadiene copolymer, (meth) acrylate-butadiene copolymer, (meth) acrylate-acrylonitrile-butadiene-styrene copolymer, carboxyl group denatured acrylonitrile -Butadiene copolymer, and the like, but not always limited thereto. These may be used singly or in combination of two or more, preferably acrylonitrile butadiene copolymers.

The weight average molecular weight of the acrylonitrile butadiene copolymer may be 2,000 to 200,000 g / mol, and preferably 3,000 to 200,000 g / mol.

According to another embodiment of the present invention, the thermoplastic resin may be contained in an amount of 1 to 25% by weight, preferably 1 to 20% by weight, based on the total weight of the anisotropic conductive adhesive layer solids or the adhesive layer composition. The stability of the composition is increased so that the adhesive layer composition is not phase-separated in the above range, the connection reliability is good, and the adhesive strength can be improved by increasing the polarity.

I. Acrylate  Modified urethane resin

The acrylate-modified urethane resin used in the present invention exhibits high adhesion by the urethane groups in the molecular chain. The acrylate modified urethane resin comprises components of diisocyanate, polyol, diol and acrylate. The diisocyanate may be aromatic, aliphatic, alicyclic diisocyanate, combinations thereof, or the like. The polyol may be a polyester polyol, a polyether polyol, a polycarbonate polyol, or the like having two or more hydroxyl groups in the molecular chain. Diols include 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, Glycol, tetraethylene glycol, and the like. As the acrylate, hydroxy acrylate or amine acrylate can be used.

The acrylate modified urethane resin may have a weight average molecular weight of 1,000 to 50,000 g / mol, and at least one of the terminal functional groups may be acrylate. The curing reaction proceeds together with the acrylate systems of the cured portion through the acrylate groups present in the terminal functional groups within the above range, and also acts as a curing portion, thereby exhibiting excellent adhesion and high connection reliability.

According to another embodiment of the present invention, the acrylate modified urethane resin may be contained in an anisotropic conductive adhesive layer in an amount of 20 to 70% by weight, preferably 20 to 60% by weight based on the total weight of the composition or the adhesive layer composition. Within the above range, it is possible to realize preferable film properties and increase the reliability, and to exhibit excellent adhesive force and high connection reliability. When used in an anisotropic conductive film, the curing performance is improved and the temperature of the connection process can be lowered.

All. Acrylic copolymer

The acrylic copolymer to be used in the present invention may be at least one selected from the group consisting of acrylate, acrylic acid, methacrylic acid and methacrylic acid, which are composed of ethyl, methyl, propyl, butyl, hexyl, oxyl, dodecyl, lauroyl acrylate, An acrylic copolymer prepared by polymerizing acrylic monomers such as methyl methacrylate, vinyl acetate, and modified acrylic monomers can be used, but not always limited thereto. The acrylic copolymer may have a weight average molecular weight of 1,000 to 250,000 g / mol, and preferably 2,000 to 150,000 g / mol.

According to another embodiment of the present invention, the acrylic copolymer may be contained in an amount of 10 to 30% by weight, and preferably 10 to 25% by weight, based on the total weight of the anisotropic conductive adhesive layer or the adhesive layer composition. In the above-mentioned range, it is possible that the workability is not deteriorated even if the pressure is applied in the pressing process, and adhesion of the film is improved, thereby preventing occurrence of lifting and depressing under pressure.

Radical Polymerizable  matter

The radical polymerizable material is not particularly limited and those conventionally used in the technical field can be used.

Non-limiting examples of the radically polymerizable material usable in the present invention include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, n- lauryl (meth) acrylates, C ₁₂ -C ₁₅ alkyl (meth) acrylate, n- stearyl (Meth) acrylate, methoxypolyethyleneglycol (meth) acrylate, n-butoxyethyl (meth) acrylate, butoxyethyleneglycol (Meth) acrylate, isobornyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate, (Meth) acrylate, 2- (Meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, dimethylaminoethyl (Meth) acrylic acid, 2- (meth) acryloyloxyethyl succinic acid, 2- (meth) acryloyloxyethylhexahydrophthalate, 2- Acrylate, diethyleneglycol di (meth) acrylate, triethyleneglycol di (meth) acrylate, diethyleneglycol di (meth) acrylate, 2- (meth) acryloyloxyethylenesulfonate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 10-decanediol di (meth) acrylate, glycerin di (Meth) acrylate, trifluoroethyl (meth) acrylate, perfluorooctylethyl (meth) acrylate, 2-hydroxy-3-acryloyloxypropyl Acrylate, isocyanuric acid ethylene oxide-modified diacrylate, bisphenol A-ethylene oxide-modified di (meth) acrylate, acid phosphoxyethyl (meth) acrylate, isoamyl acrylate, lauroyl acrylate, isocyanuric acid ethylene oxide- , Bisphenol A propylene oxide-modified di (meth) acrylate, trimethylolpropane-benzoate- (meth) acrylate, bisphenol A diglycidyl di (meth) acrylate, 2-hydroxy- (Meth) acrylate and toluene diisocyanate, a reaction product of trimethylolpropane tri (meth) acrylate, ethylene oxide modified trimethylol propane (Meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tri (meth) acrylate and hexamethylene diisocyanate , A reaction product of pentaerythritol tri (meth) acrylate and toluene diisocyanate, a reaction product of pentaerythritol tri (meth) acrylate and isophorone diisocyanate, or a reaction product of dipentaerythritol penta (meth) acrylate and hexamethylene diisocyanate . These may be used alone or in combination of two or more.

The radical polymerizable material may be at least one selected from the group consisting of tetrahydrofurfuryl acrylate, 4-hydroxybutyl acrylate, and bisphenol A propylene oxide-modified diacrylate, but is not limited thereto.

According to another embodiment of the present invention, the anisotropic conductive adhesive layer may be contained in an amount of preferably 1 to 40% by weight, more preferably 1 to 35% by weight, based on the total weight of the solid or adhesive layer composition By weight, more preferably 1 to 30% by weight.

More specifically, the radically polymerizable material may include 1 to 10% by weight of the tetrahydroperfuryl acrylate, 1 to 10% by weight of 4-hydroxybutyl acrylate, and 1 to 10% by weight of bisphenol A propylene And 1 to 20% by weight of an oxide-modified diacrylate. Within the above range, the entire cured product can sufficiently form an acrylate cured structure, and the hardness of the cured product can be prevented from becoming too high, thereby preventing deterioration of the interface peeling force and adhesion.

Organic peroxide

The organic peroxide used in the present invention functions as a polymerization initiator and as a curing agent that generates free radicals by heating or light.

Examples of the organic peroxide include t-butyl peroxylaurate, 1,1,3,3-t-methylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl- Ethylhexanoate, 2,5-dimethyl-2,5-di (m-toluoylperoxy) hexane, t-butyl T-butyl peroxybenzoate, t-butyl peroxyacetate, dicumyl peroxide, 2,5, -dimethyl-2,5-dihydroxybutyl peroxydicarbonate, T-butylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy- Butyl peroxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy- 5-trimethylhexanoate, t-butyl peroxypivalate Diisobutyl benzene peroxide, diisopropyl benzene hydroperoxide, cumene hydroperoxide, isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, Octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succin peroxide, benzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, benzoyl peroxytoluene, 1,1,3,3- Di-n-propyl peroxydicarbonate, di-isopropyl peroxycarbonate, bis (4-t-butylphenyl) peroxyneodecanoate, 1-cyclohexyl- Di (2-ethylhexyl peroxy) dicarbonate, dimethoxybutyl peroxydicarbonate, di (3-methyl-3 - < / RTI > methoxybutylperoxy) dicarbo (Tert-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1- Oxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (t-butylperoxy) decane, t- butyltrimethylsilyl peroxide, At least one selected from the group consisting of bis (t-butyl) dimethylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, Or two or more of them may be used in combination.

But is not limited to, lauroyl peroxide. The content of the organic peroxide may be determined in a range that balances the properties of the adhesive to be cured and the preservability of the adhesive.

According to another embodiment of the present invention, the anisotropic conductive adhesive layer may comprise 0.5 to 10% by weight, more preferably 1 to 10% by weight, of the organic peroxide based on the total weight of the solid or adhesive layer composition. It is possible to exhibit excellent compression characteristics in accordance with a good curing reaction rate in the above range, and the anisotropic conductive film can be well removed during reworking.

Conductive particles coated with silver on the surface of metal core particles

The anisotropic conductive film composition may contain 0.1 to 20% by weight, preferably 0.5 to 20% by weight, of conductive particles coated with silver on the surface of the metal core particles, based on the total weight of the anisotropically conductive adhesive layer or the adhesive layer composition By weight, and more preferably 0.5 to 15% by weight. The metal core particles may have the characteristics as described above. Stable connection reliability can be ensured within the above range, and a low connection resistance can be exhibited.

The anisotropic conductive adhesive layer or the adhesive layer composition of the present invention may contain inorganic particles as insulating particles in addition to the above components.

Insulating particle

Isolated particles may be inorganic particles, organic particles or organic / inorganic hybrid particle, non-limiting of the inorganic particles, examples, silica _{(silica, SiO 2), Al} 2 O 3, TiO 2, ZnO, MgO, ZrO 2, _{PbO, Bi 2 O 3, MoO} 3, V 2 O 5, Nb 2 O 5, Ta 2 O 5, WO 3 , and may be at least one member selected from the group consisting of in ₂ O _3, not limited to the organic particles of For example, acrylic beads and the like may be mentioned, and they may be organic / inorganic hybrid particles in which an organic material is coated on the surface of inorganic particles.

Preferably, the isolated particles may be inorganic particles, and may be more preferably titanium (TiO ₂₎ and silica oxide. The silica may be a silica produced by a vapor phase method such as a silica or flame oxidation method by a liquid phase method such as a sol-gel method or a precipitation method. Non-powder silica in which silica gel is pulverized may be used, or fumed silica ), Fused silica may be used, and the shape thereof may be spherical, crushed, edgeless, and the like, but is not limited thereto. Fused silica is a synthetic silica glass that is produced by thermal decomposition of natural silica glass and a gas raw material such as silicon tetrachloride or silane in an oxygen flame or an oxygen plasma produced by melting natural quartz or silica into arc (flame) discharge or melting with oxyhydrogen flame, Or the like.

When the size of the insulating particles is larger than the size of the conductive particles (average particle diameter), it is preferable that the size of the insulating particles is smaller than that of the conductive particles. In the case where the insulating particles have an average particle size of 0.1 to 20 탆, preferably 1 to 10 탆 It can be selected according to the application.

According to another embodiment of the present invention, the insulating particles may be 0.1 to 20 wt% or more, and preferably 0.1 to 10 wt%, based on the total weight of the anisotropic conductive adhesive layer or the adhesive layer composition. The anisotropic conductive film having high reliability of connection can be formed by giving the anisotropic conductive film recognition properties by the insulating particles in the above range.

According to another example of the present invention, an anisotropic conductive film is placed between a first member to be connected and a second member to be connected and pressure-bonded under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And an initial connection resistance measured after final compression under the pressure condition of 100 to 250 DEG C for 1 to 5 seconds and 2.0 to 5.0 MPa is 0.04 or less in both of the main compression temperature conditions of 100 to 250 DEG C. . More preferably, the pressing condition is a pressure condition of 50 to 60 DEG C, 1 to 3 seconds, 1 to 3 MPa, and the main pressing condition is a pressure condition of 110 to 240 DEG C for 2 to 5 seconds and a pressure of 2.0 to 5.0 MPa have.

Therefore, there is an advantage that anisotropic conductive films can be easily produced in both low-temperature and high-temperature bonding processes by lowering the connection resistance of the anisotropic conductive film at low temperature and high temperature, and satisfactory conductivity of the anisotropic conductive film within the above- can do. The initial connection resistance is obtained by pressing the anisotropic conductive film under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa and then performing final compression bonding at 100 to 250 DEG C for 1 to 5 seconds and at 2.0 to 5.0 MPa The connection resistance measured after the connection.

The method of measuring the initial connection resistance is not particularly limited and can be measured according to a method commonly used in the art. The produced anisotropic conductive film is applied to a PCB (pitch: 200 占 퐉, terminal: 100 占 퐉, inter-terminal distance: 100 占 퐉, terminal height: 35 占 퐉) and COF film 200 占 퐉, terminal width 100 占 퐉, inter-terminal distance 100 占 퐉, terminal height 8 占 퐉) under the following conditions.

1) pressing condition; 50 DEG C, 1 second, 1.0 MPa

2) This pressing condition; 120 deg. C, 3 sec, 3.0 MPa (Condition 1), 230 deg. C, 3 sec, 4.0 MPa (Condition 2)

A plurality of specimens are prepared by connecting under the above conditions. The initial connection resistance of each specimen is measured by applying a test current of 1 mA using a 4-probe method using a measuring instrument (2000 Multimeter, Keithley), and the average value is calculated.

According to another example of the present invention, an anisotropic conductive film is placed between a first member to be connected and a second member to be connected and pressure-bonded under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And after the main compression under the pressure conditions of 100 to 250 DEG C for 1 to 5 seconds and 2.0 to 5.0 MPa, the anisotropic conductive film was allowed to stand for 250 hours and 500 hours under the conditions of 85 DEG C and 85% The resistance may be an anisotropic conductive film of 0.04? Or less, respectively. Since the anisotropic conductive film exhibits a low resistance value within the above temperature range, adhesion and reliability can be ensured at a wide temperature margin, and an anisotropic conductive film capable of exhibiting not only a low temperature process but also a high temperature process can be manufactured have. The connection resistance after the high-temperature and high-humidity evaluation refers to the connection resistance after being left for 250 hours and 500 hours under the conditions of 85 占 폚 and 85% relative humidity after the pressing and pressing. The method for measuring the connection resistance after the high-temperature and high-humidity evaluation is not particularly limited and can be measured according to a method commonly used in the art. A method for measuring the connection resistance is as follows. After a plurality of film specimens are press-bonded and compression-bonded, they are left for 250 hours and 500 hours under the conditions of a temperature of 85 DEG C and a relative humidity of 85% , And then measuring the average value of each connection resistance (Keithley 2000 Multimeter, 4-probe method) by applying a test current of 1 mA.

According to another example of the present invention, an anisotropic conductive film is placed between a first member to be connected and a second member to be connected and pressure-bonded under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And 250 to 500 ° C for 1 to 5 seconds and at a pressure of 2.0 to 5.0 MPa. After the pressure-bonding and final compression of the anisotropic conductive film, And the connection resistance after the thermal shock evaluation of the cyclic condition is 0.04? Or less, respectively. By displaying the low resistance value as described above, signal interference of the fine pitch electrode can be prevented. The connection resistance after the thermal shock evaluation refers to the connection resistance after 250 and 500 cycles under the conditions of -40 to 100 캜 and 1 cycle / hr after the pressing and final pressing. The method of measuring the connection resistance after the thermal shock evaluation is not particularly limited and can be measured according to a method commonly used in the technical field. A method of measuring the connection resistance is as follows: After a plurality of film specimens are press-bonded and finally press-bonded, the specimen is subjected to a pressure of 250 to 500 cycles under the condition of -40 to 100 DEG C and 1 cycle / After the evaluation of the thermal shock resistance, a test current of 1 mA is applied to measure the respective connection resistances (Keithley 2000 Multimeter, 4-probe method).

According to another embodiment of the present invention, the viscosity of the anisotropic conductive film having the initial connection resistance, the connection resistance after the evaluation of high temperature and high humidity, or the connection resistance after the evaluation of the thermal shock is 0.04 Ω or less, s, a minimum melt viscosity in the range of 1,000 to 9,000 Pa · s, and the metal core particle surface is coated with silver (Ag). It is possible to produce an anisotropic conductive film which can maintain excellent connection reliability and ensure insulation reliability within the above range of viscosity. The initial connection resistance, the method of measuring the connection resistance after the evaluation of high temperature and humidity, and the evaluation of the thermal shock resistance are not particularly limited, and can be measured according to a method commonly used in the art. A non-limiting example of a method of measuring the connection resistance is as described above.

1 to 25% by weight, based on the total weight of the anisotropic conductive adhesive layer solids or the adhesive layer composition, of a thermoplastic resin; 20 to 70% by weight of an acrylate modified urethane resin; 10 to 30% by weight of an acrylic copolymer; 1 to 40% by weight of a radically polymerizable substance; 0.5 to 10% by weight of an organic peroxide; 0.1 to 20% by weight of inorganic particles; And 0.1 to 20% by weight of silver-coated conductive particles on the surface of the metal core particles, and exhibits high adhesion and connection reliability within the above-mentioned composition and content range.

According to another embodiment of the present invention, a method for forming an anisotropic conductive film using the anisotropic conductive adhesive layer composition does not require the special apparatus or equipment described above. The binder resin is dissolved in an organic solvent and liquefied, And the mixture is stirred for a predetermined period of time. The composition is coated on the release film with a thickness of 10 to 50 탆 and dried for a predetermined time to volatilize the organic solvent. Thus, an anisotropic conductive film having a single-layer structure can be obtained. In this case, the organic solvent may be an ordinary organic solvent without limitation. In the present invention, an anisotropic conductive film having a multilayer structure of two or more layers may be obtained by repeating the above-described process two or more times.

According to still another embodiment of the present invention, there is provided a semiconductor device connected with any one of the above-mentioned anisotropic conductive films of the present invention. The semiconductor device includes: a wiring board; A semiconductor chip, and the wiring board and the semiconductor chip are not particularly limited and those known in the art can be used. Further, the method of manufacturing the semiconductor device of the present invention is not particularly limited, and can be performed by a method known in the art.

According to another embodiment of the present invention, there is provided a driver circuit comprising: a driver circuit; panel; And the anisotropic conductive film. Specifically, a driver circuit; Liquid crystal display (LCD) panels; And an anisotropic conductive film, wherein the driver circuit can be a liquid crystal display (LCD) device; Organic light emitting diode (OLED) panels; And an anisotropic conductive film. The organic light emitting diode display (OLED) device may be an organic light emitting diode (OLED) device. Further, the method of manufacturing the display device of the present invention is not particularly limited, and can be performed by a method known in the art.

Hereinafter, the present invention will be described in more detail by describing Examples, Comparative Examples and Experimental Examples. However, the following examples, comparative examples and experimental examples are merely examples of the present invention, and the present invention should not be construed as being limited thereto.

Example  And Comparative Example

Anisotropic conductive film compositions were prepared in the compositions and contents shown in Table 1 below.

Example Comparative Example One 2 3 4 One 2 3 bookbinder
Suzy Thermoplastic resin 10 10 10 5 10 25 5 Acrylate modified urethane resin 1 15 15 15 20 15 10 25 Acrylate modified urethane resin 2 20 20 20 25 20 - 30 Acrylic copolymer 20 20 20 15 20 35 - Radical
Polymerizable
matter One 5 5 5 5 5 5 10 2 5 5 5 5 5 - 10 3 10 10 10 10 10 10 5 Organic peroxide 5 5 5 5 5 5 5 Insulating particle Titanium oxide 2 2 2 2 2 2 2 Silica 3 3 3 3 3 3 3 Conductive particle One 5 5 5 2 5 3 5 4 5 5 Sum 100 100 100 100 100 100 100 Viscosity (30 ° C, Pa s) 600,000 600,000 600,000 300,000 600,000 1,100,000 90,000 The lowest melt viscosity (Pa.s) 5,000 5,000 5,000 3,500 5,000 10,000 500 Lowest melt viscosity temperature 80 ℃ 80 ℃ 80 ℃ 78 ℃ 80 ℃ 90 ° C 75 ℃

In Table 1, the conductive particles 1 are conductive particles coated with silver of 3% on the surface of copper particles having an average particle size of 3 to 5 μm, and the conductive particles 2 are coated with 30% of silver on the surface of copper particles having an average particle size of 3 to 5 μm And the conductive particles 3 are conductive particles coated with 100% silver on the surfaces of copper particles having an average particle size of 3 to 5 μm, and the conductive particles 4 represent nickel particles having an average particle size of 3 to 5 μm.

Example  One

Anisotropy  Preparation of conductive adhesive layer composition

An anisotropic conductive adhesive layer composition was prepared in the following composition.

1) Thermoplastic resin (10% by weight): Acrylonitrile butadiene copolymer (1072CGX, Xeon Chemical) dissolved in toluene / methyl ethyl ketone in an amount of 25 vol%

2) Acrylate-modified urethane resin 1 (15% by weight): 50% by volume of methyl ethyl ketone as a solvent to prepare a polyol having a polyol content of 60% and a hydroxyl methacrylate / isocyanate molar ratio of 0.5, , A reaction time of 5 hours, a polyurethane acrylate (weight average molecular weight 25,000) synthesized by a middle polymerization reaction using dibutyltin dilaurate as a catalyst,

3) Acrylate-modified urethane resin 2 (20% by weight): 50% by volume of methyl ethyl ketone as a solvent to prepare a polyol having a polyol content of 60% and a hydroxyl acrylate / isocyanate molar ratio of 1, A reaction time of 5 hours, a polyurethane acrylate (weight average molecular weight: 28,000) synthesized by a middle polymerization reaction using dibutyltin dilaurate as a catalyst,

4) Acrylic copolymer (20% by weight): 45% by volume of an acrylic resin (AOF7003, Aekyung Chemical) having a weight average molecular weight of 90,000 to 120,000 dissolved in toluene / methyl ethyl ketone

5) Radical Polymerizable Substance 1 (5% by weight): 4-Hydroxybutyl acrylate

6) Radical Polymerizable Substance 2 (5% by weight): Tetrahydrofurfuryl acrylate

7) Radical Polymerizable Substance 3 (10 wt%): bisphenol A propylene oxide-modified diacrylate (SP1509, Showa Polymer)

8) Organic peroxide (5% by weight): Lauroyl peroxide

9) Ti (2% by weight of oxide): TiO ₂

10) Silica (3% by weight): Fumed silica

11) Conductive particles (5% by weight) Conductive particles (conductive particles 1) coated with 3% silver on the surface of copper particles having an average particle size of 3 to 5 μm,

Anisotropy  Production of conductive film

The anisotropic conductive adhesive layer composition was agitated at room temperature (25 DEG C) for 60 minutes in a speed range in which conductive particles were not crushed. The adhesive layer composition was formed into a film having a thickness of 35 탆 in a polyethylene base film subjected to a silicone release surface treatment. Casting knives were used for film formation, and the film was dried at 60 캜 for 5 minutes.

Using the anisotropic conductive adhesive layer composition, an anisotropic conductive film having a viscosity at 30 ° C of 600,000 Pa · s and a minimum melt viscosity at 80 ° C of 5,000 Pa · s was prepared.

Example  2

In Example 1, instead of 5 wt% of the conductive particles 1, conductive particles having an average particle size of 3 to 5 μm and coated with 30% of silver Anisotropic conductive material having a viscosity at 30 ° C of 600,000 Pa · s and a minimum melt viscosity of 5,000 Pa · s at 80 ° C was obtained in the same manner as in Example 1, except that the conductive particles (conductive particles 2) A film was prepared.

Example  3

Except that 5 wt% of conductive particles (conductive particles 3) coated with 100% silver on the surface of copper particles having an average particle size of 3 to 5 μm were used instead of 5 wt% of conductive particles 1 in Example 1, An anisotropic conductive film having a viscosity at 30 ° C of 600,000 Pa · s and a lowest melt viscosity at 80 ° C of 5,000 Pa · s was prepared in the same manner as in Example 1.

Example  4

In Example 1, except for containing 5 wt% of a thermoplastic resin, 20 wt% of an acrylate modified urethane resin 1, 25 wt% of an acrylate modified urethane resin 2, and 15 wt% of an acrylic copolymer, An anisotropic conductive film having a viscosity at 30 ° C. of 300,000 Pa · s and a lowest melt viscosity at 78 ° C. of 3,500 Pa · s was prepared in the same manner as in Example 1.

Comparative Example  One

In the same manner as in Example 1, except that 5 wt% of nickel particles (conductive particles 4) having an average particle size of 3 to 5 μm were contained in place of 5 wt% of the conductive particles 1 in Example 1 Anisotropic conductive film having a viscosity of 600,000 Pa · s and a minimum melt viscosity of 80,000C at 5,000 Pa · s was prepared.

Comparative Example  2

In the same manner as in Example 1, except that 25% by weight of the thermoplastic resin, 10% by weight of the acrylate modified urethane resin 1 and 35% by weight of the acrylic copolymer were added without adding the acrylate modified urethane resin 2, 2, an anisotropic conductive film having a viscosity at 30 ° C of 1.1 million Pa · s and a minimum melt viscosity of 10,000 Pa · s at 90 ° C was prepared.

Comparative Example  3

In Example 1, 5 parts by weight of a thermoplastic resin, 25 parts by weight of an acrylate modified urethane resin 1, 30 parts by weight of an acrylate modified urethane resin 2, and 1 part by weight of a radical polymerizable substance 1 5% by weight of nickel particles (conductive particles 4) having an average particle size of 3 to 5 μm instead of 5% by weight of the conductive particles 1, 10% by weight of the radical polymerizable substance 2, 10% , An anisotropic conductive film having a viscosity at 30 ° C of 90,000 Pa · s and a lowest melt viscosity at 75 ° C of 500 Pa · s was prepared.

Experimental Example  One

Initial connection resistance measurement

In order to measure the initial connection resistance of the anisotropic conductive films prepared in Examples 1 to 4 and Comparative Examples 1 to 3, the following methods were performed.

(Pitch: 200 占 퐉, terminal width: 100 占 퐉, distance between terminals: 100 占 퐉, terminal height: 8 占 퐉) Mu m) was used. Each of the anisotropic conductive compositions prepared in Examples 1 to 4 and Comparative Examples 1 to 3 was press-bonded to a PCB circuit forming portion at 50 DEG C for 1 second and 1.0 MPa, then the release film was removed, And then subjected to a 4-probe test using a measuring instrument (Keithley 2000 Multimeter) after 120 seconds, 3 seconds, 3.0 MPa (Condition 1) or 230 seconds, 3 seconds, 4.0 MPa The initial connection resistance was measured by applying a current of 1 mA and the average value thereof was calculated. The measurement results are shown in Table 2 below.

Experimental Example  2

Connection resistance measurement after high temperature and high humidity evaluation

The following methods were performed to measure the connection resistance after the high temperature and high humidity evaluation of the anisotropic conductive films prepared in Examples 1 to 4 and Comparative Examples 1 to 3.

After the pressurization and final compression of Experimental Example 1, the sample was allowed to stand for 250 hours and 500 hours at a temperature of 85 ° C and a relative humidity of 85%, and then a test current of 1 mA was applied to measure the respective connection resistances (Keithley 2000 Multimeter , And 4-probe method). The measurement results are shown in Table 2 below.

Experimental Example  3

Thermal shock  Measuring connection resistance after evaluation

The following methods were performed to measure the connection resistance after evaluating the thermal shock resistance of the anisotropic conductive films prepared in Examples 1 to 4 and Comparative Examples 1 to 3.

After the thermal shock test at 250 to 500 cycles under the conditions of -40 to 100 ° C and 1 cycle / hr, a test current of 1 mA was applied to measure the respective connection resistances (Keithley 2000 Multimeter, 4-probe method) . The measurement results are shown in Table 2 below.

Experimental Example  4

Anisotropy  Stability evaluation of conductive film product

The weights of the anisotropic conductive films prepared in Examples 1 to 4 and Comparative Examples 1 to 3 were suspended in an oven at 30 ° C for 12 hours after hanging a weight of 50 g, and the product forms of the anisotropic conductive films were compared. (See FIG. 3A), and a case in which a step, a hub drop, a shape of a surge, or the like occurred and the reel could not be stably released was evaluated as 'bad' (see FIG. 3B). The evaluation results are shown in Table 3 below.

The measurement results according to Experimental Examples 1 to 4 are summarized in Tables 2 and 3 below.

Early High temperature and high humidity Thermal shock 250hr 500 hr 250cycle 500cycle 120 DEG C, 3 seconds, 3.0 MPa Example 1 0.037 0.038 0.039 0.036 0.037 Example 2 0.035 0.037 0.038 0.035 0.036 Example 3 0.036 0.037 0.038 0.036 0.036 Example 4 0.033 0.035 0.039 0.034 0.035 Comparative Example 1 0.044 0.185 0.726 0.143 0.681 Comparative Example 2 0.042 0.881 1.314 0.885 1.110 Comparative Example 3 0.034 0.035 0.038 0.036 0.037 230 DEG C, 3 seconds, 4.0 MPa Example 1 0.035 0.036 0.036 0.037 0.038 Example 2 0.036 0.037 0.038 0.037 0.037 Example 3 0.036 0.038 0.038 0.036 0.037 Example 4 0.033 0.036 0.036 0.035 0.038 Comparative Example 1 0.034 0.149 0.677 0.157 0.465 Comparative Example 2 0.034 0.983 1.086 0.796 1.123 Comparative Example 3 0.034 0.034 0.035 0.035 0.038

result Example 1 Good Example 2 Good Example 3 Good Example 4 Good Comparative Example 1 Good Comparative Example 2 Good Comparative Example 3 Bad

In Table 2, the initial connection resistances, the values measured after the high temperature and high humidity evaluation, and the connection resistances after the evaluation of the thermal shock were respectively shown in Experimental Examples 1 to 3. Referring to Table 2, in Examples 1 to 4, the connection resistance values after the initial, high temperature and high humidity evaluation, and after the thermal shock evaluation were measured to be 0.04? Or less, and with reference to Table 3 according to Experimental Example 4, The anisotropic conductive films of Examples 1 to 4 were all found to be satisfactory in the product stability evaluation.

On the other hand, the anisotropic conductive film of Comparative Example 1 had a viscosity range of 100,000 to 1,000,000 Pa · s at 30 ° C and a minimum melt viscosity range of 1,000 to 9,000 Pa · s, And the connection resistance measured after the initial evaluation, the high temperature and high humidity evaluation and the thermal shock evaluation were all 0.04? Or more using the non-conductive particles 4 (nickel particles having an average particle size of 3 to 5 um). Although the anisotropic conductive film of Comparative Example 1 is good in terms of product stability (see Table 3), it exhibits a higher connection resistance than the present invention in terms of connection resistance, and it was confirmed that it is difficult to reduce the signal interference of the fine-grained electrode .

The anisotropic conductive film of Comparative Example 2 contained silver-coated conductive particles, but the anisotropic conductive film had a viscosity at 30 ° C of 1 million Pa · s or more, a minimum melt viscosity of 10,000 Pa · s at 90 ° C, All of the connection resistances measured after the high humidity evaluation and after the thermal shock evaluation were 0.04 Ω or more. Although the anisotropic conductive film of Comparative Example 2 is good in terms of product stability (see Table 3), it was confirmed that the anisotropic conductive film having the viscosity in terms of the connection resistance is difficult to exhibit stable resistance characteristics.

Since the anisotropic conductive film of Comparative Example 3 had a viscosity at 30 ° C of 100,000 Pa · s or less and a minimum melt viscosity at 70 to 85 ° C of 1,000 Pa · s or less, the viscosity was low and the flowability was sufficient. Therefore, even though the silver coated conductive particles were not used, all of the connection resistances measured after the evaluation of the high temperature and high humidity and after the thermal shock evaluation were 0.04 Ω or less.

The results of Table 2 and Table 3 show that when conductive particles having a viscosity range of 30 ° C. and a minimum melt viscosity of the present invention and coated with silver at 3 to 100% 1 to 4), it was confirmed that the absolute value of the connection resistance can be lowered in a wide temperature margin of the low temperature process and the high temperature process, and the stable connection resistance reliability value can be maintained.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that such detail is solved by the person skilled in the art without departing from the scope of the invention. will be. Accordingly, the actual scope of the present invention will be defined by the appended claims and their equivalents.

Claims (22)

Wherein the anisotropic conductive film according to the ARES measurement has a viscosity range of 30,000 to 100,000 Pa · s and a minimum melt viscosity of 1,000 to 9,000 Pa · s, and the metal core particle surface is coated with silver (Ag) And an anisotropic conductive film. The anisotropic conductive film according to claim 1, wherein the temperature range indicating the lowest melt viscosity range is 70 to 85 占 폚. The method as claimed in claim 1, wherein the metal core particles are made of gold (Au), nickel (Ni), copper (Cu), lead (Pb), platinum (Pt), molybdenum (Mo), and tungsten Wherein the metal core particles contain at least one metal selected from the group consisting of a metal, a metal, and a metal. 4. The anisotropic conductive film according to claim 3, wherein the metal core particles have a particle diameter of 1 to 10 mu m. The anisotropic conductive film according to claim 1, wherein the silver is coated with 3 to 100% of the surface area of the metal core particles. The anisotropic conductive film according to claim 1, wherein the shape of the silver coated on the surface of the metal core particles is islands. The anisotropic conductive film according to claim 1, wherein the anisotropic conductive film comprises an anisotropic conductive adhesive layer and a base film adhered to a back surface of the anisotropic conductive adhesive layer. 8. The method according to claim 7, wherein the total weight of the anisotropic conductive adhesive layer
1 to 25% by weight of a thermoplastic resin;
20 to 70% by weight of an acrylate modified urethane resin;
10 to 30% by weight of an acrylic copolymer;
1 to 40% by weight of a radically polymerizable substance;
0.5 to 10% by weight of an organic peroxide;
0.1 to 20% by weight of inorganic particles; And
And 0.1 to 20% by weight of conductive particles silver coated on the surface of the metal core particles. The method of claim 8, wherein the radically polymerizable material is at least one selected from the group consisting of tetrahydrofurfuryl acrylate, 4-hydroxybutyl acrylate, and bisphenol A propylene oxide-modified diacrylate. . 9. The composition of claim 8, wherein the radically polymerizable material comprises 1 to 10% by weight of tetrahydroperfuryl acrylate, 1 to 10% by weight of 4-hydroxybutyl acrylate, and 1 to 10% by weight of bisphenol A propylene oxide And 1 to 20% by weight of a modified diacrylate. Placing an anisotropic conductive film between the first to-be-connected members and the second to-be-connected member, pressurizing under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And
Wherein the initial contact resistance measured after final compression at 100 to 250 占 폚 for 1 to 5 seconds and at 2.0 to 5.0 MPa is 0.04? Or less at both of the main compression temperature conditions of 100 to 250 占 폚. Placing an anisotropic conductive film between the first to-be-connected members and the second to-be-connected member, pressurizing under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And
The connection resistance after high-temperature and high-humidity evaluation in which the anisotropic conductive film was allowed to stand for 250 hours and 500 hours under the conditions of 85 ° C and 85% relative humidity after final compression under the pressure conditions of 100 to 250 ° C for 1 to 5 seconds and 2.0 to 5.0 MPa Is 0.04? Or less, respectively. Placing an anisotropic conductive film between the first to-be-connected members and the second to-be-connected member, pressurizing under pressure conditions of 50 to 70 DEG C for 1 to 3 seconds and 1.0 to 3.0 MPa; And
After the final pressing under the pressure conditions of 100 to 250 DEG C for 1 to 5 seconds and 2.0 to 5.0 MPa, the anisotropic conductive film was subjected to thermal shock test at 250 DEG C and 500 DEG C under the conditions of -40 to 100 DEG C and 1 cycle / Are each 0.04? Or less. 14. The method according to any one of claims 11 to 13, wherein the anisotropic conductive film has a viscosity range of 30,000 to 100,000 Pa · s according to the ARES measurement and a minimum melt viscosity range of 1,000 to 9,000 Pa · s , And the metal core particle surface is coated with silver (Ag). 14. The method according to any one of claims 11 to 13, wherein the total weight of the anisotropic conductive adhesive layer
1 to 25% by weight of a thermoplastic resin;
20 to 70% by weight of an acrylate modified urethane resin;
10 to 30% by weight of an acrylic copolymer;
1 to 40% by weight of a radically polymerizable substance;
0.5 to 10% by weight of an organic peroxide;
0.1 to 20% by weight of inorganic particles; And
And 0.1 to 20% by weight of conductive particles silver coated on the surface of the metal core particles. With respect to the total weight of the anisotropic conductive adhesive layer composition
1 to 25% by weight of a thermoplastic resin;
20 to 70% by weight of an acrylate modified urethane resin;
10 to 30% by weight of an acrylic copolymer;
1 to 40% by weight of a radically polymerizable substance;
0.5 to 10% by weight of an organic peroxide;
0.1 to 20% by weight of inorganic particles; And
And 0.1 to 20% by weight of conductive particles silver coated on the surface of the metal core particles. The method of claim 16, wherein the radical polymerizable material is at least one selected from the group consisting of tetrahydrofurfuryl acrylate, 4-hydroxybutyl acrylate, and bisphenol A propylene oxide modified diacrylate. Composition. 17. The composition of claim 16, wherein the radically polymerizable material comprises 1 to 10% by weight of tetrahydroperfuryl acrylate, 1 to 10% by weight of 4-hydroxybutyl acrylate, and 1 to 10% by weight of bisphenol A propylene oxide And 1 to 20% by weight of a modified diacrylate. 17. The anisotropic conductive film composition of claim 16, wherein the organic peroxide is lauroyl peroxide. An anisotropic conductive film produced by the anisotropic conductive adhesive layer composition according to any one of claims 16 to 19, wherein the viscosity range at 30 [deg.] C according to the ARES measurement is 100,000 to 1,000,000 Pa · s and the lowest melt viscosity range is 1,000 To 9,000 Pa · s. Driver circuit; panel; And an anisotropic conductive film according to any one of claims 1 to 13. Driver circuit; panel; And an anisotropic conductive film formed by the anisotropic conductive film composition according to any one of claims 16 to 19.

Images